Electronic device

Abstract

The electronic equipment comprises a middle frame, a display screen, a mainboard and a heat dissipation module, the middle frame comprises a middle plate and a frame, and a containing cavity is formed between the display screen and the middle plate; the mainboard is arranged on the side, back to the display screen, of the middle plate, and at least part of heating devices on the mainboard are in heat conduction contact with the middle plate; the heat dissipation module is arranged in the containing cavity and comprises a first heat dissipation fin and a second heat dissipation fin, the first heat dissipation fin and the second heat dissipation fin are both arranged on the middle plate in an overlapped mode, and the heat conductivity coefficient of the second heat dissipation fin in the thickness direction is smaller than that of the first heat dissipation fin in the thickness direction. According to the electronic equipment, the second cooling fins with the low heat conductivity coefficient are used for cooling the heat concentration area of the middle plate, so that the efficiency of conducting heat of the heat concentration area of the middle plate to the display screen is reduced, and therefore the probability that the local temperature of the display screen is too high at the position corresponding to a heating device is reduced; and discomfort caused by over-high local temperature of the display screen when the electronic equipment is used is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, in particular to an electronic device. BACKGROUND

[0002] For electronic devices such as mobile phones and tablets, the display screen not only provides display effects, but also is the basis for related touch screen operations; for example, a user's finger clicks, slides or drags an icon or area related to an application object.

[0003] However, in the related art, during use of an electronic device, the display screen is prone to local overheating and even overheating, which not only affects the working performance of the display screen, but also affects the use comfort of the electronic device. SUMMARY

[0004] The present application provides an electronic device to solve the technical problem of local overheating of the display screen.

[0005] The present application provides an electronic device, comprising:

[0006] a middle frame comprising a middle plate and a frame, the frame being connected to the periphery of the middle plate;

[0007] a display screen connected to the frame, and a receiving cavity being provided between the display screen and the middle plate;

[0008] a main board provided on a side of the middle plate opposite to the display screen, at least part of heat generating devices on the main board being in thermal conduction contact with the middle plate;

[0009] a heat dissipation module provided in the receiving cavity, the heat dissipation module comprising a first heat dissipation fin and a second heat dissipation fin, the first heat dissipation fin and the second heat dissipation fin being stacked on the middle plate, at least half of the structure of the first heat dissipation fin being provided outside the area where the heat generating devices are in thermal conduction contact with the middle plate, at least half of the structure of the second heat dissipation fin being provided inside the area where the heat generating devices are in thermal conduction contact with the middle plate, and at least half of the projection area of the heat generating devices on the middle plate is located in the projection area of the second heat dissipation fin on the middle plate, the thermal conductivity of the second heat dissipation fin in the thickness direction being less than the thermal conductivity of the first heat dissipation fin in the thickness direction.

[0010] The electronic device described above adopts a heat dissipation module to dissipate heat of the heat generating device on the mainboard. Since the heat dissipation module comprises a first heat dissipation fin and a second heat dissipation fin, at least half of the structure of the first heat dissipation fin is arranged outside the area where the heat generating device is in thermal conduction contact with the middle plate, at least half of the structure of the second heat dissipation fin is arranged inside the area where the heat generating device is in thermal conduction contact with the middle plate, and at least half of the projection area of the heat generating device on the middle plate is located in the projection area of the second heat dissipation fin on the middle plate. Therefore, the first heat dissipation fin mainly dissipates heat at the position of the middle plate avoiding the heat generating device, and the second heat dissipation fin mainly dissipates heat at the part of the middle plate in thermal conduction contact with the heat generating device. In this way, the first heat dissipation fin and the second heat dissipation fin can dissipate heat at different areas of the middle plate in a targeted manner. Moreover, considering that the heat at the position where the middle plate is in thermal conduction contact with the heat generating device is more concentrated than that at other areas, in the electronic device of the present application, the thermal conductivity coefficient of the second heat dissipation fin is smaller than that of the first heat dissipation fin. In this way, the thermal resistance between the second heat dissipation fin and the display screen is greater than the thermal resistance between the first heat dissipation fin and the display screen. Compared with the heat conduction from the first heat dissipation fin to the display screen, the heat is not easy to conduct from the second heat dissipation fin to the display screen. Then, by dissipating heat at the heat concentrated area of the middle plate using the second heat dissipation fin with a lower thermal conductivity coefficient, the efficiency of heat conduction of the heat at the heat concentrated area of the middle plate to the display screen can be slowed down, thereby reducing the probability of local temperature of the display screen being too high at the position corresponding to the heat generating device, so as to facilitate maintaining the working performance of the display screen and reducing the discomfort when using the electronic device caused by local temperature of the display screen being too high. BRIEF DESCRIPTION OF DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0012] Figure 1 It is a perspective view of an electronic device of an embodiment.

[0013] Figure 2 It is a cross-sectional structural view of an electronic device of an embodiment.

[0014] Figure 3 It is a cross-sectional structural view of an electronic device of another embodiment.

[0015] Figure 4 In an electronic device of an embodiment, a structure view of the heat plate of the heat dissipation module is shown.

[0016] Figure 5 It is a circuit module view of an electronic device of an embodiment.

[0017] BRIEF DESCRIPTION OF DRAWINGS

[0018] 100, electronic device; 101, receiving cavity; 110, middle frame; 111, middle plate; 112, frame; 120, display screen; 130, mainboard; 131, heat generating device; 140, heat dissipation module; 141, first heat dissipation fin; 1411, first gap; 142, second heat dissipation fin; 1421, second gap; 143, heat spreader; 1431, evaporation cavity; 1432, condensation cavity; 1433, capillary wick; 150, heat conductive material; 160, battery module. DETAILED DESCRIPTION

[0019] For the purpose of facilitating the understanding of the present application, a more complete understanding of the present application can be had by reference to the relevant drawings in which preferred embodiments of the application are illustrated. The application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0020] As used herein, "electronic device" refers to, but is not limited to, a device capable of receiving and / or transmitting communication signals via any one or more of the following connection means:

[0021] (1) via a wired connection means, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection;

[0022] (2) via a wireless interface means, such as a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter.

[0023] An electronic device configured to communicate via a wireless interface can be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0024] (1) a satellite telephone or a cellular telephone;

[0025] (2) a Personal Communications System (PCS) terminal that can combine a cellular radiotelephone with data processing, facsimile, and data communications capabilities;

[0026] (3) wireless telephones, pagers, Internet / Intranet access, Web browsers, notepads, calendars, personal digital assistants (PDAs) equipped with Global Positioning System (GPS) receivers;

[0027] (4) conventional laptop and / or palmtop receivers;

[0028] (5) conventional laptop and / or palmtop wireless telephony transceivers, etc.

[0029] An embodiment of the present application provides an electronic device, comprising:

[0030] a middle frame, the middle frame comprising a middle plate and a frame, the frame being connected to a peripheral side of the middle plate;

[0031] a display screen, the display screen being connected to the frame, and a receiving cavity being arranged between the display screen and the middle plate;

[0032] a main board, the main board being arranged on a side of the middle plate which is opposite to the display screen, and at least part of heat generating devices on the main board being in thermal conduction contact with the middle plate;

[0033] a heat dissipation module, the heat dissipation module being arranged in the receiving cavity, the heat dissipation module comprising a first heat dissipation fin and a second heat dissipation fin, the first heat dissipation fin and the second heat dissipation fin are both stacked on the middle plate, at least half of a structure of the first heat dissipation fin is arranged outside a region in which the heat generating devices are in thermal conduction contact with the middle plate, at least half of a structure of the second heat dissipation fin is arranged inside the region in which the heat generating devices are in thermal conduction contact with the middle plate, and at least half of a projection area of the heat generating devices on the middle plate is located in a projection area of the second heat dissipation fin on the middle plate, a thermal conductivity coefficient of the second heat dissipation fin in a thickness direction is less than a thermal conductivity coefficient of the first heat dissipation fin in a thickness direction.

[0034] In one of the embodiments, the first heat dissipation fin comprises a graphite heat dissipation fin.

[0035] In one of the embodiments, the second heat dissipation fin comprises an outer shell and a phase change material arranged in the outer shell.

[0036] In one of the embodiments, the phase change material comprises at least one of paraffin or phase change ink.

[0037] In one of the embodiments, a material of the outer shell comprises at least one of a polymer, graphene or aluminum.

[0038] In one of the embodiments, the second heat sink comprises a composite phase change substrate and a tape, the tape sealingly covering the composite phase change substrate; wherein the composite phase change substrate is a graphite and paraffin composite material; or the composite phase change substrate is a graphene and paraffin composite material.

[0039] In one of the embodiments, the first heat sink and the second heat sink are integrally formed.

[0040] In one of the embodiments, the first heat sink and the second heat sink are integrally formed.

[0041] In one of the embodiments, the first heat sink and the second heat sink are integrally formed.

[0042] In one of the embodiments, the first heat sink and the second heat sink are integrally formed.

[0043] In one of the embodiments, the first heat sink and the second heat sink are integrally formed.

[0044] In one of the embodiments, the first heat sink and the second heat sink are integrally formed.

[0045] In one of the embodiments, the first heat sink and the second heat sink are integrally formed.

[0046] In one of the embodiments, the electronic device further comprises a battery module arranged on a side of the middle plate opposite to the first heat dissipation fin, a projection area of the battery module on the middle plate at least partially overlaps with a projection area of the first heat dissipation fin on the middle plate, and at least part of heat of the battery module can be conducted to the first heat dissipation fin through the middle plate.

[0047] For the convenience of understanding, the structure of the electronic device is described below in combination with the related drawings.

[0048] As shown in Figure 1 , the electronic device 100 of an embodiment of the present application can be a mobile phone. It can be understood that the specific form of the electronic device 100 can be other, such as a tablet computer or a notebook computer, etc., which is not limited herein.

[0049] In some embodiments, the electronic device 100 comprises a middle frame 110 and a display screen 120 connected with the middle frame 110.

[0050] As shown in Figure 2 , the middle frame 110 comprises a middle plate 111 and a frame 112. The frame 112 is connected to the circumferential side of the middle plate 111. The middle plate 111 and the frame 112 can be integrally formed or can be clamped, which is not limited herein.

[0051] The display screen 120 is connected with the frame 112. The display screen 120 and the frame 112 can be connected through hot melt adhesive. The connection mode of the display screen 120 and the frame 112 is not limited herein.

[0052] The electronic device 100 further comprises a mainboard 130 arranged on a side of the middle plate 111 opposite to the display screen 120, and at least part of the heat generating devices 131 on the mainboard 130 are in thermal conduction contact with the middle plate 111.

[0053] It should be noted here that the thermal conduction contact in the present application means that heat can be conducted between two structural members. Specifically, in this embodiment, the heat generated by the heat generating devices 131 in thermal conduction contact with the middle plate 111 when working can be conducted to the middle plate 111.

[0054] The two structural members in thermal conduction contact can be in direct contact or indirect contact through a heat-conducting structure, as long as heat conduction between the two structural members can be achieved. For example, in some embodiments, at least part of the heat-generating devices 131 on the main board 130 are in direct contact with the middle plate 111, so that no other substances are interposed between the two, and heat can be thermally conducted from the heat-generating devices 131 to the middle plate 111. For another example, in some embodiments, at least part of the heat-generating devices 131 on the main board 130 are indirectly in contact with the middle plate 111 through the heat-conducting material 150. In this way, the heat-conducting material 150 arranged between the heat-generating devices 131 and the middle plate 111 can also achieve thermal conduction of heat generated by the heat-generating devices 131 to the middle plate 111 during operation. The heat-conducting material 150 can be a gel, which can fill the gap between the heat-generating devices 131 and the middle plate 111, so that the area of thermal conduction contact between the heat-generating devices 131 and the middle plate 111 is increased, thereby facilitating the efficiency of heat conduction from the heat-generating devices 131 to the middle plate 111.

[0055] In this application, the heat-generating devices 131 include but are not limited to electronic components such as inductors, chips, or capacitors.

[0056] The inventors found that when the electronic device 100 works for a long time or performs high-energy-consuming operations such as gaming or shooting, the display screen 120 of the electronic device 100 is prone to local temperature overheat and even scalding. Further research found that the position of the display screen 120 where the local temperature is too high is usually the position corresponding to the heat-generating devices 131 on the main board 130. Specifically, the heat generated by the heat-generating devices 131 when operating is further thermally conducted to the display screen 120 after being thermally conducted to the middle plate 111, which in turn causes the temperature of the display screen 120 in the area corresponding to the thermal conduction contact between the heat-generating devices 131 and the middle plate 111 to be higher than that in other areas, thereby causing the aforementioned phenomenon of local temperature overheat and even scalding of the display screen 120, which causes the user to feel uncomfortable when touching the area of the display screen 120, and even have a "burning" sensation.

[0057] Continue to combine Figure 2As shown, in the embodiment of the present application, the display screen 120 and the middle plate 111 are provided with a receiving cavity 101. The electronic device 100 further comprises a heat dissipation module 140. The heat dissipation module 140 is arranged in the receiving cavity 101. The heat dissipation module 140 comprises a first heat dissipation fin 141 and a second heat dissipation fin 142. The first heat dissipation fin 141 and the second heat dissipation fin 142 are both stacked on the middle plate 111. At least half of the structure of the first heat dissipation fin 141 is arranged outside the region where the heat generating device 131 is in thermal conduction contact with the middle plate 111. At least half of the structure of the second heat dissipation fin 142 is arranged inside the region where the heat generating device 131 is in thermal conduction contact with the middle plate 111. The projection area of the heat generating device 131 on the middle plate 111 is at least half of the projection area of the second heat dissipation fin 142 on the middle plate 111. The thermal conductivity of the second heat dissipation fin 142 in the thickness direction is less than the thermal conductivity of the first heat dissipation fin 141 in the thickness direction.

[0058] In the electronic device 100 of the embodiment of the present application, the heat dissipation module 140 is used to dissipate heat of the heat generating device 131 on the main board 130. Since the heat dissipation module 140 comprises the first heat dissipation fin 141 and the second heat dissipation fin 142, at least half of the structure of the first heat dissipation fin 141 is arranged outside the region where the heat generating device 131 is in thermal conduction contact with the middle plate 111. At least half of the structure of the second heat dissipation fin 142 is arranged inside the region where the heat generating device 131 is in thermal conduction contact with the middle plate 111. The projection area of the heat generating device 131 on the middle plate 111 is at least half of the projection area of the second heat dissipation fin 142 on the middle plate 111. Therefore, the first heat dissipation fin 141 mainly dissipates heat at the position of the middle plate 111 avoiding the heat generating device 131. The second heat dissipation fin 142 mainly dissipates heat of the part of the middle plate 111 in thermal conduction contact with the heat generating device 131. In this way, the first heat dissipation fin 141 and the second heat dissipation fin 142 can dissipate heat of different regions of the middle plate 111.

[0059] Moreover, considering that the heat at the position where the middle plate 111 is in thermal conduction contact with the heat generating device 131 is more concentrated than other regions, in the electronic device 100 of the present application, the thermal conductivity of the second heat dissipation fin 142 is less than the thermal conductivity of the first heat dissipation fin 141. In this way, the thermal resistance between the second heat dissipation fin 142 and the display screen 120 is greater than the thermal resistance between the first heat dissipation fin 141 and the display screen 120. Relative to the heat conduction from the first heat dissipation fin 141 to the display screen 120, the heat is not easy to conduct from the second heat dissipation fin 142 to the display screen 120. Then, by using the second heat dissipation fin 142 with lower thermal conductivity to dissipate heat of the heat concentrated region of the middle plate 111, the efficiency of heat conduction of the heat concentrated region of the middle plate 111 to the display screen 120 can be slowed down, thereby reducing the probability of local temperature of the display screen 120 being too high at the position corresponding to the heat generating device 131, so as to facilitate maintaining the working performance of the display screen 120 and reducing the discomfort caused by local high temperature of the display screen 120 when using the electronic device 100.

[0060] Continuously combined Figure 2 As shown, the first heat dissipation fin 141 has a first gap 1411 with the display screen 120, and the second heat dissipation fin 142 has a second gap 1421 with the display screen 120.

[0061] The first gap 1411 and the second gap 1421 are arranged so that the first heat dissipation fin 141 and the second heat dissipation fin 142 do not contact the display screen 120, thereby avoiding the problem of top printing defects on the display screen 120.

[0062] The first gap 1411 and the second gap 1421 are in communication with each other. Thus, when some heat is radiated from the first heat dissipation fin 141 and the second heat dissipation fin 142 to the side where the display screen 120 is located, the first gap 1411 and the second gap 1421 are in communication with each other, thereby having a certain temperature equalization effect with the flow of air therebetween.

[0063] In some embodiments, in a direction perpendicular to the thickness direction of the display screen 120, the distance between the surface of the first heat dissipation fin 141 opposite to the display screen 120 is the size of the first gap 1411. The size of the first gap 1411 is 0.06mm-0.1mm, for example, the size of the first gap 1411 is 0.06mm, 0.07mm, 0.08mm, 0.09mm or 0.1mm.

[0064] In some embodiments, in a direction perpendicular to the thickness direction of the display screen 120, the distance between the surface of the second heat dissipation fin 142 opposite to the display screen 120 is the size of the second gap 1421. The size of the second gap 1421 is 0.06mm-0.1mm, for example, the size of the second gap 1421 is 0.06mm, 0.07mm, 0.08mm, 0.09mm or 0.1mm.

[0065] The size of the first gap 1411 and the second gap 1421 is not limited herein.

[0066] The first heat dissipation fin 141 and the second heat dissipation fin 142 are arranged in parallel to the plane where the middle plate 111 is located, and the side surface of the first heat dissipation fin 141 away from the middle plate 111 is flush with the side surface of the second heat dissipation fin 142 away from the middle plate 111. In this way, the sizes of the first gap 1411 and the second gap 1421 are consistent, that is, the distances from the first heat dissipation fin 141 and the second heat dissipation fin 142 to the display screen 120 are consistent. This structural arrangement is beneficial to reduce the waste of space in the thickness direction of the electronic device 100 caused by the inconsistency of the first gap 1411 and the second gap 1421, and is beneficial to maintain the thinness of the electronic device 100.

[0067] In some embodiments, the first heat sink 141 comprises a graphite heat sink, so that the graphite heat sink dissipates the heat received by the middle plate 111 from at least the heat generating device 131 on the main board 130, thereby leading the heat away from the heat generating device 131 to avoid performance degradation or damage of the heat generating device 131 due to excessively high temperature.

[0068] The thermal conductivity of the graphite heat sink in the thickness direction is about 1 W / mK-2 W / mK. For example, 1 W / mK, 1.3 W / mK, 1.5 W / mK, 1.7 W / mK, or 2 W / mK. No specific limitation is made herein.

[0069] The second heat sink 142 comprises an outer shell and a phase change material arranged in the outer shell. The outer shell can encapsulate the phase change material to avoid leakage of the phase change material due to phase change to, for example, a gaseous or liquid state. In this embodiment, since the second heat sink 142 adopts the phase change material, it can delay the temperature rise rate by utilizing the characteristic of the phase change material that can absorb a large amount of heat when the phase change process occurs after reaching the phase change point.

[0070] The following relationship exists between the thermal conductivity and the thermal resistance:

[0071]

[0072] Wherein, R is the thermal resistance of the material (unit: K / W), L is the thickness of the material (unit: m), λ is the thermal conductivity of the material (unit: W / mK), and S is the cross-sectional area perpendicular to the heat flow direction (unit: m 2 ).

[0073] The thermal conductivity is a physical quantity representing the heat conduction capacity of a material, and the greater the thermal conductivity, the better the heat conduction performance. Correspondingly, the thermal resistance reflects the resistance of the material to heat conduction, and is proportional to the thickness of the material and inversely proportional to the thermal conductivity and the cross-sectional area.

[0074] In the embodiments of the present application, compared with the first heat sink 141 adopting the same material as the second heat sink 142, the second heat sink 142 adopts the phase change material, and since the thermal conductivity of the phase change material is small, a greater thermal resistance can be obtained, thereby reducing the efficiency of heat conduction from the middle plate 111 to the display screen 120, delaying the temperature rise rate of the display screen 120, and reducing the surface temperature of the display screen 120, thereby reducing the probability of local high temperature in the area of the display screen 120 corresponding to the heat generating device 131, thereby facilitating the maintenance of the working performance of the display screen 120 and reducing the discomfort caused by the local high temperature of the display screen 120 when using the electronic device 100.

[0075] In some embodiments, the thermal conductivity of the phase change material in the second heat sink 142 in the thickness direction of the second heat sink 142 is approximately 0.2 W / mK-0.24 W / mK. Compared with the thermal conductivity of the graphite heat sink in the thickness direction, the phase change material in the second heat sink 142 has a smaller thermal conductivity, thereby obtaining a larger thermal resistance. In this way, the second heat sink 142 with a larger thermal resistance is beneficial to impede the rate of heat conduction from the heat generating device 131 to the display screen 120, thereby reducing the probability of local temperature overhigh of the display screen 120 in the area corresponding to the heat generating device 131.

[0076] The phase change material can be paraffin or phase change ink. In some embodiments, the phase change material can also be a mixture of paraffin and phase change ink. Paraffin provides high latent heat of phase change (e.g., 150 J / g-200 J / g) to absorb instantaneous heat. Phase change ink (such as silica gel-based ink) can accelerate heat diffusion through microfluidic structures, thereby avoiding local hot spots.

[0077] In some embodiments, the heat absorbed by the second heat sink 142 can be conducted to the first heat sink 141, so that the temperature of the first heat sink 141 tends to be consistent with the temperature of the second heat sink 142, so as to further balance the temperature of each area of the display screen 120, thereby reducing the probability of local temperature overhigh.

[0078] In the embodiment in which the second heat sink 142 adopts phase change material to achieve heat dissipation, the thickness of the second heat sink 142 can be greater than or equal to 0.05 mm, the enthalpy is greater than or equal to 50 J / g, and the thermal conductivity of the second heat sink 142 in the thickness direction is less than or equal to 0.5 W / mK. Through such a setting, the thermal resistance of the second heat sink 142 can be further improved, so as to slow down the efficiency of heat conduction from the heat generating device 131 to the corresponding area of the display screen 120, thereby reducing the probability of local temperature overhigh of the corresponding area of the display screen 120.

[0079] In some embodiments, the material of the shell includes at least one of a polymer, graphene or aluminum. Such materials not only can wrap the phase change material, but also have a heat dissipation effect by themselves, thereby facilitating heat diffusion.

[0080] The polymer includes but is not limited to polyurethane.

[0081] It should be noted that when a mixed material is used to make the shell, a better heat dissipation effect can be obtained. For example, the graphite or Al powder can be mixed into the polyurethane base to improve the thermal conductivity, thereby improving the radiation heat dissipation efficiency.

[0082] In some embodiments, the second heat sink 142 can be a polyurethane-based paraffin microcapsule composite gasket. In this case, the outer shell of the second heat sink 142 is made of polyurethane, and the phase change material is paraffin. Thus, the polymer shell serves as the encapsulation shell for the paraffin, which can be encapsulated within a polyurethane matrix as phase change units using microencapsulation technology. Because the polyurethane matrix possesses both viscoelasticity and weather resistance, it forms a support network after curing, preventing microcapsule rupture and leakage. Therefore, this second heat sink 142 can achieve both efficient temperature control and structural support.

[0083] In some embodiments, the second heat sink 142 includes a composite phase change substrate and an adhesive tape. The composite phase change substrate is a graphite and paraffin composite material; or, the composite phase change substrate is a graphene-paraffin composite material.

[0084] Adhesive tape is used to seal and encapsulate the composite phase change substrate, thereby preventing the precipitation of the phase change material. The tape includes, but is not limited to, single-sided or double-sided adhesive tape.

[0085] In some implementations, chemical vapor deposition (CVD) can also be used to achieve molecular-level coating of phase change materials such as paraffin.

[0086] The material type and structure of the second heat sink 142 will not be described in detail here.

[0087] In some embodiments, the first heat sink 141 and the second heat sink 142 are integrally formed. Thus, the first heat sink 141 and the second heat sink 142 can be used as a single unit for easy assembly onto the middle plate 111. The first heat sink 141 and the second heat sink 142 can be disposed on the middle plate 111 by means including but not limited to bonding or stacking.

[0088] In some embodiments, the first heat sink 141 and the second heat sink 142 may also be indirectly connected to the middle plate 111 through other structures.

[0089] For example, combining Figure 3 As shown, the heat dissipation module 140 also includes a heat spreader 143, which is disposed on the middle plate 111. The first heat sink 141 and the second heat sink 142 are both disposed on the side of the heat spreader 143 near the display screen 120. In this way, while the heat spreader 143 is used to even out the temperature of the middle plate 111, the first heat sink 141 and the second heat sink 142 can absorb heat at corresponding positions on the heat spreader 143 to conduct the temperature of the heat spreader 143 away, so that the heat spreader 143 can continuously cool the middle plate 111, and then the middle plate 111 can continuously absorb the heat generated by the heat-generating device 131.

[0090] It should be noted that when the heat plate 143 is used to heat the middle plate 111, the temperature of the middle plate 111 corresponding to the position of the heat generating device 131 is initially higher than other areas, and correspondingly, the temperature of the heat plate 143 corresponding to the position of the heat generating device 131 is also higher than the temperature of other areas. In this way, the heat plate 143 can realize the conduction of heat from the area with higher temperature to the area with lower temperature. Because the second heat sink 142 is arranged corresponding to the position of the heat generating device 131, and the thermal conductivity of the second heat sink 142 in the thickness direction is smaller than that of the first heat sink 141 in the thickness direction. Therefore, the second heat sink 142 will be in the area corresponding to the higher temperature of the heat plate 143, so that the smaller thermal conductivity of the second heat sink 142 relative to the first heat sink 141 can be used to obtain the thermal resistance between the heat plate 111 and the display screen 120 corresponding to the position of the heat generating device 131. Therefore, under the structure, when the heat of the heat generating device 131 is conducted to the middle plate 111, although there will be a higher temperature area formed on the heat plate 143, because the thermal resistance of the second heat sink 142 is high, the heat conduction from the higher temperature area of the heat plate 143 to the display screen 120 corresponding to the position of the heat generating device 131 can be slowed down, thereby reducing the probability of local temperature overhigh of the display screen 120 corresponding to the position of the heat generating device.

[0091] In combination Figure 3 and Figure 4 As shown in FIGS. 1, 2 and 3, the heat plate 143 includes an evaporation cavity 1431 and a condensation cavity 1432, the evaporation cavity 1431 is in communication with the condensation cavity 1432, and the area of the first heat sink 141 covering the heat plate 143 corresponds to the condensation cavity 1432 in the direction perpendicular to the heat plate 143.

[0092] The evaporation cavity 1431 is used to set the phase change medium, and the phase change medium is used to change from liquid to gas in the evaporation cavity 1431 when reaching the phase change temperature and flow to the condensation cavity 1432; the gaseous phase change medium in the condensation cavity 1432 releases heat to the first heat sink 141 to liquefy into liquid phase change medium, and the liquid phase change medium in the condensation cavity 1432 can flow back to the evaporation cavity 1431. In this way, the phase change medium in the heat plate 143 can be used to continuously conduct the heat of the middle plate 111 corresponding to the heat generating device 131 to other areas of the middle plate 111 by using the characteristics of phase change between liquid and gas.

[0093] The second heat sink 142 covers the area of the heat plate 143 corresponding to the evaporation cavity 1431 in the direction perpendicular to the heat plate 143, so that the higher thermal resistance of the second heat sink 142 can slow down the heat conduction of the heat plate 143 at the position corresponding to the evaporation cavity 1431 (also corresponding to the position of the heat generating device 131) to the display screen 120, so as to reduce the probability of local temperature overhigh of the display screen 120 at the position corresponding to the evaporation cavity 1431.

[0094] As shown in FIG. 1, the heat spreader 111 includes a vapor chamber 143. The vapor chamber 143 includes a condensing cavity 1432 and an evaporating cavity 1431. The condensing cavity 1432 is in thermal contact with the first heat dissipation fin 141, and the evaporating cavity 1431 is in thermal contact with the display screen 120. Figure 4 As shown in FIG. 1, the heat spreader 111 includes a vapor chamber 143. The vapor chamber 143 includes a condensing cavity 1432 and an evaporating cavity 1431. The condensing cavity 1432 is in thermal contact with the first heat dissipation fin 141, and the evaporating cavity 1431 is in thermal contact with the display screen 120.

[0095] In this embodiment, the capillary wick 1433 generates capillary action on the phase change medium. The phase change medium is used to absorb heat at the corresponding heat source (such as the heat generating device 131) of the vapor chamber 143 to evaporate and generate gas. The gas generated by the evaporation of the phase change medium is liquefied in the evaporating cavity 1431 due to the decrease in temperature, and the liquefied phase change medium flows back to the evaporating cavity 1431 under the action of the capillary wick 1433. In this way, the phase change medium in the vapor chamber 143, which undergoes phase change between liquid and gas, can be used to continuously conduct the heat of the corresponding heat generating device 131 of the middle plate 111 to other areas of the middle plate 111.

[0096] The capillary wick 1433 includes but is not limited to copper mesh, non-woven fabric, or foam.

[0097] As shown in FIG. 1, the electronic device 100 further includes a battery module 160. The battery module 160 is arranged on the side of the middle plate 111 opposite to the first heat dissipation fin 141. The projection area of the battery module 160 on the middle plate 111 at least partially overlaps with the projection area of the first heat dissipation fin 141 on the middle plate 111. At least part of the heat of the battery module 160 can be conducted to the first heat dissipation fin 141 through the middle plate 111. Figure 2 Figure 3 In this embodiment, since the heat generated by the battery module 160 is less than the heat generated by the heat generating device 131 on the main plate 130, without considering the heat dissipation effect of the heat dissipation module 140, the display screen 120 is more likely to have a temperature that is too high in the area corresponding to the heat generating device 131. Then, in the embodiment of the present application, since the thermal conductivity of the second heat dissipation fin 142 in the thickness direction is less than the thermal conductivity of the first heat dissipation fin 141 in the thickness direction, the second heat dissipation fin 142 has a larger thermal resistance relative to the first heat dissipation fin 141, so as to reduce the probability of the display screen 120 having a temperature that is too high at the corresponding heat generating device 131.

[0098] As shown in FIG. 1, the electronic device 100 further includes a battery module 160. The battery module 160 is arranged on the side of the middle plate 111 opposite to the first heat dissipation fin 141. The projection area of the battery module 160 on the middle plate 111 at least partially overlaps with the projection area of the first heat dissipation fin 141 on the middle plate 111. At least part of the heat of the battery module 160 can be conducted to the first heat dissipation fin 141 through the middle plate 111.

[0099] As shown in FIG. 1, the electronic device 100 further includes a battery module 160. The battery module 160 is arranged on the side of the middle plate 111 opposite to the first heat dissipation fin 141. The projection area of the battery module 160 on the middle plate 111 at least partially overlaps with the projection area of the first heat dissipation fin 141 on the middle plate 111. At least part of the heat of the battery module 160 can be conducted to the first heat dissipation fin 141 through the middle plate 111. Figure 5 Figure 5 ​​A circuit module block diagram of the electronic device 100 is provided for the embodiments of the present application. The electronic device 100 can include a radio frequency (RF) circuit 501, a memory 502 including one or more computer readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless fidelity (WiFi) module 507, a processor 508 including one or more processing cores, a power supply 509, and the like. Those skilled in the art can understand that the electronic device 100 shown in the figure does not constitute a limitation on the structure of the electronic device, and can include more or fewer components than those shown, or combine certain components, or arrange different components. Figure 5 222The electronic device 100 shown in the figure does not constitute a limitation on the structure of the electronic device, and can include more or fewer components than those shown, or combine certain components, or arrange different components.

[0100] The RF circuit 501 can be used to receive and send information or signals in a call process. In particular, after receiving the downlink information of the base station, the RF circuit 501 delivers it to the processor 508 for processing. In addition, the RF circuit 501 sends data related to the uplink to the base station. Generally, the RF circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a subscriber identity module (SIM) card, a transceiver, a coupler, a low noise amplifier (LNA), a duplexer, and the like. In addition, the RF circuit 501 can also communicate with the network and other devices through wireless communication. The wireless communication can use any communication standard or protocol, including but not limited to global system for mobile communication (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code division multiple access (WCDMA), long term evolution (LTE), email, short messaging service (SMS), and the like.

[0101] 222The memory 502 can be used to store applications and data. The applications stored in the memory 502 include executable code. The applications can constitute various functional modules. The processor 508 executes various functional applications and data processing by running the applications stored in the memory 502. The memory 502 can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required by a function (such as a sound playing function, an image playing function, etc.), and the like; and the data storage area can store data (such as audio data, a phone book, etc.) created according to the use of the electronic device 100, and the like. In addition, the memory 502 can include a high-speed random access memory, and can also include a nonvolatile memory, such as at least one magnetic disk storage device, a flash memory device, or other volatile solid-state memory device. Accordingly, the memory 502 can also include a memory controller to provide access to the memory 502 for the processor 508 and the input unit 503.

[0102] The input unit 503 can be used to receive inputted numbers, character information or user feature information (such as a fingerprint), and to generate keyboard, mouse, joystick, optical or trackball signal inputs related to user settings and function controls. Specifically, in one specific embodiment, the input unit 503 can include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch panel or a touchpad, can collect a user's touch operation (such as a user's operation on or near the touch-sensitive surface using a finger, a stylus, or any suitable object or accessory) on or near the touch-sensitive surface and drive the corresponding connection device according to the pre-set program. Optionally, the touch-sensitive surface can include two parts of a touch detection device and a touch controller. The touch detection device detects the user's touch position and detects the signal generated by the touch operation and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device and converts it into touch coordinates and sends it to the processor 508, and can also receive and execute the commands sent by the processor 508.

[0103] Further, the touch-sensitive surface can cover a liquid crystal panel, and when the touch-sensitive surface detects a touch operation on or near the touch-sensitive surface, it transmits to the processor 508 to determine the type of touch event, and then the processor 508 provides corresponding visual output on the liquid crystal panel according to the type of touch event.

[0104] The display unit 504 can be used to display information input by a user or information provided to a user and various graphical user interfaces of the electronic device 100, which can be composed of graphics, text, icons, video, and any combination thereof.

[0105] Although the above description is given with reference to the electronic device 100, the above description can also be applied to the electronic device 200. Figure 5In some embodiments, the touch-sensitive surface and the liquid crystal panel are implemented as two separate components to achieve input and output functions, but in some embodiments, the touch-sensitive surface and the liquid crystal panel can be integrated to achieve input and output functions. It can be understood that the electronic device 100 can include the input unit 503 and the display unit 504.

[0106] The electronic device 100 can further include at least one sensor 505, such as a proximity sensor, a motion sensor, and other sensors. Among them, the proximity sensor can turn off the liquid crystal panel and / or the backlight when the electronic device 100 is moved to the ear. As one of the motion sensors, the gravity acceleration sensor can detect the size of the acceleration in each direction (generally three axes), and when at rest, it can detect the size and direction of the gravity, which can be used for applications such as identifying the posture of the mobile phone (such as switching between horizontal and vertical screens, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometers, taps), and the like. As for other sensors that the electronic device 100 can also be configured, such as a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, and the like, they will not be described here.

[0107] The audio circuit 506 can provide an audio interface between the user and the electronic device 100 through the speaker and the microphone. The audio circuit 506 can convert the received audio data into an electrical signal and transmit it to the speaker, which converts it into a sound signal output. On the other hand, the microphone collects sound signals and converts them into electrical signals, which are received by the audio circuit 506 and converted into audio data. After being processed by the processor 508, the audio data is transmitted to another electronic device 100 via the radio frequency circuit 501, or output to the memory 502 for further processing. The audio circuit 506 can also include a headset seat to provide communication between the external headset and the electronic device 100.

[0108] Wireless Fidelity (WiFi) belongs to a short-range wireless transmission technology. The wireless Fidelity module 507 can help users send and receive emails, browse web pages, and access streaming media, etc. It provides users with wireless broadband Internet access. Although Figure 5 The wireless Fidelity module 507 is shown, but it can be understood that it does not belong to the necessary components of the electronic device 100, and can be omitted as needed without changing the essence of the application.

[0109] The processor 508 is the control center of the electronic device 100, which connects each part of the electronic device 100 through various interfaces and lines, performs various functions of the electronic device 100 and processes data by running or executing the application programs stored in the memory 502 and calling the data stored in the memory 502, and thus monitors the whole electronic device 100. Optionally, the processor 508 can include one or more processing cores; preferably, the processor 508 can integrate an application processor and a modem processor, wherein the application processor mainly processes the operating system, user interface, and application programs, and the modem processor mainly processes wireless communication. It can be understood that the above-mentioned modem processor can also not be integrated into the processor 508.

[0110] The electronic device 100 further includes a power supply 509 for supplying power to each component. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, so as to realize the functions of managing charging, discharging, and power consumption management through the power management system. The power supply 509 can also include one or more than one direct current or alternating current power supply, a recharging system, a power supply fault detection circuit, a power supply converter or inverter, a power supply state indicator, and any other components.

[0111] Although Figure 5 The electronic device 100 can further include a Bluetooth module and the like, which are not shown in the embodiments, and will not be described here. In specific implementation, the above modules can be implemented as independent entities, or can be combined as the same or several entities, and the specific implementation of the above modules can refer to the method embodiments described above, which will not be described here.

[0112] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0113] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that, for those skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. An electronic device, comprising: The application relates to a heat dissipation module for a mobile terminal. The heat dissipation module comprises a middle frame, a display screen, a main board and a heat dissipation module. The middle frame comprises a middle plate and a frame connected to the circumferential side of the middle plate. The display screen is connected to the frame, and a receiving cavity is arranged between the display screen and the middle plate. The main board is arranged on the side of the middle plate away from the display screen, and at least part of the heat generating devices on the main board are in thermal conduction contact with the middle plate.

2. The electronic device of claim 1, wherein, The heat dissipation module is arranged in the receiving cavity, and the heat dissipation module comprises a first heat dissipation fin and a second heat dissipation fin.

3. The electronic device of claim 1, wherein, The first heat dissipation fin and the second heat dissipation fin are both arranged on the middle plate.

4. The electronic device of claim 3, wherein, At least half of the structure of the first heat dissipation fin is arranged outside the region where the heat generating devices are in thermal conduction contact with the middle plate.

5. The electronic device of claim 3, wherein, At least half of the structure of the second heat dissipation fin is arranged inside the region where the heat generating devices are in thermal conduction contact with the middle plate.

6. The electronic device of claim 1, wherein, The first heat dissipation fin and the second heat dissipation fin are arranged on the middle plate.

7. The electronic device of claim 1, wherein, The first heat dissipation fin and the second heat dissipation fin are arranged on the middle plate.

8. The electronic device of claim 1, wherein, The first heat dissipation fin and the second heat dissipation fin are arranged on the middle plate.

9. The electronic device of claim 1, wherein, The first heat dissipation fin and the second heat dissipation fin are arranged on the middle plate.

10. The electronic device of claim 1, wherein, The first heat dissipation fin and the second heat dissipation fin are arranged on the middle plate.

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12. The electronic device of claim 11, wherein, The uniform heating plate comprises a capillary wick, a part of structure of the capillary wick is arranged in the condensation cavity, and another part of structure of the capillary wick is arranged in the evaporation cavity, the capillary wick is used for generating capillary action on the phase change medium, so that the phase change material in liquid state in the condensation cavity flows back to the evaporation cavity.

13. The electronic device of any of claims 1-12, wherein, The electronic device further comprises a battery module arranged on a side of the middle plate opposite to the first heat dissipation fin, a projection area of the battery module on the middle plate at least partially overlaps with a projection area of the first heat dissipation fin on the middle plate, and at least part of heat of the battery module can be conducted to the first heat dissipation fin through the middle plate.

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