Substrate assembly

Abstract

The substrate assembly is provided, for example, with: a substrate which has a first surface facing a first direction and a second surface facing the opposite direction of the first direction on the opposite side of the first surface, and to which an optical transceiver having a first electrical interface facing the opposite direction of the first direction and a heat dissipation part is fixed; and a first heat dissipation mechanism having a connection portion adjacent to the heat dissipation portion in the first direction and thermally connected to the heat dissipation portion in a state in which the optical transceiver is fixed to the substrate, the first heat dissipation mechanism being fixed to the substrate, and the substrate assembly being configured so that the optical transceiver can be attached to and detached from the substrate in a state in which the first heat dissipation mechanism is fixed to the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate assembly. BACKGROUND

[0002] In the past, as an optical transceiver for a network switch device, a small optical transceiver described in Patent Literature 1 (for example, Patent Literature 1) is known.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Publication No. 2020-27147 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In a network switch device that implements CPO (co-packaged optics), a switch ASIC (application specific integrated circuit) and a plurality of optical transceivers are mounted on a substrate.

[0008] In this device, the optical transceivers are sometimes set to be attachable and detachable with respect to the substrate for maintenance, replacement.

[0009] On the other hand, with an increase in communication traffic, in such a network switch device, there is a tendency for not only the heat generation amount of the switch ASIC to increase, but also the heat generation amount of the optical transceivers to increase.

[0010] As a countermeasure thereto, in the case where a heat dissipation mechanism that dissipates heat generated by the optical transceivers is provided, it is important that the heat dissipation mechanism does not hinder the replacement of the optical transceivers.

[0011] Therefore, one of the problems to be solved by the present application is to obtain, for example, a new substrate assembly in which an optical transceiver is more easily attachable and detachable, as a substrate assembly that has a substrate on which the optical transceiver is mounted and a heat dissipation mechanism.

[0012] MEANS FOR SOLVING THE PROBLEMS

[0013] The substrate assembly of the present application, for example, has: a substrate having a first surface facing a first direction and a second surface facing a direction opposite to the first direction on a side opposite to the first surface, and the substrate is provided with an optical transceiver having a first electrical interface facing the direction opposite to the first direction and a heat dissipation portion; and a first heat dissipation mechanism having a connection portion adjacent to and thermally connected with the heat dissipation portion in the first direction in a state where the optical transceiver is fixed to the substrate, and the first heat dissipation mechanism is fixed to the substrate, and the substrate assembly is configured to be able to attach and detach the optical transceiver in a state where the first heat dissipation mechanism is fixed to the substrate.

[0014] In the substrate assembly, the optical transceiver can be provided to be detachable with respect to the substrate in the first direction, and the first heat dissipation mechanism can be provided to be offset with respect to the optical transceiver in a direction opposite to the first direction.

[0015] In the substrate assembly, the optical transceiver can be provided to be detachable with respect to the substrate in the first direction, and the first heat dissipation mechanism can be provided to be offset with respect to the optical transceiver in a direction intersecting the first direction.

[0016] In the substrate assembly, the optical transceiver can be provided to be detachable with respect to the substrate in the first direction, and the first heat dissipation mechanism can have a portion offset with respect to the optical transceiver in a direction opposite to the first direction and a portion offset with respect to the optical transceiver in a direction intersecting the first direction.

[0017] In the substrate assembly, the first heat dissipation mechanism can perform heat transfer based on a liquid refrigerant.

[0018] The substrate assembly can be configured to have a second heat dissipation mechanism thermally connected with a semiconductor integrated circuit mounted on the first surface, and the substrate assembly can be configured to be able to attach and detach the optical transceiver in a state where the second heat dissipation mechanism is fixed to the semiconductor integrated circuit.

[0019] In the substrate assembly, the second heat dissipation mechanism can perform heat transfer based on a liquid refrigerant.

[0020] In the substrate assembly, the first heat dissipation mechanism can perform heat transfer based on a liquid refrigerant, and a flow path of the liquid refrigerant of the first heat dissipation mechanism and a flow path of the liquid refrigerant of the second heat dissipation mechanism can be provided in parallel.

[0021] In the substrate assembly, the substrate can be configured to be able to fix a plurality of optical transceivers as the optical transceiver.

[0022] In the substrate assembly, the plurality of optical transceivers can be arranged along an edge of the substrate.

[0023] In the substrate assembly, the first heat dissipation mechanism can be arranged along an edge of the substrate.

[0024] In the substrate assembly, a second electrical interface fixed to the substrate and electrically connected to the first electrical interface can have a conductor and an insulator, the insulator having a lower thermal conductivity than the heat dissipation portion.

[0025] Effects of Invention

[0026] According to the present application, for example, as a substrate assembly provided with a substrate for mounting an optical transceiver and a heat dissipation mechanism, a new substrate assembly improved so that the optical transceiver can be more easily attached and detached can be obtained. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is an exemplary and schematic perspective view of a switch device of the first embodiment.

[0028] Figure 2 is an exemplary and schematic plan view of a switch device of the first embodiment.

[0029] Figure 3 is an exemplary and schematic side view of a portion of a switch device of the first embodiment.

[0030] Figure 4 is an exemplary and schematic cross-sectional view of Figure 2 of the first embodiment.

[0031] Figure 5 is an exemplary and schematic perspective view of a switch device of the second embodiment.

[0032] Figure 6 is an exemplary and schematic plan view of a switch device of the second embodiment.

[0033] Figure 7 is an exemplary and schematic cross-sectional view of a portion of a switch device of the second embodiment.

[0034] Figure 8 is an exemplary and schematic cross-sectional view of a portion of a switch device of the third embodiment.

[0035] Figure 9 is an exemplary and schematic exploded cross-sectional view of a portion of a switch device of the fourth embodiment. DETAILED DESCRIPTION

[0036] Hereinafter, exemplary embodiments and modifications of the present application will be disclosed. The structures of the embodiments and modifications shown hereinafter, and the effects and results (effects) obtainable by the structures are examples. The present application can be realized by structures other than the structures disclosed in the embodiments and modifications below. In addition, according to the present application, at least one of various effects (including derivative effects) obtainable by the structures can be obtained.

[0037] The embodiments and modifications below have the same constituent elements. Hereinafter, sometimes the same constituent elements are labeled with common reference numerals and repeated explanations are omitted.

[0038] In addition, in the present specification, ordinal numbers are assigned for the purpose of distinguishing directions, positions, members, mechanisms, and the like. In addition, the ordinal numbers do not indicate priority order, sequence, or specific number.

[0039] In addition, in each drawing, the X direction is indicated with an arrow X, the Y direction is indicated with an arrow Y, and the Z direction is indicated with an arrow Z. The X direction, the Y direction, and the Z direction cross each other and are orthogonal to each other.

[0040] [First Embodiment]

[0041] Figure 1 is a perspective view of the switch device 100A (100) of the first embodiment. Figure 2 is a plan view of the switch device 100A (100). Figure 3 is a side view of a part of the switch device 100A (100) when viewed in the Y direction along an arrow III of Figure 1 In addition, in the side view of Figure 4 is a cross-sectional view along IV-IV of Figure 2

[0042] As shown in Figure 1 , the switch device 100 is mounted on a motherboard 200. Note that in the present embodiment, only one switch device 100 is mounted on the motherboard 200, but a plurality of switch devices 100 can be mounted on the motherboard 200. The motherboard 200 can also be referred to as an integrated substrate.

[0043] As shown in Figure 1 , 2 , the switch device 100 includes a substrate 10, a switch ASIC 20, a plurality of optical transceivers 30, a heat dissipation mechanism 60 for the switch ASIC 20, a fixing mechanism 40 that fixes the optical transceivers 30 to the substrate 10, and a heat dissipation mechanism 50A (50) for the optical transceivers 30. The substrate 10, the fixing mechanism 40, and the heat dissipation mechanisms 50, 60 in the switch device 100 are referred to as a substrate assembly. The substrate assembly can be mounted on the motherboard 200.

[0044] As​Figure 2 The substrate 10 has a square shape (a quadrangular shape) as shown. In addition, the substrate 10 extends crossing and orthogonally to the Z direction, and has a plate shape, has a surface 10a facing the Z direction and a surface 10b facing the opposite direction of the Z direction on the side opposite to the surface 10a. The surfaces 10a, 10b extend crossing and orthogonally to the Z direction. The substrate 10 is, for example, a printed wiring board. The Z direction is an example of the first direction of the substrate 10, and can be referred to as the thickness direction of the substrate 10. In addition, the surface 10a is an example of the first surface, and the surface 10b is an example of the second surface. Figure 4

[0045] Figures 1 to 4 The optical transceivers 30 shown respectively receive optical signals transmitted in the optical fibers 32, and output electrical signals corresponding to the optical signals. The electrical signals output from the optical transceivers 30 are input to the switch ASIC 20 via the conductors provided to the receptacle 43 (refer to FIG. 1) and the substrate 10. The optical transceivers 30 have a photodiode array (not shown) as a plurality of light-receiving portions that receive optical signals. In addition, the optical transceivers 30 respectively receive electrical signals from the switch ASIC 20 via the conductors provided to the substrate 10 and the receptacle 43, and output optical signals corresponding to the electrical signals. The optical signals output from the optical transceivers 30 are coupled to the optical fibers 32, and are transmitted in the optical fibers 32. The optical transceivers 30 have, for example, a VCSEL array (not shown, VCSEL: vertical cavity surface emitting laser) as a plurality of light-emitting portions that output optical signals. Figure 4

[0046] As shown, the plurality of optical transceivers 30 are arranged along each side 10c of the substrate 10. In addition, in the present embodiment, as shown, the optical transceivers 30 are respectively mounted in a manner of covering the side 10c. In other words, in a case where the opposite side to the Z direction is observed, the optical transceivers 30 are respectively provided in a manner of straddling the side 10c, and have a portion located inside the side 10c and a portion located outside the side 10c. Thereby, the following advantages can be obtained: interference of the optical fibers 32 extending from the optical transceivers 30 with other components such as the switch ASIC 20 and the heat dissipation mechanism 60 mounted on the substrate 10, and the like can be easily avoided, or the substrate 10 can be configured to be smaller. Figure 2 Figure 4 In addition, as shown,

[0047] In addition, as shown, Figure 1 2 ​​​​As shown, the plurality of optical transceivers 30 are fixed to the substrate 10 with fixing mechanisms 40 provided at each edge 10c of the substrate 10. The fixing mechanisms 40 are provided at each of the four edges 10c, i.e., a total of four, and are shared for the plurality of (eight in this embodiment as an example) optical transceivers 30 arranged along the edges 10c. In this way, by the fixing mechanisms 40 shared for the plurality of optical transceivers 30, the mounting structure of the fixing mechanisms 40 to the substrate 10 can be simplified, or the number of components can be reduced, for example, as compared to a case where the optical transceivers 30 are fixed to the substrate 10 with respective fixing mechanisms, and further advantages can be obtained in that the man-hours and costs of manufacturing the switch device 100 can be suppressed.

[0048] As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example). Figure 1 2 As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example). Figure 4 As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example).

[0049] As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example). Figure 4 As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example).

[0050] As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example). Figure 3 4 As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example). Figure 4 As shown in FIG. 1, the switch ASIC 20 is mounted to the substrate 10 at a position away from the edges 10c of the substrate 10 (at the substantially central portion of the substrate 10 in this embodiment as an example).

[0051] Further, in order to enable replacement of the optical transceivers 30 after assembly, the fixing mechanisms 40 include a constituent element fixed to the substrate 10 and a constituent element detachable with respect to the substrate 10. In this embodiment, the intermediate member 42 and the receptacle 43 are fixed with respect to the substrate 10, and the upper member 41 is configured to be detachable with respect to the intermediate member 42, i.e., with respect to the substrate 10. Specifically, as shown in FIG. 1, the upper member 41 is configured to be detachable with respect to the intermediate member 42 by means of screws 46. Figure 4 ​​As shown, the upper member 41 is attached to the intermediate member 42 by a fixing member 46 configured as a screw. The optical transceiver 30 is detachable by moving in the Z direction and is attachable by moving in the opposite direction of the Z direction. The optical transceiver 30 is fixed to the substrate 10 in a detachable manner by the fixing mechanism 40 of such a structure.

[0052] In addition, in the present embodiment, the upper member 41 is not shared among all of the plurality of optical transceivers 30 along the edge 10c, but is shared only among two optical transceivers 30 adjacent along the edge 10c. Thereby, for example, the following advantages can be obtained: the easiness of individual detachment of the optical transceivers 30 and the sharing of components can be taken into account, and the influence of the deflection of the fixing mechanism 40, the manufacturing variation of the constituent elements of the fixing mechanism 40, the optical transceiver 30, and the like can be reduced, thereby further improving the positioning accuracy. However, such a structure is an example, and the upper member 41 can also be shared among all of the plurality of optical transceivers 30 along the edge 10c.

[0053] As shown, the optical transceiver 30 has a main body 31 and a plurality of optical fibers 32 (refer to FIG. 2). Figure 4 Figure 1 In the following description, the state in which the optical transceiver 30 is fixed to the substrate 10 is described unless specifically mentioned.

[0054] The main body 31 has a surface 31a facing the opposite direction of the Z direction. An electrical interface 31a1 in which an array (not shown) of a plurality of electrodes is disposed and a heat dissipation surface 31a2 are provided on the surface 31a. In the fixed state, both the electrical interface 31a1 and the heat dissipation surface 31a2 face the opposite direction of the Z direction, and are arranged in a direction substantially along the surface 10a of the substrate 10 and intersecting the edge 10c of the substrate 10 (in the X direction in the optical transceiver 30 shown in FIG. 1). Figure 4 The heat dissipation surface 31a2 is an example of a heat dissipation portion. The electrical interface 31a1 is an example of a first electrical interface.

[0055] The plurality of optical fibers 32 extend from the portion arranged in the Z direction with the heat dissipation surface 31a2 at a position separate from the surface 31a of the main body 31, specifically, at a position on the side opposite the heat dissipation surface 31a2. In addition, the plurality of optical fibers 32 extend from the main body 31 in the Z direction in the vicinity of the main body 31.

[0056] The socket 43, the intermediate member 42, and the upper member 41 are sequentially placed on the substrate 10.

[0057] The upper member 41 presses the main body 31 of the optical transceiver 30 toward the substrate 10, the socket 43 in the opposite direction of the Z direction. In addition, as shown in FIG. 1, the upper member 41 is pressed by the intermediate member 42 in the opposite direction of the Z direction. Figure 4 ​As shown, the upper member 41 is provided with an opening 41a as a cutout that penetrates the upper member 41 in the Z direction. A portion of the main body 31 is housed in the opening 41a, and the optical fiber 32 extends through the opening 41a.

[0058] The intermediate member 42 is provided with an opening 42a as a through hole that extends in the Z direction. The side surface of the opening 42a has a function of roughly guiding in the X direction and the Y direction when the main body 31 of the optical transceiver 30 is assembled.

[0059] The socket 43 is placed on the face 10a of the substrate 10, and supports the main body 31 of the optical transceiver 30. The socket 43 is provided with an electrical interface 43a and an opening 43b. The electrical interface 43a is an example of the second electrical interface.

[0060] The electrical interface 43a has a conductor 43a1 that faces and is electrically connected to the plurality of electrodes provided to the electrical interface 31a1 of the main body 31 of the optical transceiver 30. The conductor 43a1 can be configured as a contact terminal having a pin that can elastically stretch and contract in the Z direction, for example. The conductor 43a1 is electrically connected to a conductor (not shown) of the substrate 10. The electrodes of the electrical interface 31a1 of the optical transceiver 30 are electrically connected to the conductors of the switch ASIC 20 via the conductor 43a1 of the electrical interface 43a of the socket 43 and the conductor of the substrate 10. By providing the socket 43 having the electrical interface 43a, for example, as compared to the case where the electrical interface 43a is provided directly to the substrate 10, it is possible to obtain the advantage that it is possible to more easily construct a structure that can ensure the positioning accuracy required for the plurality of electrodes. Note that the thermal conductivity of the insulator 43a2 that is located around the conductor 43a1 and supports the conductor 43a1 in the electrical interface 43a is lower than the thermal conductivity of the heat dissipation face 31a2.

[0061] The opening 43b exposes the heat dissipation face 31a2 provided to the main body 31 of the optical transceiver 30 in the opposite direction of the Z direction. The opening 43b is provided as a through hole or a cutout that penetrates the socket 43 in the Z direction, for example.

[0062] The heat dissipation mechanism 50 releases the heat generated by the optical transceiver 30. The heat dissipation mechanism 50 is an example of the first heat dissipation mechanism. The heat dissipation mechanism 50 will be described later.

[0063] In addition, by Figure 2 , 4As is apparent, the heat dissipation surface 31a2 is located on the side opposite to the switch ASIC 20 with respect to the electrical interface 31a1. With such a configuration, for example, the following advantages can be obtained: the length of the conductor between the electrical interface 31a1 and the switch ASIC 20 can be further shortened, the transmission characteristics required for the electrical signal can be easily ensured accordingly, interference of the first heat dissipation mechanism with the conductor can be avoided, and the heat dissipation performance required for the optical transceiver 30 can be easily obtained.

[0064] [Heat dissipation mechanism of optical transceiver]

[0065] The heat dissipation mechanism 50 for the optical transceiver 30 has a connecting member 51, a base member 52, a cover member 53, and a sealing member 54. The heat dissipation mechanism 50 is fixed to the substrate 10 or the fixing mechanism 40 by a fixing member such as a screw, adhesion, or the like. Note that at least the connecting member 51 in the heat dissipation mechanism 50 can be configured to function as a part of the fixing mechanism 40.

[0066] The connecting member 51 is located on the side opposite to the intermediate member 42 with respect to the socket 43. The connecting member 51 has a portion 51a housed in the opening 43b of the socket 43. The portion 51a is adjacent to the heat dissipation surface 31a2 of the optical transceiver 30 in the Z direction and is thermally connected to the heat dissipation surface 31a2. The portion 51a is an example of a connecting portion.

[0067] The portion 51a is adjacent to the heat dissipation surface 31a2 with the thermally conductive sheet 47 having flexibility therebetween. By providing the thermally conductive sheet 47, the following advantages can be obtained: a gap between the heat dissipation surface 31a2 and the portion 51a due to manufacturing variation, a difference in thermal expansion coefficient between components, or the like can be suppressed, and thus the heat transfer efficiency from the heat dissipation surface 31a2 to the portion 51a can be reduced, or excessive pressing force between the heat dissipation surface 31a2 and the portion 51a can be suppressed.

[0068] In addition, the connecting member 51 is thermally connected to the base member 52 at a position different from the portion 51a. Thus, the connecting member 51 can transfer the heat generated by the optical transceiver 30 to the base member 52. The connecting member 51 can also be referred to as a heat transfer member.

[0069] The base member 52 is disposed on the side opposite to the optical transceiver 30 and the socket 43 with respect to the connecting member 51, extends in a substantially rectangular shape and in a circumferential shape (annular shape) along the edge 10c of the substrate 10 with a substantially constant width in the direction along the surface 10b and a substantially constant thickness in the Z direction.

[0070] The lid member 53 is provided on the side opposite to the connecting member 51 with respect to the base member 52, extends in a substantially rectangular shape and a peripheral shape (annular shape) along the edge 10c of the substrate 10 with substantially the same width as the base member 52 in the direction along the surface 10b and a substantially constant thickness in the Z direction.

[0071] The connecting member 51, the base member 52, and the lid member 53 are each made of a material having a relatively high thermal conductivity. As the material having a relatively high thermal conductivity constituting these members, for example, a copper-based material such as pure copper or a copper alloy, an aluminum-based material such as pure aluminum or an aluminum alloy, or the like can be given.

[0072] As shown in Figure 4 , the base member 52 and the lid member 53 are internally formed with a housing chamber R1 that houses a liquid refrigerant. The housing chamber R1 is formed by butting a peripheral groove portion 52a provided in the base member 52, which is recessed in the Z direction, against a peripheral groove portion 53a provided in the lid member 53, which is recessed in the opposite direction of the Z direction. Note that the recessed portion can be provided in only one of the base member 52 and the lid member 53. In addition, the arrangement and shape of the base member 52 and the lid member 53 that form the housing chamber R1 are not limited to Figure 4 the example shown in the drawing, and can be implemented by various modifications. The base member 52 and the lid member 53 can also be referred to as refrigerant housing portions.

[0073] In the present embodiment, the base member 52, the lid member 53, the groove portion 52a, the groove portion 53a, and the housing chamber R1 extend in a substantially rectangular shape and a peripheral shape (annular shape) along the edge 10c of the substrate 10. In addition, the connecting member 51 extends in a line segment shape along the edge 10c of the substrate 10 at a position where the plurality of optical transceivers 30 overlap in the Z direction.

[0074] At the boundary surface of the base member 52 and the lid member 53, with respect to the peripheral housing chamber R1, the inner peripheral side (the right side in Figure 4 ) and the outer peripheral side (the left side in Figure 4 ) are each ensured to be liquid-tight by independent annular sealing members 54. The sealing members 54 are each made of an elastomer, for example. The sealing members 54 are each housed in a peripheral groove 52c provided in the base member 52, and are elastically compressed in the Z direction by the base member 52 and the lid member 53 in a state where the base member 52 and the lid member 53 are integrated, thereby ensuring a sealing surface pressure.

[0075] The housing chamber R1 is provided so as to at least partially overlap the heat dissipation surface 31a2 of the optical transceiver 30 and the portion 51a of the connecting member 51 in the Z direction.

[0076] Further, the base member 52 is provided with a plurality of projections 52b in the shape of fins or pins that project into the housing chamber Rl from the inner surface of the side of the housing chamber Rl that is proximate to the proximity light transceiver 30. By the projections 52b, the contact area of the base member 52 with the liquid refrigerant is increased. Thus, compared to a case in which the projections 52b are not provided, the amount of heat transfer from the base member 52 to the liquid refrigerant can be increased, and the heat dissipation efficiency based on the heat dissipation mechanism 50 can be further improved.

[0077] As shown in FIG. 1, the heat dissipation mechanism 50 is provided with two connection ports 50a that connect flow path constituting members that constitute a flow path of the liquid refrigerant like a pipe or a conduit. One of the two connection ports 50a forms an inlet of the liquid refrigerant, and the other forms an outlet of the liquid refrigerant. The two connection ports 50a are connected to a heat exchange portion (heat dissipation portion) via the flow path constituting members. That is, the heat dissipation mechanism 50 is an example of a heat transport mechanism that performs heat transport using the liquid refrigerant. Figure 1

[0078] [Heat dissipation mechanism for switch ASIC]

[0079] The heat dissipation mechanism 60 for the switch ASIC 20 has a connection member 61, a base member 62, a cover member 63, and a sealing member 64. The heat dissipation mechanism 60 is fixed to the substrate 10 or the fixing mechanism 40 by a fixing member such as a screw, adhesion, or the like.

[0080] The connection member 61 is located on the side opposite to the substrate 10 with respect to the switch ASIC 20. The connection member 61 is thermally connected to the switch ASIC 20 and is thermally connected to the base member 62 on the side opposite to the switch ASIC 20. Thus, the connection member 61 can transfer heat generated by the switch ASIC 20 to the base member 62. The connection member 61 can also be referred to as a heat transfer member.

[0081] The base member 62 has a shape that is a quadrangle shape that intersects and is orthogonal to the Z direction and is a plate shape.

[0082] Further, the cover member 63 is located on the side opposite to the connection member 61 with respect to the base member 62 and has a shape that is a quadrangle shape that intersects and is orthogonal to the Z direction and is a plate shape.

[0083] The connection member 61, the base member 62, and the cover member 63 are each made of a material having a relatively high thermal conductivity. As the material having a relatively high thermal conductivity that constitutes these members, for example, a copper-based material such as pure copper or a copper alloy, an aluminum-based material such as pure aluminum or an aluminum alloy, or the like can be given.

[0084] As shown in FIG. 1, the heat dissipation mechanism 50 is provided with two connection ports 50a that connect flow path constituting members that constitute a flow path of the liquid refrigerant like a pipe or a conduit. One of the two connection ports 50a forms an inlet of the liquid refrigerant, and the other forms an outlet of the liquid refrigerant. The two connection ports 50a are connected to a heat exchange portion (heat dissipation portion) via the flow path constituting members. That is, the heat dissipation mechanism 50 is an example of a heat transport mechanism that performs heat transport using the liquid refrigerant. Figure 4 ​As shown, the base member 62 and the cover member 63 have a housing chamber R2 for containing liquid refrigerant inside. The housing chamber R2 is formed by abutting a recess 62a, which is recessed in the opposite direction to the Z-direction, on the base member 62, with the cover member 63 covering the recess 62a. It should be noted that the recess may be provided on the cover member 63, or on both the base member 62 and the cover member 63. In addition, the arrangement and shape of the base member 62 and the cover member 63 forming the housing chamber R2 are not limited to... Figure 4 Examples can be implemented through various modifications. The base component 62 and the cover component 63 can also be referred to as refrigerant containment sections.

[0085] At the boundary surface between the base member 62 and the cover member 63, on the outer periphery of the receiving chamber R2 (in Figure 4 (Left side in the middle) Liquid tightness is ensured by a circumferential sealing member 64. The sealing member 64 is made of, for example, an elastomer. The sealing member 64 is housed in a circumferential groove 62c provided in the base member 62. When the base member 62 and the cover member 63 are integrated, the sealing member 64 is elastically compressed in the Z direction by means of the base member 62 and the cover member 63, ensuring the sealing surface pressure.

[0086] The containment chamber R2 is configured to at least partially overlap with the switch ASIC20 and the connecting member 61 in the Z direction.

[0087] Furthermore, the base member 62 is provided with a plurality of fin-shaped or pin-shaped protrusions 62b protruding into the housing R2 from the inner surface of the housing R2 on the side closest to the switch ASIC 20. The protrusions 62b increase the contact area between the base member 62 and the liquid refrigerant. Therefore, compared to the case where the protrusions 62b are not provided, the heat transfer from the base member 62 to the liquid refrigerant can be increased, further improving the heat dissipation efficiency based on the heat dissipation mechanism 60.

[0088] like Figure 1 As shown, the heat dissipation mechanism 60 has two connection ports 60a, which are connected to a flow path component that forms a flow path for the liquid refrigerant, such as a pipe or conduit. One of the two connection ports 60a forms an inlet for the liquid refrigerant, and the other forms an outlet for the liquid refrigerant. The two connection ports 60a are connected to a heat exchange section (heat dissipation section) via the flow path component. That is, the heat dissipation mechanism 60 is an example of a heat transfer mechanism that utilizes liquid refrigerant for heat transfer.

[0089] The flow paths of the liquid refrigerant in the heat dissipation mechanism 50 and the heat dissipation mechanism 60 are preferably arranged in parallel. This configuration further improves heat dissipation efficiency compared to a configuration where the flow paths of the heat dissipation mechanisms 50 and 60 are connected in series.

[0090] In this case, as described above, the optical transceiver 30 is configured to be detachable in the Z direction with respect to the substrate 10. In contrast, the heat dissipation mechanism 50 is configured to be offset in the opposite direction of the Z direction with respect to the optical transceiver 30. Therefore, the heat dissipation mechanism 50 does not hinder the attachment and detachment of the optical transceiver 30 in a state fixed with respect to the substrate 10.

[0091] On the other hand, the heat dissipation mechanism 60 is configured to be offset in a direction intersecting the Z direction with respect to the optical transceiver 30. Therefore, the heat dissipation mechanism 60 does not hinder the attachment and detachment of the optical transceiver 30 in a state fixed with respect to the substrate 10.

[0092] As described above, according to the switch device 100A (100) of the present embodiment, for example, the following effect can be obtained: the attachment and detachment of the optical transceiver 30 can be performed more easily or more quickly without being hindered by the heat dissipation mechanisms 50, 60 in a state in which the heat dissipation mechanisms 50, 60 are fixed with respect to the substrate 10.

[0093] [Second Embodiment]

[0094] Figure 5 is a perspective view of a switch device 100B (100) of a second embodiment. Figure 6 is a plan view of the switch device 100B (100). Figure 7 is a cross-sectional view of the switch device 100B (100) at a position equivalent to Figure 4 .

[0095] The Figure 5 , 6 and Figure 1 , 2 comparing the switch device 100B has the same plurality of optical transceivers 30, the fixing mechanism 40, and the heat dissipation mechanism 60 as in the first embodiment described above. In addition, the substrate 10 is also the same as in the first embodiment described above. Therefore, in the present embodiment, the heat dissipation mechanism 60 also does not hinder the attachment and detachment of the optical transceiver 30.

[0096] However, in the present embodiment, the heat dissipation mechanism 50B (50) is different from the heat dissipation mechanism 50A (50) of the first embodiment described above. Specifically, as Figure 7 indicated, the shapes of the base member 52 and the cover member 53 that constitute the accommodation chamber R1 of the liquid refrigerant are different. Note that the connection member 51 is the same as in the first embodiment described above.

[0097] In the present embodiment, the base member 52 and the cover member 53 also form the accommodation chamber R1 that accommodates the liquid refrigerant. However, in the present embodiment, the accommodation chamber R1 is located on the side opposite the center of the substrate 10 with respect to the substrate 10, the optical transceiver 30, the intermediate member 42, the socket 43, and the connection member 51.

[0098] The base member 52 is disposed on the side opposite to the center of the substrate 10 with respect to the connecting member 51, the socket 43, and the intermediate member 42. The base member 52 extends in a substantially rectangular shape and in a circumferential shape (annular shape) with a substantially constant width in the direction along the surface 10b and a substantially constant thickness in the Z direction at a position away from the edge 10c of the substrate 10, substantially along the edge 10c. In addition, the base member 52 is in contact with the connecting member 51, is thermally connected to the connecting member 51, and is also in contact with the intermediate member 42 of the fixing mechanism 40, is thermally connected to the intermediate member 42.

[0099] The base member 52 is provided with a plurality of protrusions 52b in the shape of fins or pins that protrude into the housing chamber R1 from the inner surface of the side of the housing chamber R1 that is close to the optical transceiver 30.

[0100] In addition, the cover member 53 is disposed on the side opposite to the connecting member 51, that is, the outer circumferential side, with respect to the base member 52, extends in a substantially rectangular shape and in a circumferential shape (annular shape) with a substantially constant thickness in the direction along the surface 10b and a substantially same thickness in the Z direction as the base member 52, substantially along the edge 10c of the substrate 10.

[0101] Note that the arrangement and shape of the base member 52 and the cover member 53 that form the housing chamber R1 are not limited to Figure 7 the example shown in FIG. 10, and various modifications can be made to implement.

[0102] As described above, the optical transceiver 30 is disposed so as to be detachable in the Z direction with respect to the substrate 10. In this regard, in the present embodiment, the connecting member 51 is located at a position offset in the direction opposite to the Z direction with respect to the optical transceiver 30, and the base member 52 and the cover member 53 that constitute the refrigerant housing portion that houses the refrigerant are located at positions offset in the direction intersecting the Z direction with respect to the optical transceiver 30. That is, the heat dissipation mechanism 50B (50) has a portion offset in the direction opposite to the Z direction with respect to the optical transceiver 30 and a portion offset in the direction intersecting the Z direction with respect to the optical transceiver 30. The heat dissipation mechanism 50B (50) having such a structure does not hinder the attachment and detachment of the optical transceiver 30 even in a state fixed with respect to the substrate 10.

[0103] Therefore, according to the switch device 100B (100) of the present embodiment, for example, the following effect can be obtained: the attachment and detachment of the optical transceiver 30 can be performed more easily or more quickly without being hindered by the heat dissipation mechanism 50, 60 in a state in which the heat dissipation mechanism 50, 60 is fixed with respect to the substrate 10.

[0104] [Third Embodiment]

[0105] Figure 8 is a portion of the switch device 100C (100) of the third embodiment, andFigure 4 Cross-sectional view at an equivalent position.

[0106] In the present embodiment, the mechanism for fixing the optical transceiver 30 with respect to the substrate 10 is different from those of the above-described first and second embodiments. Specifically, in the present embodiment, the magnet 70a provided to the socket 431 and the magnet 70b provided to the optical transceiver 30 face each other, and constitute an adsorption mechanism based on magnetic force. The magnetic force is set to a size that enables the optical transceiver 30 to be detached from the socket 43 by a force applied by an operator or a robot. Note that the magnet 70a can also be provided to a position different from the socket 43.

[0107] According to such a structure, for example, the following effects can be obtained: the attachment and detachment of the optical transceiver 30 can be performed more easily or more quickly, and the upper member 41 and the fixing member 46 are not needed, and accordingly the switch device 100C can be constituted more compactly, more lightweightly, or more simply, and further the man-hours and costs required for the manufacture of the switch device 100 can be reduced.

[0108] [Fourth Embodiment]

[0109] Figure 9 is a part of the switch device 100D (100) of the fourth embodiment, and is a cross-sectional view at an equivalent position. Figure 4 Exploded cross-sectional view at an equivalent position.

[0110] In the present embodiment, the mechanism for fixing the upper member 41 with respect to the intermediate member 42 is different from those of the above-described first to third embodiments. Specifically, in the present embodiment, the magnet 70c provided to the intermediate member 42 and the magnet 70d provided to the upper member 41 face each other, and constitute an adsorption mechanism based on magnetic force. The magnetic force is set to a size that enables the upper member 41 to be detached from the intermediate member 42 by a force applied by an operator or a robot.

[0111] According to such a structure, for example, the following effects can be obtained: the attachment and detachment of the upper member 41 and the optical transceiver 30 can be performed more easily or more quickly, and the fixing member 46 is not needed, and accordingly the switch device 100D can be constituted more compactly, more lightweightly, or more simply, and further the man-hours and costs required for the manufacture of the switch device 100 can be reduced.

[0112] The above-described embodiments are examples, and are not intended to limit the scope of the application. The above-described embodiments can be implemented in various other ways, and various omissions, substitutions, combinations, modifications can be made within the scope of the gist of the application. In addition, each of the specifications (structure, kind, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed to implement.

[0113] For example, it is known that even if the first heat dissipation mechanism has a structure that is offset relative to the optical transceiver in a direction intersecting with the first direction, it will not hinder the loading and unloading of the optical transceiver.

[0114] Industrial availability

[0115] This invention can be used in substrate assemblies.

[0116] Explanation of reference numerals in the attached figures:

[0117] 10… Substrate (Substrate Assembly)

[0118] 10a… (First page)

[0119] 10b… (Second side)

[0120] 10c…side

[0121] 20… Switch ASIC (Semiconductor Integrated Circuit)

[0122] 30… Optical transceiver

[0123] 31…Main Body

[0124] 31a…

[0125] 31a1… Electrical Interface (First Electrical Interface)

[0126] 31a2… Heat dissipation surface (heat dissipation section)

[0127] 32… fiber optic

[0128] 40… Fixed mechanism

[0129] 41… Upper component

[0130] 41a…opening

[0131] 42…Intermediate components

[0132] 42a…opening

[0133] 43… socket

[0134] 43a… Electrical interface (second electrical interface)

[0135] 43a1… conductor

[0136] 43a2…Insulator

[0137] 43b…open

[0138] 46…fasteners

[0139] 47… Thermal conductive sheet

[0140] 50, 50A, 50B … heat dissipation mechanism (first heat dissipation mechanism, substrate assembly)

[0141] 50a … connection port

[0142] 51 … connection member

[0143] 51a … part (connection part)

[0144] 52 … base member

[0145] 52a … groove part

[0146] 52b … protrusion

[0147] 52c … slot

[0148] 53 … cover member

[0149] 53a … groove part

[0150] 54 … sealing member

[0151] 60 … heat dissipation mechanism (second heat dissipation mechanism, substrate assembly)

[0152] 60a … connection port

[0153] 61 … connection member

[0154] 62 … base member

[0155] 62a … recess

[0156] 62b … protrusion

[0157] 62c … slot

[0158] 63 … cover member

[0159] 64 … sealing member

[0160] 70a to 70d … magnets

[0161] 100, 100A to 100D … switch device

[0162] 200 … motherboard

[0163] R1 … accommodation chamber

[0164] R2 … accommodation chamber

[0165] X … direction

[0166] Y … direction

[0167] Z … direction (first direction)

Claims

1. A substrate assembly comprising: a substrate having a first surface facing a first direction and a second surface facing a direction opposite to the first direction on a side opposite to the first surface, and the substrate is provided with an optical transceiver having a first electrical interface facing the direction opposite to the first direction and a heat dissipating portion; and a first heat dissipating mechanism having a connecting portion adjacent to and thermally connected with the heat dissipating portion in the first direction in a state where the optical transceiver is fixed to the substrate, and the first heat dissipating mechanism is fixed to the substrate, the substrate assembly being configured to be able to attach and detach the optical transceiver in a state where the first heat dissipating mechanism is fixed to the substrate.

2. The substrate assembly according to claim 1, wherein the optical transceiver is disposed to be able to be detached in the first direction with respect to the substrate, and the first heat dissipating mechanism is disposed to be offset in a direction opposite to the first direction with respect to the optical transceiver.

3. The substrate assembly according to claim 1, wherein the optical transceiver is disposed to be able to be detached in the first direction with respect to the substrate, and the first heat dissipating mechanism is disposed to be offset in a direction intersecting the first direction with respect to the optical transceiver.

4. The substrate assembly according to claim 1, wherein the optical transceiver is disposed to be able to be detached in the first direction with respect to the substrate, and the first heat dissipating mechanism has a portion offset in a direction opposite to the first direction with respect to the optical transceiver and a portion offset in a direction intersecting the first direction with respect to the optical transceiver.

5. The substrate assembly according to claim 1, wherein the first heat dissipating mechanism performs heat transport based on a liquid refrigerant.

6. The substrate assembly according to claim 1, wherein the substrate assembly is provided with a second heat dissipating mechanism thermally connected with a semiconductor integrated circuit mounted on the first surface, and the substrate assembly is configured to be able to attach and detach the optical transceiver in a state where the second heat dissipating mechanism is fixed to the semiconductor integrated circuit.

7. The substrate assembly according to claim 6, wherein the second heat dissipating mechanism performs heat transport based on a liquid refrigerant.

8. The substrate assembly according to claim 7, wherein the first heat dissipating mechanism performs heat transport based on a liquid refrigerant, and a flow path of the liquid refrigerant of the first heat dissipating mechanism is disposed in parallel with a flow path of the liquid refrigerant of the second heat dissipating mechanism.

9. The substrate assembly according to claim 1, wherein the substrate is configured to be able to fix a plurality of optical transceivers as the optical transceiver.

10. The substrate assembly according to claim 9, wherein the plurality of optical transceivers are arranged along an edge of the substrate.

11. The substrate assembly according to claim 10, wherein the first heat dissipating mechanism is arranged along the edge of the substrate.

12. The substrate assembly according to claim 1, wherein a second electrical interface fixed to the substrate and electrically connected with the first electrical interface has a conductor and an insulator, and a thermal conductivity of the insulator is lower than that of the heat dissipating portion. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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