Wafer gluing device

Abstract

The invention provides a wafer gluing device, relates to the technical field of semiconductor equipment, and aims to solve the technical problems that after a wafer is glued and washed by a wafer gluing device in the prior art, cleaning liquid is easy to cause wafer pollution, and the wafer yield is reduced. The wafer gluing device comprises a bearing table, a collecting cup and an adsorption structure; the bearing table is used for bearing wafers, the collecting cup is annularly arranged on the bearing table, and a gap is formed between the bearing table and the collecting cup; the adsorption structure is annularly arranged on the side wall, facing the bearing table, of the collection cup, and the adsorption structure is opposite to the bearing table; the adsorption structure is configured to absorb energy and / or adsorb liquid sputtered to the surface of the adsorption structure. According to the wafer gluing device provided by the invention, the risk of wafer pollution can be reduced, and the wafer yield is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a wafer coating apparatus. Background Technology

[0002] In the semiconductor device manufacturing process, the photoresist coating process often adopts the spin coating method. Specifically, the wafer is placed in a coating device, the coating device drips a certain amount of photoresist onto the wafer, and at the same time rotates the loading disk that carries the wafer, so that the photoresist is coated onto the wafer by the centrifugal force generated by the high-speed rotation.

[0003] During the photoresist coating process, the photoresist flows to the edge and back of the wafer under centrifugal force, forming an edge ring on the edge and back of the wafer. This ring exists above and below the wafer edge and is prone to peeling, affecting the pattern of the working area on the wafer and causing contamination. It is necessary to clean the excess photoresist at the edge in a timely manner.

[0004] Therefore, coating equipment typically uses a rinsing nozzle positioned at the wafer location to rinse the wafer edges with cleaning fluid, and a rinsing nozzle on the back side of the wafer to rinse the back edge with cleaning fluid. However, after coating and rinsing using the above-mentioned wafer coating equipment, the cleaning fluid can easily cause wafer contamination, reducing wafer yield. Summary of the Invention

[0005] In view of the above problems, this application provides a wafer coating apparatus that can reduce the risk of wafer contamination and improve wafer yield.

[0006] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0007] This application provides a wafer coating apparatus for coating a wafer with an adhesive layer. The wafer coating apparatus includes a support stage, a collection cup, and an adsorption structure. The support stage supports the wafer. The collection cup is arranged around the support stage along its circumference, with a gap between them. The adsorption structure is arranged around the side wall of the collection cup facing the support stage, and the adsorption structure is opposite to the support stage. The adsorption structure is configured to absorb energy and / or adsorb liquid sputtered onto the surface of the buffer layer.

[0008] In one alternative embodiment, the adsorption structure includes a buffer layer and / or an adsorption layer; the buffer layer is disposed toward the support platform and is capable of absorbing energy from liquid splashed onto its surface; the adsorption layer is disposed on the side of the buffer layer facing the sidewall of the collection cup and covers the buffer layer; the adsorption layer is capable of adsorbing liquid splashed onto its surface.

[0009] In one alternative embodiment, the absorbent layer is configured to be made of at least one of polypropylene and silica wool; and / or the buffer layer is configured to be made of a nonwoven fabric.

[0010] In an optional embodiment, the adsorption structure further includes an adhesive layer; the adhesive layer is disposed on the side of the adsorption layer facing the sidewall of the collection cup and covers the adsorption layer.

[0011] In one optional embodiment, the adhesive layer includes a first adhesive layer and a second adhesive layer stacked together; the first adhesive layer is configured as a hydrophobic and oleophobic material layer and is bonded to the adsorption layer; the second adhesive layer is configured as a sensitive adhesive tape and is bonded to the sidewall of the collection cup.

[0012] In one alternative embodiment, the support stage is configured as a disk; along the radial direction of the support stage, the adsorption structure, relative to the projection of the support stage, covers at least the upper and lower portions of the wafer.

[0013] In one optional embodiment, the collecting cup includes a flow guide section and a straight section connected to the flow guide section; the junction of the straight section and the flow guide section is located above the wafer; a first side of the adsorption structure is attached to the sidewall of the flow guide section and located below the support stage; a second side of the adsorption structure extends to the sidewall of the straight section.

[0014] In one alternative embodiment, the adsorption structure covers the entire sidewall of the guide section and at least a portion of the sidewall of the straight section.

[0015] In one alternative embodiment, the wafer coating apparatus further includes an air supply assembly; the air supply assembly includes an air outlet opposite to the sidewall of the straight section, and at least a portion of the gas discharged from the air outlet flows to the sidewall of the guide section.

[0016] In one alternative embodiment, the adsorption structure has a plurality of dot-shaped protrusions and / or depressions; the plurality of dot-shaped protrusions and / or depressions are arranged in an array on the surface of the adsorption structure opposite to the sidewall of the collection cup.

[0017] Compared with related technologies, the wafer coating apparatus provided in this application has the following advantages:

[0018] The wafer coating apparatus provided in this application embodiment has an adsorption structure set in the area opposite to the collection cup and the support stage. The adsorption structure can absorb energy and buffer and / or adsorb the cleaning liquid sputtered onto the side wall of the collection cup, so that the cleaning liquid flows along the side wall of the collection cup, effectively reducing the risk of cleaning liquid sputtering onto the wafer surface through the side wall of the collection cup, thereby reducing the risk of wafer contamination and improving wafer yield.

[0019] In the related technology, during the process of rinsing the wafer with cleaning fluid, the centrifugal force of the loading tray is large due to the high rotation speed of the loading tray. After the cleaning fluid is thrown off at high speed and hits the side wall of the collection cup, the kinetic energy of the splashed cleaning fluid is large, and some of the cleaning fluid splashes back onto the surface of the wafer, which can easily cause wafer contamination.

[0020] However, in this embodiment, by providing an adsorption structure on the side wall of the collection cup, the high-speed cleaning fluid splashed onto the side wall of the collection cup can absorb energy, buffer and / or adsorb, effectively reducing the phenomenon of cleaning fluid splashing back onto the wafer surface, thereby reducing the risk of wafer contamination and improving wafer yield.

[0021] In addition to the technical problems solved by the embodiments of this disclosure, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the wafer coating apparatus provided by the embodiments of this disclosure, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the wafer coating apparatus provided in the embodiments of this application;

[0024] Figure 2 This is a schematic diagram of the arrangement of the adsorption structure on the collection cup provided in the embodiments of this application;

[0025] Figure 3 This is a schematic diagram of the adsorption structure provided in the embodiments of this application;

[0026] Figure 4 This is a schematic diagram of the adhesive layer structure provided in an embodiment of this application;

[0027] Figure 5 This is a schematic diagram of the arrangement of the air supply assembly provided in an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10 - Support platform;

[0030] 20-Wafer;

[0031] 30 - Photoresist layer;

[0032] 40 - Collection Cup;

[0033] 41 - Straight section; 42 - Guide section;

[0034] 50-Adsorption structure;

[0035] 51-Buffer layer; 52-Absorbent layer;

[0036] 53 - Paste layer;

[0037] 531 - First adhesive layer; 532 - Second adhesive layer;

[0038] 60-nozzle;

[0039] 70 - Air supply assembly;

[0040] 100-Wafer coating device. Detailed Implementation

[0041] In related technologies, wafer coating devices have a technical problem where the cleaning solution can easily cause wafer contamination after coating and rinsing the wafer, thus reducing wafer yield. The inventors have found that the reason for this problem is that during the rinsing process of the wafer with the cleaning solution, the cleaning solution that is thrown off at high speed hits the side wall of the collection cup and splashes out with a large kinetic energy. Some of the cleaning solution splashes back onto the surface of the wafer, which can easily cause wafer contamination.

[0042] To address the aforementioned technical problems, this application provides a wafer coating apparatus. By setting an adsorption structure in the area opposite the collection cup and the support stage, the adsorption structure includes a buffer layer. The buffer layer absorbs the kinetic energy of the cleaning liquid splashed onto the side wall of the collection cup, causing the cleaning liquid to flow along the side wall of the collection cup. This effectively reduces the risk of cleaning liquid splashing onto the wafer surface via the side wall of the collection cup, thereby reducing the risk of wafer contamination and improving wafer yield.

[0043] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0044] like Figure 1 and Figure 2As shown, the wafer coating apparatus 100 provided in this embodiment is used to coat a wafer with a photoresist layer, typically a photoresist layer 30. The wafer coating apparatus 100 includes a support stage 10, a collection cup 40, an adsorption structure 50, and a cleaning structure. The support stage 10 is disk-shaped and supports the wafer 20 to be coated, rotating it to achieve uniform coating. For example, the support stage 10 is rotatable and includes a vacuum adsorption disk that can adsorb the wafer 20.

[0045] Furthermore, during the process of coating the photoresist layer 30, the photoresist flows to the edge and back of the wafer 20 under the action of centrifugal force, thereby forming an edge ring on the edge and back of the wafer 20. It exists above and below the edge of the wafer and is prone to peeling, affecting the pattern of the working area on the wafer and causing contamination. It is necessary to clean the excess photoresist at the edge in a timely manner.

[0046] The cleaning structure includes multiple nozzles 60. Some nozzles are positioned below the wafer 20 to rinse the photoresist on the back side of the wafer using a spray cleaning solution; other nozzles 60 are positioned above the wafer 20 to rinse excess photoresist at the wafer edges using a spray cleaning solution. During the cleaning process, as the stage 10 rotates at high speed, the cleaning solution splashes around the wafer 20 as it rinses the front and back edges.

[0047] In this embodiment, a collection cup 40 is arranged around the support stage 10 along its circumference, with a radial gap between them to avoid interference between the collection cup 40 and the support stage 10, thus ensuring that the support stage 10 can rotate. During the spin coating of photoresist on the wafer 20, under the action of centrifugal force, some photoresist is thrown off the edge of the wafer 20, and the part of the thrown-off photoresist is collected by the collection cup 40 and further guided to the waste liquid collection device through the collection cup 40.

[0048] Furthermore, when rinsing and removing excess photoresist from the front and back edges of the wafer 20, the cleaning solution is splashed onto the sidewall of the collection cup 40 and collected by the collection cup 40 as the stage 10 rotates at high speed and the cleaning solution rinses the front and back edges of the wafer 20.

[0049] For example, along a direction perpendicular to the stage 10, a portion of the collection cup 40 protrudes from the stage 10 to accommodate the wafer 20 within the cup of the collection cup 40, so that the ejected photoresist and sputtered cleaning solution are collected within the collection cup 40. In other words, at least a portion of the collection cup 40 is opposite to the stage 10 and has an overlapping area.

[0050] An adsorption structure 50 is annularly disposed on the sidewall of the collection cup 40 facing the support stage 10, and the adsorption structure 50 is opposite to the support stage 10. The adsorption structure 50 is configured to absorb energy and / or adsorb liquid splashed onto its surface. Exemplarily, along the radial direction of the support stage 10, the projection of the adsorption structure 50 relative to the support stage 10 can cover the area above and below the wafer 20; that is, the adsorption structure 50 not only covers the wafer 20, but also covers a certain range of space above and below the wafer 20. This configuration ensures that the adsorption structure 50 and the splashed area formed by the cleaning liquid splashing onto the sidewall of the collection cup 40 have overlapping areas.

[0051] In the related technology, during the process of rinsing the wafer with cleaning fluid, the centrifugal force of the loading tray is large due to the high rotation speed of the loading tray. After the cleaning fluid is thrown off at high speed and hits the side wall of the collection cup, the kinetic energy of the splashed cleaning fluid is large, and some of the cleaning fluid splashes back onto the surface of the wafer, which can easily cause wafer contamination.

[0052] However, in this embodiment, by providing an adsorption structure 50 on the side wall of the collection cup, the high-speed cleaning liquid splashed onto the side wall of the collection cup 40 can be buffered and / or adsorbed, effectively reducing the phenomenon of cleaning liquid splashing back onto the surface of the wafer 20, thereby reducing the risk of wafer contamination and improving wafer yield.

[0053] like Figure 3 As shown, the adsorption structure 50 provided in this embodiment includes a buffer layer 51. The buffer layer 51 is configured to absorb at least the kinetic energy of the liquid splashed onto it, that is, the buffer layer 51 can absorb the kinetic energy of the cleaning fluid splashed onto it. For example, the buffer layer 51 is configured to be made of non-woven fabric, which is soft and can absorb energy from the cleaning fluid splashed onto it, thus having a good buffering effect.

[0054] With this configuration, when the cleaning fluid splashes onto the surface of the adsorption structure 50, the kinetic energy of the cleaning fluid is adsorbed by the buffer layer 51, which reduces the kinetic energy of the cleaning fluid splashed onto the side wall surface of the collection cup 40, so that the cleaning fluid flows along the side wall of the collection cup 40, effectively reducing the risk of the cleaning fluid splashing back onto the surface of the wafer 20 through the side wall of the collection cup 40, thereby reducing the risk of wafer 20 contamination and further improving the yield of the wafer 20.

[0055] And / or, the adsorption structure 50 provided in this application embodiment further includes an adsorption layer 52, which is stacked with a buffer layer 51 and covers the buffer layer 51. The adsorption layer 52 is disposed on the side wall of the buffer layer 51 facing the collection cup 40.

[0056] In other words, the adsorption layer 52 is located on the side of the buffer layer 51 away from the support stage 10. The adsorption layer 52 can adsorb the cleaning solution sputtered onto the buffer layer 51, which can further effectively reduce the phenomenon of cleaning solution splashing back onto the surface of the wafer 20, thereby reducing the risk of wafer contamination and further improving wafer yield.

[0057] Furthermore, the adsorption layer 52 can be made of a material with good adsorption properties for liquids, including but not limited to polypropylene and quartz wool. Preferably, the adsorption layer 52 is made of polypropylene that has undergone thermal bonding treatment. Its chemical structure is stable and it will not decompose, tear, or wear after absorbing water, chemical liquids, or corrosive liquids. Therefore, the adsorption layer 52 made of this material is highly practical and has a high absorption rate.

[0058] To facilitate the installation of the adsorption structure 50 on the side wall of the collection cup 40, the adsorption structure 50 in this embodiment further includes an adhesive layer 53. The adhesive layer 53 is disposed on the side of the adsorption layer 52 facing the side wall of the collection cup 40 and covers the adsorption layer 52. That is, the adsorption structure 50 in this embodiment includes a buffer layer 51, an adsorption layer 52 and an adhesive layer 53 arranged sequentially and in layers. The adhesive layer 53 is used to attach the adsorption structure 50 to the side wall of the collection cup 40.

[0059] like Figure 4 As shown, exemplarily, the adhesive layer 53 includes a first adhesive layer 531 and a second adhesive layer 532 stacked together. The first adhesive layer 531 is disposed close to the adsorption layer 52 and is adhered to the adsorption layer 52. The second adhesive layer 532 is disposed close to the side wall of the collection cup 40 and is adhered to the side wall. For example, the second adhesive layer 532 is configured as a sensitive adhesive tape, and the sensitive adhesive tape can adhere to the side wall of the collection cup 40. Of course, the second adhesive layer 532 can also be other types of tape, and this embodiment does not limit this.

[0060] Furthermore, the first adhesive layer 531 is configured as a hydrophobic and oleophobic material layer, that is, one side of the adhesive layer 53 is made of a hydrophobic and oleophobic material, which can prevent the buffer layer 51, the adsorption layer 52 from contacting the sidewall of the collection cup 40. This configuration can prevent the cleaning fluid from affecting the adhesion between the adhesive layer 53 and the sidewall.

[0061] Continue reading Figure 2 In this embodiment, the collecting cup 40 has an overall annular structure. The collecting cup 40 includes a flow guiding section 42 and a straight section 41 connected to the flow guiding section 42. Along its axial direction, the straight section 41 is located above the flow guiding section 42, and the junction of the two is located above the wafer 20. The sidewall of the flow guiding section 42 forms a flow guiding surface, and the contour of the cavity of the flow guiding section 42 gradually increases from top to bottom.

[0062] For example, if the guide section 42 is configured as a conical section with a conical guide surface, the radius of the cavity of the guide section 42 gradually increases from top to bottom. With this configuration, most of the cleaning fluid splashed onto the guide surface is collected by the guide section 42 into the collection cup 40, which can reduce the phenomenon of cleaning fluid colliding with the guide surface and being splashed back onto the surface of the wafer 20.

[0063] Furthermore, along the axial direction of the collecting cup 40, the first side of the adsorption structure 50 is attached to the sidewall of the guide section 42, and the second side of the adsorption structure 50 extends to the sidewall of the straight section 41. For example, along the circumference of the collecting cup 40, the adsorption structure 50 is circumferentially disposed on the sidewall of the collecting cup 40. The attachment lengths corresponding to different attachment positions are different, and the length of the adsorption structure 50 needs to match the circumference of the attachment position to ensure that the adsorption structure 50 can fully adhere to the sidewall of the collecting cup 40.

[0064] Along the axial direction of the collecting cup 40, the adsorption structure 50 has a certain width, which is greater than or equal to the range of the cleaning liquid splashed on the side wall of the collecting cup 40. With this configuration, the adsorption structure 50 can be used to buffer and absorb the cleaning liquid splashed onto the collecting cup 40.

[0065] Along the width direction of the adsorption structure 50, the adsorption structure 50 includes a first side and a second side, wherein the first side of the adsorption structure 50 is the lower edge of the adsorption structure 50, and the second side is the upper edge of the adsorption structure 50; that is, the lower edge of the adsorption structure 50 is attached to the sidewall of the guide section 42, and the upper edge of the adsorption structure 50 extends to the sidewall of the straight section 41. For example, the upper edge of the adsorption structure 50 extends to the junction of the straight section 41 and the guide section 42, or the upper edge of the adsorption structure 50 covers part of the sidewall of the straight section 41. This embodiment of the application does not limit this.

[0066] Preferably, in this embodiment, the adsorption structure 50 covers the entire sidewall of the guide section 42, that is, the lower edge of the adsorption structure 50 extends to the bottom of the guide section 42; the adsorption structure 50 at least covers a portion of the sidewall of the straight section 41, in other words, the upper edge of the adsorption structure 50 extends to the straight section 41 and covers a portion of the sidewall of the straight section 41. This configuration increases the adsorption area of ​​the adsorption structure 50, allowing for sufficient energy absorption and liquid absorption of the cleaning liquid splashed onto the sidewall of the collection cup 40, reducing the phenomenon of cleaning liquid splashing back onto the surface of the wafer 20.

[0067] like Figure 5 As shown, the wafer coating apparatus 100 provided in this application embodiment also includes an air supply component 70, which can supply dry gas to the wafer 20 and the collection cup 40. After the cleaning structure has finished cleaning the wafer, the cleaned wafer 20 can be dried.

[0068] The air supply assembly 70 includes an air outlet, which is located near the collection cup 40 and is opposite to the side wall of the straight section 41. Some of the gas can be blown toward the edge of the wafer and the side wall of the straight section 41 to dry the edge of the wafer and the side wall of the straight section.

[0069] Furthermore, at least a portion of the dry gas discharged from the air outlet can flow to the sidewall of the guide section 42 to dry the cleaning liquid on the adsorption structure 50, or the dry gas can blow the cleaning liquid on the adsorption structure along the guide surface to prevent the cleaning liquid from adhering to the adsorption structure, so that more of the surface of the adsorption structure can contact the cleaning liquid, enhancing the adsorption and buffering effect of the adsorption structure, and further reducing the phenomenon of cleaning liquid splashing back onto the surface of the wafer 20. It is understood that the bottom of the collection cup 40 is provided with an air outlet and / or a suction pump that cooperates with the air outlet, etc., which will not be described in detail in this embodiment.

[0070] In some embodiments, the surface of the adsorption structure 50 away from the sidewall of the collection cup 40 in this application embodiment has an anti-splash structure. The anti-splash structure includes, but is not limited to, multiple dot-shaped protrusions and / or depressions. The multiple dot-shaped protrusions and / or depressions are arranged in an array on the surface of the adsorption structure 50 away from the sidewall of the collection cup 40 to increase the surface roughness of the adsorption structure 50, thereby reducing the kinetic energy of the cleaning liquid when it splashes back and narrowing its splash range, which can reduce the risk of wafer contamination.

[0071] For example, in one embodiment, the anti-splash structure includes a plurality of dot-shaped protrusions arranged in an array on the surface of the adsorption structure 50; or, in another embodiment, the anti-splash structure includes a plurality of dot-shaped depressions arranged in an array on the surface of the adsorption structure 50; furthermore, the anti-splash structure is composed of a plurality of dot-shaped depressions and a plurality of dot-shaped protrusions, which are respectively arranged in an array on the surface of the adsorption structure 50.

[0072] Furthermore, the adsorption structure 50 needs to include a buffer layer 51, and selectively includes at least one of an adsorption layer 52 and an adhesive layer 53. The adsorption structure 50 and the anti-splash structure can be combined as needed, and the embodiments of this application do not limit this.

[0073] It should be noted that in this embodiment, an adsorption structure is added to the side wall of the collection cup 40. The adsorption structure can be adsorption cotton, and the adsorption cotton includes a buffer layer 51, an adsorption layer 52 and an adhesive layer 53. When the cleaning liquid splashes onto the adsorption cotton, the cleaning liquid can be absorbed by the adsorption cotton, which can reduce the risk of the cleaning liquid splashing back onto the wafer surface.

[0074] Furthermore, the adsorption structure 50 can be replaced periodically without requiring modifications to the structure of the collection cup 40, exhibiting good adaptability, convenient operation, and low cost. To ensure the adhesion of the adsorption structure, the adsorption structure 50 includes release paper, and the adhesive layer 53 of the adsorption structure 50 cooperates with the release paper, with the release paper covering the adhesive layer 53 (e.g., sensitive adhesive tape). This arrangement avoids direct contact between the sensitive adhesive tape and air, extending its shelf life.

[0075] Before installing the adsorption structure 50 (e.g., adsorption cotton) onto the collection cup 40, the perimeter and width of the attachment area on the collection cup 40 need to be measured to facilitate the cutting of the adsorption cotton. During installation, simply peel off the release paper and attach the adsorption cotton tightly to the side wall of the collection cup, which allows for quick installation of the adsorption structure onto the collection cup 40.

[0076] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0077] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0078] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0079] It should be readily understood that the terms “on,” “above,” and “on top of” in this disclosure should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on top of something” but also “on top of something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wafer coating apparatus for coating a wafer with a coating layer, characterized in that, The wafer coating apparatus includes a support stage, a collection cup, and an adsorption structure; The support platform is used to support the wafer, and the collecting cup ring is disposed on the support platform with a gap between them; The adsorption structure is arranged in a ring on the side wall of the collection cup facing the support platform, and the adsorption structure is opposite to the support platform; the adsorption structure is configured to absorb energy and / or adsorb liquid splashed onto its surface.

2. The wafer coating apparatus according to claim 1, characterized in that, The adsorption structure includes a buffer layer and / or an adsorption layer; The buffer layer is disposed toward the support platform, and the buffer layer is capable of absorbing energy from liquid splashed onto its surface; The adsorption layer is disposed on the side of the buffer layer facing the sidewall of the collection cup and covers the buffer layer; The adsorption layer is capable of adsorbing liquids splashed onto its surface.

3. The wafer coating apparatus according to claim 2, characterized in that, The adsorption layer is configured to be made of at least one of polypropylene and quartz wool; and / or The buffer layer is configured to be made of nonwoven fabric.

4. The wafer coating apparatus according to claim 2, characterized in that, The adsorption structure further includes an adhesive layer; The adhesive layer is disposed on the side of the adsorption layer facing the sidewall of the collection cup and covers the adsorption layer.

5. The wafer coating apparatus according to claim 4, characterized in that, The adhesive layer includes a first adhesive layer and a second adhesive layer stacked together; The first adhesive layer is configured as a hydrophobic and oleophobic material layer, and the first adhesive layer is bonded to the adsorption layer; The second adhesive layer is configured as a sensitive adhesive tape, and the sensitive adhesive tape is adhered to the side wall of the collection cup.

6. The wafer coating apparatus according to any one of claims 1 to 5, characterized in that, The support platform is configured as a disc; Along the radial direction of the support stage, the projection of the adsorption structure relative to the support stage covers at least the upper and lower regions of the wafer.

7. The wafer coating apparatus according to claim 6, characterized in that, The collecting cup includes a flow guide section and a straight section connected to the flow guide section; The junction between the straight section and the guide section is located above the wafer; The first side of the adsorption structure is attached to the sidewall of the flow guide section and located below the support platform; the second side of the adsorption structure extends to the sidewall of the straight section.

8. The wafer coating apparatus according to claim 7, characterized in that, The adsorption structure covers the entire sidewall of the guide section and at least a portion of the sidewall of the straight section.

9. The wafer coating apparatus according to claim 7, characterized in that, The wafer coating device also includes an air supply component; The air supply assembly includes an air outlet, which is opposite to the side wall of the straight section, and at least a portion of the gas discharged from the air outlet flows to the side wall of the guide section.

10. The wafer coating apparatus according to claim 1, characterized in that, The adsorption structure has multiple dot-like protrusions and / or depressions; The plurality of dot-shaped protrusions and / or depressions are arranged in an array on the surface of the adsorption structure away from the side wall of the collection cup.

Images