A semiconductor chip coating device and a coating method

Abstract

The application belongs to the technical field of semiconductor, and particularly relates to a semiconductor chip coating device and a coating method. The device comprises a workbench, the upper end surface of the workbench is rotationally provided with a coating disc, the upper end surface of the coating disc is fixedly provided with a plurality of support frames arranged in a circumferential array, the inner side of each support frame is provided with a suction tube, the upper side of each support frame is provided with a chip body, the suction tube is used for suction of the lower end surface of the chip body, the side of the workbench and the side wall of the coating disc are provided with a coating frame, and the end surface of the coating frame is provided with a coating head. A controller controls the coating disc to stop rotating and controls the coating head to move to the side close to the chip body, and then the coating head performs coating treatment on the upper end surface and the periphery of the chip body. Through the design of the contact point one and the contact point two, one group of chip bodies can be moved to below the coating head when the two contact each other.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor, and particularly relates to a semiconductor chip coating device and a coating method. BACKGROUND

[0002] Semiconductor chips are everywhere, and coating is an important part of the production of semiconductor chips. The current coating device mostly adopts a vacuum coating process, and the vacuum coating process needs to use a coating device.

[0003] The prior art also proposes some solutions. For example, a semiconductor chip coating device is disclosed in a Chinese patent application with the announcement number CN210866113U, which comprises a bottom plate, an operation disc, an operation disc control unit, a baffle, a circular shaft control unit, a circular shaft, a coating head and a support column. The upper surface of the bottom plate is fixedly connected with support frame one, support frame two and a support plate. The middle part of the bottom plate is provided with the operation disc control unit. The support frame one is located on the front side of the bottom plate. The operation disc is installed on the upper part of the operation disc control unit. The support column is fixedly connected to the upper surface of the left end of the bottom plate. The support column is a right-angle support column. The middle part of the right side surface of the support column is fixedly connected with a support rod. When the semiconductor chip coating device works, it can coat completely, quickly and efficiently.

[0004] Although the above technical solution improves the chip coating efficiency, it still has other problems in specific use. In order to improve the stability in the coating process, the chip needs to be clamped at present. However, when clamping with the clamping mechanism, the chip side wall will be clamped, which causes the problem that the coating head is difficult to coat the clamped part of the side wall in the subsequent coating process. Moreover, because the clamping mechanism directly contacts the surface of the chip, the surface of the chip may be scratched.

[0005] Therefore, the application provides a semiconductor chip coating device and a coating method. SUMMARY

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem in the background art.

[0007] The technical scheme adopted by the application to solve the technical problems is that the semiconductor chip coating device comprises a workbench, the upper end surface of the workbench is rotationally provided with a coating disc, the upper end surface of the coating disc is fixedly provided with a plurality of support frames arranged in a circumferential array, the inner side of each support frame is provided with a suction tube, the suction tube is used for suction of the lower end surface of the chip body, the side of the workbench and the side wall of the coating disc are provided with a coating frame, and the end surface of the coating frame is provided with a coating head.

[0008] Preferably, the side wall of the support frame is fixedly installed with the contact one, the side wall of the coating frame is installed with the contact two through the support rod, and the coating disc drives the contact one to rotate and contact with the contact two of the side wall of the coating frame during rotation.

[0009] Preferably, the inside of the coating disc is provided with an annular pipeline, the bottom end of each adsorption pipe penetrates into the inside of the annular pipeline, the inside of the annular pipeline realizes internal negative pressure through the external suction pipe, the suction pipe is installed in the inside of the coating disc and is controlled through the controller and the valve body; during work, the suction pipe is controlled to suck through the controller, so that the annular pipeline and each adsorption pipe are in a negative pressure state, so that the adsorption pipe can adsorb the lower end face of the chip body, thereby ensuring the stability during subsequent coating process; in this way, the problem that the coating head is difficult to coat the clamping part of the side wall during subsequent coating due to the use of the clamping mechanism to clamp the side wall of the chip body in the prior art can be avoided, and the problem that the chip body may be damaged due to excessive force of the clamping mechanism due to the small hardness of the chip body can also be avoided, which is beneficial to the subsequent use of the semiconductor chip.

[0010] Preferably, the outer circumferential surface of the adsorption pipe is fixedly installed with a square block, both side walls of the square block are provided with a guide groove, the groove wall of the guide groove is fixedly installed with an electric telescopic rod, the telescopic end of the electric telescopic rod is fixedly installed with an inclined frame, and the top end of the inclined frame is fixedly installed with an annular placing frame.

[0011] Preferably, the inner wall of the annular placing frame is provided with a limiting ring groove, the diameter of the limiting ring groove is greater than the length of the chip body, the limiting ring groove is provided with smooth rubber, and the shape of the guide groove is matched with the shape of the electric telescopic rod; during work, since the limiting ring groove is arranged on the inner wall of the annular placing frame, the chip body is first placed in the limiting ring groove when the chip body is transferred by the mechanical hand to the inner wall of the annular placing frame, and then the annular placing frame and the limiting ring groove move along the side wall of the chip body when the annular placing frame is lowered through the above control after the adsorption pipe adsorbs. In this way, the chip body can be conveniently placed on the inside of the limiting ring groove, and the chip body will not be moved when the limiting ring groove moves from the side wall of the chip body.

[0012] Preferably, the inner wall of the annular pipeline is installed with a circumferentially arrayed elastic telescopic column, each group of elastic telescopic columns and adsorption pipes are in one-to-one correspondence, the upper end surface of each group of elastic telescopic columns is fixedly installed with a magnetic plate, the outer surface of the elastic telescopic column is sleeved with a telescopic spring, the upper side of the workbench and the side wall of the coating disc are installed with a recovery table, the upper side of the workbench is provided with a recovery unit, the recovery unit is used to recover the chip body after coating, the inside of the workbench and the side close to the recovery table are installed with a magnetic block, and the magnetism of the magnetic block is the same as that of the magnetic plate.

[0013] Preferably, the recycling unit comprises an L-shaped fixed rod installed at the middle of the workbench and not in contact with the coating disc, one end of the L-shaped fixed rod away from the workbench is fixedly installed with an arc-shaped protruding block, the lower end surface of the chip body will be in contact with the protruding end of the arc-shaped protruding block during the rotation of the coating disc driving the supporting frame and the chip body, and the recycling table is designed to be inclined relative to the horizontal plane.

[0014] When the coating disc stops rotating, the chip body with completed coating is just moved to the side corresponding to the magnetic block, and the magnetic plate moves towards the bottom of the adsorption tube; during this process, the coating disc drives the chip body with completed coating to move towards the side close to the arc-shaped protruding block, and gradually moves along the horizontal surface of the arc-shaped protruding block to the protruding surface, and then under the limiting of the protruding surface of the arc-shaped protruding block, the chip body is in an inclined state, at this time, the adsorption force of the adsorption tube is reduced, and the chip body in the inclined state slides to the surface of the recycling table and is recycled to the external device along the recycling table.

[0015] Preferably, the surface of the recycling table is installed with a plurality of rotating rollers, and the plurality of rotating rollers are arranged in a linear array; when the chip body is inclined on the surface of the recycling table, the rotating rollers can be controlled to rotate, so that the rotating rollers drive the chip body to move, thereby making the chip body move away from the adsorption tube as soon as possible.

[0016] Preferably, a semiconductor chip coating method is provided, which adopts the semiconductor chip coating device described above, and comprises the following steps:

[0017] S1, the chip body is clamped and sent from the transportation station to the upper side of the supporting frame by an external mechanical adsorption hand, and the lower end surface of the chip body is tightly adsorbed on the upper side of the supporting frame by the adsorption of the adsorption tube to generate negative pressure;

[0018] S2, then the coating disc is controlled to rotate above the workbench by an external controller, so that the coating disc drives one group of supporting frames and the chip body to move towards the side close to the coating frame;

[0019] S3, when the chip body moves below the coating head, the movement of the coating disc is stopped, and then the chip body can be coated by the coating head.

[0020] Preferably, in the step S1, the material of the adsorption tube is rubber.

[0021] The beneficial effects of the present application are as follows:

[0022] 1. The semiconductor chip coating device and coating method, the magnetic plate moves to the bottom of the adsorption tube, then the magnetic plate is close to the bottom of the adsorption tube, so that the adsorption force of the adsorption tube moving to the recovery table side is small, and then under the action of the recovery unit, the chip body after coating can be pressed and moved to the surface of the recovery table, realizing the automatic recovery function of the chip body after coating, without manual operation.

[0023] 2. The semiconductor chip coating device and coating method, when the subsequent chip body coating is completed, and the coating disc continues to rotate, one of the magnetic plates is separated from the magnetic block, and under the elastic force of the elastic telescopic column, the magnetic plate can be driven to return to the initial position, and when the subsequent chip body moves above the magnetic block again, the chip body after coating can be taken out according to the above steps, so that the chip body can be continuously coated and recovered, and the operation is more convenient, which is beneficial to the use of subsequent semiconductor chips. BRIEF DESCRIPTION OF DRAWINGS

[0024] The application will be further described below with reference to the drawings.

[0025] Figure 1 is a perspective view of the application;

[0026] Figure 2 is a schematic view of the coating frame structure in the application;

[0027] Figure 3 is a schematic view of the top structure in the application;

[0028] Figure 4 is a schematic view of the support frame structure in the application;

[0029] Figure 5 is a schematic view of the adsorption tube structure in the application;

[0030] Figure 6 is a schematic view of the square block structure in the application;

[0031] Figure 7 is a schematic view of the magnetic block structure in the application;

[0032] Figure 8 is a schematic view of the recovery table structure in the application;

[0033] Figure 9 is a schematic view of the L-shaped fixed rod structure in the application;

[0034] Figure 10 is a schematic view of the arc-shaped protrusion structure in the application;

[0035] Figure 11 is a method flowchart of the application.

[0036] In the diagram: 1. Workbench; 101. Coating rack; 102. Coating head; 2. Coating disc; 3. Support frame; 4. Adsorption tube; 301. Chip body; 5. Contact one; 6. Contact two; 7. Annular pipe; 8. Square block; 9. Guide groove; 901. Electric telescopic rod; 10. Inclined frame; 11. Annular placement rack; 12. Limiting ring groove; 13. Elastic telescopic column; 14. Magnetic plate; 15. Magnetic block; 16. Recycling table; 17. L-shaped fixing rod; 18. Arc-shaped protrusion; 19. Rotating roller. Detailed Implementation

[0037] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0038] like Figures 1 to 10 As shown in the embodiment of the present invention, a semiconductor chip coating apparatus includes a worktable 1. A coating disk 2 is rotatably mounted on the upper surface of the worktable 1. A plurality of support frames 3 arranged in a circumferential array are fixedly mounted on the upper surface of the coating disk 2. An adsorption tube 4 is provided on the inner side of each support frame 3. During coating, the chip body 301 is placed above each support frame 3. The adsorption tube 4 is used to adsorb the lower surface of the chip body 301. A coating rack 101 is mounted on the side of the worktable 1 and on the side wall of the coating disk 2. A coating head 102 is provided on the end face of the coating rack 101.

[0039] During operation, an external mechanical suction arm clamps the chip body 301 from the transport station to the support frame 3. The suction tube 4 generates negative pressure, tightly adhering the lower surface of the chip body 301 to the support frame 3. An external controller then controls the coating disc 2 to rotate above the worktable 1, causing it to move one set of support frames 3 and the chip body 301 closer to the coating frame 101. When the chip body 301 moves below the coating head 102, the movement of the coating disc 2 stops, and the coating head 102 then coats the chip body 301. Adhering the lower surface of the chip body 301 via the suction tube 4 avoids the problem in existing technologies where clamping mechanisms hold the sidewalls of the chip body 301, making it difficult for the coating head 102 to coat the clamped areas. It also avoids damage caused by excessive force from the clamping mechanism due to the relatively low hardness of the chip body 301.

[0040] It should be noted that the moving mode of the coating frame 101 and the coating of the chip body 301 by the coating head 102 are both prior art, i.e. sputtering stainless steel (transition layer) and copper (shielding layer) on the top surface and four side walls of the chip body 301 to prevent electromagnetic interference, which will not be described in detail in the embodiment of the present application.

[0041] Moreover, the driving mode of the rotating coating disc 2 is also prior art, in the embodiment of the present application, the outer wall of the coating disc 2 can be provided with a gear ring, and the gear ring and the coating disc 2 can be driven to rotate by a gear.

[0042] The side wall of the support frame 3 is fixedly provided with a contact one 5, and the side wall of the coating frame 101 is provided with a contact two 6 through a support rod, the contact one 5 will rotate and contact the contact two 6 of the side wall of the coating frame 101 during the rotation of the coating disc 2.

[0043] During work, the coating disc 2 is controlled to rotate above the workbench 1 by an external controller, so that the coating disc 2 drives one group of support frames 3 and the chip body 301 to move towards the side close to the coating frame 101, and the coating disc 2 drives the support frame 3 and the contact one 5 to move towards the side close to the contact two 6 at the same time, when the contact one 5 and the contact two 6 contact, the contact two 6 will transmit a contact signal to the external controller, the controller will first control the coating disc 2 to stop rotating, and then control the coating head 102 to move towards the side close to the chip body 301, and then the coating head 102 will perform coating on the upper end surface and the four sides of the chip body 301.

[0044] Through the design of the contact one 5 and the contact two 6, one group of chip bodies 301 can be just moved below the coating head 102 when the two contacts, so that the movement of the coating disc 2 can be automatically controlled, and the coating of the chip body 301 is facilitated.

[0045] The inside of the coating disc 2 is provided with an annular pipeline 7, the bottom end of each suction pipe 4 penetrates the inside of the annular pipeline 7, and the inside of the annular pipeline 7 is connected to an external suction pipe to achieve internal negative pressure, the suction pipe is installed in the inside of the coating disc 2 and is controlled by a controller and a valve body.

[0046] During work, the controller controls the suction pipe to suck, so that the annular pipeline 7 and each suction pipe 4 are in a negative pressure state, so that the suction pipe 4 can adsorb the lower end surface of the chip body 301, and the stability during the subsequent coating process is ensured; in this way, the problem that the side wall of the chip body 301 is clamped by a clamping mechanism in the prior art, so that the clamping part of the side wall is difficult to be coated by the coating head 102 during the subsequent coating process can be avoided, and the problem that the chip body 301 is directly contacted with the clamping mechanism, so that the surface of the chip body 301 is scratched can also be avoided, which is conducive to the use of the subsequent semiconductor chip.

[0047] The outer peripheral surface of the adsorption pipe 4 is fixedly installed with a square block 8, both side walls of the square block 8 are provided with a guide groove 9, the groove wall of the guide groove 9 is fixedly installed with an electric telescopic rod 901, the telescopic end of the electric telescopic rod 901 is fixedly installed with an inclined frame 10, and the top end of the inclined frame 10 is fixedly installed with an annular placing frame 11.

[0048] When the chip body 301 is transported to the upper side of the adsorption pipe 4 by the external mechanical adsorption hand, the chip body 301 will first fall on the inner side of the annular placing frame 11, and as shown in the attached Figure 5 When the adsorption pipe 4 adsorbs the bottom of the chip body 301, the telescopic end of the electric telescopic rod 901 is controlled to move by the controller, so that the telescopic end drives the inclined frame 10 to move downward, the inclined frame 10 drives the annular placing frame 11 to move downward, that is, the annular placing frame 11 moves away from the side of the chip body 301, and then only the adsorption of the adsorption pipe 4 can adsorb the lower end surface of the chip body 301, so that the annular placing frame 11 can avoid affecting the film coating head 102 to coat the side wall of the chip body 301.

[0049] It should be noted that during the transportation of the chip body 301 by the mechanical adsorption hand, the part adsorbed by the mechanical adsorption hand is the upper end surface of the chip body 301, and when falling on the upper end surface of the annular placing frame 11, it is the lower end surface of the chip body 301.

[0050] The inner wall of the annular placing frame 11 is provided with a limiting ring groove 12, the diameter of the limiting ring groove 12 is greater than the length of the chip body 301, the limiting ring groove 12 is provided with smooth rubber, and the shape of the guide groove 9 is matched with the shape of the electric telescopic rod 901.

[0051] During work, since the limiting ring groove 12 is arranged on the inner wall of the annular placing frame 11, when the chip body 301 is transported to the inner wall of the annular placing frame 11 by the mechanical hand, the chip body 301 will first be placed in the limiting ring groove 12, and then after the adsorption of the adsorption pipe 4, the annular placing frame 11 is moved downward by the above-mentioned control, so that the annular placing frame 11 and the limiting ring groove 12 move along the side wall of the chip body 301. By this design, the chip body 301 can be conveniently placed on the inner side of the limiting ring groove 12, and the subsequent movement of the limiting ring groove 12 from the side wall of the chip body 301 will not drive the chip body 301 to move.

[0052] The inner wall of the annular pipeline 7 is provided with elastic telescopic columns 13 in a circumferential array, each group of elastic telescopic columns 13 and the adsorption pipe 4 are in one-to-one correspondence, the upper end surface of each group of elastic telescopic columns 13 is fixedly provided with a magnetic plate 14, the outer surface of the elastic telescopic column 13 is sleeved with a telescopic spring, the upper side of the workbench 1 and the side wall of the coating disc 2 are provided with a recovery table 16, the upper side of the workbench 1 is provided with a recovery unit, the recovery unit is used for recovering the chip body 301 after coating is completed, the inside of the workbench 1 and the side close to the recovery table 16 are provided with a magnetic block 15, the magnetism of the magnetic block 15 is the same as that of the magnetic plate 14;

[0053] In work, after the chip body 301 is coated once, the coating disc 2 continues to rotate, and the subsequent support frame 3 and the contact one 5 continue to rotate, when the next group of contact one 5 and contact two 6 are in contact, the chip body 301 after coating is completed is just moved to the side of the recovery table 16, and the contact two 6 transmits a contact signal to the controller, when the coating disc 2 stops rotating; the chip body 301 after coating is completed is just moved to the side of the corresponding position of the magnetic block 15, because the magnetism of the magnetic block 15 is the same as that of the magnetic plate 14, according to the principle of same nature repelling, the magnetic plate 14 moves to the side away from the magnetic block 15, that is, the magnetic plate 14 moves to the bottom of the adsorption pipe 4, then the magnetic plate 14 approaches the bottom of the adsorption pipe 4, so that the adsorption force of the adsorption pipe 4 on the side of the recovery table 16 is small, and then under the action of the recovery unit, the chip body 301 after coating is completed is pressed and moved to the surface of the recovery table 16, realizing the automatic recovery function of the chip body 301 after coating is completed, without manual operation of the staff;

[0054] It should be noted that the repulsion of the magnetic block 15 to the magnetic plate 14 can drive the magnetic plate 14 to move to the bottom of the adsorption pipe 4.

[0055] The recovery unit comprises an L-shaped fixed rod 17, the L-shaped fixed rod 17 is installed in the middle of the workbench 1 and does not contact the coating disc 2, one end of the L-shaped fixed rod 17 away from the workbench 1 is fixedly provided with an arc-shaped protruding block 18, the lower end surface of the chip body 301 contacts the protruding end of the arc-shaped protruding block 18 in the process that the coating disc 2 drives the support frame 3 and the chip body 301 to rotate, the recovery table 16 is inclined relative to the horizontal plane;

[0056] When working, the chip body 301 after plating is just moved to the side corresponding to the magnetic block 15 while the plating disc 2 stops rotating and the magnetic plate 14 moves towards the bottom of the adsorption tube 4; in this process, the plating disc 2 drives the chip body 301 after plating to move to the side close to the arc-shaped protrusion 18 and gradually move along the horizontal plane of the arc-shaped protrusion 18 to the protruding surface, and then the chip body 301 is in an inclined state under the limiting of the protruding surface of the arc-shaped protrusion 18, at this time, the adsorption force of the adsorption tube 4 is reduced, and the chip body 301 in the inclined state slides to the surface of the recovery table 16 and is recovered to the external device along the recovery table 16.

[0057] It should be noted that when the magnetic plate 14 contacts the bottom of the adsorption tube 4, the adsorption force of the adsorption tube 4 will decrease, at this time, the adsorption force is not enough to adsorb the chip body 301, and the chip body 301 will fall onto the recovery table 16 under its own gravity when it is inclined.

[0058] A plurality of rotating rollers 19 are installed on the surface of the recovery table 16, and the plurality of rotating rollers 19 are arranged in a linear array; when the chip body 301 is inclined on the surface of the recovery table 16, the rotating rollers 19 can be controlled to rotate, so that the rotating rollers 19 drive the chip body 301 to move, so that the chip body 301 moves away from the adsorption tube 4 as soon as possible.

[0059] When the subsequent chip body 301 is plated, and the plating disc 2 continues to rotate, one of the magnetic plates 14 is separated from the magnetic block 15 at this time, and under the elastic force of the elastic telescopic column 13, the magnetic plate 14 can be restored to the initial position, and when the subsequent chip body 301 moves above the magnetic block 15 again, the chip body 301 after plating can be taken out according to the above steps. By this design, the chip body 301 can be continuously plated and recovered, which is convenient to operate and is beneficial to the use of subsequent semiconductor chips.

[0060] As shown in Figure 11 A semiconductor chip plating method, which adopts the semiconductor chip plating device described above, comprises the following steps:

[0061] S1, the chip body 301 is clamped from the transportation station to the upper side of the support frame 3 by an external mechanical adsorption hand, and the lower end surface of the chip body 301 is tightly adsorbed on the upper side of the support frame 3 by the adsorption of the adsorption tube 4 to generate negative pressure;

[0062] S2, then the plating disc 2 is controlled to rotate above the workbench 1 by an external controller, so that the plating disc 2 drives one group of support frames 3 and the chip body 301 to move to the side close to the plating frame 101;

[0063] S3, when the chip body 301 moves to the coating head 102 below, stop the movement of the coating disc 2 at this time, and then the chip body 301 can be coated by the coating head 102.

[0064] In step S1, the material of the adsorption tube 4 is rubber.

[0065] Working principle, in the initial state, the chip body 301 is sent to the upper side of the support frame 3 from the transport station by the external mechanical adsorption hand, and the lower end surface of the chip body 301 is tightly adsorbed on the upper side of the support frame 3 by the adsorption of the adsorption tube 4 to generate negative pressure; then the coating disc 2 is controlled to rotate on the workbench 1 by the external controller, so that the coating disc 2 drives one of the support frames 3 and the chip body 301 to move to the side close to the coating frame 101, and the coating disc 2 will simultaneously drive the support frame 3 and the contact one 5 to move to the side close to the contact two 6, when the contact one 5 and the contact two 6 contact, the contact two 6 will transmit the contact signal to the external controller, the controller will first control the coating disc 2 to stop rotating, and control the coating head 102 to move to the side close to the chip body 301, then the coating head 102 will coat the upper end surface and the surrounding of the chip body 301;

[0066] The controller controls the suction pipe to suck, so that the annular pipe 7 and each adsorption tube 4 are in a negative pressure state, so that the adsorption tube 4 can adsorb the lower end surface of the chip body 301, ensuring the stability in the subsequent coating process; such design can avoid the problem that the side wall of the chip body 301 is clamped by the clamping mechanism in the prior art, so that the coating head 102 is difficult to coat the clamping part of the side wall during subsequent coating, and also can avoid the problem that the chip body 301 directly contacts with the clamping mechanism, causing the surface of the chip body 301 to be scratched, which is beneficial to the subsequent use of the semiconductor chip;

[0067] When the external mechanical adsorption hand transfers the chip body 301 to the upper side of the adsorption tube 4, the chip body 301 will first fall on the inner side of the annular placing frame 11, and as shown in Figure 5The position shown, when the adsorption tube 4 adsorbs the bottom of the chip body 301, at this time, the telescopic end of the electric telescopic rod 901 is controlled to move by the controller, so that the telescopic end drives the inclined frame 10 to move downward, the inclined frame 10 drives the annular placing frame 11 to move downward, that is, the annular placing frame 11 moves away from the side of the chip body 301, and then only the adsorption of the adsorption tube 4 can adsorb the lower end surface of the chip body 301, so as to avoid the influence of the annular placing frame 11 on the film coating head 102 on the side wall of the chip body 301; Since the limiting ring groove 12 is opened in the inner wall of the annular placing frame 11, when the chip body 301 is transferred by the mechanical hand to the inner wall of the annular placing frame 11, the chip body 301 will be placed in the limiting ring groove 12 first, and then after the adsorption of the adsorption tube 4, the annular placing frame 11 is moved downward by the above-mentioned control, so that the annular placing frame 11 and the limiting ring groove 12 move along the side wall of the chip body 301. By this design, the chip body 301 can be conveniently placed on the inner side of the limiting ring groove 12, and the subsequent limiting ring groove 12 can be conveniently moved from the side wall of the chip body 301 without moving the chip body 301;

[0068] After the chip body 301 is coated once, the coating disc 2 continues to rotate, and the subsequent support frame 3 and the contact one 5 continue to rotate, when the next group of contact one 5 and contact two 6 contact, at this time, the chip body 301 which has been coated moves to the side of the recovery table 16, and the contact two 6 transmits the contact signal to the controller, and the coating disc 2 stops rotating; The chip body 301 which has been coated moves to the side corresponding to the magnetic block 15, and since the magnetism of the magnetic block 15 and the magnetism of the magnetic plate 14 are the same, according to the principle of same nature repelling, the magnetic plate 14 moves away from the magnetic block 15, that is, the magnetic plate 14 moves close to the bottom of the adsorption tube 4, and then the magnetic plate 14 moves close to the bottom of the adsorption tube 4, so that the adsorption force of the adsorption tube 4 on the recovery table 16 side becomes smaller, and then under the action of the recovery unit, the chip body 301 which has been coated is pressed and moved to the surface of the recovery table 16, realizing the automatic recovery function of the chip body 301 which has been coated, without manual operation of the staff;

[0069] When the coating disc 2 stops rotating, the chip body 301 with completed coating is just moved to the side corresponding to the position of the magnetic block 15, and the magnetic plate 14 moves towards the bottom of the suction tube 4; in this process, the coating disc 2 drives the chip body 301 with completed coating to move to the side close to the arc-shaped protrusion 18, and gradually moves along the horizontal plane of the arc-shaped protrusion 18 to the protruding surface, and then under the limiting of the protruding surface of the arc-shaped protrusion 18, the chip body 301 is in an inclined state, at this time the suction force of the suction tube 4 is reduced, and the chip body 301 in the inclined state slides to the surface of the recovery table 16 and is recovered to the external device along the recovery table 16; when the subsequent chip body 301 is coated, and the coating disc 2 continues to rotate, at this time one of the magnetic plates 14 is separated from the magnetic block 15, and under the elastic force of the elastic telescopic column 13, the magnetic plate 14 can be driven to return to the initial position, and when the subsequent chip body 301 moves above the magnetic block 15 again, the chip body 301 with completed coating can be taken out according to the above steps, so that the chip body 301 can be continuously coated and recovered, and the operation is more convenient, which is beneficial to the use of the subsequent semiconductor chip.

[0070] The basic principles, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip coating apparatus, characterized in that: The application relates to a chip coating device, which comprises a workbench, a coating disc is arranged on the upper end face of the workbench, a plurality of support frames in a circumferential array are fixedly arranged on the upper end face of the coating disc, an adsorption pipe is arranged on the inner side of each support frame and used for adsorbing the lower end face of a chip body, a coating frame is arranged on the side wall of the coating disc, an end face of the coating frame is provided with a coating head, a contact one is fixedly arranged on the side wall of the support frame, a contact two is arranged on the side wall of the coating frame through a supporting rod, the coating disc drives the contact one to rotate and contact with the contact two on the side wall of the coating frame during rotation, an annular pipeline is arranged in the coating disc, the bottom end of each adsorption pipe penetrates into the annular pipeline, the annular pipeline is provided with an external suction pipe to realize internal negative pressure, the suction pipe is arranged in the coating disc and controlled by a controller and a valve body, a square block is fixedly arranged on the outer circumferential surface of the adsorption pipe, guide grooves are arranged on the two side walls of the square block, electric telescopic rods are fixedly arranged on the groove walls of the guide grooves, an inclined frame is fixedly arranged on the telescopic end of the electric telescopic rod, an annular placing frame is fixedly arranged on the top end of the inclined frame, a limiting ring groove is arranged on the inner wall of the annular placing frame, the diameter of the limiting ring groove is larger than the length of the chip body, smooth rubber is arranged in the limiting ring groove, the shape of the guide groove is matched with the shape of the electric telescopic rod, a plurality of elastic telescopic columns in a circumferential array are arranged on the inner wall of the annular pipeline, each group of elastic telescopic columns and the adsorption pipe are in one-to-one correspondence, a magnetic plate is fixedly arranged on the upper end face of each group of elastic telescopic columns, a telescopic spring is sleeved on the outer surface of the elastic telescopic column, a recovery table is arranged above the workbench and on the side wall of the coating disc, a recovery unit is arranged above the workbench and used for recovering the chip body after coating, a magnetic block is arranged in the workbench and close to one side of the recovery table, the magnetism of the magnetic block is the same as that of the magnetic plate, when the chip body after coating moves to the side corresponding to the magnetic block, the magnetic plate moves away from the magnetic block, that is, the magnetic plate moves close to the bottom of the adsorption pipe, so that the adsorption force in the adsorption pipe becomes smaller, the L-shaped fixed rod is arranged in the middle of the workbench and does not contact the coating disc, an arc-shaped convex block is fixedly arranged on the end of the L-shaped fixed rod away from the workbench, the lower end face of the chip body contacts the convex end of the arc-shaped convex block during the rotation of the coating disc, driving the support frame and the chip body, and the recovery table is designed to be inclined relative to the horizontal plane. The surface of the recovery table is provided with a plurality of rotating rollers, and the rotating rollers are arranged in a linear array; during work, when the chip body is inclined on the surface of the recovery table, the rotating rollers are controlled to rotate, so that the rotating rollers drive the chip body to move, thereby making the chip body move away from the adsorption pipe as soon as possible. The application further discloses a coating method of the chip coating device. S1, a chip body is clamped from a conveying station to the upper side of the support frame by an external mechanical adsorption hand, negative pressure is generated by the adsorption of the adsorption pipe, and the lower end face of the chip body is tightly adsorbed on the upper side of the support frame; ​ ​ ​ 2. The semiconductor chip coating device of claim 1, wherein: ​ 3. A method for coating a semiconductor chip using the coating apparatus for a semiconductor chip according to any one of claims 1 to 2, characterized by: ​ ​ S2, then through the external controller controls the coating disc to rotate above the workbench, so that the coating disc drives one group of support frame and the chip body to move to the side close to the coating frame; S3, when the chip body moves below the coating head, stop the movement of the coating disc at this time, then the coating head can be used to coat the chip body.

4. The semiconductor chip coating method according to claim 3, characterized in that: In the step S1, the material of the adsorption tube is rubber.

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