Silicon wafer drying device

Abstract

The utility model discloses a silicon wafer drying device, and relates to the field of photovoltaic technology. The silicon wafer drying device comprises a conveying mechanism and a drying mechanism, the conveying mechanism is used for bearing and conveying silicon wafers, the conveying mechanism is provided with a first conveying section and a second conveying section which are sequentially arranged in the silicon wafer conveying direction, and the silicon wafers have different inclination directions when being borne by the first conveying section and the second conveying section. And the drying mechanism is used for drying the silicon wafers on the conveying mechanism. As the silicon wafers have different inclined directions when being carried by the first conveying section and the second conveying section, even if the silicon wafers are conveyed on the first conveying section, dead angles which are difficult to dry possibly exist, but when the silicon wafers are conveyed to the second conveying section, water in the dead angles possibly flows out or the dead angles are exposed, so that the silicon wafers are not dried. And the dead angles are easily dried in the second conveying section. Therefore, according to the silicon wafer drying device provided by the embodiment of the invention, the inclination angle of the silicon wafer is adjusted in the drying process, so that the overall drying effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of photovoltaic, in particular to a silicon wafer drying device. BACKGROUND

[0002] In some current solar cells, silicon wafers are used as substrates, and in the process of manufacturing solar cells, the silicon wafers are often cleaned. In the cleaning process, the silicon wafers will pass through various chemical tanks and water tanks, and after cleaning, the silicon wafers need to be dried. Drying is generally carried out by using air, compressed air, nitrogen, etc. to dry the surface of the silicon wafer, or by mechanical disturbance to make water (or other liquids) fall off the surface of the silicon wafer or the flower basket (used to contain the silicon wafer), or by using high temperature to make the water vaporize and be carried away with the drying gas. The residual water due to incomplete drying is not conducive to the next process. At present, most of the cleaning processes are in the form of tunnel drying and tank drying. The tank drying method has the advantage that the drying temperature is easier to ensure, but it lacks mechanical disturbance, and the concave grooves of the flower basket where water is easy to accumulate often cannot be dried completely. Although the tunnel drying method has a certain mechanical disturbance, when there is a large amount of residual water, the silicon wafers still cannot be completely dried.

[0003] Therefore, the present application is proposed. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a silicon wafer drying device with better drying effect.

[0005] The embodiments of the present application are implemented as follows:

[0006] The present application provides a silicon wafer drying device, which comprises a conveying mechanism and a drying mechanism. The conveying mechanism is used to carry and convey silicon wafers. The conveying mechanism has a first conveying section and a second conveying section arranged in sequence along the conveying direction of the silicon wafers. The silicon wafers have different inclination directions when carried by the first conveying section and the second conveying section. The drying mechanism is used to dry the silicon wafers on the conveying mechanism.

[0007] In an optional embodiment, the conveying direction of the first conveying section is inclined upward relative to the horizontal plane, and the conveying direction of the second conveying section is inclined downward relative to the horizontal plane.

[0008] In an optional embodiment, the inclination angle of the conveying direction of the first conveying section relative to the horizontal plane is not greater than 10°, and the inclination angle of the conveying direction of the second conveying section relative to the horizontal plane is not greater than 10°.

[0009] In an optional embodiment, the conveying mechanism further comprises a transition conveying section. The conveying direction of the transition conveying section is arranged horizontally. The first conveying section, the transition conveying section, and the second conveying section are arranged in sequence along the conveying direction of the silicon wafers.

[0010] In an optional embodiment, the conveying mechanism further comprises an input section arranged on one side upstream of the first conveying section and an output section arranged on one side downstream of the second conveying section, the conveying directions of the input section and the output section are horizontally arranged.

[0011] In an optional embodiment, the conveying mechanism comprises a driving assembly and a supporting assembly arranged on the driving assembly, the supporting assembly is used to carry the silicon wafer, and the driving assembly is used to drive the supporting assembly to move along the conveying direction of the silicon wafer.

[0012] In an optional embodiment, the supporting assembly comprises a first supporting seat, a second supporting seat and an angle adjusting member, the first supporting seat is connected to the driving assembly, the second supporting seat is movably connected to the first supporting seat and is used to support the silicon wafer, and the angle adjusting member is in driving connection with the first supporting seat and the second supporting seat and is used to adjust the inclination angle of the first supporting seat relative to the second supporting seat.

[0013] In an optional embodiment, one end of the second supporting seat is hinged to the first supporting seat, and the angle adjusting member is used to lift the other end of the second supporting seat, and the rotation axis of the second supporting seat is parallel to or forms an acute angle with the conveying direction of the silicon wafer.

[0014] In an optional embodiment, the conveying mechanism further comprises a receiving assembly, the receiving assembly is detachably connected to the second supporting seat, and the receiving assembly has a containing space used to contain the silicon wafer.

[0015] In an optional embodiment, the drying mechanism comprises a plurality of air blowing assemblies arranged along the conveying direction of the silicon wafer, and the air blowing assemblies are used to blow the silicon wafer on the conveying mechanism.

[0016] The beneficial effects of the embodiments of the present application are as follows:

[0017] The silicon wafer drying device provided by the present application comprises a conveying mechanism and a drying mechanism, the conveying mechanism is used to carry and convey the silicon wafer, the conveying mechanism has a first conveying section and a second conveying section arranged in sequence along the conveying direction of the silicon wafer, the silicon wafer has different inclination directions when being carried by the first conveying section and the second conveying section, and the drying mechanism is used to dry the silicon wafer on the conveying mechanism. Since the silicon wafer has different inclination directions when being carried by the first conveying section and the second conveying section, in different inclination states, liquid will flow or fall in the inclination direction under its own gravity. Therefore, even if there are dead angles that are difficult to dry when the silicon wafer is conveyed on the first conveying section, when the silicon wafer is conveyed to the second conveying section, the water in these dead angles can flow out or the dead angles can be exposed, so that the dead angles are easy to dry on the second conveying section. It can be seen that the silicon wafer drying device provided by the embodiments of the present application adjusts the inclination angle of the silicon wafer during the drying process, thereby improving the overall drying effect. BRIEF DESCRIPTION OF DRAWINGS

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a silicon wafer drying apparatus in one embodiment of this application;

[0020] Figure 2 This is a first schematic diagram of the support component, storage component, and transmission component in one embodiment of this application;

[0021] Figure 3 This is a second schematic diagram of the support component, storage component, and transmission component in one embodiment of this application.

[0022] Icons: 100-Conveying mechanism; 101-Input section; 102-First conveying section; 103-Transitional conveying section; 104-Second conveying section; 105-Output section; 110-Transmission assembly; 120-Support assembly; 121-First support seat; 122-Second support seat; 123-Angle adjustment component; 124-Hinge shaft; 125-Stop block; 130-Storage assembly; 131-Baffle; 132-Side rod; 200-Box body; 210-First gate; 220-Second gate; 230-Air blowing hole. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of the present application, it should be pointed out that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the utility model product is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description and cannot be understood as indicating or implying relative importance.

[0027] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that it is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0028] In the description of the present application, it should also be pointed out that unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] In the manufacturing process of a solar cell, the processes involving chemical cleaning, such as texturing, alkali etching, and RCA cleaning, are collectively referred to as cleaning processes. After the cleaning processes, the silicon wafer is dried. If the drying is not thorough, it will have a negative impact on subsequent processes. For example, if the drying after the texturing process is not thorough, water vapor diffusion often causes burnt wafers, affecting the rework rate and yield of the entire process. If the silicon wafer is not dried after the alkali etching process, it may affect the conversion efficiency and yield of the cell. If the silicon wafer is not dried after the RCA cleaning process, it will affect the rework rate and yield. In related technologies, the drying methods for silicon wafers include tunnel drying and slot drying. However, regardless of the drying method, the silicon wafer always maintains a fixed posture during the drying process, which causes some parts of the silicon wafer to be completely dried, while some dead angles accumulate liquid and are difficult to dry. In existing technologies, the silicon wafer is often placed in a flower basket for transportation and drying. If the flower basket contains water, the water will be splashed, sprayed, or dripped onto the silicon wafer during transportation, which will also have a negative impact. Therefore, the flower basket containing the silicon wafer also needs to be dried. The position where the silicon wafer and the flower basket teeth contact, or the position where the flower basket has a concave-convex interface, is a position prone to water accumulation. Drying gas is difficult to directly blow to these areas, and horizontal translation mechanical vibration is also difficult to disturb and drop them.

[0030] In order to improve the problem that the silicon wafer is difficult to dry in the related art, an embodiment of the present application provides a silicon wafer drying device, which changes the inclination of the silicon wafer in the drying and conveying process of the silicon wafer, so as to improve the drying effect.

[0031] Figure 1 FIG. 1 is a schematic view of a silicon wafer drying device according to an embodiment of the present application. Figure 1 The silicon wafer drying device provided by the embodiment of the present application is a tunnel type drying device, which comprises a conveying mechanism 100 and a drying mechanism (not shown in the figure). The conveying mechanism 100 is used to carry and convey the silicon wafer, specifically, the conveying mechanism 100 can transport the silicon wafer along a set silicon wafer conveying path. The drying mechanism is used to dry the silicon wafer on the conveying mechanism 100. In the embodiment, the silicon wafer can be dried by the drying mechanism at each position on the conveying mechanism 100, and the whole drying process is completed after the silicon wafer is conveyed from the starting point to the end point of the silicon wafer conveying path.

[0032] In the embodiment, the conveying mechanism 100 comprises a transmission assembly 110 and a support assembly 120 arranged on the transmission assembly 110. The support assembly 120 is used to carry the silicon wafer, and the transmission assembly 110 is used to drive the support assembly 120 to move along the silicon wafer conveying direction. Further, the conveying mechanism 100 further comprises a receiving assembly 130 arranged on the support assembly 120. The receiving assembly 130 has a containing space for accommodating the silicon wafer. By placing the silicon wafer in the containing space of the receiving assembly 130, the silicon wafer can be prevented from scattering during the conveying process, and the safety of the silicon wafer during the conveying process can be ensured.

[0033] It can be understood that in other embodiments, the receiving assembly 130 can be omitted, and the silicon wafer can be directly placed on the support assembly 120 for conveying. Correspondingly, the support assembly 120 can be provided with a structure (such as a slot) for fixing the silicon wafer. In other embodiments, the support assembly 120 and the receiving assembly 130 can be omitted, and the silicon wafer is directly supported on the transmission assembly 110. Correspondingly, the transmission assembly 110 should be provided with a structure for fixing the silicon wafer.

[0034] In this embodiment, the conveying mechanism 100 has a first conveying section 102 and a second conveying section 104 arranged sequentially along the silicon wafer conveying direction. The silicon wafer has different tilting directions when carried by the first conveying section 102 and the second conveying section 104. By making the tilt angles of the conveying directions of the first conveying section 102 and the second conveying section 104 relative to the horizontal plane different, the silicon wafer and the housing assembly 130 have different tilting directions when carried by the first conveying section 102 and the second conveying section 104, that is, the silicon wafer and the housing assembly 130 have different postures on the first conveying section 102 and the second conveying section 104. Since the postures of the silicon wafer and the housing assembly 130 can be adjusted during the drying process, more comprehensive drying can be achieved, reducing the risk of water accumulating in dead corners.

[0035] like Figure 1 As shown, the conveying direction of the first conveying section 102 is inclined upward relative to the horizontal plane, and the conveying direction of the second conveying section 104 is inclined downward relative to the horizontal plane. It can be understood that when the silicon wafer is conveyed on the first conveying section 102, the silicon wafer and the housing assembly 130 have a more "rearward" posture relative to horizontal conveying; when the silicon wafer is conveyed on the second conveying section 104, the silicon wafer and the housing assembly 130 have a more "forward" posture relative to horizontal conveying.

[0036] In alternative embodiments, the conveying direction of the first conveying section 102 may be set to inclined upward, and the conveying direction of the second conveying section 104 may also be set to inclined upward.

[0037] In other optional embodiments, one of the first conveying section 102 and the second conveying section 104 can be set to a horizontal conveying direction, while the other can be set to an upward or downward tilt; alternatively, both the first conveying section 102 and the second conveying section 104 can be set to an upward or downward tilt, but with different tilt angles. These configurations also allow the silicon wafer to adjust its posture during conveying, thus improving the drying effect to some extent.

[0038] In the embodiment, the inclination angle a1 of the conveying direction of the first conveying section 102 relative to the horizontal plane is not greater than 10°, and the inclination angle a2 of the conveying direction of the second conveying section 104 relative to the horizontal plane is not greater than 10°. It can be understood that if the inclination angle of the conveying direction of the first conveying section 102 and the second conveying section 104 is too large, the stability of the silicon wafer can be reduced, and there can be a risk of scattering. By limiting the inclination angle of the conveying direction of the first conveying section 102 and the second conveying section 104 relative to the horizontal plane to be within 10°, the reliability of the silicon wafer conveying can be improved. In addition, if one section of the conveying mechanism 100 is inclined upward or downward too much, the space occupation of the conveying mechanism 100 and even the entire silicon wafer drying device in the vertical direction can be increased; and the equipment height is too high, which can also cause inconvenience in maintenance.

[0039] Further, the conveying mechanism 100 in the embodiment further includes a transition conveying section 103, the conveying direction of the transition conveying section 103 is horizontally arranged, and the first conveying section 102, the transition conveying section 103 and the second conveying section 104 are arranged in sequence along the silicon wafer conveying direction. By arranging the transition conveying section 103, a buffer interval can be provided for the silicon wafer between the first conveying section 102 and the second conveying section 104, so as to avoid the problem that the silicon wafer is subjected to a large impact and collision due to a too large posture change when the silicon wafer is converted from the backward inclined posture to the forward inclined posture, and reduce the damage to the silicon wafer.

[0040] In an optional embodiment, the conveying mechanism 100 further includes an input section 101 arranged on one side upstream of the first conveying section 102 and an output section 105 arranged on one side downstream of the second conveying section 104, and the conveying direction of the input section 101 and the output section 105 is horizontally arranged. In the embodiment, the silicon wafer starts to be dried from the input section 101 and ends to be dried at the output section 105. By arranging the input section 101 and the output section 105 to be horizontal, the silicon wafer can be conveniently fed into the box body 200 of the silicon wafer drying device and fed out from the box body 200, and the connection with other conveying devices upstream and downstream is also facilitated.

[0041] In the embodiment, the conveying mechanism 100 only includes one ascending section (i.e. the first conveying section 102) and one descending section (i.e. the second conveying section 104), and in other embodiments, the conveying mechanism 100 can further include more ascending sections and descending sections, and by switching the posture of the silicon wafer and the receiving assembly 130 multiple times, the drying effect of the silicon wafer and the receiving assembly 130 can be improved.

[0042] In the embodiment, the transmission assembly 110 of the conveying mechanism 100 includes a chain, such as two chains parallel to each other to carry the support assembly 120. In other embodiments, the transmission assembly 110 can also be in the form of a transmission belt, a roller, etc.

[0043] Figure 2Figure 1 is a first schematic view of a support assembly 120, a receiving assembly 130 and a transmission assembly 110 in an embodiment of the present application; Figure 3 Figure 2 is a second schematic view of the support assembly 120, the receiving assembly 130 and the transmission assembly 110 in the embodiment of the present application. As shown in Figure 2 and Figure 3 the support assembly 120 in the embodiment includes a first support base 121, a second support base 122 and an angle adjusting member 123. The first support base 121 is connected to the transmission assembly 110. The second support base 122 is movably connected to the first support base 121 and is used to support a silicon wafer. The angle adjusting member 123 is in transmission connection with the first support base 121 and the second support base 122 and is used to adjust the inclination angle of the first support base 121 relative to the second support base 122. As can be seen, in the embodiment, in addition to adjusting the pitch angle of the silicon wafer and the receiving assembly 130 through the first conveying section 102 and the second conveying section 104, the attitude of the silicon wafer and the receiving assembly 130 can also be adjusted through the angle adjusting member 123, so that the silicon wafer and the receiving assembly 130 can present more different attitudes, thus being beneficial to more comprehensive drying. Figure 2 In the embodiment, the first support base 121 is parallel to the second support base 122, and the receiving assembly 130 is not inclined in the left-right direction; in Figure 3 the angle adjusting member 123 lifts one end of the second support base 122, so that the receiving assembly 130 has a certain inclination angle in the left-right direction.

[0044] As shown in Figure 2 and Figure 3 the first support base 121 and the second support base 122 are in plate-like structure. One end of the second support base 122 is hinged to the first support base 121. The angle adjusting member 123 is used to lift the other end of the second support base 122. The rotation axis of the second support base 122 is parallel or forms an acute angle with the conveying direction of the silicon wafer. The rotation axis of the second support base 122 is the extending direction of the axis of the hinge shaft 124. In the embodiment, the hinge shaft 124 and the angle adjusting member 123 are arranged in the width direction of the silicon wafer conveying path. The axis of the hinge shaft 124 is parallel to the conveying direction of the silicon wafer. Therefore, the front-rear pitch angle of the silicon wafer and the receiving assembly 130 can be adjusted through the fluctuation of the transmission assembly 110, and the inclination angle of the silicon wafer and the receiving assembly 130 in the left-right direction can be adjusted through the angle adjusting member 123. Figure 2 and Figure 3 In the embodiment, the conveying direction of the silicon wafer is perpendicular to the picture; in Figure 3 the left side of the second support base 122 is lifted by the angle adjusting member 123 to be higher than the right side; in other cases, the angle adjusting member 123 can be retracted, so that the left side of the second support base 122 is lower than the right side. Optionally, the angle adjusting member 123 is a hydraulic cylinder, an air cylinder or a linear motor.

[0045] In this embodiment, the tilt angle β of the second support 122 relative to the first support 121 is no greater than 10°, thereby avoiding the silicon wafer or housing component 130 from becoming unstable due to excessive tilting.

[0046] Optionally, the storage component 130 is detachably connected to the second support base 122. In this embodiment, the storage component 130 is placed on the second support base 122, and the storage component 130, along with the silicon wafer, can be removed from the support component 122 by applying an upward lifting force to the storage component 130. In this embodiment, a stop 125 is provided on the side of the second support base 122 opposite to the first support base 121. The stop 125 is used to limit the storage component 130 and prevent it from sliding on the second support base 122.

[0047] Optionally, the second support base 122 is provided with two stops 125, and the storage component 130 can be placed between the two stops 125. The two stops 125 are used to restrict the sliding of the storage component 130 in the left and right directions; or, the second support base 122 is provided with four stops 125. The stops 125 are L-shaped and can abut against the four corners of the storage component 130, thereby restricting the sliding of the storage component 130 in the front-back and left-right directions; or, the stops 125 are U-shaped, with a placement groove formed in the middle of the stops 125, and the bottom of the storage component 130 is embedded in the placement groove.

[0048] like Figure 2 and Figure 3 As shown, the housing assembly 130 in this embodiment includes two spaced-apart baffles 131 and two sets of spaced-apart side rods 132. The spacing direction of the two baffles 131 is perpendicular to the silicon wafer conveying direction, and the spacing direction of the two sets of side rods 132 is consistent with the silicon wafer conveying direction. The baffles 131 and side rods 132 form a receiving space for the housing assembly 130. In this embodiment, the outer side of the baffle 131 abuts against the stop block 125. Each set of side rods 132 includes at least two side rods 132 spaced apart in the vertical direction. The gaps between the side rods 132 of the housing assembly 130 in this embodiment allow for ventilation, which facilitates the outflow of liquid inside the housing assembly 130 and also helps to thoroughly dry the internal silicon wafers.

[0049] In this embodiment, the drying mechanism includes multiple air-blowing components arranged along the silicon wafer conveying direction. The air-blowing components are used to blow the silicon wafers on the conveying mechanism 100. Specifically, the input section 101, the first conveying section 102, the transition conveying section 103, the second conveying section 104, and the output section 105 are all equipped with air-blowing components for blowing.

[0050] Optionally, the silicon wafer drying device can further comprise a box 200, the box 200 forms a drying channel, a part of the input section 101, the first conveying section 102, the transition conveying section 103, the second conveying section 104 and a part of the output section 105 of the conveying mechanism 100 are arranged in the box 200, a part of the input section 101 close to the upstream, a part of the output section 105 close to the downstream and the drying mechanism are arranged outside the box 200. A plurality of air blowing holes 230 can be formed on the box 200, so that the drying mechanism can blow hot air into the box 200 through the air blowing holes 230, thereby drying the silicon wafer and the storage assembly 130 on the conveying mechanism 100. Optionally, the air blowing holes 230 can be formed on the top wall of the box 200, forming downward air flow; the air blowing holes 230 can also be formed on the bottom wall and the side wall, thereby realizing multi-angle blowing of the silicon wafer and the storage assembly 130.

[0051] Further, a first gate 210 is movably arranged at the entrance of the box 200, the first gate 210 can selectively open or close the entrance of the box 200; a second gate 220 is movably arranged at the exit of the box 200, the second gate 220 can selectively open or close the exit of the box 200.

[0052] A specific operation process of the silicon wafer drying device is as follows:

[0053] After the silicon wafer and the storage assembly 130 complete the chemical tank process, the robot carries the storage assembly 130 containing the silicon wafer to the input section 101 of the conveying mechanism 100, the storage assembly 130 is placed on the support assembly 120, the support assembly 120 can ensure that the storage assembly 130 will not be tilted at a certain inclination angle. The support assembly 120 circulates with the transmission assembly 110. After the storage assembly 130 is placed on the support assembly 120, the sensor (which can be arranged on the support assembly 120) senses the storage assembly 130, thereby opening the first gate 210. The transmission assembly 110 drives the support assembly 120 to move forward, the conveying mechanism 100 is provided with 9 stations in the box 200, wherein the input section 101, the output section 105 and the transition conveying section 103 are respectively provided with 1 station, the first conveying section 102 and the second conveying section 104 are respectively provided with 3 stations. The storage assembly 130 sequentially passes through each station, such as Figure 1As shown, the first passes through the 1# station on the input section 101, and then sequentially passes through the 2# station, the 3# station, the 4# station (in a backward-leaning posture); then is conveyed to the horizontal intermediate 5# station; then passes through the 6# station, the 7# station, the 8# station (in a forward-leaning posture) on the second conveying section 104; then passes through the 9# station at the output section 105; finally, the second gate 220 is opened, and is sent out from the outlet of the box body 200, and finally the silicon wafer can be unloaded from the support assembly 120 together with the storage assembly 130 by the mechanical hand. In this process, the storage assembly 130 and the silicon wafer complete the posture switching of backward-leaning and forward-leaning. Moreover, the storage assembly 130 stays for a certain time at each station, and in the staying process, the left and right inclination angle of the storage assembly 130 is adjusted by the angle adjusting member 123, so that the silicon wafer and the storage assembly 130 are in dynamic drying. The total time of the single station staying and the running time of moving to the next station is 100s, in other words, the total drying time of the silicon wafer and the storage assembly 130 is 900s.

[0054] Optionally, the wind direction of the drying gas is perpendicular to the conveying direction of the silicon wafer; the gas flow can be selected as 200-600m 3 / h; the drying temperature can be selected as 60-100℃, and the total drying time can be selected as 450-1800s, and the time at each station can be selected as 50-200s.

[0055] In summary, the present application provides a silicon wafer drying device, which comprises a conveying mechanism 100 and a drying mechanism, the conveying mechanism 100 is used for carrying and conveying the silicon wafer, the conveying mechanism 100 has a first conveying section 102 and a second conveying section 104 arranged in sequence along the conveying direction of the silicon wafer, the silicon wafer has different inclination directions when being carried by the first conveying section 102 and the second conveying section 104, and the drying mechanism is used for drying the silicon wafer on the conveying mechanism 100. Since the silicon wafer has different inclination directions when being carried by the first conveying section 102 and the second conveying section 104, in different inclination states, the liquid will flow or fall in the inclination direction under its own gravity. Therefore, even if there are dead angles that are difficult to dry when the silicon wafer is conveyed on the first conveying section 102, when the silicon wafer is conveyed to the second conveying section 104, the water in these dead angles can flow out or the dead angles can be exposed, so that these dead angles are easy to dry in the second conveying section 104. It can be seen that the silicon wafer drying device provided in the embodiments of the present application adjusts the inclination angle of the silicon wafer during drying, thereby improving the overall drying effect.

[0056] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A silicon wafer drying apparatus, characterized by comprising: The conveying mechanism is used for carrying and conveying the silicon wafer, and the conveying mechanism has a first conveying section and a second conveying section arranged in sequence along the conveying direction of the silicon wafer, and the silicon wafer has different inclination directions when being carried by the first conveying section and the second conveying section; and the drying mechanism is used for drying the silicon wafer on the conveying mechanism.

2. The silicon wafer drying apparatus of claim 1, wherein The conveying direction of the first conveying section is inclined upward relative to the horizontal plane, and the conveying direction of the second conveying section is inclined downward relative to the horizontal plane.

3. The silicon wafer drying apparatus of claim 2, wherein The inclination angle of the conveying direction of the first conveying section relative to the horizontal plane is not greater than 10°, and the inclination angle of the conveying direction of the second conveying section relative to the horizontal plane is not greater than 10°.

4. The silicon wafer drying apparatus of claim 2, wherein The conveying mechanism further comprises a transition conveying section, and the conveying direction of the transition conveying section is arranged horizontally, and the first conveying section, the transition conveying section and the second conveying section are arranged in sequence along the conveying direction of the silicon wafer.

5. The silicon wafer drying apparatus of claim 2, wherein The conveying mechanism further comprises an input section arranged on one side upstream of the first conveying section and an output section arranged on one side downstream of the second conveying section, and the conveying directions of the input section and the output section are arranged horizontally.

6. The silicon wafer drying apparatus according to any one of claims 1 to 5, wherein The conveying mechanism comprises a transmission assembly and a support assembly arranged on the transmission assembly, and the support assembly is used for carrying the silicon wafer, and the transmission assembly is used for driving the support assembly to move along the conveying direction of the silicon wafer.

7. The silicon wafer drying apparatus of claim 6, wherein The support assembly comprises a first support seat, a second support seat and an angle adjusting member, the first support seat is connected to the transmission assembly, the second support seat is movably connected to the first support seat, and the second support seat is used for supporting the silicon wafer; the angle adjusting member is in transmission connection with the first support seat and the second support seat, and the angle adjusting member is used for adjusting the inclination angle of the first support seat relative to the second support seat.

8. The silicon wafer drying apparatus of claim 7, wherein One end of the second support seat is hinged to the first support seat, and the angle adjusting member is used for lifting the other end of the second support seat, and the rotation axis of the second support seat is parallel to or forms an acute angle with the conveying direction of the silicon wafer.

9. The silicon wafer drying apparatus of claim 7, wherein The conveying mechanism further comprises a receiving assembly, and the receiving assembly is detachably connected to the second support seat, and the receiving assembly has a containing space for accommodating the silicon wafer.

10. The silicon wafer drying apparatus according to any one of claims 1 to 5, wherein The drying mechanism comprises a plurality of blowing assemblies arranged along the conveying direction of the silicon wafer, and the blowing assemblies are used for blowing the silicon wafer on the conveying mechanism.

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