A small test machine for final testing of memory chips

Abstract

The application relates to the technical field of storage chip testing, and particularly discloses a small test machine table for final testing of a storage chip, which comprises a socket module and a temperature control assembly. During high-temperature and low-temperature simulation testing, because the sizes of heat exchange plates are different, and the volumes of air cavities are equal, the heat exchange efficiency of the heat exchange plate with a larger size is higher, so the temperature in the corresponding air cavity is relatively low (when high-temperature air) or relatively high (when low-temperature air), so that the to-be-tested environments with different temperature gradients can be simultaneously set, when temperature sudden change needs to be simulated, only the high-temperature box or the low-temperature box needs to be quickly moved, so that the air with a large temperature difference can be in contact with the to-be-tested chip, thereby realizing the testing of the chip when the temperature suddenly changes, so that the actual use environment can be simulated, and the accuracy and reliability of the test result are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of storage chip testing, and in particular to a small test machine for final testing of storage chips. BACKGROUND

[0002] Final testing (FT) of storage chips is a key link to ensure the performance and reliability of storage chips. In the final testing link of storage chips, a dedicated final test machine is used for chip testing. The dedicated final test machine for chips is configured according to the full production capacity of mass production, and the number of boards and the size of the machine are increased. A final test machine for mass production also needs to be used with a power cabinet, a sorting machine and other equipment, which increases the overall floor space and compresses the user's operation space. When facing the iteration of new chip testing products or the testing process of new boards, the use of final test machines for mass production will greatly waste the use of machine resources and power costs. If the test machine is not used, the accurate test environment for product upgrading cannot be obtained.

[0003] Therefore, a small test machine for final testing of storage chips is needed. However, the small test machine on the market has the following defects: the temperature test of the existing small test machine only supports gradual temperature rise or fall, and cannot simulate the temperature sudden change (such as extreme high temperature impact or instantaneous extreme cold environment) that may occur in actual application, which leads to the disconnection of temperature test conditions and actual application scenarios, affecting the accuracy and reliability of test results. Therefore, it is urgent to develop a small test machine with precise temperature simulation capability. SUMMARY

[0004] The present application aims to solve the technical problem that the existing small test machine cannot simulate temperature sudden change in use, and provides a small test machine for final testing of storage chips.

[0005] The purpose of the present application can be achieved by the following technical solutions:

[0006] A small test machine for final testing of storage chips, comprising a test table body, the small test machine further comprising:

[0007] A socket module is installed on the test table body, the socket module comprising a protective shell and a socket board, the protective shell covering the socket board, the socket board protruding from the protective shell, and the socket board being connected to the chip to be tested;

[0008] The temperature control assembly comprises a guide plate, a high-temperature box and a low-temperature box, the guide plate is installed on a protective shell, the socket plate card is inserted from the top of the guide plate, the top of the guide plate is flush with the top of the socket plate card, sliding plates are slidably installed on both sides of the guide plate, the high-temperature box and the low-temperature box are installed between the two groups of sliding plates, a driving module is installed on the guide plate, the driving module drives the sliding plates to move, a plurality of fixing cylinders are arranged on the high-temperature box and the low-temperature box, heat exchange plates are installed in the fixing cylinders, the sizes of the heat exchange plates in the plurality of fixing cylinders are arranged in a gradient mode, a plurality of air cavities are formed in the high-temperature box and the low-temperature box, the air cavities are located between the fixing cylinders and the guide plate, a plurality of hot inlets and a plurality of hot outlets are installed on both sides of the high-temperature box, the hot inlets are connected with an external hot air supply unit, cold inlets and cold outlets are installed on both sides of the low-temperature box, and the cold inlets are connected with an external cold air supply unit.

[0009] As a preferred form of the above technical solution, the volumes of the plurality of air cavities in the high-temperature box are equal, the volumes of the plurality of air cavities in the low-temperature box are equal, and the high-temperature box and the low-temperature box are made of heat insulation materials.

[0010] As a preferred form of the above technical solution, the bottom of the fixing cylinder is symmetrically and elastically rotatably installed with sealing plates, the heat exchange plates are separated from the air cavities when the two groups of sealing plates are combined, a telescopic member is installed on the fixing cylinder, and the output end of the telescopic member is connected with the heat exchange plate.

[0011] As a preferred form of the above technical solution, a humidity control assembly is installed on the fixing cylinder, the humidity control assembly comprises a water storage cavity, a plurality of water storage cavities are formed in the fixing cylinder, water is stored in the water storage cavities, a plurality of nozzles are arranged at the edge of the bottom of the fixing cylinder, the nozzles are communicated with the water storage cavities, a pressing plate is slidably arranged in the water storage cavity, a pressing rod is arranged on the pressing plate, the output end of the telescopic member is fixed with a tooth ring, an ear plate is arranged on the tooth ring, the ear plate is used in cooperation with the pressing rod, a driving member is installed on the fixing cylinder, a gear is installed on the driving member, the gear is intermeshed with the tooth ring, and the length of the gear is greater than the maximum downward movement distance of the tooth ring.

[0012] As a preferred form of the above technical solution, the plurality of nozzles are directed towards the inner wall of the air cavity.

[0013] As a preferred form of the above technical solution, the test bench body comprises a base, a fixing frame, a machine bench body and a rotating module, the fixing frame is fixed on the base, the machine bench body is rotatably installed on the fixing frame, the rotating module is installed on the fixing frame and drives the machine bench body to rotate, and the socket plate card is installed on the machine bench body.

[0014] As a preferred form of the above technical solution, a machine bench switch and an emergency stop switch are installed on the machine bench body.

[0015] As the preferred technical scheme of the above, the machine body is provided with an interface module and a board fixing member.

[0016] As the preferred technical scheme of the above, the machine body is provided with a heat dissipation module.

[0017] The present application has the following advantages:

[0018] 1. In the present application, during high-temperature and low-temperature simulation tests, since the sizes of the heat exchange plates are different and the volumes of the air cavities are equal, the heat exchange efficiency of the larger heat exchange plates is higher, so the temperature in the corresponding air cavity is relatively lower (when the air is at high temperature) or relatively higher (when the air is at low temperature), while the temperature in the air cavity corresponding to the smaller heat exchange plate is relatively higher (when the air is at high temperature) or relatively lower (when the air is at low temperature), so that different temperature gradients of the test environment can be set at the same time, and when a sudden temperature change needs to be simulated, only the high-temperature chamber or the low-temperature chamber needs to be moved quickly, so that air with a large temperature difference can be in contact with the chip to be tested, thereby testing the chip when the temperature changes suddenly, which can simulate the actual use environment and improve the accuracy and reliability of the test results.

[0019] 2. In the present application, the machine body is rotated by the rotating module, so that the manual installation mode or the automatic mode can be switched when the chip to be tested is installed, and the digital board card and the power supply board card that provide test signals for the chip to be tested can also be conveniently installed on the board fixing member; the socket board card and the slot on the board fixing member are made in the form of a reduced version of the mass production machine, so that most interface board cards can be compatible and reused in the mass production test machine, improving the utilization rate of the board cards to save design and manufacturing costs; the multifunctional interface is provided on the interface module, so that both manual test mode and automatic test mode with a small sorting machine can be used; during normal temperature test, the board card is cooled by the heat dissipation module, air cooling is used in the case of non-full configuration, and liquid cooling is used in the case of near-full configuration, which improves the service life of the board card while considering energy saving.

[0020] 3、In the application, the over-elastic member is elongated to push the two sets of sealing plates apart, so that the heat exchange plate is in contact with the air in the cavity to exchange heat, so that the two sets of sealing plates are in a sealed state when preparing, so that the heat loss of the air introduced in front is avoided, and the temperature gradient is not balanced, so that the accuracy and reliability of the test structure are affected; at the same time, when the heat exchange plate pushes the two sets of sealing plates to rotate, the two sets of sealing plates will drive the air in the air cavity to flow, and the heat exchange plate will reduce the pressure in the air cavity, so as to further promote the air flow, so that the air can fully contact the chip to be tested, and the test result is not accurate and unreliable due to insufficient contact between the air and the chip to be tested; in addition, the rapidly flowing air can realize rapid heat exchange with the chip, thereby accelerating the temperature simulation efficiency and improving the test efficiency;

[0021] 4、In the application, the gear is driven to rotate by the driving member, so that the gear ring drives the lug plate to rotate until the lug plate rotates to the upper side of the pressing rod and stops, at this time, the elastic member is elongated, so that the lug plate moves downward to press the pressing rod, so that the pressing plate moves downward to press the water in the water storage cavity, and the water in the water storage cavity is sprayed from the plurality of nozzles, so that the humidity in the air cavity is increased, the humidity can be adjusted by the distance of the heat exchange plate moving downward, the more the distance of the heat exchange plate moving downward, the more the water sprayed, and the humidity will be greater, and the humidity simulation is added during the temperature simulation test, so that the actual use environment of the chip can be restored more accurately, thereby further improving the accuracy and reliability of the test result. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a whole structure schematic view of the application;

[0023] Figure 2 It is a test bench structure schematic view;

[0024] Figure 3 It is a test bench bottom structure schematic view;

[0025] Figure 4 It is a temperature control assembly structure schematic view;

[0026] Figure 5 It is a temperature control assembly overhead structure schematic view;

[0027] Figure 6 It is a high-temperature box section structure schematic view;

[0028] Figure 7 It is a humidity control assembly structure schematic view;

[0029] Figure 8 It is a sealing plate structure schematic view;

[0030] Figure 9 It is a sealing plate structure schematic view.

[0031] In the drawings:

[0032] 1, test bench body; 11, base; 12, fixed frame; 13, machine table body; 14, rotating module; 15, machine table switch; 16, interface module; 17, heat dissipation module; 18, emergency stop switch; 19, board fixing piece; 2, socket module; 21, protective shell; 22, socket board; 3, temperature control assembly; 4, guide plate; 41, drive module; 42, sliding plate; 5, high-temperature box; 51, hot inlet; 52, hot outlet; 6, low-temperature box; 61, cold inlet; 62, cold outlet; 7, fixed cylinder; 71, heat exchange plate; 72, expansion piece; 73, sealing plate; 8, air cavity; 9, humidity control assembly; 91, water storage cavity; 92, pressing plate; 93, pressing rod; 94, spray head; 95, gear ring; 96, lug plate; 97, drive piece; 98, gear. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0034] As Figures 1-9 shown, a small test machine table for final testing of a storage chip comprises a test bench body 1, and further comprises:

[0035] A socket module 2 is installed on the test bench body 1, the socket module 2 comprises a protective shell 21 and a socket board 22, the protective shell 21 covers the socket board 22, the socket board 22 leaks out of the protective shell 21, and a chip to be tested is inserted on the socket board 22;

[0036] The temperature control assembly 3 comprises a guide plate 4, a high-temperature box 5 and a low-temperature box 6. The guide plate 4 is installed on the protective shell 21, the socket board card 22 is inserted from the top of the guide plate 4, the top of the guide plate 4 is flush with the top of the socket board card 22, and the guide plate 4 is slidably installed with slide plates 42 on both sides. The high-temperature box 5 and the low-temperature box 6 are installed between the two groups of slide plates 42. The guide plate 4 is provided with a driving member 41, the driving member 41 drives the slide plates 42 to move, the high-temperature box 5 and the low-temperature box 6 are provided with a plurality of fixing cylinders 7, the fixing cylinders 7 are provided with heat exchange plates 71, the sizes of the heat exchange plates 71 in the fixing cylinders 7 are set in a gradient, the high-temperature box 5 and the low-temperature box 6 are provided with a plurality of air cavities 8, the air cavities 8 are located between the fixing cylinders 7 and the guide plate 4, the high-temperature box 5 is provided with a plurality of hot inlets 51 and a plurality of hot outlets 52 on both sides, the hot inlets 51 are connected with an external hot air supply unit, and the low-temperature box 6 is provided with a cold inlet 61 and a cold outlet 62 on both sides.

[0037] The test bench body 1 comprises a base 11, a fixing frame 12, a machine bench body 13 and a rotating module 14. The fixing frame 12 is fixed on the base 11, the machine bench body 13 is rotatably installed on the fixing frame 12, and the rotating module 14 is installed on the fixing frame 12 and drives the machine bench body 13 to rotate. The socket board card 22 is installed on the machine bench body 13. The machine bench body 13 is provided with a machine bench switch 15 and an emergency stop switch 18. The machine bench body 13 is provided with an interface module 16 and a board card fixing member 19. The machine bench body 13 is provided with a heat dissipation module 17.

[0038] The volumes of the air cavities 8 in the high-temperature box 5 are equal, the volumes of the air cavities 8 in the low-temperature box 6 are equal, and the high-temperature box 5 and the low-temperature box 6 are made of heat insulation materials.

[0039] In actual application, three temperatures (high temperature, normal temperature and low temperature) are needed in the temperature simulation test. In normal temperature test, the chip to be tested is directly inserted into the socket card 22 for test. In high temperature and low temperature simulation test, the chip to be tested is first inserted into the socket card 22, and then the temperature control assembly 3 is installed on the protective shell 21. The external hot air supply unit is used to fill the high temperature air into the air cavities 8 in the high temperature box 5, and the external cold air supply unit is used to fill the low temperature air into the air cavities 8 in the low temperature box 6. Since the sizes of the heat exchange plates 71 are different, and the volumes of the air cavities 8 are equal, the heat exchange efficiency of the heat exchange plates 71 with large size is high, so the temperature in the corresponding air cavity 8 is relatively low (when the high temperature air is used) or relatively high (when the low temperature air is used). The temperature in the air cavity corresponding to the heat exchange plate 71 with small size is relatively high (when the high temperature air is used) or relatively low (when the low temperature air is used). Therefore, different temperature gradients of the test environment can be set at the same time. When the test of gradually increasing or decreasing temperature needs to be simulated, the slide plate 42 is slowly moved by the driving member 41, so that different air cavities 8 are in communication with the socket card 22, thereby realizing the test of the chip in the stable and gradually increasing or decreasing temperature. When the temperature is simulated to change suddenly, the high temperature box 5 or the low temperature box 6 is quickly moved, so that the air with large temperature difference is in contact with the chip to be tested, thereby realizing the test of the chip in the temperature change. Therefore, the actual use environment can be simulated, and the accuracy and reliability of the test result are improved.

[0040] When the next temperature simulation test is performed, the hot outlet 52 and the cold outlet 62 are opened, and the external hot air supply unit is used to inject high temperature air into the air cavities 8 in the high temperature box 5, and the external cold air supply unit is used to inject low temperature air into the air cavities 8 in the low temperature box 6. The injected high temperature air discharges the high temperature air in the original air cavity 8 from the hot outlet 52, and the new high temperature air gradually fills the air cavity 8. The injected low temperature air discharges the low temperature air in the original air cavity from the cold outlet 62, and the new low temperature air gradually fills the air cavity 8. As described above, the newly entered high temperature air or low temperature air can squeeze and discharge the original high temperature air and low temperature air, thereby effectively avoiding the influence of the high temperature air and low temperature air which have been cooled or heated in the last test on the result of this temperature change test.

[0041] The machine body 13 is rotated by the rotating module 14, so that the manual installation mode or the automatic mode is switched when the chip to be tested is installed, and meanwhile, it is convenient to install the digital board and the power supply board which provide test signals for the chip to be tested on the board fixing member 19; the socket board 22 and the socket on the board fixing member 19 are made in a reduced version of the mass production machine, so that most of the interface boards can be compatible and reused in the mass production test machine, the board utilization rate is improved to save the design cost and the board manufacturing cost; the multifunctional interface is arranged on the interface module 16, so that the manual test mode can be used, and the automatic test mode can be matched with the small sorting machine; when the normal temperature test is performed, the board is cooled by the cooling module 17, the air cooling is used in the case of non-full configuration, and the liquid cooling is used in the case of close to full configuration, and the service life of the board is improved under the consideration of energy saving.

[0042] Further, the bottom of the fixed cylinder 7 is symmetrically and elastically rotatably provided with sealing plates 73, the two groups of sealing plates 73 are combined, the heat exchange plate 71 is separated from the air cavity 8, the fixed cylinder 7 is provided with an extension piece 72, and the output end of the extension piece 72 is connected with the heat exchange plate 71.

[0043] In actual application, the heat exchange plate 71 is pushed away from the two groups of sealing plates 73 by being moved downward by the extension piece 72, so that the heat exchange plate 71 is in contact with the air in the air cavity 8 to exchange heat, so that the two groups of sealing plates 73 are in a sealed state when the preparation work is performed, so that the heat loss of the air introduced in front is avoided, and the temperature gradient is not balanced, so that the accuracy and reliability of the test structure are avoided.

[0044] Meanwhile, when the heat exchange plate 71 moves downward to push the two groups of sealing plates 73 to rotate, the two groups of sealing plates 73 drive the air in the air cavity 8 to flow, and the heat exchange plate 71 reduces the pressure in the air cavity 8, so that the air flow is further promoted, so that the air is fully in contact with the chip to be tested, and the test result is not accurate and reliable due to insufficient contact between the air and the chip to be tested; in addition, the rapidly flowing air can realize rapid heat exchange with the chip, so as to accelerate the temperature simulation efficiency and improve the test efficiency.

[0045] Further, the fixed cylinder 7 is provided with a humidity control assembly 9, the humidity control assembly 9 comprises water storage cavities 91, a plurality of water storage cavities 91 are formed in the fixed cylinder 7, water is stored in the water storage cavities 91, a plurality of nozzles 94 are arranged at the edge of the bottom of the fixed cylinder 7, the nozzles 94 are communicated with the water storage cavities 91, a pressing plate 92 is slidably arranged in the water storage cavities 91, a pressing rod 93 is arranged on the pressing plate 92, a tooth ring 95 is fixed to the output end of the extension piece 72, an ear plate 96 is arranged on the tooth ring 95, the ear plate 96 is used in cooperation with the pressing rod 93, a driving piece 97 is arranged on the fixed cylinder 7, a gear 98 is arranged on the driving piece 97, the gear 98 is intermeshed with the tooth ring 95, and the length of the gear 98 is greater than the maximum downward movement distance of the tooth ring 95.

[0046] In actual application, when humidity simulation is needed, the gear 98 is rotated by the driving member 97, so that the tooth ring 95 drives the lug plate 96 to rotate until the lug plate 96 stops above the pressure rod 93, at this time, the telescopic member 72 is elongated, so that the lug plate 96 moves downward to press the pressure rod 93, the pressing plate 92 moves downward to press the water in the water storage cavity 91, the water in the water storage cavity 91 is sprayed from the plurality of nozzles 94, the sprayed water is in atomized state, so that the humidity in the air cavity 8 is increased, the humidity can be adjusted by the downward moving distance of the heat exchange plate 71, the more the downward moving distance of the heat exchange plate 71, the more the sprayed water, and the greater the humidity, when temperature simulation test is added with humidity simulation, the actual use environment of the chip can be restored more accurately, so as to further improve the accuracy and reliability of the test result.

[0047] Further, the plurality of nozzles 94 are directed to the inner wall of the air cavity 8.

[0048] In actual application, the water mist sprayed by the nozzle 94 does not directly face the chip, so that the chip is effectively prevented from being damaged by direct water, the sprayed water mist contacts the inner wall of the air cavity 8, and when the water mist is sprayed, the two groups of sealing plates 73 rotate downward, and the pressure in the air cavity 8 is reduced, so that the water mist can be quickly attached in the air flow, so that the humidity distribution in the air cavity 8 is more uniform, so that the humidity simulation is more real, so as to further improve the accuracy and reliability of the test result.

[0049] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, the above embodiments and descriptions in the specification are only to illustrate the principle of the present application, various changes and improvements can be made without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application.

Claims

1. A compact test machine for final testing of memory chips, comprising a test machine body (1), characterized in that, The small test machine also includes: The socket module (2) is installed on the test bench body (1), the socket module (2) includes a protective shell (21) and a socket board card (22), the protective shell (21) covers the socket board card (22), the socket board card (22) leaks from the protective shell (21), and the socket board card (22) is inserted into the chip to be tested; The temperature control assembly (3) includes a guide plate (4), a high-temperature box (5) and a low-temperature box (6), the guide plate (4) is installed on the protective shell (21), the socket board card (22) passes through the top of the guide plate (4), the top of the guide plate (4) is flush with the top of the socket board card (22), and the guide plate (4) is slidably installed on both sides of the guide plate (4). The high-temperature box (5) and the low-temperature box (6) are installed between the two groups of sliding plates (42), the drive module (41) is installed on the guide plate (4), the drive module (41) drives the sliding plate (42) to move, the high-temperature box (5) and the low-temperature box (6) are provided with a plurality of fixed cylinders (7), the heat exchange plates (71) are installed in the fixed cylinders (7), the sizes of the heat exchange plates (71) in the plurality of fixed cylinders (7) are set in a gradient, a plurality of air cavities (8) are formed in the high-temperature box (5) and the low-temperature box (6), the air cavities (8) are located between the fixed cylinders (7) and the guide plate (4), a plurality of hot inlets (51) and a plurality of hot outlets (52) are installed on both sides of the high-temperature box (5), the hot inlets (51) are connected with an external hot air supply unit, and cold inlets (61) and cold outlets (62) are installed on both sides of the low-temperature box (6), the cold inlets (61) are connected with an external cold air supply unit; The volumes of the plurality of air cavities (8) in the high-temperature box (5) are equal, the volumes of the plurality of air cavities (8) in the low-temperature box (6) are equal, and the high-temperature box (5) and the low-temperature box (6) are made of heat insulation material.

2. The compact test handler for final testing of memory chips as recited in claim 1, wherein, The fixed cylinder (7) is symmetrically and elastically rotatably installed with a sealing plate (73), the heat exchange plates (71) and the air cavities (8) are separated when the two groups of sealing plates (73) are combined, and the fixed cylinder (7) is installed with an expansion piece (72), and the output end of the expansion piece (72) is connected with the heat exchange plate (71).

3. The compact test handler for final testing of memory chips as recited in claim 2, wherein, The fixed cylinder (7) is provided with a wet control assembly (9), the wet control assembly (9) comprises a water storage cavity (91), a plurality of water storage cavities (91) are formed in the fixed cylinder (7), water is stored in the water storage cavities (91), a plurality of spray heads (94) are arranged at the bottom edge of the fixed cylinder (7), the spray heads (94) are communicated with the water storage cavities (91), a pressing plate (92) is slidably arranged in the water storage cavity (91), a pressing rod (93) is arranged on the pressing plate (92), the output end of the telescopic member (72) is fixedly provided with a tooth ring (95), an ear plate (96) is arranged on the tooth ring (95), the ear plate (96) is used in cooperation with the pressing rod (93), a driving member (97) is arranged on the fixed cylinder (7), a gear (98) is arranged on the driving member (97), the gear (98) is meshed with the tooth ring (95), and the length of the gear (98) is greater than the maximum downward movement distance of the tooth ring (95).

4. The compact test handler for final testing of memory chips as recited in claim 3, wherein, The plurality of spray heads (94) are directed to the inner wall of the air cavity (8).

5. The compact test handler for final testing of memory chips as recited in claim 1, wherein, The test bench body (1) comprises a base (11), a fixing frame (12), a machine table body (13) and a rotating module (14), the fixing frame (12) is fixed on the base (11), the machine table body (13) is rotatably installed on the fixing frame (12), the rotating module (14) is installed on the fixing frame (12) and drives the machine table body (13) to rotate, and the socket board card (22) is installed on the machine table body (13).

6. The compact test handler for final testing of memory chips as recited in claim 5, wherein, The machine table body (13) is provided with a machine table switch (15) and an emergency stop switch (18).

7. The compact test handler for final testing of memory chips as recited in claim 6, wherein, The machine table body (13) is provided with an interface module (16) and a board card fixing member (19).

8. The compact test handler for final testing of memory chips as recited in claim 7, wherein, The machine table body (13) is provided with a heat dissipation module (17).

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