Anodic bonding positioning device and method of use thereof

Abstract

The application discloses an anode bonding positioning device and a use method thereof in the technical field of microelectronic manufacturing, and relates to the technical field of microelectronic manufacturing. The anode bonding positioning device comprises a frame, a bonding positioning mechanism and a material conveying mechanism. The bonding positioning mechanism comprises a heating disc, a bonding pressure gun, a pressure gun push rod, a pressure gun cam, a rotating rod, a rotating rod support, a baffle cam, a baffle push rod and a positioning baffle. The rotating rod passes through the shaft centers of the pressure gun cam and the baffle cam and is fixedly connected with the pressure gun cam and the baffle cam. The phase difference between the pressure gun cam and the baffle cam is 180 degrees. The rotating rod support is installed on the frame and is used for supporting the rotating rod. The pressure gun push rod is connected with the bonding pressure gun. The pressure gun push rod is matched with the pressure gun cam. The baffle push rod is matched with the baffle cam. The anode bonding positioning device and the use method thereof can realize the continuous production of each step, have simple structures, are low in maintenance cost and suitable for packaging requirements of different sizes.

Description

Technical Field

[0001] This invention relates to the field of microelectronic packaging and microelectromechanical systems manufacturing technology, specifically to an anode bonding positioning device and its usage method. Background Technology

[0002] In the field of microelectronic packaging and microelectromechanical systems (MEMS) device manufacturing, the anodic bonding and encapsulation of glass covers and silicon-based chips is a critical process. Traditional packaging processes typically rely on manual alignment and clamping under a microscope, which is highly dependent on operator experience and has a high rate of occupational injuries. Existing technologies also offer a fully automated vision positioning system based on a dual-field high-resolution industrial camera and a precision motion platform, but this is expensive and has low equipment utilization in small-batch production. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide an anode bonding positioning device and its usage method, which can realize the coordinated and continuous production of each step, and has a simple structure, low maintenance cost, and adaptability to packaging requirements of different sizes.

[0004] To achieve the above objectives, the present invention is implemented using the following technical solution:

[0005] On one hand, the present invention provides an anode bonding positioning device, comprising: a frame, a bonding positioning mechanism, and a material conveying mechanism;

[0006] The bonding positioning mechanism includes a heating plate, a bonding press gun, a press gun push rod, a press gun cam, a rotating rod, a rotating rod support, a baffle cam, a baffle push rod, and a positioning baffle.

[0007] The heating plate is fixedly connected to the frame. The upper surface of the heating plate is provided with a positioning groove with an inclined surface, and the output end of the positioning groove is through. The middle section of the positioning groove is provided with a first guide groove. The baffle push rod is fixedly connected to one end of the positioning baffle. The baffle push rod passes through the first guide groove so that the positioning baffle is set in the positioning groove.

[0008] The rotating rod passes through the axis of the pressure gun cam and the baffle cam, and is fixedly connected to the pressure gun cam and the baffle cam. The phase difference between the pressure gun cam and the baffle cam is 180°. The rotating rod support is mounted on the frame to support the rotating rod. The pressure gun push rod is connected to the bonding pressure gun. The pressure gun push rod cooperates with the pressure gun cam. The baffle push rod cooperates with the baffle cam.

[0009] The material conveying mechanism is connected to the input end of the positioning chute.

[0010] Furthermore, the frame includes a base, a support column, and a work platform, wherein the base is parallel to the work platform, and the support column is supported between the base and the work platform.

[0011] Furthermore, the material conveying mechanism also includes a feeding cylindrical cam, a feeding push rod, a storage container, and a feeding chute;

[0012] The feeding chute is perpendicular to the working platform and is fixedly connected to the working platform. The output end of the feeding chute overlaps with the input end of the positioning chute.

[0013] The storage container is fixedly connected to the working platform, and the output end of the storage container overlaps with the input end of the feeding chute. A second guide groove is provided on one side of the storage container. The feeding cylindrical cam is coaxial with the rotating rod and fixedly connected to one end of the rotating rod. A guide groove is provided on the cylindrical surface of the feeding cylindrical cam. One end of the feeding push rod is slidably connected to the guide groove, and the other end is slidably engaged with the second guide groove. The rotation of the feeding cylindrical cam can be converted into the reciprocating sliding of the feeding push rod along the second guide groove, periodically pushing the workpiece to be bonded in the storage container out from the output end of the storage container. When the feeding push rod slides out of the storage container along the second guide groove to the limit position, the pressure gun cam pushes up the bonding pressure gun.

[0014] Furthermore, the material conveying mechanism also includes a feeding chute baffle, which is fixedly connected to the bonding press gun. When the press gun cam lifts the bonding press gun, the feeding chute baffle rises. When the press gun cam lowers the bonding press gun, the feeding chute baffle blocks the feeding chute.

[0015] Furthermore, the bonding positioning mechanism also includes a pressure gun platform and an insulating support. The pressure gun platform is parallel to the working platform, and the insulating support is supported between the pressure gun platform and the working platform. The pressure gun platform is provided with a third guide groove for cooperating with the bonding pressure gun.

[0016] Furthermore, a fourth guide groove is provided on one side of the working platform in the vertical direction for cooperating with the pressure gun push rod.

[0017] Furthermore, the positioning groove is provided with a positioning recess, one side of which is connected to the positioning baffle.

[0018] On the other hand, the present invention provides a method of using the aforementioned anode bonding positioning device, comprising:

[0019] Initially, the pressure cam lifts the keying pressure gun to its limit position, and the baffle cam lowers the positioning baffle to its limit position;

[0020] Place the part to be bonded into the positioning slide groove, rotate the rod, the baffle cam gradually lifts the positioning baffle, and the pressure gun cam gradually lowers the bonding pressure gun.

[0021] The rotating rod continues to rotate, the baffle cam lifts the positioning baffle to the limit position, the pressure gun cam lowers the bonding pressure gun to the limit position, and the bonding work begins;

[0022] After bonding is completed, the rotary rod continues to rotate, the baffle cam gradually lowers the positioning baffle, and the pressure gun cam gradually lifts the bonding pressure gun;

[0023] The lever continues to rotate, the baffle cam lowers the positioning baffle to the limit position, the pressure gun cam lifts up the keyed pressure gun to the limit position, and returns to the initial state;

[0024] Repeat the above steps until all components to be bonded have been bonded.

[0025] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0026] The anode bonding positioning device provided by the present invention, by setting a bonding positioning mechanism, includes a heating plate, a bonding press gun, a press gun push rod, a press gun cam, a rotating rod, a rotating rod support, a baffle cam, a baffle push rod, and a positioning baffle. The press gun push rod and the baffle push rod are driven by the coaxial press gun cam and the baffle cam, so as to realize the synchronous action of pressing down the bonding press gun and moving up the positioning baffle, ensuring the synchronization and stability of the action, realizing the coordinated continuous production of each step, and having a simple structure, low maintenance cost, and adapting to the packaging requirements of different sizes;

[0027] The anode bonding positioning device provided by the present invention, by setting a material conveying mechanism, including a feeding cylindrical cam, a feeding push rod, a storage container and a feeding chute, wherein the feeding cylindrical cam moves synchronously with the pressure gun cam and the baffle cam on the same axis, can realize the coordinated work of loading and unloading and bonding, the device has a better degree of automation and better integration, and significantly improves production efficiency.

[0028] The anode bonding positioning device provided by the present invention has high positioning accuracy and simple positioning operation by setting a positioning groove on the positioning slide and adopting a ramp positioning structure. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the anode bonding positioning device provided in an embodiment of the present invention;

[0030] Figure 2 This is a first-view structural schematic diagram of the anode bonding positioning device provided in an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the anode bonding positioning device provided in an embodiment of the present invention from a second perspective.

[0032] Figure 4 This is a schematic diagram of the framework provided in an embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of the frame and bonding positioning mechanism provided in an embodiment of the present invention;

[0034] Figure 6 This is a schematic diagram of the frame, bonding and positioning mechanism, and material conveying mechanism provided in the embodiments of the present invention;

[0035] Figure 7 This is an exploded view of the connection of the motor, baffle cam, rotating rod, pressure gun cam and feeding cylindrical cam provided in the embodiment of the present invention;

[0036] Figure 8 This is a mathematical model diagram of the baffle cam provided in an embodiment of the present invention;

[0037] Figure 9 This is a mathematical model diagram of the pressure cam provided in an embodiment of the present invention.

[0038] In the diagram: 1. Frame; 1-1. Base; 1-2. Working platform; 1-3. Support column; 2. Bonding and positioning mechanism; 2-1. Pressure gun cam; 2-2. Pressure gun push rod; 2-3. Pressure gun platform; 2-4. Bonding pressure gun; 2-5. Insulating support column; 2-6. Rotating rod; 2-7. Rotating rod support column; 2-8. Baffle cam; 2-9. Baffle push rod; 2-10. Positioning slide; 2-11. Positioning groove; 2-12. Positioning baffle; 2-13. Heating plate; 2-14. Motor; 3. Material conveying mechanism; 3-1. Feeding cylindrical cam; 3-2. Feeding push rod; 3-3. Storage container; 3-4. Feeding slide; 3-5. Feeding slide baffle; 3-6. Discharge port. Detailed Implementation

[0039] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0040] Example 1

[0041] This embodiment provides an anode bonding positioning device. The workpieces to be bonded are a chip and a glass cover. The anode bonding positioning device, such as... Figure 1 As shown, it includes: frame 1, bonding and positioning mechanism 2 and material conveying mechanism 3.

[0042] like Figure 2 As shown, the frame 1 includes a base 1-1, pillars 1-3 and a working platform 1-2. The base 1-1 is parallel to the working platform 1-2. The four pillars 1-3 are supported at the four corners between the base 1-1 and the working platform 1-2 and are connected to the base 1-1 and the working platform 1-2 by welding.

[0043] like Figure 2 and Figure 3As shown, the bonding positioning mechanism 2 includes a heating plate 2-13, a bonding press gun 2-4, a press gun push rod 2-2, a press gun cam 2-1, a rotating rod 2-6, a rotating rod support 2-7, a baffle cam 2-8, a baffle push rod 2-9, and a positioning baffle 2-12.

[0044] like Figure 4 As shown, the working platform 1-2 has a hole in the middle, and the heating plate 2-13 is fixed in the hole in the middle of the working platform 1-2. The upper surface of the heating plate 2-13 is provided with a positioning groove 2-10 with an inclined surface, and the output end of the positioning groove 2-10 is through to form a discharge port 3-6. The middle section of the positioning groove 2-10 is provided with a first guide groove. The baffle push rod 2-9 is fixedly connected to one end of the positioning baffle 2-12. The baffle push rod 2-9 passes through the first guide groove, so that the positioning baffle 2-12 is set in the positioning groove 2-10.

[0045] In this embodiment, the tilt angle of the positioning slide 2-10 is 25°±2° to facilitate the sliding of the chip and glass cover. The inner wall of the positioning slide 2-10 is embedded with a high-temperature resistant ceramic liner.

[0046] like Figure 7 As shown, the rotating rod 2-6 passes through the axis of the pressure gun cam 2-1 and the baffle cam 2-8, and is fixedly connected to the pressure gun cam 2-1 and the baffle cam 2-8 by a key. The phase difference between the pressure gun cam 2-1 and the baffle cam 2-8 is 180°. The rotating rod support 2-7 is perpendicular to the base 1-1 and welded to the base 1-1 to support the rotating rod 2-6. The output end of the motor 2-14 is connected to the rotating rod 2-6 to drive the rotating rod 2-6 to rotate. The pressure gun push rod 2-2 is a U-shaped rod, one end of which is connected to the keyed pressure gun 2-4, and the other end passes through the working platform 1-2. A limit rod is provided at the bottom of the other end of the pressure gun push rod 2-2. The limit rod at the bottom of the pressure gun push rod 2-2 cooperates with the pressure gun cam 2-1. The baffle push rod 2-9 cooperates with the baffle cam 2-8.

[0047] In this embodiment, the bonding gun 2-4 is equipped with a high-voltage power supply to provide bonding voltage for chip bonding. The heating plate 2-13 is a metal thermally conductive substrate with a high-frequency induction coil surrounding its outer edge. Rapid heating is achieved through the eddy current effect, providing the necessary temperature for chip bonding. A thermistor is embedded inside the heating plate 2-13, and a closed-loop control system adjusts the coil power to maintain the operating temperature within ±3℃ of the set value.

[0048] like Figure 8 The mathematical model diagram of baffle cam 2-8 is shown below. Figure 8As shown, the baffle cam 2-8 has a period of 30 s, a base circle radius of 5 mm, a lift of 2.5 mm, a maximum pressure angle of 27°, a push stroke of 90°, a return stroke of 90°, a near rest angle of 120°, and a far rest angle of 60°.

[0049] like Figure 9 The mathematical model diagram of the pressure cam 2-1 is as follows: Figure 9 As shown, the cycle of the pressure cam 2-1 is 30 s, the base circle radius is 20 mm, the lift is 10 mm, the maximum pressure angle is 27°, the push stroke is 90°, the return stroke is 90°, the near rest angle is 120°, and the far rest angle is 60°.

[0050] like Figure 6 As shown, the material conveying mechanism 3 also includes a feeding cylindrical cam 3-1, a feeding push rod 3-2, a storage container 3-3, and a feeding chute 3-4.

[0051] The feeding chute 3-4 is perpendicular to the working platform 1-2 and is welded to the working platform 1-2. The output end of the feeding chute 3-4 overlaps with the input end of the positioning chute 2-10.

[0052] The storage container 3-3 is fixedly connected to the working platform 1-2 and located next to the feeding chute 3-4. The output end of the storage container 3-3 overlaps with the input end of the feeding chute 3-4. A square second guide groove is provided on one side of the storage container 3-3. The feeding cylindrical cam 3-1 is coaxial with the rotating rod 2-6 and fixedly connected to one end of the rotating rod 2-6. A guide groove is provided on the cylindrical surface of the feeding cylindrical cam 3-1. One end of the feeding push rod 3-2 is slidably connected to the groove, and the other end is slidably engaged with the second guide groove. The rotation of the feeding cylindrical cam 3-1 can be converted into the reciprocating sliding of the feeding push rod 3-2 along the second guide groove, periodically pushing the workpiece to be bonded in the storage container 3-3 out from the output end of the storage container 3-3. When the feeding push rod 3-2 slides out of the storage container 3-3 along the second guide groove to the limit position, the pressure gun cam 2-1 pushes up the bonding pressure gun 2-4.

[0053] The material conveying mechanism 3 also includes a feeding chute baffle 3-5, which is fixedly connected to the bonding press gun 2-4. When the press gun cam 2-1 lifts the bonding press gun 2-4, the feeding chute baffle 3-5 rises. When the press gun cam 2-1 lowers the bonding press gun 2-4, the feeding chute baffle 3-5 blocks the feeding chute 3-4.

[0054] like Figure 5As shown, the bonding positioning mechanism 2 also includes a pressure gun platform 2-3 and an insulating support 2-5. The pressure gun platform 2-3 is parallel to the working platform 1-2, and the insulating support 2-5 is supported between the pressure gun platform 2-3 and the working platform 1-2, which can isolate high voltage. The pressure gun platform 2-3 is provided with a third guide groove, which is used to cooperate with the bonding pressure gun 2-4 to restrict the horizontal movement of the bonding pressure gun 2-4.

[0055] A fourth guide groove is provided on one side of the working platform 1-2 along the vertical direction, which is used to cooperate with the pressure gun push rod 2-2 to restrict the horizontal movement of the pressure gun push rod 2-2.

[0056] The positioning groove 2-10 is provided with a positioning groove 2-11. One side of the positioning groove 2-11 is connected to the positioning baffle 2-12, and the side of the positioning baffle 2-12 is also provided with an auxiliary positioning groove, so that the chip and the glass cover are separated into layers, and the bonding work is more precise.

[0057] Example 2

[0058] This embodiment provides a method for using the anode bonding positioning device provided in Embodiment 1, including:

[0059] Initially, the pressure gun cam 2-1 fully lifts the bonding pressure gun 2-4, the baffle cam 2-8 fully lowers the positioning baffle 2-12, and the feeding push rod 3-2 moves away from the storage container 3-3.

[0060] Place the part to be bonded into the storage container 3-3, start the motor 2-14, the rotating rod 2-6 starts to rotate, the feeding push rod 3-2 slides into the storage container 3-3, and pushes the part to be bonded out to the feeding slide 3-4. At this time, the pressure gun cam 2-1 is fully lowered and the bonding pressure gun 2-4 is fully lowered, and the feeding slide baffle 3-5 is also fully lowered, and the part to be bonded is blocked outside the feeding slide baffle 3-5.

[0061] Rotating rod 2-6 continues to rotate until the pressure gun cam 2-1 fully lifts the bonding pressure gun 2-4 and fully lifts the feeding slide baffle 3-5. The baffle cam 2-8 fully lowers the positioning baffle 2-12, and the bonding part continues to slide down.

[0062] As the rotating rod 2-6 continues to rotate, the baffle cam 2-8 gradually pushes up the positioning baffle 2-12. As the bonding part continues to slide down to the positioning groove 2-11, the pressure gun cam 2-1 gradually lowers the bonding pressure gun 2-4.

[0063] As the rotating rod 2-6 continues to rotate, the baffle cam 2-8 fully lifts the positioning baffle 2-12, and the pressure gun cam 2-1 fully lowers to engage the pressure gun 2-4, thus beginning the bonding operation.

[0064] After bonding is completed, the rotating rod 2-6 continues to rotate until the baffle cam 2-8 is fully lowered to position the baffle 2-12, and the pressure gun cam 2-1 fully lifts the bonding pressure gun 2-4, returning to the initial state;

[0065] Repeat the above steps until all components to be bonded have been bonded.

[0066] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to explain the relative positional relationship and movement between components in a specific posture. If the specific posture changes, the directional indication will also change accordingly. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0067] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0068] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the protection scope of the present invention.

Claims

1. An anode bonding positioning device, characterized in that, The utility model relates to a kind of key bonding positioning mechanism and material conveying mechanism, including: Frame (1), bonding positioning mechanism (2) and material conveying mechanism (3); The bonding positioning mechanism (2) includes heating disc (2-13), bonding pressure gun (2-4), pressure gun push rod (2-2), pressure gun cam (2-1), rotating rod (2-6), rotating rod support (2-7), baffle cam (2-8), baffle push rod (2-9) and positioning baffle (2-12); Wherein, the heating disc (2-13) is fixedly connected to frame (1), the upper surface of the heating disc (2-13) is provided with inclined positioning chute (2-10), and the output end of the positioning chute (2-10) is through, the middle section of the positioning chute (2-10) is provided with first guide slot, the baffle push rod (2-9) is fixedly connected at one end of the positioning baffle (2-12), baffle push rod (2-9) passes through first guide slot, so that positioning baffle (2-12) is arranged in positioning chute (2-10); The rotating rod (2-6) passes through the shaft center of pressure gun cam (2-1) and baffle cam (2-8), and is fixedly connected with pressure gun cam (2-1) and baffle cam (2-8), the phase difference of pressure gun cam (2-1) and baffle cam (2-8) is 180 °, the rotating rod support (2-7) is installed on frame (1), for supporting rotating rod (2-6), the pressure gun push rod (2-2) is connected with bonding pressure gun (2-4), the pressure gun push rod (2-2) is matched with pressure gun cam (2-1), the baffle push rod (2-9) is matched with baffle cam (2-8); The material conveying mechanism (3) is connected with the input end of the positioning chute (2-10).

2. The anodic bonding positioning device according to claim 1, wherein: The frame (1) includes base (1-1), support (1-3) and work platform (1-2), the base (1-1) is parallel with work platform (1-2), the support (1-3) is supported between base (1-1) and work platform (1-2).

3. The anodic bonding positioning device of claim 2, wherein: The material conveying mechanism (3) further includes feeding cylindrical cam (3-1), feeding push rod (3-2), storage container (3-3) and feeding chute (3-4); The feeding chute (3-4) is perpendicular to the work platform (1-2), fixedly connected on the work platform (1-2), the output end of the feeding chute (3-4) is overlapped with the input end of the positioning chute (2-10); The storage container (3-3) is fixedly connected to the working platform (1-2), the output end of the storage container (3-3) is overlapped with the input end of the feeding chute (3-4), and the storage container (3-3) is provided with a second guide groove on one side; the feeding cylindrical cam (3-1) is coaxial with the rotating rod (2-6) and is fixedly connected to one end of the rotating rod (2-6), the cylindrical surface of the feeding cylindrical cam (3-1) is provided with a guide groove, one end of the feeding push rod (3-2) is slidably connected to the guide groove, and the other end is slidably connected to the second guide groove; the rotation of the feeding cylindrical cam (3-1) can be converted into the reciprocating sliding of the feeding push rod (3-2) along the second guide groove, periodically pushing the to-be-bonded parts in the storage container (3-3) to be output from the output end of the storage container (3-3), and when the feeding push rod (3-2) slides out of the storage container (3-3) to the limit position, the press gun cam (2-1) pushes up the bonding press gun (2-4).

4. The anodic bonding positioning apparatus according to claim 3, wherein: The feeding mechanism (3) further comprises a feeding chute baffle (3-5) fixedly connected to the bonding press gun (2-4), when the press gun cam (2-1) lifts the bonding press gun (2-4), the feeding chute baffle (3-5) is lifted, and when the press gun cam (2-1) lowers the bonding press gun (2-4), the feeding chute baffle (3-5) blocks the feeding chute (3-4).

5. The anodic bonding positioning device of claim 2, wherein: The bonding positioning mechanism (2) further comprises a press gun platform (2-3) and an insulating support (2-5), the press gun platform (2-3) is parallel to the working platform (1-2), and the insulating support (2-5) is supported between the press gun platform (2-3) and the working platform (1-2); the press gun platform (2-3) is provided with a third guide groove for cooperating with the bonding press gun (2-4).

6. The anodic bonding positioning device of claim 2, wherein: One side of the working platform (1-2) is provided with a fourth guide groove in the vertical direction for cooperating with the press gun push rod (2-2).

7. The anodic bonding positioning device of claim 1, wherein: The positioning chute (2-10) is provided with a positioning groove (2-11), and one side of the positioning groove (2-11) is connected to the positioning baffle (2-12).

8. A method of using an anodic bonding positioning device as claimed in any one of claims 1 to 7, characterized in that, It comprises: At the beginning, the press gun cam (2-1) lifts the bonding press gun (2-4) to the limit position, and the baffle cam (2-8) lowers the positioning baffle (2-12) to the limit position; Put the to-be-bonded parts into the positioning chute (2-10), rotate the rotating rod (2-6), gradually lift the positioning baffle (2-12) with the baffle cam (2-8), and gradually lower the bonding press gun (2-4) with the press gun cam (2-1); Continue to rotate the rotating rod (2-6), lift the positioning baffle (2-12) to the limit position with the baffle cam (2-8), lower the bonding press gun (2-4) to the limit position with the press gun cam (2-1), and start the bonding work; After the bonding is completed, continue to rotate the rotating rod (2-6), gradually lower the positioning baffle (2-12) to the limit position with the baffle cam (2-8), and gradually lift the bonding press gun (2-4) to the limit position with the press gun cam (2-1), and return to the initial state; Repeat the above steps until all the to-be-bonded parts are bonded.

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