Method for testing interface bonding force between ABF material and base material

By forming a curing layer on the substrate and using laser processing to create raised structures, the problem of inaccurate evaluation of the bonding force between ABF material and the substrate in existing technologies is solved, achieving efficient and accurate bonding force testing and reducing errors and waste in post-packaged product testing.

CN120908087APending Publication Date: 2025-11-07GUANGZHOU MEADVILLE ELECTRONICS
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Patent Information

Application Number
CN202511303817.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-12
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

Existing technologies test the adhesion between ABF material and substrate after the finished product is manufactured, which leads to waste and the inability to obtain accurate adhesion data, making it impossible to assess the adhesion performance in the early stages.

Method used

By pressing ABF material onto a substrate and performing heat treatment to form a cured layer, a patterned raised structure is then processed using a laser. The adhesion between the raised structure and the substrate is measured using a thrust test instrument, thus enabling preliminary assessment of the bonding force between the ABF material and the substrate.

Benefits of technology

It improves testing efficiency and accuracy, reduces errors caused by batch differences, and enables the acquisition of accurate bonding strength data in the early stages, avoiding the waste of testing after the finished product is packaged.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the technical field of packaging, and particularly relates to a method for testing the interface bonding force of an ABF material and a base material. The testing method comprises the following steps: S1, pressing an ABF material on a base material, then carrying out heat treatment, and forming an ABF material curing layer on the base material; s2, laser emitted by a laser device is used for conducting ablation treatment on the curing layer, a patterned curing layer is prepared, and the patterned curing layer is composed of a plurality of protrusion structures which are arranged at intervals; and S3, testing the bonding force between the plurality of bulge structures and the substrate interface by adopting a thrust testing instrument. By testing the interface bonding force between the ABF material and the base material through the testing method provided by the invention, the accuracy of a testing result is relatively high; the testing method provided by the invention can be used for evaluating the bonding performance between the ABF material and different base materials in the early stage, and the situation that the bonding force between the ABF material and the base materials is detected after a packaged finished product is prepared is avoided.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of packaging, and relates to a test method for the interfacial bonding force of ABF material and a base material. BACKGROUND

[0002] At present, ABF (full name: Ajinomoto Build-up Film) material is a special flexible packaging material, which has been widely used in the packaging field, and different component devices and component terminals are molded into a PCB board through the ABF material.

[0003] The component devices (such as chips, capacitors, etc.) have different materials (mainly Si, ceramic, etc.), and the component terminals have plating layers of different materials. In order to ensure the reliability of the finished product, the prior art usually completes the production of the packaging finished product first, and then evaluates the bonding performance between the ABF material and the base material in contact with it. The specific test method is: after the packaging finished product is aged in a harsh environment, whether delamination and thin plate problems occur is observed by visual observation or slicing. However, this test method is tested after the production of the finished product, and once it is found that the bonding force between the ABF material and the base material in contact with it is poor, delamination and explosion problems occur, resulting in waste of packaging material; and the test data of the bonding force between the ABF material and different base materials cannot be obtained.

[0004] Therefore, it is necessary to provide a test method to test the interfacial bonding force of the ABF material and the base material before the production of the finished product. SUMMARY

[0005] The application aims to overcome the shortcomings of the prior art and provide a test method for the interfacial bonding force of ABF material and a base material.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the application is as follows:

[0007] A test method for the interfacial bonding force of ABF material and a base material, comprising the following steps:

[0008] S1, pressing the ABF material on the base material, and then performing heat treatment to form an ABF material solidification layer on the base material;

[0009] S2, using the laser emitted by the laser to perform ablation treatment on the solidification layer to prepare a patterned solidification layer, the patterned solidification layer being composed of a plurality of protruding structures spaced from each other;

[0010] S3, using a thrust tester to test the adhesion between the plurality of protruding structures and the base material interface, respectively.

[0011] The application forms a solidified layer of ABF material on the substrate by pressing and heat treatment, processes several protruding structures on the same substrate by laser ablation processing on the solidified layer of ABF material, thereby forming a plurality of test samples of the same batch, and then respectively tests the adhesion of the several protruding structures and the substrate interface by using a thrust testing instrument, which can improve the test efficiency, reduce the error caused by the difference between different batches of samples, reduce the measurement error, and improve the accuracy of the bonding test.

[0012] The test method provided by the application can be used for preliminary evaluation of the adhesion performance between the ABF material and different substrates, and can obtain accurate test data of the bonding force between the ABF material and different substrates without detecting the adhesion between the ABF material and the substrate after preparing the packaged finished product.

[0013] Preferably, in step S1, the temperature of the pressing is 90-120℃, the pressure of the pressing is 5-10Kg / cm 2 , and the time of the pressing is 20-40s.

[0014] For example, in step S1, the temperature of the pressing can be 90℃, 95℃, 100℃, 105℃, 110℃, 115℃, 120℃, or a range formed by any two of the above values, the pressure of the pressing can be 5Kg / cm 2 , 6Kg / cm 2 , 7Kg / cm 2 , 8Kg / cm 2 , 9Kg / cm 2 , 10Kg / cm 2 , or a range formed by any two of the above values, and the time of the pressing can be 20s, 25s, 30s, 35s, 40s, or a range formed by any two of the above values.

[0015] Preferably, in step S1, the heat treatment includes the following stages:

[0016] First stage: heat treatment at 90-120℃ for 20-40min;

[0017] Second stage: heat treatment at 150-200℃ for 20-40min;

[0018] Third stage: heat treatment at 180-220℃ for 30-120min.

[0019] Exemplarily, in the first stage, the temperature of the heat treatment can be 90℃, 95℃, 100℃, 105℃, 110℃, 115℃, 120℃ or a range formed by any two of the above values, and the time of the heat treatment can be 20min, 25min, 30min, 35min, 40min or a range formed by any two of the above values.

[0020] In the second stage, the temperature of the heat treatment can be 150℃, 155℃, 160℃, 165℃, 170℃, 175℃, 180℃, 185℃, 190℃, 195℃, 200℃ or a range formed by any two of the above values, and the time of the heat treatment can be 20min, 25min, 30min, 35min, 40min or a range formed by any two of the above values.

[0021] In the third stage, the temperature of the heat treatment can be 180℃, 185℃, 190℃, 195℃, 200℃, 205℃, 210℃, 215℃, 220℃ or a range formed by any two of the above values, and the time of the heat treatment can be 30min, 40min, 50min, 60min, 70min, 80min, 90min, 100min, 110min, 120min or a range formed by any two of the above values.

[0022] Preferably, in step S1, the substrate comprises any one of a silicon layer, a ceramic layer, a metal layer, a glass substrate.

[0023] Preferably, in step S2, the plurality of protruding structures are arranged in an array, and the protruding structures can be cylindrical or polygonal.

[0024] Preferably, in step S2, the laser ablation treatment is performed on the solidified layer according to a preset machining path and machining parameters, the machining path is provided with N paths, N is a positive integer not less than 2, the N paths surround the protruding structure and are arranged from inside to outside, and in the N paths, the solidified layer is machined along the innermost path to form the profile of the protruding structure.

[0025] Further preferably, in the laser ablation treatment according to the innermost path, the machining parameters of the laser are as follows: spot diameter 55-65μm, spot overlap rate 45-55%, pulse width 8-12μs, laser energy 2-3mJ, and light output diameter 1.0-1.2mm.

[0026] Exemplarily, during the ablation treatment by the laser according to the machining path of the innermost layer, the spot diameter of the laser can be 55 μm, 56 μm, 57 μm, 58 μm, 59 μm, 60 μm, 61 μm, 62 μm, 63 μm, 64 μm, 65 μm, or a range formed by any two of the above values, the spot overlap rate can be 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, or a range formed by any two of the above values, the pulse width can be 8 μs, 9 μs, 10 μs, 11 μs, 12 μs, or a range formed by any two of the above values, the laser energy can be 2 mJ, 2.1 mJ, 2.2 mJ, 2.3 mJ, 2.4 mJ, 2.5 mJ, 2.6 mJ, 2.7 mJ, 2.8 mJ, 2.9 mJ, 3 mJ, or a range formed by any two of the above values, and the light output diameter can be 1.0 mm, 1.05 mm, 1.1 mm, 1.15 mm, 1.2 mm, or a range formed by any two of the above values.

[0027] Further preferably, during the ablation treatment by the laser according to the machining path other than the machining path of the innermost layer, the machining parameters of the laser are as follows: the spot diameter is 120-200 μm, the spot overlap rate is 20-40%, the pulse width is 8-12 μs, the laser energy is 8-12 mJ, and the light output diameter is 2.0-2.3 mm.

[0028] Exemplarily, during the ablation treatment by the laser according to the machining path other than the machining path of the innermost layer, the spot diameter of the laser can be 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, 155 μm, 160 μm, 165 μm, 170 μm, 175 μm, 180 μm, 185 μm, 190 μm, 195 μm, 200 μm, or a range formed by any two of the above values, the spot overlap rate can be 20%, 22%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, or a range formed by any two of the above values, the pulse width can be 8 μs, 9 μs, 10 μs, 11 μs, 12 μs, or a range formed by any two of the above values, the laser energy can be 8 mJ, 8.5 mJ, 9 mJ, 9.5 mJ, 10 mJ, 10.5 mJ, 11 mJ, 11.5 mJ, 12 mJ, or a range formed by any two of the above values, and the light output diameter can be 2.0 mm, 2.05 mm, 2.1 mm, 2.15 mm, 2.2 mm, 2.25 mm, 2.3 mm, or a range formed by any two of the above values.

[0029] In the present application, the spot diameter refers to the diameter of the spot formed by the laser on the surface of the solidified layer, and the light emission diameter refers to the diameter of the laser beam at the exit end surface of the laser.

[0030] It has been found through research that, by reasonably adjusting the processing parameters of the laser, the profile of the convex structure processed can be made more uniform, and large thermal deformation of the convex structure can be avoided, thereby improving the accuracy of subsequent bonding force testing.

[0031] Preferably, the laser is a carbon dioxide laser.

[0032] Preferably, step S3 is: placing the substrate on a test platform and fixing it, and a push knife of the push force testing instrument applies a push force to the convex structure, the direction of application of the push force being perpendicular to the thickness direction of the convex structure, until the convex structure is separated from the substrate or breaks, at which time the size of the push force is the bonding force between the convex structure and the substrate;

[0033] According to the above steps, the bonding force between the convex structure and the substrate is tested, a plurality of sets of bonding force test results are obtained, and the average value is taken, that is, the test result of the bonding force between the ABF material and the substrate.

[0034] Preferably, in step S3, the speed of the push knife is 800-1200 mm / s.

[0035] Compared with the prior art, the present application has the following beneficial effects:

[0036] The test method provided by the present application can be used to test the interfacial bonding force between the ABF material and the substrate, and the test result has high accuracy;

[0037] The test method provided by the present application can be used to test the interfacial bonding force between the ABF material and the substrate, and the test result has high accuracy; BRIEF DESCRIPTION OF DRAWINGS

[0038] The embodiments in the present application will not be limited to the drawings described below, and the drawings described below are only part of the embodiments in the present application. Those skilled in the art can obtain drawings of other embodiments according to the content in the present application.

[0039] Figure 1 The structure schematic diagram of the solidified layer and the substrate provided by the present application is shown in the figure;

[0040] Figure 2 The schematic diagram of the arrangement of the convex structure on the substrate provided by the present application is shown in the figure;

[0041] Figure 3 The photo of the convex structure prepared in step S2 of Example 1 of the present application is shown in the figure. Detailed Implementation

[0042] To better illustrate the purpose, technical solution, and advantages of this application, the following detailed description will be provided in conjunction with specific embodiments. Those skilled in the art should understand that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0043] In this application, the technical features described in an open-ended manner include both closed technical solutions consisting of the listed features and open technical solutions that include the listed features.

[0044] Unless otherwise specified, the reagents, methods and equipment used in this application are all conventional reagents, methods and equipment in this technical field.

[0045] Example 1

[0046] This embodiment provides a method for testing the interfacial adhesion between ABF material and a substrate, including the following steps:

[0047] S1. The ABF material is pressed onto a substrate (a copper layer with a thickness of 0.3 mm). The pressing temperature is 100°C, and the pressing pressure is 7 kg / cm². 2 The pressing time is 30 seconds; then heat treatment is performed, such as... Figure 1 As shown, a cured layer 2 with a thickness of 250 μm is formed on the substrate 1; the heat treatment includes the following stages:

[0048] First stage: Heat treatment at 100℃ for 30 minutes;

[0049] Second stage: Heat treatment at 180℃ for 30 minutes;

[0050] Third stage: Heat treatment at 190℃ for 1 hour.

[0051] S2. Using a carbon dioxide laser, the solidified layer is ablated according to a preset processing path and parameters. Figures 2-3 As shown, 15 protrusion structures 3 are formed on the substrate 1, and the 15 protrusion structures 3 are arranged in an array of cylindrical protrusion structures 3; then laser ablation is performed to remove the excess solidified layer outside the protrusion structures.

[0052] The laser ablates the solidified layer according to a preset processing path and preset processing parameters. The processing path has N paths, where N is 51. The 51 processing paths surround the protruding structure and are arranged sequentially from the inside to the outside. The laser processes the solidified layer along the innermost processing path to form the outline of the protruding structure.

[0053] In the ablation treatment process of the laser according to the machining path of the innermost layer, the machining parameters of the laser are as follows: a spot diameter of 60 μm, a spot overlap rate of 50%, a pulse width of 12 μs, a laser energy of 2.5 mJ, and an output light diameter of 1.1 mm;

[0054] In the ablation treatment process of the laser according to the machining path of the innermost layer, the machining parameters of the laser are as follows: a spot diameter of 60 μm, a spot overlap rate of 50%, a pulse width of 12 μs, a laser energy of 2.5 mJ, and an output light diameter of 1.1 mm;

[0055] The diameters of multiple positions on each protruding structure 3 are tested by using a micrometer, and the average value is taken; and the maximum diameter and the minimum diameter of each protruding structure 3 are selected, and the roundness of each protruding structure 3 is calculated according to the following formula: roundness = minimum diameter / maximum diameter x 100%, and the average value is taken.

[0056] S3, place the substrate on the test platform and fix it, and apply a pushing force to the protruding structure on the substrate at a rate of 1000 mm / s by using a pushing knife of a pushing force testing instrument (model Dage4000), the direction of the pushing force being perpendicular to the thickness direction of the protruding structure, until the protruding structure is separated from the substrate or is broken, at which time the size of the pushing force is the bonding force of the interface between the protruding structure and the substrate;

[0057] According to the above steps, the bonding forces of all the protruding structures and the substrate interfaces are tested to obtain the bonding force test results, and the average value is taken to obtain the test results of the bonding force of the interface between the ABF material and the substrate, and the accuracy of the test results is evaluated: (1-average deviation / average value) x 100%.

[0058] Examples 2-3 and Comparative Example 1

[0059] Examples 2-3 and Comparative Example 1 are different from Example 1 in that the laser machining parameters are changed to change the roundness, average diameter and bonding force test results of the protruding structure, as shown in Table 1.

[0060] Table 1

[0061]

[0062]

[0063] As can be seen from Table 1, by reasonably adjusting the laser machining parameters, the average roundness of the protruding structure can be improved, so that the average roundness of the protruding structure is not less than 95%, thereby improving the accuracy of the bonding force test, and the accuracy of the bonding force test in Examples 1-3 is not less than 90.18%.

[0064] Compared with Examples 1-3, the roundness of the protruding structure of Comparative Example 1 is significantly reduced due to unreasonable laser processing parameters during the laser ablation process according to the processing path of the innermost layer, and thus the accuracy of the bonding force test is also significantly reduced.

[0065] Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present application and not to limit the scope of protection of the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for testing the interfacial bonding strength between ABF material and a substrate, characterized in that, The method comprises the following steps: S1, pressing the ABF material on a substrate, and then performing heat treatment to form a solidified layer of the ABF material on the substrate; S2, performing ablation treatment on the solidified layer by using a laser to prepare a patterned solidified layer, wherein the patterned solidified layer is composed of a plurality of protruding structures spaced from each other; S3, testing the adhesion between the protruding structures and the substrate by using a thrust testing instrument.

2. The method of claim 1, wherein the ABF material is a polyurethane. In step S1, the temperature of the pressing is 90-120℃, the pressure of the pressing is 5-10 Kg / cm 2 , and the time of the pressing is 20-40s.

3. The method of claim 1, wherein the ABF material is a polyurethane. In step S1, the heat treatment comprises the following stages: First stage: heat treatment at 90-120℃ for 20-40min; Second stage: heat treatment at 150-200℃ for 20-40min; Third stage: heat treatment at 180-220℃ for 30-120min.

4. The method of claim 1, wherein the ABF material is a polyurethane. In step S1, the substrate comprises any one of a silicon layer, a ceramic layer, a metal layer, and a glass substrate.

5. The method of claim 1, wherein the ABF material is a polyurethane. In step S2, the protruding structures are arranged in an array, and the protruding structures are in a cylindrical or polygonal shape.

6. The method of claim 1, wherein the ABF material is a polyurethane. In step S2, the laser performs ablation treatment on the solidified layer according to a preset machining path and preset machining parameters, wherein the machining path is provided with N channels, N is a positive integer not less than 2, the N machining paths surround the protruding structures and are arranged from the inside to the outside, and the laser performs machining on the solidified layer along the machining path located in the innermost layer to form the contour of the protruding structure.

7. The method of claim 1, wherein the ABF material is a polyurethane. In the ablation treatment process of the laser according to the machining path located in the innermost layer, the machining parameters of the laser are as follows: the spot diameter is 55-65μm, the spot overlap rate is 45-55%, the pulse width is 8-12μs, the laser energy is 2-3mJ, and the light output diameter is 1.0-1.2mm.

8. The method of claim 1, wherein the ABF material is a polyurethane. In the ablation treatment process of the laser according to the machining path other than the machining path located in the innermost layer, the machining parameters of the laser are as follows: the spot diameter is 120-200μm, the spot overlap rate is 20-40%, the pulse width is 8-12μs, the laser energy is 8-12mJ, and the light output diameter is 2.0-2.3mm.

9. The method of claim 1, wherein the ABF material is a polyurethane. In step S3, the substrate is placed on a test platform and fixed, a push knife of the thrust testing instrument applies a thrust to the protruding structure, the application direction of the thrust is perpendicular to the thickness direction of the protruding structure, until the protruding structure is separated from the substrate or is broken, and at this time, the size of the thrust is the bonding force between the protruding structure and the substrate. According to the above steps, the adhesion between the protruding structures and the substrate is tested, a plurality of sets of adhesion test results are obtained, an average value is taken, and the test result of the bonding force between the ABF material and the substrate is obtained.

10. The method of claim 9, wherein the ABF material is a polyurethane. In step S3, the speed of the push knife is 800-1200mm / s.