Integrated control contactor hierarchical intelligent dynamic over-temperature protection coordination system and method

Abstract

The application relates to an integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system and method, which comprises an integrated control contactor, a communication module and an upper computer. The integrated control contactor is composed of a contactor body and an integrated control module. The integrated control module comprises a temperature sensing sub-module for sampling the temperature of an electromagnetic system, an integrated driving sub-module for closed-loop excitation control of the electromagnetic system, and a microprocessor sub-module for executing the lower computer part of the method and the intelligent control strategy of the contactor. The communication module is used for data communication. The upper computer is used for executing the upper computer part of the method and performing hierarchical over-temperature protection through relevant modules. The collaborative system and method integrate the integrated control module into the contactor, form a three-dimensional over-temperature protection mechanism of the integrated control contactor of the lower computer and the upper computer, realize the leap from single contactor over-temperature protection to higher-level system-level collaborative temperature protection, have a wide application range, and are flexible and reliable in protection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of contactors, in particular to an integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system and method. BACKGROUND

[0002] At present, contactors with large quantities and wide applications in power distribution are undergoing upgrading and transformation from direct AC control to intelligent control. The intelligent control module of the contactor is embedded in the body from external, which gradually develops from discrete components to chip integration of control function. The integrated control contactor has significantly improved performance, and the compact space structure and complex service environment make the electromagnetic system heating an important indicator in design. However, the current integrated control contactor lacks targeted embedded temperature protection technology.

[0003] At present, the heating indicators of the electromagnetic system of the contactor mainly rely on the optimization of the body in the early stage. Once the design is finalized, there is no over-temperature protection during use. Some intelligent contactors are essentially the temperature protection of the chips used. The design is initially for chip protection, which is limited for electromagnetic system protection. The chip simulation set temperature cannot simultaneously protect the contactor body and the chip, and is prone to misjudgment. The chip protection is independent of the system where the contactor is located, and cannot form effective protection for the short-time heating of the electromagnetic system. The measure of cutting off the power supply will seriously expand the fault range in serious cases. There is also a lack of system-level temperature monitoring and over-temperature protection measures for batch operation contactors. SUMMARY

[0004] The purpose of the present application is to provide an integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system and method. The collaborative system and method integrate the integrated control module into the contactor to form a three-dimensional over-temperature protection mechanism of the integrated control contactor of the lower computer and the upper computer, realize the leap from single contactor over-temperature protection to higher level system-level collaborative temperature protection, have wide application range, and are flexible and reliable in protection.

[0005] In order to achieve the above purpose, the technical scheme adopted by the present application is as follows: an integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system, comprising an integrated control contactor, a communication module and an upper computer.

[0006] The integrated control contactor is composed of a contactor body and an integrated control module, and the integrated control module comprises:

[0007] A temperature sensing sub-module for sampling the temperature of the electromagnetic system of the contactor and sending the collected temperature data to the microprocessor sub-module for processing;

[0008] An integrated drive sub-module for receiving the drive signal of the microprocessor sub-module to realize closed-loop excitation control of the electromagnetic system of the contactor.

[0009] a microprocessor sub-module for receiving information sent by the temperature sensing sub-module and executing the lower-level part of the hierarchical intelligent dynamic over-temperature protection method, and executing the intelligent control strategy of the contactor to intelligently control the contactor;

[0010] The communication module is used to realize data communication between the microprocessor sub-module and the upper computer, so as to send the current, temperature and alarm information on the microprocessor sub-module to the upper computer.

[0011] The upper computer is used to comprehensively process the information sent by the microprocessor sub-module, execute the upper-level part of the hierarchical intelligent dynamic over-temperature protection method, judge the over-temperature severity, and execute the hierarchical over-temperature protection through the related modules.

[0012] Further, the integrated control module is built in the contactor body; the temperature sensing sub-module is arranged on the surface of the integrated control module and is spaced apart from the electromagnetic system of the contactor by a set minimum distance, so as to sample the temperature of the electromagnetic system of the contactor.

[0013] Further, the cooperative system further comprises:

[0014] a heat dissipation module for receiving heat dissipation instructions from the upper computer or the supervisor terminal and dissipating heat from the contactor body;

[0015] a human-computer interaction module for realizing the interaction between the upper computer and the supervisor terminal;

[0016] an alarm module for issuing sound and light alarms when an over-temperature fault occurs;

[0017] a supervisor terminal for interacting with the upper computer and issuing heat dissipation instructions to the heat dissipation module.

[0018] Further, the upper computer executes the hierarchical over-temperature protection according to the over-temperature severity, including automatically opening the heat dissipation module, issuing sound and light alarms through the alarm module, and sending the over-temperature severity information to the supervisor terminal through the human-computer interaction module;

[0019] The supervisor decides whether to take manual intervention and protection upgrade according to the over-temperature severity information received by the supervisor terminal, and the manual intervention and protection upgrade measures include manually and forcibly opening the heat dissipation module, sending the upper computer instructions through the human-computer interaction module, and transmitting the instructions to the microprocessor sub-module through the communication module; if the upper computer instructions are shutdown maintenance instructions, the microprocessor sub-module closes the contactor excitation through the integrated driving sub-module.

[0020] Further, the core of the microprocessor submodule adopts a single-chip MCU chip, which is used to execute the lower machine part of the hierarchical intelligent dynamic over-temperature protection method and the intelligent control strategy of the contactor; the core of the integrated driving submodule adopts a power integrated chip, which is embedded with the functions of bus self-energy, temperature monitoring and power conversion, and the current information output pin of the power integrated chip can transmit the coil current information to the second analog input pin of the single-chip MCU chip;

[0021] After the single-chip MCU chip executes the intelligent control strategy of the contactor, the control input pin of the power integrated chip receives the driving signal from the pulse width modulation output pin of the single-chip MCU chip, and the power conversion unit of the power integrated chip realizes closed-loop excitation on the electromagnetic system of the contactor.

[0022] The heat-sensitive resistor NTC and the wafer resistor R1 are connected in series between the temperature monitoring input pin and the ground pin of the power integrated chip, and the operational amplifier K and the resistor R2 constitute a voltage follower subcircuit, which together with the heat-sensitive resistor NTC and the wafer resistor R1 forms the temperature sensing part of the temperature sensing submodule.

[0023] The ground pins of the microprocessor submodule, the integrated driving submodule and the temperature sensing submodule are common.

[0024] Further, let U D When the integrated control module is working, the power integrated chip of the integrated driving submodule feeds the heat-sensitive resistor NTC and the wafer resistor R1 to the ground end with an internal current source every period. When the temperature of the electromagnetic system changes, the resistance of the heat-sensitive resistor NTC changes, which causes the voltage between the temperature monitoring input pin and the ground to change. On the one hand, the temperature information is transmitted to the temperature monitoring unit of the power integrated chip. Once the voltage exceeds U D that is, the analog temperature protection action is started, and on the other hand, the voltage follower subcircuit is matched in impedance with the capture input pin and the first analog input pin of the single-chip MCU chip.

[0025] The capture input pin of the single-chip MCU chip is used to execute the capture function, that is, to capture the moment when the current source feeds the heat-sensitive resistor NTC, and then trigger the single-chip MCU chip to sample the voltage between the temperature monitoring input pin and the ground through the first analog input pin.

[0026] The single-chip MCU chip is set to sample after a fixed delay from the trigger moment, so as to wait for the voltage between the temperature monitoring input pin and the ground to stabilize and avoid sampling transient errors. The single-chip MCU chip periodically samples the voltage value through the first analog input pin and transmits the temperature information to the microprocessor submodule for calculation of the lower machine part of the hierarchical intelligent dynamic over-temperature protection method.

[0027] The application also provides an integrated control contactor hierarchical intelligent dynamic over-temperature protection method based on the above-mentioned cooperative system, comprising the following steps:

[0028] Step S1: the microprocessor submodule executes the intelligent control strategy of the contactor, outputs a PWM signal to drive the integrated driving submodule, and controls the excitation state of the electromagnetic system in a closed loop to intelligently control the contactor.

[0029] Step S2: the voltage following sampling temperature monitoring input pin end voltage change is monitored, and the temperature sensing part of the temperature sensing submodule is sampled according to the following sampling time sequence: at time t1, the current source starts to feed the thermistor NTC, at time t2, the input pin captures the rising edge change of the voltage at the temperature monitoring input pin end after the current source feeds, the hardware triggers AD analog-digital conversion, the AD sampling of the first analog input pin is set to wait for a set time to time t3, at this time, the voltage at the temperature monitoring input pin end is stable, and the digital temperature information required by the single-chip microcomputer MCU chip is converted, at this time, the analog-digital conversion result is directly applied, or is converted into the actual temperature again, at time t4, the current source stops feeding.

[0030] The temperature initial value calculation of the lower computer part of the hierarchical intelligent dynamic over-temperature protection method is performed after each start of the contactor or after the temperature of the electromagnetic system is abnormal, and is reset and updated at a fixed interval to avoid the intelligent dynamic critical value model from falling into local optimization; when the contactor is in a stable holding stage, the temperature information θ k-M , θ k-M+1 ,..., θ k-1 of the initial stage in the past M moments is selected to calculate the initial value of the temperature mean and sample standard deviation of the near electromagnetic system, and the near electromagnetic system is approximately equivalent to the electromagnetic system during calculation, as shown in formula (1) and formula (2).

[0031] (1)

[0032] (2)

[0033] In the formula, is the initial value of the average value of the electromagnetic system temperature in the past M moments of the stable holding stage of the contactor, θ j is the temperature value at the jth calculation moment, and k-M represents the upper M calculation moments of the current calculation moment, is the initial value of the temperature sample standard deviation in the past M moments.

[0034] Step S3: the microprocessor submodule implements the intelligent dynamic critical value calculation and configuration of the lower computer part of the hierarchical intelligent dynamic over-temperature protection method, and iteratively refreshes every period, and the calculation period is set according to the actual application system and working condition.

[0035] Set interval N1 time as a calculation period, the current k time electromagnetic system temperature average value And standard deviation s k The moving recursive calculation process of and is shown in formula (3) and formula (4);

[0036] (3)

[0037] (4)

[0038] In the formula, the subscripts k, k-1 respectively represent the current calculation time and the last calculation time, θ k-1 Is the temperature value of the last calculation time, the temperature value collected during the protection state needs to be removed, and ω is the weight of the new temperature sampling information;

[0039] The intelligent dynamic threshold is set by the weighted moving iterative calculation method to perform hierarchical over-temperature protection, and the online refresh configuration process of each layer threshold is shown in formula (5);

[0040] (5)

[0041] In the formula, Is the threshold weight of the standard deviation, and four different threshold weights , , , Are set to obtain each layer threshold θh j , wherein θh1 is a safety threshold, θh2 is a reporting threshold, θh3 is a protection threshold, and θh4 is a limit threshold, and the relationship between the thresholds is θh1< θh2< θh3< θh4, and subsequent steps are performed according to the relationship between the current sampling temperature θ k And each threshold θh j Different processing is performed in layers;

[0042] The electromagnetic system temperature mean value and standard deviation obtained from formula (1) and (2) are the iteration initial values of formula (3) and (4), the current calculation value result of formula (3) and (4) is the input of formula (5), and when the contactor is restarted, or temperature anomaly occurs, or the fixed period interval is reached, the calculation initial value of formula (1) and (2) is restarted, and formula (3) and (4) are forced to start a new iteration sequence to avoid falling into local optimum;

[0043] Step S4: comparing the current sampling temperature with the dynamically configured protection threshold θh3, and performing hierarchical processing according to different situations;

[0044] Step S5: If the current sampling temperature is lower than the current protection threshold θh3 and is less than the current reporting threshold θh2, it is determined that the current temperature is normal and there is no over-temperature risk in a short time, and the step S1 is returned to continue the intelligent control of the contactor;

[0045] Step S6: If the current temperature sampling value is higher than the current reporting threshold θh2, the microprocessor submodule uploads the information of the existence of over-temperature risk to the upper computer through the communication module, the monitor obtains the information uploaded by the upper computer through the human-computer interaction module, including the current sampling temperature, the historical sampling temperature, the current reporting threshold, the current coil current value and the historical coil current value, and determines whether to take manual intervention based on the obtained information, and then returns to step S1;

[0046] Step S7: If the current sampling temperature is higher than the current protection threshold θh3, the microprocessor submodule automatically starts the heat dissipation module through the communication module and the upper computer, and transmits the information to the upper computer, and the monitor decides whether to take protection upgrade;

[0047] Step S8: After starting the heat dissipation module, if the temperature drops below the safety threshold θh1 after a set time, step S9 is entered;

[0048] Step S9: The heat dissipation module is turned off, and if the temperature is not higher than the protection threshold θh3 after a set time, the step S1 is returned; if the temperature is higher than the protection threshold θh3 again within a set time after the heat dissipation module is turned off, step S10 is entered;

[0049] Step S10: The heat dissipation module is restarted, and the number of burp protection and the over-temperature duration are monitored; the safety threshold θh1 is set to be lower than the protection threshold θh3, and a hysteresis is formed between θh1 and θh3, if the temperature exceeds the protection threshold θh3, the heat dissipation module is started, and if the temperature is lower than the safety threshold θh1, the heat dissipation module is turned off, this process is defined as burp protection; if the number of repeated burp protection within a set safety time T pro exceeds the burp number threshold N2, or the duration of the temperature exceeding the protection threshold θh3 is longer than the safety time T pro , it is considered that a persistent over-temperature fault occurs and is irreversible, and step S12 is entered; N2 and T pro may be set according to the field conditions;

[0050] Step S11: If the temperature continues to rise and exceeds the limit threshold θh4 after taking the heat dissipation protection measures, it is determined as the highest level over-temperature fault, and step S12 is entered;

[0051] Step S12: The microprocessor submodule automatically turns off the contactor excitation through the integrated driving submodule, the contactor trips, and the sound and light alarm is sent out by the alarm module through the communication module and the upper computer, and waits for maintenance.

[0052] Compared with the prior art, the application has the following beneficial effects:

[0053] (1) A hierarchical intelligent dynamic over-temperature protection collaborative system applied to integrated control contactors is proposed, realizing a leap from single contactor individual temperature protection to higher-level system-level collaborative protection, forming a three-dimensional over-temperature protection mechanism of lower computer-upper computer, and the protection measures are more flexible and reliable.

[0054] (2) In the power integrated chip, the temperature monitoring function is integrated, without the need to increase complex sensing elements, the sampling timing of the proposed capture-trigger-delay is more accurate, the anti-interference ability is strong, the built-in intensive layout is easy to capture the temperature change trend of the electromagnetic system, and the scheme is small in size and low in cost.

[0055] (3) The digital multi-weight critical value configuration and the iterative refreshing dynamic critical value do not affect the existing control scheme, form a hierarchical protection system, the collaborative system is high in intelligent degree, can flexibly adapt to different temperature abnormal conditions, contactor bodies and complex working conditions, further improves the over-temperature protection stability, and reduces the misjudgment rate.

[0056] (4) It can be transplanted into most application systems of the contactor, and the collaborative system and method are not limited to the protection of a single contactor, and are also more suitable for application scenarios containing a large number of contactors, without complex modification, can be directly transplanted, has a wide application range, and is flexible in application. BRIEF DESCRIPTION OF DRAWINGS

[0057] Figure 1 is the implementation principle diagram of the hierarchical intelligent dynamic over-temperature protection collaborative system of the integrated control contactor provided by the embodiment of the application;

[0058] Figure 2 is a schematic diagram of the relative position relationship between the temperature sensing sub-module and the electromagnetic system of the contactor in the embodiment of the application;

[0059] Figure 3 is the implementation flowchart of the hierarchical intelligent dynamic over-temperature protection method of the integrated control contactor provided by the embodiment of the application;

[0060] Figure 4 is a sampling timing schematic diagram of the temperature sensing part of the temperature sensing sub-module in the embodiment of the application;

[0061] Figure 5 is a logic relationship diagram of the critical value calculation formula in the embodiment of the application.

[0062] In the figure: 100 - integrated control contactor; 110 - contactor body; 120 - integrated control module; 1201 - temperature sensing sub-module; 1202 - integrated drive sub-module; 1203 - microprocessor sub-module; 200 - communication module; 300 - upper computer; 400 - heat dissipation module; 500 - human-computer interaction module; 600 - alarm module; 700 - supervisor terminal. DETAILED DESCRIPTION

[0063] The application will be further described below in conjunction with the accompanying drawings and examples.

[0064] It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0065] It should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of the features, steps, operations, devices, components and / or combinations thereof.

[0066] As shown in Figure 1 The embodiment provides an integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system, which comprises an integrated control contactor 100, a communication module 200, an upper computer 300, a heat dissipation module 400, a human-computer interaction module 500, an alarm module 600 and a supervisor terminal 700.

[0067] The integrated control contactor 100 is composed of a contactor body 110 and an integrated control module 120, and the integrated control module 120 comprises a temperature sensing sub-module 1201, an integrated drive sub-module 1202 and a microprocessor sub-module 1203.

[0068] The temperature sensing sub-module 1201 is used for sampling the temperature of the contactor electromagnetic system and sending the collected temperature data to the microprocessor sub-module 1203 for processing.

[0069] The integrated drive sub-module 1202 is used for receiving the drive signal of the microprocessor sub-module 1203 to realize closed-loop excitation control of the contactor electromagnetic system.

[0070] The microprocessor sub-module 1203 is used for receiving the information sent by the temperature sensing sub-module 1201 and executing the lower computer part of the hierarchical intelligent dynamic over-temperature protection method, and executing the contactor intelligent control strategy to intelligently control the contactor.

[0071] In the embodiment, the integrated control module 120 is built inside the contactor body 110. Figure 2 As shown, the temperature sensing sub-module 1201 is arranged on the surface of the integrated control module 120, which is in contact with the contactor electromagnetic system, but is spaced apart from the contactor electromagnetic system by a set minimum distance, so as to sample the temperature of the contactor electromagnetic system.

[0072] The communication module 200 is used to realize data communication between the microprocessor sub-module 1203 and the upper computer 300, so as to send the current, temperature and alarm information on the microprocessor sub-module 1203 to the upper computer 300.

[0073] The upper computer 300 is used to comprehensively process the information sent by the microprocessor sub-module 1203, execute the upper computer part of the hierarchical intelligent dynamic over-temperature protection method, judge the over-temperature severity, and execute the hierarchical over-temperature protection through the related modules.

[0074] The heat dissipation module 400 is used to receive the heat dissipation instructions of the upper computer 300 or the supervisor terminal 700, and dissipate heat for the contactor body 110.

[0075] The human-computer interaction module 500 is used to realize the interaction between the upper computer 300 and the supervisor terminal 700.

[0076] The alarm module 600 is used to issue sound and light alarms when over-temperature faults occur.

[0077] The supervisor terminal 700 is used to interact with the upper computer 300, and send heat dissipation instructions to the heat dissipation module 400.

[0078] The upper computer executes the hierarchical over-temperature protection according to the over-temperature severity, including automatically opening the heat dissipation module 400, issuing sound and light alarms through the alarm module 600, and sending the over-temperature severity information to the supervisor terminal 700 through the human-computer interaction module 500. The supervisor decides whether to take manual intervention and protection upgrade according to the over-temperature severity information received by the supervisor terminal 700, and the manual intervention and protection upgrade measures include manually and forcibly opening the heat dissipation module 400, sending the upper computer instructions through the human-computer interaction module 500, transmitting the instructions to the microprocessor sub-module 1203 through the communication module 200, and if the upper computer instructions are shutdown maintenance instructions, the microprocessor sub-module 1203 closes the contactor excitation through the integrated drive sub-module 1202.

[0079] In the application, the integrated control contactor structure is intensive, the integrated control module is close to the electromagnetic system, and the natural favorable conditions are provided for sensing the temperature of the electromagnetic system. The implementation principle of the core part of the integrated control module 120 is as shown in the figure. Figure 1As shown in the dashed line box in the middle and lower part, the core of the microprocessor submodule 1203 adopts a single-chip MCU chip, which is used to execute the lower computer part of the hierarchical intelligent dynamic over-temperature protection method and the intelligent control strategy of the contactor; the core of the integrated driving submodule 1202 adopts a power integrated chip, which is embedded with the functions of bus self-energy, temperature monitoring and power conversion. The current information output pin (pin I) of the power integrated chip can deliver the coil current information to the second analog input pin (pin AN2) of the single-chip MCU chip. In this embodiment, the single-chip MCU chip adopts a single-chip MCU PIC24FJx and its series chips; the power integrated chip adopts a power integrated chip PI-246x and its series chips.

[0080] After the single-chip MCU chip executes the intelligent control strategy of the contactor, the control input pin (pin C) of the power integrated chip receives the driving signal from the pulse width modulation output pin (PWM pin) of the single-chip MCU chip, and the power conversion unit realizes closed-loop excitation of the electromagnetic system of the contactor.

[0081] The temperature monitoring input pin (pin S) of the power integrated chip and the ground pin (pin G) are connected in series with a thermistor NTC and a wafer resistor R1. An operational amplifier K and a resistor R2 constitute a voltage follower subcircuit, which, together with the thermistor NTC and the wafer resistor R1, constitutes the temperature sensing part of the temperature sensing submodule 1201. The wafer resistor R1 can be flexibly adjusted to adapt to different ranges of temperature sampling and improve the sampling accuracy.

[0082] The pins G of the microprocessor submodule 1203, the integrated driving submodule 1202 and the temperature sensing submodule 1201 are grounded.

[0083] Let U D be the temperature protection fixed voltage reference value. When the integrated control module 120 is working, the power integrated chip of the integrated driving submodule 1202 feeds the thermistor NTC and the wafer resistor R1 to the ground end with an internal current source every period. When the temperature of the electromagnetic system changes, the resistance of the thermistor NTC changes, causing the voltage between the pin S and the ground to change. On the one hand, the temperature information is transmitted to the temperature monitoring unit of the power integrated chip. Once the voltage exceeds U D , the analog temperature protection action is started. On the other hand, the voltage follower subcircuit is impedance-matched with the capture input pin (pin CCP) and the first analog input pin (pin AN1) of the single-chip MCU chip.

[0084] The pin CCP of the single-chip MCU chip is used to execute the capture function, i.e. to capture the moment when the current source feeds the thermistor NTC, and then trigger the single-chip MCU chip to sample the voltage between the pin S and the ground through the pin AN1.

[0085] The single-chip MCU chip is set to sample after a fixed delay at the triggering moment to wait for the voltage at pin S to stabilize and avoid sampling transient errors; The single-chip MCU chip periodically samples the voltage value through pin AN1, and provides temperature information to the microprocessor submodule 1203 for calculation of the lower computer part of the hierarchical intelligent dynamic over-temperature protection method.

[0086] As shown in Figure 3 , the embodiment also provides an integrated control contactor hierarchical intelligent dynamic over-temperature protection method based on the above-mentioned cooperative system, and the specific implementation steps are as follows.

[0087] Step S1: The microprocessor submodule executes a contactor intelligent control strategy, outputs a PWM signal to drive the integrated driving submodule, and closed-loop controls the excitation state of the electromagnetic system to intelligently control the contactor.

[0088] Step S2: The voltage at pin S is sampled, as shown in Figure 4 , the temperature sensing part of the temperature sensing submodule is sampled according to the following sampling time sequence: at t1, the current source starts to feed the thermistor NTC, at t2, the pin CCP captures the rising edge change of the voltage at pin S with respect to ground after the current source feeds, triggers the AD analog-digital conversion, and the AD sampling of pin AN1 is set to wait for a long enough time to t3, at which time the voltage at pin S is stable, and the digital temperature information required by the single-chip MCU chip is started to be converted, at this time, the analog-digital conversion result is directly applied, or the actual temperature is converted again, at t4, the current source stops feeding.

[0089] The temperature initial value calculation of the lower computer part of the hierarchical intelligent dynamic over-temperature protection method is performed after each start of the contactor or after an abnormal temperature of the electromagnetic system, and is reset and updated at a fixed interval to avoid the intelligent dynamic critical value model from falling into a local optimum; When the contactor is in a stable holding stage, the temperature information θ k-M , θ k-M+1 ,..., θ k-1 of the past M time points in the initial stage are selected to calculate the initial values of the average temperature and the sample standard deviation of the near electromagnetic system, and the near electromagnetic system is approximated as the electromagnetic system during calculation, as shown in formula (1) and formula (2).

[0090] (1)

[0091] (2)

[0092] In the formula, θ is the initial value of the average temperature of the electromagnetic system in the stable holding stage of the contactor in the past M time points, is the initial value of the sample standard deviation of the temperature in the past M time points.

[0093] wherein, is the initial value of the electromagnetic system temperature average value of the past M time points in the contactor stable holding stage, θ j is the temperature value at the jth calculation time point, k-M represents the upper M calculation time points of the current calculation time point, is the initial value of the standard deviation of the temperature sample of the past M time points.

[0094] Step S3: The microprocessor submodule implements the intelligent dynamic critical value calculation and configuration of the lower computer part of the hierarchical intelligent dynamic over-temperature protection method, and iteratively refreshes in a programmed manner every period. The calculation period is flexibly set according to the actual application system and working condition, so as to balance the temperature protection sensitivity and anti-interference, and avoid over-protection or under-protection of temperature.

[0095] It is assumed that an interval of N1 time points is one calculation period, and the electromagnetic system temperature average value at the current k time point is and the standard deviation s k is calculated by moving recursion as shown in formula (3) and formula (4);

[0096] (3)

[0097] (4)

[0098] In the formula, the subscripts k and k-1 respectively represent the current calculation time point and the last calculation time point, θ k-1 is the temperature value at the last calculation time point, and the temperature value collected during the protection state needs to be removed, and ω is the weight of the new temperature sampling information.

[0099] The memory occupation is reduced by the weighted moving iterative calculation method, so as to reasonably arrange the weights to capture the electromagnetic system temperature change trend, so as to accurately set the intelligent dynamic critical value for hierarchical over-temperature protection. The online refresh configuration process of each layer critical value is shown in formula (5);

[0100] (5)

[0101] In the formula, is the critical weight of the standard deviation, and by setting four different critical weights , , , , the critical values θh j of each layer are obtained, wherein θh1 is the safety critical value, θh2 is the reporting critical value, θh3 is the protection critical value, and θh4 is the limit critical value. The relationship between the critical values is θh1<θh2<θh3<θh4, and subsequent steps are processed differently according to the relationship between the current sampling temperature θ k and the critical values θh j of each layer.

[0102] The logical relationship between each formula in steps S2 and S3 is as shown in FIG. 2. Figure 5 The mean and standard deviation of the electromagnetic system temperature obtained by formula (1) and (2) are the initial values of formula (3) and (4); the current calculation results of formula (3) and (4) are the input of the intelligent dynamic threshold calculation model of formula (5); after the contactor is restarted, or after a temperature anomaly occurs, or after a fixed period of the interval, the initial values of formula (1) and (2) are restarted, and a new iteration sequence of formula (3) and (4) is forced to start to avoid falling into a local optimum.

[0103] Step S4: Compare the current sampling temperature with the dynamically configured protection threshold θh3, and perform hierarchical processing according to different situations.

[0104] Step S5: If the current sampling temperature is lower than the current protection threshold θh3 and is lower than the current reporting threshold θh2, it is judged that the current temperature is normal and there is no over-temperature hidden danger in a short time, and the process returns to step S1 to continue the intelligent control of the contactor.

[0105] Step S6: If the current sampling temperature is higher than the current reporting threshold θh2, the microprocessor submodule uploads the information of the over-temperature hidden danger to the upper computer through the communication module, the operator obtains the information uploaded by the upper computer through the human-computer interaction module, including the current sampling temperature, the historical sampling temperature, the current reporting threshold, the current coil current value and the historical coil current value, and judges whether to take manual intervention, such as manually opening the cooling module or preparing for shutdown maintenance in advance, and then returns to step S1.

[0106] Step S7: If the current sampling temperature is higher than the current protection threshold θh3, the microprocessor submodule automatically opens the cooling module through the communication module and the upper computer, and transmits the information to the upper computer, and the operator decides whether to upgrade the protection, such as whether to increase the number of opened cooling modules, or to save the scene and shut down for maintenance, so as to avoid the expansion of the fault range and reduce the potential economic loss.

[0107] Step S8: After the cooling module is opened, if the temperature drops below the safety threshold θh1 within a set time, step S9 is entered.

[0108] Step S9: Close the cooling module, and if the temperature is not higher than the protection threshold θh3 within a set time after the cooling module is closed, return to step S1; if the temperature is higher than the protection threshold θh3 again within a set time after the cooling module is closed, step S10 is entered.

[0109] Step S10: re-open the heat dissipation module, and monitor the burping protection times and over-temperature duration; set a safety threshold value θh1 lower than the protection threshold value θh3, form a hysteresis between θh1 and θh3, if the temperature exceeds the protection threshold value θh3, open the heat dissipation protection (i.e. open the heat dissipation module), if the temperature is lower than the safety threshold value θh1, close the heat dissipation protection (i.e. close the heat dissipation module), this process is defined as "burping" protection; if the number of repeated "burping" protection times exceeds the burping times threshold value N2, or the temperature is higher than the protection threshold value θh3 for a duration exceeding the safety duration T pro , within the set safety duration T pro , it is considered that a persistent over-temperature fault occurs and is irreversible, and enters step S12. N2 and T pro may be flexibly set according to the field conditions.

[0110] Step S11: if the temperature continues to rise and exceeds the limit threshold value θh4 under the heat dissipation protection measures, it is determined as a highest level over-temperature fault, and enters step S12.

[0111] Step S12: the microprocessor sub-module automatically closes the contactor excitation through the integrated driving sub-module, the contactor trips, at the same time, the sound and light alarm is sent out by the alarm module through the communication module and the upper computer, and waits for maintenance.

[0112] It needs to be explained here that the above-mentioned cooperative system and method provided by the application are not limited to the protection of a single contactor, and are also more suitable for application scenarios containing a large number of contactors, and can be directly transplanted without complex modification.

[0113] Figure 3 The flowchart shown is only one of the flow examples of the application, and the above steps can be executed in the order of the arrows, or several steps can be executed synchronously without sequence.

[0114] Those skilled in the art should understand that the embodiments of the application can be provided as a method, a system, or a computer program product. Therefore, the application can adopt a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the application can adopt the form of a computer program product implemented on one or more computer usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer usable program codes.

[0115] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flow or blocks Figure 1 means for functionally implementing the steps listed in the flowchart block or blocks.

[0116] These computer program instructions can also be stored in a computer readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer readable memory produce an article of manufacture including instructions which implement the function specified in the flowchart block or blocks. Figure 1 one or more flow or blocks Figure 1 means for functionally implementing the steps listed in the flowchart block or blocks.

[0117] The computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart block or blocks. Figure 1 one or more flow or blocks Figure 1 means for functionally implementing the steps listed in the flowchart block or blocks.

[0118] The above description is only preferred embodiments of the present application, and is not intended to limit the present application to other forms described above. Any person skilled in the art may make modifications or improvements without departing from the technical scope of the present application. Any simple modifications, equivalent changes and improvements made to the above embodiments according to the technical essence of the present application, without departing from the technical scope of the present application, shall fall within the protection scope of the present application.

Claims

1. An integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system, characterized in that, It comprises an integrated control contactor (100), a communication module (200) and an upper computer (300); The integrated control contactor (100) is composed of a contactor body (110) and an integrated control module (120), and the integrated control module (120) comprises: a temperature sensing sub-module (1201) for sampling the temperature of the contactor electromagnetic system and sending the collected temperature data to a microprocessor sub-module (1203) for processing; an integrated driving sub-module (1202) for receiving the driving signal of the microprocessor sub-module (1203) to realize closed-loop excitation control of the contactor electromagnetic system; the microprocessor sub-module (1203) is used for receiving the information sent by the temperature sensing sub-module (1201) and executing the lower computer part of the hierarchical intelligent dynamic over-temperature protection method, and executing the intelligent control strategy of the contactor to intelligently control the contactor; The communication module (200) is used for realizing data communication between the microprocessor sub-module (1203) and the upper computer (300) to send the current, temperature and alarm information on the microprocessor sub-module (1203) to the upper computer (300); The upper computer (300) is used for comprehensively receiving the information sent by the microprocessor sub-module (1203), executing the upper computer part of the hierarchical intelligent dynamic over-temperature protection method, judging the over-temperature severity and executing the hierarchical over-temperature protection through the related module.

2. The integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system according to claim 1, wherein, The integrated control module (120) is built in the contactor body (110); the temperature sensing sub-module (1201) is arranged on the surface of the integrated control module (120) and is spaced apart from the contactor electromagnetic system by a set minimum distance to sample the temperature of the contactor electromagnetic system.

3. The integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system according to claim 1, wherein, It also comprises: a heat dissipation module (400) for receiving the heat dissipation instructions of the upper computer (300) or the supervisor terminal (700) to dissipate heat for the contactor body (110); a human-computer interaction module (500) for realizing the interaction between the upper computer (300) and the supervisor terminal (700); an alarm module (600) for issuing sound and light alarms when over-temperature failure occurs; a supervisor terminal (700) for interacting with the upper computer (300) and issuing heat dissipation instructions to the heat dissipation module (400).

4. The integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system according to claim 3, wherein, The upper computer executes the hierarchical over-temperature protection according to the over-temperature severity, which comprises automatically opening the heat dissipation module (400), issuing sound and light alarms through the alarm module (600) and sending the over-temperature severity information to the supervisor terminal (700) through the human-computer interaction module (500); The supervisor decides whether to take manual intervention and protection upgrade according to the over-temperature severity information received by the supervisor terminal (700), and the manual intervention and protection upgrade measures comprise manually and forcibly opening the heat dissipation module (400), sending the upper computer instructions through the human-computer interaction module (500), transmitting the instructions to the microprocessor sub-module (1203) through the communication module (200), and if the upper computer instruction is a shutdown for repair instruction, the microprocessor sub-module (1203) closes the contactor excitation through the integrated driving sub-module (1202).

5. The integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system according to claim 1, wherein, The core of the microprocessor submodule (1203) adopts a single-chip MCU chip, which is used to execute the lower computer part of the hierarchical intelligent dynamic over-temperature protection method and the intelligent control strategy of the contactor; the core of the integrated driving submodule (1202) adopts a power integrated chip, which is embedded with the functions of bus self-energy, temperature monitoring and power conversion, and the current information output pin of the integrated driving submodule (1202) can transmit the coil current information to the second analog input pin of the single-chip MCU chip; After the single-chip MCU chip executes the intelligent control strategy of the contactor, the control input pin of the power integrated chip receives the driving signal from the pulse width modulation output pin of the single-chip MCU chip, and the power conversion unit of the power integrated chip realizes closed-loop excitation of the electromagnetic system of the contactor; The temperature monitoring input pin and the ground pin of the power integrated chip are connected in series with a thermistor NTC and a wafer resistor R1, and a voltage follower subcircuit composed of an operational amplifier K and a resistor R2, together with the thermistor NTC and the wafer resistor R1, constitutes the temperature sensing part of the temperature sensing submodule (1201); The ground pins of the microprocessor submodule (1203), the integrated driving submodule (1202) and the temperature sensing submodule (1201) are connected in common.

6. The integrated control contactor hierarchical intelligent dynamic over-temperature protection collaborative system according to claim 5, wherein, Let U D As a temperature protection fixed voltage reference value, the integrated control module (120) works, the power integrated chip of integrated drive sub-module (1202), the internal current source feeds into the thermistor NTC and the wafer resistance R1 to the ground end, when the electromagnetic system temperature changes, the thermistor NTC resistance changes, the temperature monitoring input pin end voltage changes, on the one hand, the temperature information is transmitted to the temperature monitoring unit of the power integrated chip, once the voltage exceeds U D That is, the analog temperature protection action is started, and on the other hand, through the voltage following subcircuit, the impedance matching of the capture input pin of the single-chip microcomputer MCU chip and the first analog input pin is realized. The capture input pin of the single-chip MCU chip is used to execute the capture function, i.e. to capture the moment when the current source feeds the thermistor NTC, and then trigger the single-chip MCU chip to sample the voltage between the temperature monitoring input pin and the ground through the first analog input pin; The single-chip MCU chip is set to sample after a fixed delay from the trigger moment, so as to wait for the voltage between the temperature monitoring input pin and the ground to stabilize and avoid sampling transient errors; the single-chip MCU chip periodically samples the voltage value through the first analog input pin and transmits the temperature information to the microprocessor submodule (1203) for calculation of the lower computer part of the hierarchical intelligent dynamic over-temperature protection method.

7. A hierarchical intelligent dynamic over-temperature protection method based on the integrated control contactor synergy system of claim 6, characterized in that, The method comprises the following steps: Step S1: the microprocessor submodule executes the intelligent control strategy of the contactor, outputs a PWM signal to drive the integrated driving submodule, and controls the excitation state of the electromagnetic system in a closed loop to intelligently control the contactor; Step S2: the temperature sensing part of the temperature sensing submodule samples the voltage change between the temperature monitoring input pin and the ground according to the following sampling time sequence: at time t1, the current source starts to feed the thermistor NTC; at time t2, the capture input pin captures the rising edge change of the voltage between the temperature monitoring input pin and the ground after the current source feeds; the hardware triggers AD analog-digital conversion; the AD sampling of the first analog input pin is set to wait for a set time to time t3, at which time the voltage between the temperature monitoring input pin and the ground is stable, and the single-chip MCU chip starts to convert the digital temperature information required by the single-chip MCU chip; at this time, the analog-digital conversion result is directly applied, or the actual temperature is converted again; at time t4, the current source stops feeding; The temperature initial value calculation of the lower machine part is performed after each start of the contactor or after the temperature anomaly of the electromagnetic system, and is reset and updated at a fixed interval to avoid the intelligent dynamic critical value model from falling into local optimum; when the contactor is in the stable holding stage, the temperature information θ k-M , θ k-M+1 ,..., θ k-1 of the initial stage in the past M moments are selected to calculate the initial value of the temperature mean and sample standard deviation of the near electromagnetic system, and the near electromagnetic system is approximately equivalent to the electromagnetic system during calculation, as shown in formula (1) and formula (2); (1) (2) wherein is the initial value of the average temperature of the electromagnetic system for the last M time instants, θ j is the temperature value at the jth calculation instant, k - M indicates the last M calculation instants of the current calculation instant, is the initial value of the standard deviation of the temperature samples for the last M time instants; Step S3: the microprocessor submodule implements intelligent dynamic critical value calculation and configuration of the lower computer part of the hierarchical intelligent dynamic over-temperature protection method, and iteratively refreshes the calculation period according to the actual application system and working condition. Let interval N1 time as a computing cycle, the current k time electromagnetic system temperature average value and standard deviation s k The moving recursive calculation process is shown in formula (3) and formula (4). (3) (4) In the formula, the subscripts k and k-1 represent the current calculation time and the previous calculation time, respectively, θ k-1 is the temperature value at the previous calculation time, the temperature value collected during the protection state needs to be removed, and ω is the weight of the newly added temperature sampling information. The intelligent dynamic threshold is set by the iterative calculation of the weighted movement to perform hierarchical over-temperature protection, and the online refresh configuration process of each layer threshold is shown in formula (5); (5) In the formula, Critical weight of standard deviation, by setting 4 different critical weights , , , , respectively, get each layer critical value θh j , wherein θh1 is a safety critical value, θh2 is a report critical value, θh3 is a protection critical value, θh4 is a limit critical value, the relationship between each critical value is θh1<θh2<θh3<θh4, the subsequent steps are according to the relationship between the current sampling temperature θ k and each critical value θh j , carry out different processing in layers; The mean and standard deviation of the electromagnetic system temperature obtained by formula (1) and (2) are the initial values of formula (3) and (4); the current calculation results of formula (3) and (4) are the input of formula (5); when the contactor is restarted, or when a temperature anomaly occurs, or when the fixed period of the interval is reached, the initial values of formula (1) and (2) are restarted, and formula (3) and (4) are forced to start a new iteration sequence to avoid falling into local optimization; Step S4: compare the current sampling temperature with the dynamically configured protection threshold θh3, and perform hierarchical processing according to different situations; Step S5: if the current sampling temperature is lower than the current protection threshold θh3 and is lower than the current reporting threshold θh2, it is judged that the current temperature is normal and there is no over-temperature risk in a short time, and the process returns to step S1 to continue intelligent control of the contactor; Step S6: if the current temperature sampling value is higher than the current reporting threshold θh2, the microprocessor submodule uploads the information of the over-temperature risk to the upper computer through the communication module, the monitor obtains the information uploaded by the upper computer through the human-computer interaction module, including the current sampling temperature, the historical sampling temperature, the current reporting threshold, the current coil current value and the historical coil current value, and judges whether to take manual intervention, and then returns to step S1; Step S7: if the current sampling temperature is higher than the current protection threshold θh3, the microprocessor submodule automatically starts the cooling module through the communication module and the upper computer, and transmits the information to the upper computer, and the monitor decides whether to upgrade the protection; Step S8: after starting the cooling module, if the temperature drops below the safety threshold θh1 within a set time, proceed to step S9; Step S9: turn off the cooling module, and if the temperature does not exceed the protection threshold θh3 within a set time, return to step S1; if the temperature exceeds the protection threshold θh3 again within a set time after turning off the cooling module, proceed to step S10; Step S10: reopen the cooling module and monitor the number of burp protection and over-temperature duration; The safety threshold θh1 is set lower than the protection threshold θh3, a hysteresis is formed between θh1 and θh3, if the temperature exceeds the protection threshold θh3, the heat dissipation module is turned on, if the temperature is lower than the safety threshold θh1, the heat dissipation module is turned off, this process is defined as hiccup protection; if the hiccup protection is performed for a safety time T pro times, or the temperature is higher than the protection threshold θh3 for a time exceeding the safety time T pro , it is considered that a persistent over-temperature fault occurs and is irreversible, and enters step S12; N2 and T pro are set according to the field conditions. Step S11: if the temperature continues to rise beyond the limit threshold θh4 after taking the cooling protection measures, it is determined as the highest level over-temperature fault, and proceed to step S12; Step S12: the microprocessor submodule automatically turns off the contactor excitation through the integrated drive submodule, the contactor trips, and the alarm module sends an audible and visual alarm through the communication module and the upper computer, and waits for maintenance.

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