High-power laser

Abstract

The invention discloses a high-power laser which comprises a shell, a light source assembly and a mainboard assembly, the light source assembly is arranged on one side of the shell and comprises a substrate, a chip mounting plate, a plurality of laser chips, electrodes and electrode connecting plates, the chip mounting plate is arranged on the substrate, and the plurality of laser chips are arranged on the substrate. The multiple laser chips are arranged on the side, away from the substrate, of the chip mounting plate, the multiple laser chips are electrically connected with the chip mounting plate, one end of the electrode is electrically connected with the electrode connecting plate, and the electrode connecting plate is arranged on the chip mounting plate; the mainboard assembly is arranged in the shell, and the electrode is electrically connected with the mainboard assembly. According to the invention, the power supply structure of the chip is changed, the wiring layout can be simplified, the shielding of the laser chip is reduced, and the optical power density is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, and more particularly to a high-power surface-emitting array laser. BACKGROUND

[0002] With the continuous miniaturization of electronic products, the requirements for semiconductor packaging technology are also increasing, and smaller packaging sizes and higher integration densities need to be achieved. In order to improve the performance of electronic devices and reduce power consumption, the packaging technology needs to support high-speed electrical signal transmission and have an effective heat dissipation mechanism.

[0003] A surface-emitting array laser is a kind of laser light source that integrates "hundreds of semiconductor laser chips" in a two-dimensional array form on a single (or a few) wafer, and is synchronously driven and output. By adjusting the number and layout of the chips and modules, the desired spot size and optical power density can be achieved. However, as the output power of the laser increases, the chip current density also increases, and the existing power supply method is prone to cause wiring congestion, light blocking and optical power density reduction. SUMMARY

[0004] The embodiment of the present application provides a high-power laser, which can simplify the wiring layout, reduce the shielding of the laser chip, and improve the optical power density.

[0005] The high-power laser provided by the present application adopts the following technical scheme:

[0006] A high-power laser includes a shell, a light source assembly, and a mainboard assembly. The light source assembly is arranged on one side of the shell. The light source assembly includes a substrate, a chip mounting plate, a plurality of laser chips, an electrode, and an electrode connecting plate. The chip mounting plate is arranged on the substrate. The plurality of laser chips are arranged on the side of the chip mounting plate away from the substrate, and the plurality of laser chips are electrically connected to the chip mounting plate. One end of the electrode is electrically connected to the electrode connecting plate, and the electrode connecting plate is arranged on the chip mounting plate. The mainboard assembly is arranged in the shell, and the electrode is electrically connected to the mainboard assembly.

[0007] In some technical solutions, the mainboard assembly is provided with a power connector and a first connecting head. The power connector is electrically connected to the first connecting head. The first connecting head is provided with a second connecting head at the end away from the mainboard assembly. The first connecting head and the second connecting head are in contact and can be conductive. The other end of the second connecting head is electrically connected to the electrode.

[0008] In some embodiments, the first connector is internally provided with an elastic member, when the second connector is inserted into the first connector, the second connector is in contact with the elastic member and is pressed against the elastic member, so as to ensure that the first connector and the second connector are well connected.

[0009] In some embodiments, the electrode is provided with an insulating layer on the periphery, the electrode penetrates through the substrate and is insulated from the substrate, and the end of the electrode away from the electrode connecting plate is threadedly connected with the second connector to complete conduction.

[0010] In some embodiments, the light source assembly is arranged in a two-dimensional array and is provided with multiple groups, each of the light source assembly is provided with at least two electrodes, and the first connector and the second connector are provided with multiple and are arranged one-to-one corresponding to the electrodes.

[0011] In some embodiments, the heat dissipation assembly further comprises a water cooling plate and a water cooling pipeline, the water cooling pipeline is used to be connected with an external refrigerating mechanism, the water cooling pipeline is arranged on the water cooling plate, the water cooling plate is arranged between the substrate and the shell, and the water cooling plate is arranged in close contact with the substrate to dissipate heat from the laser chip.

[0012] In some embodiments, the water cooling pipeline is provided with a total water inlet and a total water outlet, the total water inlet and the total water outlet are arranged at two ends of the water cooling pipeline respectively, and multiple branch water inlets and multiple branch water outlets are arranged at a middle position of the water cooling pipeline; each of the substrate is provided with a water passing pipeline, each of the water passing pipeline corresponds to one of the branch water inlets and one of the branch water outlets, and two end openings of the water passing pipeline are respectively in communication with the corresponding branch water inlets and branch water outlets.

[0013] In some embodiments, the multiple branch water inlets and the multiple branch water outlets are alternately arranged, and the multiple branch water inlets and the multiple branch water outlets are arranged in a two-dimensional array on the water cooling plate.

[0014] In some embodiments, a sealing ring is arranged at the two end openings of each of the water passing pipelines, a sealing groove is arranged at the outer edge of the branch water inlet and the branch water outlet, and the sealing ring is located in the sealing groove, so as to seal the water passing pipeline and the water cooling pipeline.

[0015] In some embodiments, the electrode is configured as a copper electrode, the substrate is configured as a copper substrate, and the chip mounting plate and the electrode connecting plate are both configured as a DPC ceramic plate.

[0016] From the above technical solutions, it can be seen that the embodiments of the present application have the following advantages:

[0017] The plurality of laser chips are electrically connected to the substrate through the chip mounting plate, the electrical connection of the laser chips and the mainboard assembly is realized through the design of the electrode and the electrode connecting plate, the power supply structure of the laser chips is moved from the laser chip surface to the back surface of the laser chip, and finally the positive and negative electrodes of the laser chips are respectively collected on the electrode connecting plate, and the positive and negative electrodes of the laser chips are conducted to the mainboard assembly through the electrode. When the external power supply is connected to the mainboard assembly, the electrode is in conductive connection with the mainboard assembly and the electrode connecting plate at the same time, and then the current is transmitted to the chip mounting plate through the electrode and the electrode connecting plate, so that the positive and negative electrodes of the laser chips are connected to make the laser chips work, thereby solving the power supply problem of the laser chips, simplifying the wiring layout, reducing the shielding of the laser chips, and improving the optical power density. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0019] Figure 1 The overall structure of a high-power laser disclosed in the embodiments of the present application is shown in the figure.

[0020] Figure 2 The structure of a high-power laser highlighting the light source assembly disclosed in the embodiments of the present application is shown in the figure.

[0021] Figure 3 The structure of a high-power laser highlighting the mainboard assembly, the first connecting head and the power connector disclosed in the embodiments of the present application is shown in the figure.

[0022] Figure 4 The structure of a high-power laser highlighting the heat dissipation assembly disclosed in the embodiments of the present application is shown in the figure.

[0023] Explanation of reference signs:

[0024] 1, housing; 2, light source assembly; 201, electrode; 202, electrode connecting plate; 203, chip mounting plate; 204, laser chip; 205, substrate; 206, insulating layer; 207, sealing ring; 208, water pipeline; 209, second connecting head; 3, mainboard assembly; 301, integrated circuit board; 302, first connecting head; 303, power connector; 304, elastic member; 4, heat dissipation assembly; 401, total water inlet; 402, total water outlet; 403, water cooling pipeline; 404, water cooling plate; 405, connector via hole; 406, sealing groove. DETAILED DESCRIPTION

[0025] The present application will be further described in detail below with reference to the drawings.

[0026] The embodiment of the present application provides a high-power laser, which can simplify wiring layout, reduce shielding of a laser chip and improve optical power density.

[0027] In order to enable persons skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by persons skilled in the art without creative work should belong to the protection scope of the present application. In addition, the technical solutions in each embodiment can be combined with each other, but it should be based on that the combination of the technical solutions can be realized by persons skilled in the art, and when the combination of the technical solutions appears contradictory or cannot be realized, it should be considered that the combination of the technical solutions does not exist, and is not within the protection scope of the present application.

[0028] The terms "first", "second", "third", "fourth" and the like in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily indicate a specific order or a chronological sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to the process, method, product or device.

[0029] Please refer to Figure 1 For one embodiment of the high-power laser in the embodiments of the present application, the laser comprises a shell 1, a light source assembly 2, a mainboard assembly 3 and a heat dissipation assembly 4, the mainboard assembly 3 is arranged in the shell 1, the shell 1 is used for protecting internal devices, the light source assembly 2 is arranged on one side of the shell 1, the light source assembly 2 is provided in multiple groups, and the multiple groups of light source assemblies 2 are integrated in a two-dimensional array form, and the heat dissipation assembly 4 is arranged between the shell 1 and the light source assembly 2, and the heat dissipation assembly 4 is used for heat dissipation treatment on the light source assembly 2.

[0030] Specifically, please refer to Figure 1 and Figure 2The light source assembly 2 comprises a substrate 205, a chip mounting plate 203, a plurality of laser chips 204, an electrode 201 and an electrode connecting plate 202. The chip mounting plate 203 is horizontally arranged on the substrate 205. The plurality of laser chips 204 are arranged on a side of the chip mounting plate 203 away from the substrate 205, and the plurality of laser chips 204 are electrically connected with the chip mounting plate 203. The electrode 201 is arranged on the chip mounting plate 203 and is vertically arranged. One end of the electrode 201 is electrically connected with the electrode connecting plate 202, and the other end of the electrode 201 is electrically connected with the mainboard assembly 3.

[0031] It can be understood that the plurality of laser chips 204 are electrically connected with the substrate 205 through the chip mounting plate 203. The electrical connection between the laser chips 204 and the mainboard assembly 3 is realized through the design of the electrode 201 and the electrode connecting plate 202. The power supply structure of the laser chips 204 is moved from the front surface of the laser chips 204 to the back surface of the laser chips 204. Finally, the positive and negative electrodes of the laser chips 204 are respectively collected on the electrode connecting plate 202. The positive and negative electrodes of the laser chips 204 are conducted to the mainboard assembly 3 through the electrode 201. When the external power supply is connected with the mainboard assembly 3, the electrode 201 is simultaneously conducted with the mainboard assembly 3 and the electrode connecting plate 202. Then, the current is transmitted to the chip mounting plate 203 through the electrode 201 and the electrode connecting plate 202. Thus, the positive and negative electrodes of the laser chips 204 are connected, so that the laser chips 204 work. The power supply problem of the laser chips 204 is solved. Meanwhile, the wiring layout can be simplified, the shielding of the laser chips 204 is reduced, and the optical power density is improved.

[0032] In the embodiment, the electrode 201 is configured as a copper electrode, the substrate 205 is configured as a copper substrate, and the chip mounting plate 203 and the electrode connecting plate 202 are both configured as DPC ceramic plates. The laser chip 204 is packaged on the substrate 205 through the chip mounting plate 203, the electrode 201 is provided with an insulating layer 206 on the periphery, the electrode 201 penetrates the substrate 205 and is insulated from the substrate 205, the insulating layer 206 is preferably plastic, and the insulation from the substrate 205 is achieved by plastic packaging on the periphery of the electrode 201 to prevent short circuit. It can be understood that the resistivity of the copper electrode is low, easy to process and weld, and allows a small cross-sectional area to pass a large current. The copper substrate can quickly take away the heat generated by the laser chip 204 as a "uniform temperature plate", and the difference in expansion coefficient between the copper substrate and the DPC ceramic plate is small, reducing thermal stress. The electrode 201, the electrode connecting plate 202 and the chip mounting plate 203 are all directly fused by metallized via or solder, forming a continuous low-resistance conductive path of "copper-ceramic-copper", realizing parallel power supply of large current to multiple laser chips 204, and meeting the power supply needs of high-power lasers in four dimensions of "low resistance, low thermal resistance, high insulation and high reliability". Secondly, the heat generated by the laser chip 204 is quickly diffused horizontally through the DPC ceramic plate, and then vertically transmitted to the copper substrate through the high-thermal-conductivity insulating layer 206 of the DPC ceramic plate, and finally taken away by the heat dissipation component 4 on the back of the copper substrate; the current path and the heat dissipation path in the application coincide in space, forming a thermal-electricity synergistic effect, and the ceramic layer is effectively isolated to avoid short circuit.

[0033] Each power supply component is provided with two groups of electrodes 201 and electrode connecting plates 202, and the electrodes 201 and the electrode connecting plates 202 are one-to-one correspondingly arranged. The two groups of electrodes 201 are arranged at the edge positions of the chip mounting plate 203, forming double-channel power supply, and the left-right symmetrical power supply reduces the transverse voltage of the laser chip 204 array, and the current density is more uniform, avoiding the "edge overcurrent" phenomenon caused by single-end power supply. On the other hand, the thermal expansion stress is offset, and the warping amount of the chip mounting plate 203 is reduced by more than 30%. Secondly, when any channel fails due to solder fatigue or corrosion, the other channel can still carry all the current, and the system will not immediately crash, improving the reliability.

[0034] Please refer to Figure 1 and Figure 3The mainboard assembly 3 comprises an integrated circuit board 301, a power connector 303 and a first connecting head 302. The power connector 303 is used for connecting with an external power supply. The first connecting head 302 is connected with the power connector 303 through a surface pad of the integrated circuit board 301 and internal wiring. The power connector 303 is electrically connected with the first connecting head 302. An end of the first connecting head 302 away from the mainboard assembly 3 is provided with a second connecting head 209. The first connecting head 302 and the second connecting head 209 are in contact and can be conductive. The other end of the second connecting head 209 is electrically connected with the electrode 201, so as to conduct the positive and negative electrodes of the laser chip 204 on the front surface of the substrate 205 to the second connecting head 209 on the back surface. Thus, the positive and negative electrodes of the laser chip 204 are conducted to the power connector 303, and then the external power supply can be connected through the power connector 303 to supply power to the laser chip 204.

[0035] In the embodiment of the present application, the first connecting head 302 and the second connecting head 209 are provided in plurality and correspond to the electrode 201 one by one. The first connecting head 302 is a female connecting head, and the second connecting head 209 is a male connecting head. The female connecting head is a standard part and is fixed on the integrated circuit board 301 by a patch. The communication between the electrode 201 and the integrated circuit board 301 is realized by plug-in connection of the first connecting head 302 and the second connecting head 209. The mainboard assembly 3 and the light source assembly 2 are connected by the male and female connecting heads. Compared with the traditional power supply mode using wires, the light source assembly 2 is easier to assemble and disassemble, the problem of wire sequence error is avoided, the assembly difficulty of the light source assembly 2 is reduced, and the maintainability is improved.

[0036] Please refer to Figure 3 Further, the tail of the electrode 201 is a threaded structure. The end of the electrode 201 away from the electrode connecting plate 202 is threadedly connected with the second connecting head 209 to complete the conduction. The first connecting head 302 is internally provided with an elastic member 304. The elastic member 304 is preferably a crown spring. When the second connecting head 209 is plugged into the first connecting head 302, the second connecting head 209 is in contact with and pressed against the elastic member 304, so as to ensure that the first connecting head 302 and the second connecting head 209 are well connected. It can be understood that the crown spring forms multi-line contact with the first connecting head 302 in the circumferential direction. After the second connecting head 209 is plugged in, the second connecting head 209 generates 360° uniform radial elastic force with the crown spring. Even if there is manufacturing tolerance or thermal expansion and contraction of the second connecting head 209, the first connecting head 302 and the second connecting head 209 can always maintain electrical connection throughout the service life of the laser, so as to avoid power drift or instantaneous failure of the laser due to loose contact points.

[0037] Please refer to Figure 1 and Figure 4The heat dissipation assembly 4 comprises a water cooling plate 404 and a water cooling pipeline 403. The water cooling pipeline 403 is used to be connected with an external refrigerating mechanism. The water cooling pipeline 403 is arranged on the water cooling plate 404. The water cooling plate 404 is arranged between the substrate 205 and the shell 1. The water cooling plate 404 is arranged in close contact with the substrate 205 to dissipate heat for the laser chip 204. The water cooling plate 404 is provided with a connector via hole 405 for avoiding the second connecting head 209. The second connecting head 209 is arranged to pass through the connector via hole 405 and is electrically connected with the first connecting head 302. The liquid cooling heat dissipation directly cools the light source module. The copper substrate and the water cooling plate 404 are matched with each other. The distance from the heat exchange surface to the heat source is greatly reduced. Compared with the traditional way of separating the light source from the water cooling block, the heat conduction path is reduced, and the heat dissipation efficiency is improved.

[0038] Please refer to Figure 4 Specifically, the water cooling pipeline 403 is provided with a total water inlet 401 and a total water outlet 402. The total water inlet 401 and the total water outlet 402 are arranged at two end portions of the water cooling pipeline 403. A plurality of branch water inlets and a plurality of branch water outlets are arranged at a middle portion of the water cooling pipeline 403. Each substrate 205 is provided with a water passing pipeline 208. Each water passing pipeline 208 corresponds to a branch water inlet and a branch water outlet. The two end openings of the water passing pipeline 208 are respectively communicated with the corresponding branch water inlet and branch water outlet.

[0039] It can be understood that the refrigerating mechanism adjusts the flow or the water temperature in real time according to the temperature of the total water outlet 402. The total water inlet 401 maintains a constant low temperature. The refrigerating liquid enters the water cooling pipeline 403 from the refrigerating mechanism through the total water inlet 401. The refrigerating liquid flows through the water cooling pipeline 403 and simultaneously branches into a plurality of branch water inlets, and then enters the water passing pipeline 208 in each substrate 205, to absorb the heat of the substrate 205 and the laser chip 204. After the cooling liquid enters the water passing pipeline 208, the cooling liquid flows along the internal serpentine or straight flow channel of the substrate 205, and performs forced convection heat exchange with the wall surface of the substrate 205. Due to the high thermal conductivity of the copper substrate, the heat generated by the laser chip 204 can be rapidly spread laterally to the flow channel wall and carried away by the cooling liquid. The cooling liquid after being heated flows out from each branch water outlet, converges to the water cooling pipeline 403, and then flows to the refrigerating mechanism through the total water outlet 402, to complete the closed cycle. The water passing pipeline 208 in each substrate 205 can accurately dissipate heat for the corresponding light source assembly 2. The combination of the two-stage total pipe of the total water inlet and the total water outlet and the parallel connection of the branch water inlets and the branch water outlets enables each substrate 205 to obtain an independent, isothermal and low-resistance cooling path, so that uniform, efficient and low-energy water cooling heat dissipation is realized in the high-power laser array. At the same time, since all the water passing pipelines 208 are connected in parallel at the middle section of the total pipeline, the flow of each water passing pipeline 208 is only determined by the pressure difference of the corresponding branch water inlet or branch water outlet, and does not interfere with each other, to realize parallel heat dissipation.

[0040] Further, the plurality of water inlet ports and the plurality of water outlet ports are arranged alternately, and the plurality of water inlet ports and the plurality of water outlet ports are arranged in a two-dimensional array on the water-cooled plate 404. The two ends of each water passing pipeline 208 are provided with a sealing ring 207, and the outer edges of the water inlet ports and the water outlet ports are provided with a sealing groove 406 for sealing between the water passing pipeline 208 and the water-cooled pipeline 403. The sealing ring 207 is located in the sealing groove 406 to form a double seal of the end face and the radial direction, thereby improving the sealing effect and preventing water leakage from affecting other devices.

[0041] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not limit the same; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A high power laser, characterized by, The utility model relates to a kind of laser light source module, including: Shell (1); Light source assembly (2) is arranged in the shell (1) side, the light source assembly (2) includes substrate (205), chip mounting plate (203), multiple laser chips (204), electrode (201) and electrode connecting plate (202), the chip mounting plate (203) is arranged in the substrate (205), multiple the laser chips (204) are arranged in the side of the chip mounting plate (203) away from the substrate (205), and multiple the laser chips (204) are electrically connected with the chip mounting plate (203), one end of the electrode (201) is electrically connected with the electrode connecting plate (202), and the electrode connecting plate (202) is arranged in the chip mounting plate (203); Mainboard assembly (3) is arranged in the shell (1), and the electrode (201) is electrically connected with the mainboard assembly (3).

2. The high power laser of claim 1, wherein, The mainboard assembly (3) is provided with power connector (303) and first connecting head (302), and the power connector (303) is electrically connected with the first connecting head (302), one end of the first connecting head (302) away from the mainboard assembly (3) is provided with second connecting head (209), the first connecting head (302) and the second connecting head (209) are in contact and can be conducted, and the other end of the second connecting head (209) is electrically connected with the electrode (201).

3. The high power laser of claim 2, wherein, The first connecting head (302) is provided with elastic member (304) inside, when the second connecting head (209) is inserted in the first connecting head (302), the second connecting head (209) is contacted with the elastic member (304) and is pressed, to ensure that the first connecting head (302) and the second connecting head (209) are well connected.

4. The high power laser of claim 2, wherein, The electrode (201) is provided with insulating layer (206) on the side, the electrode (201) is threaded through the substrate (205) and is insulated with the substrate (205), and one end of the electrode (201) away from the electrode connecting plate (202) is threadedly connected with the second connecting head (209) to complete conduction.

5. The high power laser of claim 2, wherein, The light source assembly (2) is arranged in two-dimensional array with multiple groups, each light source assembly (2) is provided with at least two electrodes (201), and the first connecting head (302) and the second connecting head (209) are provided with multiple and are one-to-one corresponding with the electrode (201).

6. The high power laser of claim 1, wherein, Further including heat dissipation assembly (4), the heat dissipation assembly (4) includes water cooling plate (404) and water cooling pipeline (403), the water cooling pipeline (403) is used to be connected with external refrigerating mechanism, the water cooling pipeline (403) is arranged in the water cooling plate (404), the water cooling plate (404) is arranged between the substrate (205) and the shell (1), and the water cooling plate (404) is arranged in close contact with the substrate (205) to dissipate heat for the laser chip (204).

7. The high power laser of claim 6, wherein, The water cooling pipeline (403) is provided with a total water inlet (401) and a total water outlet (402), the total water inlet (401) and the total water outlet (402) are respectively arranged at both ends of the water cooling pipeline (403), and a plurality of branch water inlets and a plurality of branch water outlets are arranged at the middle position of the water cooling pipeline (403); Each of the substrates (205) is provided with a water passing pipeline (208), each of the water passing pipelines (208) corresponds to one of the branch water inlets and one of the branch water outlets, and the two ends of the water passing pipeline (208) are respectively communicated with the corresponding branch water inlet and branch water outlet.

8. The high power laser of claim 7, wherein, The plurality of branch water inlets and the plurality of branch water outlets are alternately arranged, and the plurality of branch water inlets and the plurality of branch water outlets are arranged in a two-dimensional array on the water cooling plate (404).

9. The high power laser of claim 7, wherein, Sealing rings (207) are arranged at the two ends of each of the water passing pipelines (208), sealing grooves (406) are arranged at the outer edges of the branch water inlets and the branch water outlets, and the sealing rings (207) are located in the sealing grooves (406) to seal the water passing pipelines (208) and the water cooling pipeline (403).

10. The high power laser of claim 1, wherein, The electrode (201) is configured as a copper electrode, the substrate (205) is configured as a copper substrate, and the chip mounting plate (203) and the electrode connecting plate (202) are both configured as DPC ceramic plates.

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