Wafer centering, edge searching and positioning method and wafer centering, edge searching and positioning equipment

Abstract

The invention discloses a wafer centering, edge searching and positioning method and device. The method comprises the steps that a centering and positioning tool is driven to stretch through a parallel opening and closing type pneumatic claw; when it is detected that a wafer is placed on the suction cup, the parallel opening and closing type pneumatic claw drives the centering and positioning tool to contract, so that the outer edge of the wafer is attached to an arc step of the centering and positioning tool, the wafer and the suction cup are coaxially arranged, and wafer centering is achieved; the wafer is adsorbed through the suction cup; the centering and positioning tool is driven to stretch through the parallel opening and closing type pneumatic claw, so that the centering and positioning tool is far away from the wafer; driving the suction cup to rotate through a driving device so as to drive the wafer adsorbed on the suction cup to rotate; in the wafer rotation process, the mark position of the wafer is detected, and the mark of the wafer comprises a flat edge or a Notch groove; and according to the marked position, driving the sucker to rotate through a driving device so as to drive the wafer to rotate to a target position. According to the invention, adaptive high-precision positioning of wafers with different sizes can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer positioning, and in particular to a wafer centering and edge finding positioning method and a wafer centering and edge finding positioning device. BACKGROUND

[0002] In a semiconductor material processing process, wafer thinning is an important link for improving the efficiency of the final product and controlling the accuracy of the product. A positioning device is used to position the wafer before wafer thinning grinding. Specifically, the positioning device is used to place the wafer at the center position of a turntable to prevent the eccentricity of the wafer from reducing the uniformity of the thickness of the wafer after grinding and affecting the processing efficiency of the next process.

[0003] A wafer refers to a substrate for manufacturing a semiconductor integrated circuit. Since the wafer has a circular shape, it is called a wafer. The wafer is cut from a silicon ingot. In the manufacturing process of the silicon ingot, for an ingot of less than 8 inches, a flat edge will be cut. For an ingot of 8 inches, 12 inches or even larger, a V-shaped small opening will be processed to reduce waste, which is called a V-shaped groove or a Notch groove. The semiconductor industry generally determines the position of the wafer according to the flat edge or the Notch groove, and then performs edge finding operation. The edge finding operation is very important for subsequent chip manufacturing processes such as cutting, thinning and testing.

[0004] In the prior art, the wafer positioning function is generally achieved by clamping. This method cannot ensure the accuracy of wafer positioning and cannot achieve adaptive positioning of wafers of different sizes.

[0005] Therefore, there is a need for a wafer centering and edge finding positioning method to solve the problems in the above technical solutions. SUMMARY

[0006] To this end, the present application provides a wafer centering and edge finding positioning method and a wafer centering and edge finding positioning device to solve or at least alleviate the above problems.

[0007] According to an aspect of the present application, a wafer centering and edge finding positioning method is provided, which is performed in a wafer centering and edge finding positioning device. The wafer centering and edge finding positioning device comprises a chuck, a parallel opening and closing pneumatic gripper, a centering and positioning tool mounted on the parallel opening and closing pneumatic gripper, and a driving device connected to the chuck. The parallel opening and closing pneumatic gripper is adapted to drive the centering and positioning tool to extend and retract. The centering and positioning tool has a circular arc step matching the outer diameter of a wafer, and the circular arc step is located at the outer periphery of the chuck. The method comprises the following steps: driving the centering and positioning tool to extend away from the center of the chuck by the parallel opening and closing pneumatic gripper; when it is detected that a wafer is placed on the chuck, driving the centering and positioning tool to retract towards the center of the chuck by the parallel opening and closing pneumatic gripper, so that the outer edge of the wafer is in contact with the circular arc step of the centering and positioning tool, and the wafer is coaxially arranged with the chuck to achieve wafer centering; adsorbing the centered wafer by the chuck; driving the centering and positioning tool to extend away from the center of the chuck by the parallel opening and closing pneumatic gripper, so that the centering and positioning tool is away from the wafer; driving the chuck to rotate by the driving device, so as to drive the wafer adsorbed on the chuck to rotate; detecting the mark position of the wafer during the rotation of the wafer. The mark of the wafer includes a flat edge or a Notch groove. According to the mark position, the chuck is driven to rotate by the driving device, so as to drive the wafer to rotate to a target position.

[0008] Optionally, in the wafer centering and edge finding positioning method according to the present application, the step of driving the centering and positioning tool to extend away from the center of the chuck by the parallel opening and closing pneumatic gripper comprises the following steps: switching the air path by an electromagnetic valve, and controlling the parallel opening and closing pneumatic gripper to drive the centering and positioning tool to extend away from the center of the chuck. The step of driving the centering and positioning tool to retract towards the center of the chuck by the parallel opening and closing pneumatic gripper comprises the following steps: switching the air path by an electromagnetic valve, and controlling the parallel opening and closing pneumatic gripper to drive the centering and positioning tool to retract towards the center of the chuck.

[0009] Optionally, in the wafer centering and edge finding positioning method according to the present application, the parallel opening and closing pneumatic gripper comprises a middle base body, a first pneumatic gripper and a second pneumatic gripper mounted on both ends of the middle base body respectively. The centering and positioning tool comprises a first part and a second part which are symmetrical to each other. The first part and the second part are mounted on the first pneumatic gripper and the second pneumatic gripper respectively.

[0010] Optionally, in the wafer centering and edge finding positioning method according to the present application, the first pneumatic gripper and the second pneumatic gripper are adapted to extend outward or retract inward relative to the middle base body, so as to drive the first part and the second part of the centering and positioning tool to move away from each other or move close to each other, and achieve the extension or retraction of the centering and positioning tool.

[0011] Optionally, in the wafer centering positioning method according to the present application, the wafer centering positioning device further comprises a photoelectric sensor; when it is detected that the chuck is placed with a wafer, the parallel opening and closing type air claw drives the centering positioning tool to contract towards the direction of the chuck center, comprising: the photoelectric sensor detects whether the chuck is placed with a wafer, if the chuck is placed with a wafer, the parallel opening and closing type air claw drives the centering positioning tool to contract towards the direction of the chuck center; if the chuck is not placed with a wafer, the robot transports a wafer and places the wafer on the chuck.

[0012] Optionally, in the wafer centering positioning method according to the present application, the wafer is adsorbed by the chuck after centering, comprising: the vacuum air path below the chuck is opened to adsorb the wafer after centering by the chuck.

[0013] Optionally, in the wafer centering positioning method according to the present application, the wafer centering positioning device further comprises a detection switch; during the rotation of the wafer, the mark position of the wafer is detected, comprising: during the rotation of the wafer, when the mark of the wafer passes through the detection switch, the detection switch sends a signal to determine the mark position of the wafer.

[0014] Optionally, in the wafer centering positioning method according to the present application, the driving device comprises a servo motor and a main shaft, the servo motor is in transmission connection with the main shaft, and the chuck is installed on the main shaft; the chuck is driven to rotate by the driving device, comprising: the main shaft is driven to rotate by the servo motor, so as to drive the chuck to rotate via the main shaft.

[0015] Optionally, in the wafer centering positioning method according to the present application, the circular arc step comprises a step plane and a circular arc side surface perpendicular to the step plane, and the circular arc side surface is located at the outer periphery of the chuck; the parallel opening and closing type air claw drives the centering positioning tool to contract towards the direction of the chuck center, so that the outer edge of the wafer is fitted with the circular arc step of the centering positioning tool, comprising: the parallel opening and closing type air claw drives the centering positioning tool to contract towards the direction of the chuck center, so that the outer edge of the wafer is fitted with the circular arc side surface of the circular arc step of the centering positioning tool.

[0016] According to one aspect of the present application, a wafer centering and edge finding positioning device is provided, comprising: a chuck adapted to place a wafer and adapted to adsorb the wafer; a centering positioning tool having a circular arc step matching an outer diameter of the wafer, the circular arc step being located at an outer periphery of the chuck; a parallel opening and closing pneumatic gripper connected with the centering positioning tool, the parallel opening and closing pneumatic gripper being adapted to drive the centering positioning tool to extend and retract, wherein the parallel opening and closing pneumatic gripper is adapted to drive the centering positioning tool to extend away from a center of the chuck first, when the wafer is placed on the chuck, the parallel opening and closing pneumatic gripper is adapted to drive the centering positioning tool to retract towards the center of the chuck, so that an outer edge of the wafer is in contact with the circular arc step of the centering positioning tool, so that the wafer is coaxially arranged with the chuck, and the wafer is centered; after the wafer is adsorbed and centered on the chuck, the parallel opening and closing pneumatic gripper is adapted to drive the centering positioning tool to extend away from the center of the chuck, so that the centering positioning tool is away from the wafer; a driving device connected with the chuck, adapted to drive the chuck to rotate, so as to drive the wafer adsorbed on the chuck to rotate; a detection device adapted to detect a mark position of the wafer during rotation of the wafer, so as to drive the chuck to rotate by the driving device according to the mark position, so as to drive the wafer to rotate to a target position, wherein the mark of the wafer includes a flat edge or a Notch groove.

[0017] Optionally, in the wafer centering and edge finding positioning device according to the present application, the parallel opening and closing pneumatic gripper comprises an intermediate base body, a first pneumatic gripper and a second pneumatic gripper respectively mounted at two ends of the intermediate base body; the centering positioning tool comprises a first part and a second part which are symmetrical to each other, the first part and the second part are respectively mounted on the first pneumatic gripper and the second pneumatic gripper.

[0018] Optionally, in the wafer centering and edge finding positioning device according to the present application, the first pneumatic gripper and the second pneumatic gripper are adapted to extend outward or retract inward relative to the intermediate base body, so as to drive the first part and the second part of the centering positioning tool to move away from each other or move close to each other, so as to realize extension or retraction of the centering positioning tool.

[0019] Optionally, in the wafer centering and edge finding positioning device according to the present application, the detection device comprises a detection switch, when the mark of the wafer passes through the detection switch during rotation of the wafer, the detection switch is adapted to send a signal to determine the mark position of the wafer.

[0020] Optionally, in the wafer centering and edge searching positioning device according to the present application, the driving device comprises a spindle, the suction disc is mounted on the spindle, and a servo motor is in driving connection with the spindle and is adapted to drive the spindle to rotate so as to drive the suction disc to rotate via the spindle.

[0021] Optionally, in the wafer centering and edge searching positioning device according to the present application, the arc step comprises a step plane and an arc side surface perpendicular to the step plane, and the arc side surface is located at the outer periphery of the suction disc; the parallel opening and closing type air claw is adapted to drive the centering and positioning tool to contract towards the center of the suction disc so as to make the outer edge of the wafer fit the arc side surface of the arc step of the centering and positioning tool.

[0022] Optionally, in the wafer centering and edge searching positioning device according to the present application, further comprising a photoelectric sensor adapted to detect whether a wafer is placed on the suction disc.

[0023] According to the technical scheme of the present application, a wafer centering and edge searching positioning method and a wafer centering and edge searching positioning device are provided. First, the parallel opening and closing type air claw is used to drive the centering and positioning tool to stretch, and when it is detected that a wafer is placed on the suction disc, the parallel opening and closing type air claw is used to drive the centering and positioning tool to contract so as to make the outer edge of the wafer fit the arc step of the centering and positioning tool, thereby realizing wafer centering. Then, the suction disc is used to adsorb the centered wafer, and the parallel opening and closing type air claw is used to drive the centering and positioning tool to stretch, thereby completing the wafer centering and positioning process. Next, the driving device is used to drive the suction disc to rotate so as to drive the wafer to rotate synchronously, and the position of the mark (flat edge or Notch groove) of the wafer is detected during the rotation of the wafer. According to the position of the mark, the driving device is used to drive the suction disc to rotate so as to drive the wafer to rotate to a target position (the mark on the wafer rotates to a target mark position), thereby completing the edge searching and positioning process of the wafer. Based on this, adaptive high-precision positioning of wafers of different sizes can be realized, and all wafers are centered and the notch directions are kept consistent.

[0024] The above description is only a summary of the technical scheme of the present application. In order to more clearly understand the technical means of the present application, the present application can be implemented according to the content of the specification, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0025] To the accomplishment of the foregoing and related ends, certain illustrative aspects are described herein in connection with the following description and the annexed drawings. These aspects are indicative of various ways in which the principles disclosed herein can be practiced and all aspects and equivalents thereof are intended to be within the scope of the claimed subject matter. The above- and other advantages of the present disclosure, as defined solely by the claims, will become more fully apparent from the detailed description given herein below and the accompanying drawings, wherein like elements are referred to by like reference numerals. Such description is given for the sake of

[0026] Figure 1 Fig. 1 shows a structural schematic diagram of a wafer centering and edge finding positioning device 100 according to an embodiment of the present application;

[0027] Figure 2 Fig. 2 shows a schematic diagram of the cooperation structure between a centering positioning tool 120 and a parallel opening and closing type air gripper 110 according to an embodiment of the present application;

[0028] Figure 3 Fig. 3 shows a flow schematic diagram of a wafer centering and edge finding positioning method 300 according to an embodiment of the present application. DETAILED DESCRIPTION

[0029] Exemplary embodiments of the present disclosure will be described herein below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it is understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art.

[0030] In view of the problem that the wafer positioning manner in the prior art cannot adaptively position wafers of different sizes, the present application provides a wafer centering and edge finding positioning method, which can adaptively and accurately position wafers of different sizes.

[0031] The wafer centering and edge finding positioning method according to an embodiment of the present application can be executed in a wafer centering and edge finding positioning device. First, the wafer centering and edge finding positioning device of the present application is introduced below.

[0032] It should be noted that the wafer has a mark for determining the wafer position, and the mark of the wafer includes a flat edge or a notch groove. For wafers of different sizes, the mark for determining the wafer position is different. For example, the mark of a wafer of less than 8 inches (2 inches to 6 inches) is a flat edge; the mark of a wafer of 8 inches, 12 inches or more is a notch groove (i.e., a V-shaped groove).

[0033] Figure 1 Fig. 1 shows a structural schematic diagram of a wafer centering and edge finding positioning device 100 according to an embodiment of the present application;

[0034] As shown in the drawings, Figure 1 The wafer centering and edge positioning device 100 includes a circular chuck 150, a centering positioning tool 120, a parallel opening and closing pneumatic gripper 110, a driving device, and a detecting device.

[0035] The chuck 150 can place a wafer thereon, and the wafer can be adsorbed by the chuck 150. Specifically, the chuck 150 is provided with a vacuum air path below, and the chuck 150 can adsorb the wafer arranged thereon by opening the vacuum air path. In some embodiments of the present application, after the wafer is centered, the chuck 150 can adsorb the centered wafer by opening the vacuum air path.

[0036] The centering positioning tool 120 is mounted on the parallel opening and closing pneumatic gripper 110, and the centering positioning tool 120 is coaxially arranged with the chuck 150. The centering positioning tool 120 is provided with a circular arc step 123 matching the outer diameter of the wafer, and the circular arc step 123 is located at the outer periphery of the chuck 150.

[0037] The parallel opening and closing pneumatic gripper 110 is connected with the centering positioning tool 120, and the parallel opening and closing pneumatic gripper 110 can drive the centering positioning tool 120 to extend and retract (extend or contract). Specifically, the parallel opening and closing pneumatic gripper 110 can first drive the centering positioning tool 120 to extend away from the center of the chuck 150, and when the wafer is placed on the chuck 150, the parallel opening and closing pneumatic gripper 110 can drive the centering positioning tool 120 to contract towards the center of the chuck 150, so that the outer edge of the wafer is in contact with the circular arc step 123 of the centering positioning tool 120, so that the wafer is coaxially arranged with the chuck 150, thereby realizing wafer centering. After the wafer is centered, the chuck 150 can adsorb the centered wafer by opening the vacuum air path. After the chuck 150 adsorbs the centered wafer, the parallel opening and closing pneumatic gripper 110 can drive the centering positioning tool 120 to extend away from the center of the chuck 150, so that the centering positioning tool 120 is away from the wafer, thereby completing the wafer centering and positioning process.

[0038] The driving device is connected with the chuck 150, and can drive the chuck 150 to rotate, so as to drive the wafer adsorbed on the chuck 150 to rotate.

[0039] In the embodiments of the present application, after the wafer centering and positioning process is completed, the chuck 150 can be driven to rotate by the driving device, so as to drive the wafer adsorbed on the chuck 150 to rotate synchronously. During the rotation of the wafer, the detecting device can detect the mark position of the wafer, and then, according to the mark position, the chuck 150 can be driven to rotate by the driving device, so as to drive the wafer to rotate to a target position (i.e., to make the mark on the wafer rotate to a target mark position). Here, the mark of the wafer includes Flat or Notch groove.

[0040] In some embodiments, the detecting device comprises a detecting switch 160, which can send a signal when the mark of the wafer passes the detecting switch 160 during the rotation of the wafer, so as to determine the position of the mark of the wafer according to the position where the detecting switch 160 sends the signal.

[0041] Figure 2 A schematic diagram of the cooperation structure between the centering positioning tool 120 and the parallel opening-closing type air claw 110 is shown.

[0042] In some embodiments, as shown in Figure 1 and Figure 2 , the centering positioning tool 120 is installed on the parallel opening-closing type air claw 110 through the tool seat 125.

[0043] As shown in Figure 2 , the parallel opening-closing type air claw 110 comprises a middle base body 115, a first air claw 111 and a second air claw 112 respectively installed at both ends of the middle base body 115. The centering positioning tool 120 comprises a first part 121 and a second part 122 which are symmetrical to each other, and the first part 121 and the second part 122 of the centering positioning tool 120 can be respectively installed on the first air claw 111 and the second air claw 112 of the parallel opening-closing type air claw 110 through the tool seat 125.

[0044] The first air claw 111 and the second air claw 112 of the parallel opening-closing type air claw 110 can be extended outward or contracted inward relative to the middle base body 115, so as to drive the first part 121 and the second part 122 of the centering positioning tool 120 to move away from each other or move close to each other, thereby realizing the extension or contraction of the centering positioning tool 120.

[0045] In some embodiments, as shown in Figure 2 , the circular arc step 123 of the centering positioning tool 120 comprises a step plane and a circular arc side surface which is perpendicular to the step plane, and the circular arc side surface is located at the outer periphery of the suction disc 150. By driving the centering positioning tool 120 (the first part 121 and the second part 122) to contract in the direction close to the center of the suction disc 150 through the parallel opening-closing type air claw 110, the outer edge of the wafer can be made to fit the circular arc side surface of the circular arc step 123 of the centering positioning tool 120, so as to realize the centering of the wafer.

[0046] In some embodiments, as shown in Figure 1As shown, the driving device includes a servo motor 141 and a main shaft 145. The servo motor 141 is in driving connection with the main shaft 145, for example, the servo motor 141 can be in driving connection with the main shaft 145 through a belt wheel 142 and a synchronous belt 143. A chuck 150 is coaxially installed on the main shaft 145. That is, the servo motor 141 is connected with the chuck 150 via the main shaft 145, so as to drive the chuck 150 to rotate.

[0047] In some embodiments, as shown in Figure 1 As shown, the wafer centering and edge-finding positioning device 100 further includes a photoelectric sensor 170, which is used to detect whether a wafer is placed on the chuck 150. After the parallel opening and closing pneumatic chuck 110 drives the centering and positioning tool 120 to stretch away from the center of the chuck 150, it can be detected by the photoelectric sensor 170 whether a wafer is placed on the chuck 150. When it is detected that a wafer is placed on the chuck 150, the parallel opening and closing pneumatic chuck 110 can drive the centering and positioning tool 120 to contract towards the center of the chuck 150, so that the outer edge of the wafer is in contact with the arc step 123 of the centering and positioning tool 120, and the wafer is coaxially arranged with the chuck 150, thereby realizing wafer centering. If no wafer is detected on the chuck 150, the wafer needs to be transported by a robot and placed on the chuck 150, and then the parallel opening and closing pneumatic chuck 110 drives the centering and positioning tool 120 to contract towards the center of the chuck 150, so that the outer edge of the wafer is in contact with the arc step 123 of the centering and positioning tool 120.

[0048] In some embodiments, as shown in Figure 1 As shown, the wafer centering and edge-finding positioning device 100 further includes a bottom plate 190. The parallel opening and closing pneumatic chuck 110, the driving device (the servo motor 141 and the main shaft 145), the detection device (the detection switch 160), and the photoelectric sensor 170 can be installed on the bottom plate. The servo motor 141 can be installed on the bottom plate 190 through a motor base 149.

[0049] In some embodiments, as shown in Figure 1 As shown, the bottom plate 190 is provided with a first bracket 191 and a second bracket 192, and the detection switch 160 can be installed on the first bracket 191 through a switch bracket 161. The photoelectric sensor 170 can be installed on the second bracket 192. The main shaft 145 can be installed on the bottom plate through a shaft sleeve 146.

[0050] According to the wafer alignment and edge-finding positioning device 100 provided in this embodiment of the invention, the alignment and positioning fixture is first extended by a parallel opening and closing type air gripper. When a wafer is detected placed on the chuck, the alignment and positioning fixture is contracted by the parallel opening and closing type air gripper so that the outer edge of the wafer fits against the arc step of the alignment and positioning fixture, thereby achieving wafer alignment. Then, the aligned wafer is picked up by the chuck, and the alignment and positioning fixture is extended again by the parallel opening and closing type air gripper to complete the wafer alignment and positioning process. Next, the chuck is driven to rotate by a drive device to drive the wafer to rotate synchronously. During the wafer rotation, the position of the marking (flat edge or notch groove) on the wafer is detected. Based on the marking position, the chuck is driven to rotate by the drive device to drive the wafer to rotate to the target position (the marking on the wafer rotates to the target marking position), thereby completing the wafer edge-finding and positioning process. Based on this, adaptive high-precision positioning of wafers of different sizes can be achieved, so that all wafers are aligned and the notch direction is consistent.

[0051] Figure 3 A schematic flowchart of a wafer alignment edge-finding and positioning method 300 according to an embodiment of the present invention is shown. Method 300 can be executed in the aforementioned wafer alignment edge-finding and positioning device 100.

[0052] As described above, the wafer alignment and edge-finding positioning device 100 includes a circular chuck 150, a parallel-opening / closing gripper 110, an alignment positioning fixture 120 mounted on the parallel-opening / closing gripper 110, and a drive device connected to the chuck 150. The parallel-opening / closing gripper 110 can drive the alignment positioning fixture 120 to extend and retract. The alignment positioning fixture 120 is coaxially arranged with the chuck 150, and the alignment positioning fixture 120 has an arc-shaped step 123 that matches the outer diameter of the wafer. The arc-shaped step 123 is located on the outer periphery of the chuck 150.

[0053] like Figure 3 As shown, the wafer alignment and edge-finding positioning method 300 includes the following steps 310 to 370.

[0054] Step 310: The centering and positioning fixture 120 is extended away from the center of the suction cup 150 by the parallel opening and closing pneumatic gripper 110.

[0055] In some embodiments, in step 310, the parallel opening and closing type pneumatic gripper 110 can be controlled to extend the centering positioning fixture 120 away from the center of the suction cup 150 by switching the air path through the solenoid valve (the solenoid valve switching air path for controlling the extension of the parallel opening and closing type pneumatic gripper 110).

[0056] When it is detected that the wafer is placed on the chuck 150 (at this time, the chuck 150 does not suck the wafer by vacuum), the parallel opening and closing type air claw 110 drives the centering positioning tool 120 to contract (slowly move) in the direction of approaching the center of the chuck 150, so that the outer edge of the wafer is fitted with the arc step 123 of the centering positioning tool 120, in this case, the wafer and the chuck 150 can be coaxially arranged, so as to realize the centering of the wafer, and avoid the eccentricity problem of the wafer.

[0057] In some embodiments, the parallel opening and closing type air claw 110 drives the centering positioning tool 120 to contract in the direction of approaching the center of the chuck 150 can be controlled by switching the gas circuit of the electromagnetic valve (the electromagnetic valve switching gas circuit for controlling the contraction of the parallel opening and closing type air claw 110).

[0058] In some embodiments, the wafer centering and edge positioning device 100 further comprises a photoelectric sensor 170. In step 320, whether the wafer is placed on the chuck 150 can be detected by the photoelectric sensor 170, if the wafer is placed on the chuck 150, the parallel opening and closing type air claw 110 drives the centering positioning tool 120 to contract in the direction of approaching the center of the chuck 150, so that the outer edge of the wafer is fitted with the arc step 123 of the centering positioning tool 120, to realize the centering of the wafer. If the wafer is not placed on the chuck 150, the wafer can be transported by the mechanical hand and placed on the chuck 150, and then whether the wafer is placed on the chuck 150 can be detected by the photoelectric sensor 170, at this time, it can be detected that the wafer is placed on the chuck 150, and then the parallel opening and closing type air claw 110 drives the centering positioning tool 120 to contract in the direction of approaching the center of the chuck 150, so that the outer edge of the wafer is fitted with the arc step 123 of the centering positioning tool 120, to realize the centering of the wafer.

[0059] In some embodiments, as shown in FIG. 12, the arc step 123 of the centering positioning tool 120 comprises a step plane and an arc side surface perpendicular to the step plane, wherein the arc side surface is located at the outer periphery of the chuck 150. Figure 2 In step 320, the parallel opening and closing type air claw 110 drives the centering positioning tool 120 to contract in the direction of approaching the center of the chuck 150, so that the outer edge of the wafer is fitted with the arc side surface of the arc step 123 of the centering positioning tool 120, in this case, the wafer and the chuck 150 can be coaxially arranged (the wafer is located at the center position of the chuck 150), so as to realize the centering of the wafer.

[0060] In step 330, the wafer after centering is sucked by the chuck 150.

[0061] In some embodiments, the chuck 150 has a vacuum gas circuit below, in step 330, the vacuum gas circuit below the chuck 150 can be opened, so that the chuck 150 sucks the wafer after centering by vacuum.

[0062] Step 340: The parallel opening and closing type air gripper 110 drives the centering and positioning fixture 120 to extend away from the center of the suction cup 150, so that the centering and positioning fixture 120 is away from the wafer.

[0063] In some embodiments, in step 340, the parallel opening and closing type pneumatic gripper 110 can be controlled to extend the centering positioning fixture 120 away from the center of the suction cup 150 by switching the air path through the solenoid valve (the solenoid valve switching air path for controlling the extension of the parallel opening and closing type pneumatic gripper 110).

[0064] This completes the wafer alignment and positioning process.

[0065] Next, edge finding of the wafer is performed by executing the following steps 350-370.

[0066] Step 350: Drive the chuck 150 to rotate via the drive device, so as to rotate the wafer adsorbed on the chuck 150.

[0067] In some embodiments, such as Figure 1 As shown, the drive device includes a servo motor 141 and a spindle 145. The servo motor 141 is drive-connected to the spindle 145, for example, the servo motor 141 can be drive-connected to the spindle 145 via a pulley 142 and a synchronous belt 143. The suction cup 150 is mounted on the spindle 145 and is coaxial with the spindle 145. That is, the servo motor 141 is connected to the suction cup 150 via the spindle 145, thereby driving the suction cup 150 to rotate. Based on this, in step 350, the servo motor 141 can drive the spindle 145 to rotate, so as to drive the suction cup 150 to rotate via the spindle 145.

[0068] Step 360: During wafer rotation, detect the marking position on the wafer. The wafer markings include flat edges or notch grooves. Specifically, the marking position on the wafer can be detected by a detection device (detection switch 160).

[0069] In some embodiments, during wafer rotation, when the wafer mark passes the detection switch 160, the detection switch 160 can send a signal so as to determine the wafer mark position based on the position of the signal sent by the detection switch 160.

[0070] Step 370: Based on the marked position, drive the chuck 150 to rotate via the drive device, so as to rotate the wafer to the target position (correct position), that is, to rotate the mark on the wafer to the target mark position.

[0071] At this point, the edge finding positioning process of the wafer is completed. It should be noted that through the above edge finding positioning process, the direction of the notch (flat edge or Notch groove) of all wafers can be kept consistent, so as to facilitate the subsequent wafer thinning grinding operation.

[0072] In some embodiments, in step 370, the main shaft 145 can be driven to rotate by the servo motor 141, so as to drive the chuck 150 to rotate via the main shaft 145. It should be noted that the encoder of the servo motor 141 has high accuracy, and high-precision positioning can be achieved.

[0073] In some embodiments, the centering positioning tool 120 is installed on the parallel opening and closing type air claw 110 through the tool seat 125. As shown in Figure 2 The parallel opening and closing type air claw 110 includes a middle base body 115, a first air claw 111 and a second air claw 112 respectively installed at both ends of the middle base body 115. The centering positioning tool 120 includes a first part 121 and a second part 122 which are symmetrical to each other, and the first part 121 and the second part 122 of the centering positioning tool 120 can be respectively installed on the first air claw 111 and the second air claw 112 of the parallel opening and closing type air claw 110 through the tool seat 125.

[0074] The first air claw 111 and the second air claw 112 of the parallel opening and closing type air claw 110 can be extended outward or retracted inward relative to the middle base body 115, so as to drive the first part 121 and the second part 122 of the centering positioning tool 120 to move away from each other or move close to each other, thereby realizing the extension or retraction of the centering positioning tool 120.

[0075] In some embodiments, as shown in Figure 2 The arc step 123 of the centering positioning tool 120 includes a step plane and an arc side surface perpendicular to the step plane, and the arc side surface is located at the outer periphery of the chuck 150. By driving the centering positioning tool 120 (the first part 121 and the second part 122) to retract in the direction close to the center of the chuck 150 through the parallel opening and closing type air claw 110, the outer edge of the wafer can be made to fit the arc side surface of the arc step 123 of the centering positioning tool 120, so as to realize the centering of the wafer.

[0076] Therefore, according to the wafer centering and edge searching positioning method 300 provided by the embodiment of the present application, first, the parallel opening and closing type air claw drives the centering and positioning tool to stretch, when it is detected that the wafer is placed on the suction plate, the parallel opening and closing type air claw drives the centering and positioning tool to contract so that the outer edge of the wafer is attached to the arc step of the centering and positioning tool, and the wafer centering is realized. Then, the suction plate adsorbs the centered wafer, and the parallel opening and closing type air claw drives the centering and positioning tool to stretch, and the wafer centering and positioning process is completed. Next, the driving device drives the suction plate to rotate to drive the wafer to rotate synchronously, and the mark (flat edge or Notch groove) position of the wafer is detected during the wafer rotating process. According to the mark position, the driving device drives the suction plate to rotate to drive the wafer to rotate to the target position (the mark on the wafer rotates to the target mark position), and thus the wafer edge searching and positioning process is completed. Based on this, the self-adaptive high-precision positioning of wafers of different sizes can be realized, and all wafers are centered and the notch direction is consistent.

[0077] In addition, the embodiment of the present application also discloses that: B11, the device of B10, wherein the parallel opening and closing type air claw includes an intermediate base body, a first air claw and a second air claw respectively installed at both ends of the intermediate base body; the centering and positioning tool includes a first part and a second part which are mutually symmetrical, and the first part and the second part are respectively installed on the first air claw and the second air claw. B12, the device of B11, wherein the first air claw and the second air claw are adapted to stretch outwards or contract inwards relative to the intermediate base body, so as to drive the first part and the second part of the centering and positioning tool to move away from each other or move close to each other, and realize the stretching or contraction of the centering and positioning tool. B13, the device of any one of B10-B12, wherein the detection device includes a detection switch; during the wafer rotating process, when the mark of the wafer passes through the detection switch, the detection switch is adapted to send a signal to determine the mark position of the wafer. B14, the device of any one of B10-B13, wherein the driving device includes: a main shaft, the suction plate is installed on the main shaft; a servo motor is in transmission connection with the main shaft and is adapted to drive the main shaft to rotate, so as to drive the suction plate to rotate via the main shaft. B15, the device of any one of B10-B14, wherein the arc step includes a step plane and an arc side surface which is perpendicular to the step plane and is located at the outer periphery of the suction plate; the parallel opening and closing type air claw is adapted to drive the centering and positioning tool to contract in the direction close to the center of the suction plate, so that the outer edge of the wafer is attached to the arc side surface of the arc step of the centering and positioning tool. B16, the device of any one of B10-B15, further comprising: a photoelectric sensor adapted to detect whether the wafer is placed on the suction plate.

[0078] In the description of the present specification, the terms "connection", "fixed", and the like are to be broadly understood, unless otherwise explicitly specified and limited. In addition, the terms "front", "back", "upper", "lower", "inner", "outer", "top", "bottom", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or unit referred to must have a particular direction, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0079] In the description provided herein, a large number of specific details are explained. However, it can be understood that embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure the understanding of the present description.

[0080] Similarly, it is to be understood that, for the sake of brevity, the description of the exemplary embodiments of the present application hereinabove can sometimes refer to features in a single embodiment, figure, or description thereof only without intent to limit the scope thereof inasmuch as such singularized aspects of the application can be combined in one or more embodiments.

[0081] It will be appreciated by persons of ordinary skill in the art that the modules or units or components of the devices in the examples disclosed herein can be arranged in the devices as described in the examples, or alternatively can be located in one or more devices different from the devices in the examples.

[0082] It will be appreciated by persons of ordinary skill in the art that the modules in the devices in the examples can be adaptively changed and arranged in one or more devices different from the examples. The modules or units or components in the examples can be combined into one module or unit or component, and in addition can be divided into a plurality of sub-modules or sub-units or sub-components.

[0083] In addition, those skilled in the art can understand that although some of the examples described herein include certain features included in other examples but not others, the combination of features of different examples means within the scope of the present application and forms different examples.

[0084] As used herein, unless otherwise specified, the use of the ordinal adjectives "first", "second", "third", etc., merely to distinguish between two or more of the similar objects, and does not limit the number of those objects.

[0085] While the application has been described in terms of several embodiments, it will be apparent to those of ordinary skill in the art that many modifications, additions, substitutions, and the like can be made to the applications set forth herein without departing from the scope of the application as understood by the skilled artisan in light of the foregoing description. Moreover, it is to be understood that the phraseology and terminology employed herein are for the purpose of description and teaching without intent that the that the application be limited to such phraseology and terminology.

Claims

1. A wafer centering and edge finding positioning method, performed in a wafer centering and edge finding positioning device, the wafer centering and edge finding positioning device comprising a chuck, a parallel open-close air gripper, a centering and positioning tool mounted on the parallel open-close air gripper, a driving device connected with the chuck, the parallel open-close air gripper being adapted to drive the centering and positioning tool to extend or retract, the centering and positioning tool having a circular arc step matching with an outer diameter of a wafer, the circular arc step being located at an outer periphery of the chuck; the method comprising: driving the centering and positioning tool to extend away from a center of the chuck by the parallel open-close air gripper; when detecting that the wafer is placed on the chuck, driving the centering and positioning tool to retract towards the center of the chuck by the parallel open-close air gripper, so that an outer edge of the wafer is in contact with the circular arc step of the centering and positioning tool, so that the wafer is coaxially arranged with the chuck, and the wafer centering is achieved; sucking the centered wafer by the chuck; driving the centering and positioning tool to extend away from the center of the chuck by the parallel open-close air gripper, so that the centering and positioning tool is away from the wafer; driving the chuck to rotate by the driving device, so as to drive the wafer sucked on the chuck to rotate; detecting a mark position of the wafer during the rotation of the wafer, the mark of the wafer comprising a flat edge or a Notch slot; driving the chuck to rotate by the driving device according to the mark position, so as to drive the wafer to rotate to a target position.

2. The method of claim 1, wherein, driving the centering and positioning tool to extend away from the center of the chuck by the parallel open-close air gripper, comprising: controlling the parallel open-close air gripper to drive the centering and positioning tool to extend away from the center of the chuck by switching a gas circuit by an electromagnetic valve; driving the centering and positioning tool to retract towards the center of the chuck by the parallel open-close air gripper, comprising: controlling the parallel open-close air gripper to drive the centering and positioning tool to retract towards the center of the chuck by switching a gas circuit by an electromagnetic valve. 3.The method of claim 1 or 2, wherein: the parallel open-close air gripper comprises a middle base body, a first air gripper and a second air gripper mounted on two ends of the middle base body respectively; the centering and positioning tool comprises a first part and a second part which are symmetrical to each other, and the first part and the second part are mounted on the first air gripper and the second air gripper respectively. 4.The method of claim 3, wherein: the first air gripper and the second air gripper are adapted to extend outwards or retract inwards relative to the middle base body, so as to drive the first part and the second part of the centering and positioning tool to move away from each other or move close to each other, so as to achieve the extension or retraction of the centering and positioning tool.

5. The method of any one of claims 1-4, wherein, the wafer centering and edge finding positioning device further comprises a photoelectric sensor; when detecting that the wafer is placed on the chuck, driving the centering and positioning tool to retract towards the center of the chuck by the parallel open-close air gripper, comprising: detecting, by the photosensor, whether a wafer is placed on the chuck, and if the wafer is placed on the chuck, driving, by the parallel opening and closing pneumatic gripper, the centering positioning tool to contract toward the chuck center; if the wafer is not placed on the chuck, transporting, by the robot, the wafer and placing the wafer on the chuck.

6. The method of any one of claims 1-5, wherein, sucking, by the chuck, the centered wafer, comprising: opening the vacuum air path below the chuck to suck the centered wafer by the chuck.

7. The method of any one of claims 1-6, wherein, The wafer centering and edge finding positioning device further comprises a detection switch; during the wafer rotation, detecting the mark position of the wafer, comprising: during the wafer rotation, when the mark of the wafer passes through the detection switch, sending a signal by the detection switch to determine the mark position of the wafer.

8. The method of any one of claims 1-7, wherein, The driving device comprises a servo motor and a main shaft, the servo motor is in transmission connection with the main shaft, and the chuck is installed on the main shaft; driving, by the driving device, the chuck to rotate, comprising: driving, by the servo motor, the main shaft to rotate, so as to drive the chuck to rotate through the main shaft.

9. The method of any one of claims 1-8, wherein, The arc step comprises a step plane and an arc side surface perpendicular to the step plane, and the arc side surface is located at the outer periphery of the chuck; driving, by the parallel opening and closing pneumatic gripper, the centering positioning tool to contract toward the chuck center, so that the outer edge of the wafer is fitted with the arc step of the centering positioning tool, comprising: driving, by the parallel opening and closing pneumatic gripper, the centering positioning tool to contract toward the chuck center, so that the outer edge of the wafer is fitted with the arc side surface of the arc step of the centering positioning tool.

10. A wafer centering and edge finding positioning device, comprising: a chuck adapted to place a wafer and to suck the wafer; a centering positioning tool having an arc step matching the outer diameter of the wafer, the arc step being located at the outer periphery of the chuck; a parallel opening and closing pneumatic gripper connected with the centering positioning tool, the parallel opening and closing pneumatic gripper being adapted to drive the centering positioning tool to extend and contract, wherein the parallel opening and closing pneumatic gripper is first adapted to drive the centering positioning tool to extend away from the chuck center, when the wafer is placed on the chuck, the parallel opening and closing pneumatic gripper is adapted to drive the centering positioning tool to contract toward the chuck center, so that the outer edge of the wafer is fitted with the arc step of the centering positioning tool, so that the wafer is coaxially arranged with the chuck to realize the wafer centering; after the chuck sucks the centered wafer, the parallel opening and closing pneumatic gripper is adapted to drive the centering positioning tool to extend away from the chuck center, so that the centering positioning tool is away from the wafer; a driving device connected with the chuck and adapted to drive the chuck to rotate to drive the wafer sucked on the chuck to rotate; The detection device is adapted to detect the mark position of the wafer during the rotation of the wafer, so as to drive the chuck to rotate by the driving device according to the mark position, so as to drive the wafer to rotate to the target position, wherein the mark of the wafer comprises a flat edge or a Notch groove.

Images