Laser vibration monitoring equipment with damping bracket

Abstract

The invention provides a laser vibration monitoring device with a damping support, which relates to the technical field of laser vibration monitoring and comprises a mounting base, a cabinet and a support base are fixedly mounted at the upper end of the mounting base, a cooling liquid circulation system is connected to the side wall of the cabinet, and a CMOS laser acquisition component is arranged on one side of the cabinet. A laser emitter is installed on the side wall of the CMOS laser collection component, a semiconductor chilling plate is installed on the side, close to the cabinet, of the CMOS laser collection component and connected with the cabinet through a cooling liquid circulation system, a connecting column is arranged in the support base, the connecting column is fixedly sleeved with an outer magnetic ring, an inner rod is slidably installed in the connecting column, and an outer magnetic ring is fixedly installed on the outer magnetic ring. The spiral spring is fixedly installed at the lower end of the inner rod and is a variable-diameter spiral spring, and the lower end of the spiral spring is fixedly connected with the inner wall of the connecting column, so that the problem of vibration isolation failure of the spring in a high-low frequency junction area is solved, it is ensured that a laser light path is always stable, and measurement errors are reduced from the source.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of laser vibration monitoring, more specifically, particularly relates to a laser vibration monitoring equipment with a damping support. BACKGROUND

[0002] The laser vibration monitor is a non-contact process test instrument widely used in the field of mechanical engineering and information science, mainly used for precise measurement of object vibration, displacement and acceleration. Its core technology is based on laser Doppler effect and interference principle. The vibration parameters are analyzed through the frequency shift of reflected light. It is suitable for complex scenes of high temperature, high pressure or small objects.

[0003] However, the existing laser vibration monitoring equipment has the following problems when in use:

[0004] 1. The stiffness characteristics of the existing linear vibration isolation device (such as steel spring and rubber pad) are single. If high stiffness spring is used to ensure the static stability of the laser vibration monitor, the dynamic stiffness will also increase, resulting in increased low frequency vibration transmission rate and laser light path deviation. If low stiffness spring is used to improve high frequency vibration isolation effect, the static bearing capacity will be insufficient, resulting in millimeter level settlement of the equipment under its own weight, and the micro level measurement reference cannot be maintained.

[0005] 2. Since the vibration source frequency often fluctuates dynamically with the working condition, the natural frequency of the traditional vibration isolation system is fixed by the structural parameters (such as spring stiffness and mass). When the external vibration frequency overlaps with the system natural frequency, resonance will occur (the vibration amplitude may be amplified by more than 10 times), resulting in severe jitter of the light spot received by the CMOS sensor of the laser vibration monitor, and the measurement error increases from microns to millimeters, affecting the use effect. SUMMARY

[0006] In order to solve the above technical problems, the present application provides a laser vibration monitoring equipment with a damping support to solve the above problems.

[0007] The utility model provides a kind of laser vibration monitoring equipment with shock-absorbing support, including installation base, the upper end of installation base is fixedly installed with cabinet and support base, one side of the cabinet is provided with CMOS laser acquisition component, connecting wire is connected between the CMOS laser acquisition component and cabinet, the inside of support base is provided with connecting column, the lower end of connecting column is fixedly installed with mounting disc, the lower end of mounting disc is fixedly installed with elastic damping pad, and the elastic damping pad is fixedly connected with support base, air cavity is opened in the lower end of elastic damping pad, outer magnetic ring is fixedly sleeved on the connecting column, inner rod is slidably installed in the connecting column, the lower end of inner rod is fixedly installed with helical spring, the helical spring is variable-diameter helical spring, the lower end of helical spring is fixedly connected with the inner wall of connecting column, inner magnetic ring is fixedly installed on the inner rod, dynamic when external vibration causes helical spring deformation, drives inner magnetic ring displacement relative to outer magnetic ring, and non-linear negative stiffness is generated with the change of magnetic force with distance, and the dynamic offset of spring positive stiffness makes the overall stiffness of system close to zero, realizes static load stable, dynamic vibration isolation efficient high static low dynamic vibration isolation effect, and guarantees high-precision measurement of laser vibration meter;

[0008] Preferably, the cabinet side wall is connected with a cooling liquid circulation system, the CMOS laser acquisition component side wall is installed with a laser emitter, the side of the CMOS laser acquisition component close to the cabinet is installed with a semiconductor refrigeration piece, the semiconductor refrigeration piece is connected with the cabinet through the cooling liquid circulation system, the cabinet upper end is connected with a central controller, the cabinet side wall is hingedly connected with a cabinet door, the cabinet inner side wall is fixedly installed with a control instrument power air switch, a refrigeration power air switch, a signal controller, a filter and a refrigeration piece power controller, and the cabinet inner wall lower end is fixedly installed with a vibration meter environmental temperature monitoring instrument. Through the synergistic effect of multiple elements, high-precision, high-stability and automatic measurement of dynamic parameters of the measured object are realized.

[0009] Preferably, the support base upper end is provided with an annular groove, the annular groove is slidably installed with a counterweight, the counterweight is internally provided with an inner groove, the counterweight is slidably installed with a friction block, the friction block upper end is fixedly installed with a sliding column, the sliding column is slidably installed in the counterweight, the sliding column is sleeved with a spring, and the upper and lower ends of the spring are fixedly connected with the inner groove inner wall and the friction block. The overall counterweight can be adjusted by adjusting the counterweight, the overall center of gravity and mass distribution can be changed, the natural frequency can be shifted from the risk frequency band to the safe range without disturbance on site, and the vibration amplification problem caused by resonance can be avoided from the root.

[0010] Preferably, the inner rod is fixedly sleeved with an annular sheet, and the inner wall of the annular sheet is installed with displacement sensors in equidistant spiral tracks.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] In the application, when the device is working, high-frequency laser can be emitted by the laser emitter, the laser is reflected after being reflected by the measured object, the reflected laser is collected by the CMOS laser collection component, the displacement of the reflected laser on the CMOS laser collection component is calculated to obtain the displacement of the measured object, then the CMOS laser collection component converts the measured displacement value into voltage analog quantity and transmits to the filter, the filter obtains the acceleration value after calculation, converts the acceleration value into current analog quantity and transmits to the data collector and data controller in the cabinet, the central controller connects the data collector to obtain the acceleration value for comparison operation to judge the accuracy and stability of the value, according to the final judgment obtained by calculation, the high-precision, high-stability and automatic measurement of the dynamic parameters of the measured object are realized;

[0013] In the application, when the outside is vibrated, the spiral spring will be deformed (positive stiffness mechanism), the outer magnetic ring and the inner magnetic ring are combined to form a double-ring permanent magnet, when the spiral spring is deformed, the relative displacement between the inner magnetic ring and the outer magnetic ring will occur (negative stiffness mechanism), the device is composed of a double-ring permanent magnet (negative stiffness mechanism) and a spiral spring (positive stiffness mechanism) in parallel to form a vibration isolation system, the height center lines of the outer magnetic ring and the inner magnetic ring are flush in the static state, the magnetic force is zero due to the symmetrical layout, and the spring provides high static stiffness to bear the weight of the laser vibration meter; when the outside is vibrated, the spiral spring is deformed, the inner magnetic ring is displaced relative to the outer magnetic ring, the magnetic force changes with the distance to generate nonlinear negative stiffness, and the positive stiffness of the spring is dynamically offset to make the overall stiffness of the system close to zero, so that the high static low dynamic vibration isolation effect of static bearing stability and dynamic vibration isolation efficiency is realized, and the high-precision measurement of the laser vibration meter is ensured.

[0014] In the application, the spiral spring is designed as a variable-diameter spiral spring (the diameter gradually increases from the top end to the bottom end), the thin-diameter section (top end) has thin wire diameter and sparse turns, and is easy to be elastically deformed under the action of high-frequency vibration (short period and small amplitude), can absorb high-frequency energy (similar to "flexible buffering") through rapid stretching and contraction, the thick-diameter section (bottom end) has thick wire diameter and dense turns, and resists deformation by high stiffness under the action of low-frequency vibration (long period and large amplitude), so that low-frequency energy is avoided from being transmitted to the device, and this characteristic can cover a wider frequency range without additional adjustment, the thin-diameter section of the spiral spring in the scheme can efficiently absorb high-frequency vibration to avoid spot jitter, and the thick-diameter section can suppress low-frequency microseismicity by high stiffness to avoid relative position deviation, and the two cooperate to eliminate the vibration isolation failure problem of the spring in the "high-low frequency junction area", so that the laser light path is always stable, and the measurement error is reduced from the source.

[0015] In the application, the support base, annular groove, counterweight, inner groove, friction block, slide column and spring are arranged, so that the device can complete the adjustment of the overall counterweight, the overall gravity center and mass distribution can be changed, the natural frequency is deviated from the risk frequency band to the safe range without disturbance on site, and the problem of vibration amplification caused by resonance is avoided from the root.

[0016] In the application, when the vibration is transmitted from the ground, the vibration is conducted to the support base through the installation base, and then the elastic damping pad directly absorbs part of the vibration energy through the elastic deformation of the elastic damping pad, the air cavity on the elastic damping pad is repeatedly extruded and released by high-frequency vibration, air damping is formed, the transmission efficiency of ultrahigh-frequency vibration is further weakened, and then the original vibration intensity transmitted to the spring is reduced.

[0017] In the application, the inner rod, spiral spring, annular sheet and displacement sensor are arranged, each displacement sensor can monitor the outer surface of the thin diameter section of the spiral spring, the deformation of the spiral spring is monitored in real time, early warning can be performed when the spring is about to be excessively deformed, the laser vibration meter is prevented from being disturbed by vibration due to failure of the support, and the micron-level measurement precision is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a three-dimensional structural schematic diagram of the application;

[0019] Figure 2 is a schematic diagram of the internal structure of the cabinet of the application;

[0020] Figure 3 is a schematic diagram of the semiconductor refrigeration piece connection structure of the application;

[0021] Figure 4 is a schematic diagram of the inner rod connection explosion structure of the application;

[0022] Figure 5 is a schematic diagram of the annular sheet connection explosion structure of the application;

[0023] Figure 6 is a schematic diagram of the displacement sensor connection structure of the application;

[0024] Figure 7 is a schematic diagram of the elastic damping pad connection explosion structure of the application;

[0025] Figure 8 is a schematic diagram of the counterweight connection explosion structure of the application;

[0026] Figure 9 is a schematic diagram of the friction block connection explosion structure of the application.

[0027] In the figure, the correspondence between the component names and the reference numerals is as follows: 1, mounting base; 2, cabinet; 3, cooling liquid circulation system; 4, CMOS laser acquisition component; 5, laser emitter; 6, connecting wire; 7, central controller; 8, cabinet door; 9, control instrument power air switch; 10, refrigeration power air switch; 11, signal controller; 12, filter; 13, refrigeration fin power controller; 14, vibration meter environmental temperature monitoring instrument; 15, semiconductor refrigeration fin; 16, support base; 17, annular groove; 18, counterweight; 19, inner groove; 20, friction block; 21, sliding column; 22, spring; 23, connecting column; 24, mounting disc; 25, elastic damping pad; 26, air cavity; 27, outer magnetic ring; 28, inner rod; 29, helical spring; 30, inner magnetic ring; 31, annular fin; 32, displacement sensor. DETAILED DESCRIPTION

[0028] The embodiments of the present application will be further described in detail with reference to the drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0029] Please refer to Figures 1-9The application provides a laser vibration monitoring device with a damping support, which comprises a mounting base 1, a cabinet 2 and a support base 16 fixedly installed at the upper end of the mounting base 1, a cooling liquid circulating system 3 connected to the side wall of the cabinet 2, a CMOS laser acquisition component 4 arranged on one side of the cabinet 2, a laser emitter 5 installed on the side wall of the CMOS laser acquisition component 4, a semiconductor refrigeration sheet 15 installed on the side of the CMOS laser acquisition component 4 close to the cabinet 2, the semiconductor refrigeration sheet 15 being a heat transfer tool, when a current passes through a thermocouple pair formed by a piece of N-type semiconductor material and a piece of P-type semiconductor material, heat transfer occurs between the two ends, the heat is transferred from one end to the other end, thereby generating a temperature difference to form hot and cold ends, the semiconductor refrigeration sheet converts the heat on the A side to the B side in the energized state, the semiconductor refrigeration chip is press-fitted on the copper shell on the A side, the shell temperature is rapidly reduced, the environmental temperature of the CMOS laser acquisition component 4 is ensured to be normal, the cooling effect of the laser sensor is achieved, the semiconductor refrigeration sheet 15 is connected with the cabinet 2 through the cooling liquid circulating system 3, a connecting line 6 is connected between the CMOS laser acquisition component 4 and the cabinet 2, a central controller 7 is connected to the upper end of the cabinet 2, the central controller 7 is actually an industrial computer, which is designed for an industrial production environment and has the advantages of high temperature resistance, wide voltage, long-term work and the like, a WIN10 system and various acquisition and analysis software designed for the project are preinstalled in the industrial computer, a cabinet door 8 is hingedly connected to the side wall of the cabinet 2, control instrument power air switches 9, refrigeration power air switches 10, signal controllers 11, filters 12 and refrigeration sheet power controllers 13 are fixedly installed in the inner side wall of the cabinet 2, the signal controllers 11 adopt Omron relays as the main body, accept the commands of the central controller and perform opening and closing operations on each relay, so as to realize the on-off of each line and control the signal output.The refrigeration sheet power controller 13 is a self-developed electric appliance, integrating an STM32 operation chip, a voltage control chip, a storage chip and other components. The PID-based algorithm is burned in the storage chip. The algorithm performs smooth calculation by comparing the collected temperature and output voltage in real time, and completes accurate voltage and current output, so as to control the working power of the semiconductor refrigeration sheet, and ensure that the environmental temperature of the laser vibration meter is stable and unchanged in the case of severe changes in external environment. The environmental temperature monitoring instrument 14 of the vibration meter is fixedly installed at the lower end of the inner wall of the cabinet 2. The environmental temperature monitoring instrument 14 of the vibration meter is connected with a thermocouple sensor. The temperature value change is calculated by detecting the change of the resistance value. The annular groove 17 is formed in the upper end of the support base 16. The counterweight 18 is slidably installed in the annular groove 17. The inner groove 19 is formed in the counterweight 18. The friction block 20 is slidably installed in the counterweight 18. The slide column 21 is fixedly installed at the upper end of the friction block 20. The slide column 21 is slidably installed in the counterweight 18. The spring 22 is sleeved on the slide column 21. The upper and lower ends of the spring 22 are fixedly connected with the inner wall of the inner groove 19 and the friction block 20 respectively. During use, the slide column 21 can be pulled upward. The friction block 20 will move upward in the inner groove 19 under the movement of the slide column 21. The spring 22 will be compressed. Then the counterweight 18 can be moved in the annular groove 17. When the counterweight 18 moves to the position where counterweight is needed, the slide column 21 is released. At this time, the spring 22 will restore the deformation to make the friction block 20 and the support base 16 abut tightly. The adjustment of the overall counterweight is completed. The overall gravity center and mass distribution can be changed, so that the natural frequency is shifted from the risk frequency band to the safe range without disturbance on site. The problem of vibration amplification caused by resonance is avoided from the root;

[0030] The connecting column 23 is arranged in the support base 16. The mounting disc 24 is fixedly installed at the lower end of the connecting column 23. The elastic damping pad 25 is fixedly installed at the lower end of the mounting disc 24. The elastic damping pad 25 is fixedly connected with the support base 16. The air cavity 26 is formed in the lower end of the elastic damping pad 25. When the vibration is transmitted from the ground, the vibration will be conducted to the support base 16 through the mounting base 1. Then the elastic damping pad 25 will directly absorb part of the vibration energy through the elastic deformation of itself. The air cavity 26 formed in the elastic damping pad 25 is repeatedly squeezed and released by high-frequency vibration, forming air damping, further weakening the transmission efficiency of ultrahigh-frequency vibration, and reducing the original vibration intensity transmitted to the spring.

[0031] The outer magnetic ring 27 is fixedly sleeved on the connecting column 23, the inner rod 28 is slidably installed in the connecting column 23, the helical spring 29 is fixedly installed at the lower end of the inner rod 28, the helical spring 29 is a variable-diameter helical spring (the diameter gradually increases from the top end to the bottom end), the lower end of the helical spring 29 is fixedly connected with the inner wall of the connecting column 23, the inner magnetic ring 30 is fixedly installed on the inner rod 28, when the external environment vibrates during the operation of the equipment, at this time, the CMOS laser acquisition component 4 drives the helical spring 29 to vibrate, the helical spring 29 will deform (positive stiffness mechanism), the outer magnetic ring 27 and the inner magnetic ring 30 form a double-ring permanent magnet, when the helical spring 29 deforms, the relative displacement between the inner magnetic ring 30 and the outer magnetic ring 27 will occur (negative stiffness mechanism), the equipment is connected in parallel with the helical spring 29 (positive stiffness mechanism) to form a vibration isolation system through the installation of the double-ring permanent magnet (negative stiffness mechanism), the height center lines of the outer magnetic ring 27 and the inner magnetic ring 30 are flush in the static state, because the symmetric layout magnetic force is zero, the spring provides high static stiffness to bear the weight of the laser vibration instrument at this time; in the dynamic state, the external vibration causes the helical spring 29 to deform, drives the inner magnetic ring to displace relative to the outer magnetic ring, the magnetic force changes with the distance to produce nonlinear negative stiffness, and the dynamic offset of the spring positive stiffness makes the overall stiffness of the system close to zero, realizes the high static and low dynamic vibration isolation effect of static bearing stability and dynamic vibration isolation efficiency, and guarantees the high-precision measurement of the laser vibration instrument; the helical spring 29 is designed as a variable-diameter helical spring (the diameter gradually increases from the top end to the bottom end), the thin-diameter section (top end) has thin wire diameter and sparse number of turns, is easy to elastically deform under the action of high-frequency vibration (short period and small amplitude), can absorb high-frequency energy through rapid stretching and contraction (similar to “flexible buffering”), the thick-diameter section (bottom end) has thick wire diameter and dense number of turns, resists deformation by high stiffness under the action of low-frequency vibration (long period and large amplitude), avoids the transmission of low-frequency energy to the equipment, and this characteristic can cover a wider frequency range without additional adjustment, the thin-diameter section of the helical spring 29 in the scheme can efficiently absorb high-frequency vibration to avoid spot jitter, and the thick-diameter section can suppress low-frequency microseismicity by high stiffness to avoid relative position deviation, the two eliminate the vibration isolation failure problem of the spring in the “high-low frequency junction area”, ensure that the laser light path is always stable, and reduce measurement errors from the source;

[0032] The inner rod 28 is fixedly sleeved with an annular sheet 31, and a displacement sensor 32 is equidistantly installed in a spiral track in the inner wall of the annular sheet 31. The annular sheet 31 is installed on the inner rod 28, and then the displacement sensor 32 is designed according to the spiral spring 29, so that each displacement sensor 32 can face the outer surface of the thin diameter section of the spiral spring 29, and the deformation of the spiral spring 29 can be monitored in real time, and early warning can be made when the spring is about to be excessively deformed, so as to avoid the vibration interference of the laser vibration meter due to the failure of the support, protect the micron-level measurement accuracy, and the data collector and the data controller are further arranged in the cabinet 2. When in use, the control instrument power air switch 9, the refrigeration power air switch 10, the signal controller 11, the filter 12 and the refrigeration piece power controller 13 are installed in the cabinet 2, then the semiconductor refrigeration piece 15 is installed on the CMOS laser collection component 4, the cooling liquid circulation system 3 is connected to the closed waterway in the factory, the water pressure is 0.55mpa, and the water temperature is about 35 degrees Celsius, which is used for heat dissipation of the hot end of the semiconductor refrigeration piece 15. At this time, the cabinet 2 is turned on to be powered on, the refrigeration power air switch 10 is turned on, then the value of the vibration meter environmental temperature monitoring instrument 14 is observed, the temperature displayed by the instrument is reduced to below 40℃, the control instrument power air switch 9 is turned on, and the equipment is operated. When in use, the laser emitter 5 can emit high-frequency laser, the reflected laser is collected by the CMOS laser collection component 4 after being reflected by the measured object, the displacement of the reflected laser on the CMOS laser collection component 4 is calculated to calculate the displacement of the measured object, then the CMOS laser collection component 4 converts the measured displacement value into voltage analog quantity and transmits it to the filter 12, the filter 12 obtains the acceleration value after calculation, converts the acceleration value into current analog quantity and transmits it to the data collector and the data controller in the cabinet 2, the central controller 7 connects the data collector to obtain the acceleration value for comparison operation to judge the accuracy and stability of the value, and according to the final judgment obtained by calculation, the high-precision, high-stability and automatic measurement of the dynamic parameters of the measured object are realized.

[0033] Working principle:

[0034] First step, use can first install the control instrument power air switch 9, refrigeration power air switch 10, signal controller 11, filter 12 and refrigeration piece power controller 13 in the cabinet 2, then install the semiconductor refrigeration piece 15 on the CMOS laser acquisition component 4 shell, the closed waterway of the factory is connected to the cooling liquid circulation system 3, the water pressure is 0.55mpa, the water temperature is about 35 degrees Celsius, the heat end of the semiconductor refrigeration piece 15 is used for heat dissipation, at this time, open the cabinet 2 to make it power on, then open the refrigeration power air switch 10, then observe the value of the vibration measuring instrument environmental temperature monitoring instrument 14, until the temperature displayed by the instrument is below 40℃, open the control instrument power air switch 9, the equipment can emit high-frequency laser through the laser emitter 5, the laser reflected by the measured object, the reflected laser is collected by the CMOS laser acquisition component 4, the displacement of the reflected laser on the CMOS laser acquisition component 4 is calculated to obtain the displacement of the measured object, then the CMOS laser acquisition component 4 converts the measured displacement value into voltage analog quantity and transmits it to the filter 12, the filter 12 obtains the acceleration value after calculation, converts the acceleration value into current analog quantity and transmits it to the data collector and data controller inside the cabinet 2, the central controller 7 connects the data collector to obtain the acceleration value for comparison operation to judge the accuracy and stability of the value, according to the final judgment obtained by calculation, the high-precision, high-stability and automatic measurement of the dynamic parameters of the measured object are realized;

[0035] Second step, when the equipment is working, the CMOS laser acquisition component 4 drives the spiral spring 29 to vibrate, the spiral spring 29 will deform (positive stiffness mechanism), the outer magnetic ring 27 and the inner magnetic ring 30 form a double-ring permanent magnet, when the spiral spring 29 deforms, the relative displacement between the inner magnetic ring 30 and the outer magnetic ring 27 will occur (negative stiffness mechanism), the equipment is installed in parallel with the spiral spring 29 (positive stiffness mechanism) to form a vibration isolation system, the height center lines of the outer magnetic ring 27 and the inner magnetic ring 30 are flush, the symmetric layout magnetic force is zero, the spring provides high static stiffness to bear the weight of the laser vibration measuring instrument; when the external vibration causes the spiral spring 29 to deform, the inner magnetic ring is displaced relative to the outer magnetic ring, the magnetic force changes with the distance to produce nonlinear negative stiffness, which dynamically offsets the positive stiffness of the spring to make the overall stiffness of the system close to zero, realizing the high static low dynamic vibration isolation effect of stable static bearing and efficient dynamic vibration isolation, ensuring the high-precision measurement of the laser vibration measuring instrument;

[0036] Third step, by designing the spiral spring 29 as a variable diameter spiral spring (the diameter gradually increases from the top end to the bottom end), the thin diameter section (top end) has thin wire diameter and sparse number of turns, and is easy to elastically deform under the action of high frequency vibration (short period and small amplitude), can absorb high frequency energy through rapid expansion and contraction (similar to "flexible buffering"), the thick diameter section (bottom end) has thick wire diameter and dense number of turns, and resists deformation by high stiffness under the action of low frequency vibration (long period and large amplitude), avoids the transmission of low frequency energy to the equipment, this characteristic can cover a wider frequency range without additional adjustment, the thin diameter section of the spiral spring 29 in the scheme can efficiently absorb high frequency vibration to avoid spot jitter, and the thick diameter section can suppress low frequency microseismicity by high stiffness to avoid relative position deviation, the two cooperate to eliminate the vibration isolation failure problem of the spring in the "high-low frequency junction area", ensure that the laser light path is always stable, and reduce measurement error from the source;

[0037] Fourth step, the slide column 21 can be pulled upward during use, the friction block 20 is driven to move upward in the inner groove 19 under the movement of the slide column 21, the spring 22 is compressed, then the counterweight block 18 can be moved in the annular groove 17, the slide column 21 is released when the counterweight block 18 moves to the position where the counterweight is required, at this time, the spring 22 restores the deformation to make the friction block 20 and the support base 16 abut tightly, the adjustment of the overall counterweight is completed, the overall center of gravity and mass distribution can be changed, the natural frequency is deviated from the risk frequency band to the safe range without disturbance on the site, and the vibration amplification problem caused by resonance is avoided from the root;

[0038] Fifth step, when the ground transmits vibration, the vibration is conducted to the support base 16 through the installation base 1, then the elastic damping pad 25 directly absorbs part of the vibration energy through elastic deformation, the air cavity 26 provided on the elastic damping pad 25 is repeatedly squeezed and released by high frequency vibration, air damping is formed, the transmission efficiency of super high frequency vibration is further reduced, and then the original vibration intensity transmitted to the spring is reduced;

[0039] Sixth step, the annular sheet 31 is installed on the inner rod 28, and then the displacement sensor 32 is designed according to the spiral pattern of the spiral spring 29 on the annular sheet 31, so that each displacement sensor 32 can face the outer surface of the thin diameter section of the spiral spring 29, the deformation of the spiral spring 29 can be monitored in real time, early warning can be made when the spring is about to be excessively deformed, the laser vibration meter is prevented from being disturbed by vibration due to support failure, and the micron-level measurement precision is ensured.

[0040] Embodiments of the present application are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the application to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments are chosen and described in order to best explain the principles of the application and its practical application, and to enable others skilled in the art to understand the application for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A laser vibration monitoring device with a shock-absorbing support, comprising a mounting base (1), a cabinet (2) and a support base (16) fixedly installed on the upper end of the mounting base (1), a CMOS laser acquisition component (4) arranged on one side of the cabinet (2), and a connecting line (6) connected between the CMOS laser acquisition component (4) and the cabinet (2), characterized in that: The support base (16) is internally provided with a connecting column (23), the lower end of the connecting column (23) is fixedly installed with a mounting disc (24), the lower end of the mounting disc (24) is fixedly installed with an elastic damping pad (25), the elastic damping pad (25) is fixedly connected with the support base (16), the lower end of the elastic damping pad (25) is provided with an air cavity (26), the connecting column (23) is fixedly sleeved with an outer magnetic ring (27), the connecting column (23) is internally slidably installed with an inner rod (28), the lower end of the inner rod (28) is fixedly installed with a spiral spring (29), the spiral spring (29) is a variable-diameter spiral spring, the lower end of the spiral spring (29) is fixedly connected with the inner wall of the connecting column (23), and the inner rod (28) is fixedly installed with an inner magnetic ring (30).

2. The laser vibration monitoring device with a shock absorbing support according to claim 1, characterized in that, The cabinet (2) is connected with a cooling liquid circulating system (3); The CMOS laser acquisition component (4) is provided with a laser emitter (5) on the side wall.

3. The laser vibration monitoring apparatus with a shock absorbing support of claim 2, wherein, The CMOS laser acquisition component (4) is provided with a semiconductor refrigeration piece (15) on the side close to the cabinet (2). The semiconductor refrigeration piece (15) is connected with the cabinet (2) through the cooling liquid circulating system (3).

4. The laser vibration monitoring apparatus with a shock absorbing support of claim 1, wherein, The cabinet (2) is connected with a central controller (7) at the upper end. The cabinet (2) is hingedly connected with a cabinet door (8) on the side wall.

5. The laser vibration monitoring apparatus with a shock absorbing support of claim 1, wherein, The cabinet (2) is fixedly installed with a control instrument power air switch (9), a refrigeration power air switch (10), a signal controller (11), a filter (12) and a refrigeration piece power controller (13) in the inner side wall. The cabinet (2) is fixedly installed with a vibration meter environmental temperature monitoring instrument (14) at the lower end of the inner wall.

6. The laser vibration monitoring device with a shock absorbing support according to claim 1, wherein, The support base (16) is provided with an annular groove (17) at the upper end. The annular groove (17) is slidably installed with a counterweight (18) inside.

7. The laser vibration monitoring apparatus with a shock absorbing support of claim 6, wherein, The counterweight (18) is internally provided with an inner groove (19). The counterweight (18) is slidably installed with a friction block (20) inside.

8. The laser vibration monitoring apparatus with a shock absorbing support of claim 7, wherein, The friction block (20) is fixedly installed with a sliding column (21) at the upper end. The sliding column (21) is slidably installed in the counterweight (18).

9. The laser vibration monitoring device with a shock absorbing support according to claim 8, characterized in that, The sliding column (21) is sleeved with a spring (22). The spring (22) is fixedly connected with the inner wall of the inner groove (19) and the friction block (20) at the upper and lower ends.

10. The laser vibration monitoring apparatus with a shock absorbing support of claim 1, wherein, The inner rod (28) is fixedly sleeved with an annular piece (31). The annular piece (31) is installed with displacement sensors (32) at equal intervals in a spiral track in the inner wall.

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