An automated eutectic reactor and method for semiconductor chips

Abstract

This invention discloses an automated eutectic crystallizer and method for semiconductor chips, comprising a base, an upper conveying assembly for conveying substrates, a lower conveying assembly for conveying chips, and a first eutectic chamber and a second eutectic chamber for eutectic crystallization of substrates and chips. The upper conveying assembly includes an upper movable frame and an upper placement plate located within the upper movable frame. The upper placement plate has multiple placement holes for placing substrates, and a heat-conducting plate is disposed on the bottom surface of the upper placement plate. The lower conveying assembly includes a lower fixed box and a movable seat located within the lower fixed box. A movable plate is slidably connected to the surface of the movable seat, and a lower placement plate is disposed on the surface of the movable plate. The surface of the lower placement plate has multiple placement slots for placing chips. This invention can simultaneously preheat multiple substrates and chips, maximizing the consistency of preheating temperatures between chips and substrates, greatly reducing temperature fluctuations, and improving subsequent eutectic crystallization results.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to an automatic eutectic reactor and method for semiconductor chips. Background Technology

[0002] In the field of semiconductor packaging, eutectic bonding technology is a key bonding process. It uses various heating methods such as ultrasonic heating, pulse heating, and constant temperature heating to melt and bond the chip with the PCB board or other substrate materials at a specific temperature to form a stable eutectic point, thereby achieving electrical and mechanical connection.

[0003] Currently, to reduce temperature fluctuations between the chip and substrate and improve the quality and stability of the eutectic process, eutectic machines typically preheat both the chip and substrate before eutectic bonding. However, different heat sources are used for preheating; for example, the chip may be preheated using a suction nozzle, while the substrate may be preheated using a heating plate. Because different heat sources and methods are employed, the preheating temperatures of the chip and substrate cannot be guaranteed to be consistent, resulting in temperature fluctuations even after preheating.

[0004] The nozzle preheats the chip during the transfer process. However, the nozzle's structural design makes it impossible to ensure uniform coverage of the chip when it is adsorbed, resulting in slow and uneven chip heating. In addition, the nozzle can only transfer and preheat one chip at a time. This greatly affects the efficiency of high-volume eutectic processes and makes it impossible to achieve efficient operation.

[0005] In conclusion, the current preheating method still has shortcomings and needs to be improved. Summary of the Invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0007] Therefore, the object of the present invention is to provide an automatic eutectic machine for semiconductor chips, including a base, an upper conveying assembly for conveying a substrate, a lower conveying assembly for conveying a chip, and a first eutectic chamber and a second eutectic chamber for eutectic bonding of the substrate and the chip.

[0008] The upper conveying assembly includes an upper movable frame and an upper placement plate located within the upper movable frame. The upper placement plate has multiple placement holes for placing substrates, and a heat-conducting plate is provided on the bottom surface of the upper placement plate.

[0009] The lower conveying assembly includes a lower fixed box and a movable seat located inside the lower fixed box. A movable plate is slidably connected to the surface of the movable seat, and a lower placement plate is provided on the surface of the movable plate. The lower placement plate has multiple placement slots for placing chips.

[0010] The outer walls of the upper movable frame and the lower fixed box are connected by vertical plates. One side of the vertical plate is provided with a telescopic component for driving the heat-conducting plate and the lower placement plate to move in opposite directions.

[0011] Heating plates are provided inside both the first eutectic chamber and the second eutectic chamber. A fixing plate is connected to one side of the heating plate by a crossbar. A second slider is provided on the side of the fixing plate. A second sliding groove is provided on the inner wall of both the first eutectic chamber and the second eutectic chamber for matching the second slider.

[0012] The heating plate uses resistance heating to convert electrical energy into heat energy. The heating temperature can be adjusted by changing the output power. The heating plate can perform preheating or eutectic operation by adjusting the output power. The heating plate uses a drag chain track, so that the heating plate can always be connected to the circuit and perform heating operation during horizontal reciprocating movement.

[0013] The side wall of the upper placement plate is fitted to the inner wall of the upper movable frame, so that the upper placement plate can only move vertically within the upper movable frame. The side wall of the movable seat is fitted to the inner wall of the lower fixed box, so that the movable seat can only move vertically within the fixed box.

[0014] The upper movable frame and the lower fixed box are fixedly connected to the vertical plate, such as by welding or bolting, so that the upper movable frame and the lower fixed box can move synchronously through the vertical plate.

[0015] As a preferred technical solution:

[0016] As described above, in an automated eutectic die set for semiconductor chips, the upper conveying assembly further includes a set of second guide rods. The second guide rods pass through the second protrusions, and the two second protrusions are located on both sides of the upper movable frame and are integrally formed with the upper movable frame.

[0017] The lower conveying assembly also includes a lead screw and a set of first guide rods. The lead screw passes through the first protrusion and is threadedly connected to the first protrusion. The first guide rods pass through the first protrusion. The first protrusion is integrally formed with the bottom surface of the lower fixed box.

[0018] Both sides of the base are vertically fixed with support plates. The lead screw, the first guide rod, and the second guide rod all pass through the first eutectic chamber and the second eutectic chamber. The two ends of the first guide rod and the second guide rod are welded and fixed to the support plate. The two ends of the lead screw pass through the support plate and are movably connected to the bearing of the support plate.

[0019] Through the above technical solution, the two support plates can support the lead screw, the first guide rod and the second guide rod, thereby supporting the upper conveying component and the lower conveying component and ensuring that the upper conveying component and the lower conveying component can move horizontally and reciprocally smoothly.

[0020] As described above, in an automatic eutectic crystallizer for semiconductor chips, an inverted "L"-shaped upright is welded and fixed to the base surface between the first and second eutectic chambers and to both sides of the base. A notch is provided on one side of the top of the upright, and a roller is axially connected to the notch.

[0021] The top surface of the movable seat is provided with a set of T-shaped first sliding grooves. The bottom surface of the movable plate is bolted with a set of first sliders that are adapted to the first sliding grooves. One end of the first slider is connected to the groove wall of the first sliding groove through a first spring. Two symmetrically distributed guide grooves are provided on one side of the movable plate.

[0022] With the above technical solution, the guide groove and the roller are on the same horizontal plane. When the movable plate moves horizontally, the roller is in contact with the guide groove and rolls along the guide groove. Since the guide groove is a sloping structure, the movable plate will be pushed by the roller during the horizontal movement, so the movable plate will be pushed backward.

[0023] As described above, in an automatic eutectic crystallizer for semiconductor chips, the telescopic assembly includes a fixed cylinder and an electromagnet fixed inside the fixed cylinder. An upper movable column and a lower movable column pass through the top and bottom of the fixed cylinder, respectively. A magnet is fixed to one end of each of the upper and lower movable columns. A second spring is sleeved on each of the upper and lower movable columns located inside the fixed cylinder. Both ends of the second spring are fixedly connected to the magnet and the inner wall of the fixed cylinder.

[0024] The side of the magnet block on the upper movable column that faces the electromagnet is an opposite magnetic pole, and the side of the magnet block on the lower movable column that faces the electromagnet is an opposite magnetic pole. The top of the upper movable column is fixedly connected to the bottom surface of the upper placement plate, and the bottom of the lower movable column is fixedly connected to the surface of the movable seat.

[0025] Through the above technical solution, the two fixed cylinders can support the upper placement plate through the upper movable column. The upper and lower movable columns are movable structures on the fixed cylinders. In this way, the upper and lower movable columns can be moved to control the upper placement plate and the movable seat to move closer or further apart, thereby realizing the movement of the heat conduction plate and the lower placement plate.

[0026] As described above, in an automatic eutectic crystallizer for semiconductor chips, a connecting pipe is welded to one side of the fixed cylinder, and the connecting pipe is welded to a hollow vertical plate. A conductive metal head is passed through the back of both vertical plates, and the conductive metal heads on the two vertical plates are set at different heights. The electromagnet is soldered to the conductive metal head via a cable.

[0027] The first eutectic chamber and the second eutectic chamber are provided with an upper conductive strip and a lower conductive strip. One bottom surface of the upper conductive strip and one bottom surface of the lower conductive strip are integrally formed. The height of the upper conductive strip and the lower conductive strip are matched with the height of the two conductive metal heads.

[0028] With the above technical solution, the conductive metal head, the upper conductive strip, and the lower conductive strip are all covered with insulating material, which can reduce the risk of electric shock and improve safety. The conductive metal head is bonded and fixed to the vertical plate by the external insulating material, and the upper and lower conductive strips are fixed to the inner walls of the first and second eutectic chambers by insulating ceramic cylinders.

[0029] In the aforementioned automated eutectic die bonding machine for semiconductor chips, the distance between the lower placement plate and the heat-conducting plate is greater than the thickness of the heating plate, and the lower placement plate, the heat-conducting plate, and the heating plate are all parallel to each other.

[0030] The above technical solution, through the thickness design of the heating plate, ensures that the lower plate and the heat-conducting plate will not rub against the heating plate during horizontal movement, thus ensuring smooth movement.

[0031] An automated eutectic bonding method for semiconductor chips includes the following steps:

[0032] S1. Place the substrate on the upper transport assembly and the chip on the lower transport assembly;

[0033] S2. The upper and lower conveying components move horizontally into the first eutectic chamber. The upper and lower conveying components clamp the heating plate and move together. The heating plate preheats the substrate and chip to a certain temperature.

[0034] S3. The upper and lower conveying components are removed from the first eutectic chamber, and the robot uses a suction cup to pick up the chip and place it on the substrate.

[0035] S4. The upper and lower conveying components move horizontally into the second eutectic chamber. The upper and lower conveying components clamp the heating plate and move together. The heating plate heats the substrate and achieves eutectic bonding between the substrate and the chip.

[0036] S5. After the upper and lower conveyor components are removed from the second eutectic chamber, the eutectic product can be taken out from the upper conveyor component.

[0037] S6. Place the substrate and chip back onto the upper and lower transport components, and drive the upper and lower transport components to move in opposite directions to perform preheating and eutectic operation again.

[0038] Compared with the prior art, the present invention has at least the following beneficial effects:

[0039] (1) Continuous eutectic with homogeneous symmetrical thermal field: The upper and lower plates clamp the workpiece on both sides to establish a homogeneous and symmetrical heating environment. Heat is conducted simultaneously and at equal distances from top to bottom, avoiding the "hot spot-cold edge" effect caused by local heating of the suction nozzle. The follow-up conveyor connects preheating, transfer and eutectic into a single continuous cycle. The residual heat of the previous batch naturally participates in the heating process of the next batch through the reciprocating stroke, forming a stable thermal cycle. As a result, the vertical and in-plane temperature gradients are significantly reduced, suppressing warping, internal stress and thermal shock. On the other hand, the original waiting time is transformed into effective heating time, reducing stagnation oxidation and contamination. The weld joint morphology is fuller, the empty / false weld rate is significantly reduced, and the consistency between pieces and energy efficiency are improved simultaneously, directly addressing the core problems of traditional processes such as "large temperature difference, slow cycle time and quality fluctuation".

[0040] (2) The integrated positioning of adaptive clamping and dynamic power supply, the clamping unit composed of electromagnetic attraction and spring reset can automatically compensate for the clamping force according to the slight difference in workpiece thickness and position, ensuring both close fit and avoiding overpressure damage; the conductive metal head maintains reliable contact with the conductive strip along the stroke, realizing "power supply in motion", so that the clamping action and power supply are not limited by wiring; the lead screw drive and the double guide rods pass through the two chambers to form a rigid transmission circuit, ensuring straightness and repeatability positioning accuracy. The three work together to bring about the overall machine behavior of "stable clamping, accurate placement, and continuous power supply": faster loading / unloading response, significantly reduced picking and placing deviation and hot zone alignment error, while weakening the dependence on air circuit and multi-axis mechanism, reducing maintenance complexity and failure rate, and providing an integrated solution to the pain points of alignment drift, uneven clamping and heavy system maintenance common in mass production lines.

[0041] (3) Multi-station parallel loading and "push-and-yield" coordinated feeding: the upper plate with multiple holes and the lower plate with multiple slots are matched with the full-coverage heating of the flat plate, which can carry and uniformly heat multiple workpieces at one time, avoiding the bottleneck of "heating one piece at a time"; at key stations, the push-and-yield mechanism composed of T-shaped slides, rollers and return springs will automatically move laterally / longitudinally at the moment the robot picks up / the machine vision recognizes, forming a safe working gap, and quickly self-reset after picking up and placing, without interrupting the main cycle. Parallel heating ensures consistent temperature between batches and synchronous solder wetting, and the yielding mechanism eliminates the risk of interference and scratching during picking up and placing, while reducing secondary heat loss caused by repeated moving. The result is a significant increase in throughput per unit time, enhanced consistency between pieces, and more compact equipment space, systematically solving the problems of low efficiency, station congestion and uneven heating of traditional single station. Attached Figure Description

[0042] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0043] Figure 1 This is a perspective view of the present invention;

[0044] Figure 2 This is a perspective view of the lower fixed box and the upper movable frame of the present invention;

[0045] Figure 3 This is a perspective view of the lower placement plate and the upper placement plate of the present invention;

[0046] Figure 4 This is an exploded perspective view of the lower fixed box and the upper movable frame of the present invention;

[0047] Figure 5 This is a perspective view of the lower placement plate, heat-conducting plate, and heating plate of the present invention in a bonded state;

[0048] Figure 6 This is a perspective view of the first eutectic chamber and the heating plate of the present invention;

[0049] Figure 7 This is a cross-sectional view of the inside of the fixed cylinder of the present invention;

[0050] Figure 8 This is a perspective view of the upper and lower conductive strips of the present invention.

[0051] In the diagram: 1. Base; 2. Support plate; 3. Lead screw; 4. First guide rod; 5. Second guide rod; 6. Lower fixed box; 7. First protrusion; 8. Movable seat; 9. First sliding groove; 10. Movable plate; 11. Guide groove; 12. First slider; 13. Lower placement plate; 14. Placement groove; 15. Upper movable frame; 16. Upper placement plate; 17. Placement hole; 18. Heat-conducting plate; 19. Second protrusion; 20. Upright post; 21. Roller; 22. Fixed cylinder; 23. Vertical plate; 24. Connecting pipe; 25. Electromagnet; 26. Magnet block; 27. Upper movable column; 28. Lower movable column; 29. ​​Conductive metal head; 30. Upper conductive strip; 31. Lower conductive strip; 32. First eutectic chamber; 33. Second eutectic chamber; 34. Heating plate; 35. Crossbar; 36. Fixed plate; 37. Second slider; 38. Second sliding groove. Detailed Implementation

[0052] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0053] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0054] like Figures 1-6As shown in the figure, an embodiment of the present invention discloses an automatic eutectic machine for semiconductor chips, including a base 1, an upper conveying assembly for conveying a substrate, a lower conveying assembly for conveying a chip, and a first eutectic chamber 32 and a second eutectic chamber 33 for eutectic bonding of the substrate and the chip.

[0055] The upper conveying assembly includes an upper movable frame 15 and an upper placement plate 16 located within the upper movable frame 15. The upper placement plate 16 has multiple placement holes 17 for placing substrates, and a heat-conducting plate 18 is provided on the bottom surface of the upper placement plate 16.

[0056] The lower conveying assembly includes a lower fixed box 6 and a movable seat 8 located inside the lower fixed box 6. A movable plate 10 is slidably connected to the surface of the movable seat 8. A lower placement plate 13 is provided on the surface of the movable plate 10. A plurality of placement slots 14 for placing chips are opened on the surface of the lower placement plate 13.

[0057] The outer walls of the upper movable frame 15 and the lower fixed box 6 are connected by vertical plates 23. A telescopic component is provided on one side of the vertical plate 23 to drive the heat-conducting plate 18 and the lower placement plate 13 to move towards each other.

[0058] Heating plates 34 are provided inside the first eutectic chamber 32 and the second eutectic chamber 33. A fixing plate 36 is connected to one side of the heating plate 34 via a crossbar 35. A second slider 37 is provided on the side of the fixing plate 36. A second sliding groove 38 for matching the second slider 37 is provided on the inner wall of the first eutectic chamber 32 and the second eutectic chamber 33.

[0059] Specifically, during operation, multiple substrates are placed in the placement holes 17 on the upper placement plate 16, with the bottom surface of the substrates contacting the heat-conducting plate 18. Simultaneously, multiple chips are placed in the placement slots 14 on the lower placement plate 13. The upper and lower transport components can move horizontally, allowing for the transfer of substrates and chips. When the upper and lower transport components move into the first eutectic chamber 32, and the heating plate 34 is located between the heat-conducting plate 18 and the lower placement plate 13, the heat-conducting plate 18 and the lower placement plate 13 move closer together under the action of the telescopic component, clamping the heating plate 34. At this time, the chip surface on the lower placement plate 13 will be in contact with the bottom surface of the heating plate 34, allowing the heating plate 34 to directly preheat the chips. Meanwhile, the heat-conducting plate 18 is made of metal and is fixed to the upper placement plate 16 by bolts or other means, so the heating plate 34 can indirectly preheat the substrate through the heat-conducting plate 18.

[0060] The fixed plate 36 can move horizontally along the second sliding groove 38 via the second slider 37, so that the heating plate 34 can move horizontally synchronously with the fixed plate 36 via the crossbar 35. While holding the heating plate 34, the heat-conducting plate 18 and the lower placement plate 13 can drive the heating plate 34 to move horizontally a certain distance synchronously, thus achieving preheating while transferring.

[0061] After preheating, the upper and lower conveying components move out of the first eutectic chamber 32. A robotic arm is positioned between the first and second eutectic chambers 32 and 33. The robotic arm is equipped with a vacuum chuck, which can pick up the chip and place it on the substrate. Then, the upper and lower conveying components continue to move into the second eutectic chamber 33 and clamp the heating plate 34 in the second eutectic chamber 33 again. At this time, the heating plate 34 can heat the substrate through the heat-conducting plate 18 and complete the eutectic process between the substrate and the chip.

[0062] After the eutectic process is completed, the upper and lower conveying components are removed from the second eutectic chamber 33. At this time, the product after the eutectic process can be taken out from the upper placement plate 16, and multiple substrates can be placed in the placement holes 17 on the upper placement plate 16 again, and multiple chips can be placed in the placement slots 14 on the lower placement plate 13.

[0063] The upper and lower conveying components move in opposite directions and re-enter the second eutectic chamber 33. At this time, the heating plate 34 in the second eutectic chamber 33 still has residual heat. The heating plate 34 can preheat the chip and substrate by using the residual heat, thereby achieving efficient utilization of heat energy, avoiding heat waste, and saving energy.

[0064] After preheating, the upper and lower conveying components are removed from the second eutectic chamber 33. The robotic arm uses a vacuum suction cup to pick up the chip and place it on the substrate. Then, the upper and lower conveying components move to the first eutectic chamber 32. The heat-conducting plate 18 and the lower placement plate 13 can hold the heating plate 34. The heating plate 34 can heat the substrate through the heat-conducting plate 18 and complete the eutectic process between the substrate and the chip.

[0065] After eutectic bonding is completed, the upper and lower conveying components are removed from the first eutectic chamber 32. The product after eutectic bonding can be taken out from the upper placement plate 16 and the substrate and chip can be placed again. In this way, continuous preheating and eutectic bonding operations can be achieved by the horizontal reciprocating movement of the upper and lower conveying components.

[0066] In one specific embodiment of the present invention, the upper conveying assembly further includes a set of second guide rods 5, the second guide rods 5 passing through the second protrusions 19, and the two second protrusions 19 are respectively located on both sides of the upper movable frame 15 and integrally formed with the upper movable frame 15.

[0067] The lower conveying assembly also includes a lead screw 3 and a set of first guide rods 4. The lead screw 3 passes through the first protrusion 7 and is threadedly connected to the first protrusion 7. The first guide rods 4 pass through the first protrusion 7. The first protrusion 7 is integrally formed with the bottom surface of the lower fixed box 6.

[0068] Support plates 2 are vertically fixed on both sides of the base 1. The lead screw 3, the first guide rod 4, and the second guide rod 5 all pass through the first eutectic chamber 32 and the second eutectic chamber 33. The two ends of the first guide rod 4 and the second guide rod 5 are welded and fixed to the support plate 2. The two ends of the lead screw 3 pass through the support plate 2 and are movably connected to the bearing of the support plate 2.

[0069] Specifically, such as Figure 2 and Figure 5 As shown, a servo motor is fixed on the support plate 2. The servo motor can drive the lead screw 3 to rotate forward and backward on the support plate 2. When the lead screw 3 rotates, the lead screw 3 can drive the first protrusion 7 to move horizontally along a set of first guide rods 4. The first protrusion 7 can drive the lower fixed box 6 to move synchronously. The lower fixed box 6 can drive the lower placement plate 13 to move synchronously through the movable seat 8 and the movable plate 10, thereby realizing the chip transfer operation.

[0070] When the lower fixed box 6 moves, the upper movable frame 15 can be moved by the vertical plate 23. The upper movable frame 15 then moves the upper placement plate 16, thereby realizing the transfer of the substrate. When the upper movable frame 15 moves, it can slide along a set of second guide rods 5 by the second protrusion 19, thereby ensuring the movement accuracy of the upper movable frame 15.

[0071] By rotating the lead screw 3 in both directions, the lower placement plate 13 and the lower fixed box 6 can be moved horizontally and reciprocally, thereby enabling continuous operation.

[0072] In one specific embodiment of the present invention, an inverted "L"-shaped upright rod 20 is welded and fixed to the surface of the base 1 between the first eutectic chamber 32 and the second eutectic chamber 33, as well as to both sides of the base 1. A notch is opened on one side of the top of the upright rod 20, and a roller 21 is axially connected inside the notch.

[0073] The top surface of the movable seat 8 is provided with a set of T-shaped first sliding grooves 9. The bottom surface of the movable plate 10 is bolted with a set of first sliders 12 that are adapted to the first sliding grooves 9. One end of the first slider 12 is connected to the groove wall of the first sliding groove 9 through a first spring. Two symmetrically distributed guide grooves 11 are provided on one side of the movable plate 10.

[0074] Specifically, such as Figure 1 , Figure 2 and Figure 4As shown, during the horizontal movement of the lower fixed box 6 driven by the movable seat 8 to move the movable plate 10, when it moves to the roller 21, the roller 21 will contact the guide groove 11 and roll along the inclined surface of the guide groove 11. Since the position of the roller 21 is fixed, as the movable plate 10 moves horizontally, the movable plate 10 will gradually be subjected to a longitudinal thrust. Then the movable plate 10 moves longitudinally along the first sliding groove 9 through the first slider 12. When the movable plate 10 moves to both sides of the base 1, the movable plate 10 will be pushed out, and the lower placement plate 13 will move synchronously. In this way, the lower placement plate 13 will not be blocked by the upper placement plate 16 after it moves, which makes it easier to place the chip on the lower placement plate 13.

[0075] When the movable plate 10 moves between the first eutectic chamber 32 and the second eutectic chamber 33, the movable plate 10 will also be pushed out, which will facilitate the robot arm to adsorb the chip on the lower placement plate 13 through the vacuum suction cup.

[0076] When the first slider 12 moves along the first sliding groove 9, it will compress the first spring. When the roller 21 moves out of the guide groove 11, under the elastic force of the first spring, the first slider 12 moves in the opposite direction in the first sliding groove 9 and drives the movable plate 10 to reset.

[0077] In one specific embodiment of the present invention, the telescopic component includes a fixed cylinder 22 and an electromagnet 25 fixed inside the fixed cylinder 22. An upper movable column 27 and a lower movable column 28 pass through the top and bottom ends of the fixed cylinder 22, respectively. A magnet block 26 is fixed to one end of the upper movable column 27 and the lower movable column 28, respectively. A second spring is sleeved on the upper movable column 27 and the lower movable column 28 inside the fixed cylinder 22. Both ends of the second spring are fixedly connected to the magnet block 26 and the inner wall of the fixed cylinder 22.

[0078] The side of the magnet 26 on the upper movable column 27 that is opposite to the electromagnet 25 is a different magnetic pole. The side of the magnet 26 on the lower movable column 28 that is opposite to the electromagnet 25 is a different magnetic pole. The top of the upper movable column 27 is connected to the bottom surface of the upper placement plate 16, and the bottom of the lower movable column 28 is connected to the surface of the movable seat 8.

[0079] A connecting pipe 24 is welded to one side of the fixed cylinder 22. The connecting pipe 24 is welded to the hollow vertical plate 23. A conductive metal head 29 is passed through the back of both vertical plates 23. The conductive metal heads 29 on the two vertical plates 23 are set at different heights. The electromagnet 25 is soldered to the conductive metal head 29 through a cable.

[0080] An upper conductive strip 30 and a lower conductive strip 31 are provided in the first eutectic chamber 32 and the second eutectic chamber 33. One bottom surface of the upper conductive strip 30 and one bottom surface of the lower conductive strip 31 are integrally formed. The height of the upper conductive strip 30 and the lower conductive strip 31 matches the height of the two conductive metal heads 29.

[0081] The distance between the lower placement plate 13 and the heat-conducting plate 18 is greater than the thickness of the heating plate 34, and the lower placement plate 13, the heat-conducting plate 18 and the heating plate 34 are all parallel to each other.

[0082] Specifically, such as Figures 4-8 As shown, when the upper and lower conveying components move into the first eutectic chamber 32 or the second eutectic chamber 33, the two conductive metal heads 29, one high and one low, will contact the upper conductive strip 30 and the lower conductive strip 31 respectively. The upper conductive strip 30 and the lower conductive strip 31 are connected to the power grid through wires, thereby energizing the electromagnets 25 in the two fixed cylinders 22 and generating magnetism, which in turn generates attraction with the two magnet blocks 26. The magnet blocks 26 are attracted to move by the attraction, and the upper movable column 27 and the lower movable column 28 move synchronously with the magnet blocks 26 and compress the second spring. When the upper movable column 27 and the lower movable column 28 move, they will cause the upper placement plate 16 and the movable seat 8 to move closer to each other. The upper placement plate 16 moves vertically downward within the upper movable frame 15. The upper placement plate 16 can drive the heat conduction plate 18 to move synchronously. The movable seat 8 moves vertically upward within the lower fixed box 6 and drives the lower placement plate 13 to move synchronously through the movable plate 10. In this way, the heat conduction plate 18 and the lower placement plate 13 can clamp the heating plate 34. The heating plate 34 can preheat the chip and the substrate, or perform eutectic operation on the chip and the substrate.

[0083] Since the upper conductive strip 30 and the lower conductive strip 31 have a certain length, the electromagnet 25 can work continuously for a period of time when the upper and lower conveying components move horizontally in the first eutectic chamber 32 or the second eutectic chamber 33. When the two conductive metal heads 29 are separated from the upper conductive strip 30 and the lower conductive strip 31, the electromagnet 25 is de-energized and loses its magnetism. The second spring can drive the upper movable column 27 or the lower movable column 28 to reset through the magnet block 26. In this way, the upper movable column 27 and the lower movable column 28 can drive the upper placement plate 16 and the movable seat 8 to reset. The heat-conducting plate 18 and the lower placement plate 13 reset synchronously and separate from the heating plate 34.

[0084] In the description of this specification, terms such as "connection," "installation," and "fixation" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meanings of the above terms within this invention based on the specific circumstances.

[0085] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0086] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An automatic eutectic machine for semiconductor chips, comprising a base (1), an upper conveying assembly for conveying a substrate, a lower conveying assembly for conveying a chip, and a first eutectic chamber (32) and a second eutectic chamber (33) for eutectic bonding of the substrate and the chip. Its features are: The upper conveying assembly includes an upper movable frame (15) and an upper placement plate (16) located inside the upper movable frame (15). The upper placement plate (16) has a plurality of placement holes (17) for placing substrates, and a heat-conducting plate (18) is provided on the bottom surface of the upper placement plate (16). The lower conveying assembly includes a lower fixed box (6) and a movable seat (8) located inside the lower fixed box (6). A movable plate (10) is slidably connected to the surface of the movable seat (8). A lower placement plate (13) is provided on the surface of the movable plate (10). A plurality of placement slots (14) for placing chips are opened on the surface of the lower placement plate (13). The upper movable frame (15) and the lower fixed box (6) are connected on both sides by a vertical plate (23). A telescopic assembly for driving the heat-conducting plate (18) and the lower placement plate (13) to move in opposite directions is provided on one side of the vertical plate (23). Heating plates (34) are provided inside the first eutectic chamber (32) and the second eutectic chamber (33). A fixing plate (36) is connected to one side of the heating plate (34) via a crossbar (35). A second slider (37) is provided on the side of the fixing plate (36). A second sliding groove (38) for matching the second slider (37) is provided on the inner wall of the first eutectic chamber (32) and the second eutectic chamber (33).

2. The automatic eutectic reactor for semiconductor chips according to claim 1, characterized in that: The upper conveying assembly also includes a set of second guide rods (5), which pass through the second protrusions (19). The two second protrusions (19) are located on both sides of the upper movable frame (15) and are integrally formed with the upper movable frame (15).

3. The automatic eutectic reactor for semiconductor chips according to claim 1, characterized in that: The lower conveying assembly also includes a lead screw (3) and a set of first guide rods (4). The lead screw (3) passes through the first protrusion (7) and is threadedly connected to the first protrusion (7). The first guide rods (4) pass through the first protrusion (7). The first protrusion (7) is integrally formed with the bottom surface of the lower fixing box (6).

4. The automatic eutectic reactor for semiconductor chips according to claim 3, characterized in that: The base (1) has support plates (2) fixed vertically on both sides. The lead screw (3), the first guide rod (4), and the second guide rod (5) all pass through the first eutectic chamber (32) and the second eutectic chamber (33). The first guide rod (4) and the second guide rod (5) are welded and fixed to the support plate (2) at both ends. The lead screw (3) passes through the support plate (2) at both ends and is movably connected to the bearing of the support plate (2).

5. The automatic eutectic reactor for semiconductor chips according to claim 1, characterized in that: An inverted "L"-shaped upright rod (20) is welded and fixed on the surface of the base (1) between the first eutectic chamber (32) and the second eutectic chamber (33) and on both sides of the base (1). A notch is opened on one side of the top of the upright rod (20), and a roller (21) is connected to the notch.

6. The automatic eutectic reactor for semiconductor chips according to claim 1, characterized in that: The top surface of the movable seat (8) is provided with a set of T-shaped first sliding grooves (9), and the bottom surface of the movable plate (10) is bolted with a set of first sliders (12) that are adapted to the first sliding grooves (9). One end of the first slider (12) is connected to the groove wall of the first sliding groove (9) through a first spring. Two symmetrically distributed guide grooves (11) are provided on one side of the movable plate (10).

7. The automatic eutectic reactor for semiconductor chips according to claim 1, characterized in that: The telescopic assembly includes a fixed cylinder (22) and an electromagnet (25) fixed inside the fixed cylinder (22). An upper movable column (27) and a lower movable column (28) pass through the top and bottom of the fixed cylinder (22), respectively. A magnet (26) is fixed to one end of each of the upper movable column (27) and the lower movable column (28). A second spring is sleeved on each of the upper movable column (27) and the lower movable column (28) inside the fixed cylinder (22). The two ends of the second spring are fixedly connected to the magnet (26) and the inner wall of the fixed cylinder (22). The side of the magnet block (26) on the upper movable column (27) opposite to the electromagnet (25) is a different magnetic pole, the side of the magnet block (26) on the lower movable column (28) opposite to the electromagnet (25) is a different magnetic pole, the top of the upper movable column (27) is fixedly connected to the bottom surface of the upper placement plate (16), and the bottom of the lower movable column (28) is fixedly connected to the surface of the movable seat (8).

8. The automatic eutectic reactor for semiconductor chips according to claim 7, characterized in that: A connecting pipe (24) is welded to one side of the fixed cylinder (22). The connecting pipe (24) is welded to a hollow vertical plate (23). A conductive metal head (29) is passed through the back of each of the two vertical plates (23). The conductive metal heads (29) on the two vertical plates (23) are set at different heights. The electromagnet (25) is soldered to the conductive metal head (29) via a cable. The first eutectic chamber (32) and the second eutectic chamber (33) are provided with an upper conductive strip (30) and a lower conductive strip (31). The bottom surface of one side of the upper conductive strip (30) and the bottom surface of one side of the lower conductive strip (31) are integrally formed. The height of the upper conductive strip (30) and the lower conductive strip (31) matches the height of the two conductive metal heads (29).

9. The automatic eutectic reactor for semiconductor chips according to claim 1, characterized in that: The distance between the lower placement plate (13) and the heat-conducting plate (18) is greater than the thickness of the heating plate (34), and the lower placement plate (13), the heat-conducting plate (18) and the heating plate (34) are all parallel to each other.

10. A method for implementing an automated eutectic reactor for semiconductor chips as described in any one of claims 1-9, characterized in that: Includes the following steps, S1. Place the substrate on the upper transport assembly and the chip on the lower transport assembly; S2. The upper conveying component and the lower conveying component move horizontally into the first eutectic chamber (32). The upper conveying component and the lower conveying component clamp the heating plate (34) and move together. The heating plate (34) preheats the substrate and the chip to a certain temperature. S3, the upper conveying component and the lower conveying component are removed from the first eutectic chamber (32), and the robot arm picks up the chip by suction cup and places the chip on the substrate; S4. The upper conveying component and the lower conveying component move horizontally into the second eutectic chamber (33). The upper conveying component and the lower conveying component clamp the heating plate (34) and move together. The heating plate (34) heats the substrate and realizes the eutectic between the substrate and the chip. S5. After the upper and lower conveying components are removed from the second eutectic chamber (33), the eutectic product can be taken out from the upper conveying component. S6. Place the substrate and chip back onto the upper and lower conveyor components, and drive the upper and lower conveyor components to move in opposite directions to perform preheating and eutectic processes again.

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