Thermal dye sublimation printing head liquid cooling heat dissipation substrate, manufacturing method thereof and thermal dye sublimation printing head
By introducing a liquid-cooled heat dissipation substrate design into the thermal sublimation printhead, integrating flow channels and thermally conductive materials, the shortcomings of traditional heat dissipation methods are solved, achieving efficient thermal management and equipment stability, and meeting the needs of high power density and high load conditions.
Patent Information
- Application Number
- CN202511040329.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-28
- Publication Date
- 2025-11-07
AI Technical Summary
Traditional thermal sublimation printheads rely primarily on air convection or passive heat conduction through a small amount of metal for heat dissipation. This cannot meet the demands of current and future higher power density and high-load operating conditions, leading to deterioration in print quality and reduced equipment stability.
The liquid-cooled heat dissipation substrate design integrates flow channels within the printhead mounting substrate and forms a stepped arrangement of ceramic plates and PCB board mounting planes on one side of the substrate. Combined with thermal grease and adhesive, a highly efficient liquid cooling system is formed.
It significantly improves heat transfer efficiency, shortens thermal response time, overcomes the problem of poor heat dissipation in existing thermal sublimation printhead structures, and ensures high-precision printing and equipment stability.
Smart Images
Figure CN120902435A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of thermal dye sublimation print head, and particularly relates to a thermal dye sublimation print head liquid cooling heat dissipation substrate, a manufacturing method thereof and a thermal dye sublimation print head. BACKGROUND
[0002] With the wide application of thermal dye sublimation printing technology in high-resolution, high-speed and high-load continuous printing scenarios, the working temperature and heat dissipation efficiency of the thermal dye sublimation print head (TPH) as a core heating component have become the key bottleneck restricting the printing performance, stability and service life.
[0003] The working principle of the thermal dye sublimation print head is to heat the thermal dye sublimation medium instantaneously through precise resistance heating points, so that the thermal dye sublimation medium directly changes from solid state to gaseous state. The gaseous dye passes through the protective layer of the printing material, diffuses and penetrates to the surface of the printing material (such as photographic paper, cloth), and then condenses and fixes, thereby forming each pixel point. In order to meet the high-resolution and high-speed printing requirements, a high-density of micro heating points are integrated on the print head. Under the working mode of high frequency, continuous and large printing volume, these dense heating points will generate a large amount of highly concentrated heat energy. If the heat is not dissipated in time, it will cause problems such as degradation of printing quality, limitation of printing speed, thermal damage of components, and decline of equipment stability.
[0004] The traditional heat dissipation of the thermal dye sublimation print head mainly relies on air convection (heat sink + fan) or passive heat conduction of a metal back plate. However, in the face of current and future higher power density and high-load working conditions, the traditional air cooling method has significant shortcomings, and therefore, in order to break through the performance limit of the existing thermal dye sublimation printing technology and meet the stringent requirements of ultra-high printing precision, extremely long continuous working time, small device space and low noise operation, a heat management solution with higher heat dissipation efficiency, stronger space adaptability and more accurate temperature control is urgently needed. SUMMARY
[0005] The technical problem to be solved by the present application is that the traditional heat dissipation of the thermal dye sublimation print head mainly relies on air convection or passive heat dissipation conduction of a small amount of metal. However, in the face of current and future higher power density and high-load working conditions, the traditional air cooling method has significant shortcomings, which easily leads to printing color step deviation. In order to solve this technical problem, the present application provides a thermal dye sublimation print head liquid cooling heat dissipation substrate, a manufacturing method thereof and a thermal dye sublimation print head.
[0006] The technical scheme for solving the above technical problems is as follows: the present application provides a liquid cooling heat dissipation substrate for thermal dye sublimation print head, comprising a print head mounting substrate, a first flow channel and a second flow channel are formed in the print head mounting substrate and are arranged in parallel and communicated, a ceramic plate mounting plane and a PCB plate mounting plane are arranged in a stepped manner on one side of the print head mounting substrate, the height of the ceramic plate mounting plane is higher than that of the PCB plate mounting plane, the first flow channel is arranged in parallel corresponding to the ceramic plate mounting plane, and the second flow channel is arranged in parallel corresponding to the PCB plate mounting plane.
[0007] The present application has the following beneficial effects: the liquid cooling heat dissipation substrate for thermal dye sublimation print head can utilize the metal substrate of the original thermal dye sublimation print head, the heat transfer efficiency is greatly improved by integrating the flow channel inside and forming the ceramic plate mounting plane and the PCB plate mounting plane arranged in a stepped manner on one side of the print head mounting substrate, the heat response time is shortened, and the problem of poor heat dissipation effect of the existing thermal dye sublimation print head structure is overcome.
[0008] Based on the above technical scheme, the present application can also be improved as follows.
[0009] Further, a first separation groove and a second separation groove are formed on the ceramic plate mounting plane, and the first separation groove and the second separation groove are arranged in extension along the length direction parallel to the first flow channel.
[0010] The beneficial effects of the above further scheme are as follows: by arranging the first separation groove and the second separation groove, the ceramic plate mounting plane can be divided into three parts by the first separation groove and the second separation groove, the heat-conducting silicone grease can be applied on the part between the two separation grooves, the cement can be applied on the two sides, and the two separation grooves can realize zero penetration and mutual interference between the heat-conducting silicone grease and the cement.
[0011] Further, a third separation groove is formed on the PCB plate mounting plane, the third separation groove is located at the joint of the ceramic plate mounting plane and the PCB plate mounting plane and on the PCB plate mounting plane, and the third separation groove is arranged in extension along the length direction parallel to the second flow channel.
[0012] The beneficial effects of the above further scheme are as follows: by arranging the third separation groove, the PCB plate can be arranged closely to the side wall during mounting.
[0013] Further, the closest distance between the first flow channel and the ceramic plate mounting plane is a, the closest distance between the second flow channel and the PCB plate mounting plane is b, and a=b.
[0014] The beneficial effects of the above further scheme are as follows: the ceramic plate and the PCB plate can be effectively cooled.
[0015] Further, the other side of the print head mounting substrate is provided with a communication hole, one end of the first flow channel and one end of the second flow channel are both through the one end surface of the print head mounting substrate, and the other end of the first flow channel and the other end of the second flow channel are both located in the print head mounting substrate; the communication hole communicates the other end of the first flow channel and the other end of the second flow channel.
[0016] The beneficial effect of the above further scheme is that the communication hole facilitates the formation of a fluid circuit in the print head mounting substrate.
[0017] Further, one end of the first flow channel is machined to form a first interface, one end of the second flow channel is machined to form a second interface, the inner diameter of the first interface is larger than the inner diameter of the first flow channel, the inner diameter of the second interface is larger than the inner diameter of the second flow channel, the first interface is arranged eccentrically with the first flow channel, and the second interface is coaxially arranged with the second flow channel; the first interface and the second interface are located at the same horizontal height, and the distance between the central axis of the first flow channel and the ceramic plate mounting plane is smaller than the distance between the central axis of the first interface and the ceramic plate mounting plane.
[0018] Further, the height difference between the ceramic plate mounting plane and the PCB plate mounting plane is 0.8-1.2 mm; the material of the print head mounting substrate is 7075-T6 aluminum alloy; the diameter of the first flow channel is 5-7 mm, and the diameter of the second flow channel is 5-7 mm; the ceramic plate mounting plane and the PCB plate mounting plane are both arranged in parallel with the other side of the print head mounting substrate.
[0019] Further, a plurality of threaded holes are formed in the print head mounting substrate, and the plurality of threaded holes are located between the first flow channel and the second flow channel.
[0020] The beneficial effect of the above further scheme is that the threaded holes facilitate the connection and fixation of the print head mounting substrate.
[0021] The application also provides a manufacturing method of a heat-diffusion printing head liquid cooling heat dissipation substrate, which comprises the following steps: S1, drilling two parallel axial deep holes in the print head mounting substrate to form a first flow channel and a second flow channel; S2, drilling a communication hole to communicate the closed ends of the first flow channel and the second flow channel, and laser welding the opening of the communication hole to seal, so that the first flow channel, the second flow channel and the communication hole form a closed cooling circuit; S3, milling a ceramic plate mounting plane and a PCB plate mounting plane in the form of a stepped structure on one side of the print head mounting substrate, so that the height of the ceramic plate mounting plane is higher than that of the PCB plate mounting plane.
[0022] The application has the advantages that the manufacturing method is simple, the heat dissipation substrate has high structural strength and good heat dissipation effect, and overcomes the heat dissipation deficiency of the prior art. The liquid cooling circuit is integrated in the printhead mounting substrate, so that the heat transfer efficiency is greatly improved, and the thermal response time is shortened.
[0023] The application further provides a thermal dye sublimation printhead, which comprises the thermal dye sublimation printhead liquid cooling heat dissipation substrate, and further comprises a ceramic plate and a PCB plate. The ceramic plate mounting plane is coated with heat-conducting silicone grease in the region corresponding to the first flow channel, the ceramic plate mounting plane on both sides of the heat-conducting silicone grease is coated with adhesive, the heat-conducting silicone grease and the adhesive are arranged in a spaced manner, and the ceramic plate is combined on the ceramic plate mounting plane through the adhesive and the heat-conducting silicone grease. The PCB plate mounting plane is coated with adhesive, and the PCB plate is combined on the PCB plate mounting plane through the adhesive.
[0024] The application has the advantages that the thermal dye sublimation printhead discards the traditional air convection or passive heat conduction heat dissipation mode with low efficiency, and innovatively introduces a liquid cooling system. By using the characteristics that the specific heat capacity and thermal conductivity of liquid are much higher than those of air, the liquid can efficiently and quickly absorb and take away a large amount of heat concentrated in the thermal dye sublimation printhead under high power and high load continuous work. The application ingeniously reforms the original machine structure, redesigns and integrates the mounting substrate of the key component, i.e., the thermal dye sublimation printhead, into a liquid cooling system core heat dissipation module (cold plate). The cold plate is internally provided with a fine flow channel, and the heat dissipation efficiency of the core heat source region is maximized on the premise of guaranteeing the original mechanical support and mounting positioning function. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 FIG. 1 is a schematic view of an end face structure of a thermal dye sublimation printhead liquid cooling heat dissipation substrate according to the application; Figure 2 FIG. 2 is a schematic view of an end face structure of a thermal dye sublimation printhead liquid cooling heat dissipation substrate in a use state according to the application; Figure 3 FIG. 3 is a schematic view of a three-dimensional structure of a thermal dye sublimation printhead liquid cooling heat dissipation substrate according to the application; Figure 4 FIG. 4 is a schematic view of a sectional structure of a thermal dye sublimation printhead liquid cooling heat dissipation substrate according to the application.
[0026] In the drawings, the components represented by the respective reference numerals are listed as follows: 1, printhead mounting substrate; 2, first flow channel; 3, second flow channel; 4, first interface; 5, second interface; 6, ceramic plate mounting plane; 7, PCB plate mounting plane; 8, ceramic plate; 9, PCB plate; 10, first separation through slot; 11, second separation through slot; 12, third separation through slot; 13, communication hole; 14, threaded hole; 15, heating wire. Detailed Implementation
[0027] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.
[0028] Example 1 like Figures 1-4 As shown, a liquid-cooled heat dissipation substrate for a thermal sublimation printhead in this embodiment includes a printhead mounting substrate 1. A first flow channel 2 and a second flow channel 3 are formed in parallel and interconnected within the printhead mounting substrate 1. A ceramic plate mounting plane 6 and a PCB board mounting plane 7 are formed on one side of the printhead mounting substrate 1 in a stepped arrangement. The height of the ceramic plate mounting plane 6 is higher than that of the PCB board mounting plane 7. The first flow channel 2 is arranged parallel to the ceramic plate mounting plane 6, and the second flow channel 3 is arranged parallel to the PCB board mounting plane 7.
[0029] like Figure 3 and Figure 4 As shown, in a specific embodiment, a connecting hole 13 is provided on the other side of the printhead mounting substrate 1. One end of the first flow channel 2 and one end of the second flow channel 3 both penetrate one end face of the printhead mounting substrate 1, and the other ends of the first flow channel 2 and the second flow channel 3 are both located inside the printhead mounting substrate 1. The connecting hole 13 connects the other ends of the first flow channel 2 and the second flow channel 3. By providing the connecting hole, it is convenient to form a fluid circuit within the printhead mounting substrate. After the connecting hole 13 connects the two flow channels, the opening of the connecting hole 13 is then welded shut. The ratio of the diameter of the connecting hole 13 to the diameter of the first flow channel 2 or the second flow channel 3 is in the range of 0.8 to 1.2.
[0030] like Figure 1 , Figure 2 and Figure 4 As shown, in a specific embodiment, a first interface 4 is formed at one end of the first flow channel 2, and a second interface 5 is formed at one end of the second flow channel 3. The inner diameter of the first interface 4 is larger than the inner diameter of the first flow channel 2, and the inner diameter of the second interface 5 is larger than the inner diameter of the second flow channel 3. The first interface 4 is eccentrically arranged with the first flow channel 2, and the second interface 5 is coaxially arranged with the second flow channel 3. The first interface 4 and the second interface 5 are located at the same horizontal height, and the distance between the central axis of the first flow channel 2 and the ceramic plate mounting plane 6 is smaller than the distance between the central axis of the first interface 4 and the ceramic plate mounting plane 6.
[0031] Specifically, the height difference between the ceramic plate mounting plane 6 and the PCB plate mounting plane 7 is 0.8-1.2 mm; the material of the print head mounting substrate 1 is 7075-T6 aluminum alloy; the diameter of the first flow channel 2 is 5-7 mm, and the diameter of the second flow channel 3 is 5-7 mm; the ceramic plate mounting plane 6 and the PCB plate mounting plane 7 are arranged in parallel with the other side of the print head mounting substrate 1. As shown in Figure 3 Specifically, a plurality of threaded holes 14 are formed in the print head mounting substrate 1, and the plurality of threaded holes 14 are located between the first flow channel 2 and the second flow channel 3. By providing threaded holes, the connection and fixation of the print head mounting substrate are facilitated. The print head mounting substrate can be mounted and fixed on the machine through the threaded holes.
[0032] The ceramic plate mounting plane 6 of the sublimation thermal print head liquid cooling heat dissipation substrate in this embodiment is used as a high-heat-density bearing surface to attach the ceramic plate integrated with the print head. The PCB plate mounting plane 7 is used to attach the PCB plate.
[0033] Preferably, as shown in Figure 1 and Figure 2 The ceramic plate mounting plane 6 and the PCB plate mounting plane 7 of this embodiment are arranged in parallel with each other, and the other side of the print head mounting substrate 1 is arranged in parallel with the ceramic plate mounting plane 6 and the PCB plate mounting plane 7.
[0034] The sublimation thermal print head liquid cooling heat dissipation substrate in this embodiment can utilize the metal substrate of the original sublimation thermal print head. By integrating flow channels inside and forming a ceramic plate mounting plane and a PCB plate mounting plane arranged in a stepped manner on one side of the print head mounting substrate, the heat transfer efficiency is greatly improved, the thermal response time is shortened, and the problem of poor heat dissipation effect of the existing sublimation thermal print head structure is overcome.
[0035] Embodiment 2 Based on embodiment 1, this embodiment provides a preferred scheme of the ceramic plate mounting plane 6. As shown in Figure 1 and Figure 2 The first separation groove 10 and the second separation groove 11 are formed in the ceramic plate mounting plane 6, and the first separation groove 10 and the second separation groove 11 are arranged in parallel to the length direction of the first flow channel 2. By providing the first separation groove and the second separation groove, the first separation groove and the second separation groove can divide the ceramic plate mounting plane into three parts. The heat-conducting silicone grease can be applied between the two separation grooves, and the adhesive can be applied on both sides. The adhesive can be high-temperature-resistant epoxy resin. The two separation grooves can achieve zero penetration and mutual interference between the heat-conducting silicone grease and the adhesive.
[0036] Specifically, the slot width of the first and second partition grooves 10 and 11 is 0.8-1.2 mm, and the slot depth is 0.8-1.2 mm. As shown in Figure 1 and Figure 2 The first flow channel is arranged on one side between the first and second partition grooves.
[0037] Embodiment 3 On the basis of Embodiment 1 or Embodiment 2, this embodiment provides a preferred scheme of the PCB mounting plane 7. As shown in Figure 1 and Figure 2 A third partition groove 12 is formed on the PCB mounting plane 7, and the third partition groove 12 is located at the intersection of the ceramic plate mounting plane 6 and the PCB mounting plane 7 and on the PCB mounting plane 7; the third partition groove is arranged along the length direction parallel to the second flow channel. The second flow channel is located on one side of the third partition groove. By arranging the third partition groove, the PCB can be arranged close to the side wall during mounting.
[0038] Embodiment 4 On the basis of any of the above embodiments, this embodiment provides a preferred arrangement of the flow channel. As shown in Figure 1 and Figure 2 The closest distance between the first flow channel 2 and the ceramic plate mounting plane 6 is a, and the closest distance between the second flow channel 3 and the PCB mounting plane 7 is b, and a=b. By limiting the distance between the two flow channels and the mounting plane, the first flow channel is closer to the heat source of the ceramic plate under the condition of meeting the structural strength, the heat conduction distance is reduced, the heat is removed faster, and the ceramic plate and the PCB can be effectively cooled.
[0039] Embodiment 5 The manufacturing method of the above-mentioned sublimation printing head liquid cooling heat dissipation substrate includes the following steps: S1, two parallel axial deep holes are drilled on the printing head mounting substrate 1 to form a first flow channel 2 and a second flow channel 3; S2, a communication hole 13 is drilled to connect the closed ends of the first flow channel 2 and the second flow channel 3, and the opening of the communication hole 13 is laser welded to seal, so that the first flow channel 2, the second flow channel 3 and the communication hole 13 form a closed-loop cooling circuit; S3, a ceramic plate mounting plane 6 and a PCB mounting plane 7 with a stepped structure are milled on one side of the printing head mounting substrate 1, so that the height of the ceramic plate mounting plane 6 is higher than that of the PCB mounting plane 7.
[0040] The manufacturing method of this embodiment is simple in process, and the heat dissipation substrate formed has high structural strength and good heat dissipation effect. The manufacturing method of this embodiment is simple in process, and the heat dissipation substrate formed has high structural strength and good heat dissipation effect.
[0041] Embodiment 6 The embodiment also provides a thermal dye-sublimation print head, which comprises the liquid-cooled heat-dissipation substrate of the thermal dye-sublimation print head according to any one of the above embodiments, and further comprises a ceramic plate 8 and a PCB plate 9, the ceramic plate mounting plane 6 is coated with a heat-conducting silicone grease in the area corresponding to the first flow channel 2, the ceramic plate mounting plane 6 on both sides of the heat-conducting silicone grease is coated with an adhesive, the heat-conducting silicone grease and the adhesive are arranged in a spaced manner, the ceramic plate 8 is combined on the ceramic plate mounting plane 6 through the adhesive and the heat-conducting silicone grease; the PCB plate mounting plane 7 is coated with an adhesive, and the PCB plate 9 is combined on the PCB plate mounting plane 7 through the adhesive. The side of the ceramic plate 8 away from the ceramic plate mounting plane 6 is provided with a heating wire 15.
[0042] Other necessary components of the thermal dye-sublimation print head of the embodiment can be components commonly used in print heads.
[0043] The thermal dye-sublimation print head of the embodiment discards the traditional air convection or passive heat conduction heat dissipation mode with low efficiency, and innovatively introduces a liquid cooling system. By using the characteristics that the specific heat capacity and thermal conductivity of liquid are much higher than those of air, the liquid can efficiently and quickly absorb and take away a large amount of highly concentrated heat generated by the thermal dye-sublimation print head under high power and high load continuous work. The original machine structure is ingeniously modified, and the installation substrate of the key component, the thermal dye-sublimation print head, is redesigned and integrated into a liquid cooling system core heat dissipation module (cold plate). The cold plate is provided with a fine flow channel, which maximizes the heat dissipation efficiency of the core heat source area on the premise of guaranteeing the original mechanical support and installation positioning function.
[0044] In the description of the present application, it should be understood that the terms "center", "length", "horizontal", "inner", "outer", "axial" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0045] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0046] In the present application, unless specifically defined otherwise, the terms "mounting", "connected", "connecting", "fixed", "fixedly connected", "connection", "fixedly connected", "connected", "fixed", and the like should be construed broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be directly connected, or indirectly connected through an intermediate medium; can be internal communication of two elements or interaction relationship between two elements, unless specifically defined otherwise. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0047] In the present application, unless specifically defined otherwise, the first feature is "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.
[0048] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.
[0049] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application, and those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.
Claims
1. A liquid-cooled heat dissipation substrate for a thermal dye sublimation printhead, characterized by, The printing head mounting base plate is provided with a first flow channel and a second flow channel which are arranged in parallel and communicated, and a ceramic plate mounting plane and a PCB plate mounting plane which are arranged in a stepped manner on one side surface of the printing head mounting base plate, the height of the ceramic plate mounting plane is higher than that of the PCB plate mounting plane, the first flow channel is arranged in parallel corresponding to the ceramic plate mounting plane, and the second flow channel is arranged in parallel corresponding to the PCB plate mounting plane.
2. The liquid-cooled heat dissipation substrate for a thermal dye sublimation printhead according to claim 1, wherein, The ceramic plate mounting plane is provided with a first separation groove and a second separation groove which are arranged in extension along the length direction parallel to the first flow channel.
3. The liquid-cooled heat-diffusion substrate for a thermal dye sublimation printhead according to claim 1, wherein, The PCB plate mounting plane is provided with a third separation groove which is located at the joint of the ceramic plate mounting plane and the PCB plate mounting plane and on the PCB plate mounting plane, and the third separation groove is arranged in extension along the length direction parallel to the second flow channel.
4. The liquid-cooled heat-dissipation substrate for a thermal dye diffusion printing head according to claim 1, wherein The closest distance between the first flow channel and the ceramic plate mounting plane is a, and the closest distance between the second flow channel and the PCB plate mounting plane is b, a = b.
5. The liquid-cooled heat-dissipation substrate for a thermal dye sublimation printhead according to claim 1, wherein The other side surface of the printing head mounting base plate is provided with a communication hole, one end of the first flow channel and one end of the second flow channel penetrate the end surface of the printing head mounting base plate, and the other end of the first flow channel and the other end of the second flow channel are located in the printing head mounting base plate; the communication hole communicates the other end of the first flow channel and the other end of the second flow channel.
6. The liquid-cooled heat-diffusion substrate for a thermal dye sublimation printhead according to claim 5, wherein, One end of the first flow channel is formed with a first interface, one end of the second flow channel is formed with a second interface, the inner diameter of the first interface is larger than that of the first flow channel, the inner diameter of the second interface is larger than that of the second flow channel, the first interface is arranged eccentrically with the first flow channel, and the second interface is coaxially arranged with the second flow channel; the first interface and the second interface are located at the same horizontal height, and the distance between the center axis of the first flow channel and the ceramic plate mounting plane is smaller than the distance between the center axis of the first interface and the ceramic plate mounting plane.
7. The liquid-cooled heat-diffusion substrate for a thermal dye sublimation printhead of claim 1, wherein, The height difference between the ceramic plate mounting plane and the PCB plate mounting plane is 0.8-1.2 mm; the material of the printing head mounting base plate is 7075-T6 aluminum alloy; the diameter of the first flow channel is 5-7 mm, and the diameter of the second flow channel is 5-7 mm; the ceramic plate mounting plane and the PCB plate mounting plane are arranged in parallel with the other side surface of the printing head mounting base plate.
8. The liquid-cooled heat-diffusion substrate for a thermal dye sublimation printhead of claim 1, wherein, A plurality of threaded holes are formed on the printing head mounting base plate, and the plurality of threaded holes are located between the first flow channel and the second flow channel.
9. A method for manufacturing a liquid-cooled heat dissipation substrate for a thermal dye sublimation printhead, characterized in that, The method comprises the following steps: S1, drilling two parallel axial deep holes on the printing head mounting base plate to form a first flow channel and a second flow channel; S2, drilling a communication hole to communicate the closed ends of the first flow channel and the second flow channel, and laser welding the opening of the communication hole to seal the communication hole, so as to form a closed cooling loop of the first flow channel, the second flow channel and the communication hole; S3, milling on one side of the print head mounting substrate to form a stepped structure of the ceramic plate mounting plane and the PCB plate mounting plane, so that the height of the ceramic plate mounting plane is higher than the PCB plate mounting plane.
10. A thermal dye sublimation printhead characterized by, The liquid-cooled heat dissipation substrate for the thermal dye diffusion printing head comprises a ceramic plate and a PCB plate, a region corresponding to the first flow channel of the ceramic plate mounting plane is coated with a heat-conducting silicone grease, both sides of the heat-conducting silicone grease of the ceramic plate mounting plane are coated with an adhesive, the heat-conducting silicone grease and the adhesive are arranged in a spaced manner, and the ceramic plate is combined on the ceramic plate mounting plane through the adhesive and the heat-conducting silicone grease; the PCB plate mounting plane is coated with an adhesive, and the PCB plate is combined on the PCB plate mounting plane through the adhesive.