Small computer workstation with air cooling and liquid cooling synergistic heat dissipation

Abstract

The invention relates to the technical field of small computer workstations, in particular to an air cooling and liquid cooling collaborative heat dissipation small computer workstation which comprises a case, a mainboard unit and a liquid cooling system. The mainboard unit is horizontally mounted in the mounting cavity, and the top of the mainboard unit is at least provided with a CPU module and a first patch element; the liquid cooling system comprises a uniform temperature plate horizontally installed at the top of the mainboard unit, a heat dissipation frame horizontally installed in the installation cavity and covering the air outlet, a fan assembly installed at the bottom of the heat dissipation frame and arranged at an interval from the uniform temperature plate up and down, and a water pump assembly installed between the uniform temperature plate and the fan assembly. Compared with the prior art, when the fan assembly works, external air flow is sucked into the mounting cavity from the bottom air inlet and finally exhausted from the top air outlet, so that a liquid cooling and air cooling double-heat-dissipation structure is achieved, and the heat dissipation effect of the whole small computer workstation is cooperatively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of small computer workstation, and particularly relates to a small computer workstation with air cooling and liquid cooling cooperative heat dissipation. BACKGROUND

[0002] The essence of the small computer workstation is to compress the computing power of the traditional small computer / workstation into an acceptable volume and noise on the office table through the continuous evolution of semiconductor technology, bus, heat dissipation and software stack. It inherits the professional / multi-task / ECC / graphic genes of the small computer, and combines the open / low-price / standardized advantages of the PC, and becomes the main computing node of the current digital creativity, engineering design and edge AI. Therefore, how to compress the volume of the small computer workstation and improve the heat dissipation effect is the research and development direction of the small computer workstation.

[0003] In the related art, as disclosed in the workstation case and workstation of Chinese invention CN219320723U, the main case, the first expansion case and the second expansion case are arranged, the power supply is arranged in the first expansion case and is used for power supply for the display card; the radiator is arranged in the independent second expansion case and is used for heat dissipation for the display card. Although this structure can configure a higher or more efficient radiator for heat dissipation to a certain extent, the structure of the main case, the first expansion case and the second expansion case will cause the overall volume of the workstation case to be large, which is not suitable for the miniaturization development trend. Moreover, if the radiator is a liquid cooling radiator, the pipeline needs to be extended from the main case to the second expansion case for circulating cooling, which undoubtedly prolongs the circulating flow path of the cooling liquid and seriously limits the heat dissipation effect of the liquid cooling radiator.

[0004] Therefore, it is necessary to study a new technical solution to solve the above problems. SUMMARY

[0005] Therefore, the present application aims at the defects in the prior art, and the main purpose is to provide a small computer workstation with air cooling and liquid cooling cooperative heat dissipation, which effectively solves the technical defects of large volume and poor heat dissipation effect of the small computer workstation in the prior art.

[0006] The present application provides a small computer workstation with air cooling and liquid cooling cooperative heat dissipation, which comprises a case comprising a support frame and a protective shell arranged on the side surface of the support frame, the protective shell can form an installation chamber with the closed side surface; the top of the support frame is an air outlet connected to the installation chamber, and the bottom is an air inlet connected to the installation chamber; a mainboard unit horizontally installed in the installation chamber, the top of the mainboard unit is provided with at least a CPU module and a first patch element; and The liquid cooling system comprises a vapor chamber horizontally installed on the top of the mainboard unit, a heat dissipation frame horizontally installed in the installation cavity and covering the air outlet, a fan assembly installed at the bottom of the heat dissipation frame and arranged in the upper and lower space of the vapor chamber, and a water pump assembly installed between the vapor chamber and the fan assembly. The bottom of the vapor chamber is at least abutted against the CPU module and the first patch element, the water pump assembly, the fan assembly and the heat dissipation frame are sequentially stacked on the top of the vapor chamber from bottom to top and coaxially arranged; when the fan assembly works, the external air flow enters from the bottom air inlet and is discharged from the top air outlet to form an air cooling channel from bottom to top.

[0007] The small computer workstation with the air cooling and liquid cooling cooperative heat dissipation has the following advantages: compared with the prior art, in the first aspect, the mainboard unit and the vapor chamber are horizontally installed, the bottom of the vapor chamber is abutted against the CPU module and the first patch element, and the vapor chamber is used for heat dissipation of the electronic components with large heat dissipation; when the fan assembly works, the external air flow is sucked into the installation cavity from the bottom air inlet, and finally discharged from the top air outlet, so that the liquid cooling and air cooling double heat dissipation structure is realized, the heat dissipation of the small computer workstation can be made lower under the same power, and the heat dissipation effect of the whole small computer workstation is improved. In the second aspect, the mainboard unit and the vapor chamber are horizontally installed, the water pump assembly, the fan assembly and the heat dissipation frame are sequentially arranged on the top of the vapor chamber from bottom to top and coaxially arranged, when the fan assembly works, the external air flow enters from the bottom air inlet and is discharged from the top air outlet to form an air cooling channel from bottom to top, and no additional expansion case is needed to install the heat sink and other components, so that the volume of the small computer workstation is further reduced to the acceptable volume of an office table, which meets the current miniaturization development trend; and the air cooling and liquid cooling double-channel heat dissipation is adopted, the working pressure of the fan unit can be reduced, and the heat dissipation operation can be effectively completed under the low-speed working state, so that the running noise of the small computer workstation is reduced.

[0008] As a preferred solution, the installation cavity comprises a bottom layer installation area, a middle layer installation area and a top layer installation area, the bottom layer installation area is connected to the bottom air inlet, the top layer installation area is connected to the top air outlet, and the middle layer installation area is connected to the bottom layer installation area and the top layer installation area. The bottom layer installation area is provided with a hard disk and a power supply, and the mainboard unit and the liquid cooling system are sequentially arranged from the middle layer installation area to the top layer installation area.

[0009] As a preferred solution, a bottom plate is further included, the upper surface of the bottom plate is provided with extension blocks at four corners, the bottom of the support frame is installed on the extension blocks, so that an air inlet avoiding area is formed between the bottom of the support frame and the bottom plate, and air filter screens are installed at the bottom air inlet and the top air outlet.

[0010] As a preferred solution, the water pump assembly is installed on the top of the vapor chamber, and the distance between the water pump assembly and the fan assembly is less than the height of the water pump assembly.

[0011] As a preferred solution, the vapor chamber has a first liquid inlet and a first liquid outlet, and the first liquid inlet and the first liquid outlet are located on the same side of the vapor chamber and are arranged in front and back; the first liquid inlet is provided with a first connector, and the first liquid outlet is provided with a second connector; The heat dissipation frame has a fifth connector and a sixth connector, and the fifth connector and the sixth connector are located on the same side of the heat dissipation frame and are arranged in front and back; the water pump assembly is provided with a third connector on the side facing the first connector and the second connector, and is provided with a fourth connector on the side facing the fifth connector and the sixth connector; Among them, the second connector and the third connector are connected through the pipeline, the fourth connector and the fifth connector are connected through the pipeline, and the sixth connector is connected with the first connector through the pipeline.

[0012] As a preferred solution, the vapor chamber includes an upper plate body and a lower plate body assembled together, and the first cooling contact surface and the second cooling contact surface are protruded on the lower surface of the lower plate body; The upper surface of the lower plate body is provided with a first recess position, and the first cooling contact surface covers the position where the first recess position is located; the first recess position is provided with a heat dissipation fin, and each heat dissipation fin is arranged in front and back and extends left and right; The bottom of the upper plate body is provided with a recess, and a liquid cooling chamber is formed by the recess and the top of the lower plate body.

[0013] As a preferred solution, it also includes a third cooling contact surface, a fourth cooling contact surface and a fifth cooling contact surface protruded on the lower surface of the lower plate body; The first cooling contact surface corresponds to abutting against the CPU module, the second cooling contact surface corresponds to abutting against the first patch element, the third cooling contact surface corresponds to abutting against the second patch element, the fourth cooling contact surface corresponds to abutting against the third patch element, and the fifth cooling contact surface corresponds to abutting against the fourth patch element.

[0014] As a preferred solution, the recess of the upper plate body is provided with a first partition plate and a second partition plate, and the first partition plate and the second partition plate are arranged in front and back to divide the liquid cooling chamber into a first liquid cooling chamber, a second liquid cooling chamber and a third liquid cooling chamber; The left side of the upper plate body is provided with a first liquid inlet and a first liquid outlet, and the first liquid outlet is in conductive connection with the left end of the first liquid cooling chamber, and the first liquid inlet is in conductive connection with the left end of the third liquid cooling chamber; The right end of the first liquid cooling chamber is in conductive connection with the front center position of the second liquid cooling chamber and forms a first branch, the left end of the third liquid cooling chamber is in conductive connection with the rear left end of the second liquid cooling chamber and forms a second branch, and the right end of the third liquid cooling chamber is in conductive connection with the rear right end of the second liquid cooling chamber and forms a third branch; The cross-sectional area of the second liquid cooling cavity is greater than the cross-sectional area of the first liquid cooling cavity and the third liquid cooling cavity, and the cross-sectional area of the first liquid cooling cavity is greater than, equal to, or less than the cross-sectional area of the third liquid cooling cavity.

[0015] As a preferred solution, the upper plate body is provided with a first base plate and a second base plate in the second liquid cooling cavity, the first base plate and the second base plate are arranged at a left-right interval and surround the branch flow channel; the branch flow channel is vertically and conductively connected with the first branch; and each heat dissipation fin extends upward and abuts against the lower surface of the first base plate and the second base plate.

[0016] As a preferred solution, the heat dissipation frame comprises The left liquid connection frame has a left liquid connection cavity; The right liquid connection frame has a right liquid connection cavity, and the right liquid connection frame is arranged at a left-right interval with the left liquid connection frame; and The heat dissipation fins have a plurality of front heat dissipation fins and rear heat dissipation fins, and each of the front heat dissipation fins and the rear heat dissipation fins has a heat dissipation cavity penetrating through the left and right sides thereof; The right liquid connection cavity has a front liquid connection cavity and a rear liquid connection cavity, the right end of the front heat dissipation fin is connected to the left side of the right liquid connection frame and is conductively connected with the front liquid connection cavity, and the right end of the rear heat dissipation fin is connected to the left side of the right liquid connection frame and is conductively connected with the rear liquid connection cavity; and the left end of the front heat dissipation fin and the rear heat dissipation fin is connected to the right side of the left liquid connection frame and is conductively connected with the left liquid connection cavity; The fifth joint is conductively connected with the front liquid connection cavity, and the sixth joint is conductively connected with the rear liquid connection cavity. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 is a schematic diagram of the three-dimensional structure of the small computer workstation provided by the embodiments of the present application; Figure 2 is Figure 1 a schematic diagram of the full cross-sectional structure of the small computer workstation shown in Figure 3 is Figure 1 a schematic diagram of the three-dimensional structure of the small computer workstation shown in Figure 4 is Figure 3 a front view of the liquid cooling system and the mainboard unit of the small computer workstation shown in Figure 5 is Figure 4A three-dimensional structural diagram of the liquid cooling system and motherboard unit of the small computer workstation shown. Figure 6 yes Figure 5 A partial structural cross-sectional view of the heat dissipation frame and fan assembly of the small computer workstation shown. Figure 7 yes Figure 5 An exploded three-dimensional view of the vapor chamber and motherboard unit of the small computer workstation shown. Figure 8 yes Figure 5 An exploded three-dimensional view of the vapor chamber and motherboard unit of the small computer workstation shown from another angle. Figure 9 yes Figure 8 A first cross-sectional view of the vapor chamber of the small computer workstation shown. Figure 10 yes Figure 8 The above view of the upper plate of the temperature distribution plate is shown. Figure 11 yes Figure 8 The diagram shows a three-dimensional structure of the lower plate of the temperature distribution plate.

[0019] The following are the labeling elements in the figure: 100. Mini computer workstations; 10. Chassis; 101. Mounting Chamber; 102. Air Inlet; 103. Air Outlet; 104. Bottom Mounting Area; 105. Middle Mounting Area; 106. Top Mounting Area; 108. Air Filter; 11. Base Plate; 111. Extension Block; 112. Air Inlet Clearance Area; 12. Protective Shell; 13. Hard Drive; 14. Power Supply; 20. Motherboard unit; 201. First component setting area; 202. Second component setting area; 203. Third component setting area; 204. Fourth component setting area; 21. CPU module; 22. First surface mount component; 23. Second surface mount component; 24. Third surface mount component; 25. Fourth surface mount component; 30, liquid cooling system; 31, vapor chamber; 311, upper plate body; 3111, first partition plate; 3112, second partition plate; 3113, first base plate; 3114, second base plate; 3115, first liquid inlet; 3116, first liquid outlet; 312, lower plate body; 3121, first cooling contact surface; 3122, second cooling contact surface; 3123, third cooling contact surface; 3124, fourth cooling contact surface; 3125, fifth cooling contact surface; 3126, first recess; 313, liquid cooling chamber; 3131, first liquid cooling cavity; 3132, second liquid cooling cavity; 3133, third liquid cooling cavity; 3134, first branch; 3135, second branch; 3136, third branch; 3137, branch flow channel; 314, heat dissipation fin; 315, first liquid flow channel; 316, second liquid flow channel; 317, third liquid flow channel; 32, water pump assembly; 33, heat dissipation frame; 331, left liquid receiving frame; 332, right liquid receiving frame; 3321, right liquid receiving cavity; 3322, front liquid receiving cavity; 3323, rear liquid receiving cavity; 333, front heat dissipation fin; 334, rear heat dissipation fin; 335, heat dissipation cavity; 341, first connector; 342, second connector; 343, third connector; 344, fourth connector; 345, fifth connector; 346, sixth connector; 35, fan assembly. DETAILED DESCRIPTION

[0020] In order to make the technical problems to be solved, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0021] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0023] In addition, the terms "first", "second", etc. are used only for descriptive purposes and should not be construed as implying or suggesting relative importance or an indicated number of the technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0024] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below in combination with the drawings and examples.

[0025] Please refer to Figures 1 to 11 , now the liquid cooling system 30 of the small computer workstation 100 provided by the embodiment of the present application will be described. The liquid cooling system 30 of the small computer workstation 100 comprises a case 10, a mainboard unit 20 and a liquid cooling system 30.

[0026] The case 10 comprises a support frame and a protective shell 12 arranged on the side surface of the support frame. The protective shell 12 can form an installation chamber 101 with a closed side surface. The top of the support frame is connected to the air outlet 103 of the installation chamber 101, and the bottom is connected to the air inlet 102 of the installation chamber 101. The mainboard unit 20 and the liquid cooling system 30 are arranged in the installation chamber 101. The mainboard unit 20 is horizontally arranged in the installation chamber 101. The top of the mainboard unit 20 is provided with at least a CPU module 21 and a first patch element 22. The liquid cooling system 30 comprises a vapor chamber 31 horizontally arranged on the top of the mainboard unit 20, a heat dissipation frame 33 horizontally arranged in the installation chamber 101 and covering the air outlet 103, a fan assembly 35 arranged at the bottom of the heat dissipation frame 33 and spaced from the vapor chamber 31, and a water pump assembly 32 arranged between the vapor chamber 31 and the fan assembly 35. The bottom of the vapor chamber 31 abuts against at least the CPU module 21 and the first patch element 22. The water pump assembly 32, the fan assembly 35 and the heat dissipation frame 33 are sequentially arranged on the top of the vapor chamber 31 from bottom to top and coaxially arranged. When the fan assembly 35 works, the external air flow enters from the bottom air inlet 102 and is discharged from the top air outlet 103, forming a bottom-to-top air cooling channel.

[0027] Specifically, compared with the prior art, in the first aspect, the heat-dissipating plate 31 is used to dissipate heat from the electronic components with large heat dissipation by horizontally installing the mainboard unit 20 and the heat-dissipating plate 31 and abutting the bottom of the heat-dissipating plate 31 against the CPU module 21 and the first patch element 22; and when the fan assembly 35 works, the external air flow is sucked into the installation chamber 101 from the bottom air inlet 102 and finally discharged from the top air outlet 103, so as to realize the liquid cooling and air cooling double heat-dissipating structure, so that the heat dissipation of the small computer workstation 100 can be made lower under the same power, and the heat-dissipating effect of the small computer workstation 100 is improved. In the second aspect, the water pump assembly 32, the fan assembly 35 and the heat-dissipating frame 33 are sequentially arranged on the top of the heat-dissipating plate 31 from bottom to top and coaxially arranged, so that when the fan assembly 35 works, the external air flow enters from the bottom air inlet 102 and is discharged from the top air outlet 103 to form an air cooling channel from bottom to top, without the need of additionally arranging an expansion case to install the heat-dissipating device and other components, so as to further reduce the volume of the small computer workstation 100 to the volume acceptable by an office table, which conforms to the current miniaturization development trend; and the air cooling and liquid cooling double-channel heat-dissipating structure is adopted, which can also reduce the working pressure of the fan unit and effectively complete the heat-dissipating operation under the low-speed working state, so as to reduce the running noise of the small computer workstation 100.

[0028] In some embodiments, the installation chamber 101 includes a bottom layer installation area 104, a middle layer installation area 105 and a top layer installation area 106, the bottom layer installation area 104 is connected to the bottom air inlet 102 at the bottom, the top layer installation area 106 is connected to the top air outlet 103 at the top, and the middle layer installation area 105 is connected to the bottom layer installation area 104 and the top layer installation area 106; the hard disk 13 and the power supply 14 are arranged in the bottom layer installation area 104, and the mainboard unit 20 and the liquid cooling system 30 are sequentially arranged from the middle layer installation area 105 to the top layer installation area 106. The bottom plate 11 is further included, the upper surface of the bottom plate 11 is provided with an extension block 111 at four corners, the bottom of the support frame is installed on the extension block 111, so that the bottom of the support frame and the bottom plate 11 form an air inlet avoiding area 112; the air flow filter screen 108 is installed at the bottom air inlet 102 and the top air outlet 103. Such a structure can arrange the air flow flowing from bottom to top, which is beneficial to improving the air cooling heat-dissipating efficiency. Meanwhile, the cross-sectional area of the heat-dissipating frame 33 is 95% of the cross-sectional area of the top air outlet 103, and the cross-sectional area of the heat-dissipating plate 31 and the mainboard unit 20 is 90% to 95% of the cross-sectional area of the installation chamber 101.

[0029] Preferably, the water pump assembly 32 is installed on the top of the vapor chamber 31, and the distance between the water pump assembly 32 and the fan assembly 35 is less than the height of the water pump assembly 32; in this way, the pipeline can be hidden between the fan assembly 35 and the vapor chamber 31 as much as possible, thereby optimizing the layout of the pipeline.

[0030] In other embodiments, the vapor chamber 31 comprises an upper plate body 311 and a lower plate body 312 assembled together, the first cooling contact surface 3121 and the second cooling contact surface 3122 are protruded on the lower surface of the lower plate body 312; the upper surface of the lower plate body 312 is provided with a first recess position 3126, and the first cooling contact surface 3121 covers the position of the first recess position 3126; the heat dissipation fins 314 are provided with the first recess position 3126, and each heat dissipation fin 314 extends forward and backward and left and right; the bottom of the upper plate body 311 is provided with a recessed cavity, and the liquid cooling chamber 313 is formed by the recessed cavity and the top of the lower plate body 312.

[0031] Specifically, the third cooling contact surface 3123, the fourth cooling contact surface 3124, and the fifth cooling contact surface 3125 are protruded on the lower surface of the lower plate body 312; the first cooling contact surface 3121 corresponds to abutting against the CPU module 21, the second cooling contact surface 3122 corresponds to abutting against the first patch element 22, the third cooling contact surface 3123 corresponds to abutting against the second patch element 23, the fourth cooling contact surface 3124 corresponds to abutting against the third patch element 24, and the fifth cooling contact surface 3125 corresponds to abutting against the fourth patch element 25.

[0032] It should be noted that the first patch element 22 is arranged in the first element arrangement area 201 of the mainboard unit 20; the second patch element 23 is arranged in the second element arrangement area 202; the third patch element 24 is arranged in the third element arrangement area 203, and the fourth element is arranged in the fourth element arrangement area 204; the area of the second cooling contact surface 3122 is greater than the area of the first element arrangement area 201, the area of the third cooling contact surface 3123 is greater than the area of the second element arrangement area 202, the area of the fourth cooling contact surface 3124 is greater than the area of the third element arrangement area 203, and the area of the fifth cooling contact surface 3125 is greater than the area of the fourth element arrangement area 204; in this way, the vapor chamber 31 can effectively dissipate heat for each patch element, so that the small computer workstation 100 works more reliably and does not have the problem of local temperature being too high.

[0033] In this way, the heat spreader 31 is arranged on the top of the mainboard unit 20, and the first cooling contact surface 3121 of the heat spreader 31 is in contact with the CPU module 21, and the second cooling contact surface 3122 is in contact with the first patch element 22, so that the heat spreader 31 cools the CPU module 21 and the patch element 22. At the same time, the heat dissipation fins 314 are arranged at the position of the first cooling contact surface 3121, so that the cooling efficiency of the first cooling contact surface 3121 is greater than that of the second cooling contact surface 3122, and the heat dissipation effect of the CPU module 21 is improved, thereby improving the heat dissipation effect of the entire small computer workstation 100.

[0034] More specifically, the recessed cavity of the upper plate body 311 is provided with a first partition plate 3111 and a second partition plate 3112, and the first partition plate 3111 and the second partition plate 3112 are arranged at a front-to-back interval to divide the liquid cooling chamber 313 into a first liquid cooling chamber 3131, a second liquid cooling chamber 3132, and a third liquid cooling chamber 3133. The left side of the upper plate body 311 is provided with a first liquid inlet 3115 and a first liquid outlet 3116. The first liquid outlet 3116 is in communication with the left end of the first liquid cooling chamber 3131, and the first liquid inlet 3115 is in communication with the left end of the third liquid cooling chamber 3133. The right end of the first liquid cooling chamber 3131 is in communication with the front center of the second liquid cooling chamber 3132 and constitutes a first branch 3134. The left end of the third liquid cooling chamber 3133 is in communication with the rear left end of the second liquid cooling chamber 3132 and constitutes a second branch 3135. The right end of the third liquid cooling chamber 3133 is in communication with the rear right end of the second liquid cooling chamber 3132 and constitutes a third branch 3136.

[0035] Further, the cross-sectional area of the second liquid cooling chamber 3132 is greater than that of the first liquid cooling chamber 3131 and the third liquid cooling chamber 3133. The cross-sectional area of the first liquid cooling chamber 3131 is greater than, equal to, or less than that of the third liquid cooling chamber 3133.

[0036] In other embodiments, the upper plate body 311 is provided with a first base plate 3113 and a second base plate 3114 at the second liquid cooling chamber 3132. The first base plate 3113 and the second base plate 3114 are arranged at a left-to-right interval and surround a branch flow channel 3137. The branch flow channel 3137 is in vertical communication with the first branch 3134. Each heat dissipation fin 314 extends upward and abuts against the lower surface of the first base plate 3113 and the second base plate 3114.

[0037] Specifically, the first liquid inlet 3115 is provided with a first joint 341, and the first liquid outlet 3116 is provided with a second joint 342; the water pump assembly 32 has a third joint 343 and a fourth joint 344, and the heat dissipation frame 33 has a fifth joint 345 and a sixth joint 346; the second joint 342 and the third joint 343 are connected by a pipeline, the fourth joint 344 and the fifth joint 345 are connected by a pipeline, and the sixth joint 346 is connected to the first joint 341 by a pipeline.

[0038] Preferably, the first liquid inlet 3115 and the first liquid outlet 3116 are located on the same side of the vapor chamber 31 and arranged in front of and behind each other, the fifth joint 345 and the sixth joint 346 are located on the same side of the heat dissipation frame 33 and arranged in front of and behind each other, the third joint 343 is arranged on the side facing the first joint 341 and the second joint 342 of the water pump assembly 32, and the fourth joint 344 is arranged on the side facing the fifth joint 345 and the sixth joint 346 of the water pump assembly 32; such a structure can shorten the path of liquid flow, thereby further improving the liquid cooling efficiency.

[0039] More specifically, the heat dissipation frame 33 includes a left liquid connection frame 331, a right liquid connection frame 332, and a plurality of heat dissipation fins, the left liquid connection frame 331 has a left liquid connection cavity; the right liquid connection frame 332 has a right liquid connection cavity 3321, and the right liquid connection frame 332 is arranged with a left-right spacing from the left liquid connection frame 331; the heat dissipation fins have a plurality of front heat dissipation fins 333 and a plurality of rear heat dissipation fins 334, and the plurality of front heat dissipation fins 333 and the plurality of rear heat dissipation fins 334 each have a heat dissipation cavity 335 penetrating the left and right sides thereof; the right liquid connection cavity 3321 has a front liquid connection cavity 3322 and a rear liquid connection cavity 3323, the right end of the front heat dissipation fin 333 is connected to the left side of the right liquid connection frame 332 and is in conductive connection with the front liquid connection cavity 3322, and the right end of the rear heat dissipation fin 334 is connected to the left side of the right liquid connection frame 332 and is in conductive connection with the rear liquid connection cavity 3323; the left end of the front heat dissipation fin 333 and the left end of the rear heat dissipation fin 334 are connected to the right side of the left liquid connection frame 331 and are in conductive connection with the left liquid connection cavity; the fifth joint 345 is in conductive connection with the front liquid connection cavity 3322, and the sixth joint 346 is in conductive connection with the rear liquid connection cavity 3323.

[0040] It can be understood that the liquid enters from the first liquid inlet 3115, and then directly flows into the second liquid cooling cavity 3132 from the second branch 3135 to form a first liquid flow channel 315. The liquid flows through the third liquid cooling cavity 3133 and flows into the second liquid cooling cavity 3132 from the third branch 3136 to form a second liquid flow channel 316. The liquid in the second liquid cooling cavity 3132 flows into the branch flow channel 3137 through the heat dissipation fins 314, flows into the first liquid cooling cavity 3131 from the first branch 3134 through the branch flow channel 3137 to form a third liquid flow channel 317, and finally flows out of the first liquid outlet 3116 to take away the heat of the uniform temperature plate 31. The liquid in the first liquid outlet 3116 is powered by the water pump assembly 32 to enter the front liquid receiving cavity 3322, and then flows into the heat dissipation cavity 335 of the front heat dissipation fin 333, the left liquid receiving cavity of the left liquid receiving frame 331, and the heat dissipation cavity 335 of the rear heat dissipation fin 334 in sequence to flow into the rear liquid receiving cavity 3323. At this time, the liquid in the rear liquid receiving cavity 3323 is cooled by the front heat dissipation fin 333 and the rear heat dissipation fin 334, and then continues to be input into the third liquid cooling cavity 3133 from the first liquid inlet 3115 to continuously provide cooling liquid for the uniform temperature plate 31 to perform heat dissipation work.

[0041] The above is only a preferred embodiment of the present application, and only the technical principles of the present application are specifically described. These descriptions are only for explaining the principles of the present application, and cannot be explained as limitations on the protection scope of the present application in any way. Based on the explanations here, any modifications, equivalent replacements and improvements made within the spirit and principles of the present application, and other specific embodiments of the present application that can be thought of by those skilled in the art without creative labor, should be included in the protection scope of the present application.

Claims

1. A small computer workstation with air cooling and liquid cooling synergistic heat dissipation, characterized in that, The application relates to a computer case. The computer case comprises a support frame and a protective shell arranged on the side surface of the support frame, the protective shell can form a closed installation chamber on the side surface; the top of the support frame is connected with the air outlet of the installation chamber, and the bottom of the support frame is connected with the air inlet of the installation chamber; A mainboard unit is horizontally arranged in the installation chamber, and the top of the mainboard unit is provided with at least a CPU module and a first patch element; and A liquid cooling system comprises a vapor chamber horizontally arranged on the top of the mainboard unit, a heat dissipation frame horizontally arranged in the installation chamber and covering the air outlet, a fan assembly arranged on the bottom of the heat dissipation frame and spaced from the vapor chamber, and a water pump assembly arranged between the vapor chamber and the fan assembly; The bottom of the vapor chamber is abutted against at least the CPU module and the first patch element, the water pump assembly, the fan assembly and the heat dissipation frame are sequentially arranged on the top of the vapor chamber from bottom to top and coaxially arranged; when the fan assembly works, the outside air flow enters from the bottom air inlet and is discharged from the top air outlet, thereby forming a bottom-to-top air cooling channel.

2. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 1, wherein, The installation chamber comprises a bottom layer installation area, a middle layer installation area and a top layer installation area, the bottom of the bottom layer installation area is connected with the bottom air inlet, the top of the top layer installation area is connected with the top air outlet, and the middle layer installation area is connected with the bottom layer installation area and the top layer installation area; The bottom layer installation area is provided with a hard disk and a power supply, and the mainboard unit and the liquid cooling system are sequentially arranged from the middle layer installation area to the top layer installation area.

3. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 1 or 2, wherein, The bottom plate is further provided, the upper surface of the bottom plate is provided with extension blocks at four corners, the bottom of the support frame is arranged on the extension blocks, so that the bottom of the support frame and the bottom plate form an air inlet avoiding area; the support frame is provided with air filter screens at the bottom air inlet and the top air outlet.

4. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 3, wherein, The water pump assembly is arranged on the top of the vapor chamber, and the distance between the water pump assembly and the fan assembly is less than the height of the water pump assembly.

5. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 1 or 2 or 4, wherein, The vapor chamber is provided with a first liquid inlet and a first liquid outlet, the first liquid inlet and the first liquid outlet are arranged on the same side of the vapor chamber and are arranged in front and back; the first liquid inlet is provided with a first connector, and the first liquid outlet is provided with a second connector; The heat dissipation frame is provided with a fifth connector and a sixth connector, the fifth connector and the sixth connector are arranged on the same side of the heat dissipation frame and are arranged in front and back; the water pump assembly is provided with a third connector on the side facing the first connector and the second connector, and is provided with a fourth connector on the side facing the fifth connector and the sixth connector; The second connector and the third connector are connected through a pipeline, the fourth connector and the fifth connector are connected through a pipeline, and the sixth connector is connected with the first connector through a pipeline.

6. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 2, wherein, The vapor chamber comprises an upper plate body and a lower plate body which are assembled together, the first cooling contact surface and the second cooling contact surface are protruded on the lower surface of the lower plate body; The upper surface of the lower plate body is provided with a first recess, the first cooling contact surface covers the position of the first recess, the first recess is provided with heat dissipation fins, and each heat dissipation fin is arranged in front and back and extends left and right; The bottom of the upper plate body is provided with a recess, and the recess and the top of the lower plate body form a liquid cooling chamber.

7. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 6, wherein, The vapor chamber further comprises a third cooling contact surface, a fourth cooling contact surface and a fifth cooling contact surface which are protruded on the lower surface of the lower plate body. The first cooling abutting surface corresponds to abutting against the CPU module, the second cooling abutting surface corresponds to abutting against the first patch element, the third cooling abutting surface corresponds to abutting against the second patch element, the fourth cooling abutting surface corresponds to abutting against the third patch element, and the fifth cooling abutting surface corresponds to abutting against the fourth patch element.

8. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 5 or 7, wherein, The concave cavity of the upper plate body is provided with a first partition plate and a second partition plate, and the first partition plate and the second partition plate are arranged at front and back positions to divide the liquid cooling cavity into a first liquid cooling cavity, a second liquid cooling cavity and a third liquid cooling cavity. The left side of the upper plate body is provided with a first liquid inlet and a first liquid outlet, the first liquid outlet is in conductive connection with the left end of the first liquid cooling cavity, and the first liquid inlet is in conductive connection with the left end of the third liquid cooling cavity. The right end of the first liquid cooling cavity is in conductive connection with the front center position of the second liquid cooling cavity and constitutes a first branch, the left end of the third liquid cooling cavity is in conductive connection with the rear left end of the second liquid cooling cavity and constitutes a second branch, and the right end of the third liquid cooling cavity is in conductive connection with the rear right end of the second liquid cooling cavity and constitutes a third branch. The cross-sectional area of the second liquid cooling cavity is greater than that of the first liquid cooling cavity and the third liquid cooling cavity, and the cross-sectional area of the first liquid cooling cavity is greater than, equal to or less than that of the third liquid cooling cavity.

9. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 8, wherein, The upper plate body is provided with a first base plate and a second base plate in the second liquid cooling cavity, the first base plate and the second base plate are arranged at left and right positions and surround a branch flow channel; the branch flow channel is in vertical conductive connection with the first branch, and each heat dissipation fin extends upward and abuts against the lower surfaces of the first base plate and the second base plate.

10. The small computer workstation with air and liquid cooling synergistic heat dissipation of claim 1 or 2 or 6 or 7 or 9, wherein, The heat dissipation frame comprises The left liquid connection frame has a left liquid connection cavity; The right liquid connection frame has a right liquid connection cavity, and the right liquid connection frame is arranged at a left and right position apart from the left liquid connection frame; and The heat dissipation fins have a plurality of front heat dissipation fins and rear heat dissipation fins, and each of the front heat dissipation fins and the rear heat dissipation fins has a heat dissipation cavity penetrating through the left and right sides thereof; The right liquid connection cavity has a front liquid connection cavity and a rear liquid connection cavity, the right end of the front heat dissipation fin is connected to the left side of the right liquid connection frame and in conductive connection with the front liquid connection cavity, and the right end of the rear heat dissipation fin is connected to the left side of the right liquid connection frame and in conductive connection with the rear liquid connection cavity; the left end of the front heat dissipation fin and the rear heat dissipation fin is connected to the right side of the left liquid connection frame and in conductive connection with the left liquid connection cavity; The fifth joint is in conductive connection with the front liquid connection cavity, and the sixth joint is in conductive connection with the rear liquid connection cavity.

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