Temperature control fluid distribution assembly, process chamber and semiconductor process equipment

Abstract

The invention discloses a temperature control fluid distribution assembly, a process chamber and semiconductor process equipment, and relates to the field of semiconductors. A temperature control fluid distribution assembly is used for a process chamber, and the temperature control fluid distribution assembly is provided with an air inlet, a first air vent, a flow channel and an air outlet. The temperature control fluid distribution assembly comprises an air inlet and an air outlet, the air inlet and the air outlet are respectively arranged at one end of the temperature control fluid distribution assembly, the first air vent is arranged at the other end of the temperature control fluid distribution assembly and is used for providing temperature control fluid for the process chamber, and the first air vent is positioned between the air inlet and the air outlet along the flowing direction of the temperature control fluid; the flow channel extends in the circumferential direction of the temperature control fluid distribution assembly, and the air inlet, the air outlet and the first ventilation opening communicate with the flow channel. The problem that the temperature of the ceramic cylinder is not uniform can be solved at least.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductors, and particularly relates to a temperature control fluid distribution assembly, a process chamber, and a semiconductor process equipment. BACKGROUND

[0002] Temperature is an important factor in the working process of an etching machine, and has an important influence on the uniformity of etching rate in the etching process of a wafer. How to improve the temperature uniformity in the working process of the etching machine is crucial. A three-dimensional plasma source can generate a higher density of plasma, thereby obtaining a faster etching rate. Through a related process kit, the distribution of plasma and process gas can be better controlled to adjust the uniformity and etching morphology of wafer etching.

[0003] Some ICP etching equipment in the related art adopts a hot air structure to control the temperature of a ceramic cylinder. The hot air structure introduces hot air into the air duct of the outer periphery of the ceramic cylinder through an air outlet to heat the ceramic cylinder. However, when the hot air flows in the air duct, the hot air flow near the air duct inlet is large, which causes the temperature of the ceramic cylinder near the air duct inlet to be high, and the temperature of the ceramic cylinder near the air duct outlet to be low, thereby causing the temperature of the ceramic cylinder to be non-uniform, which affects the process. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide a temperature control fluid distribution assembly, a process chamber, and a semiconductor process equipment, which can at least solve the problem of non-uniform temperature of the ceramic cylinder.

[0005] To solve the above technical problems, the present application is implemented as follows: The embodiments of the present application provide a temperature control fluid distribution assembly for a process chamber, which is provided with an air inlet, a first air vent, a flow channel, and an air outlet. The air inlet and the air outlet are respectively arranged at one end of the temperature control fluid distribution assembly, and the first air vent is arranged at the other end of the temperature control fluid distribution assembly, for providing temperature control fluid to the process chamber. In the flow direction of the temperature control fluid, the first air vent is located between the air inlet and the air outlet. The flow channel extends along the circumference of the temperature control fluid distribution assembly, and the air inlet, the air outlet, and the first air vent are respectively communicated with the flow channel.

[0006] The embodiments of the present application further provide a process chamber, which comprises a temperature control main body and a mounting plate. The mounting plate is arranged on the temperature control main body and is used to carry the above-mentioned temperature control fluid distribution assembly. The temperature control main body is provided with a third flow channel. The mounting plate is provided with a first air hole and a second air hole, the first air hole is used for being arranged opposite to a first air vent of the temperature control fluid distribution assembly and being communicated with the first air vent and the third flow channel, and the second air hole is used for being arranged opposite to an air outlet of the temperature control fluid distribution assembly and being communicated with the air outlet and the third flow channel.

[0007] The application further provides a semiconductor process equipment, which comprises the temperature control fluid distribution assembly, a process chamber and a temperature control module. The temperature control module is arranged in the temperature control fluid distribution assembly and is used for conveying temperature control fluid to the temperature control fluid distribution assembly and conveying the temperature control fluid to the third flow channel of the temperature control main body in the process chamber through the temperature control fluid distribution assembly.

[0008] In the application, the temperature control fluid (such as hot air or cold air) can be input into the flow channel through the air inlet, and the temperature control fluid can be diffused in the flow channel to fill the space in the flow channel. The temperature control fluid in the flow channel can be conveyed to the process chamber through the first air vent, so that the temperature control fluid can flow into each area in the process chamber more uniformly, so as to increase the contact area between the temperature control fluid and each area in the process chamber and improve the temperature uniformity of each area in the process chamber. Compared with the way of inputting hot air into the air duct around the outer periphery of the ceramic cylinder through the air outlet by using a hot air structure in the related art, the application can also improve the temperature difference between the temperature control fluid close to the air inlet and the temperature control fluid close to the air outlet under the action of the first air vent, so as to effectively improve the uniformity of temperature control and ensure the normal operation of the semiconductor process. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 A structural schematic diagram of a semiconductor process equipment disclosed in the application is shown in the figure; Figure 2 A structural schematic diagram of a semiconductor process equipment disclosed in the application is shown in the figure; Figure 3 A first structural schematic diagram of an air inlet part disclosed in the application is shown in the figure; Figure 4 A second structural schematic diagram of an air inlet part disclosed in the application is shown in the figure; Figure 5 A structural schematic diagram of a mounting plate disclosed in the application is shown in the figure; Figure 6 A structural schematic diagram of an air inlet hole plate disclosed in the application is shown in the figure; Figure 7 A structural schematic diagram of an air outlet part disclosed in the application is shown in the figure; Figure 8 A structural schematic diagram of an air outlet hole plate disclosed in the application is shown in the figure; Figure 9 A partial schematic view at the first arc surface or the second arc surface disclosed by embodiments of the present application; Figure 10 A first schematic view of one of the process chambers disclosed by embodiments of the present application; Figure 11 A second schematic view of one of the process chambers disclosed by embodiments of the present application; Figure 12 A first schematic view of another form of the process chamber disclosed by embodiments of the present application; Figure 13 A second schematic view of another form of the process chamber disclosed by embodiments of the present application; Figure 14 A schematic view of simulation results disclosed by embodiments of the present application; Figure 15 A schematic view of the temperature control system disclosed by embodiments of the present application.

[0010] Explanation of reference signs: 01-temperature control fluid distribution assembly; 11-housing; 111-air inlet member; 1111-air inlet; 1112-first opening; 1113-first arc surface; 112-air outlet member; 1121-air outlet; 1122-second opening; 1123-second arc surface; 12-orifice plate; 121-air inlet orifice plate; 121a-air vent group; 1211-first air vent; 122-air outlet orifice plate; 1221-second air vent; M-flow channel; M1-first flow channel; M2-second flow channel; 02-temperature control main body; 021-medium cylinder; 022-mounting plate; 0221-first air hole; 0222-second air hole; 023-medium window; M3-third flow channel; 03-temperature control module. DETAILED DESCRIPTION

[0011] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and do not limit the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the objects before and after are in an "or" relationship.

[0013] The embodiments of the present application will be described in detail below with reference to the accompanying drawings, specific embodiments and application scenarios.

[0014] The related art uses a hot air structure to control the temperature of the ceramic cylinder. Specifically, the hot air module can be provided with an air inlet and an air outlet. The heated air or cooled air can enter the ceramic cylinder through the air inlet, flow through the air duct of the ceramic cylinder, and then flow out through the air outlet to achieve temperature control of the ceramic cylinder. However, this temperature control method can cause the temperature of the ceramic cylinder to be higher near the air inlet and lower near the air outlet, resulting in a large temperature difference between the air inlet and the air outlet of the ceramic cylinder. In addition, after the air inlet sends air, most of the air directly flows out from the air outlet, resulting in insufficient heat exchange with the ceramic cylinder.

[0015] To solve the problem of uneven temperature distribution at the air inlet and outlet of the ceramic cylinder in the related art, the embodiments of the present application disclose a temperature control fluid distribution assembly 01 applied to a process chamber for temperature control of the process chamber. Referring to Figures 1 to 15 , the disclosed temperature control fluid distribution assembly 01 is provided with an air inlet 1111, a first air vent 1211, a flow channel M and an air outlet 1121.

[0016] The air inlet 1111 is used to receive temperature control fluid, such as hot air or cold air, etc.; the flow channel M is used to transport the temperature control fluid; in some embodiments, the first air vent 1211 can be multiple, used to uniform the temperature control fluid to improve the uniformity of the temperature control fluid transportation; the air outlet 1121 is used to discharge the temperature control fluid.

[0017] Among them, the air inlet 1111 and the air outlet 1121 are respectively arranged at one end of the temperature control fluid distribution assembly 01, and the first air vent 1211 is arranged at the other end of the temperature control fluid distribution assembly 01, used to provide temperature control fluid to the process chamber. Along the flow direction of the temperature control fluid, the first air vent 1211 is located between the air inlet 1111 and the air outlet 1121.

[0018] Optionally, the temperature control fluid distribution assembly 01 can be a ring structure, and can also be other shapes suitable for the process chamber, which is not limited here. When the temperature control fluid distribution assembly 01 is a ring structure, the gas inlet 1111 and the gas outlet 1121 can be respectively arranged on the side wall of one end of the temperature control fluid distribution assembly 01 along the axis direction of the temperature control fluid distribution assembly 01, and the first air port 1211 can be arranged on the other end of the temperature control fluid distribution assembly 01 along the axis direction of the temperature control fluid distribution assembly 01.

[0019] The flow channel M extends along the circumference of the temperature control fluid distribution assembly 01, and the gas inlet 1111, the gas outlet 1121 and the first air port 1211 are respectively communicated with the flow channel M, so that the temperature control fluid can flow between the gas inlet 1111, the gas outlet 1121 and the first air port 1211 and the flow channel M respectively, so as to achieve the temperature control effect on the process chamber.

[0020] Specifically, the temperature control fluid can flow into the flow channel M through the gas inlet 1111 and diffuse in the flow channel M, and the diffused temperature control fluid is uniformly delivered to the outer wall of the process chamber through the first air port 1211, so as to control the temperature of the outer wall of the process chamber. After the temperature control fluid is delivered to the outer wall of the process chamber, heat exchange occurs between the temperature control fluid and the outer wall of the process chamber, and the temperature control fluid after heat exchange flows back to the flow channel M from the temperature control chamber and is finally discharged through the gas outlet 1121.

[0021] In the embodiment of the present application, the temperature control fluid (such as hot air or cold air) can be input into the flow channel M through the gas inlet 1111, and the temperature control fluid can diffuse in the flow channel M to fill the space in the flow channel M. The temperature control fluid in the flow channel M can be delivered to the outer wall of the process chamber through the first air port 1211, so that the temperature control fluid can flow more uniformly into the outer wall of the process chamber, so as to increase the contact area between the temperature control fluid and the outer wall of the process chamber and improve the temperature uniformity of the outer wall of the process chamber. Compared with the related art which uses a hot air structure to deliver hot air to the air duct around the ceramic cylinder through the air outlet, the embodiment of the present application improves the temperature difference between the temperature control fluid near the gas inlet 1111 and the temperature control fluid near the gas outlet 1121 under the action of the first air port 1211, thereby effectively improving the uniformity of temperature control and ensuring the normal operation of the semiconductor process.

[0022] Reference Figure 1 and Figure 2 In some embodiments, the flow channel M can include a first flow channel M1 and a second flow channel M2, which are arranged along the circumference of the temperature control fluid distribution assembly 01 and are respectively used to communicate with the process chamber, so that the first flow channel M1 and the second flow channel M2 can respectively deliver the temperature control fluid between the process chamber.

[0023] The inlet 1111 and the first vent 1211 can be in communication with the first flow channel M1, so that the temperature control fluid can flow into the first flow channel M1 through the inlet 1111 and flow out of the first vent 1211 and be delivered to the outer wall of the process chamber for heat exchange.

[0024] The outlet 1121 is in communication with the second flow channel M2, so that the temperature control fluid after heat exchange can flow back to the second flow channel M2 from the process chamber and finally be discharged through the outlet 1121.

[0025] It should be noted that the first flow channel M1 and the second flow channel M2 are separated from each other to prevent the situation that part of the temperature control fluid in the first flow channel M1 does not flow into the process chamber but is directly discharged from the second flow channel M2 and the outlet 1121.

[0026] In some embodiments, the temperature control fluid distribution assembly 01 can also be provided with a second vent 1221 in communication with one end of the second flow channel M2 away from the outlet 1121, so that the second vent 1221 can be arranged corresponding to the local part of the process chamber to facilitate receiving the temperature control fluid after heat exchange output from the process chamber. In some embodiments, the second vent 1221 can be multiple to play a uniform flow role on the temperature control fluid.

[0027] Optionally, the second vent 1221 can be provided at the other end of the temperature control fluid distribution assembly 01 along the axial direction thereof, that is, the first vent 1211 and the second vent 1221 can be located at the same end, so that when the temperature control fluid distribution assembly 01 is installed to the process chamber, the first vent 1211 and the second vent 1221 can be respectively docked with the process chamber, thereby realizing the transmission of the temperature control fluid.

[0028] Reference Figure 2 In some embodiments, the temperature control fluid distribution assembly 01 can include a shell 11 and a hole plate 12. The inlet 1111 and the outlet 1121 can be respectively provided at one end of the shell 11, and the other end of the shell 11 is provided with an opening, the hole plate 12 is provided at the opening and surrounds the flow channel M with the shell 11, and the first vent 1211 is provided on the hole plate 12.

[0029] It should be noted that the other end of the shell 11 can be provided with an opening, and the other areas can be closed to serve as the inner wall of the flow channel M. The hole plate 12 is provided at the opening, so that the plate surface of the hole plate 12 can also serve as the inner wall of the flow channel M.

[0030] Optionally, the shell 11 can be a long strip-shaped shell, such as a rectangular shell, a long strip-shaped arc shell, etc. Correspondingly, the shape of the hole plate 12 is adapted to the shape of the shell 11. Of course, other shapes are also possible, which are not limited here.

[0031] In some specific embodiments, the gas inlet 1111 and the gas outlet 1121 can be arranged on the side wall of one end of the cover 11 and spaced along the circumference of the temperature control fluid distribution assembly 01, so as to separate the positions of the temperature control fluid input from the positions of the temperature control fluid output, thereby increasing the contact area of the temperature control fluid with the process chamber and improving the heat exchange effect.

[0032] In some embodiments, the cover 11 and the hole plate 12 can be integrally arranged to ensure the sealing of the flow channel M; in other embodiments, the hole plate 12 can be fixedly connected to the opening of the cover 11, such as welding, bonding, riveting, screwing, etc., to ensure the reliability and stability of the connection between the hole plate 12 and the cover 11, and of course, to ensure the sealing of the flow channel M.

[0033] In some embodiments, the temperature control fluid distribution assembly 01 can include at least two covers 11 and at least two hole plates 12. Among them, the at least two covers 11 are arranged in a head-to-tail manner along the circumference of the temperature control fluid distribution assembly 01, and the at least two hole plates 12 are arranged at the openings of the corresponding covers 11. Based on this arrangement, a ring structure can be formed around the at least two covers 11, so as to adapt to the shape of the process chamber, and when the at least two hole plates 12 are arranged at the openings of the at least two covers 11, a ring-shaped flow channel M can be formed, so as to make the temperature control fluid entering the flow channel M flow along the ring-shaped temperature control fluid distribution assembly 01, thereby improving the efficiency of the temperature control fluid entering the process chamber, and increasing the contact area of the temperature control fluid with the process chamber and improving the heat exchange efficiency between the temperature control fluid and the process chamber.

[0034] It should be noted here that the at least two covers 11 and the at least two hole plates 12 can form at least two flow channels M to respectively supply temperature control fluid to the process chamber through the at least two flow channels M.

[0035] Further, the gas inlet 1111 of one of the two adjacent covers 11 is used to communicate with the gas outlet 1121 of the other cover 11 through the flow channel M and the process chamber. Specifically, when the temperature control fluid distribution assembly 01 is installed to the process chamber, the gas inlet 1111 of one of the two adjacent covers 11 can pass through the first flow channel M1, the first air vent 1211, the process chamber, the second flow channel M2, and finally be discharged through the gas outlet 1121.

[0036] From the perspective of easy processing and disassembly, in the embodiments of the present application, the cover 11 can include a gas inlet member 111 and a gas outlet member 112, the hole plate 12 can include a gas inlet hole plate 121 and a gas outlet hole plate 122, and the opening can include a first opening 1112 and a second opening 1122.

[0037] The air intake component 111 may have an air inlet 1111 and a first opening 1112. The air inlet plate 121 may be disposed at the first opening 1112 and form a first flow channel M1 with the air intake component 111. Based on this, the temperature control fluid can flow into the first flow channel M1 through the air inlet 1111 of the air intake component 111, and the temperature control fluid can be evenly delivered to the process chamber through the first vent 1211 of the air inlet plate 121.

[0038] Optionally, the air inlet 111 may be provided with an arc-shaped groove extending along the temperature control fluid distribution assembly 01. The arc-shaped groove can guide the temperature control fluid and extend the flow area of ​​the temperature control fluid so as to achieve a uniform flow of the temperature control fluid before it enters the process chamber.

[0039] In addition, the air outlet 112 may be provided with an air outlet 1121 and a second opening 1122, and the air outlet plate 122 is provided at the second opening 1122, forming a second flow channel M2 with the air outlet 112. Based on this, the temperature-controlled fluid after heat exchange in the process chamber can flow into the second flow channel M2 through the second flow equalization plate, and finally be discharged through the air outlet 1121.

[0040] To further improve the uniform flow effect, the air inlet plate 121 can be provided with multiple air vent groups 121a, such as Figure 6 As shown, each vent group 121a may include multiple first vents 1211. Based on this, the multiple vent groups 121a can divert the temperature-controlled fluid in the first flow channel M1, allowing the temperature-controlled fluid to flow into the process chamber through the multiple vent groups 121a respectively, thus achieving a uniform flow of the temperature-controlled fluid. Furthermore, it can realize multi-port input of temperature-controlled fluid, which helps to reduce temperature differences at different locations in the process chamber, thereby improving temperature uniformity. At the same time, the multiple first vents 1211 in each vent group 121a can further uniformize the flow of the temperature-controlled fluid.

[0041] Optionally, the first flow channel M1 can extend circumferentially along the temperature control fluid distribution component 01. For example, the first flow channel M1 can be an arc-shaped flow channel. In this case, multiple vent groups 121a can be distributed circumferentially, such as uniformly or non-uniformly, so as to transport the temperature control fluid to different areas along the circumferential direction in the process chamber through multiple vent groups 121a, thereby increasing the heat exchange efficiency between the temperature control fluid and the process chamber.

[0042] In addition, the multiple first vents 1211 in each vent group 121a can be arranged evenly or unevenly, depending on actual needs.

[0043] like Figure 8As shown, the gas outlet plate 122 is provided with a plurality of second air vents 1221, which can also form an air vent group 121a, so that the temperature-controlled fluid in the process chamber after heat exchange can enter the second flow channel M2 through the uniform flow of the plurality of second air vents 1221, thereby increasing the flow area of the temperature-controlled fluid flowing into the second flow channel M2 and improving the delivery efficiency.

[0044] It should be noted here that the distribution of the air vent group 121a and the first air vent 1211 in each air vent group 121a will affect the flow of the temperature-controlled fluid entering the process chamber. Therefore, the number of first air vents 1211 in different positions of the air vent group 121a needs to be considered to make the flow of the temperature-controlled fluid input by each air vent group 121a the same. Similarly, the distribution of the second air vent 1221 will also affect the flow of the temperature-controlled fluid. Therefore, by combining simulation and actual testing, the distribution of the first air vent 1211 and the distribution of the second air vent 1221 can be changed without changing the overall structure, so as to determine the optimal distribution of the first air vent 1211 and the second air vent 1221.

[0045] As shown, Figure 14 The simulation result shows that the streamline represents the path of the temperature-controlled fluid flow, and the density of the streamline can reflect the area where most of the temperature-controlled fluid passes through. From the streamline diagram, it can be seen that the temperature-controlled fluid is distributed in most of the area of the third flow channel M3 in the process chamber. Whether the temperature-controlled fluid is uniformly distributed in the third flow channel M3 will directly affect the heat exchange efficiency between the process chamber and the temperature-controlled fluid, thereby affecting the uniformity of the temperature distribution in the process chamber.

[0046] In the temperature distribution of the simulation result, the color represents the temperature, and the temperature difference of the process chamber can be directly observed from the color difference, and the smaller the color difference means the smaller the temperature difference. From Figure 14 It can be seen that when the plurality of air vent groups 121a are used to input the temperature-controlled fluid, the temperature-controlled fluid distribution assembly 01 uniformly distributes the temperature-controlled fluid entering the process chamber, and the temperature distribution is relatively uniform, and the temperature difference between the inlet and outlet positions is improved.

[0047] In addition, the gas inlet hole plate 121 can also shield radio frequency to prevent the radio frequency radiation generated after the coil in the process chamber from affecting the external environment. From the perspective of radio frequency shielding, to further improve the radio frequency shielding effect, the aperture of the first air vent 1211 can be no more than 4 mm, such as 4 mm, 3.5 mm, 3 mm, 2.5 mm, etc. Of course, it can also be other sizes, which are not limited here. It should be noted here that the influence of the aperture of the first air vent 1211 on the radio frequency shielding effect can be simulated by simulation. Of course, the aperture of the second air vent 1221 of the gas outlet hole plate 122 can also be no more than 4 mm, so as to improve the radio frequency shielding effect.

[0048] Considering that the first flow channel M1 can extend along the circumference of the temperature control fluid distribution assembly 01, correspondingly, the first opening 1112 can also extend along the circumference of the temperature control fluid distribution assembly 01, so as to set the gas inlet hole plate 121 extending along the circumference of the temperature control fluid distribution assembly 01, so that the uniform flow area can be improved and the uniform flow effect can be improved through the plurality of air vent groups 121a distributed on the gas inlet hole plate 121 in the circumferential direction. Exemplarily, the first opening 1112 can be an arc-shaped opening, so as to set the arc-shaped gas inlet hole plate 121 here.

[0049] The gas inlet 1111 can be arranged opposite to the local area of the first opening 1112, the cross-sectional area of the gas inlet 1111 is greater than that of the local area of the first opening 1112, and the gas inlet 1111 and the local area of the first opening 1112 are connected by the first arc surface 1113. Based on this setting, on the one hand, the first flow channel M1 can be smoother at the gas inlet 1111 and the first opening 1112, reducing the flow resistance of the temperature control fluid in the first flow channel M1, making the temperature control fluid flow more smoothly, on the other hand, the gas inlet 111 can also be smoother, which is beneficial to alleviate the stress concentration problem.

[0050] Optionally, the gas inlet 1111 is located at one end of the first opening 1112 in the circumferential direction, and the cross-sectional area of the gas inlet 1111 is greater than that of the opposite area of the first opening 1112 and the gas inlet 1111. Exemplarily, the gas inlet 1111 can be a circular port, and the first opening 1112 can be a long strip-shaped port, such as an arc-shaped port.

[0051] Exemplarily, the gas inlet 1111 can be a circular port, and the first opening 1112 and the first gas hole 0221 of the mounting plate 022 can be a fan-shaped port, and the smooth transition between the circular port and the fan-shaped port can be realized through the first arc surface 1113 to reduce the flow resistance.

[0052] Similarly, the air outlet 1121 is arranged opposite to the second opening 1122, the cross-sectional area of the air outlet 1121 is greater than that of the second opening 1122, and the air outlet 1121 and the second opening 1122 can be connected by the second arc surface 1123. Based on this setting, on the one hand, the second flow channel M2 can be made more smooth at the air outlet 1121 and the second opening 1122, reducing the flow resistance of the temperature control fluid in the second flow channel M2, making the temperature control fluid flow more smoothly, on the other hand, the air outlet 112 can also be made more smooth, which is beneficial to alleviate the stress concentration problem.

[0053] Exemplarily, the air outlet 1121 can be a circular port, and the second opening 1122 can be a waist-shaped port.

[0054] In some embodiments, the sum of the cross-sectional areas of the first air ports 1211 of the plurality of air port groups 121a can be less than or equal to the cross-sectional area of the air inlet 1111. Based on this, it can be ensured that the temperature control fluid is uniformly diffused without reducing the input area. The embodiment of the present application also discloses a process chamber, the disclosed process chamber comprising a temperature control body 02 and a mounting plate 022, the mounting plate 022 being arranged on the temperature control body 02 and being used to carry the temperature control fluid distribution assembly 01. Referring to Figure 5 、 Figure 10 and Figure 11 , the temperature control body 02 can be provided with a third flow channel M3, the mounting plate 022 is provided with a first air hole 0221 and a second air hole 0222, the first air hole 0221 is arranged opposite to the first air port 1211 of the temperature control fluid distribution assembly 01 and is communicated with the first air port 1211 and the third flow channel M3, and the second air hole 0222 is arranged opposite to the air outlet 1121 of the temperature control fluid distribution assembly 01 and is communicated with the air outlet 1121 and the third flow channel M3.

[0055] Optionally, screws can be used to fix the air inlet member 111 and the air inlet hole plate 121 of the temperature control fluid distribution assembly 01 and the air outlet member 112 and the air outlet hole plate 122 on the mounting plate 022 respectively, so as to ensure the installation stability of the temperature control fluid distribution assembly 01.

[0056] Based on the above setting, the temperature control fluid can be input into the first air hole 0221 through the first air port 1211 of the temperature control fluid distribution assembly 01, and then into the third flow channel M3 through the first air hole 0221, so that the temperature control fluid can flow in the third flow channel M3 and exchange heat with the temperature control body 02; after the heat exchange, the temperature control fluid flows into the second air hole 0222 through the third flow channel M3, and then flows into the air outlet 1121 through the second air hole 0222, and finally is discharged through the air outlet 1121.

[0057] Optionally, the second air hole 0222 can be directly communicated with the second vent 1221, and the second vent 1221 is communicated with the air outlet 1121 through the second flow channel M2.

[0058] Optionally, the mounting plate 022 can be provided with a plurality of first air holes 0221 distributed along the circumference of the medium cylinder 021; the plurality of first air holes 0221 can be uniformly arranged or non-uniformly arranged along the circumference, which is specifically set according to actual needs.

[0059] Considering that the size of the first air hole 0221 and the second air hole 0222 has a certain influence on the strength of the mounting plate 022, and in order to increase the input area and reduce the influence of the air hole on the strength of the mounting plate 022 when the third flow channel M3 is in a ring structure, the first air hole 0221 and the second air hole 0222 can be fan-shaped holes, as shown in Figure 5 .

[0060] In addition, the center of the plurality of first air holes 0221 and the center of the second air hole 0222 can be located on the center line of the medium cylinder 021, so that the cross-sectional area of the plurality of first air holes 0221 and the second air hole 0222 can be the same, and the uniformity of the temperature control fluid flow can be ensured.

[0061] Further, from the aspect of relieving stress concentration, the edge of the hole wall of the first air hole 0221 and the second air hole 0222 can be designed as a round corner.

[0062] In some embodiments, the opening form and position of the inlet hole plate 121 and the outlet hole plate 122 can correspond to the opening form and position on the mounting plate 022. For example, the vent group 121a of the inlet hole plate 121 can be in the form of a rectangle; the plurality of second vents 1221 of the outlet hole plate 122 can also be distributed in the form of a rectangle.

[0063] In some embodiments, the plate surface of the mounting plate 022 facing the temperature control fluid distribution assembly 01 can be provided with a plurality of mounting grooves extending along the circumference of the temperature control fluid distribution assembly 01, and one end of the plurality of temperature control fluid distribution assemblies 01 provided with the first vent 1211 is respectively embedded in the corresponding mounting groove. Optionally, the hole plate 12 can be embedded in the mounting groove, and the cover 11 can be fixed at the mounting plate 022 and correspondingly arranged with the mounting groove.

[0064] The groove bottom of each mounting groove can be provided with a plurality of first air holes 0221 and second air holes 0222, and the plurality of first air holes 0221 and second air holes 0222 are arranged along the circumference of the temperature control fluid distribution assembly 01 and are respectively arranged opposite and communicated with the first vent 1211 and the second vent 1221 of the temperature control fluid distribution assembly 01, so as to communicate the temperature control fluid distribution assembly 01 with the third flow channel M3 of the temperature control main body 02 through the plurality of first air holes 0221 and second air holes 0222.

[0065] In addition, in the two adjacent installation grooves, the first air hole 0221 of the former corresponds to the second air hole 0222 of the latter, so as to be adapted to the air inlet 1111 and the air outlet 1121 of the temperature control fluid distribution assembly 01. Reference Figure 10 And Figure 11 In some embodiments, the temperature control body 02 can be a medium cylinder 021, which has a cylinder wall, and a third flow channel M3 extending along the circumference of the medium cylinder 021 is arranged in the cylinder wall; the mounting plate 022 is arranged on the medium cylinder 021, and the first air hole 0221 and the second air hole 0222 respectively communicate with the third flow channel M3.

[0066] Based on the above arrangement, when the temperature control fluid distribution assembly 01 is installed to the medium cylinder 021, the mounting plate 022 can be used to bear the temperature control fluid distribution assembly 01, so as to ensure the stability of the temperature control fluid distribution assembly 01; and the cylinder opening of the medium cylinder 021 can be blocked by the mounting plate 022, and at the same time, the first air hole 0221 is used to communicate the first air port 1211 and the third flow channel M3, and the second air hole 0222 is used to communicate the second air port 1221 and the third flow channel M3, so as to prevent the mounting plate 022 from blocking the communication between the temperature control fluid distribution assembly 01 and the medium cylinder 021.

[0067] Exemplarily, the medium cylinder 021 can include a ceramic cylinder and a coil shielding cylinder, the ceramic cylinder is arranged in the coil shielding cylinder and is spaced apart to form the third flow channel M3.

[0068] Reference Figure 12 And Figure 13 In some embodiments, the temperature control body 02 can also be a medium window 023, which can be provided with a third flow channel M3, and the surface of the medium window 023 is provided with an inlet and an outlet respectively communicating with the third flow channel M3; the mounting plate 022 is arranged on the surface of the medium window 023, and the first air hole 0221 communicates with the inlet and the second air hole 0222 communicates with the outlet.

[0069] Based on the above setting, when the temperature control fluid distribution assembly 01 is installed to the medium window 023, the load bearing of the temperature control fluid distribution assembly 01 can be realized through the mounting plate 022 to ensure the stability of the temperature control fluid distribution assembly 01, and the first air hole 0221 can be used to communicate the first air vent 1211 and the inlet, the second air hole 0222 can be used to communicate the air outlet 1121 and the outlet, and the inlet and the outlet are respectively communicated with the third flow channel M3, so that the situation that the mounting plate 022 blocks the communication between the temperature control fluid distribution assembly 01 and the medium window 023 can be effectively prevented. The temperature control fluid is distributed by the temperature control fluid distribution assembly 01, which can uniform the flow before the temperature control fluid exchanges heat with the medium window 023, reduces the temperature difference of the medium window 023 at the inlet and outlet positions, and improves the uniformity of the temperature of the medium window 023.

[0070] It should be noted that the temperature control body 02 in the embodiments of the present application is not limited to the three-dimensional medium cylinder 021, but can also be a planar medium window 023.

[0071] The semiconductor process equipment disclosed in the embodiments of the present application comprises the temperature control fluid distribution assembly 01 and the process chamber, and the temperature control module 03. The temperature control module 03 is arranged in the temperature control fluid distribution assembly 01, used to deliver the temperature control fluid to the temperature control fluid distribution assembly 01, and deliver the temperature control fluid to the third flow channel M3 of the temperature control body 02 in the process chamber through the temperature control fluid distribution assembly 01.

[0072] Based on the above setting, the temperature control fluid can be generated by the temperature control module 03, the temperature control fluid enters the flow channel M of the temperature control fluid distribution assembly 01 through the air inlet 1111, and is delivered to the third flow channel M3 of the temperature control body 02 in the process chamber through the first air vent 1211. The temperature control fluid exchanges heat with the medium cylinder 021 in the third flow channel M3, and the heat-exchanged temperature control fluid flows back to the flow channel M through the third flow channel M3, and is finally discharged through the air outlet 1121. At this time, the temperature control fluid completes a cycle to realize the temperature adjustment and control of the temperature control body 02.

[0073] Exemplarily, the temperature control module 03 can comprise a heating wire, an air inlet flange, an air amplifier and the like. The heating wire is used to realize the heating function of the cold air, and the air amplifier uses the principle of fluid mechanics to realize the large-flow flow of the gas in the air duct under the condition of inputting compressed air. It should be noted that the specific structure of the temperature control module 03 and its working principle can also refer to related technologies.

[0074] In some embodiments, the semiconductor process equipment can further comprise a controller comprising a memory and a processor. The memory stores a computer program, and when the computer program is executed by the processor, the following temperature control method is realized: detecting the temperature of a local region of the temperature control body 02; In the case where the detected temperature is higher than the preset temperature value, low-temperature fluid, which can be cold air, is introduced into the third flow channel M3 of the temperature control body 02 through the temperature control fluid distribution assembly 01 by the temperature control module 03. Alternatively, in the case where the detected temperature is lower than the preset temperature value, high-temperature fluid, which can be hot air, is introduced into the third flow channel M3 of the temperature control body 02 through the temperature control fluid distribution assembly 01 by the temperature control module 03.

[0075] Based on the above method, the temperature of the temperature control body 02 can be adjusted and controlled to ensure that the temperature of the temperature control body 02 meets the process requirements.

[0076] Taking the medium cylinder 021 as an example, the temperature of the medium cylinder 021 needs to be ensured to achieve dynamic balance in cooling and heating. In the process, the heat source of the medium cylinder 021 can include two parts of radio frequency heating power and heating wire heating power, and the cooling source includes relay off time and air cooling power. Controlling the relay on-off time can control the mutual adjustment of the heating system and the cooling system to maintain the temperature of the medium cylinder 021 relatively stable.

[0077] In addition, an infrared temperature measurement sensor can be used to measure the temperature of the medium cylinder 021. When the feedback temperature (i.e., the detected temperature) is lower than the preset temperature value, the relay is turned on, and the resistance wire is heated. When the feedback detected temperature is higher than the preset temperature value, the relay is turned off, and cold air is introduced to achieve cooling, so as to achieve dynamic balance. When the temperature control is performed by using the temperature control method in the embodiment of the present application, double over-temperature protection is also used. When the CDA flow is less than 40 L / min, the relay is turned off to disconnect the machine heating power supply. When the heating wire temperature exceeds 200℃, the temperature limiter normally closed contact is disconnected to disconnect the machine heating power supply. The temperature control principle is as shown in Figure 15 .

[0078] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, which are only illustrative rather than limiting. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the protection scope of the claims.

Claims

1. A temperature-controlled fluid distribution assembly for a process chamber, characterized in that, The temperature-controlled fluid distribution assembly (01) is provided with an air inlet (1111), a first air vent (1211), a flow channel (M) and an air outlet (1121). The air inlet (1111) and the air outlet (1121) are respectively located at one end of the temperature-controlled fluid distribution assembly (01), and the first vent (1211) is located at the other end of the temperature-controlled fluid distribution assembly (01) for providing temperature-controlled fluid to the process chamber. Along the flow direction of the temperature-controlled fluid, the first vent (1211) is located between the air inlet (1111) and the air outlet (1121). The flow channel (M) extends circumferentially along the temperature-controlled fluid distribution assembly (01), and the air inlet (1111), air outlet (1121) and the first vent (1211) are respectively connected to the flow channel (M).

2. The temperature-controlled fluid distribution assembly according to claim 1, characterized in that, The flow channel (M) includes a first flow channel (M1) and a second flow channel (M2). The first flow channel (M1) and the second flow channel (M2) are arranged circumferentially along the temperature control fluid distribution assembly (01) and are respectively used to communicate with the process chamber. The air inlet (1111) and the first vent (1211) are respectively connected to the first flow channel (M1); The air outlet (1121) is connected to the second flow channel (M2).

3. The temperature-controlled fluid distribution assembly according to claim 2, characterized in that, The temperature-controlled fluid distribution assembly (01) is further provided with a second vent (1221), which is connected to the end of the second flow channel (M2) away from the air outlet (1121).

4. The temperature-controlled fluid distribution assembly according to claim 2 or 3, characterized in that, The temperature-controlled fluid distribution assembly (01) includes a housing (11) and an orifice plate (12). The air inlet (1111) and the air outlet (1121) are respectively located at one end of the cover (11), and the other end of the cover (11) is provided with an opening. The perforated plate (12) is located at the opening and forms the flow channel (M) with the cover (11). The first vent (1211) is located on the orifice plate (12).

5. The temperature-controlled fluid distribution assembly according to claim 4, characterized in that, The temperature-controlled fluid distribution assembly (01) includes at least two of the housings (11) and at least two of the orifice plates (12). At least two of the housings (11) are arranged end to end along the circumference of the temperature control fluid distribution assembly (01), and in two adjacent housings (11), the air inlet (1111) of one is used to communicate with the air outlet (1121) of the other through the flow channel (M) and the process chamber. At least two of the perforated plates (12) are provided at the openings of the corresponding housings (11).

6. The temperature-controlled fluid distribution assembly according to claim 4, characterized in that, The cover (11) includes an air inlet (111) and an air outlet (112), the perforated plate (12) includes an air inlet perforated plate (121) and an air outlet perforated plate (122), and the opening includes a first opening (1112) and a second opening (1122). The air intake component (111) has the air inlet (1111) and the first opening (1112), and the air inlet plate (121) is located at the first opening (1112) and forms the first flow channel (M1) with the air intake component (111). The air outlet (112) is provided with the air outlet (1121) and the second opening (1122), and the air outlet plate (122) is provided at the second opening (1122) and forms the second flow channel (M2) with the air outlet (112). The air inlet plate (121) is provided with a plurality of air vent groups (121a), each of the air vent groups (121a) includes a plurality of first air vents (1211), and the air outlet plate (122) is provided with a plurality of second air vents (1221).

7. The temperature-controlled fluid distribution assembly according to claim 6, characterized in that, The first opening (1112) extends circumferentially along the temperature control fluid distribution assembly (01), and the air inlet (1111) is disposed opposite to a local area of ​​the first opening (1112); The cross-sectional area of ​​the air inlet (1111) is larger than the cross-sectional area of ​​the local area of ​​the first opening (1112), and the air inlet (1111) and the local area of ​​the first opening (1112) are connected by a first arc surface (1113).

8. The temperature-controlled fluid distribution assembly according to claim 6, characterized in that, The air outlet (1121) is positioned opposite to the second opening (1122); The cross-sectional area of ​​the air outlet (1121) is larger than that of the second opening (1122), and the air outlet (1121) and the second opening (1122) are connected by a second arc surface (1123).

9. The temperature-controlled fluid distribution assembly according to claim 6, characterized in that, The sum of the cross-sectional areas of the first vents (1211) of the plurality of vent groups (121a) is less than or equal to the cross-sectional area of ​​the air inlet (1111).

10. A process chamber, characterized in that, include: Temperature control body (02) and mounting plate (022), wherein the mounting plate (022) is disposed on the temperature control body (02) and is used to carry the temperature control fluid distribution assembly (01) according to any one of claims 1 to 9; The temperature control body (02) is provided with a third flow channel (M3); The mounting plate (022) is provided with a first vent (0221) and a second vent (0222). The first vent (0221) is arranged opposite to the first vent (1211) of the temperature control fluid distribution assembly (01) and connects the first vent (1211) and the third flow channel (M3). The second vent (0222) is arranged opposite to the air outlet (1121) of the temperature control fluid distribution assembly (01) and connects the air outlet (1121) and the third flow channel (M3).

11. The process chamber according to claim 10, characterized in that, The mounting plate (022) facing the temperature control fluid distribution assembly (01) has a plurality of mounting grooves extending circumferentially along the temperature control fluid distribution assembly (01), and the ends of the plurality of temperature control fluid distribution assemblies (01) having the first vent (1211) are respectively embedded in the corresponding mounting grooves. Each of the mounting slots has a plurality of first air holes (0221) and second air holes (0222) at the bottom of the slot, and the plurality of first air holes (0221) and second air holes (0222) are arranged along the circumferential direction; In two adjacent mounting slots, the first air hole (0221) of the former is correspondingly provided with the second air hole (0222) of the latter.

12. The process chamber according to claim 10, characterized in that, The temperature control body (02) is a medium cylinder (021), the medium cylinder (021) has a cylinder wall, and the cylinder wall is provided with the third flow channel (M3) extending circumferentially along the medium cylinder (021). The mounting plate (022) is disposed on the medium cylinder (021), and the first air hole (0221) and the second air hole (0222) are respectively connected to the third flow channel (M3).

13. The process chamber according to claim 10, characterized in that, The temperature control body (02) is a medium window (023), the medium window (023) is provided with the third flow channel (M3), and the surface of the medium window (023) is provided with an inlet and an outlet respectively connected to the third flow channel (M3); The mounting plate (022) is disposed on the surface of the medium window (023), and the first air hole (0221) is connected to the inlet, and the second air hole (0222) is connected to the outlet.

14. A semiconductor process apparatus, comprising the temperature-controlled fluid distribution assembly (01) as described in claims 1 to 9, the process chamber as described in claims 10 to 13, and a temperature control module (03). The temperature control module (03) is located on the temperature control fluid distribution assembly (01) and is used to deliver temperature control fluid to the temperature control fluid distribution assembly (01) and deliver the temperature control fluid to the third flow channel (M3) of the temperature control body (02) in the process chamber through the temperature control fluid distribution assembly (01).

15. The semiconductor process equipment according to claim 14, characterized in that, It also includes a controller, which comprises a memory and a processor. The memory stores a computer program that, when executed by the processor, implements the following temperature control method: Detect the temperature of a local area of ​​the temperature control body (02); When the detected temperature is higher than the preset temperature value, the temperature control module (03) introduces low-temperature fluid into the third flow channel (M3) of the temperature control body (02) through the temperature control fluid distribution component (01); Alternatively, if the detected temperature is lower than the preset temperature value, high-temperature fluid is introduced into the third flow channel (M3) of the temperature control body (02) through the temperature control module (03) via the temperature control fluid distribution component (01).

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