Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including a multilayer portion having dielectric layers and internal electrodes alternately disposed in a first direction. The multilayer portion has a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction, the inner electrodes alternately extend to the third surface and the fourth surface. A protection portion is disposed on the third surface and the fourth surface, and an external electrode is disposed on the multilayer portion and the protection portion and electrically connected to the internal electrode. The dielectric layer includes a first dielectric grain, and the protection portion includes a second dielectric grain having an average grain size smaller than an average grain size of the first dielectric grain.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0062080, filed on May 10, 2024, with the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] This disclosure relates to a multilayer electronic component. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs, a type of multilayer electronic component) are chip capacitors mounted on printed circuit boards of various types of electronic products, such as image display devices (such as liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, and mobile phones, for charging or discharging from them.

[0004] Multilayer ceramic capacitors are used as components in a variety of electronic devices due to their small size, high capacitance, and ease of installation. With the miniaturization and increasing power output of various electronic devices, such as computers and mobile devices, the demand for miniaturized and high-capacitance multilayer ceramic capacitors is increasing.

[0005] To increase the capacitance per unit volume of a multilayer ceramic capacitor, a method can be used that maximizes the area occupied by the capacitor forming portion throughout the entire multilayer ceramic capacitor. However, in this case, the thickness of the covering portions on the upper and lower surfaces of the capacitor forming portion, or the edge portions on the two side surfaces of the capacitor forming portion, decreases, leading to a deterioration in the moisture resistance reliability of the multilayer ceramic capacitor.

[0006] Additionally, when a multilayer ceramic capacitor is formed to include a minimum edge portion, during the polishing process of the multilayer portion, a portion of the inner electrode may be exposed to a surface other than the outer electrode coating surface, resulting in a short circuit in the multilayer ceramic capacitor.

[0007] Therefore, structural improvements are needed to mitigate issues related to the deterioration of moisture resistance reliability in multilayer ceramic capacitors, as well as issues related to short circuits in multilayer ceramic capacitors caused by the minimization of the edges. Summary of the Invention

[0008] One aspect of this disclosure is to mitigate problems related to the deterioration of the moisture resistance reliability of multilayer ceramic capacitors caused by the shortening of the moisture penetration path.

[0009] Another aspect of this disclosure is to mitigate problems related to short circuits in multilayer ceramic capacitors caused by the minimization of the edge portion.

[0010] However, the aspects of this disclosure are not limited to those described herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure.

[0011] According to one aspect of this disclosure, a multilayer electronic component is provided, comprising: a multilayer portion including a dielectric layer and an inner electrode alternately disposed in a first direction, the multilayer portion having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first and second directions, the inner electrode extending alternately to the third surface and the fourth surface; a protective portion disposed on the third surface and the fourth surface; and an outer electrode disposed on the multilayer portion and the protective portion, the outer electrode being connected to the inner electrode. The dielectric layer may include a first dielectric die, and the protective portion may include a second dielectric die. The average size of the second dielectric die may be smaller than the average size of the first dielectric die.

[0012] According to another aspect of this disclosure, a multilayer electronic assembly is provided, comprising: a multilayer portion including a dielectric layer and an inner electrode alternately disposed in a first direction, the multilayer portion having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first and second directions; a protective portion disposed on the third surface and the fourth surface; an outer electrode disposed on the multilayer portion and the protective portion, the outer electrode being electrically connected to the inner electrode; and an edge portion disposed on the fifth surface and the sixth surface. The average thickness of each of the edge portions may be less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly in the third direction.

[0013] According to exemplary embodiments of this disclosure, the moisture penetration path can be extended, thereby improving the moisture resistance reliability of multilayer electronic components.

[0014] According to example embodiments of this disclosure, edge minimization can be compensated for, thereby reducing the short-circuit rate of multilayer electronic components.

[0015] However, the various advantages and effects of this disclosure are not limited to those described herein, and will be more readily understood through the description of specific exemplary embodiments. Attached Figure Description

[0016] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment of the present disclosure.

[0017] Figure 2 This is a schematic perspective view of a multilayer electronic component according to an example embodiment, omitting the external electrodes.

[0018] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0019] Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line III-III'.

[0020] Figure 5 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0021] Figure 6 yes Figure 3 A magnified view of region P.

[0022] Figure 7 This is a schematic exploded perspective view of a multi-layered portion according to an example embodiment.

[0023] Figure 8 A schematic connection relationship between the multi-layer section and the protective section according to an example embodiment is shown.

[0024] Figure 9 This is a schematic perspective view of a multilayer electronic component according to an example embodiment, omitting the external electrodes.

[0025] Figure 10 A schematic connection relationship between the multi-layer section and the protective section according to an example embodiment is shown.

[0026] Figure 11 It is along Figure 1 A schematic cross-sectional view taken from line IV-IV'. Detailed Implementation

[0027] In the following description, exemplary embodiments of the present disclosure are illustrated with reference to the accompanying drawings. However, the present disclosure may be exemplified in many different forms and should not be construed as being limited to the specific exemplary embodiments described herein. Additionally, exemplary embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements indicated by the same reference numerals in the drawings may be the same elements.

[0028] In the accompanying drawings, for clarity of illustration, portions irrelevant to the description have been omitted, and dimensions and thicknesses have been enlarged to clearly indicate layers and regions. Throughout the specification, similar portions having the same function within the same area are indicated by similar reference numerals. Throughout the specification, unless otherwise specifically stated, when an element is referred to as “comprising” or “including” another element, it means that the element may also include other elements without excluding them.

[0029] In the accompanying drawings, the first direction can be defined as the stacking direction or the thickness direction, the second direction can be defined as the length direction, and the third direction can be defined as the width direction.

[0030] Figure 1 This is a schematic perspective view of a multilayer electronic component according to an exemplary embodiment of the present disclosure.

[0031] Figure 2 This is a schematic perspective view of a multilayer electronic component according to an example embodiment, omitting the external electrodes.

[0032] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0033] Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line III-III'.

[0034] Figure 5 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0035] Figure 6 yes Figure 3 A magnified view of region P.

[0036] Figure 7 This is a schematic exploded perspective view of a multi-layered portion according to an example embodiment.

[0037] Figure 8 A schematic connection relationship between the multi-layer section and the protective section according to an example embodiment is shown.

[0038] Figure 9 This is a schematic perspective view of a multilayer electronic component according to an example embodiment, omitting the external electrodes.

[0039] Figure 10 A schematic connection relationship between the multi-layer section and the protective section according to an example embodiment is shown.

[0040] Figure 11 It is along Figure 1 A schematic cross-sectional view taken from line IV-IV'.

[0041] In the following text, reference will be made to Figures 1 to 11 A multilayer electronic assembly 100 and various variations thereof are described in detail according to exemplary embodiments of the present disclosure. Additionally, multilayer ceramic capacitors (MLCCs) are described as examples of multilayer electronic assemblies, but the present disclosure is not limited thereto.

[0042] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a multilayer portion 110 including a dielectric layer 111 alternately disposed in a first direction and inner electrodes 121 and 122, the multilayer portion 110 having a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 opposite to each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 opposite to each other in a third direction perpendicular to the first and second directions, the inner electrodes 121 and 122 alternately extending to the third surface 3 and the fourth surface 4; a protective portion 120 disposed on the third surface 3 and the fourth surface 4; and outer electrodes 131 and 132 disposed on the multilayer portion 110 and the protective portion 120, the outer electrodes 131 and 132 being connected to the inner electrodes 121 and 122. The dielectric layer 111 may include a first dielectric die, and the protective portion 120 may include a second dielectric die. The average size (or average die size) of the second dielectric die may be smaller than the average size of the first dielectric die. In the following, various components included in the multilayer electronic assembly 100 according to an exemplary embodiment of the present disclosure will be described.

[0043] The multilayer portion 110 may include a dielectric layer 111 and internal electrodes 121 and 122 disposed alternately with the dielectric layer 111 in a first direction.

[0044] The specific shape of the multi-layered section 110 is not limited. However, as... Figure 2 As shown, the multilayer portion 110 may have a hexahedral shape or a shape similar to a hexahedron. During the sintering process, the ceramic particles included in the multilayer portion 110 may shrink, so that the multilayer portion 110 may not have a hexahedral shape with perfect straight lines, but may have a generally hexahedral shape.

[0045] In the example embodiment, the stacking direction of the dielectric layer 111 and the inner electrodes 121 and 122 can be defined as a first direction, the direction perpendicular to the first direction can be defined as a second direction, and the direction perpendicular to the first and second directions can be defined as a third direction.

[0046] The multilayer portion 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in a first direction; a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction; and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4, and are opposite to each other in a third direction.

[0047] In this configuration, the third surface 3 and the fourth surface 4 can be connected to portions of the inner electrodes 121 and 122, respectively. Specifically, the third surface 3 can be connected to the first inner electrode 121, and the fourth surface 4 can be connected to the second inner electrode 122. In other words, the inner electrodes 121 and 122 can extend alternately to the third surface 3 and the fourth surface 4. Specifically, the first inner electrode 121 can extend to the third surface 3, and the second inner electrode 122 can extend to the fourth surface 4.

[0048] Additionally, the fifth surface 5 and the sixth surface 6 may be configured to be spaced apart from the inner electrodes 121 and 122. Specifically, the fifth surface 5 and the sixth surface 6 may be configured to be spaced apart from the two ends of the first inner electrode 121 and the second inner electrode 122 in the third direction.

[0049] Since the edge regions of the dielectric layer 111 on which the inner electrodes 121 and 122 are not disposed overlap each other in the first direction, steps may be caused by the thickness of the inner electrodes 121 and 122, such that the corners connecting the first surface 1 and the third to sixth surfaces 3 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3 and 6 may shrink relative to the first surface 1 or the second surface 2 toward the center of the multilayer portion 110 in the first direction. Optionally, due to the shrinkage behavior of the multilayer portion 110 during the sintering process, the corners connecting the first surface 1 with the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, the fourth surface 4, the fifth surface 5 and the sixth surface 6 may shrink relative to the first surface 1 or the second surface 2 toward the center of the multilayer portion 110 in the first direction. Optionally, in order to prevent peeling defects, etc., an additional process may be performed to round the corners connecting the various surfaces of the multilayer portion 110. Therefore, the corners connecting the first surface 1 to the third to sixth surfaces 6 and / or the corners connecting the second surface 2 to the third to sixth surfaces 6 can have a rounded shape.

[0050] The multiple dielectric layers 111 in the multilayer portion 110 may be in a sintered state, and adjacent dielectric layers 111 are integrated with each other, making it difficult to identify the boundary between them without using a scanning electron microscope (SEM). The number of stacked dielectric layers 111 is not limited and may be determined based on the size of the multilayer electronic component 100. For example, the multilayer portion 110 may be formed by stacking 400 or more dielectric layers 111.

[0051] The dielectric layer 111 may be formed by preparing a ceramic slurry containing ceramic particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a green sheet, and then sintering the green sheet. The ceramic particles are not limited as long as sufficient capacitance can be obtained using them, and may be, for example, barium titanate (BaTiO3)-based particles. As a more specific example, the ceramic particles may be CaZrO3-based paraelectric particles or similar materials. As a more specific example, the barium titanate (BaTiO3)-based particles may be BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1), and the CaZrO3-based paraelectric particles may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0052] Therefore, the dielectric layer 111 may include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Tiy )At least one of O3 (0 < x < 1, 0 < y < 1).

[0053] The average thickness td of the dielectric layer 111 is not limited.

[0054] To achieve high capacitance and miniaturization of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 can be less than or equal to 0.35 μm. To improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 can be greater than or equal to 3 μm.

[0055] The average thickness td of the dielectric layer 111 can be measured by an image obtained by scanning a cross-section in the second and first directions at the central portion of the multilayer portion 110 in the third direction with SEM.

[0056] For example, the average thickness td of the dielectric layer 111 can be obtained as follows: For a total of five dielectric layers among the dielectric layers extracted from an image obtained by scanning a cross-section in the length and thickness directions at the central portion of the multilayer portion 110 in the width direction (including one dielectric layer (i.e., the reference layer) at the intersection of the center line of the multilayer portion 110 in the length direction and the center line of the multilayer portion 110 in the thickness direction, two dielectric layers above the reference layer, and two dielectric layers below the reference layer), five points (including a reference point on the center line of the multilayer portion 110 in the length direction, two points to the left of the reference point, and two points to the right of the reference point) that are equally spaced from each other in the length direction are set, and then the thickness of the dielectric layer at these points is measured to obtain an average value.

[0057] The multilayer portion 110 may include a capacitance forming portion Ac, in which the dielectric layer 111 and the inner electrodes 121 and 122 are alternately arranged to form a capacitance. Specifically, the capacitance forming portion Ac may be a region having a capacitance by including a first inner electrode 121 and a second inner electrode 122 that are arranged opposite to each other with the dielectric layer 111 interposed therebetween.

[0058] The capacitance forming portion Ac may be a part that contributes to the capacitance of the formed capacitor, and may be formed by repeatedly laminating the first inner electrode 121 and the second inner electrode 122 with the dielectric layer 111 interposed therebetween. In addition, the first inner electrode 121 may be provided at the uppermost end of the capacitance forming portion Ac in the first direction, and the second inner electrode 122 may be provided at the lowermost end of the capacitance forming portion Ac in the first direction.

[0059] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged opposite each other with a dielectric layer 111 between them, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the multilayer portion 110, respectively.

[0060] The first inner electrode 121 may be spaced apart from the fourth surface 4 and extend to the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and extend to the fourth surface 4. The first outer electrode 131 may be disposed on the third surface 3 of the multilayer portion 110 to be connected to the first inner electrode 121, and the second outer electrode 132 may be disposed on the fourth surface 4 of the multilayer portion 110 to be connected to the second inner electrode 122.

[0061] That is, the first inner electrode 121 is connected to the first outer electrode 131 instead of the second outer electrode 132, and the second inner electrode 122 is connected to the second outer electrode 132 instead of the first outer electrode 131. Therefore, the first inner electrode 121 can be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 can be spaced apart from the third surface 3 by a predetermined distance.

[0062] The conductive metal used in the internal electrodes 121 and 122 may include at least one of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti and alloys thereof; however, this disclosure is not limited thereto.

[0063] The average thickness te of the inner electrodes 121 and 122 is not limited and can be varied depending on the purpose. To miniaturize the multilayer electronic component 100, the average thickness te of the inner electrodes 121 and 122 can be less than or equal to 0.35 μm. To improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the inner electrodes 121 and 122 can be greater than or equal to 3 μm.

[0064] For example, the average thickness te of the inner electrodes 121 and 122 can be obtained by: for each of the five inner electrodes extracted from an image obtained by scanning a cross-section of the multilayer section 110 taken in the width direction at the center of the multilayer section 110 in the length and thickness directions (including one inner electrode located at the point where the center line of the multilayer section 110 in the length direction and the center line of the multilayer section 110 in the thickness direction intersect each other, two inner electrode layers above the one inner electrode, and two inner electrodes below the one inner electrode), five points (including a reference point located on the center line of the multilayer section 110 in the length direction, two points to the left of the reference point, and two points to the right of the reference point) that are equidistant from each other in the length direction are set, and then the thickness of the inner electrode at each point is measured to obtain its average value.

[0065] The shape of each of the internal electrodes 121 and 122 is not restricted.

[0066] However, when each of the inner electrodes 121 and 122 has a bottleneck shape in which the dimension in the third direction decreases toward the third surface 3 or the fourth surface 4, the moisture resistance reliability can be ensured because the permeation path of external moisture to the inner electrodes 121 and 122 is extended.

[0067] When the bottleneck shape is not applied to the inner electrode, the capacitance per unit volume of the multilayer electronic component 100 can be increased, and the thickness variation of the inner electrode can be reduced, resulting in improved BDV characteristics. However, compared to the case where the bottleneck shape is applied, the penetration path of external moisture may be shortened when the bottleneck shape is not applied to the inner electrode, which may make it difficult to ensure moisture resistance reliability.

[0068] However, according to an example embodiment of this disclosure, a protective portion 120 including dielectric grains with an average grain size smaller than the average grain size of dielectric layer 111 can be formed on the third surface 3 and the fourth surface 4 of the multilayer portion 110. Therefore, excellent moisture resistance reliability can be ensured even when the bottleneck pattern is not applied to the internal electrode. That is, compared with the case where the bottleneck pattern is applied, the effect of this disclosure in improving moisture resistance reliability is more significant when the bottleneck pattern is not applied to the internal electrode, and the capacitance per unit volume of the multilayer electronic component 100 can be increased, and the BDV characteristics can also be improved.

[0069] "When the bottleneck pattern is not applied to the inner electrodes" can mean that the cross-sections of the inner electrodes 121 and 122 in the second and third directions are rectangular, or that the dimension of each of the inner electrodes 121 and 122 in the third direction is substantially constant in the second direction. In this case, "the dimension of each of the inner electrodes 121 and 122 in the third direction is substantially equal in the second direction" can mean that the dimension of each of the inner electrodes 121 and 122 in the third direction varies within a deviation range of -2% to +2% in the second direction.

[0070] Reference Figure 3 and Figure 5 The covering portions C1 and C2 can be disposed on two surfaces of the capacitor forming portion Ac in the first direction.

[0071] Covers C1 and C2 are primarily used to prevent damage to the internal electrodes caused by physical and / or chemical stress.

[0072] Covering portions C1 and C2 may include the same material as the dielectric layer 111. That is, covering portions 112 and 113 may include ceramic materials (e.g., barium titanate (BaTiO3) based ceramic materials).

[0073] Reference Figure 7 The covering portions C1 and C2 can be formed by laminating additional dielectric layers onto two surfaces in the first direction of the capacitor forming portion Ac, in which the inner electrodes 121 and 122 are alternately disposed with the dielectric layer 111, but this disclosure is not limited thereto.

[0074] The thickness of each of the covers C1 and C2 does not need to be limited. For example, the average thickness tc of each of the covers C1 and C2 may be less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly 100 in the first direction.

[0075] When the average thickness of each of the covers C1 and C2 is less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly 100 in the first direction, the path for external moisture or plating solution to penetrate into the capacitor forming portion Ac may be shortened. Therefore, it may be difficult to ensure the moisture resistance reliability of the multilayer electronic assembly 100. However, according to an example embodiment of this disclosure, a protective portion 120 including dielectric grains with an average grain size smaller than the average grain size of the dielectric layer 111 can be formed on the third surface 3 and the fourth surface 4 of the multilayer portion 110, thereby extending the path for external moisture to penetrate into the capacitor forming portion Ac through the corners of the multilayer electronic assembly 100. Therefore, even when the average thickness of each of the covers C1 and C2 is less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly 100 in the first direction, excellent moisture resistance reliability can be ensured. That is, when the average thickness of each of the covers C1 and C2 is less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly 100 in the first direction, the effect of this disclosure in improving moisture resistance reliability is more significant.

[0076] The average thickness tc of each of the covering parts C1 and C2 may refer to the average dimension of each of the covering parts C1 and C2 in the first direction, and may be the average value obtained by averaging the dimensions of each of the covering parts C1 and C2 in the first direction measured at five equidistant points on the upper or lower part of the capacitor forming part Ac.

[0077] Additionally, refer to Figure 4 and Figure 5 Edge portions M1 and M2 can be disposed on two surfaces of the capacitor forming portion Ac in the third direction.

[0078] Edge portions M1 and M2 may include a first edge portion M1 disposed on one side surface of the capacitor forming portion Ac in a third direction (i.e., the width direction) and a second edge portion M2 disposed on the other side surface of the capacitor forming portion Ac in a third direction (i.e., the width direction). That is, edge portions 114 and 115 may be disposed on both side surfaces of the capacitor forming portion Ac in the width direction.

[0079] like Figure 5 As shown, the edge portions 114 and 115 can refer to the region between the two ends of the first inner electrode 121 and the second inner electrode 122 and the outer surface of the multilayer portion 110 in the cross section of the width-thickness direction of the multilayer portion 110.

[0080] Edge sections M1 and M2 are primarily used to prevent damage to the internal electrodes caused by physical and / or chemical stress.

[0081] Edge portions M1 and M2 can be formed by applying conductive paste only to the portion of the ceramic green sheet outside the area where the edge portion will be formed when forming the internal electrode. However, this disclosure is not limited to this, and edge portions M1 and M2 can be formed by: applying a ceramic paste for forming the edge portion to the side surface of the capacitor forming portion Ac and then sintering it; or pressing the ceramic green sheet for forming the edge portion to attach the ceramic green sheet to the side surface of the capacitor forming portion Ac and then sintering it. The materials of edge portions M1 and M2 are not limited and can be the same as the material of dielectric layer 111. However, this disclosure is not limited to this, and the materials of edge portions M1 and M2 can be different from the material of dielectric layer 111. As a result, edge portions M1 and M2 can have a composition different from that of dielectric layer 111. Furthermore, the edge portion can also be described as a portion independent of the multilayer portion, in which case the internal electrode can be exposed on the fifth and sixth surfaces of the multilayer portion, and the edge portion can be disposed on the fifth and sixth surfaces of the multilayer portion.

[0082] The width (i.e., the dimension in the third direction) of each of the edge portions M1 and M2 does not need to be limited. For example, the average width of each of the edge portions M1 and M2 may be less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly 100 in the third direction.

[0083] When the average width of each of the edge portions M1 and M2 is less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly 100 in the third direction, the path for external moisture or plating solution to penetrate into the capacitor formation portion Ac may be shortened, making it difficult to ensure the moisture resistance reliability of the multilayer electronic assembly 100. However, in the exemplary embodiments of this disclosure, a protective portion 120 including dielectric grains with an average grain size smaller than the average grain size of the dielectric layer 111 can be formed on the third surface 3 and the fourth surface 4 of the multilayer portion 110, thereby extending the path for external moisture to penetrate into the capacitor formation portion Ac through the side portion of the multilayer electronic assembly 100 in the second direction. That is, when the average width of each of the edge portions M1 and M2 is less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly 100 in the third direction, the effect of this disclosure in improving moisture resistance reliability is more significant.

[0084] The average widths of the edge portions M1 and M2 may refer to the average dimensions in the third direction of the regions where the inner electrodes are spaced apart from the fifth surface and the average dimensions in the third direction of the regions where the inner electrodes are spaced apart from the sixth surface, and may be the average values obtained by averaging the dimensions in the third direction of each of the edge portions M1 and M2 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0085] Referring Figure 8 , the protection portion 120 may be provided on the third surface 3 and the fourth surface 4 of the multilayer portion 110 (one ends of the first inner electrode 121 and the second inner electrode 122 are respectively exposed on the third surface and the fourth surface) to extend the penetration path of external moisture.

[0086] The material of the protection portion 120 is not limited, but the protection portion 120 may include one or more dielectric materials such as BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0087] According to an exemplary embodiment of the present disclosure, the multilayer portion 110 may include dielectric grains. Only dielectric layers may be present in the covering portion or the edge portion (i.e., there are no inner electrodes in the covering portion or the edge portion), so that the sintering driving force of the covering portion or the edge portion may be weaker than the sintering driving force of the capacitance forming portion Ac including the inner electrodes. Thus, when sintering the multilayer portion 110, the covering portion or the edge portion may form a structure that is not denser than the capacitance forming portion Ac.

[0088] Therefore, in an exemplary embodiment of the present disclosure, the protection portion 120 having dielectric grains smaller than the dielectric grains of the dielectric layer 111 may be formed on the third surface 3 and the fourth surface 4 of the multilayer portion 110 to extend the penetration path of external moisture, thereby improving the moisture resistance reliability of the multilayer electronic component 100.

[0089] The ratio of the average size of the second dielectric grain to the average size of the first dielectric grain is not limited. However, when the ratio is less than 0.10, the size difference between the first and second dielectric grains is too large, potentially leading to porosity due to sintering mismatch. This may reduce moisture resistance and cause problems such as cracking. When the ratio is greater than 0.80, the sizes of the first and second dielectric grains may be similar, resulting in slightly insufficient protection against external moisture penetration. Therefore, the ratio of the average size of the second dielectric grain to the average size of the first dielectric grain can be greater than or equal to 0.10 and less than or equal to 0.80.

[0090] There are no restrictions on the method for measuring the ratio of the average size of the second dielectric grain to the average size of the first dielectric grain.

[0091] First, the average size of the first dielectric grain can be calculated by averaging the sizes of the dielectric grains measured in the central regions Q1, Q2, and Q3 of the dielectric layer. The aforementioned measurements are cross-sections of the multilayer electronic assembly obtained by polishing the multilayer electronic assembly to its central portion along a third direction in both the first and second directions. Figure 3 (This was done)

[0092] Each region used to measure the average size of the first dielectric die can refer to a region with a size of 5 μm × 5 μm in the first direction × the second direction as measured by SEM in the cross section, but this disclosure is not limited thereto. Alternatively, the average size of the dielectric die in each region can be measured by measuring the minor axis length and major axis length of any ten or more dies in each region, or by measuring the die area in a pixel and converting that area to an equivalent circle diameter, but this disclosure is not limited thereto. The average size of the first dielectric die can be further generalized by measuring the size of the first dielectric die in the central regions Q1, Q2, and Q3 of the dielectric layer. Region Q1 is located at the uppermost end of the capacitor forming portion Ac in the first direction, region Q2 is located at the center of the capacitor forming portion Ac in the first direction, and region Q3 is located at the lowermost end of the capacitor forming portion Ac in the first direction. The dimensions measured from these regions can then be averaged.

[0093] Next, the average size of the second dielectric grain can be determined by adjusting the size of the grains in the central regions P1, P2, and P3. Figure 6The average value obtained by averaging the size of the dielectric grains measured in the measurement, the central regions P1, P2 and P3 are obtained by dividing the area where the protective part 120 is formed in the first direction into three parts in the cross section of the multilayer electronic component obtained by polishing the multilayer electronic component to the central part of the multilayer electronic component along the third direction in the first direction.

[0094] Similarly, each region used to measure the average size of the second dielectric die can refer to a region with a size of 5 μm × 5 μm in the first direction × the second direction as measured by SEM in the cross section, but this disclosure is not limited thereto. Alternatively, the average size of the dielectric die in each region can be measured by measuring the minor axis length and major axis length of any ten or more dies in each region, or by measuring the die area in a pixel and converting that area to an equivalent circle diameter, but this disclosure is not limited thereto. The average size of the second dielectric die can be further generalized by measuring the dimensions of the second dielectric dies in regions P1, P2, and P3 of the protection section 120 respectively and averaging these dimensions.

[0095] In the example embodiment, the protective portion 120 may cover the area of ​​the end surface Sc of the third surface 3 and the fourth surface 4, excluding the inner electrodes. Therefore, the connection between the outer electrodes 131 and 132 and the inner electrodes 121 and 122 may not be affected.

[0096] Reference Figure 2 The end of the inner electrode in the second direction that extends to the third surface 3 or the fourth surface 4 is called the end of the inner electrode. The end surface Sc of the inner electrode refers to the region located between the uppermost and lowermost ends of the end of the inner electrode in the first direction and between two line segments connecting the two side edges of the end of the inner electrode in the third direction. As an example, this region can be a rectangular region. Here, the uppermost end of the end of the inner electrode in the first direction can refer to the uppermost end of the inner electrode located on the uppermost side of the third surface 3 or the fourth surface 4, and the lowermost end of the end of the inner electrode in the first direction can refer to the uppermost end of the inner electrode located on the lowermost side of the third surface 3 or the fourth surface 4.

[0097] The end surface Sc of the inner electrode can refer to the region where the outer electrodes 131 and 132 directly contact one end of the inner electrodes 121 and 122 in the second direction. Therefore, according to the example embodiment, when the protective portion 120 covering the region of the third surface 3 and the fourth surface 4 excluding the end surface Sc of the inner electrode is applied, the outer electrodes 131 and 132 can be formed on all ends of the inner electrodes located on the end surface Sc of the inner electrode, thereby ensuring the connection between the outer electrodes 131 and 132 and the inner electrodes 121 and 122.

[0098] Reference Figure 3 The maximum dimension of the external electrode 131 or 132 in the second direction is represented by B, and the maximum dimension of the protective part 120 in the second direction is represented by A.

[0099] When a protective portion 120 containing dielectric grains smaller than those in dielectric layer 111 is formed on the third surface 3 and the fourth surface 4, short circuits in multilayer electronic components can be prevented and moisture resistance reliability can be improved.

[0100] However, when the protective portion 120 is formed to have a larger size than the maximum dimension B of the external electrodes 131 and 132 in the second direction, the external electrodes 131 and 132 may be trapped in the protective portion 120, and therefore may not be able to be mounted on the substrate. Therefore, the ratio (A / B) of the maximum dimension A of the protective portion 120 in the second direction to the maximum dimension B of the external electrodes in the second direction can be appropriately adjusted to improve the mountability of multilayer electronic components, improve moisture resistance reliability, and prevent short circuits.

[0101] Specifically, the ratio (A / B) of the maximum dimension A of the protective part 120 in the second direction to the maximum dimension B of the external electrode in the second direction can be greater than 0.18 and less than 1.00, and more preferably between 0.25 and 0.75 (i.e., greater than or equal to 0.25 and less than or equal to 0.75).

[0102] When the ratio (A / B) of the maximum dimension A of the protective part 120 in the second direction to the maximum dimension B of the external electrode in the second direction is less than or equal to 0.18, installability can be ensured. However, as a result of the protective part 120 not being sufficiently formed, it may be difficult to ensure the effect of preventing short circuits and improving moisture resistance reliability.

[0103] When the ratio (A / B) of the maximum dimension A of the protection part 120 in the second direction to the maximum dimension B of the external electrode in the second direction is greater than 0.18, the installationability can be improved, the moisture resistance reliability can be improved, and the short circuit can be prevented at the same time.

[0104] However, when the ratio (A / B) of the maximum dimension A of the protection portion 120 in the second direction to the maximum dimension B of the external electrode in the second direction is greater than or equal to 1.00, the multilayer electronic assembly 100 may be unable to be mounted on the substrate due to the over-formation of the protection portion 120.

[0105] Therefore, in order to ensure installability, the ratio (A / B) of the maximum dimension A of the protection part 120 in the second direction to the maximum dimension B of the external electrode in the second direction can be less than 1.00.

[0106] The method of measuring the maximum dimension A of the protection unit 120 in the second direction and the maximum dimension B of the external electrodes 131 and 132 in the second direction is not limited.

[0107] The maximum dimension A of the protective part 120 in the second direction and the maximum dimension B of the external electrode 131 or 132 in the second direction can refer to the values ​​obtained by measuring the horizontal distance in the second direction from the third surface 3 or the fourth surface 4 to the outermost point of the protective part 120 in the second direction and the horizontal distance in the second direction from the third surface 3 or the fourth surface 4 to the outermost point of the external electrode 131 or 132 in the second direction in the second direction using SEM, optical microscope (OM) or the like in a cross section of the multilayer electronic assembly 100 in the first and second directions.

[0108] The maximum dimension A of the protective part 120 in the second direction can be adjusted according to the thickness of the ceramic green sheet used to form the protective part attached to the third surface 3 or the fourth surface 4 of the multilayer part 110, and the maximum dimension B of the external electrode in the second direction can be adjusted according to the degree of impregnation of conductive paste for the external electrode before sintering.

[0109] According to an example embodiment, the protective portion 120 may be disposed on the side surfaces of the covering portions C1 and C2 in the second direction and on the side surfaces of the edge portions M1 and M2 in the second direction. Specifically, the protective portion 120 may be disposed to cover the side surfaces of the covering portions C1 and C2 in the second direction and the side surfaces of the edge portions M1 and M2 in the second direction, thus the effect of improving moisture resistance reliability according to the present disclosure can be more significant.

[0110] The shape of the protective part 120 is not limited. Figures 1 to 8 In this context, the areas of the third surface 3 and the fourth surface 4 not covered by the protected portion 120 are represented as having a rectangular shape, but are not limited to this, and may have various shapes. For example, refer to... Figure 9 and Figure 10 The areas of the third surface 3 and the fourth surface 4 that are not covered by the protected part 120' may have an elliptical or circular shape.

[0111] Reference Figure 11The area of ​​the third surface 3 of the multilayer portion 110 not covered by the protected portion 120 can be larger than the area of ​​the third surface 3 covered by the protected portion 120. Therefore, the improved moisture resistance effect of this disclosure can be ensured, and the contact area between the first external electrode 131 and the first internal electrode 121 can be sufficiently ensured to improve the electrical connection and bonding strength between the first external electrode 131 and the first internal electrode 121. The relationship between the protected portion 120 and the third surface 3 has been described; the relationship between the protected portion 120 and the fourth surface 4 can be understood similarly. Specifically, the area of ​​the fourth surface 4 of the multilayer portion 110 not covered by the protected portion 120 can be larger than the area of ​​the fourth surface 4 covered by the protected portion 120.

[0112] External electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the multilayer portion 110. Additionally, refer to... Figure 3 and Figure 4 External electrodes 131 and 132 can be disposed on the protective part 120 and can cover the protective part 120.

[0113] Reference Figure 1 The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the multilayer portion 110, respectively, and may include the first external electrode 131 and the second external electrode 132 respectively connected to the first internal electrode 121 and the second internal electrode 122.

[0114] In this example embodiment, a multilayer electronic component 100 is described having a structure with two external electrodes 131 and 132, but the number and / or shape of the external electrodes 131 and 132 may be changed depending on the shape and / or other purpose of the internal electrodes 121 and 122.

[0115] The external electrodes 131 and 132 can be made of any conductive material, such as metal. Specific materials can be selected based on electrical properties, structural stability, or similar considerations. Additionally, the external electrodes 131 and 132 can have a multilayer structure.

[0116] For example, the external electrodes 131 and 132 may include an electrode layer disposed on the multilayer portion 110 and a plating layer formed on the electrode layer.

[0117] As a more specific example of an electrode layer, the electrode layer may be a sintered electrode comprising a conductive metal and glass, or a resin-based electrode comprising a conductive metal and resin.

[0118] Alternatively, the electrode layer may consist of a sintered electrode and a resin-based electrode sequentially formed on the multilayer portion 110. The electrode layer may also be formed by transferring a sheet containing a conductive metal onto the multilayer portion 110 or the sintered electrode.

[0119] As the conductive metal included in the electrode layer, any metallic material with excellent conductivity can be used, and there are no restrictions. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys.

[0120] The coating can be used to improve mounting characteristics. The type of coating is not limited and can include at least one of Ni, Sn, Pd, and their alloys, and can be formed using multiple layers.

[0121] As a more specific example, the coating may be a Ni coating or a Sn coating, or it may be in the form of Ni coatings and Sn coatings sequentially formed on the electrode layer, or it may be in the form of Sn coatings, Ni coatings and Sn coatings sequentially formed. Additionally, the coating may include multiple Ni coatings and / or multiple Sn coatings.

[0122] The size of the multilayer electronic component 100 is not limited.

[0123] For example, the multilayer electronic component 100 may have a size of less than or equal to 0201 (length × width, 0.2mm × 0.1mm) to achieve both miniaturization and high capacitance, and may have a size of greater than or equal to 3216 (length × width, 3.2mm × 1.6mm) for use in products with high reliability requirements under high temperature and high pressure environments, but this disclosure is not limited thereto.

[0124] Here, the length of the multilayer electronic component 100 refers to the maximum dimension of the multilayer electronic component 100 in the second direction, the thickness of the multilayer electronic component 100 refers to the maximum dimension of the multilayer electronic component 100 in the first direction, and the width of the multilayer electronic component 100 refers to the maximum dimension of the multilayer electronic component 100 in the third direction.

[0125] (Example) Table 1 below shows the results of evaluating installability, short-circuit rate and moisture resistance reliability based on the ratio (A / B) of the maximum dimension A of the protection unit 120 in the second direction to the maximum dimension B of the external electrode in the second direction.

[0126] Samples of multilayer electronic components for which their characteristics are evaluated during the test process in Table 1 are manufactured by: printing conductive paste for internal electrodes onto a dielectric mold to create multilayer strips; cutting the multilayer strips; pressing ceramic green sheets for forming protective parts to attach the ceramic green sheets to the side surfaces of the cut multilayer strips; and plasticizing and re-oxidizing the ceramic green sheets together with the cut multilayer strips in a plastic reducing atmosphere.

[0127] In this case, for different test numbers, the A / B value is adjusted by changing the thickness of the ceramic green sheet used to form the protective part and the degree of impregnation of the conductive paste used for the external electrode, while other conditions are the same.

[0128] The maximum dimension A of the protective portion 120 in the second direction and the maximum dimension B of the external electrodes 131 and 132 in the second direction are obtained by measuring the horizontal distance from the third surface 3 or the fourth surface 4 to the outermost point of the protective portion 120 in the second direction and from the third surface 3 or the fourth surface 4 to the outermost point of the external electrodes 131 or 132 in the second direction in a cross section of the multilayer electronic assembly 100 obtained by polishing the multilayer electronic assembly 100 to the central portion of the multilayer electronic assembly 100 along a third direction using OM.

[0129] Installability is evaluated as follows: 400 multilayer electronic components are soldered onto a substrate using a reflow soldering process. The substrate is then inverted. If 200 or more multilayer electronic components detach, the installability is rated as poor (X). If fewer than 200 multilayer electronic components detach, the installability is rated as good (○).

[0130] In the short circuit rate evaluation, the capacitance of 30 multilayer electronic components was measured using a capacitance meter, and multilayer electronic components with a dissipation factor (DF) greater than or equal to 0.1 were identified as short circuits, and the ratio of short-circuited multilayer electronic components to the total number of 30 multilayer electronic components was expressed as a percentage.

[0131] Moisture resistance reliability was evaluated in 1200 samples for each test number under conditions of 1.2Vr (i.e., 1.2 times the rated voltage), 85°C and 85% relative humidity, and samples whose insulation resistance value decreased by 100 times or more from the initial insulation resistance value were identified as defective.

[0132] [Table 1]

[0133] Test number 1 represents the case where no protection unit was formed, and it can be confirmed that the short circuit occurrence rate is 100%.

[0134] Test number 2 is the case where A / B is 0.05, and it can be confirmed that the short circuit occurrence rate is 20%.

[0135] Test numbers 3 and 4 represent cases where A / B is less than or equal to 0.18 or less than 0.25. It is confirmed that even when the short-circuit occurrence rate decreases as A / B increases, sufficient moisture resistance reliability cannot be guaranteed.

[0136] Test numbers 5 to 9 represent cases where A / B is greater than 0.18 and less than 1.00, or greater than or equal to 0.25 and less than or equal to 0.75. It can be confirmed that the short circuit occurrence rate is 0%, and the installability and moisture resistance are excellent.

[0137] Test number 10 represents the case where A / B is 1, and it can be confirmed that the installability is poor. Therefore, A / B is preferably less than 1, and more preferably less than or equal to 0.75.

[0138] Therefore, when the ratio (A / B) of the maximum dimension A of the protection part 120 in the second direction to the maximum dimension B of the external electrode in the second direction is greater than 0.18 and less than 1.00 (more preferably, greater than or equal to 0.25 and less than or equal to 0.75), excellent installability and moisture resistance reliability can be ensured, and the occurrence of short circuits can be suppressed.

[0139] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

[0140] Furthermore, the term "example embodiment" as used herein does not refer to the same example embodiment, but is provided to emphasize a particular feature or characteristic that differs from that of another example embodiment. The example embodiments provided herein are thought to be implementable by combining them, in whole or in part. For example, an element described in a particular example embodiment may be understood to be related to another example embodiment, even if it is not described in another example embodiment, unless a contrary or contradictory description is provided in another example.

[0141] The terminology used herein is intended to describe particular exemplary embodiments and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form may include the plural form.

Claims

1. A multilayer electronic component, comprising: A multilayer portion includes a dielectric layer and an inner electrode alternately disposed in a first direction. The multilayer portion has a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposite to each other in a third direction perpendicular to the first direction and the second direction. The inner electrode extends alternately to the third surface and the fourth surface. A protective portion is disposed on the third surface and the fourth surface; and An external electrode is disposed on the multilayer portion and the protective portion, and the external electrode is connected to the internal electrode. Wherein, the dielectric layer includes a first dielectric grain, and the protective portion includes a second dielectric grain, and The average size of the second dielectric grain is smaller than the average size of the first dielectric grain.

2. The multilayer electronic component as claimed in claim 1, wherein, The end of the inner electrode that connects to the third or fourth surface in the second direction is referred to as the end of the inner electrode, and the region located between the uppermost and lowermost ends of the end of the inner electrode in the first direction and between two line segments connecting the end of the inner electrode to the two side edges in the third direction is referred to as the end surface of the inner electrode. The protective portion covers the region of the end surface of the third and fourth surfaces, excluding the inner electrode.

3. The multilayer electronic component as described in claim 2, wherein, The areas of the third and fourth surfaces not covered by the protective portion have a rectangular shape.

4. The multilayer electronic component as described in claim 2, wherein, The areas of the third and fourth surfaces not covered by the protective portion have an elliptical or circular shape.

5. The multilayer electronic component as claimed in claim 1, wherein, The ratio of the average size of the second dielectric grain to the average size of the first dielectric grain is greater than or equal to 0.10 and less than or equal to 0.

80.

6. The multilayer electronic component as claimed in claim 1, wherein, The ratio of the maximum dimension of the protective part in the second direction to the maximum dimension of the external electrode in the second direction is greater than 0.18 and less than 1.

00.

7. The multilayer electronic component as claimed in claim 1, wherein, The ratio of the maximum dimension of the protective part in the second direction to the maximum dimension of the external electrode in the second direction is greater than or equal to 0.25 and less than or equal to 0.

75.

8. The multilayer electronic component as claimed in claim 1, wherein, The inner electrode is positioned at both ends in the third direction to be spaced apart from the fifth and sixth surfaces.

9. The multilayer electronic component as claimed in claim 1, wherein, The cross-section of the inner electrode in the second direction and the third direction is rectangular.

10. The multilayer electronic component as claimed in claim 1, wherein, The dimension of the internal electrode in the third direction is constant in the second direction.

11. The multilayer electronic component as claimed in claim 1, wherein, The multilayer portion includes a capacitor forming portion in which the inner electrode and the dielectric layer are alternately arranged to form a capacitor, and a covering portion disposed on each of two surfaces of the capacitor forming portion in the first direction. The average size of the cover portion in the first direction is less than or equal to 0.25 times the maximum size of the multilayer electronic component in the first direction.

12. The multilayer electronic component as claimed in claim 1, wherein, The multilayer portion includes a capacitor forming portion in which the inner electrode and the dielectric layer are alternately arranged to form a capacitor, and an edge portion disposed on each of the two surfaces of the capacitor forming portion in the third direction. The average size of the edge portion in the third direction is less than or equal to 0.25 times the maximum size of the multilayer electronic assembly in the third direction.

13. The multilayer electronic component as claimed in claim 1, wherein, The area of ​​the third and fourth surfaces not covered by the protective portion is greater than the area of ​​the third and fourth surfaces covered by the protective portion.

14. The multilayer electronic assembly as claimed in claim 1, wherein, The inner electrode includes a first inner electrode and a second inner electrode alternately arranged in the first direction, the first inner electrode being exposed on the third surface and the second inner electrode being exposed on the fourth surface.

15. A multilayer electronic component, comprising: A multilayer portion includes a dielectric layer and an inner electrode alternately disposed in a first direction. The multilayer portion has a first surface and a second surface that are opposite to each other in the first direction, a third surface and a fourth surface that are opposite to each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface that are opposite to each other in a third direction perpendicular to the first direction and the second direction. A protective part is disposed on the third surface and the fourth surface; An outer electrode is disposed on the multilayer portion and the protective portion, and the outer electrode is electrically connected to the inner electrode; as well as Edge portions are disposed on the fifth and sixth surfaces, wherein the average thickness of each of the edge portions is less than or equal to 0.25 times the maximum dimension of the multilayer electronic assembly in the third direction.

16. The multilayer electronic assembly of claim 15, wherein, The edge portion has a composition different from that of the dielectric layer.

17. The multilayer electronic assembly as claimed in claim 15, wherein, The edge portion includes a dielectric material with an average grain size smaller than the average grain size of the dielectric material of the dielectric layer.

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