Cleaning equipment for silicon wafer processing

Abstract

The invention discloses cleaning equipment for silicon wafer processing, and relates to the technical field of silicon wafer processing and cleaning, the cleaning equipment comprises a base, the side surface of the base at one end is fixedly connected with a mounting seat, and the side surface of the base at the other end is fixedly connected with a heating bin; communicated roller conveyors are mounted above the mounting base, the heating bin and the cleaning tank, a drying mechanism is arranged in the heating bin, a steam cleaning mechanism is arranged in the mounting base, a protective cover is arranged at the top of the mounting base and the top of the base, and a cleaning mechanism is arranged in the protective cover; the cleaning mechanism comprises a cleaning pipe and spraying heads, the cleaning pipe shaped like a Chinese character'hui 'is installed above the cleaning tank and located in the protective cover, the spraying heads are connected to the lower portion of the cleaning pipe, and silicon wafers in the cleaning tank are cleaned through spraying of the spraying heads. And the cleaning efficiency and the cleanliness of the surface of the silicon wafer are obviously improved.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing and cleaning technology, and more particularly to cleaning equipment for silicon wafer processing. Background Technology

[0002] In the semiconductor manufacturing industry, silicon wafers are the basic material for integrated circuits, and the surface cleanliness of silicon wafers is crucial to the performance and reliability of chips. With the continuous advancement of technology, the requirements for silicon wafer cleaning equipment are becoming increasingly stringent.

[0003] A search revealed that CN 113182243 B discloses a photovoltaic silicon wafer cleaning device. This invention utilizes a front-end limiting mechanism and a rear-end limiting mechanism to provide effective support and limiting when the fixing mechanism is placed inside the sealing mechanism, thereby ensuring the overall stability of the fixing mechanism during placement and use. The water supply seat can be moved back and forth to quickly connect the joints, thereby improving the cleaning efficiency. Its design is reasonable, but there are still some shortcomings in the structural design.

[0004] In the existing technology, silicon wafer cleaning equipment may cause scratches, micro-cracks or even breakage on the surface of silicon wafers due to physical rinsing and fixing during the cleaning process, which seriously reduces the utilization rate of silicon wafers and product quality. Secondly, most existing cleaning equipment adopts liquid immersion or spraying methods. Although this method can effectively remove most of the contaminants on the surface of silicon wafers, it is not effective for some difficult-to-remove micro-particles or organic residues. Summary of the Invention

[0005] The present invention proposes a cleaning device for silicon wafer processing, which solves the problems of easy damage to silicon wafers, limited cleaning methods, and poor cleaning effect of existing silicon wafer cleaning devices.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A cleaning device for silicon wafer processing includes a base, a mounting seat fixedly connected to one side of the base, and a heating chamber fixedly connected to the other side of the base. A cleaning tank is provided inside the base, and a roller conveyor is installed above the mounting seat, the heating tank, and the cleaning tank. A drying mechanism is provided inside the heating tank, and a steam cleaning mechanism is provided inside the mounting seat. A protective cover is provided on the top of the mounting seat and the base, and a cleaning mechanism is provided inside the protective cover.

[0008] The cleaning mechanism includes a cleaning pipe and spray heads. A U-shaped cleaning pipe is installed above the cleaning tank inside the protective cover. Several sets of spray heads are connected below the cleaning pipe, and the silicon wafers inside the cleaning tank are cleaned by spraying water through the spray heads.

[0009] Preferably, the mounting base is fixedly connected with a support frame outside the heating bin, and the roller conveyor is installed at the inside of the support frame.

[0010] Preferably, the drying mechanism comprises a drying cover, a heat dissipation hole, a heating box, a heating plate, a blower, and a connecting pipe, and the drying cover is installed on the top of the heating bin, and the heat dissipation holes are arranged on the two sides of the inside of the heating bin.

[0011] Preferably, the heating box is installed on the top of the protective cover at one end, and the heating box is provided with a plurality of heating plates inside, and the blower is fixedly installed on the side of the heating box, and the blower, the heating box, and the drying cover are connected in series through the connecting pipe.

[0012] Preferably, the steam cleaning mechanism comprises a steam generator, a steam pipeline, an air outlet, and a conveying pipe, and the steam pipelines are installed on the upper and lower sides of the roller conveyor inside the mounting base, and the steam pipelines are provided with a plurality of air outlets on the side.

[0013] Preferably, the steam generator is installed on the top of the protective cover at the other end, and the steam generator is connected to the steam pipelines through the conveying pipe.

[0014] Preferably, the water tank is installed on the upper middle part of the protective cover, and the water tank is provided with a water inlet on the top.

[0015] Preferably, the cleaning mechanism further comprises a high-pressure water pump, a high-pressure water supply pump, a water supply pipe, and a water suction pipe, and the high-pressure water pump is connected to the side of the water tank at one end, and the high-pressure water pump is connected to the inside of the cleaning tank through the water suction pipe.

[0016] Preferably, the high-pressure water supply pump is connected to the side of the water tank at the other end, and the high-pressure water supply pump is connected to the cleaning pipe through the water supply pipe.

[0017] Preferably, the mounting base is installed with a plurality of support tops at the bottom of the heating bin.

[0018] Preferably, the cleaning method using the cleaning device is as follows:

[0019] Step one, place the silicon wafer to be cleaned on the surface of the roller conveyor in sequence, and the roller conveyor transports the silicon wafer to the inside of the mounting base, and generates steam through the steam generator, and cleans through the conveying pipe, the steam pipeline, and the air outlet;

[0020] Step two, the preliminarily cleaned silicon wafer is immersed into the cleaning tank through the roller conveyor, and then the high-pressure water pump extracts the cleaning liquid to clean the silicon wafer in the cleaning tank through the cleaning pipe and the spray head;

[0021] Step 3: After cleaning in Steps 1 and 2, the silicon wafers are transported to the heating chamber via a roller conveyor. A blower, in conjunction with the heating box and drying hood, quickly dries the silicon wafers.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] 1. The silicon wafer processing cleaning equipment has interconnected roller conveyors installed above the mounting base, heating chamber, and cleaning tank. The silicon wafers are transported by the roller conveyors, which reduces collisions and contact between the silicon wafers during the cleaning process, thereby reducing damage. At the same time, the rollers of the roller conveyors are wrapped with soft materials to reduce direct contact with the silicon wafers.

[0024] 2. By adjusting the conveyor speed and acceleration, the impact caused by sudden stops and starts is avoided, ensuring safety during the silicon wafer cleaning process. In addition, the cleaning equipment adopts a steam cleaning method, which is carried out in a non-contact manner, avoiding physical damage to the silicon wafer surface caused by traditional mechanical rinsing and reducing the risk of silicon wafer breakage.

[0025] 3. The mounting base is equipped with a steam cleaning mechanism. First, the steam generated by the steam generator is used for preheating and initial cleaning. The high temperature and high energy of the steam help soften and remove stains from the surface of the silicon wafer. Compared with traditional liquid cleaning, it saves water resources. The high permeability of the steam can penetrate into the tiny crevices on the surface of the silicon wafer, improving cleaning efficiency and quality. Then, the silicon wafer is transported into the cleaning tank for liquid immersion by a roller conveyor. At the same time, it is sprayed with high-pressure cleaning fluid to deeply clean the silicon wafer, which can effectively remove residual stains and impurities, ensure the consistency and stability of the cleaning effect, and significantly improve the cleaning effect. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the present invention.

[0027] Figure 2 This is a cross-sectional structural diagram of the present invention.

[0028] Figure 3 This is a schematic diagram of the exploded structure of the present invention.

[0029] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle.

[0030] Figure 5 This is a schematic diagram of the exploded structure from another perspective of the present invention.

[0031] Figure 6 For the present invention Figure 5 Enlarged view of section B in the middle.

[0032] The figure label: 1, base; 2, mounting seat; 3, heating bin; 4, cleaning tank; 5, roller conveyor; 6, protective cover; 7, cleaning pipe; 8, spray head; 9, support frame; 10, drying cover; 11, heat dissipation hole; 12, heating box; 13, heating plate; 14, air blower; 15, connecting pipe; 16, steam generator; 17, steam pipeline; 18, air outlet; 19, conveying pipe; 20, water tank; 21, water inlet; 22, high-pressure water pump; 23, high-pressure water pump; 24, water conveying pipe; 25, water suction pipe; 26, support top. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0034] Embodiment one

[0035] Referring to Figures 1-6 , the present application provides a technical solution: a cleaning equipment for silicon wafer processing, comprising a base 1, one end of the base 1 is fixedly connected with a mounting seat 2 on the side surface, and the other end of the base 1 is fixedly connected with a heating bin 3 on the side surface, a cleaning tank 4 is formed in the inside of the base 1, and the mounting seat 2, the heating bin 3 and the cleaning tank 4 are all provided with a roller conveyor 5 in communication above them, the roller of the roller conveyor 5 is wrapped with soft material to reduce direct contact with the silicon wafer during conveying and cause damage to the silicon wafer, and a steam cleaning mechanism is arranged in the inside of the mounting seat 2, the mounting seat 2 and the top of the base 1 are provided with a protective cover 6, and the inside of the protective cover 6 is provided with a cleaning mechanism.

[0036] Referring to Figure 2 , Figure 3 , the steam cleaning mechanism comprises a steam generator 16, a steam pipeline 17, an air outlet 18 and a conveying pipe 19, steam pipelines 17 are arranged on both sides of the roller conveyor 5 in the inside of the mounting seat 2, a plurality of groups of air outlets 18 are formed in the side surface of the steam pipeline 17, a steam generator 16 is arranged on the top of the other end of the protective cover 6, the steam generator 16 can adopt a DZFS-660 type, and the steam generator 16 is connected to the steam pipelines 17 through the conveying pipe 19 on the side surface, and the steam cleaning mechanism has the advantage of non-contact cleaning mode, which avoids damage to the silicon wafer caused by mechanical friction, and the high permeability of steam can penetrate into the small gaps on the surface of the silicon wafer, thereby improving the cleaning efficiency and quality.

[0037] Referring to Figure 1The mounting base 2 and the heating chamber 3 are fixedly connected to the support frame 9, and the roller conveyor 5 is installed inside the support frame 9 at both ends. Several sets of support tops 26 are installed at the bottom of the mounting base 2 and the heating chamber 3. The support frame 9 and the support tops 26 provide support for the cleaning equipment and ensure the stability of the cleaning equipment during the cleaning process.

[0038] In specific implementation, a silicon wafer processing cleaning device is used. First, the cleaning device is placed in a suitable working area using the support top 26 and support frame 9. Then, the roller conveyor 5 is started, and the silicon wafers are placed on the surface of the roller conveyor 5 in sequence. The silicon wafers are then conveyed by the roller conveyor 5 and enter the mounting base 2. Next, the steam generator 16 is started. The steam generator 16 delivers the generated high-temperature steam to the steam pipe 17 through the conveying pipe 19, and then sprays it onto the surface of the silicon wafer at high speed and in a fine mist through the air outlet 18. Because the steam has high energy and penetrability, it can effectively remove small particles, organic matter and some metal impurities from the surface of the silicon wafer. Thus, the surface of the silicon wafer can be preheated and initially cleaned by the steam. The high temperature and high energy characteristics of the steam soften and peel off the stains on the surface of the silicon wafer, while also reducing the amount of cleaning fluid used. Through the above operation, the cleaning efficiency and quality are improved. The non-contact cleaning method also further reduces physical damage to the surface of the silicon wafer.

[0039] Example 2

[0040] Reference Figure 5 , Figure 6 This embodiment is an optimization based on the first embodiment. The cleaning mechanism includes a cleaning pipe 7 and a spray head 8. The cleaning pipe 7 in a U-shape is installed above the cleaning tank 4 inside the protective cover 6. Several sets of spray heads 8 are connected below the cleaning pipe 7. The silicon wafers inside the cleaning tank 4 are cleaned by spraying through the spray heads 8. The spray heads 8 spray out in a fine mist to further clean the surface of the silicon wafers, which can deeply clean and remove residual stains and impurities on the surface of the silicon wafers.

[0041] Reference Figure 3 , Figure 4The cleaning mechanism further comprises a high-pressure water pump 22, a high-pressure water delivery pump 23, a water delivery pipe 24, and a water suction pipe 25, one end of which is connected to the side of the water tank 20, and the high-pressure water pump 22 can be of the ZDK-20-0.75 type. The high-pressure water pump 22 is connected to the inside of the cleaning tank 4 through the water suction pipe 25, and the cleaning liquid in the cleaning tank 4 can be recycled through the high-pressure water pump 22, thereby improving the utilization rate of the cleaning liquid, reducing energy consumption and wastewater discharge, and meeting the current development trend of green manufacturing. The other end of the water tank 20 is connected to the side of the high-pressure water delivery pump 23, which can also be of the ZDK-20-0.75 type. The high-pressure water delivery pump 23 is connected to the cleaning pipe 7 through the water delivery pipe 24. The water tank 20 is installed on the upper middle part of the protective cover 6, and the water tank 20 is provided with a water inlet 21 on the top. The water inlet 21 can supplement the loss of the cleaning liquid in the cleaning process in time.

[0042] Referring to Figure 3 The drying mechanism is arranged in the heating bin 3 and comprises a drying cover 10, heat dissipation holes 11, a heating box 12, heating plates 13, an air blower 14, and a connecting pipe 15. The drying cover 10 is installed on the top of the heating bin 3. The heat dissipation holes 11 are arranged on both sides of the inside of the heating bin 3. The heating box 12 is installed on the top of the protective cover 6. The heating plates 13 are arranged in the heating box 12. The air blower 14 is fixedly installed on the side of the heating box 12. The air blower 14, the heating box 12, and the drying cover 10 are connected in series through the connecting pipe 15.

[0043] In specific implementation, when the cleaning equipment for silicon wafer processing is used for cleaning, the cleaning liquid is first added to the inside of the cleaning tank 4, and the cleaning liquid just covers the surface of the middle section of the roller conveyor 5. Then, the silicon wafer cleaned by steam is continuously conveyed to the inside of the cleaning tank 4 through the roller conveyor 5 for immersion. After steam treatment, the micro particles, organic matter, and part of the metal impurities that are not cleaned completely are effectively cleaned in the immersion process. Then, the high-pressure water delivery pump 23 is started, and the cleaning liquid in the water tank 20 is delivered to the inside of the cleaning pipe 7 through the water delivery pipe 24. Then, the silicon wafer surface is further washed in depth through the spray head 8, thereby further ensuring that the remaining stains and impurities are removed. At the same time, the high-pressure water pump 22 is started, and the excess cleaning liquid in the cleaning tank 4 is sucked into the water tank 20 through the water suction pipe 25, thereby ensuring that the cleaning liquid in the cleaning tank 4 is always stable. At the same time, the recycling of the cleaning liquid is improved, the utilization rate of the cleaning liquid is improved, and the consistency and stability of the cleaning effect are further ensured.

[0044] Then, after the cleaning is completed, the roller conveyor 5 continues to convey the cleaned silicon wafer, when the cleaned silicon wafer enters the heating bin 3, the heating plate 13 first preheats the inside of the heating box 12, then the air blower 14 is started, and because the air blower 14, the heating box 12, and the drying cover 10 are connected in series through the connecting pipe 15, the air blower 14 blows the hot air to the surface of the cleaned silicon wafer through the heating box 12 and the drying cover 10, realizing the rapid drying of the silicon wafer. Through the above operation, the automation level of cleaning is improved, and the cleaning efficiency and the cleanliness of the surface of the silicon wafer are significantly improved.

[0045] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A cleaning apparatus for processing silicon wafers, comprising a base (1), characterized in that, One end of the base (1) side fixedly connected with the mounting seat (2), and the other end of the base (1) side fixedly connected with the heating bin (3), the base (1) inside is provided with cleaning tank (4), and the mounting seat (2), heating bin (3) and cleaning tank (4) top are all installed with the roll type conveyor (5) that communicates, the heating bin (3) is provided with drying mechanism inside, and the mounting seat (2) is provided with steam cleaning mechanism inside, the mounting seat (2) and base (1) top are provided with protective cover (6), and the protective cover (6) is provided with cleaning mechanism inside; The cleaning mechanism includes a cleaning pipe (7), a spray head (8), and a cleaning pipe (7) in the form of a back is installed inside the protective cover (6) above the cleaning tank (4), the cleaning pipe (7) is connected with a plurality of spray heads (8), and the cleaning tank (4) is cleaned by spraying through the spray head (8).

2. The cleaning apparatus for processing silicon wafers according to claim 1, wherein The mounting seat (2) and the heating bin (3) are fixedly connected with the support frame (9) outside, and the roll type conveyor (5) is installed in the support frame (9) inside both ends, the mounting seat (2) and the heating bin (3) are installed with a plurality of support tops (26) at the bottom.

3. The cleaning apparatus for processing a silicon wafer according to claim 1, wherein The drying mechanism includes a drying cover (10), a heat dissipation hole (11), a heating box (12), a heating plate (13), a blower (14), and a connecting pipe (15), and the heating bin (3) is provided with a drying cover (10) at the top, and a plurality of heat dissipation holes (11) are formed on both sides of the heating bin (3) inside.

4. The cleaning apparatus for processing a silicon wafer according to claim 3, wherein One end of the protective cover (6) top is provided with a heating box (12), and a plurality of heating plates (13) are arranged in the heating box (12), and a blower (14) is fixedly installed on the side of the heating box (12), and the blower (14), the heating box (12) and the drying cover (10) are connected by the connecting pipe (15) in series.

5. The cleaning apparatus for processing silicon wafers according to claim 1, wherein The steam cleaning mechanism includes a steam generator (16), a steam pipe (17), an air outlet (18), and a conveying pipe (19), and the steam pipe (17) is installed on both sides of the roll type conveyor (5) inside the mounting seat (2), and a plurality of air outlets (18) are formed on the side of the steam pipe (17).

6. The cleaning apparatus for processing a silicon wafer according to claim 5, wherein The other end of the protective cover (6) top is provided with a steam generator (16), and the steam generator (16) is connected to the steam pipe (17) through the conveying pipe (19).

7. The cleaning apparatus for processing silicon wafers according to claim 1, wherein The protective cover (6) is provided with a water tank (20) above the middle, and the water tank (20) is provided with a water inlet (21) at the top.

8. The cleaning apparatus for processing a silicon wafer according to claim 7, wherein The cleaning mechanism further includes a high-pressure water pump (22), a high-pressure water pump (23), a water pipe (24), and a water pump (25), and one end of the water tank (20) is connected with a high-pressure water pump (22) on the side, and the high-pressure water pump (22) is connected to the inside of the cleaning tank (4) through the water pump (25).

9. The cleaning apparatus for processing a silicon wafer according to claim 8, wherein The other end of the water tank (20) is connected with a high-pressure water pump (23) on the side, and the high-pressure water pump (23) is connected to the cleaning pipe (7) through the water pipe (24).

10. The cleaning apparatus for processing a silicon wafer according to any one of claims 1 to 9, wherein The cleaning method of the cleaning equipment is as follows: Step one, the silicon wafer to be cleaned is placed on the surface of the roller conveyor (5) in turn, the roller conveyor (5) transports the silicon wafer to the inside of the mounting seat (2), and at the same time, the vapor generator (16) generates vapor, which is cleaned through the conveying pipe (19), the vapor pipeline (17), and the air outlet (18); Step two, the silicon wafer preliminarily cleaned is immersed in the cleaning tank (4) through the roller conveyor (5), and then the high-pressure water pump (22) draws the cleaning liquid to clean the silicon wafer in the cleaning tank (4) deeply through the cleaning pipe (7) and the spray head (8); Step three, after the cleaning in steps one and two is completed, the silicon wafer is transported to the heating bin (3) through the roller conveyor (5), and the air blower (14) cooperates with the heating box (12) and the drying cover (10) to quickly dry the silicon wafer.

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