TO-46 die bonder and control method thereof

Abstract

The invention provides a TO-46 die bonder and a control method thereof, and relates to the technical field of die bonders. The TO-46 die bonder comprises a machine table, and a wafer feeding device, a wafer moving swing arm device, a dispensing device, a charging tray bearing device and a charging tray accommodating device which are arranged on the machine table, the charging tray bearing device is used for bearing charging trays, the charging tray containing device is used for containing the charging trays and pushing the charging trays into the charging tray bearing device, and the dispensing device is used for dispensing the charging trays; the number of the wafer feeding devices, the number of the wafer moving swing arm devices and the number of the dispensing devices are all multiple, and the multiple wafer feeding devices are used for bearing blue diaphragms of wafers with different sizes and specifications respectively. And the wafer moving swing arm device transfers the wafers with different sizes and specifications to the charging tray, so that the wafers are fixed on the charging tray. According to the invention, wafers with two dimensions can be simultaneously bonded on one TO-46 packaging tube socket.

Description

Technical Field

[0001] This application relates to the technical field of die bonders, and in particular to a TO-46 die bonder and its control method. Background Technology

[0002] A die bonder uses adhesive to bond wafers to a designated area on a tray, forming an electrical path. Die bonders in related technologies generally include a wafer feeding device, a wafer moving arm device, a dispensing device, a feeding mechanism, a tray transport device, and a receiving mechanism. The feeding mechanism supplies the tray, the dispensing device dispenses adhesive onto the tray, and then the tray enters the tray transport device. The wafer feeding device carries a blue film, which holds the wafers. The wafer moving arm device moves above the blue film, and the wafer feeding device, including a ejector mechanism, lifts the wafer from the blue film. The wafer moving arm then picks up the wafer and transfers it to the tray on the tray transport device, thus bonding the wafer to the tray. The tray transport device then moves the tray, and the receiving mechanism collects the tray from the transport device.

[0003] For a tray with a TO-46 package socket, it is necessary to simultaneously bond two sizes of wafers onto a single TO-46 package socket. Current die bonders can only bond one size of wafer, making it impossible to bond two sizes of wafers simultaneously onto a single TO-46 package socket. This typically requires two separate die bonders, resulting in low processing efficiency and an inability to meet production demands. Summary of the Invention

[0004] In order to simultaneously bond two types of wafers to a single TO-46 package socket, this application provides a TO-46 die bonder and its control method.

[0005] In a first aspect, this application provides a TO-46 die bonder, which adopts the following technical solution: A TO-46 die bonder includes a machine base and a wafer feeding device, a wafer moving arm device, a dispensing device, a tray carrying device, and a tray receiving device disposed on the machine base; the tray carrying device is used to carry the tray, the tray receiving device is used to push the tray into the tray carrying device, and the dispensing device dispenses adhesive onto the tray. Multiple wafer feeding devices, wafer moving arm devices, and dispensing devices are provided. The multiple wafer feeding devices are used to carry blue film sheets of wafers with different sizes and specifications. The wafer moving arm devices transfer wafers of different sizes and specifications to the material tray, so that the wafers are bonded to the material tray.

[0006] By adopting the above technical solution, the tray receiving device pushes the tray into the tray carrying device, and the dispensing device dispenses adhesive onto the tray. This application includes multiple wafer feeding devices, a wafer moving arm device, and a dispensing device. The multiple wafer feeding devices can carry wafers of different sizes and specifications, and the wafer moving arm device transfers wafers of different sizes and specifications onto the tray, thus bonding the wafers onto the tray. Therefore, this application can simultaneously bond wafers of two different sizes onto the TO-46 package sockets on the tray, improving processing efficiency and adapting to production needs.

[0007] Optionally, the tray carrying device includes a tray moving mechanism, a carrying support frame, a carrying rail, and a fixing component; the tray moving mechanism is disposed on the machine platform, the carrying support frame is connected to the tray moving mechanism, the carrying rail is connected to the carrying support frame, the tray receiving device pushes the tray into the carrying rail, and the fixing component fixes the position of the tray.

[0008] By adopting the above technical solution, the tray moving mechanism drives the support frame to move, bringing the support track closer to the tray receiving device, facilitating the tray receiving device to push the tray onto the support track. The fixing component can fix the position of the tray, ensuring the smooth progress of subsequent dispensing and die bonding processes.

[0009] Optionally, the fixing component includes an adsorption carrier, a lifting drive source, and a limiting plate. The adsorption carrier is connected to the lifting drive source and is used to adsorb the material tray. The limiting plate is connected to the bearing support frame. The lifting drive source drives the adsorption carrier to move, so that the material tray is clamped between the adsorption carrier and the limiting plate.

[0010] By adopting the above technical solution, the lifting drive source moves the adsorption carrier upward, causing it to contact the material tray. The adsorption carrier can then adsorb the material tray, improving its stability. The lifting drive source continues to move the adsorption carrier upward, firmly clamping the material tray between the adsorption carrier and the limiting plate, further improving the positional stability of the material tray during processing.

[0011] Optionally, the tray carrying device further includes a pushing mechanism, which includes a pushing component and a limiting pushing plate. The pushing component is connected to the carrying support frame, and the pushing component drives the limiting pushing plate to move, so that the limiting pushing plate pushes the tray located on the carrying track into the tray receiving device.

[0012] By adopting the above technical solution, after the wafer is bonded to the tray, the pushing component drives the limiting push plate, which pushes the tray into the tray receiving device, so that the tray can be recycled after the die bonding is completed, thereby improving the continuity of production and the degree of automation.

[0013] Optionally, the tray receiving device includes a material cylinder, a lifting assembly, and a pushing assembly; the lifting assembly is disposed on the machine platform, the lifting assembly drives the material cylinder to move up and down, the material cylinder is used to receive the tray, and the pushing assembly pushes the tray in the material cylinder onto the bearing track.

[0014] By adopting the above technical solution, the lifting component drives the material cylinder to move up and down, so that the material tray inside the material cylinder is aligned with the bearing rail. Then, the pushing component pushes the material tray inside the material cylinder onto the bearing rail, thus realizing the feeding of the material tray.

[0015] Optionally, the lifting assembly includes a lifting support plate and a lifting drive element. The lifting drive element is connected to the machine base and drives the lifting support plate to move up and down. The material cylinder is detachably connected to the lifting support plate.

[0016] By adopting the above technical solution, the lifting drive component drives the lifting support plate to move up and down, and the lifting support plate drives the material cylinder to move up and down, which is beneficial for aligning the material tray inside the cylinder with the support track. The material cylinder and the lifting support plate are detachably connected, which is convenient for replacing the material cylinder after the material tray inside the cylinder has been die-bonded.

[0017] Optionally, the pushing assembly includes a pushing drive source and a pushing plate, wherein the pushing drive source drives the pushing plate to move, causing the pushing plate to push out the material tray inside the material cylinder.

[0018] By adopting the above technical solution, the drive source drives the push plate to move, which enables the push plate to push the material tray in the barrel onto the bearing track, thereby realizing the feeding of the material tray.

[0019] Optionally, the wafer feeding device includes a wafer feeding moving component, a wafer feeding disk, and a ejector mechanism; the wafer feeding moving component is connected to the machine tool, the wafer feeding disk is disposed on the wafer feeding moving component, the wafer feeding moving component drives the wafer feeding disk to move, and the wafer feeding disk is used to carry blue film; the ejector mechanism is disposed in the wafer feeding disk, and the ejector mechanism lifts the wafer on the blue film.

[0020] By adopting the above technical solution, the crystal supply moving component can drive the crystal supply disk to move, which makes it easy to adjust the position of the crystal on the blue film. The ejector pin mechanism can lift the crystal on the blue film, which makes it easy for the crystal moving arm device to pick up the crystal.

[0021] Optionally, the wafer moving arm device includes a swing arm support, a swing arm drive mechanism, and a moving swing arm; the swing arm support is disposed on the machine base, the swing arm drive mechanism is disposed on the swing arm support, the swing arm drive mechanism drives the moving swing arm to swing and move up and down, and the moving swing arm is used to pick up wafers.

[0022] By adopting the above technical solution, the swing arm drive mechanism drives the moving swing arm to swing and move up and down, so that the moving swing arm can flexibly move above the wafer feeding device to pick up the wafer and transfer the wafer to the tray.

[0023] Secondly, this application also provides a control method for a TO-46 die bonder, which includes the following steps using the aforementioned TO-46 die bonder: S1: The material tray moving mechanism drives the bearing support frame to move, so that the bearing track is close to the material cylinder; the lifting component drives the material cylinder to move, so that the material tray in the material cylinder is aligned with the bearing track; the pushing component pushes the material tray in the material cylinder into the bearing track. S2: The fixing component fixes the position of the material tray, and then the material tray moving mechanism drives the material tray to the predetermined position, and the dispensing device dispenses glue onto the material tray; S3: After dispensing the adhesive onto the tray, multiple wafer moving arm devices transfer wafers of different sizes and specifications from the wafer feeding device to the tray, so that the wafers are bonded to the tray. S4: The fixing component releases the fixing of the tray, the tray moving mechanism drives the bearing rail to move and align with the material cylinder, and then the pushing mechanism pushes the tray on the bearing rail into the material cylinder.

[0024] By adopting the above technical solution, the material tray inside the barrel can be pushed to the bearing track, the position of the material tray can be fixed and moved to the predetermined position for dispensing. It can simultaneously bond two different sizes of wafers onto one material tray, improving processing efficiency to meet production needs. It can also push the material tray back into the barrel after bonding for easy subsequent operations.

[0025] In summary, this application includes at least one of the following beneficial effects: 1. Multiple wafer feeding devices carry blue film wafers of different sizes and specifications. The wafer moving arm device transfers wafers of different sizes and specifications to the material tray, which is beneficial to simultaneously die bond wafers of different sizes and specifications onto a TO-46 package socket, improving processing efficiency and better adapting to production needs. 2. The lifting drive source moves the adsorption carrier upward, bringing it into contact with the material tray. The adsorption carrier then adsorbs the material tray, improving its stability. The lifting drive source continues to move the adsorption carrier upward, firmly clamping the material tray between the adsorption carrier and the limiting plate, further enhancing the positional stability of the material tray during processing. 3. The drive source moves the push plate, which pushes the tray in the barrel onto the carrying track to load the tray. After the wafer is bonded to the tray, the drive component drives the limit push plate, which pushes the tray into the barrel, so that the tray can be recycled after the die bonding is completed, improving the continuity of production and the degree of automation. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of a TO-46 die bonder according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of the tray carrying device and the tray receiving device according to the embodiments of this application; Figure 3 This is an exploded structural diagram of the material tray support device according to an embodiment of this application; Figure 4 This is an exploded structural diagram of the tray receiving device according to an embodiment of this application.

[0027] Explanation of reference numerals in the attached drawings: 1. Machine base; 2. Wafer feeding device; 21. Wafer feeding moving assembly; 22. Wafer feeding tray; 23. Ejector pin mechanism; 3. Wafer moving swing arm device; 31. Swing arm support base; 32. Swing arm drive mechanism; 33. Moving swing arm; 34. Blue film station visual inspection component; 4. Dispensing device; 5. Tray carrying device; 51. Tray moving mechanism; 52. Carrying support frame; 53. Carrying track; 54. Fixing assembly; 541. Adsorption tray; 542. Lifting drive source; 543. Limiting plate; 55. Pushing mechanism; 551. Pushing assembly; 552. Limiting push plate; 6. Tray receiving device; 61. Material cylinder; 62. Lifting assembly; 621. Lifting carrying plate; 622. Lifting drive element; 63. Pushing assembly; 631. Pushing drive source; 632. Pushing plate; 633. Protective shell. Detailed Implementation

[0028] The following combination Figures 1 to 4 This application will be described in further detail.

[0029] Embodiment 1 of this application provides a TO-46 die bonder.

[0030] refer to Figure 1 A TO-46 die bonder includes a machine base 1, a wafer feeding device 2, a wafer moving arm device 3, a dispensing device 4, a tray carrying device 5, and a tray receiving device 6. The wafer feeding device 2 provides wafers, the tray receiving device 6 holds a tray, and the tray receiving device 6 pushes the tray onto the tray carrying device 5. The dispensing device 4 dispenses adhesive onto the tray. The wafer moving arm device 3 transfers the wafers from the wafer feeding device 2 to the tray on the tray carrying device 5, thus bonding the wafers to the tray.

[0031] refer to Figure 2 and Figure 3The tray carrying device 5 includes a tray moving mechanism 51, a support frame 52, and a carrying track 53. The tray moving mechanism 51 is specifically a two-axis linear module. The body of the tray moving mechanism 51 is fixedly connected to the machine base 1. The support frame 52 is fixedly connected to the moving end of the tray moving mechanism 51. The tray moving mechanism 51 can drive the support frame 52 to move two-dimensionally on a horizontal plane. The carrying track 53 is fixedly connected to the support frame 52 and is horizontally positioned. The carrying track 53 is used to carry the tray.

[0032] refer to Figure 2 The material tray receiving device 6 includes a material cylinder 61, a lifting assembly 62, and a pushing assembly 63. The lifting assembly 62 includes a lifting support plate 621 and a lifting drive element 622. The lifting drive element 622 specifically adopts a linear module. The body of the lifting drive element 622 is fixedly connected to the machine base 1, and the lifting support plate 621 is fixedly connected to the output end of the lifting drive element 622. The material cylinder 61 is detachably connected to the lifting support plate 621, and the material cylinder 61 contains multiple layers of material trays. The lifting drive element 622 drives the lifting support plate 621 to move up and down, thereby driving the material cylinder 61 to move up and down.

[0033] refer to Figure 2 and Figure 4 The pushing assembly 63 includes a push drive source 631, a push plate 632, and a protective shell 633. The protective shell 633 is fixedly connected to the body of the lifting drive element 622. The push drive source 631 is specifically an electric push rod. The body of the push drive source 631 is fixedly connected to the protective shell 633, and the push plate 632 is fixedly connected to the output end of the push drive source 631.

[0034] refer to Figure 3 and Figure 4 The material tray moving mechanism 51 drives the support frame 52 to approach the material cylinder 61, and the lifting component 62 drives the material cylinder 61 to move up and down, so that the material tray in the material cylinder 61 is aligned with the support rail 53. Then, the drive source 631 drives the push plate 632 to move horizontally, so that the push plate 632 can push the material tray in the material cylinder 61 horizontally onto the support rail 53, thereby realizing the feeding of the material tray.

[0035] refer to Figure 2 and Figure 3The material tray carrying device 5 also includes a fixing component 54, which includes an adsorption tray 541, a lifting drive source 542, and a limiting plate 543. The limiting plate 543 is fixedly connected to the top side of the support frame 52. The lifting drive source 542 is specifically an electric push rod. The body of the lifting drive source 542 is fixedly connected to the support frame 52, and the output end of the lifting drive source 542 is fixedly connected to the adsorption tray 541. The lifting drive source 542 drives the adsorption tray 541 to move upward. The adsorption tray 541 contacts the material tray located on the support track 53 and adsorbs it. The adsorption tray 541 continues to drive the material tray to move upward, so that the material tray is clamped between the limiting plate 543 and the adsorption tray 541, improving the stability of the material tray.

[0036] refer to Figure 1 and Figure 2 A dispensing port is provided in the middle of the limiting plate 543, and the dispensing port exposes the TO-46 packaging tube seat on the material tray. The dispensing device 4 is set on the machine 1, and the dispensing device 4 dispenses glue to the TO-46 packaging tube seat on the material tray through the dispensing port.

[0037] refer to Figure 1 The wafer feeding device 2 includes a wafer feeding moving assembly 21, a wafer feeding tray 22, and a ejector mechanism 23. In this embodiment, the wafer feeding moving assembly 21 specifically adopts a two-axis linear module. The body of the wafer feeding moving assembly 21 is fixedly connected to the machine base 1, and the wafer feeding tray 22 is fixedly connected to the moving end of the wafer feeding moving assembly 21. The wafer feeding moving assembly 21 drives the wafer feeding tray 22 to move two-dimensionally on a horizontal plane. The wafer feeding tray 22 is used to carry a blue film, on which the wafer is carried. The ejector mechanism 23 is fixedly connected inside the wafer feeding tray 22. The ejector mechanism 23 can lift the blue film, thereby lifting the wafer on the blue film to facilitate wafer feeding.

[0038] refer to Figure 1The wafer moving swing arm device 3 includes a swing arm support base 31, a swing arm drive mechanism 32, a moving swing arm 33, and a blue film station visual inspection component 34. The swing arm drive mechanism 32 includes a rotation drive component and a lifting drive component. In this embodiment, the rotation drive component is specifically a motor, and the lifting drive component is specifically an electric push rod. The swing arm support base 31 is fixedly connected to the machine base 1. The body of the rotation drive source component is fixedly connected to the swing arm support base 31. The body of the lifting drive component is fixedly connected to the output end of the rotation drive source component, and the output end of the lifting drive component is fixedly connected to the moving swing arm 33. The rotation drive component drives the lifting drive component to rotate, thereby driving the moving swing arm 33 to rotate. The lifting drive component can drive the moving swing arm 33 to move up and down; that is, the swing arm drive mechanism 32 can drive the moving swing arm 33 to rotate and move up and down. The end of the movable swing arm 33 has a suction nozzle. When the swing arm drive mechanism 32 drives the movable swing arm 33 to move above the die supply tray 22, the ejector pin mechanism 23 lifts the die, the movable swing arm 33 picks up the die, and then the movable swing arm 33 drives the die to be placed on the TO-46 package socket of the tray.

[0039] refer to Figure 1 The blue film station visual inspection component 34 is fixedly connected to the swing arm support 31. In this embodiment, the blue film station visual inspection component 34 is specifically a camera. The blue film station visual inspection component 34 can capture images of the wafers on the blue film, thereby detecting the position of the wafers and making the position of the moving swing arm 33 more accurate when picking up the wafers.

[0040] refer to Figure 1 Two wafer feeding devices 2, two wafer moving arm devices 3, and two dispensing devices 4 are provided. The two dispensing devices 4 dispense adhesive to the TO-46 packaging sockets of the material tray. The two wafer feeding devices 2 carry wafers of different sizes and specifications. The two wafer moving arm devices 3 transfer the two different sizes and specifications of wafers to the TO-46 packaging sockets of the material tray, so that the wafers are bonded to the TO-46 packaging sockets of the material tray.

[0041] refer to Figure 2 and Figure 3The tray carrying device 5 also includes a pushing mechanism 55, which includes a pushing component 551 and a limiting pushing plate 552. The pushing component 551 specifically adopts a belt drive structure and is mounted on the carrying support frame 52. The pushing component 551 includes a motor, a pulley, and a belt, with the belt sleeved on the pulley. The limiting pushing plate 552 is slidably connected to the carrying rail 53 and fixedly connected to the belt. The initial position of the limiting pushing plate 552 is located on the side of the carrying rail 53 away from the tray receiving device 6. During the process of the tray receiving device 6 pushing the tray onto the carrying rail 53, the movement stops when the tray comes into contact with the limiting pushing plate 552, thus limiting the movement of the tray. After the current tray has finished solidifying, the tray moving mechanism 51 moves the support rail 53 closer to the cylinder 61. The lifting drive source 542 drives the adsorption tray 541 downward, so that the tray is positioned on the support rail 53, and the adsorption tray 541 releases its adsorption on the tray. Then, the motor drives the pulley to rotate, the pulley drives the belt to move, and the belt drives the limit push plate 552 to slide. The limit push plate 552 pushes the tray on the support rail 53 into the cylinder 61, realizing the unloading of the current tray. Then, the lifting component 62 drives the cylinder 61 to move, so that the next tray in the cylinder 61 is aligned with the support rail 53. The pushing component 63 pushes the next tray into the support rail 53, realizing the loading of the next tray.

[0042] This application also provides a control method for a TO-46 die bonder, including the following steps: S1: The material tray moving mechanism 51 drives the bearing support frame 52 to move, so that the bearing track 53 is close to the material cylinder 61; the lifting component 62 drives the material cylinder 61 to move, so that the material tray in the material cylinder 61 is aligned with the bearing track 53, and the pushing component 63 pushes the material tray in the material cylinder 61 onto the bearing track 53. S2: The fixing component 54 fixes the position of the material tray, and then the material tray moving mechanism 51 drives the material tray to the predetermined position, and the dispensing device 4 dispenses glue to the material tray; S3: After dispensing adhesive onto the tray, multiple wafer moving arm devices 3 transfer wafers of different sizes and specifications from the wafer feeding device 2 to the tray, so that the wafers are bonded to the tray. S4: The fixing component 54 releases the fixing of the tray, the tray moving mechanism 51 drives the bearing rail 53 to move and align with the material cylinder 61, and then the pushing mechanism 55 pushes the tray on the bearing rail 53 into the material cylinder 61.

[0043] The implementation principle of a TO-46 die bonder according to an embodiment of this application is as follows: A tray moving mechanism 51 moves a support frame 52, causing the support track 53 to approach the cylinder 61. A lifting assembly 62 moves the cylinder 61, aligning the tray inside the cylinder 61 with the support track 53. A pushing assembly 63 pushes the tray from the cylinder 61 onto the support track 53. Then, a fixing assembly 54 fixes the tray, and the tray moving mechanism 51 moves the support frame 52 towards the dispensing device 4. The dispensing device 4 then dispenses adhesive onto the TO-46 packaging socket on the tray. A wafer moving arm 3 moves wafers of different sizes onto the TO-46 packaging socket, thus bonding the wafers to the TO-46 packaging socket. Subsequently, the fixing assembly 54 releases the tray, the tray moving mechanism 51 moves the support frame 52 towards the cylinder 61, and a pushing mechanism 55 pushes the tray located on the support track 53 into the cylinder 61, thus unloading the tray.

[0044] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A TO-46 die bonder, characterized in that, It includes a machine base (1) and a wafer feeding device (2), a wafer moving arm device (3), a dispensing device (4), a tray carrying device (5) and a tray receiving device (6) disposed on the machine base (1). The tray support device (5) is used to support the tray, the tray receiving device (6) is used to receive the tray and push the tray into the tray support device (5), and the dispensing device (4) dispenses glue onto the tray. The wafer feeding device (2), the wafer moving arm device (3) and the dispensing device (4) are all provided in multiple ways. The multiple wafer feeding devices (2) are used to carry blue film wafers with different sizes and specifications. The wafer moving arm device (3) transfers wafers of different sizes and specifications to the material tray, so that the wafers are solidified on the material tray.

2. The TO-46 die bonder according to claim 1, characterized in that, The tray carrying device (5) includes a tray moving mechanism (51), a carrying support frame (52), a carrying rail (53), and a fixing component (54); the tray moving mechanism (51) is mounted on the machine base (1), the carrying support frame (52) is connected to the tray moving mechanism (51), the carrying rail (53) is connected to the carrying support frame (52), the tray receiving device (6) pushes the tray into the carrying rail (53), and the fixing component (54) fixes the position of the tray.

3. A TO-46 die bonder according to claim 2, characterized in that, The fixing component (54) includes an adsorption tray (541), a lifting drive source (542), and a limiting plate (543). The adsorption tray (541) is connected to the lifting drive source (542) and is used to adsorb the material tray. The limiting plate (543) is connected to the bearing support frame (52). The lifting drive source (542) drives the adsorption tray (541) to move, so that the material tray is clamped between the adsorption tray (541) and the limiting plate (543).

4. A TO-46 die bonder according to claim 2, characterized in that, The tray carrying device (5) further includes a pushing mechanism (55), which includes a pushing component (551) and a limiting pushing plate (552). The pushing component (551) is connected to the carrying support frame (52). The pushing component (551) drives the limiting pushing plate (552) to move, so that the limiting pushing plate (552) pushes the tray located on the carrying track (53) into the tray receiving device (6).

5. A TO-46 die bonder according to claim 2, characterized in that, The tray receiving device (6) includes a material cylinder (61), a lifting assembly (62), and a pushing assembly (63); the lifting assembly (62) is mounted on the machine base (1), the lifting assembly (62) drives the material cylinder (61) to move up and down, the material cylinder (61) is used to receive the tray, and the pushing assembly (63) pushes the tray in the material cylinder (61) onto the bearing rail (53).

6. A TO-46 die bonder according to claim 5, characterized in that, The lifting assembly (62) includes a lifting support plate (621) and a lifting drive element (622). The lifting drive element (622) is connected to the machine base (1). The lifting drive element (622) drives the lifting support plate (621) to move up and down. The material cylinder (61) is detachably connected to the lifting support plate (621).

7. A TO-46 die bonder according to claim 5, characterized in that, The feeding assembly (63) includes a driving source (631) and a push plate (632). The driving source (631) drives the push plate (632) to move, so that the push plate (632) pushes out the material tray in the material cylinder (61).

8. A TO-46 die bonder according to claim 1, characterized in that, The wafer feeding device (2) includes a wafer feeding moving component (21), a wafer feeding disk (22), and a ejector mechanism (23); the wafer feeding moving component (21) is connected to the machine base (1), the wafer feeding disk (22) is disposed on the wafer feeding moving component (21), the wafer feeding moving component (21) drives the wafer feeding disk (22) to move, and the wafer feeding disk (22) is used to carry the blue film; the ejector mechanism (23) is disposed in the wafer feeding disk (22), and the ejector mechanism (23) lifts the wafer on the blue film.

9. A TO-46 die bonder according to claim 1, characterized in that, The wafer moving arm device (3) includes a swing arm support base (31), a swing arm drive mechanism (32), and a moving swing arm (33); the swing arm support base (31) is disposed on the machine base (1), the swing arm drive mechanism (32) is disposed on the swing arm support base (31), the swing arm drive mechanism (32) drives the moving swing arm (33) to swing and move up and down, and the moving swing arm (33) is used to pick up wafers.

10. A control method for a TO-46 die bonder, characterized in that, Using the TO-46 die bonder as described in any one of claims 1-9, the process includes the following steps: S1: The material tray moving mechanism (51) drives the bearing support frame (52) to move, so that the bearing track (53) is close to the material cylinder (61); the lifting component (62) drives the material cylinder (61) to move, so that the material tray in the material cylinder (61) is aligned with the bearing track (53), and the pushing component (63) pushes the material tray in the material cylinder (61) onto the bearing track (53); S2: The fixing component (54) fixes the position of the tray, and then the tray moving mechanism (51) drives the tray to move to the predetermined position, and the dispensing device (4) dispenses glue onto the tray; S3: After dispensing the adhesive onto the tray, multiple wafer moving arm devices (3) transfer wafers of different sizes and specifications from the wafer feeding device (2) to the tray, so that the wafers are bonded to the tray. S4: The fixing component (54) releases the fixing of the tray, the tray moving mechanism (51) drives the bearing rail (53) to move and align with the cylinder (61), and then the pushing mechanism (55) pushes the tray on the bearing rail (53) into the cylinder (61).

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