Circuit board assembly and electronic equipment

Abstract

The invention provides a circuit board assembly and electronic equipment, relates to the technical field of electronic products, and enables the circuit board assembly to be installed on the electronic equipment more stably and detached from the electronic equipment more conveniently. The circuit board assembly is provided, the circuit board assembly comprises a circuit board, a first group of electronic components and a support, the circuit board comprises a first surface, and the first group of electronic components are arranged on the first surface. The support is connected to the circuit board and comprises a first support part, the first support part is located on the side facing the first surface and covers a part of the first surface, and at least the part, back to the first surface, of the first support part is of an elastic soft structure.

Description

[0001] This application is based on the parent application with the application number 202310801833.7, the application date of June 30, 2023, and the invention name of "a circuit board assembly and electronic device". The entire content of the original application is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic products, in particular to a circuit board assembly and electronic device. BACKGROUND

[0003] With the development of the information age, users have more diverse demands for the functions of electronic devices and higher requirements for performance. Therefore, in order to meet the above demands, more circuit board assemblies are provided in electronic devices to realize various functions of electronic devices. However, in order to improve the user experience, the thinning of the whole machine is also the direction that electronic devices continue to pursue. In the limited space, how to better arrange the devices, optimize the structure layout, improve the performance, and also ensure the reliability of the whole machine and the convenience of disassembling the circuit board assembly during the later maintenance and disassembly, which poses an important challenge to the structure design of the whole machine. SUMMARY

[0004] The present application provides a circuit board assembly and electronic device, which makes the circuit board assembly more stable and convenient to disassemble.

[0005] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, a circuit board assembly is provided, which includes a circuit board, a first group of electronic components, and a support. The circuit board includes a first surface, and the first group of electronic components is disposed on the first surface. The support is connected to the circuit board, and the support includes a first support portion. The first support portion is located on the side facing the first surface, and the direction perpendicular to the first surface is the first direction. At least part of the first support portion in the first direction is a flexible soft structure.

[0007] Different from being bonded to other structural members only through the side or surface of the circuit board, the circuit board assembly is connected to other structural members by means of the bracket. On the one hand, compared with being connected to other structural members through the side of the circuit board, the bracket can provide a larger connection area for the connection of the circuit board assembly, thereby connecting the circuit board assembly more stably and reliably to other structural members. On the other hand, when the circuit board assembly is disassembled, an external force for disassembly can be directly applied to the bracket to disassemble the circuit board from other structural members, avoiding damage to the circuit board assembly caused by directly applying force to the circuit board assembly, and improving the stability of the use of the circuit board assembly. Further, after the circuit board is installed, the bracket further extrudes the circuit board between the two opposite structural members through the elastic soft structure, and then the circuit board forms an interference fit between the elastic soft structure and other structural members, so that the connection of the circuit board assembly is more stable, and the stability and reliability of the circuit board assembly after installation are further improved.

[0008] In a possible implementation manner of the first aspect, the first bracket portion includes a substrate portion and an elastic glue material, the substrate portion includes a second surface and a fourth surface opposite to each other, and the second surface faces the first surface. The elastic glue material is arranged on the fourth surface, and the elastic glue material forms an elastic soft structure. The elastic soft structure formed by the elastic glue material can have multiple functions. First, the circuit board assembly can be bonded to other structural members through the elastic glue material. Second, the elastic glue material is located between the substrate portion and other structural members, so that the circuit board assembly and other structural members form an interference fit, thereby improving the stability and reliability of the installation of the circuit board assembly. Third, when the circuit board assembly collides, the elastic glue material has a certain buffering effect, thereby protecting the circuit board assembly and avoiding damage to the circuit board assembly in the collision, and further improving the satisfaction of users.

[0009] In a possible implementation manner of the first aspect, the height of the elastic glue material protruding from the fourth surface is greater than or equal to 0.05 mm. In this way, the second bracket portion limits the side of the circuit board facing the first side.

[0010] In a possible implementation manner of the first aspect, the circuit board further includes a first side surface connected to the first surface, and the bracket further includes a second bracket portion, the second bracket portion is located on the side facing the first side surface, and the second bracket portion is arranged on the second surface.

[0011] In this way, the second support part limits the side of the circuit board facing the first side. Specifically, the first support part limits the circuit board in the thickness direction, and the second support part limits the circuit board in the width direction. Further, the assembly error between the support and the circuit board is reduced in the width direction of the circuit board, and the assembly accuracy of the support and the circuit board is improved. Further, the stability and reliability of the circuit board assembly installed in the electronic device are improved.

[0012] In a possible implementation of the first aspect, the circuit board further includes a third side opposite to the first side, and a fourth side and a fifth side, and the distance between the first side and the third side is less than the distance between the fourth side and the third side.

[0013] In this way, the side of the bottom wall of the first avoiding gap facing the second support part, and the bottom of the side wall of the first avoiding gap facing the second support part. When the support is installed on the circuit board, the positioning of the support can be realized through the cooperation of the second support part and the first avoiding gap. After the support is installed on the circuit board, the circuit board can be limited through the bottom wall and the side wall of the first avoiding gap, thereby ensuring the stability and reliability of the circuit board assembly. Moreover, the second support part is accommodated in the first avoiding gap, which further ensures the flatness of the overall appearance of the circuit board assembly after the support is fixed on the circuit board, thereby facilitating the convenience and accuracy of the installation of the circuit board assembly in the electronic device.

[0014] In a possible implementation of the first aspect, the circuit board further includes a second side connected to the first surface, and the second side is also connected to the first side. The support further includes a third support part, the third support part is located on the side facing the second side, and the third support part is arranged on the second surface.

[0015] In this way, the first support part limits the circuit board in the thickness direction, the second support part limits the circuit board in the width direction, and the third support part limits the circuit board in the length direction. Therefore, the support limits the circuit board in three directions, thereby reducing the assembly error between the support and the circuit board, and improving the assembly accuracy of the support and the circuit board. Further, the stability and reliability of the circuit board assembly installed in the electronic device are improved.

[0016] In a possible implementation of the first aspect, the circuit board is provided with a first positioning part, and the second surface is provided with a second positioning part matched with the first positioning part. The assembly accuracy of the support and the circuit board is improved through the cooperation of the first positioning part and the second positioning part, thereby reducing the assembly error between the support and the circuit board, further improving the stability and reliability of the connection between the support and the circuit board, and improving the assembly accuracy of the circuit board assembly and the electronic device.

[0017] In a possible implementation manner of the first aspect, the first positioning part is a notch, and the notch penetrates through the third side face; and the second positioning part is a protrusion matched with the notch. In this way, when the support is assembled with the circuit board, the protrusion is aligned with the notch in the width direction of the circuit board assembly, and then the protrusion is pushed into the notch to accommodate the protrusion in the notch, thereby realizing the positioning of the support and the circuit board, improving the accuracy of bonding of the support and the circuit board, thereby reducing the assembly error between the support and the circuit board, further improving the stability and reliability of the connection of the support and the circuit board, and improving the assembly accuracy of the circuit board assembly and the electronic device.

[0018] In a possible implementation manner of the first aspect, the arrangement direction of the first side face and the third side face is the second direction, and in the second direction, the support includes a seventh side face and an eighth side face opposite to each other, the seventh side face is located on one side of the fourth side face away from the third side face, and the eighth side face is located on one side of the fourth side face away from the seventh side face. In this way, after the circuit board assembly is installed in the accommodating groove, the back cover of the electronic device is installed on the frame, the circuit board assembly is located between the bottom wall of the accommodating groove and the back cover, and the circuit board assembly directly contacts the back cover through the support, thereby realizing the fixation of the circuit board assembly in the second direction. Further, the back cover can form an interference fit relationship with the circuit board assembly to press the circuit board assembly in the accommodating groove, thereby further improving the stability and reliability of the installation of the circuit board assembly in the accommodating groove.

[0019] In a possible implementation manner of the first aspect, the eighth side face is located between the third side face and the fourth side face. In this way, after the circuit board assembly is installed in the accommodating groove, the circuit board assembly directly contacts other structural members through the third side face. The circuit board assembly is installed and positioned by the circuit board itself, thereby reducing the assembly error of the circuit board assembly and improving the accuracy of the installation of the circuit board assembly in the electronic device.

[0020] In a possible implementation manner of the first aspect, in the second direction, the distance from the eighth side face to the third side face is less than or equal to 0.15 millimeters. The circuit board assembly is installed and positioned by the circuit board itself, thereby reducing the assembly error of the circuit board assembly and improving the accuracy of the installation of the circuit board assembly in the electronic device.

[0021] In a possible implementation manner of the first aspect, the substrate part is provided with a avoiding slot, the opening of the avoiding slot faces the first surface, and at least part of the first group of electronic components is accommodated in the avoiding slot. In this way, the circuit board assembly is connected in the accommodating groove through the support, thereby improving the stability and reliability of the fixation of the circuit board assembly in the electronic device. The support further avoids the installation of the electronic components to accommodate space, so as to arrange more electronic components on the surface of the circuit board, thereby improving the compactness of the circuit board layout.

[0022] In a possible implementation manner of the first aspect, the circuit board further includes a third surface opposite to the first surface, the second support portion further includes a fifth surface opposite to the second surface, and a distance from the third surface to the fourth surface is greater than or equal to a distance from the fifth surface to the fourth surface. In this way, the circuit board assembly is fixed in the accommodating groove in the width direction of the electronic device. Moreover, one side surface of the circuit board assembly is connected to the second inner wall surface of the accommodating groove through the circuit board itself, further reducing the assembly error between the circuit board assembly and the frame, and further improving the installation accuracy of the circuit board assembly. Further, the third surface of the circuit board directly contacts the second inner wall surface, further improving the stability and reliability of the circuit board assembly in use, and avoiding the problem of easy breakage caused by the third surface of the circuit board forming a cantilever structure.

[0023] In a possible implementation manner of the first aspect, the circuit board assembly further includes a protruding portion, the protruding portion is arranged on the fifth surface, the protruding portion extends away from the second surface along the fifth surface, and the protruding portion protrudes from the third surface. In this way, after the circuit board assembly is installed in the accommodating groove, the circuit board assembly can be connected to the second inner wall surface through the protruding portion of the support. In the width direction of the electronic device, the circuit board assembly is fixed in the accommodating groove through the support, improving the stability and reliability of the fixing of the circuit board assembly.

[0024] In a possible implementation manner of the first aspect, the circuit board assembly further includes a second group of electronic components, and the second group of electronic components is arranged on the third surface. In this way, the performance of the electronic device is further improved, and the diversity of functions of the electronic device is further improved.

[0025] In a possible implementation manner of the first aspect, an edge of the support is provided with a second avoiding gap, the second avoiding gap is located on a side of the second support portion away from the fifth side surface and on a side of the third support portion away from the third side surface. The second avoiding gap further improves the convenience of disassembling the circuit board assembly. When the circuit board assembly is disassembled, force can be applied to the support through the second avoiding gap to take out the circuit board assembly from the accommodating groove. Specifically, a crowbar can be used to apply force to the support through the second avoiding gap to pry out the circuit board assembly from the accommodating groove. When the support and the frame are connected in a bonding manner, the adhesive material between the support and the frame can be melted when the circuit board assembly is disassembled, and the circuit board assembly can be taken out through the second avoiding gap after the adhesive material is melted. Therefore, the second avoiding gap improves the convenience of disassembling the circuit board assembly, avoids damage to the circuit board assembly when the circuit board assembly is disassembled, and improves the reliability and stability of the use of the circuit board assembly.

[0026] In a possible implementation manner of the first aspect, the circuit board is connected to at least one of the first support part, the second support part and the third support part. In this way, the connection between the circuit board and the support is not limited to one area on the support, and the area connected to the circuit board can be flexibly selected according to the specific structure of the support, further improving the flexibility of the connection between the support and the circuit board.

[0027] In a possible implementation manner of the first aspect, the circuit board includes opposite first and second ends, and the number of supports is two, and the two supports are symmetrically arranged at the first and second ends. The circuit board is fixed in the accommodation groove through the two supports, and the circuit board assembly can be more stably and reliably connected to the accommodation groove.

[0028] The second aspect further provides an electronic device including a housing and the circuit board assembly. The housing includes an accommodation groove including opposite first and second inner wall surfaces. The circuit board assembly is located in the accommodation groove, and the arrangement direction of the support of the circuit board assembly and the circuit board of the circuit board assembly is consistent with the arrangement direction of the first and second inner wall surfaces. The support of the circuit board assembly is connected to the first inner wall surface, and the circuit board of the circuit board assembly is connected to the second inner wall surface. In this way, in the width direction of the electronic device, the circuit board assembly is fixed in the accommodation groove. Moreover, one side surface of the circuit board assembly is connected to the second inner wall surface of the accommodation groove through the circuit board itself, further reducing the assembly error between the circuit board assembly and the frame, and further improving the installation accuracy of the circuit board assembly. Further, the third surface directly contacts the second inner wall surface, further improving the stability and reliability of the circuit board assembly in use, and avoiding the problem of easy breakage caused by the third surface of the circuit board forming a cantilever structure.

[0029] In a possible implementation manner of the second aspect, the accommodation groove further includes a third inner wall surface connected between the first and second inner wall surfaces, and the distance between the support and the third inner wall surface is less than or equal to 0.15 mm.

[0030] In a possible implementation manner of the second aspect, the housing further includes a frame including a sixth surface, and the accommodation groove is arranged on the sixth surface. The thickness direction of the circuit board is perpendicular to the thickness direction of the electronic device.

[0031] In one possible implementation of the second aspect, the sixth surface also has a clearance groove that communicates with the receiving groove. This allows the circuit board assembly to be removed from the receiving groove by applying force to the bracket through the clearance groove. Specifically, a pry bar can be used to apply force to the bracket through the clearance groove to pry the circuit board assembly out of the receiving groove. When the bracket and frame are bonded together, the adhesive between the bracket and frame can be melted before removing the circuit board assembly. After the adhesive melts, the circuit board assembly can be removed through the clearance groove. Therefore, by providing a clearance groove, the ease of disassembly of the circuit board assembly is improved, damage to the circuit board assembly is avoided during disassembly, and the reliability and stability of the circuit board assembly are enhanced. Attached Figure Description

[0032] Figure 1 Perspective views of electronic devices provided in some embodiments of this application;

[0033] Figure 2 for Figure 1 A schematic diagram of the exploded structure of the electronic device shown.

[0034] Figure 3 for Figure 2 An enlarged view of point A in the image;

[0035] Figure 4 This application provides schematic diagrams of the circuit board structure for some embodiments.

[0036] Figure 5 for Figure 4 The circuit board in is installed in Figure 3 A schematic diagram of the structure inside the receiving groove;

[0037] Figure 6 This is a schematic diagram of the structure of a circuit board assembly provided in some embodiments of this application;

[0038] Figure 7 for Figure 6 A schematic diagram of the circuit board assembly installed in the receiving slot;

[0039] Figure 8 Schematic diagrams of the structure of the bracket provided in some embodiments of this application;

[0040] Figure 9 for Figure 7 A schematic diagram of the support structure viewed from the F1 angle;

[0041] Figure 10 for Figure 8 This application provides schematic diagrams of the circuit board structure in some embodiments;

[0042] Figure 11 forFigure 9 The bracket in Figure 10 The structure diagram of the circuit board in

[0043] Figure 12 The structure diagram of the bracket in some embodiments of the present application;

[0044] Figure 13 The front view of the bracket in Figure 12

[0045] Figure 14 The structure diagram of the bracket in some embodiments of the present application; Figure 13

[0046] Figure 15 The structure diagram of the circuit board in some embodiments of the present application;

[0047] Figure 16 The structure diagram of the bracket in some embodiments of the present application; Figure 14 The structure diagram of the circuit board in Figure 15

[0048] Figure 17 The structure diagram of the circuit board assembly in some embodiments of the present application; Figure 16

[0049] Figure 18 The top view of the circuit board assembly in some embodiments of the present application; Figure 17

[0050] Figure 19 The structure diagram of the circuit board assembly in some embodiments of the present application;

[0051] Figure 20 The structure diagram of the bracket in some embodiments of the present application;

[0052] Figure 21 The structure diagram of the bracket in some embodiments of the present application; Figure 20

[0053] Figure 22 The structure diagram of the bracket and the circuit board in some embodiments of the present application; Figure 21

[0054] Figure 23 The top view of the circuit board in some embodiments of the present application; Figure 22

[0055] Figure 24 The structure diagram of the circuit board assembly in some embodiments of the present application;

[0056] Figure 25 ​​​​​​​​A structural schematic diagram of a circuit board assembly provided for some embodiments of the present application;

[0057] Figure 26 A structural schematic diagram of a bracket installed in a receiving groove provided for some embodiments of the present application.

[0058] Reference signs

[0059] 100, electronic device; 10, screen; 11, light-transmissive cover plate; 12, display screen;

[0060] 20, back shell; 21, back cover; 22, frame; S15, sixth surface; 221, receiving groove; 222, inner frame; 223, outer frame; 224, first inner wall surface; 225, second inner wall surface; 226, third inner wall surface; 227, fourth inner wall surface; 228, bottom wall surface; 22a, third avoiding gap; 23, middle plate;

[0061] 30, circuit board assembly; 31, circuit board; 31a, first end; 31b, second end;

[0062] 32, electronic component; S1, first surface; S3, third surface; S4, first side surface; S5, second side surface; S6, third side surface; 33, first positioning portion; S9, sixth side surface; 34, fourth avoiding gap; S11, fourth side surface; S12, fifth side surface;

[0063] 30a, main board circuit board assembly; 311, main board circuit board 311; 312, electronic component of main board;

[0064] 30b, other circuit board assembly; 321, other circuit board; 322, other electronic component; 322a, first group of electronic components; 322b, second group of electronic components;

[0065] 40, bracket; S2, second surface; S7, seventh side surface; S8, eighth side surface; 40a, second avoiding gap; S13, fourth surface;

[0066] 41, first bracket portion; 411, second positioning portion; 412, substrate portion; 412a, avoiding groove; 413, elastic adhesive material; 414, first adhesive material;

[0067] 42, second bracket portion; S14, fifth surface; 421, protruding portion; 43, third bracket portion; 44, receiving groove of bracket;

[0068] 50, flexible circuit board; 51, first portion; 52, second portion; 53, bending portion; 60, elastic connecting member. DETAILED DESCRIPTION

[0069] In the embodiments of the present application, the terms "first", "second", "third", "fourth", "fifth" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features defined with "first", "second", "third", "fourth", "fifth" can explicitly or implicitly include one or more of the features.

[0070] In the embodiments of the present application, the terms "including", "containing" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0071] In the embodiments of the present application, unless otherwise specified, the description of "parallel" means allowing a certain error range of approximate parallelism, which can be a range of deviation angle less than or equal to 5° from absolute parallelism. The description of "perpendicular" means allowing a certain error range of approximate perpendicularity, which can be a range of deviation angle less than or equal to 5° from absolute perpendicularity.

[0072] In the embodiments of the present application, unless otherwise specified, the description of two objects "overlapping" includes four possible implementations: a part of one object overlaps with the whole of the other object, a part of the other object overlaps with the whole of the one object, the whole of the one object overlaps with the whole of the other object, and a part of the one object overlaps with a part of the other object. The description of two objects "overlapping" means that the middle part and the edge of the two objects are completely coincident.

[0073] With the development of the information age, users have more diverse needs for the functions of electronic devices and higher requirements for performance. Therefore, in order to meet the above-mentioned needs, more circuit board assemblies are arranged in electronic devices to realize various functions of the electronic devices. However, in order to improve the user experience, the thinning of the whole machine is also the direction that electronic devices continue to pursue. In the limited space, how to better arrange the devices, optimize the structure layout, improve the performance while ensuring the reliability of the whole machine, and the convenience of disassembling the circuit board assembly during later maintenance and disassembly, which poses an important challenge to the structure design of the whole machine.

[0074] Based on this, in order to solve the above problems, the circuit board assembly is provided from the perspective of improving the stability of the circuit board assembly installed in the electronic device and facilitating disassembly. The circuit board assembly is fixed in the electronic device by means of the support. The circuit board assembly is fixed under the clamping of the support and the inner wall of the electronic device, thereby realizing the stability of the circuit board assembly fixed in the electronic device.

[0075] The specific structure of the support will be described below in combination with the specific application scenarios of the circuit board assembly.

[0076] The electronic device provided in the present application can be a user equipment (UE) or a terminal device, etc. For example, the electronic device can be a portable android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, and the like. The form of the electronic device is not limited in the embodiments of the present application.

[0077] Please refer to Figure 1 , Figure 1 The electronic device 100 provided in some embodiments of the present application is a handheld device with wireless communication function, for example, a mobile phone. The electronic device 100 is generally rectangular and flat. For the convenience of description of the following embodiments, an XYZ coordinate system is established, and the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It can be understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, which is not limited here. When the electronic device 100 is other products, the electronic device 100 can also be generally square and flat, circular and flat, etc., which is not limited here.

[0078] Please refer to the following: Figure 1 and Figure 2 , Figure 2 for Figure 1 The diagram shows an exploded view of the electronic device 100. The electronic device 100 includes a screen 10, a back cover 20, a circuit board assembly 30, electronic components, and a support 50.

[0079] Understandable Figure 1 and Figure 2 The illustration schematically shows some components included in the electronic device 100, the actual shape, size, location, and construction of which are not affected by the actual shape, size, location, and construction of the components. Figure 1 and Figure 2 The limitations. In some other examples, the electronic device 100 may also not include the screen 10.

[0080] Screen 10 is used to display images, videos, etc. Screen 10 includes a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 and the display screen 12 are stacked together. The light-transmitting cover plate 11 is mainly used to protect the display screen 12 and prevent dust. The material of the light-transmitting cover plate 11 includes, but is not limited to, glass. The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode (MLED) display screen, a micro light-emitting diode (LED) display screen, a micro organic light-emitting diode (MOLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0081] The back cover 20 is connected to the screen 10 and serves to protect the internal electronic components of the electronic device 100. In some embodiments, please refer to [the relevant documentation / reference needed]. Figure 1 and Figure 2The back shell 20 can include a back cover 21 and a frame 22. The back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11 and is spaced apart from the display screen 12. The frame 22 is located between the back cover 21 and the screen 10 and is arranged along the edges of the back cover 21 and the edges of the screen 10. The frame 22 is fixed to the back cover 21. For example, the frame 22 can be fixed to the back cover 21 by adhesive. The frame 22 can also be an integral structure with the back cover 21, that is, the frame 22 and the back cover 21 are an integral structure. The light-transmitting cover plate 11 is fixed to the frame 22 by adhesive. The back shell 20 has a receiving cavity. In some embodiments, the receiving cavity is located between the screen 10 and the back cover 21.

[0082] In some embodiments, referring to Figure 2 The electronic device 100 further includes a middle plate 23. The middle plate 23 is fixed to the inner surface of the frame 22. For example, the middle plate 23 can be fixed to the frame 22 by welding. The middle plate 23 can also be an integral structure with the frame 22. The middle plate 23 serves as a structural "skeleton" of the electronic device 100 and is used to support and fix the electronic components in the electronic device 100.

[0083] The structural member composed of the middle plate 23 and the frame 22 can also be referred to as a middle frame. On this basis, the receiving cavity can be located between the middle frame and the back cover 21.

[0084] The circuit board assembly 30 is accommodated in the receiving cavity. In some embodiments, the circuit board assembly 30 can be fixed to the middle plate 23. In other embodiments, when the electronic device 100 does not include the middle plate 23, the circuit board assembly 30 can also be fixed to the back cover 21 or the frame 22.

[0085] The circuit board assembly 30 is used to realize electrical connection between various electronic components and is used for signal control, data signal processing, and data signal storage of the electronic components. Specifically, the circuit board assembly 30 can include a circuit board 31 and electronic components 32 arranged on the surface of the circuit board.

[0086] The circuit board 31 includes first and third surfaces S1 and S3 opposite to each other. The first and third surfaces S1 and S3 can be the two largest surfaces of the circuit board 31. The circuit board 31 can include a multilayer stack structure formed by insulating medium layers and metal layers alternately and stacked in sequence and a solder mask layer arranged on at least one end surface of the multilayer stack structure along the stacking direction thereof, wherein the metal layers have patterns to form internal traces or reference grounds of the circuit board 31. Based on this, the first and third surfaces S1 and S3 can be perpendicular to the stacking direction of the insulating medium layers and the metal layers in the multilayer stack structure.

[0087] The circuit board 31 can be a double-sided board, or a single-sided board with the first surface S1 used for disposing electronic components. When the circuit board 31 is a double-sided board, the first surface S1 and the third surface S3 are both provided with electronic components. In other embodiments, the circuit board 31 can also be a single-sided board with the third surface S3 used for disposing electronic components.

[0088] The circuit board 31 can be a rigid circuit board, a flexible circuit board, or a rigid-flexible combined circuit board. In this embodiment, the circuit board 31 is taken as an example of a rigid circuit board, and specifically, the circuit board 31 can be a rigid printed circuit board (PCB).

[0089] The electronic components 32 include, but are not limited to, chips, resistors, capacitors, inductors, potentiometers, tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices, sensors, power supplies, switches, micro motors, electronic transformers, relays, etc. It should be noted that the number and arrangement of the electronic components 32 in this embodiment can be set according to actual needs, and the number and arrangement of the electronic components 32 are not limited in this embodiment.

[0090] In order to achieve the diversity of the functions of the electronic device 100, the circuit board assembly 30 can include multiple circuit board assemblies 30 for implementing different functions, and specifically, the circuit board assembly 30 can include a main board circuit board assembly 30a and at least one other circuit board assembly 30b, Figure 2 Only one other circuit board assembly 30b is shown, which does not represent a special limitation of this application, and the number of other circuit board assemblies 30b can be two, three, four, etc. The main board circuit board assembly 30a includes a main board circuit board 311 and electronic components 312 of the main board, and the other circuit board assembly 30b includes an other circuit board 321 and other electronic components 322. The main board circuit board assembly 30a is used as the main board of the electronic device 100, and the other circuit board assembly 30b can be other circuit boards of the electronic device 100, such as circuit boards used for carrying speakers, USB interfaces, switch side keys, and volume side keys in a mobile phone, which are not specifically limited here.

[0091] In order to improve the user experience, the thinning of the whole machine is also a continuous pursuit of the electronic device 100. In the limited space of the electronic device 100, the devices should be reasonably arranged and the structure layout should be optimized. In order to more efficiently use the space of the electronic device 100, the circuit board assembly 30 can be arranged using multiple layout schemes. For example, Figure 2As shown, the motherboard circuit board assembly 30a is used as the motherboard circuit board 311 of the electronic device 100. The motherboard circuit board 311 is the circuit board 31 with a larger surface area in the electronic device 100 and can be arranged in a planar layout. The surface area of ​​other circuit board assemblies 30b is smaller than that of the motherboard circuit board 311, and at least some of the other circuit board assemblies 30b can be arranged in a vertical layout.

[0092] "Planar layout" means that the thickness direction of the circuit board 31 is parallel to the thickness direction of the electronic device 100, that is... Figure 2 In the Z-axis direction, parallelism here refers to parallelism including a certain margin of error, not absolute parallelism. The parallelism mentioned in the following embodiments all include a certain margin of error, and will not be repeated hereafter. Specifically, the motherboard circuit board 311 includes a first surface S1 and a third surface S3 facing away from each other. The first surface S1 faces the back cover 21, and the third surface S3 faces the middle plate 23. When the motherboard circuit board assembly 30a is a single-sided board, the electronic components 312 of the motherboard can be disposed on the first surface S1, and the motherboard circuit board assembly 30a is bonded to the middle plate 23 by means of the third surface S3. Alternatively, the electronic components 312 of the motherboard can be disposed on the third surface S3, and the motherboard circuit board assembly 30a is bonded to the back cover 21 by means of the first surface S1. When the motherboard circuit board assembly 30a is a double-sided board, the electronic components 312 of the motherboard are distributed on the first surface S1 and the third surface S3, and the motherboard circuit board assembly 30a is fixed to the middle plate 23 or the back cover 21 by means of the bracket 40.

[0093] Other circuit board assemblies 30b are fixed within the electronic device 100 using a vertical layout. "Vertical layout" means that the thickness direction of the other circuit boards 31 is perpendicular to the thickness direction of the electronic device 100, that is, perpendicular to the Z-axis. Here, "perpendicular" refers to a verticality that includes a certain margin of error, not absolute verticality. The verticality mentioned in the following embodiments includes this margin of error, and will not be elaborated further. The vertical layout can be achieved by setting a receiving slot 221 on the middle frame, within which the other circuit board assemblies 30b are placed. Therefore, compared to using only a planar layout, the combination of vertical and planar layouts can utilize the space within the electronic device 100 more efficiently.

[0094] The following will be described in detail with the circuit board assembly 30 as an example of other circuit board assemblies 30b, and the scenario in which the other circuit board assembly 30b is fixed in the electronic device 100 in a facade layout will be described in detail. In order to facilitate the smoothness of reading, the other circuit board assembly 30b in the following will be described by taking its upper concept circuit board assembly 30 as the name, the other circuit board 31 will be described by taking its upper concept circuit board 31 as the name, and the other electronic component 30b will be described by taking its upper concept electronic component 32 as the name. That is, the scenario in which the circuit board assembly 30 adopts a facade layout will be described in detail.

[0095] Please refer to Figure 3 , Figure 3 for Figure 2 an enlarged view of A. The frame 22 includes an inner frame 222 and an outer frame 223 facing away from each other, and a sixth surface S15 connected between the inner frame 222 and the outer frame 223. The inner frame 222 is a frame of the frame 22 facing the inside of the housing, and the outer frame 223 is a frame of the frame 22 facing the outside of the housing. The receiving groove 221 is provided on the sixth surface S15 between the inner frame 222 and the outer frame 223. The extension direction of the length of the receiving groove 221 can be consistent with the extension direction of the length of the frame 22, that is, extending along the Y-axis direction. When the circuit board assembly 30 is received in the receiving groove 221, the extension direction of the length of the circuit board assembly 30 is consistent with the extension direction of the length of the frame 22. In this way, the length of the receiving groove 221 can extend to the inner wall of both ends of the frame 22 in the length direction to meet the demand of installing a circuit board 31 with a larger length.

[0096] Of course, in other embodiments, the extension direction of the length of the circuit board 31 can also be inclined at an angle with respect to the Y-axis direction. In this way, the circuit board 31 can avoid interference with the installation of other components by being arranged obliquely to avoid interference with the installation of other components.

[0097] Figure 3 The receiving groove 221 is described by being arranged on the frame 22. However, this does not mean a special limitation of the present application. That is, in other embodiments, the receiving groove 221 can also be arranged on the middle plate 23 or the back cover 21. The extension direction of the length of the receiving groove 221 can extend along the X-axis direction, the Y-axis direction, or the Z-axis direction, or can extend at an angle with respect to the X-axis direction, the Y-axis direction, or the Z-axis direction. It can be understood that the extension direction of the length of the receiving groove 221 extending in each direction is within the protection scope of the present application.

[0098] The following describes an example in which the accommodating groove 221 is arranged on the frame 22, and the extending direction of the length of the accommodating groove 221 is consistent with the extending direction of the length of the frame 22.

[0099] Please continue to refer to Figure 3 The opening of the accommodating groove 221 faces the back cover 21, and the circuit board assembly 30 can be installed in the accommodating groove 221 before the back cover 21 is assembled when the circuit board assembly 30 is assembled. When the electronic device 100 malfunctions, the circuit board assembly 30 can be directly observed after the back cover 21 is disassembled, and the circuit board assembly 30 can be easily disassembled through the opening. In this way, the assembly and disassembly of the circuit board assembly 30 are facilitated.

[0100] Specifically, the accommodating groove 221 includes opposite first and second inner wall surfaces 224 and 225, opposite third and fourth inner wall surfaces 226 and 227 connected between the first and second inner wall surfaces 224 and 225, and a bottom wall surface 228 facing the opening of the accommodating groove 221, and the bottom wall surface 228 is located on the side of the first and second inner wall surfaces 224 and 225 away from the opening of the accommodating groove 221.

[0101] The extending direction of the first inner wall surface 224 is parallel to the length direction of the electronic device 100, that is, the Y-axis direction in Figure 3 The extending direction of the second inner wall surface 225 is parallel to the length direction of the electronic device 100, that is, the Y-axis direction in Figure 3 The extending direction of the third inner wall surface 226 is parallel to the width direction of the electronic device 100, that is, the X-axis direction in

[0102] This embodiment and the following embodiments are illustrated using the connection between the bottom wall surface 228 and the first inner wall surface 224 and the second inner wall surface 225 as an example. The line connecting the midpoint D1 of the first inner wall surface 224 and the midpoint D2 of the second inner wall surface 225 is defined as the centerline L1 of the bottom wall surface 228. One end of the bottom wall surface 228 extends a certain distance from the centerline L1 towards the third inner wall surface 226, and the other end extends a certain distance from the centerline L1 towards the fourth inner wall surface 227. Here, "midpoint D1 of the first inner wall surface 224" refers to the region on the first inner wall surface 224 where the distances from the third inner wall surface 226 and the fourth inner wall surface 227 are equal. Similarly, "midpoint D2 of the second inner wall surface 225" is also defined as above. The length of the bottom wall surface 228 can be between one-fifteenth and one-tenth of the length of the circuit board 31, and this length does not constitute a specific limitation of this application. In this way, the bottom wall 228 can not only support the circuit board 31, but the hollow areas on both sides of the bottom wall 228 can also save the weight of the electronic device 100, thereby improving the user experience.

[0103] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of a circuit board 31 provided in some embodiments of this application. Based on the above, the circuit board 31 is further described as follows: the circuit board 31 also includes a first side surface S4 and a third side surface S6 opposite to each other connected between the first surface S1 and the third surface S3, and a second side surface S5 and a sixth side surface S9 opposite to each other connected between the first surface S1 and the third surface S3.

[0104] Please see Figure 5 , Figure 5 for Figure 4 Circuit board 31 is installed in Figure 3 A schematic diagram of the structure within the receiving groove 221 is shown. The circuit board assembly 30 is installed within the receiving groove 221. The first surface S1 of the circuit board 31 faces the first inner wall surface 224, the second surface S2 faces the second inner wall surface 225, the first side surface S4 faces the opening of the receiving groove 221, the second side surface S5 faces the third inner wall surface 226, the third side surface S6 faces the bottom wall surface 228, and the sixth side surface S9 faces the fourth inner wall surface 227. The circuit board assembly 30 can be bonded to the inner wall of the receiving groove 221 by at least one of the first surface S1, second surface S2, second side surface S5, third side surface S6, and sixth side surface S9, or the circuit board 31 can be abutted between the back cover 21 and the bottom wall surface 228. A filler material can also be provided between the circuit board 31 and the back cover 21 or between the circuit board 31 and the bottom wall surface 228 to improve the stability of the circuit board 31.

[0105] However, the circuit board assembly 30 fixed in the above manner may have the problem of unstable fixation, and the reason is as follows. The side surface of the circuit board 31 has a small area, and when the small-area side surface is connected with the back cover 21 or the bottom wall surface 228, the problem of unstable adhesion may occur. After the circuit board assembly 30 is accommodated in the accommodation groove 221, the problem of difficult disassembly may also occur. Since the circuit board 31 is connected to the inner wall of the accommodation groove 221 by adhesion, when the circuit board assembly 30 is disassembled, it is difficult to take out the circuit board assembly 30 inside the accommodation groove 221 due to the small space of the accommodation groove 221, and other disassembly tools need to be used to take out the circuit board assembly 30, for example, a pry bar is used to pry out the circuit board 31 from the accommodation groove 221. However, the circuit board 31 may be damaged during disassembly.

[0106] To solve the above problems, the present application also provides a circuit board assembly 30, please refer to Figure 6 , Figure 6 The structural schematic diagram of the circuit board assembly 30 provided for some embodiments of the present application. The circuit board assembly 30 is mainly different from the above-mentioned circuit board assembly 30 in that the circuit board assembly 30 further comprises a bracket 40. The bracket 40 will be described in detail below. The bracket 40 is connected to the circuit board 31. "The bracket 40 is connected to the circuit board 31" means that at least part of the bracket 40 is connected to the circuit board 31 to fix the bracket 40 on the circuit board 31. The bracket 40 comprises a first bracket portion 41. In some embodiments, the bracket 40 can be connected to the circuit board 31 through the first bracket portion 41. The first bracket portion 41 is located on the side toward the first surface S1, that is, the first bracket portion 41 is located on the same side of the circuit board 31 as the first group of electronic components 32. The direction perpendicular to the first surface S1 is the first direction, that is, the direction of the X-axis in the figure. At least part of the first bracket portion 41 in the first direction is a flexible soft structure, which can be compressed and rebounded in the first direction when the bracket 40 is subjected to a force in the first direction.

[0107] In some embodiments, the material of the bracket 40 includes but is not limited to stainless steel, aluminum alloy, titanium alloy and other metals. Such materials have good heat dissipation performance, which helps to dissipate heat of the electronic device 100. In addition, such materials have high structural strength, which can ensure the stability of the bracket 40 during use. In other embodiments, the material of the bracket 40 can also be non-metallic materials such as polycarbonate (PC), PC+glass fiber and ABS plastic (acrylonitrile butadienestyrene plastic). The bracket 40 made of such materials has a lighter weight, which is beneficial to reduce the weight of the electronic device 100 and thus improve the user experience.

[0108] The first support portion 41 can be plate-shaped, block-shaped, strip-shaped, etc. This embodiment and the following embodiments use a plate-shaped first support portion 41 as an example for description, but this does not imply a specific limitation on this application. Furthermore, the first support portion 41 can be square plate-shaped, circular plate-shaped, elliptical plate-shaped, irregularly shaped plate-shaped, etc. This embodiment and the following embodiments use a square plate-shaped first support portion 41 as an example for description. In this way, the first support portion 41 includes a second surface S2 facing the first surface S1, and the first support portion 41 can be connected to the circuit board 31 through the second surface S2.

[0109] The first bracket portion 41 can be connected to the circuit board 31 by means of bonding, snap-fitting, threaded connection, etc. This embodiment and the following embodiments will illustrate the application of bonding the first bracket portion 41 to the circuit board 31 as an example. Specifically, an adhesive material is provided between the first bracket portion 41 and the first surface S1 to bond the first bracket portion 41 to the first surface S1. The adhesive material can be a thermally conductive adhesive, thermally conductive gel, or other materials with adhesive properties. This helps dissipate heat during use of the electronic device 100, thereby improving the performance of the electronic device 100. However, the above does not constitute a specific limitation on this application; that is, the use of other adhesive materials is also within the scope of protection of this application.

[0110] The material of the elastic soft structure can be rubber, silicone, foam, sponge, etc. Given that the first support portion 41 is a square plate, the elastic soft material can be at least a portion constituting the square plate in the first direction, while the remaining portion of the square plate is a rigid material. The elastic soft material can also be a portion protruding from the surface of the square plate, and the elastic soft material protrudes from the square plate in the first direction.

[0111] Based on the above embodiments, unlike simply attaching the circuit board 31 to other structural components via its side or surface, a bracket 40 is provided on the circuit board 31, and the circuit board assembly 30 is connected to other structural components by means of the bracket 40. On one hand, the bracket 40 provides a larger connection area for the connection of the circuit board assembly 30, thereby making the circuit board assembly 30 more securely and reliably connected to other structural components. On the other hand, when disassembling the circuit board assembly 30, force can be applied directly to the bracket 40 to remove the circuit board 31 from other structural components, avoiding damage to the circuit board assembly 30 caused by directly applying force to it, thus improving the stability of the circuit board assembly 30 in use. Furthermore, after the circuit board 31 is installed, the bracket 40 also uses an elastic soft structure to press the circuit board 31 between two opposing structural components, thereby forming an interference fit between the circuit board 31 and other structural components, making the connection of the circuit board assembly 30 more secure, further improving the stability and reliability of the circuit board assembly 30 after installation.

[0112] Please refer to Figure 7 , Figure 7 For Figure 6 the structure diagram of the circuit board assembly 30 installed in the accommodating groove 221. The surface of the support 40 away from the circuit board 31 faces the first inner wall surface 224, and the surface of the circuit board 31 away from the support 40 (i.e. the third surface S3 of the circuit board 31) faces the second inner wall surface 225. The circuit board assembly 30 is installed between the first inner wall surface 224 and the second inner wall surface 225, and the circuit board assembly 30 can be bonded to the first inner wall surface 224 of the accommodating groove 221 through the support 40. Further, the elastic soft structure on the support 40 forms an interference fit between the circuit board assembly 30 and the first inner wall surface 224 and the second inner wall surface 225, thereby making the circuit board assembly 30 more stable and reliable in connection with the accommodating groove 221.

[0113] Please continue to refer to Figure 6 and Figure 7 , the number of supports 40 can be set to at least one, that is, the support 40 can be set to one, two, three, four, etc. The number of supports 40 can be determined according to the length of the circuit board 31. For example, when the length of the circuit board 31 is large, the number of supports 40 can be set to two, the circuit board 31 includes opposite first and second ends 31a and 31b, and the first and second ends 31a and 31b are two ends in the length direction of the circuit board 31. Two supports 40 are symmetrically arranged at the first and second ends 31a and 31b. In this way, the circuit board 31 is fixed in the accommodating groove 221 by the two supports 40, and the circuit board assembly 30 can be more stably and reliably connected to the accommodating groove 221.

[0114] In other embodiments, when the length of the circuit board 31 is larger, more supports 40 can be provided to fix the circuit board assembly 30. When the length of the circuit board 31 is small, one support 40 can achieve the stability and reliability of the installation of the circuit board assembly 30. Therefore, the number of supports 40 is not specially limited in the present application, and the number of supports 40 can be selected according to the length of the circuit board 31 and the stability requirement of the installation of the circuit board 31. The above embodiments and the following embodiments are described by taking the number of supports 40 as two as an example.

[0115] The specific structure of the first support part 41 will be introduced below. Please refer to Figure 8 , Figure 8The schematic structural diagram of the bracket 40 is provided for some embodiments of the present application. Based on the above introduction of the bracket 40, the first bracket part 41 is in the shape of a square plate, and the first bracket part 41 includes a substrate part 412 and an elastic glue material 413. The substrate part 412 is connected with the first surface S1. The elastic glue material 413 is arranged on the surface of the substrate part 412 away from the first surface S1, and the elastic glue material 413 forms an elastic soft structure. The elastic glue material 413 covers at least part of the surface of the substrate part 412 away from the first surface S1. For example, the elastic glue material 413 can cover one-third to one-half of the surface of the substrate part 412 away from the first surface S1, and the elastic glue material 413 can also cover the entire surface of the substrate part 412 away from the first surface S1. The present application does not specially limit the coverage area of the elastic glue material 413. It can be understood that the elastic glue material 413 can be selected according to the size of the volume of the circuit board 31, and the size of the area of the elastic glue material 413 is within the protection scope of the present application.

[0116] The elastic glue material 413 can include a part protruding from the surface of the substrate part 412 and a part extending into the interior of the substrate part 412, that is, the part represented by the dashed line in the above figure. Figure 8 The height of the elastic glue material 413 protruding from the surface of the substrate part 412 is greater than or equal to 0.05 mm. For example, the height of the elastic glue material 413 protruding from the surface of the substrate part 412 can be 0.05 mm, 0.07 mm, 0.08 mm, 0.1 mm, 0.12 mm, etc. In this way, the extension length of the elastic glue material 413 is greater, providing greater elastic force for the fixation of the circuit board assembly 30, so that the circuit board assembly 30 is in interference fit with the accommodating groove 221, and thus the installation of the circuit board assembly 30 is more stable and reliable.

[0117] The elastic glue material 413 can be integrally formed with the substrate part 412, or can be connected to the substrate part 412 in an assembled manner.

[0118] The elastic glue material 413 can be made of a heat-conducting glue, a heat-conducting gel, etc. with adhesive properties. In this way, it is helpful for heat dissipation of the electronic device 100 during use, and thus improves the use performance of the electronic device 100. However, the above does not constitute a special limitation of the present application, that is, other elastic glue materials 413 also belong to the protection scope of the present application.

[0119] The elastic soft structure adopts the elastic glue material 413, which can play multiple roles. First, the circuit board assembly 30 can be bonded to the first inner wall surface 224 through the elastic glue material 413. Second, the elastic glue material 413 is located between the substrate 412 and the first inner wall surface 224, so that the circuit board assembly 30 and the accommodating groove 221 form an interference fit, thereby improving the stability and reliability of the installation of the circuit board assembly 30. Third, when the circuit board assembly 30 collides, the elastic glue material 413 has a certain buffering effect, thereby protecting the circuit board assembly 30 and avoiding damage to the circuit board assembly 30 in the collision, further improving the user's satisfaction.

[0120] Please refer to Figure 9 and Figure 10 , Figure 9 for Figure 7 a structural schematic view of the support 40 from the F1 angle; Figure 10 is a structural schematic view of the circuit board 31 provided by some embodiments of the present application. The first surface S1 of the circuit board 31 and the second surface S2 of the support 40 are provided with a first glue material 414, and the support 40 is bonded to the circuit board 31 through the first glue material 414. In order to improve the accuracy of the cooperation between the support 40 and the circuit board 31, the first surface S1 is provided with a first positioning part 33, and the second surface S2 is provided with a second positioning part 411 matched with the first positioning part 33. The cooperation between the first positioning part 33 and the second positioning part 411 improves the accuracy of the bonding between the support 40 and the circuit board 31, thereby reducing the assembly error between the support 40 and the circuit board 31, further improving the stability and reliability of the connection between the support 40 and the circuit board 31, and improving the assembly accuracy of the circuit board assembly 30 and the electronic device 100.

[0121] Please continue to refer to Figure 9 and Figure 10 , further, the first positioning part 33 is a notch, and the notch penetrates the third side surface S6; the second positioning part 411 is a protrusion matched with the notch. In one of the embodiments, the protrusion is arranged on the support 40, and the notch is arranged on the circuit board 31. In some other embodiments, the protrusion is arranged on the circuit board 31, and the notch is arranged on the support 40. The present embodiment and the following embodiments will be described by taking the protrusion arranged on the support 40 and the notch arranged on the circuit board 31 as an example.

[0122] Specifically, the protrusion can be a square block, a circular block, an oval block, a special-shaped block, etc. protruding from the second surface S2. The shape of the notch is consistent with the shape of the protrusion to accommodate the protrusion. Moreover, the notch penetrates to the third side surface S6, and correspondingly, the protrusion is arranged on the area of the second surface S2 close to the third side surface S6, that is, the area of the second surface S2 downward in the Z-axis direction. Please refer to Figure 11 , Figure 11 forFigure 9 The bracket 40 in the middle is installed at Figure 10 The diagram shows the structure of the circuit board 31. In this way, during the assembly of the bracket 40 and the circuit board 31, the first positioning part 33 of the circuit board 31 is aligned with the second positioning part 411 of the bracket 40 along the thickness direction (Z-axis direction) of the electronic device 100. After alignment, the second positioning part 411 is pushed into the first positioning part 33 to house the second positioning part 411 within the first positioning part 33. This achieves the positioning of the bracket 40 and the circuit board 31, improves the bonding accuracy of the bracket 40 and the circuit board 31, reduces the assembly error between the bracket 40 and the circuit board 31, further improves the stability and reliability of the connection between the bracket 40 and the circuit board 31, and improves the assembly accuracy of the circuit board assembly 30 and the electronic device 100.

[0123] The above embodiment uses the first bracket portion 41 to fix the circuit board assembly 30 in the width direction of the electronic device 100. Based on this, in order to further improve the installation stability of the circuit board assembly 30, please refer to... Figure 12 and Figure 13 , Figure 12 This is a schematic diagram of the structure of the bracket 40 provided in some embodiments of this application; Figure 13 for Figure 12 The image shows a front view of the bracket 40. The bracket 40 also includes a second bracket portion 42, which is connected to the first bracket portion 41. Specifically, the second bracket portion 42 can be connected to the second surface S2 of the first bracket portion 41 and is located on the side facing the first side S4. In some other embodiments, the second bracket portion 42 can also be connected to other surfaces of the first bracket portion 41, which is not specifically limited here.

[0124] The second support portion 42 can be block-shaped, plate-shaped, strip-shaped, etc. In this embodiment and the following embodiments, the second support portion 42 is described as a block-shaped example. The second support portion 42 can be square block-shaped, circular block-shaped, elliptical block-shaped, etc. In this embodiment and the following embodiments, the second support portion 42 is described as a square block-shaped example. The second support portion 42 includes a seventh surface facing the second surface S2. Figure 12The second support portion 42 is connected to the second surface S2 through a seventh surface, and extends to at least a part of the first side surface S4. The second support portion 42 is in the shape of a square block extending from the seventh surface to the fifth surface S14 opposite to the seventh surface. The second support portion 42 extends to at least a part of the first side surface S4, which means that the orthographic projection of the first side surface S4 on the second support portion 42 overlaps the second support portion 42. The orthographic projection of the first side surface S4 on the second support portion 42 can be completely overlapped with the second support portion 42, or at least partially overlapped with the second support portion 42.

[0125] The second support portion 42 can be in direct contact with the first side surface S4 of the circuit board 31, or have a gap with the first side surface S4 of the circuit board 31, or abut against the first side surface S4 of the circuit board 31.

[0126] In this way, the second support portion 42 limits the position of the circuit board 31 in the direction in which the first side surface S4 faces. Specifically, the first support portion 41 limits the position of the circuit board 31 in the thickness direction of the circuit board 31, that is, in the X-axis direction in the coordinate system shown in Figure 13 The second support portion 42 limits the position of the circuit board 31 in the width direction of the circuit board 31, that is, in the Z-axis direction in the coordinate system shown in Figure 13 Further, in the width direction of the circuit board 31, the second positioning portion 411 and the second support portion 42 cooperate to more accurately mount the circuit board 31 on the circuit board 31, thereby reducing the assembly error between the support 40 and the circuit board 31 and improving the assembly accuracy of the support 40 and the circuit board 31. Further, the stability and reliability of the circuit board assembly 30 mounted in the electronic device 100 are improved.

[0127] Please refer to Figure 13 and Figure 14 , Figure 14 for Figure 13The diagram shows the structure of the bracket 40 viewed from angle F2. In the width direction of the circuit board 31, i.e., the Z-axis direction, the bracket 40 includes a seventh side S7 and an eighth side S8 facing away from each other. The seventh side S7 is the side of the bracket 40 closest to the first side S4. Specifically, the seventh side S7 includes the side S71 of the first bracket portion 41 and the side S72 of the second bracket portion 42. The side S71 of the first bracket portion 41 and the side S72 of the second bracket portion 42 are located in the same plane a. This ensures the flatness of the seventh side S7, avoiding the installation difficulties caused by unevenness in the first bracket portion 41 and the second bracket portion 42. This is because uneven surfaces have greater assembly errors when mating with other surfaces, making it difficult to adhere and fix them to other surfaces.

[0128] In some other embodiments, the side S71 of the first bracket portion 41 and the side S72 of the second bracket portion 42 may not be in the same plane. For example, the side S72 of the second bracket portion 42 may protrude from the side S71 of the first bracket portion 41. A notch is provided in the area of ​​the electronic device 100 opposite to the second bracket portion 42. The part of the second bracket portion 42 that protrudes from the first bracket portion 41 mates with the notch, so that the bracket 40 can be positioned with the electronic device 100 during installation.

[0129] In some embodiments, please refer to Figure 15 and Figure 16 , Figure 15 This is a schematic diagram of the structure of the circuit board 31 provided in some embodiments of this application; Figure 16 for Figure 14 The bracket 40 is installed in Figure 15 A schematic diagram of the circuit board 31 is shown. The circuit board 31 also includes a third side S6 opposite to the first side S4, a fourth side S11, and a fifth side S12. The distance from the first side S4 to the third side S6 is less than the distance from the fourth side S11 to the third side S6. When the bracket 40 is installed on the circuit board 31, its positioning can be achieved through the cooperation of the second bracket portion 42 with the first side S4, thereby ensuring the stability and reliability of the circuit board assembly 30. Furthermore, the second bracket portion 42 is accommodated within the notch formed by the fourth side S11 and the fifth side S12, further ensuring the flatness of the overall appearance of the circuit board assembly 30 after the bracket 40 is fixed to the circuit board 31, thus facilitating the convenience and accuracy of installing the circuit board assembly 30 into the electronic device 100.

[0130] The above embodiment realizes the fixation of the circuit board assembly 30 in the width direction of the electronic device 100 through the first support part 41, realizes the fixation of the circuit board assembly 30 in the thickness direction of the electronic device 100 through the second support part 42, and in order to further improve the stability of the installation of the circuit board assembly 30, please continue to refer to Figure 12 , Figure 13 and Figure 14 The support 40 further comprises a third support part 43, the third support part 43 is located on the side of the third side surface S6 of the circuit board 31, the third support part 43 can be connected to the first support part 41, the third support part 43 can also be connected to the second support part 42, the third support part 43 can also be connected to both the first support part 41 and the second support part 42, and the present embodiment and the following embodiments are described by taking the third support part 43 connected to both the first support part 41 and the second support part 42 as an example.

[0131] Please continue to refer to Figure 12 , Figure 13 and Figure 14 The third support part 43 can be block-shaped, plate-shaped, strip-shaped, etc., and in the present embodiment and the following embodiments, the third support part 43 is taken as an example of being block-shaped. The third support part 43 can be square block-shaped, circular block-shaped, elliptical block-shaped, etc., and in the present embodiment and the following embodiments, the third support part 43 is taken as an example of being square block-shaped.

[0132] Specifically, the top surface of the third support part 43 faces the second support part 42 and is connected to the second support part 42, and the side surface of the third support part 43 faces the first support part 41 and is connected to the first support part 41. In this way, the first support part 41, the second support part 42, and the third support part 43 form a containing groove 44 of the support. Please refer to Figure 16 At least part of the circuit board 31 is contained in the containing groove 44 of the support, specifically, the first surface S1 of the circuit board 31 is connected to the first support part 41, the first side surface S4 of the circuit board 31 faces the second support part 42, and the second side surface S5 of the circuit board 31 faces the third support part 43. The circuit board 31 can be in direct contact with the second support part 42 and the third support part 43, or the circuit board 31 can have a certain gap with the second support part 42 and the third support part 43.

[0133] The support 40 positions the circuit board 31 in three directions, thereby reducing the assembly error between the support 40 and the circuit board 31 and improving the accuracy of the assembly of the support 40 and the circuit board 31. Further, the stability and reliability of the installation of the circuit board assembly 30 in the electronic device 100 are also improved.

[0134] The first surface S1 of the circuit board 31 can be connected with the second support part 42, and the first surface S1 of the circuit board 31 can also be connected with the third support part 43. In some other embodiments, the first surface S1 of the circuit board 31 can be connected with two or three of the first support part 41, the second support part 42, and the third support part 43 at the same time, so as to improve the connection strength between the circuit board 31 and the support 40. Therefore, the connection between the circuit board 31 and the support 40 is not limited to one area on the support 40, and the area connected with the circuit board 31 can be flexibly selected according to the specific structure of the support 40, further improving the flexibility of the connection between the support 40 and the circuit board 31.

[0135] Please continue to refer to Figure 16 , the arrangement direction of the first side S4 and the third side S6 is the second direction, that is, the Z-axis direction in Figure 16 . In the second direction, the support 40 includes a seventh side S7 and an eighth side S8 opposite to each other, the seventh side S7 is located on the side of the first side S4 away from the third side S6, and the eighth side S8 is located on the side of the first side S4 away from the seventh side S7. That is, the seventh side S7 is the surface of the support 40 facing the opening of the accommodating groove 221, and the eighth side S8 is arranged opposite to the seventh side S7. In the width direction of the circuit board assembly 30, that is, the Z-axis direction in Figure 16 , the seventh side S7 of the support 40 protrudes from the first side S4 of the circuit board 31.

[0136] In this way, after the circuit board assembly 30 is installed in the accommodating groove 221, and the back cover 21 of the electronic equipment 100 is installed on the frame 22, the circuit board assembly 30 is located between the bottom wall of the accommodating groove 221 and the back cover 21. The support 40 can be in direct contact with the back cover 21, so as to fix the circuit board assembly 30 in the second direction. Further, the back cover 21 can form an interference fit relationship with the circuit board assembly 30, so as to press the circuit board assembly 30 in the accommodating groove 221, further improving the stability and reliability of the installation of the circuit board assembly 30 in the accommodating groove 221.

[0137] In some other embodiments, the support 40 and the back cover 21 can also not be in contact, and the support 40 and the back cover 21 can have a certain gap. The support 40 and the back cover 21 can also be in contact by means of other structural members, for example, a filler can be arranged between the support 40 and the back cover 21, and the filler is pressed between the support 40 and the back cover 21, further improving the stability and reliability of the installation of the circuit board assembly 30 in the accommodating groove 221.

[0138] In some other embodiments, the seventh side S7 can be flush with the first side S4, so as to ensure the flatness of the circuit board assembly 30.

[0139] Please continue to refer to Figure 16 The eighth side S8 is located between the first side S4 and the third side S6. That is, in the width direction of the circuit board assembly 30, that is, the Z-axis direction in the figure, the third side S6 of the circuit board 31 protrudes from the eighth side S8 of the bracket 40. The height by which the third side S6 protrudes from the eighth side S8 can be greater than or equal to 0.1 millimeters. The height by which the third side S6 protrudes from the eighth side S8 can be 0.1 millimeters, 0.11 millimeters, 0.13 millimeters, 0.15 millimeters, and the like. In this way, after the circuit board assembly 30 is installed in the accommodation groove 221, the circuit board assembly 30 directly contacts the bottom wall surface 228 of the accommodation groove 221 through the third side S6. The circuit board assembly 30 relies on the circuit board 31 itself for installation and positioning, reducing the assembly error of the circuit board assembly 30 and improving the accuracy of the installation of the circuit board assembly 30 in the electronic device 100.

[0140] Please refer to Figure 17 and Figure 18 , Figure 17 for Figure 16 the structure diagram of the circuit board assembly 30 in the electronic device 100; Figure 18 for Figure 17 the top view of the circuit board assembly 30 in the electronic device 100. After the bracket 40 is installed on the circuit board 31, the circuit board assembly 30 with the bracket 40 is installed in the accommodation groove 221 of the frame 22. In the width direction of the electronic device 100, that is, the X-axis direction in Figure 17 , one side surface of the circuit board assembly 30 is connected to the first inner wall surface 224 through the bracket 40, and the other side surface of the circuit board assembly 30 is connected to the second inner wall surface 225 through the third surface S3 of the circuit board 31.

[0141] In this way, in the width direction of the electronic device 100, the circuit board assembly 30 is fixed in the accommodation groove 221. Moreover, one side surface of the circuit board assembly 30 is connected to the second inner wall surface 225 of the accommodation groove 221 through the circuit board 31 itself, further reducing the assembly error between the circuit board assembly 30 and the frame 22, and further improving the installation accuracy of the circuit board assembly 30. Further, by directly contacting the third surface S3 with the second inner wall surface 225, the stability and reliability of the circuit board assembly 30 in use are further improved, and the problem of easy breakage caused by the third surface S3 of the circuit board 31 forming a cantilever structure is avoided.

[0142] Based on the above embodiments, in the length direction of the electronic device 100, that is, Figure 17The circuit board assembly 30 is fixed in the accommodating groove 221 through the supports 40 at both ends in the Y-axis direction. Specifically, the support 40 at the first end 31a of the circuit board 31 is connected to the third inner wall surface 226 of the accommodating groove 221, and the support 40 at the second end 31b of the circuit board 31 is connected to the fourth inner wall surface 227 of the accommodating groove 221. The distance between the support 40 at the first end 31a and the third inner wall surface 226 and the distance between the support 40 at the second end 31b and the fourth inner wall surface 227 are less than or equal to 0.15 mm. For example, the distance between the support 40 at the first end 31a and the third inner wall surface 226 and the distance between the support 40 at the second end 31b and the fourth inner wall surface 227 can be 0.05 mm, 0.1 mm, or 0.15 mm. In this way, the circuit board assembly 30 is fixed in the accommodating groove 221 in the length direction of the electronic device 100 through the supports 40. On the one hand, the supports 40 increase the connection area of the circuit board assembly 30 with the accommodating groove 221 in the length direction, thereby improving the connection strength of the circuit board assembly 30 fixed in the accommodating groove 221, and further improving the stability and reliability of the electronic device 100 in use. On the other hand, when the circuit board assembly 30 needs to be disassembled, the connection between the supports 40 and the accommodating groove 221 can be removed. Specifically, the circuit board assembly 30 can be pried up by applying a crowbar to the supports 40, without applying external force to the circuit board 31, thereby avoiding damage to the circuit board assembly 30 during disassembly, thereby prolonging the service life of the electronic device 100 and improving the user experience.

[0143] To further facilitate the disassembly of the circuit board 31, please continue to refer to Figure 17 In some embodiments, the first inner wall surface 224 is provided with an avoiding groove 22a, and the direction of the avoiding groove 22a is consistent with the direction of the opening of the accommodating groove 221. Specifically, the avoiding groove 22a extends from the direction of the first inner wall surface 224 away from the supports 40, and the avoiding groove 22a penetrates to the opening of the accommodating groove 221. In this way, when the circuit board assembly 30 is disassembled, force can be applied to the supports 40 through the avoiding groove 22a to remove the circuit board assembly 30 from the accommodating groove 221. Specifically, the circuit board assembly 30 can be pried out of the accommodating groove 221 by applying force to the supports 40 through the avoiding groove 22a with the help of a crowbar. When the supports 40 and the frame 22 are connected by adhesion, the adhesive material between the supports 40 and the frame 22 can be melted before disassembling the circuit board assembly 30, and the circuit board assembly 30 can be removed through the avoiding groove 22a after the adhesive material is melted. Therefore, the avoiding groove 22a improves the convenience of disassembling the circuit board assembly 30, and avoids damage to the circuit board assembly 30 during disassembly, thereby improving the reliability and stability of the use of the circuit board assembly 30.

[0144] Please continue to see Figure 17 And Figure 18 In some other embodiments, in order to facilitate the disassembly of the circuit board assembly 30, a second avoiding gap 40a can also be arranged on the support 40, the second avoiding gap 40a is arranged on the seventh side surface S7, and the opening of the second avoiding gap 40a faces away from the eighth side surface S8 in the direction of the seventh side surface S7. Further, the second avoiding gap 40a can be arranged on the surface of the first support portion 41 facing the opening of the accommodating groove 221, and can also be arranged on the surface of the second support portion 42 facing the opening of the accommodating groove 221, and can also be arranged on the surface of the third support portion 43 facing the opening of the accommodating groove 221. In this embodiment, the second avoiding gap 40a can be arranged on the basis of the above-mentioned embodiments, and the avoiding groove 22a can also not be arranged, and only the second avoiding gap 40a can be arranged.

[0145] By arranging the second avoiding gap 40a, the convenience of disassembling the circuit board assembly 30 is further improved. When disassembling the circuit board assembly 30, force can be applied to the support 40 through the second avoiding gap 40a to take out the circuit board assembly 30 from the accommodating groove 221. Specifically, a crowbar can be used to apply force to the support 40 through the second avoiding gap 40a to pry out the circuit board assembly 30 from the accommodating groove 221. When the support 40 and the frame 22 are connected in a bonding manner, the adhesive material between the support 40 and the frame 22 can be melted when disassembling the circuit board assembly 30. After the adhesive material is melted, the circuit board assembly 30 can be taken out through the second avoiding gap 40a. Therefore, by arranging the second avoiding gap 40a, the convenience of disassembling the circuit board assembly 30 is improved, and damage to the circuit board assembly 30 during disassembly is avoided, and the reliability and stability of the use of the circuit board assembly 30 are improved.

[0146] Please continue to see Figure 17 And Figure 18 In some embodiments, the circuit board assembly 30 further comprises a flexible electrical connection structure connected to the circuit board 31. The circuit board assembly 30 can be electrically connected to the main board circuit board 311 by means of the flexible electrical connection structure. The flexible electrical connection structure includes but is not limited to a flexible printed circuit board 50 (FPC) and a structure formed by a wire and a soft material. In this embodiment, the flexible electrical connection structure 43 is exemplarily illustrated as a flexible printed circuit board 50.

[0147] Please see Figure 19 , Figure 19A structural schematic diagram of the circuit board assembly 30 is provided for some other embodiments of the present application. Specifically, the flexible circuit board 50 includes a first portion 51, a second portion 52, and a bending portion 53 connected between the first portion 51 and the second portion 52, and the bending portion 53 is located on the side of the first side S4 of the circuit board 31 facing away from the third side S6, and the first portion 51 is connected to the circuit board 31. The first side S4 is also provided with a fourth avoiding gap 34 opposite to the bending portion 53, and at least part of the bending portion 53 is accommodated in the fourth avoiding gap 34. "Opposite to the bending portion 53" means that the orthographic projection of the bending portion 53 on the first side S4 overlaps the first side S4. The first portion 51 is connected to the first surface S1 of the circuit board 31 and extends along the width direction of the first surface S1 to the first side S4. The second portion 52 extends from the surface of the main board circuit board 311 to the side of the first side S4, and the bending portion 53 connects the first portion 51 and the second portion 52 above the first side S4. Since the extension directions of the first portion 51 and the second portion 52 are different, the bending portion 53 plays a role in connecting the first portion 51 and the second portion 52. In order to ensure the flatness of the overall structure of the circuit board assembly 30, the fourth avoiding gap 34 is provided to accommodate the bending portion 53, so as to avoid the bending portion 53 protruding from the circuit board assembly 30. Further, it is more convenient for the assembly of the circuit board assembly 30 and the frame 22, thereby facilitating the stability and reliability of the installation of the circuit board assembly 30.

[0148] The first portion 51 can be a board-to-board (BTB) connector at both ends of the FPC, which is a flexible connecting piece and can be deformed to flexibly adapt to the space layout, thereby facilitating the connection of the external connecting end and the main board circuit board 311. It can be known that the flexible electrical connection structure is not limited to establishing a connection through the BTB and electronic elements, for example, the elements of the electronic device 100 can be provided with a spring piece as a connecting end, the first portion of the flexible electrical connection structure can be directly exposed to copper to connect with the spring piece, or a conductive glue can be used to establish a connection, and the present embodiment does not make specific limitations. In some embodiments, the first portion 51 can be adhered to the circuit board 31, and the first portion 51 can also be welded to the circuit board 31.

[0149] The material of the flexible electrical connection structure can be liquid crystal polymer (LPC), polyimide (PI), modified polyimide (MPI), etc., as long as it can realize the function of circuit layout and has a certain bending ability.

[0150] Please continue to refer to Figure 19The circuit board assembly 30 further comprises an elastic connecting piece 60. When the circuit board assembly 30 is used as a side key circuit board 31 of the electronic device 100, for example, a volume circuit board 31, a switch circuit board 31 of the electronic device 100. The elastic connecting piece 60 is arranged corresponding to the side key on the outer surface of the shell to realize various functions of the electronic device 100. Based on the third surface S3 of the circuit board 31 being directly connected with the second inner wall surface 225, when the side key is pressed, the side key transmits the external force to the elastic connecting piece 60 on the circuit board 31, and the elastic connecting piece 60 transmits the force to the circuit board 31 after being stressed. Since the third surface S3 of the circuit board 31 is directly connected with the second inner wall surface 225, the second inner wall surface 225 can provide reliable support for the circuit board 31, thereby avoiding structural damage of the circuit board 31 when subjected to external force. Moreover, due to the support of the second inner wall surface 225, the elastic deformation of the circuit board 31 when subjected to force is also avoided, further avoiding the problem of the side key not contacting the elastic connecting piece 60 due to the elastic deformation of the circuit board 31, thereby ensuring the performance of the circuit board assembly 30.

[0151] In some other embodiments, the circuit board assembly 30 can also comprise the elastic connecting piece 60 when not used as the side key circuit board 31 of the electronic device 100. One side of the elastic connecting piece 60 can be connected to the circuit board 31 by welding, bonding, clamping or other fixing methods, and the other side of the elastic connecting piece 60 can abut against the first inner wall surface 224.

[0152] Please refer to Figure 20 and Figure 21 , Figure 20 the structural schematic view of the bracket 40 provided in some other embodiments of the present application; Figure 21 the structural schematic view of the bracket 40 in Figure 20 from the F3 angle. The bracket 40 further comprises a protruding part 421, which can be arranged on the second bracket part 42, can also be arranged on the third bracket part 43, and can also be arranged on both the second bracket part 42 and the third bracket part 43. The arrangement direction of the circuit board 31 and the bracket 40 is defined as the first direction, that is, the X-axis direction in Figure 20 , the protruding part 421 extends along the first direction and protrudes from the third surface S3 in the first direction. That is, the protruding part 421 extends from the bracket 40 to the circuit board 31 and protrudes from the third surface S3 of the circuit board 31. Please refer to Figure 22 and Figure 23 , Figure 22 the structural schematic view of the bracket 40 in Figure 21 connected with the circuit board 31 and installed in the accommodating groove 221; Figure 23 the structural schematic view of the bracket 40 in Figure 22The plan view of the circuit board 31 installed in the accommodating groove 221. In this way, after the circuit board assembly 30 is installed in the accommodating groove 221, the circuit board assembly 30 can be connected with the second inner wall surface 225 through the protruding portion 421 of the support 40. In the width direction of the electronic device 100, the circuit board assembly 30 is fixed in the accommodating groove 221 through the support 40, which improves the stability and reliability of the fixation of the circuit board assembly 30.

[0153] As the functions of the electronic device 100 gradually increase and the performance gradually improves, the electronic components 32 integrated on the circuit board 31 are more and more, and these electronic components 32 can be distributed on the opposite sides of the circuit board 31. That is, the circuit board 31 can be a double-sided board integrating the electronic components 32 on the opposite sides. Specifically, based on the above-mentioned support 40 including the protruding portion 421, please refer to Figure 24 , Figure 24 The structural schematic diagram of the circuit board assembly 30 provided for some other embodiments of the present application omits the support 40. The circuit board assembly 30 includes a first group of electronic components 32 and a second group of electronic components 32, the first group of electronic components 32 is arranged on the first surface S1, and the second group of electronic components 32 is arranged on the third surface S3. In this way, the performance of the electronic device 100 is further improved, and the diversity of the functions of the electronic device 100 is further improved.

[0154] The above embodiments are described by taking two supports 40 as an example, and one support 40 is described below. Please refer to Figure 25 , Figure 25 The structural schematic diagram of the circuit board assembly 30 provided for some other embodiments of the present application. When the length of the circuit board 31 is small, one support 40 can be arranged to fix the circuit board 31 in the accommodating groove 221, which is different from the above-mentioned embodiments. The support 40 of the present embodiment can not be arranged at the two ends of the circuit board 31, and the support 40 can be arranged in the central region of the circuit board 31, so as to more stably fix the circuit board assembly 30 in the accommodating groove 221. Here, the "central region" refers to a region with a distance from the edge of the circuit board 31 substantially equal. In order to avoid the connection between the support 40 and the circuit board 31 reducing the surface of the circuit board 31, causing the area of the circuit board 31 for bonding the electronic components 32 to be reduced, the avoiding slot 412a is arranged on the support 40, the opening of the avoiding slot 412a faces the first surface S1, and at least part of the electronic components 32 is accommodated in the avoiding slot 412a. In this way, the circuit board assembly 30 is connected to the accommodating groove 221 through the support 40, which improves the stability and reliability of the fixation of the circuit board assembly 30 in the electronic device 100. The support 40 also avoids the accommodation space for the installation of the electronic components 32, so as to arrange more electronic components 32 on the surface of the circuit board 31, and improve the compactness of the layout of the circuit board 31.

[0155] The above embodiments are described by taking the way of vertical layout of the circuit board 31 as an example. In some other embodiments, the support 40 can also be applied to the scenario of the way of planar layout of the circuit board 31. Please refer to Figure 26 , Figure 26 The structural schematic diagram of the support 40 provided by some embodiments of the present application installed in the accommodating groove 221 is shown. For example, the support 40 can also be connected to the mainboard circuit board 311. Specifically, the mainboard circuit board 311 includes a first surface S1 facing the support 40 and a third surface S3 facing the back cover 21. The mainboard circuit board 311 is fixed in the accommodating groove 221 through the support 40. When the circuit board assembly 30 is disassembled, force can be directly applied to the support 40, so as to avoid damage to the circuit board assembly 30, thereby ensuring the quality of the circuit board assembly 30 in use and maintenance and further ensuring the performance of the circuit board assembly 30.

[0156] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0157] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that, include: A circuit board, the circuit board including a first surface and a third surface facing away from each other; The first group of electronic components is disposed on the first surface; A bracket connected to the circuit board, the bracket including a first bracket portion located on the side facing the first surface and covering a portion of the first surface, wherein at least a portion of the first bracket portion facing away from the first surface is an elastic soft structure.

2. The circuit board assembly according to claim 1, characterized in that, The first support portion includes: A substrate portion, the substrate portion including a second surface and a fourth surface facing away from each other, the second surface facing the first surface; An elastic adhesive material is disposed on the fourth surface, and the elastic adhesive material forms the elastic soft structure.

3. The circuit board assembly according to claim 2, characterized in that, The circuit board also includes a first side surface that is in contact with the first surface, and the bracket also includes a second bracket portion located on the side facing the first side surface and disposed on the second surface.

4. The circuit board assembly according to claim 3, characterized in that, The circuit board also includes a second side surface that is in contact with both the first surface and the first side surface; The bracket also includes a third bracket portion disposed on the second surface, the third bracket portion being located on the side facing the second side.

5. The circuit board assembly according to claim 4, characterized in that, The circuit board is provided with a first positioning part, and the second surface is provided with a second positioning part that cooperates with the first positioning part. The first positioning part is a notch that penetrates the third side surface; the second positioning part is a protrusion that cooperates with the notch.

6. The circuit board assembly according to claim 5, characterized in that, The first side and the third side are arranged in a second direction. In the second direction, the bracket includes a seventh side and an eighth side facing away from each other. The seventh side is located on the side of the fourth side away from the third side, and the eighth side is located on the side of the fourth side away from the seventh side.

7. The circuit board assembly according to any one of claims 2-6, characterized in that, The second support portion also includes a fifth surface opposite to the second surface, wherein the distance from the third surface to the fourth surface is greater than or equal to the distance from the fifth surface to the fourth surface.

8. The circuit board assembly according to any one of claims 1-7, characterized in that, The circuit board assembly also includes a second set of electronic components disposed on the third surface.

9. The circuit board assembly according to any one of claims 1-8, characterized in that, The support has a second clearance notch at its edge.

10. An electronic device, characterized in that, include: A housing, the housing including a receiving groove, the receiving groove including opposing first inner wall surfaces and second inner wall surfaces; The circuit board assembly according to any one of claims 1-9, wherein the circuit board assembly is located within the receiving groove, and the arrangement direction of the support of the circuit board assembly and the circuit board of the circuit board assembly is consistent with the arrangement direction of the first inner wall surface and the second inner wall surface.

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