A high light extraction semiconductor lead frame processing device and products thereof

Abstract

The application discloses a high-light-extraction semiconductor lead frame processing device and a product thereof, and relates to the technical field of semiconductor lead frames, and comprises a main unit, a pressing unit and a receiving unit arranged in sequence at the bottom of the main unit. Through the cooperation of the receiving plate and the moving plate, the position limitation of the bayonet and the protruding column one, and the accommodation of the receiving plate and the accommodating cavity, the position of the solder pad after stamping is limited after stamping dispersion, so that the movement of the receiving unit does not affect the solder pad, the pre-stamping does not affect the subsequent process, the problem that the solder pad is easily damaged and the processing precision is excessively deviated in the subsequent process is avoided, and in addition to solving the influence of the pre-processing and post-stamping stripping on the chip welding and packaging, the problem that the whole strip needs to be placed regularly after being stamped into a small strip before the next process is avoided, and the pre-stamping process is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor lead frame technology, and in particular to a high light-emitting semiconductor lead frame processing apparatus and its products. Background Technology

[0002] The lead frame is a semiconductor component formed by processing thin strips, and its bottom is often fitted with a cup bottom to support the lead frame.

[0003] Chinese patent CN118636382A discloses a semiconductor lead frame processing equipment and product for automotive interactive taillights, relating to the field of semiconductor technology. It includes a work stand unit and an integrated processing unit, with several integrated processing units arranged on the top of the operating table. The integrated processing unit lowers the push-out base plate to press and position the roll material inside the positioning frame and restricts the pre-welded electrical test pins on the top of the roll material, reducing the offset of the electrical test pins during the stamping process. The stamping block and the electrical test pins, when pressed together, form an injection channel communicating with the structural cavity, thus completing the stamping modeling. Specifically, the roll material between the central hollow block, the push-out base plate, the stamping block, the ring plate, and the top surface of the support plate forms a structural cavity, which in turn forms a sealed mold cavity with the positioning frame. This allows the reaction cup sidewalls and the reaction cup mouth to be injection molded inside the mold cavity, reducing the time required for re-clamping and re-injection molding after stamping.

[0004] The aforementioned patents and prior art have the following problems:

[0005] Existing lead frames are all welded and packaged on a single thin strip of material before being peeled off. This final separation process often results in uneven stress distribution due to mechanical stamping, which can easily cause damage to the solder joints and the package of the lead frame, thus affecting the processing quality of the lead frame. Summary of the Invention

[0006] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0008] A high-light-emission semiconductor lead frame processing apparatus, comprising:

[0009] The main body unit has a pressing unit and a receiving unit arranged sequentially at its bottom;

[0010] The receiving unit includes a movable plate, the surface of which is provided with a plurality of receiving cavities. A plurality of protruding posts are staggered on the symmetrical sides of the receiving cavities. A plug is movably provided on the side of the receiving cavities corresponding to the side of the movable plate. The receiving cavities are movably engaged by the protruding posts and the slots. The slots are provided on the side of the receiving plate.

[0011] The pressing unit includes a punch head, which is located on the top of the receiving plate. The inner side of the punch head is provided with a second protrusion corresponding to the first protrusion. The punch head and the receiving plate are closed to punch the whole strip into a small strip. After being punched, the small strip is snapped into the space at the top of the receiving plate, the inner side of the receiving cavity, and the bottom of the insertion rod.

[0012] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0013] The main unit includes a stamping frame, a stamping source is mounted on the top of the stamping frame, a placement frame is fixedly connected to the bottom of the stamping frame, a stopper rod is fixedly connected to the output end of the bottom of the stamping source, and a mounting plate is fixedly connected to the bottom of the stopper rod.

[0014] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0015] A support frame is fixedly connected to the side of the stamping frame, a screw is rotatably mounted on the top of the support frame, a movable drive source is installed on the side of the support frame, and the output shaft of the movable drive source passes through the support frame and is fixedly connected to the screw.

[0016] A seat plate is slidably disposed on the surface of the screw. The interior of the seat plate is elastically connected to a resetting member and a folding plate. Several rollers are rotatably disposed on one side of the folding plate opposite to the moving plate.

[0017] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0018] The receiving unit includes a movable frame, a lifting drive source is installed at the bottom of the movable frame, a displacement plate is fixedly connected to the top of the output shaft of the lifting drive source, and a number of movable rods are installed on the surface of the displacement plate.

[0019] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0020] A receiving plate is fixedly connected to the top of the movable rod. The receiving plate is movably disposed inside the receiving cavity. The receiving cavity is opened inside the movable plate and the storage cavity. Several storage cavities are disposed inside the fixed plate. The storage cavity at the bottom outer side of the fixed plate is fixedly connected to the movable frame.

[0021] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0022] The surface of the side of the moving plate is provided with several positioning guide posts, and the bottom of the moving plate is fixedly connected to a reset member two. The moving plate is elastically connected to the fixed plate through the reset member two.

[0023] A synchronization plate is fixedly connected to the side of the moving plate, and the bottom of the synchronization plate is fixedly connected to the output shaft of the locking drive source. The bottom of the locking drive source is fixedly connected to the storage cavity through a base plate.

[0024] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0025] The moving plate has a liquid chamber filled with hydraulic oil. A through hole is located at the bottom of the liquid chamber, and a trigger block is positioned thereon. The trigger block, through a rod at its top passing through the through hole, is fixedly connected to a piston inside the liquid chamber. A perforation is located on the side of the liquid chamber closest to the receiving plate. The perforation is movably connected to a sealing ring and a rod. A piston is installed on the part of the rod inside the liquid chamber. The side of the rod opposite to the liquid chamber is elastically connected to a reset member and a storage slot located inside the moving plate.

[0026] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0027] Several stamping heads are disposed at the bottom of the placement rack. The surface of the placement rack is symmetrically provided with horizontal bars. The stamping heads are provided with spaces to accommodate stacked plates corresponding to the internal positions of the placement rack. The protruding columns inside the stamping heads extend into the internal space of the placement rack.

[0028] As a preferred embodiment of the high light yield semiconductor lead frame processing apparatus of the present invention, wherein:

[0029] Support rods are provided at the four corners of the bottom of the stacking plate. The stacking plate is movably engaged by the slots and protrusions on its side. A locking strip is movably provided at the bottom of the placement frame. The locking strip passes through the placement frame and is fixedly connected to the connecting plate at the bottom of the crossbar.

[0030] Another object of the present invention is to address the shortcomings of the prior art by providing a high light-emitting semiconductor lead frame product, comprising:

[0031] The lead frame includes pads, and the sides of the pads are provided with cup bottoms. The corners of the cup bottoms are composed of three rounded corners and one chamfer. The symmetrical sides of the pads are provided with a number of slots.

[0032] The beneficial effects of this invention are:

[0033] By cooperating with the receiving plate and the moving plate, as well as limiting the position of the bayonet and the protruding post, and accommodating the receiving plate and the receiving cavity, the position of the stamped pads is restricted after stamping and dispersion. This prevents the moving receiving unit from affecting the pads and ensures that pre-stamping does not affect subsequent processes. It avoids the problems of pads being easily damaged and excessive deviation in processing accuracy during subsequent processes. In addition to solving the impact of pre-processing and post-stamping stripping on chip soldering and packaging, it also avoids the problem of having to place the small strips neatly one by one before proceeding to the next process after the entire strip is stamped into small strips, thus avoiding the tedious pre-stamping process. Attached Figure Description

[0034] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below, wherein:

[0035] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0036] Figure 2 for Figure 1 A magnified structural diagram of part A in the middle;

[0037] Figure 3 This is a schematic diagram showing the connection between the receiving unit and the pressing unit of the present invention;

[0038] Figure 4 This is a schematic diagram of the front structure connection of the receiving unit of the present invention;

[0039] Figure 5 This is a schematic diagram of the side structure connection of the receiving unit of the present invention;

[0040] Figure 6 for Figure 4 A magnified structural diagram of part B in the middle section;

[0041] Figure 7 for Figure 4 A magnified structural diagram of section C;

[0042] Figure 8 This is a schematic diagram of the internal structure of the storage cavity of the present invention;

[0043] Figure 9 for Figure 8 A magnified structural diagram of section D in the middle;

[0044] Figure 10 This is a schematic diagram of the bottom structure connection of the pressing unit of the present invention;

[0045] Figure 11This is a schematic diagram of the internal structure connection of the placement rack of the present invention;

[0046] Figure 12 This is a schematic diagram of the lead frame structure connection of the present invention;

[0047] Figure 13 This is a schematic diagram of the surface structure connection of the pads in this invention.

[0048] In the picture:

[0049] 1. Main body unit; 101. Stamping frame; 1011. Placement frame; 102. Stamping source; 103. Piston rod; 104. Mounting plate; 105. Support frame; 1051. Motion drive source; 1052. Screw; 1053. Seat plate; 1054. Folding plate; 1055. Roller; 1056. Reset component one;

[0050] 2. Receiving unit; 201. Moving frame; 2011. Handrail; 2012. Lifting drive source; 2013. Displacement plate; 2014. Movable rod; 202. Fixed plate; 2021. Storage cavity; 2022. Base plate; 2023. Locking drive source; 2024. Synchronization plate; 203. Moving plate; 2031. Positioning guide post; 2032. Receiving cavity; 2033. Protruding post one; 2034. Reset component two; 2035. Trigger block; 2036. Liquid cavity; 2037. Insert rod; 2038. Storage slot; 2039. Reset component three; 204. Receiving plate; 2041. Slot one;

[0051] 3. Pressing unit; 301. Placement rack; 3011. Crossbar; 3012. Connecting plate; 30121. Locking strip; 302. Punching head; 3021. Protruding column two; 303. Stacking plate; 3031. Locking groove two; 3032. Support rod;

[0052] 4. Lead frame; 401. Pad; 402. Cup bottom; 403. Corner; 404. Bayonet. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] Example 1: This embodiment is an example Figures 1-11 As shown, a high-luminosity semiconductor lead frame processing apparatus includes:

[0055] The main body unit 1 has a pressing unit 3 and a receiving unit 2 arranged sequentially at its bottom.

[0056] The receiving unit 2 includes a movable plate 203. The surface of the movable plate 203 is provided with a plurality of receiving cavities 2032. The sides of the receiving cavities 2032 are symmetrically and alternately provided with a plurality of protruding posts 2033. The receiving cavities 2032 are movably provided with insert rods 2037 on the side of the movable plate 203. The receiving cavities 2032 are movably engaged by the protruding posts 2033 and the slots 2041. The slots 2041 are provided on the side of the receiving plate 204.

[0057] The pressing unit 3 includes a punch head 302, which is disposed on the top of the receiving plate 204. The inner side of the punch head 302 is provided with a second protrusion 3021 corresponding to the first protrusion 2033. The punch head 302 and the receiving plate 204 are closed to punch the whole strip into a small strip. After being punched, the small strip is snapped into the space at the top of the receiving plate 204, the inner side of the receiving cavity 2032, and the bottom of the insertion rod 2037.

[0058] like Figures 1-2 As shown, the main unit 1 includes a stamping frame 101, a stamping source 102 is mounted on the top of the stamping frame 101, and a placement frame 1011 is fixedly connected to the bottom of the stamping frame 101. The stamping source 102 is preferably a PLC-controlled hydraulic cylinder. A stopper rod 103 is fixedly connected to the output end of the bottom of the stamping source 102, and a mounting plate 104 is fixedly connected to the bottom of the stopper rod 103.

[0059] like Figures 2-3 As shown, a support frame 105 is fixedly connected to the side of the stamping frame 101, a screw 1052 is rotatably provided on the top of the support frame 105, a mobile drive source 1051 is installed on the side of the support frame 105, and the output shaft of the mobile drive source 1051 passes through the support frame 105 and is fixedly connected to the screw 1052.

[0060] A seat plate 1053 is slidably disposed on the surface of the screw 1052. The interior of the seat plate 1053 is elastically connected to the folding plate 1054 via a reset member 1056. Several rollers 1055 are rotatably disposed on one side of the folding plate 1054 opposite to the moving plate 203. Each roller 1055 is composed of a steel column and a rubber layer covering its surface. The two sides of the steel column are rotatably connected to the folding plate 1054 via cylinders on its sides. The moving drive source 1051 is preferably a PLC-controlled geared motor. The screw 1052 is preferably a ball screw. A ball screw nut that cooperates with the ball screw is disposed inside the seat plate 1053. The reset member 1056 is preferably a spring.

[0061] like Figures 3-4As shown, the receiving unit 2 includes a movable frame 201, a handrail 2011 is installed on the side of the movable frame 201, and a lifting drive source 2012 is installed at the bottom of the movable frame 201. The lifting drive source 2012 is preferably an electric telescopic cylinder or a PLC-controlled cylinder that is powered by a battery.

[0062] A displacement plate 2013 is fixedly connected to the top of the output shaft of the lifting drive source 2012, and a number of movable rods 2014 are installed on the surface of the displacement plate 2013.

[0063] like Figures 4-8 As shown, a receiving plate 204 is fixedly connected to the top of the movable rod 2014. The receiving plate 204 is movably disposed inside the receiving cavity 2032. The receiving cavity 2032 is opened inside the movable plate 203 and the storage cavity 2021. Several storage cavities 2021 are disposed inside the fixed plate 202. The storage cavity 2021 at the bottom outer side of the fixed plate 202 is fixedly connected to the movable frame 201.

[0064] like Figures 6-7 As shown, a plurality of positioning guide posts 2031 are provided on the side surface of the moving plate 203, and a reset member 2034 is fixedly connected to the bottom of the moving plate 203. The moving plate 203 is elastically connected to the fixed plate 202 through the reset member 2034.

[0065] A synchronization plate 2024 is fixedly connected to the side of the moving plate 203. The bottom of the synchronization plate 2024 is fixedly connected to the output shaft of the locking drive source 2023. The bottom of the locking drive source 2023 is fixedly connected to the storage cavity 2021 through the base plate 2022. The number of locking drive sources 2023 is preferably two, symmetrically arranged on the front and rear sides of the moving frame 201. The locking drive source 2023 is preferably a battery-powered electric telescopic cylinder or a PLC-controlled cylinder.

[0066] like Figures 8-9As shown, the moving plate 203 has a liquid chamber 2036 inside, which is filled with hydraulic oil. A through hole is formed at the bottom of the liquid chamber 2036, and a trigger block 2035 is located at the bottom of the liquid chamber 2036. The trigger block 2035 is fixedly connected to the piston inside the liquid chamber 2036 after its top rod passes through the through hole. A perforation is formed on the side of the liquid chamber 2036 closest to the receiving plate 204, and a sealing ring and a rod 203 pass through the interior of the perforation. 7. Movable connection: The portion of the insert rod 2037 located inside the liquid chamber 2036 is fitted with a piston. The side of the insert rod 2037 opposite to the liquid chamber 2036 is elastically connected via a reset component 2039 and a storage groove 2038. The storage groove 2038 is located inside the moving plate 203, and hydraulic oil is provided between the two pistons. The liquid chamber 2036 has an oil inlet with a plug on the surface of the moving plate 203. The reset component 2034 and the reset component 2039 are preferably springs.

[0067] like Figures 10-11 As shown, several stamping heads 302 are disposed at the bottom of the placement rack 301. The surface of the placement rack 301 is symmetrically provided with horizontal bars 3011. The horizontal bars 3011 are movably engaged with the inner side of the mounting plate 104 and are threadedly connected to the threaded holes on the surface of the horizontal bars 3011 by bolts passing through the mounting plate 104. The stamping heads 302 are provided with spaces to accommodate stacked plates 303 corresponding to the internal position of the placement rack 301. The protruding columns 3021 inside the stamping heads 302 extend into the internal space of the placement rack 301.

[0068] like Figures 10-11 As shown, support rods 3032 are provided at the four corners of the bottom of the stacking plate 303. The stacking plate 303 is movably engaged by the second slot 3031 and the second protrusion 3021 opened on its side. The position of the second slot 3031 on the surface of the stacking plate 303 corresponds to the position of the first slot 2041 opened on the surface of the receiving plate 204, and the second protrusion 3021 corresponds to the first protrusion 2033 at its bottom. The bottom of the placement rack 301 is movably provided with a locking strip 30121. The locking strip 30121 passes through the placement rack 301 and is fixedly connected to the connecting plate 3012 at the bottom of the crossbar 3011. The locking strip 30121 is disposed between adjacent support rods 3032 and movably contacts the bottom of the stacking plate 303.

[0069] Operation process:

[0070] The handrail 2011 is manually grasped, and the moving frame 201 is placed inside the placement frame 1011 to restrict its position. The straightened strip is then placed on the surface of the moving plate 203, with the pre-drilled holes on the side of the strip engaging with the positioning guide post 2031. This restricts the strip's side to the surface of the moving plate 203, fixing it in place. Then, the stamping source 102 moves the stop rod 103 and its bottom stamping head 302 downwards, causing the stamping head 302 to contact the strip on the surface of the receiving plate 204, clamping it between the receiving plate 204 and the stamping head 302. Subsequently, the lifting drive source 2012 is activated, moving the displacement plate 2013 and the receiving plate 204 to engage with the stamping head 302. 2. The moving plate 203 is lowered at the same rate. At this time, the moving plate 203 is supported and fixed in its initial position by the locking drive source 2023, so that there is a height difference between the moving plate 203 and the receiving plate 204. During the process of forming the height difference, a shearing force is formed between the material strip held by the receiving plate 204 and the material strip at the top of the receiving plate 204 and the material strip. Since the raw material of the lead frame 4 is a thin material strip, under this height shearing, the material strip is squeezed and sheared into several small material strips, i.e., solder pads 401, with the same shape as the receiving plate 204 and the slot 2041. At this time, the side of the solder pad 401 is stamped to form a preferably four slots 404. The slots 404 are asymmetrical on both sides of the solder pad 401, which optimizes the stamping stress distribution during the separation of the solder pad 401 from the whole material strip.

[0071] The protruding post 2033 located on the side of the receiving plate 204 will contact and restrict the contact of the clamp 404 formed by the stamping of the side of the pad 401 during the stamping process. The surface of the protruding post 2033 is pre-coated with lubricating oil, which helps to reduce the frictional resistance of the strip at the top of the receiving plate 204 during the stamping process, so that the pad 401 will not shift. After the stamping is completed, the entire strip is pre-separated into several small strips, namely pads 401. Several pads 401 are engaged with the protruding post 2033 on the inner side of the moving plate 203 through the clamp 404, which reduces the subsequent shift of the pad 401.

[0072] By pre-stamping the entire strip of material into several pads 401, the problems of package cracking and solder joint peeling caused by the prior art, where chip soldering and packaging are both performed on the entire strip, and then the formed lead frame 4 and strip are stamped and separated, are reduced. Pre-separating the strip into several smaller strips, i.e., pads 401, avoids damage to the chip and package caused by processing first and then peeling off the material. Furthermore, the locking and limiting by the bayonet 404 and the protrusion 2033, as well as the receiving cavity 2032 and the receiving plate 204, make the stamped pads 401 more orderly. After the pads 401 are independently restrained, the entire receiving unit 2 can be moved, allowing the pads 401 in the receiving cavity 2032 inside the receiving unit 2 to be transferred. Furthermore, the support and containment provided by the receiving plate 204 and the protruding post 2033 can reduce the offset of the solder pad 401 during subsequent soldering and encapsulation processes, avoiding the problem of easy offset during subsequent processes after the thin strip is stamped into small strips. Moreover, the receiving plate 204 and the moving plate 203 gradually restrict the solder pad 401 during the stamping process, thus avoiding the cumbersome process and placement accuracy issues caused by arranging several small strips formed after pre-stamping. Therefore, through the cooperation of the receiving plate 204 and the moving plate 203, the positional restriction of the bayonet 404 and the protruding post 2033, and the containment by the receiving plate 204 and the receiving cavity 2032, the position of the stamped solder pad 401 is restricted after stamping dispersion. This prevents the movement of the receiving unit 2 from affecting the solder pad 401, ensuring that pre-stamping does not affect subsequent processes and avoiding the problem of the solder pad 401 being easily damaged and having excessive deviations in processing accuracy during subsequent processes. Furthermore, in addition to solving the impact of pre-processing followed by stamping and stripping on chip soldering and packaging, it also avoids the problem of having to place each small strip neatly before proceeding to the next process after the entire strip is stamped into small strips, thus avoiding the tedious pre-stamping process.

[0073] After stamping, the solder pad 401 on the top of the receiving plate 204 and the bottom of the roller 1055 are aligned. Then, the stamping head 302 is raised to a preset height, so that a gap is set between the stamping head 302 and the receiving plate 204 to accommodate the roller 1055. At this time, the locking drive source 2023 is controlled to drive the moving plate 203 to move down through the synchronous plate 2024, so that the top surface of the moving plate 203 is aligned with the middle of the solder pad 401 on the top of the receiving plate 204. At this time, the upper half of the solder pad 401 is exposed in the receiving cavity 2032, while the lower half of the solder pad 401 is still inside the receiving cavity 2032 and is restricted by the protruding post 2033 to the locking slot 404.

[0074] Then, the moving drive source 1051 is started, causing the screw 1052 to drive the base plate 1053 to move, so that the roller 1055 at the front end of the folding plate 1054 enters the gap between the receiving plate 204 and the punch head 302. Then, the punch head 302 is moved down, so that the roller 1055 and the folding plate 1054 are pressed down and moved, so that the roller 1055 presses against the solder pad 401 on the top of the receiving plate 204. At this time, the downward pressure of the folding plate 1054 will compress the internal reset component 1056 of the base plate 1053. Then, the base plate 1053 is controlled to move, so that the roller 1055 is restricted to move between the receiving plate 204 and the punch head 302, thereby performing stable rolling correction on the independent solder pad 401 on the top of the receiving plate 204. Of course, the space between the receiving plate 204 and the stamping head 302 can be slightly larger than the diameter of the roller 1055, thereby facilitating the passage of the roller 1055 and preventing excessive rolling vibration of the roller 1055 to a certain extent. At this time, the reset component 1056 is preferably a damping spring, which further alleviates the rolling vibration of the roller 1055. The rolling of the roller 1055 eliminates the slight bending and unevenness caused by the uneven distribution of surface stress during the pre-stamping process of the pad 401, further improving the flatness of the surface of the pad 401. After the strip is pre-flattened, the individual small strips are corrected and flattened separately. During the overall flattening process of the entire strip, the local slight unevenness will also be stamped to form the pad 401, which is flattened by the independent correction of the roller 1055, facilitating subsequent processing. After the roller 1055 reciprocates a preset number of times, the seat plate 1053 drives the roller 1055 to return to its original position.

[0075] During the subsequent transfer process, the receiving plate 204 can be lowered to a preset height, allowing the solder pad 401 to move downwards under its own weight. The surface of the protruding post 2033, which contacts the bayonet 404, is coated with lubricant, making it easier for the solder pad 401 to descend a short distance with the receiving plate 204. After the receiving plate 204 descends, the locking drive source 2023 also drives the moving plate 203 downwards. As the moving plate 203 descends, the trigger block 2035, which was not previously in contact with the fixed plate 202, comes into contact with the fixed plate 202. This causes the fixed plate 202 to push the trigger block 2035 upwards, which in turn pushes the hydraulic oil inside the liquid chamber 2036. This pressurizes the hydraulic oil, pushing the insertion rod 2037 outwards. After passing through the storage slot 2038, the insertion rod 2037 moves to the top of the solder pad 401 on the top of the receiving plate 204. At this time, the locking drive source 2023 stops moving, so that the upper and lower surfaces of the pad 401 are restricted vertically by the insert rod 2037 and the receiving plate 204, while the bayonet 404 and the protruding post 2033 restrict the lateral displacement of the pad 401, thereby further improving the support and restriction effect after the entire strip is stamped into an independent pad 401, and avoiding the impact of subsequent processes on the flatness and processing accuracy of the pad 401.

[0076] Of course, if the insufficient downward movement of the pad 401 due to its own weight is taken into account, the stamping head 302 can be moved further down after the roller 1055 returns to its original position, so that the receiving plate 204 and the stamping head 302 clamp the pad 401 and move it down to the preset position, so that the stamping head 302 is reset, and then the moving plate 203 moves to repeat the above process.

[0077] To improve work efficiency, after the lead frame 4 at the top of the movable rod 2014 is formed, the movable rod 2014 can drive the receiving plate 204 and its top lead frame 4 to descend to a preset height, allowing the moving frame 201 to continue being placed inside the placement frame 1011. This causes the stamping head 302 to descend to the surface of the moving plate 203. Then, the connecting plate 3012 and the locking strip 30121 are manually pulled out, causing the stacked plates 303 inside the placement frame 301 to descend as a whole. The bottom stacked plate 303 of the placement frame 301 descends to the surface of the lead frame 4 at the top of the receiving plate 204. The stacked plate 303 then contacts the four corners of the lead frame 4 via the support rod 3032 (which is wrapped with elastic rubber at the bottom). These four corners are not the corners 403 of the cup bottom 402. This allows the descending stacked plate 303 at the bottom of the placement frame 301 to contact the lead frame 4 via the support rod 3032 and the support... After the top of the receiving plate 204 makes contact with the lead frame 4, the top of the stacking plate 303 on the top of the lead frame 4 and the top of the moving plate 203 are aligned. Then, the locking strip 30121 is inserted back, so that the locking strip 30121 supports the bottom surface of the bottom stacking plate 303 inside the placement frame 301 between the adjacent support rods 3032, thereby resetting the punch head 302. The lowered stacking plate 303 and the moving plate 203 are aligned, which makes it easier for the stacking plate 303 to replace the receiving plate 204 to independently separate and reprocess the next batch of material strips. This allows the lead frame 4 to accumulate to a preset quantity after processing, and then unload the material uniformly by lifting the receiving plate 204. Of course, depending on the actual processing situation, the stacking plate 303 may not be used. After the receiving plate 204 finishes processing a batch, the lead frame 4 is reset and removed, and then the new material strip is processed and supported.

[0078] Example 2: This implementation is as follows Figure 12-13 As shown, this embodiment provides a high light-emitting semiconductor lead frame product, which includes the following:

[0079] The lead frame 4 includes a pad 401, and a cup bottom 402 is provided on the side of the pad 401. The corners 403 of the cup bottom 402 are composed of three rounded corners and one chamfer. The shape of the rounded corners is the same as the letter 'C'. Several bayonets 404 are staggered on the symmetrical side of the pad 401. Through the design of the corners 403, the design of three rounded corners and one chamfer is adopted. The wall thickness is increased at the chamfer, and the rounded corners are larger, which makes it easier to identify the direction and also improves the light output. The number of bayonets 404 is preferably four. The four bayonets 404 are arranged in pairs, and the two pairs are staggered and opposite to each other on the symmetrical side of the pad 401 to form asymmetrical bayonets 404, which reduces stress concentration during subsequent stamping and stripping and reduces the risk of breakage.

Claims

1. A high-luminosity semiconductor lead frame processing apparatus, characterized in that, include: The main body unit (1) is provided with a pressing unit (3) and a receiving unit (2) in sequence at the bottom of the main body unit (1). The receiving unit (2) includes a movable plate (203). The surface of the movable plate (203) is provided with a plurality of receiving cavities (2032). A plurality of protruding posts (2033) are staggered on the symmetrical sides of the receiving cavities (2032). A plug rod (2037) is movably provided on the side of the movable plate (203) corresponding to the receiving cavity (2032). The receiving cavity (2032) is movably engaged by the protruding posts (2033) and the slot (2041). The slot (2041) is provided on the side of the receiving plate (204). The pressing unit (3) includes a punch head (302), which is located on the top of the receiving plate (204). The inner side of the punch head (302) is provided with a protrusion two (3021) corresponding to the protrusion one (2033). The punch head (302) and the receiving plate (204) are closed to punch the whole strip into a small strip. After the small strip is punched, it is snapped into the space at the top of the receiving plate (204), the inner side of the receiving cavity (2032), and the bottom of the insert rod (2037). The receiving unit (2) also includes a movable frame (201), a lifting drive source (2012) is installed at the bottom of the movable frame (201), a displacement plate (2013) is fixedly connected to the top of the output shaft of the lifting drive source (2012), and a number of movable rods (2014) are installed on the surface of the displacement plate (2013). The top of the movable rod (2014) is fixedly connected to a receiving plate (204), which is movably disposed inside the receiving cavity (2032). The receiving cavity (2032) is opened inside the movable plate (203) and the storage cavity (2021). Several storage cavities (2021) are disposed inside the fixed plate (202). The storage cavity (2021) at the bottom outer side of the fixed plate (202) is fixedly connected to the movable frame (201). The side surface of the moving plate (203) is provided with a plurality of positioning guide posts (2031), and the bottom of the moving plate (203) is fixedly connected with a reset member two (2034). The moving plate (203) is elastically connected to the fixed plate (202) through the reset member two (2034). A synchronization plate (2024) is fixedly connected to the side of the moving plate (203). The bottom of the synchronization plate (2024) is fixedly connected to the output shaft of the locking drive source (2023). The bottom of the locking drive source (2023) is fixedly connected to the storage cavity (2021) through the base plate (2022). The protruding post 1 (2033) located on the side of the receiving plate (204) will restrict contact with the gusset (404) formed by stamping on the side of the pad (401) during the stamping process.

2. The high light-emission semiconductor lead frame processing apparatus as described in claim 1, characterized in that: The main unit (1) includes a stamping frame (101), a stamping source (102) is installed on the top of the stamping frame (101), a placement frame (1011) is fixedly connected to the bottom of the stamping frame (101), a stopper rod (103) is fixedly connected to the output end of the bottom of the stamping source (102), and a mounting plate (104) is fixedly connected to the bottom of the stopper rod (103).

3. The high light-emission semiconductor lead frame processing apparatus as described in claim 2, characterized in that: A support frame (105) is fixedly connected to the side of the stamping frame (101). A screw (1052) is rotatably provided on the top of the support frame (105). A mobile drive source (1051) is installed on the side of the support frame (105). The output shaft of the mobile drive source (1051) passes through the support frame (105) and is fixedly connected to the screw (1052). The screw (1052) has a seat plate (1053) slidably disposed on its surface. The interior of the seat plate (1053) is elastically connected by a reset member (1056) and a folding plate (1054). Several rollers (1055) are sequentially rotatably disposed on one side of the folding plate (1054) opposite to the moving plate (203).

4. The high light-emission semiconductor lead frame processing apparatus as described in claim 3, characterized in that: The moving plate (203) has a liquid chamber (2036) inside, which is filled with hydraulic oil. The bottom of the liquid chamber (2036) has a through hole, and a trigger block (2035) is provided at the bottom of the liquid chamber (2036). The trigger block (2035) is fixedly connected to the piston inside the liquid chamber (2036) after its top rod passes through the through hole. The side of the liquid chamber (2036) close to the receiving plate (204) has a through hole. The inside of the through hole is movably connected to the insert rod (2037) through a sealing ring. The part of the insert rod (2037) inside the liquid chamber (2036) is equipped with a piston. The side of the insert rod (2037) opposite to the liquid chamber (2036) is elastically connected to the storage groove (2038) through a reset member (2039). The storage groove (2038) is located inside the moving plate (203).

5. The high light-emission semiconductor lead frame processing apparatus as described in claim 4, characterized in that: Several stamping heads (302) are disposed at the bottom of the placement rack (301). The surface of the placement rack (301) is symmetrically provided with horizontal bars (3011). The stamping heads (302) are provided with a space to accommodate stacked plates (303) corresponding to the internal position of the placement rack (301). The protruding column (3021) inside the stamping head (302) extends into the internal space of the placement rack (301).

6. The high-luminosity semiconductor lead frame processing apparatus as described in claim 5, characterized in that: The stacking plate (303) is provided with support rods (3032) at the four corners of its bottom. The stacking plate (303) is movably engaged by the slots (3031) and protrusions (3021) on its side. The bottom of the placement rack (301) is movably provided with a locking strip (30121). The locking strip (30121) passes through the placement rack (301) and is fixedly connected to the connecting plate (3012) at the bottom of the crossbar (3011).

7. A high-luminosity semiconductor lead frame product, applied to the high-luminosity semiconductor lead frame processing apparatus according to any one of claims 1-6, characterized in that, Includes the following steps: The lead frame (4) includes a pad (401), and a cup bottom (402) is provided on the side of the pad (401). The corners (403) of the cup bottom (402) are composed of three rounded corners and one chamfer. Several bayonets (404) are staggered on the symmetrical side of the pad (401).

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