Bearing disc for epitaxial growth of wafer

Abstract

The invention relates to the technical field of semiconductors, and discloses a bearing disc for wafer epitaxial growth, the bearing disc comprises a disc body, a cover plate, an adjusting assembly and a positioning mechanism, the upper part of the disc body is provided with a plurality of grooves, bearing blocks are arranged in the grooves and are used for bearing wafers placed in the grooves, the disc body is internally provided with a cavity and a plurality of mounting ports, and the mounting ports are arranged in the cavity. A plurality of mounting openings are formed in the disc body and communicate with the cavity, the cover plate is arranged at the upper end of the disc body, a plurality of through holes corresponding to the grooves are formed in the cover plate, and the adjusting assembly is arranged in the cavity and used for adjusting the using angle of the bearing block; by arranging the bearing block and the adjusting assembly, the wafer is placed on the bearing block when epitaxial growth is carried out on the wafer, and then the adjusting assembly can be used for adjusting the use angle of the bearing block, so that the problem that the wavelength of the wafer is not uniform in the epitaxial growth process due to temperature field difference can be avoided; and the quality of the wafer after epitaxial growth is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and more particularly, it relates to a wafer epitaxial growth carrier plate. BACKGROUND

[0002] Wafer epitaxy, also known as epitaxial growth, is an important step in the semiconductor manufacturing process. It refers to growing a single crystal layer with certain requirements (such as thickness and doping concentration) on a single crystal substrate (wafer), which has the same crystal orientation as the substrate. The carrier plate plays a crucial role in the wafer epitaxial growth process, which is mainly used to support the wafer, ensure the stability of the wafer during epitaxial growth, and optimize the growth conditions to improve the quality of the epitaxial layer.

[0003] The wafer is usually placed in a wafer groove on the carrier plate, and then placed in the wafer groove for epitaxial growth. The wafer is raised by the edge protrusion in the wafer groove to avoid direct contact between the back of the wafer and the inner wall of the wafer groove. However, the epitaxial growth of the wafer is affected by several factors, including the characteristics of different products and the temperature field differences between different machines. The temperature field difference will cause the wafer to experience uneven temperature distribution during epitaxial growth, thereby affecting its physical properties, such as wavelength. Since the position of the edge protrusion in the wafer groove is fixed, it cannot adjust and optimize the heating condition of the wafer according to the change of the temperature field, which may cause the problem of uneven wavelength of the wafer during epitaxial growth under certain temperature field conditions. SUMMARY

[0004] The present application provides a wafer epitaxial growth carrier plate, which solves the technical problem that in the related art, the position of the edge protrusion in the wafer groove is fixed, which cannot adjust and optimize the heating condition of the wafer according to the change of the temperature field, which may cause the problem of uneven wavelength of the wafer during epitaxial growth under certain temperature field conditions.

[0005] The present application provides a wafer epitaxial growth carrier plate, which includes a disc body and a cover plate, the upper part of the disc body is provided with a plurality of grooves, the grooves are provided with a carrier block for carrying the wafer placed in the groove, the inside of the disc body is provided with a cavity and a plurality of mounting holes, and the mounting holes are in communication with the cavity, the cover plate is arranged at the upper end of the disc body, the cover plate is provided with a plurality of through holes corresponding to the grooves, and further includes:

[0006] An adjusting assembly is arranged in the cavity for adjusting the use angle of the carrier block, the adjusting assembly includes a driving mechanism and a rotating mechanism.

[0007] The driving mechanism comprises a moving disc arranged in the cavity, and a plurality of racks are arranged on the outer side of the moving disc; the rotating mechanism comprises a rotating rod arranged in the cavity in a rotating mode, and a gear is arranged on the rotating rod and engaged with the racks;

[0008] The positioning mechanism is arranged in the mounting port and used for positioning the moving disc.

[0009] As a further optimization scheme of the present application, the driving mechanism further comprises a plurality of guide rods arranged in the cavity, the guide rods penetrate through the moving disc, and the moving disc is in sliding connection with the guide rods; a threaded rod is arranged in the cavity in a rotating mode, and the moving disc is in threaded connection with the threaded rod; and a handle is arranged on the upper end of the threaded rod.

[0010] As a further optimization scheme of the present application, the rotating mechanism further comprises a U-shaped block arranged on the rotating rod, and the gear is located on the inner side of the U-shaped block; a connecting rod is arranged on the outer side of the U-shaped block, and the top end of the connecting rod penetrates into the groove and is connected with the bottom end of the bearing block.

[0011] As a further optimization scheme of the present application, the positioning mechanism comprises a spring arranged in the mounting port, a round block is arranged on the end of the spring away from the inner wall of the mounting port, and the round block is in sliding connection with the mounting port; a positioning rod is arranged on the end of the round block away from the spring, the end of the positioning rod away from the round block penetrates out of the mounting port, and the end of the positioning rod penetrating out of the mounting port is semicircular.

[0012] As a further optimization scheme of the present application, a plurality of positioning ports for cooperating with the positioning rod are arranged on the outer side of the moving disc, and a collision block is arranged in the positioning port; the end of the positioning rod away from the round block penetrates into the positioning port and abuts against the collision block.

[0013] As a further optimization scheme of the present application, a circular groove is arranged at the central position of the upper part of the disc body, the end of the handle away from the threaded rod penetrates into the circular groove, an annular port is arranged on the inner wall of the circular groove at a certain height position, two symmetrical handle rods are arranged on the outer side of the handle, and the end of the handle rod away from the handle penetrates into the annular port and is in sliding connection with the annular port.

[0014] As a further optimization scheme of the present application, a threaded groove is arranged on the end of the connecting rod away from the U-shaped block, and a threaded head is arranged on the side of the bearing block close to the connecting rod and in threaded connection with the threaded groove.

[0015] As a further optimization scheme of the present application, a plurality of first holes are formed on the disc body, a plurality of second holes that are used in cooperation with the first holes are formed on the side of the cover plate close to the disc body, and the positions of the second holes correspond to the positions of the first holes one by one.

[0016] As a further optimization scheme of the present application, a plurality of positioning blocks are arranged on the upper portion of the disc body, the positioning blocks are arranged in a circumferential array on the upper portion of the disc body, a plurality of sockets that are used in cooperation with the positioning blocks are formed on the cover plate, and the positioning blocks are inserted into the sockets.

[0017] As a further optimization scheme of the present application, a sliding hole is formed at the bottom end of the inner wall of the groove, the sliding hole is communicated with the cavity, and the end of the connecting rod away from the U-shaped block penetrates through the sliding hole and is in sliding connection with the sliding hole.

[0018] The present application has the following beneficial effects:

[0019] The present application has the following beneficial effects: BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a structural schematic diagram of the present application;

[0021] Figure 2 is a structural schematic diagram of the present application without the cover plate;

[0022] Figure 3 is a sectional structural schematic diagram of the present application from a first perspective;

[0023] Figure 4 is a sectional structural schematic diagram of the present application from a second perspective;

[0024] Figure 5 is a sectional connection structural schematic diagram of the moving disc and the disc body in the present application;

[0025] Figure 6 is a sectional structural schematic diagram of the disc body in the present application;

[0026] Figure 7 is a structural schematic diagram of the adjusting assembly in the present application;

[0027] Figure 8 isFigure 5 Enlarged schematic view of the structure of part A;

[0028] Figure 9 is an exploded view of the connection structure between the bearing block and the connecting rod in the present application;

[0029] Figure 10 is a schematic view of the structure of the cover plate in the present application;

[0030] Figure 11 is a schematic view of the structure of the bearing block in the first use state in the present application;

[0031] Figure 12 is a schematic view of the structure of the bearing block in the second use state in the present application;

[0032] Figure 13 is a schematic view of the structure of the bearing block in the third use state in the present application.

[0033] In the figure: 1, disc body; 2, cover plate; 3, groove; 4, bearing block; 5, through hole; 6, cavity; 7, mounting port; 8, adjusting assembly; 9, driving mechanism; 901, moving disc; 902, rack; 903, guide rod; 904, threaded rod; 10, rotating mechanism; 101, rotating rod; 102, gear; 103, U-shaped block; 104, connecting rod; 11, positioning mechanism; 1101, spring; 1102, circular block; 1103, positioning rod; 12, positioning port; 13, impact block; 14, circular groove; 15, handle; 16, annular port; 17, grip rod; 18, threaded groove; 19, threaded head; 20, first hole; 21, second hole; 22, positioning block; 23, socket; 24, sliding port. DETAILED DESCRIPTION

[0034] The subject matter described herein will now be discussed with reference to example implementations. It should be understood that discussions of these implementations are merely provided to enable those skilled in the art to better understand so as to be able to implement the subject matter described herein, and variations of elements discussed can be made by one skilled in the art without departing from the scope of the present specification. Various examples can omit, substitute, or add various procedures or components as appropriate, and the methods described can not necessarily be performed in the order described. Also, the various features of some examples described can be combined in other examples.

[0035] As Figures 1 to 13As shown, the present application discloses a kind of wafer epitaxial growth with bearing disc, including disc body 1, cover plate 2, adjusting assembly 8 and positioning mechanism 11, the upper portion of disc body 1 is equipped with several grooves 3, bearing block 4 is arranged in groove 3, for the wafer placed in groove 3 is carried, the inside of disc body 1 is equipped with cavity 6 and several installation ports 7, and several installation ports 7 are all communicated with cavity 6, cover plate 2 is set in the upper end of disc body 1, cover plate 2 is equipped with several through holes 5 corresponding with groove 3;

[0036] Adjusting assembly 8 is set in cavity 6, for the use angle of bearing block 4 is adjusted, adjusting assembly 8 includes driving mechanism 9 and rotating mechanism 10;

[0037] Driving mechanism 9 includes moving disc 901 set in cavity 6, the outside of moving disc 901 is equipped with several racks 902, rotating mechanism 10 includes rotating rod 101 rotatably set in cavity 6, gear 102 is set on rotating rod 101, and gear 102 is engaged with rack 902;

[0038] Positioning mechanism 11 is set in installation port 7, for moving disc 901 is positioned, so that moving disc 901 moves to the appropriate position stops, at this time, bearing block 4 can be horizontal state.

[0039] Wherein, driving mechanism 9 further includes several guide rods 903 set in port cavity, guide rod 903 penetrates moving disc 901, and moving disc 901 is slidably connected with guide rod 903, threaded rod 904 is rotatably set in cavity 6, and moving disc 901 is threadedly connected with threaded rod 904, the upper end of threaded rod 904 is provided with handle 15.

[0040] It needs to be explained that when the use angle of bearing block 4 needs to be adjusted, rotating handle 15 can drive threaded rod 904 to rotate, at this time, the cooperation of guide rod 903 can drive moving disc 901 to move upwards or downwards, moving disc 901 moves to drive rack 902 to move, rack 902 moves to drive gear 102 to rotate, gear 102 rotates to drive rotating rod 101 to rotate.

[0041] Wherein, rotating mechanism 10 further includes U-shaped block 103 set on rotating rod 101, and gear 102 is located in the inside of U-shaped block 103, the outside of U-shaped block 103 is provided with connecting rod 104, the top end of connecting rod 104 penetrates into groove 3, and is connected with the bottom end of bearing block 4.

[0042] It should be noted that, as described above, when the gear 102 rotates to drive the rotating rod 101 to rotate, the rotating rod 101 can drive the U-shaped block 103 to rotate, the U-shaped block 103 can drive the connecting rod 104 to rotate, and the connecting rod 104 can drive the bearing block 4 to rotate, so as to conveniently adjust the use angle of the bearing block 4;

[0043] For example, when a wafer is grown by using a Veeco epitaxial growth device, a thin layer of adhesive is applied on the bottom of the wafer, and then the wafer is placed on the bearing block 4 in a horizontal state, the wavelength of the inner ring is longer and the wavelength of the outer ring is shorter, in this wavelength distribution, only adjusting the temperature of the heating wire cannot adjust the wavelength of the wafer in the two regions, at this time, the moving disc 901 can be moved upward, which can drive the bearing block 4 to tilt from inside to outside, so as to realize uniform heating of the wafer, thereby improving the phenomenon that the wavelength of the inner ring is longer and the wavelength of the outer ring is shorter, and then preparing a wafer with uniform wavelength distribution; when the moving disc 901 is moved downward, the bearing block 4 can be tilted from outside to inside, so as to realize uniform heating of the wafer, thereby improving the phenomenon that the wavelength of the inner ring is shorter and the wavelength of the outer ring is longer, and then preparing a wafer with uniform wavelength distribution.

[0044] The positioning mechanism 11 includes a spring 1101 arranged in the mounting port 7, one end of the spring 1101 away from the inner wall of the mounting port 7 is provided with a round block 1102, and the round block 1102 is in sliding connection with the mounting port 7, and the other end of the round block 1102 away from the spring 1101 is provided with a positioning rod 1103, and the other end of the positioning rod 1103 away from the round block 1102 penetrates out of the mounting port 7, and the other end of the positioning rod 1103 penetrating out of the mounting port 7 is semicircular.

[0045] The outer side of the moving disc 901 is provided with a plurality of positioning ports 12 matched with the positioning rod 1103, the inside of the positioning port 12 is provided with a collision block 13, and the other end of the positioning rod 1103 away from the round block 1102 penetrates into the positioning port 12, and abuts against the collision block 13.

[0046] It should be noted that, as described above, in the process of adjusting the use angle of the bearing block 4 by driving the moving disc 901 to move, the positioning rod 1103 will move out of the positioning opening 12, and when it is necessary to restore the bearing block 4 to a horizontal state for use, the handle 15 can be continuously rotated to drive the threaded rod 904 to rotate, the threaded rod 904 is driven to move by the moving disc 901, the moving disc 901 moves to contact and extrude the positioning rod 1103, the positioning rod 1103 is extruded to push the circular block 1102 to move and extrude the spring 1101, and when the positioning opening 12 on the moving disc 901 is at the same horizontal height as the positioning rod 1103, the extrusion force on the positioning rod 1103 disappears, so that the elastic force of the spring 1101 can push the positioning rod 1103 to insert into the positioning opening 12, and when the positioning rod 1103 is inserted into the positioning opening 12, it will collide with the collision block 13, thereby emitting a clear collision sound, at this time, the handle 15 can be stopped rotating, so that the moving disc 901 stops moving, and at this time the bearing block 4 restores to a horizontal state.

[0047] Wherein, the upper center position of the disc body 1 is provided with a circular groove 14, one end of the handle 15 away from the threaded rod 904 penetrates into the circular groove 14, the inner wall of the circular groove 14 is provided with an annular opening 16 at a certain height position, and the outer side of the handle 15 is provided with two symmetrical handle rods 17, one end of the handle rod 17 away from the handle 15 penetrates into the annular opening 16 and is in sliding connection with the annular opening 16.

[0048] It should be noted that, since the handle 15 is located inside the circular groove 14, the handle 15 is not easy to be accidentally contacted and rotated by external factors, thereby ensuring the stability of the bearing block 4 during use, and the handle rod 17 makes it more convenient to rotate the handle 15.

[0049] Wherein, one end of the connecting rod 104 away from the U-shaped block 103 is provided with a threaded groove 18, and one side of the bearing block 4 close to the connecting rod 104 is provided with a threaded head 19, and the threaded head 19 is in threaded connection with the threaded groove 18.

[0050] It should be noted that, when the wafer is placed on the bearing block 4 and the epitaxial growth is completed, and the wafer is taken out of the groove 3, the bearing block 4 can be rotated at this time, the threaded head 19 is driven to rotate in the threaded groove 18, so that the threaded head 19 can be moved out of the threaded groove 18, thereby facilitating the taking out of the bearing block 4 from the groove 3, and the groove 3 and the bearing block 4 can be more easily and thoroughly cleaned and maintained, which helps to remove residues, contaminants or impurities that may be generated during the epitaxial growth of the wafer.

[0051] The disc body 1 is provided with a plurality of first holes 20, and the cover plate 2 is provided with a plurality of second holes 21 corresponding to the first holes 20.

[0052] It should be noted that, in the epitaxial production process of the wafer, the first holes 20 and the second holes 21 can be used as gas channels to provide the required gas flow environment for the epitaxial production of the wafer, and the second holes 21 do not penetrate the cover plate 2, which can reduce the risk of external dust, particles and other pollutants entering the epitaxial production area of the wafer.

[0053] The disc body 1 is provided with a plurality of positioning blocks 22, and the cover plate 2 is provided with a plurality of sockets 23 corresponding to the positioning blocks 22.

[0054] It should be noted that, by using the plug-in mode of the positioning blocks 22 and the sockets 23, the cover plate 2 can be accurately installed on the disc body 1, avoiding misalignment or offset, and the cover plate 2 and the disc body 1 are easy to disassemble and assemble, and a plurality of connection points are formed between the cover plate 2 and the disc body 1, thereby enhancing the stability of the connection between the cover plate 2 and the disc body 1.

[0055] The inner wall of the groove 3 is provided with a sliding hole 24, the sliding hole 24 is communicated with the cavity 6, and the end of the connecting rod 104 away from the U-shaped block 103 penetrates the sliding hole 24 and is slidably connected with the sliding hole 24.

[0056] It should be noted that, as described above, in the process of rotating the connecting rod 104, the sliding hole 24 makes the rotation of the connecting rod 104 more smooth and stable, thereby ensuring the stability of the rotating bearing block 4.

[0057] The above describes the embodiment of the embodiment, but the embodiment is not limited to the specific implementation described above, and the specific implementation described above is only illustrative but not limited, and those skilled in the art can make many forms under the inspiration of the embodiment, which are all within the protection of the embodiment.

Claims

1. A wafer supporting disc for epitaxial growth, comprising a disc body (1) and a cover plate (2), the upper part of the disc body (1) is provided with a plurality of grooves (3), a supporting block (4) is arranged in each groove (3) for supporting a wafer placed in the groove (3), a cavity (6) and a plurality of mounting openings (7) are formed in the interior of the disc body (1), and each mounting opening (7) is in communication with the cavity (6), the cover plate (2) is arranged at the upper end of the disc body (1), a plurality of through holes (5) corresponding to the grooves (3) are formed in the cover plate (2), characterized in that, Also include: Adjusting assembly (8) is arranged in the cavity (6), for adjusting the use angle of the bearing block (4), the adjusting assembly (8) includes driving mechanism (9) and rotating mechanism (10); The driving mechanism (9) includes a moving disc (901) arranged in the cavity (6), the outer side of the moving disc (901) is provided with a plurality of racks (902), the rotating mechanism (10) includes a rotating rod (101) rotatably arranged in the cavity (6), the rotating rod (101) is provided with a gear (102), and the gear (102) is engaged with the rack (902); Positioning mechanism (11) is arranged in the mounting port (7), for positioning the moving disc (901).

2. The wafer carrying disk for epitaxial growth of a wafer as set forth in claim 1, wherein The driving mechanism (9) further comprises a plurality of guide rods (903) arranged in the oral cavity, the guide rods (903) penetrate the moving disc (901), and the moving disc (901) is slidably connected with the guide rods (903), a threaded rod (904) is rotatably arranged in the cavity (6), and the moving disc (901) is threadedly connected with the threaded rod (904), the upper end of the threaded rod (904) is provided with a handle (15).

3. The wafer carrier disk for epitaxial growth according to claim 1, wherein The rotating mechanism (10) further comprises a U-shaped block (103) arranged on the rotating rod (101), and the gear (102) is located on the inner side of the U-shaped block (103), the outer side of the U-shaped block (103) is provided with a connecting rod (104), the top end of the connecting rod (104) penetrates into the recess (3), and the bottom end of the bearing block (4) is connected.

4. The wafer carrier disk for epitaxial growth according to claim 1, wherein The positioning mechanism (11) includes a spring (1101) arranged in the mounting port (7), one end of the spring (1101) away from the inner wall of the mounting port (7) is provided with a round block (1102), and the round block (1102) is slidably connected with the mounting port (7), one end of the round block (1102) away from the spring (1101) is provided with a positioning rod (1103), one end of the positioning rod (1103) away from the round block (1102) penetrates out of the mounting port (7), and one end of the positioning rod (1103) penetrating out of the mounting port (7) is semicircular.

5. The wafer carrying disk for epitaxial growth of a wafer as set forth in claim 4, wherein The outer side of the moving disc (901) is provided with a plurality of positioning ports (12) matched with the positioning rod (1103), the inner side of the positioning port (12) is provided with a collision block (13), one end of the positioning rod (1103) away from the round block (1102) penetrates into the positioning port (12), and abuts with the collision block (13).

6. The wafer carrying disk for epitaxial growth of a wafer as set forth in claim 2, wherein The upper center position of the disc body (1) is provided with a circular groove (14), one end of the handle (15) away from the threaded rod (904) penetrates into the circular groove (14), the inner wall of the circular groove (14) is provided with an annular port (16) at a certain height position, the outer side of the handle (15) is provided with two symmetrically distributed grip rods (17), one end of the grip rod (17) away from the handle (15) penetrates into the annular port (16), and is slidably connected with the annular port (16).

7. The wafer carrying disk for epitaxial growth of a wafer as set forth in claim 3, wherein The threaded groove (18) is arranged at the end of the connecting rod (104) away from the U-shaped block (103), the threaded head (19) is arranged on the side of the bearing block (4) close to the connecting rod (104), and the threaded head (19) is threadedly connected with the threaded groove (18).

8. The wafer carrier disk for epitaxial growth according to claim 1, wherein A plurality of first holes (20) are arranged on the disc body (1), a plurality of second holes (21) are arranged on the side of the cover plate (2) close to the disc body (1) and used in cooperation with the first holes (20), and the positions of the second holes (21) correspond to the positions of the first holes (20) one by one.

9. The wafer carrying disk for epitaxial growth of a wafer as set forth in claim 1, wherein A plurality of positioning blocks (22) are arranged on the upper portion of the disc body (1) and are arranged in a circumferential array on the upper portion of the disc body (1), a plurality of sockets (23) are arranged on the cover plate (2) and used in cooperation with the positioning blocks (22), and the positioning blocks (22) are inserted into the sockets (23).

10. The wafer carrying disk for epitaxial growth of a wafer as set forth in claim 3, wherein The inner wall bottom end of the groove (3) is provided with a sliding opening (24) in communication with the cavity (6), and the end of the connecting rod (104) away from the U-shaped block (103) penetrates through the sliding opening (24) and is in sliding connection with the sliding opening (24).

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