Directional cleaning method for semiconductor chip
By using a semiconductor chip directional cleaning method, an adjustable nozzle is used to clean the gaps between chips, overcoming the limitations of traditional cleaning technologies in high-precision chip cleaning. This method achieves efficient, uniform, and environmentally friendly cleaning results, improving product qualification rate and production efficiency.
Patent Information
- Application Number
- CN202410548798.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2025-11-07
AI Technical Summary
Existing cleaning technologies struggle to completely remove contaminants from the narrow gaps in semiconductor chips, and traditional methods may be harmful to the environment or damage the chips. They also result in uneven cleaning effects, are time-consuming, and costly.
The semiconductor chip directional cleaning method uses a fluid nozzle that moves along the chip arrangement direction to precisely align and clean the chip gaps. The nozzle has adjustable pressure and angle, making it suitable for chips of different sizes and types. The nozzle is also detachable to adapt to different needs.
It achieves efficient and uniform cleaning of chip gaps, reduces contaminant residue, shortens cleaning time, reduces costs and environmental impact, and improves product qualification rate and production efficiency.
Smart Images
Figure CN120914082A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductors, and in particular to a semiconductor chip pointing cleaning method applied to a conveying device to achieve cleaning operations when chips are transferred from one process to another. BACKGROUND
[0002] In the microelectronic manufacturing process, the cleaning of semiconductor chips is a crucial step. With the advancement of semiconductor technology, especially the continuous reduction of feature sizes of integrated circuits (ICs), the requirement for chip surface cleanliness is increasingly high. Any tiny contaminants can cause performance degradation of the chips, or even product failure. Therefore, developing an effective, reliable and economical cleaning technology is an important research direction for the semiconductor manufacturing industry.
[0003] Traditional cleaning methods, such as wet cleaning, use various chemical solvents and water to clean the chips. Although these methods can effectively remove various impurities on the chips, they usually involve a large amount of chemical solvents, which are harmful to the environment. In addition, when cleaning extremely small chip structures, wet cleaning may not be precise enough to remove all tiny particles and contaminants, leading to chip damage or performance degradation.
[0004] Another cleaning technology is dry cleaning, such as plasma cleaning, which uses active species generated by plasma to remove surface contaminants. This method has less impact on the environment compared to wet cleaning, but it may cause damage to the chip surface and is not sufficient to remove all types of contaminants, especially when the contaminants are firmly attached to the chip surface, the removal effect is limited.
[0005] Another cleaning technology is spin cleaning, which uses centrifugal force to remove liquid or water on the chip. However, the cleaning effect is not uniform in different parts of the chip, especially near the center of the chip, where the centrifugal force is weakened, resulting in poor cleaning effect in this area. In addition, high-speed rotation is required to achieve effective cleaning, which increases the dissipation of the liquid, thereby prolonging the cleaning time and increasing the cost of consumables.
[0006] Therefore, the purpose of the present application is to overcome the above problems and create a semiconductor chip pointing cleaning method that can thoroughly clean every gap between chips, thereby improving cleaning efficiency and reducing environmental impact. This method improves the limitations of traditional cleaning technologies in high-precision chip cleaning and provides a more efficient and comprehensive cleaning solution for the semiconductor manufacturing industry. SUMMARY
[0007] To solve the above problems and achieve the purpose of the present application, the technical means of the present application is realized as follows: a semiconductor chip pointing type cleaning method is used to clean a to-be-cleaned object which is placed on a conveying belt and transported by a jig, the jig has at least one cleaning area, the to-be-cleaned object includes at least one substrate and at least one chip, the to-be-cleaned object is arranged in the cleaning area, and a gap is formed between the chip and the substrate, which includes the following steps: step one: at least two nozzles are arranged to be aligned with the gap of the chip in the cleaning area; step two: the nozzles are synchronously moved along the arrangement direction of the chip to clean the gap; step three: after cleaning the gap of the chip, if there is no adjacent cleaning area, the cleaning is ended, if there is an adjacent cleaning area, the nozzles are synchronously moved to the adjacent cleaning area and are aligned with the gap of the chip in the cleaning area; and step four: steps two and three are repeated until all the gaps of the chips are cleaned; the nozzles in each step are fluid nozzles.
[0008] Further, in the above technical solution, the cleaning times of step two can be one-way cleaning or multiple back-and-forth cleaning.
[0009] Further, in the above technical solution, the pressure of the nozzles is 5-125 kgf / cm 2 .
[0010] Further, in the above technical solution, the nozzles can be adjusted in angle in the direction of the gap; the angle of the nozzles is 20-90 degrees.
[0011] Further, in the above technical solution, the nozzles are detachable for replacement or adjustment.
[0012] Further, in the above technical solution, the chip is positioned on the substrate by using a flux.
[0013] If the above technical solution of the present application is used, compared with the prior art, the following benefits are obtained:
[0014] Firstly, the present application realizes the cleaning operation of the chip during the transfer from one process to another in the semiconductor manufacturing process, accurately and efficiently cleans the narrow gap between the cut chips, improves the work efficiency of the production line and the processing quality of the chip, shortens the cleaning time, reduces the use of chemical cleaning liquid, and reduces the impact on the environment during the manufacturing process.
[0015] Secondly, in the present application, by implementing step two, the nozzle can penetrate into each narrow gap of the chip for cleaning, so that the cleaning liquid can cover every corner of the chip, effectively cleaning the chip gap, thereby improving the cleaning effect. And because the chip gap can be thoroughly cleaned, reducing the residue of pollutants, it helps to improve the product pass rate, so as to improve the product pass rate.
[0016] Thirdly, in the present application, a fluid nozzle is used for cleaning, which can more evenly distribute the cleaning liquid, especially in the narrow gap of the chip, improving the uniformity, depth and quality of cleaning, to reduce the risk of pollutant residue.
[0017] Fourthly, the semiconductor chip pointing type cleaning method of the present application reduces the amount of cleaning liquid and other consumables, thereby achieving the effect of reducing waste and reducing cost.
[0018] Fifthly, the semiconductor chip pointing type cleaning method of the present application is suitable for chips of different sizes and types, so it has high adaptability and can be widely used in various semiconductor manufacturing processes, so as to achieve the effect of strong adaptability. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 is a partial plane schematic diagram of the present application.
[0020] Figure 2 is a flowchart of the present application.
[0021] Figure 3 is a schematic diagram of a single row of chips in the cleaning area of the present application.
[0022] Figure 4 and Figure 5 is a schematic diagram of the implementation action of the single row of chips in the cleaning area of the present application when cleaning.
[0023] Figure 6 is a schematic diagram of the implementation action of the multiple rows of chips in the cleaning area of the present application when cleaning.
[0024] Figure 7 is a schematic diagram of the implementation action of the nozzle angle adjustment of the present application.
[0025] The figures are marked as follows:
[0026] 1 Step one 301 substrate
[0027] 2 Step two 302 chip
[0028] 3 Step three 303 gap
[0029] 4 Step four 40 nozzle
[0030] 10 Conveyor Belts 50 Flux
[0031] 20 Jig 60 Clean area
[0032] 30 Angle of the object to be sprayed Detailed Implementation
[0033] The present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.
[0034] like Figures 1 to 5 As shown in the figure, a method for directional cleaning of semiconductor chips is disclosed for cleaning a workpiece 30 to be sprayed and transported on a conveyor belt 10 by a fixture 20. The fixture 20 has at least one cleaning area 60. The workpiece 30 to be sprayed and cleaned includes at least one substrate 301 and at least one chip 302. The workpiece 30 to be sprayed and cleaned is disposed in the cleaning area 60. A gap 303 is formed between the chip 302 and the substrate 301. The method includes the following steps: Step 1: Set at least two nozzles 40 to be respectively aligned with the gap 303 of the chip 302 in the cleaning area 60. Step 2: The aforementioned nozzle 40 moves synchronously along the arrangement direction of the aforementioned chips 302 to clean the gaps 303; Step 3: After cleaning the gaps 303 of the aforementioned chips 302, if there is no adjacent cleaning area 60, the cleaning ends; if there is an adjacent cleaning area 60, the aforementioned nozzle 40 moves synchronously to the adjacent cleaning area 60 and aligns with the gaps 303 of the chips 302 within this cleaning area 60; and Step 4: Repeat Step 2 and Step 3 until all the gaps 303 of the chips 302 are cleaned; The nozzle 40 in the aforementioned steps is a fluid nozzle.
[0035] By implementing step 2, it can be ensured that the nozzle 40 can penetrate into every narrow gap 303 of the chip 302 for cleaning, allowing the cleaning fluid to cover every corner of the chip 302, thereby effectively cleaning the gaps 303 of the chip 302 and improving the cleaning effect. Furthermore, since the gaps 303 of the chip 302 can be thoroughly cleaned, the residual contaminants are reduced, which helps to improve the product qualification rate and achieve the effect of improving the product qualification rate.
[0036] Secondly, by using a single-fluid nozzle for cleaning via the nozzle 40, the cleaning fluid can be distributed more evenly, especially in the narrow gap 303 of the chip 302, which improves the uniformity, depth and quality of cleaning, thereby reducing the risk of contaminant residue.
[0037] Furthermore, by implementing the steps one 1 to four 4, the overall cleaning work can be completed in a shorter time, not only saving time, but also effectively improving production efficiency, and due to the efficiency and accuracy of the cleaning process, the amount of cleaning fluid and other consumables is reduced, thereby achieving the effect of reducing waste and reducing costs.
[0038] In addition, the semiconductor chip pointing cleaning method is suitable for chips 302 of different sizes and types, and has high adaptability, and can be widely applied to various semiconductor manufacturing processes to achieve the effect of strong adaptability.
[0039] It should be particularly pointed out that the process of the semiconductor chip pointing cleaning method is as follows: first, two spray heads 40 are set to accurately align the gaps 303 of the chips 302 in the cleaning area 60 to ensure that each gap 303 can be effectively cleaned; then, the spray heads 40 move synchronously along the arrangement direction of the chips 302 and uniformly and comprehensively clean the gaps 303 to remove accumulated dust and contaminants; then, after cleaning the gaps 303 of the chips 302 in the cleaning area 60, it is checked whether there is a neighboring cleaning area 60, if not, the cleaning process is ended, if there is, the spray heads 40 will move synchronously to the neighboring cleaning area 60 and align the gaps 303 of the chips 302; finally, steps two 2 and three 3 are repeated until the gaps 303 of the chips 302 in all cleaning areas 60 are thoroughly cleaned.
[0040] In the above, the pressure of the spray head 40 is 5 to 125 kgf / cm 2 . Therefore, within this pressure range, the spray head 40 can generate enough force to remove dirt and residues, and has the effect of efficient cleaning in small gaps or hard-to-reach areas.
[0041] Secondly, the pressure of the spray head 40 can be adjusted according to the degree of contamination of the chip 302 and the type of the chip 302, that is, lower pressure can be used for slight contamination, and pressure can be increased for stubborn contamination, to achieve the effect of being suitable for different degrees of contamination.
[0042] Furthermore, by controlling the pressure not to exceed 125 kgf / cm 2 , it can avoid excessive damage to the chips 302 during the cleaning process, especially when dealing with chips 302 with fragile or delicate structures, to achieve the effect of reducing the risk of damage.
[0043] In addition, appropriate pressure can ensure that the cleaning fluid is uniformly distributed in all gaps 303 of the chips 302, even in narrow or irregular spaces, to improve the uniformity and depth of cleaning.
[0044] In the above, the spray head 40 is detachable, so as to facilitate replacement or adjustment. In this way, the cleaning and maintenance of the spray head 40 become easier, so as to ensure the efficient operation of the spray head 40. In addition, when the spray head 40 fails, the spray head 40 can be replaced individually instead of the entire system, thereby reducing maintenance costs and downtime.
[0045] Secondly, the spray head 40 is detachable, and the operator can quickly replace different types or sizes of spray heads 40 to adapt to different cleaning needs or clean different sizes, shapes or materials of chips 302, so as to achieve the effect of flexible adjustment. Since the spray head 40 can be replaced or adjusted according to needs, the cleaning process can always be carried out in the best state, thereby improving the cleaning effect.
[0046] In the above, the chip 302 is positioned on the substrate 301 with the flux 50.
[0047] Among them, through the application of the flux 50, not only the bonding strength between the chip 302 and the substrate 301 is enhanced, but also the correct position of the chip 302 in the manufacturing process is ensured, so as to improve the assembly accuracy.
[0048] Secondly, the flux 50 has good thermal conductivity, which can effectively and uniformly transfer heat to each welding area when heated, which helps to ensure uniform heat distribution during welding and prevent welding defects caused by uneven heat distribution. In addition, the flux 50 contains chemical components that can react and dissolve the oxides on the surface of the chip 302, so that the generation of residues during welding can be reduced, thereby reducing the need for subsequent cleaning, saving time and resources, and helping to speed up production and improve overall production efficiency.
[0049] As shown in Figure 4 and Figure 5 , the number of cleaning times of step two 2 can be one-way cleaning (see Figure 4 ) or multiple back-and-forth cleaning (see Figure 5 ). In this way, one-way cleaning or multiple back-and-forth cleaning can be selected according to different types of contaminants and specific needs of the chip 302, so as to increase the flexibility of cleaning, for example, for light or general pollution, one-way cleaning may be sufficient, while for more stubborn or severe pollution, multiple back-and-forth cleaning can provide more thorough cleaning.
[0050] In addition, selecting the most suitable number of cleaning times helps to reduce the risk of damage to the chip 302 during cleaning, thereby effectively reducing the possibility of damage to the chip 302.
[0051] As shown in Figure 6As shown, the multiple rows of chips 302 in the cleaning area 60 are synchronously cleaned, and the multiple rows of chips 302 in the cleaning area 60 are simultaneously cleaned by moving the two or more spray heads 40 along the arrangement direction of the multiple rows of chips 302, thereby improving the cleaning efficiency.
[0052] As shown, Figure 7 The spray head 40 can be adjusted at an angle towards the gap 303, and the angle a of the spray head 40 is 20-90 degrees.
[0053] The spray head 40 can be adjusted at an angle towards the gap 303, and the angle a of the spray head 40 is 20-90 degrees.
[0054] The above-described embodiments of the present application are not intended to limit the scope of the present application, and equivalent changes or modifications made according to the principles of the present application should be included in the scope of the present application.
Claims
1. A method of semiconductor chip directed cleaning, characterized by, A method for cleaning a plurality of substrates (301) and a plurality of chips (302) on a plurality of substrates (301) in a plurality of cleaning areas (60) in a plurality of jigs (20) on a conveyor (10) by a plurality of nozzles (40) in a plurality of cleaning steps, wherein each of the plurality of cleaning steps comprises the following steps: Step 1 (1): setting the plurality of nozzles (40) to be aligned with the plurality of gaps (303) between the plurality of chips (302) and the plurality of substrates (301) in the plurality of cleaning areas (60); Step 2 (2): moving the plurality of nozzles (40) along the direction of the plurality of chips (302) to clean the plurality of gaps (303) between the plurality of chips (302) and the plurality of substrates (301); Step 3 (3): after cleaning the plurality of gaps (303) between the plurality of chips (302) and the plurality of substrates (301), if there is no adjacent cleaning area (60), the cleaning is completed, if there is an adjacent cleaning area (60), the plurality of nozzles (40) are moved to the adjacent cleaning area (60) and are aligned with the plurality of gaps (303) between the plurality of chips (302) and the plurality of substrates (301) in the adjacent cleaning area (60); and Step 4 (4): repeating Step 2 (2) and Step 3 (3) until all the plurality of gaps (303) between the plurality of chips (302) and the plurality of substrates (301) are cleaned. The plurality of nozzles (40) in each of the plurality of steps is a fluid nozzle.
2. The method for semiconductor chip directed cleaning of claim 1, wherein: The plurality of cleaning steps in Step 2 (2) can be one-way cleaning or back-and-forth cleaning.
3. The method for semiconductor chip directed cleaning of claim 1, wherein: The pressure of the spray head (40) is 5 to 125 kgf / cm 2 .
4. The method of claim 3, wherein: The plurality of nozzles (40) can be adjusted in angle towards the plurality of gaps (303). The angle (a) of the plurality of nozzles (40) is 20 to 90 degrees.
5. The method for semiconductor chip directed cleaning of claim 4, wherein: The plurality of nozzles (40) are detachable for replacement or adjustment.
6. The method for semiconductor chip directed cleaning of claim 1, wherein: The plurality of chips (302) are positioned on the plurality of substrates (301) by flux (50). The plurality of chips (302) are positioned on the plurality of substrates (301) by flux (50).