Self-adaptive inter-board welding-free radio frequency connector

Abstract

The invention discloses a self-adaptive inter-board welding-free radio frequency connector, which relates to the technical field of radio frequency connectors and comprises a first elastic conductor piece, an insulating medium piece, a shell piece and a second elastic conductor piece. The first elastic conductor piece is composed of an inner conductor piece and a built-in elastic piece, and axial floating compensation of the inner conductor is achieved. The insulating medium member sleeves the outer side of the first elastic conductor member through the step structure and keeps clearance fit with the first elastic conductor member. The shell part fixes the insulating medium part through the blocking table, and a conical surface groove is formed in the inner wall of the shell part. The second elastic conductor parts are two outer conductor parts of a trumpet-shaped petal clamp spring structure, the two ends of the insulating medium are sleeved with the second elastic conductor parts, the outer conductor parts are matched with the conical surface grooves in an embedded mode through the annular protrusions, and axial floating is achieved through elasticity of the clamp spring structure. According to the self-adaptive inter-board welding-free radio frequency connector disclosed by the invention, the problems of high-temperature thermal stress and board surface deformation caused by a traditional welding process are avoided, and the connector can realize inter-board welding-free and self-adaptive floating connection.

Description

Technical Field

[0001] This invention belongs to the field of radio frequency connector technology, and specifically relates to an adaptive board-to-board solderless radio frequency connector. Background Technology

[0002] Driven by information technology, users have increasingly higher requirements for system miniaturization and integration. As an important technology for connector miniaturization and integration in recent years, board-to-board interconnect technology is being used more and more in various fields such as aerospace, aviation, and communications.

[0003] Existing conventional push-in and blind-push-in miniature inter-board RF coaxial connectors are widely used in inter-board interconnection technology, while conventional interconnection methods are two-piece plug and socket interconnection or three-piece plug and socket interconnection with adapters.

[0004] The above traditional interconnection methods are complex to install, have no floating amount between the inner and outer conductors, and require high-temperature welding for fixation. This kind of hard contact product interconnection may lead to product damage during the assembly process. Summary of the Invention

[0005] To address the aforementioned problems in the prior art, this invention provides an adaptive, solderless inter-board RF connector. The technical problem to be solved by this invention is achieved through the following technical solution: This invention provides an adaptive, solderless inter-board RF connector, comprising: a first elastic conductor, an insulating dielectric, a housing, and a second elastic conductor, wherein... The first elastic conductor includes an inner conductor and an elastic element located inside the inner conductor, wherein the inner conductor achieves axial floating through the elastic element; The insulating dielectric element is sleeved on the outside of the first elastic conductor element through a stepped structure, and is in clearance fit with the first elastic conductor element; The outer casing is fixed to the outside of the insulating medium by a baffle structure, and a conical groove is provided on the inner wall of the outer casing near the end. The second elastic conductor includes two outer conductors, which are correspondingly sleeved at both ends of the insulating dielectric component. The outer conductors have a trumpet-shaped petal spring structure. The outer conductors are nested with the outer shell component through annular protrusions that cooperate with the conical groove. The outer conductors achieve axial floating by utilizing the elastic contraction and expansion of the spring structure.

[0006] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The adaptive solderless RF connector of this invention achieves stable electrical contact with the PCB board through the elastic compression structure of the inner and outer conductors, transforming product interconnection from hard contact to soft connection. This avoids the high-temperature thermal stress and board surface deformation problems caused by traditional soldering processes, improving installation reliability and PCB board lifespan. The inner conductor achieves axial floating through internal elastic elements, while the outer conductor achieves axial expansion and contraction through the cooperation of a trumpet-shaped petal spring structure and a conical groove on the outer shell. Together, they provide bidirectional floating in both axial and radial directions, effectively compensating for displacement caused by inter-board installation errors, thermal expansion and contraction, and vibration, resulting in strong adaptability.

[0007] 2. The adaptive board-to-board solderless RF connector of the present invention features a detachable outer conductor structure, eliminating the need for soldering. This simplifies installation and replacement, significantly reducing assembly and maintenance difficulty and time costs, making it particularly suitable for applications requiring frequent debugging or replacement. The outer conductor employs a multi-petal elastic contact structure, exhibiting excellent elasticity and wear resistance after heat treatment. This provides multi-point contact assurance, maintaining a stable electrical connection even under vibration and shock environments.

[0008] 3. The adaptive board-to-board solderless RF connector of the present invention has a simple overall design, fewer parts, and supports multi-channel parallel arrangement. It is especially suitable for modular, high-density integrated electronic devices, which is conducive to the miniaturization and lightweight design of the whole machine.

[0009] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of an adaptive inter-board solderless RF connector provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of an external conductor provided in an embodiment of the present invention; Figure 3 This is an installation diagram of the adaptive inter-board solderless RF connector provided in an embodiment of the present invention when the inter-board spacing is large; Figure 4 This is an installation diagram of the adaptive inter-board solderless RF connector provided in an embodiment of the present invention when the inter-board spacing is small.

[0011] Icons: 1-Inner conductor; 2-Elastic component; 3-First insulating medium component; 4-Second insulating medium component; 5-First outer shell component; 51-First conical groove; 6-Second outer shell component; 61-Second conical groove; 7-Outer conductor component; 71-Annular main body; 72-Contact spring; 73-Opening; 74-Annular protrusion; 8-PCB board; 9-Metallized via; 10-Metallic coating; 11-Supporting structure cavity component. Detailed Implementation

[0012] To further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the following detailed description of an adaptive board-to-board solderless radio frequency connector based on the present invention is provided in conjunction with the accompanying drawings and specific embodiments.

[0013] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of specific embodiments in conjunction with the accompanying drawings. Through the description of the specific embodiments, a more in-depth and concrete understanding can be gained of the technical means and effects adopted by the present invention to achieve its intended purpose. However, the accompanying drawings are for reference and illustration only and are not intended to limit the technical solutions of the present invention.

[0014] This invention provides an adaptive, solderless inter-board RF connector. Please refer to [link / reference]. Figure 1 , Figure 1 This is a schematic diagram of the structure of an adaptive inter-board solderless RF connector provided in an embodiment of the present invention. Figure 1 As shown, the adaptive board-to-board solderless RF connector of this embodiment includes: a first elastic conductor, an insulating dielectric, a housing, and a second elastic conductor.

[0015] In this embodiment, the first elastic conductor includes an inner conductor 1 and an elastic element 2 located inside the inner conductor 1. The inner conductor 1 achieves axial floating through the elastic element 2.

[0016] In an optional embodiment, the inner conductor 1 includes a first inner conductor portion and a second inner conductor portion; the first inner conductor portion has a first step on its outer periphery near its first end, and the second inner conductor portion has a second step on its outer periphery near its second end; the two ends of the elastic member 2 are in close contact with the second end of the first inner conductor portion and the first end of the second inner conductor portion, respectively.

[0017] Optionally, the material of the inner conductor 1 can be beryllium bronze, which has good electrical conductivity, elasticity and fatigue resistance.

[0018] In other embodiments, the material of the inner conductor 1 can also be phosphor bronze, gold-plated copper alloy, gold-plated stainless steel, or other conductive materials, and there are no limitations on this. Phosphor bronze has good elasticity and wear resistance, and is relatively inexpensive, making it suitable for low-to-medium frequency bands (such as DC to 20GHz); gold-plated copper alloy has high conductivity and good high-temperature stability, making it suitable for high-frequency and high-speed applications; gold-plated stainless steel has high mechanical strength and corrosion resistance, making it suitable for harsh environments (such as military and aerospace), but its conductivity is slightly poor and needs to be optimized through coating; titanium alloy has lightweight, high strength, and corrosion resistance, making it suitable for weight-sensitive applications such as drones and satellites.

[0019] In this embodiment, the elastic element 2 provides uniform and reliable axial elastic force. When the adaptive solderless RF connector is connected to the PCB (Printed Circuit Board), the elastic element 2 ensures that the first and second inner conductor parts of the inner conductor 1 always maintain close contact with the PCB, thereby guaranteeing the stability and low loss of high-frequency signal transmission. The elastic expansion and contraction characteristics of the elastic element 2 enable the axial floating of the inner conductor 1, effectively absorbing and compensating for installation tolerances, differences in thermal expansion coefficients, and minor displacements caused by vibration between PCBs, greatly improving the adaptability and reliability of the product.

[0020] Optionally, the elastic element 2 can be a bobble button. As a precision spring element, the bobble button possesses excellent fatigue resistance, maintaining its elasticity even after multiple compression cycles, thus ensuring the connector's service life and contact reliability under repeated mating / unmating or long-term vibration environments. As a standard part, the bobble button is easy to install and position, and its contact method with the first and second inner conductor ends is simple and reliable, contributing to improved production efficiency and product consistency.

[0021] In other embodiments, the elastic element 2 can also be other elastic devices such as a helical spring, a bellows-type contact, a wire mesh, or conductive rubber, and there are no limitations on this. Helical springs can provide greater stroke and more stable elastic force, and are suitable for scenarios with greater floating range; bellows-type contacts can provide multi-directional floating capability, and are suitable for scenarios with complex assembly errors; wire mesh has good high-frequency characteristics and flexibility, and is often used for high-frequency floating connections; conductive rubber has certain conductivity and elasticity, and is suitable for low-frequency, high-vibration environments.

[0022] In this embodiment, the insulating dielectric element is sleeved on the outside of the first elastic conductor element through a stepped structure, and is in clearance fit with the first elastic conductor element.

[0023] In an optional embodiment, the insulating medium includes a nested first insulating medium 3 and a second insulating medium 4; the inner wall of the first insulating medium 3 near the first end is provided with a first limiting step that cooperates with a first step, and the inner wall of the second insulating medium 4 near the second end is provided with a second limiting step that cooperates with a second step.

[0024] In this embodiment, the inner wall of the first insulating dielectric element 3 near its second end and the outer periphery of the second insulating dielectric element 4 near its first end are provided with mutually cooperating steps to achieve nesting of the first insulating dielectric element 3 and the second insulating dielectric element 4. The nesting joint position of the first insulating dielectric element 3 and the second insulating dielectric element 4 is always kept within the axial floating stroke range of the inner conductor element 1 to increase the creepage distance, while ensuring that the inner conductor element 1 and the elastic element 2 slide smoothly without jamming during the axial sliding process.

[0025] It is understandable that the inner diameter of the first insulating dielectric element 3 and the second insulating dielectric element 4 is slightly larger than that of the inner conductor element 1 and the elastic element 2, and they are in a clearance fit to ensure that the inner conductor element 1 and the elastic element 2 can slide freely in the hole of the insulating dielectric element.

[0026] Optionally, the insulating dielectric element can be made of rigid plastic, such as PEI (polyetherimide), PI (polyimide), or PEEK (polyetheretherketone), to ensure smooth support and extension of the inner conductor element 1 and the elastic element 2.

[0027] In this embodiment, the outer casing is fixed to the outside of the insulating medium by a baffle structure, and a conical groove is provided on the inner wall of the outer casing near the end.

[0028] In an optional embodiment, the outer casing includes a nested first outer casing 5 and a second outer casing 6; the inner wall of the first outer casing 5 near its first end is provided with a first conical groove 51, and the inner wall of the second outer casing 6 near its second end is provided with a second conical groove 61. The larger end of the first conical groove 51 is close to the first end of the first outer casing 5, and the larger end of the second conical groove 61 is close to the second end of the second outer casing 6.

[0029] In this embodiment, the outer periphery of the first insulating medium 3 and the second insulating medium 4 located on both sides of the nested joint is provided with a boss, the position where the first outer shell 5 is in contact with the first insulating medium 3 is provided with a stop that cooperates with the boss, and the position where the second outer shell 6 is in contact with the second insulating medium 4 is provided with a stop that cooperates with the boss.

[0030] Understandably, the retaining structure is an internal feature of the RF connector used for fixing and positioning. It forms a mechanical stop surface that defines the axial position of the insulating dielectric component within the housing. By mounting the insulating dielectric component against the retaining surface, it prevents internal movement, ensuring the structural stability of the entire assembly. The retaining structure provides a clear reference surface for the assembly process, enabling quick and accurate installation of the insulating dielectric component and inner conductor, thus improving production efficiency and product consistency.

[0031] In this embodiment, the second elastic conductor includes two outer conductors 7, which are respectively sleeved on both ends of the insulating dielectric component. The outer conductors 7 have a trumpet-shaped petal spring structure. The outer conductors 7 are nested with the outer shell component through the annular protrusions 74 that cooperate with the conical groove. The outer conductors 7 achieve axial floating by utilizing the elastic contraction and expansion of the spring structure.

[0032] In this embodiment, the conical groove is the core structure for achieving axial floating, self-adaptation, and reliable connection of the outer conductor 7. The annular protrusion 74 on the outer conductor 7 nests with the conical groove of the outer shell. The inclined structure of the conical surface provides a precise guiding path for the compression and rebound of the snap ring structure, ensuring that it can only slide smoothly along the axial direction and preventing radial sway or jamming. The conical groove mechanically limits the range of motion of the outer conductor 7, ensuring that the outer conductor 7 can slide freely within the holes of the first outer shell 5 and the second outer shell 6 without falling off, preventing the snap ring structure from excessively popping out during elastic recovery or completely disengaging during compression, thus ensuring the controllability and safety of the floating of the outer conductor 7.

[0033] Please refer to the above. Figure 2 , Figure 2 This is a schematic diagram of the structure of an external conductor provided in an embodiment of the present invention, as shown below. Figure 2 As shown, the outer conductor 7 includes an annular main body 71 and a plurality of contact springs 72; an opening 73 penetrating the annular main body 71 is provided on the side wall of the annular main body 71 in the axial direction, so that the outer conductor 7 has radial elastic deformation capability; a plurality of contact springs 72 are provided on the side wall of the annular main body 71 near the first end, and the plurality of contact springs 72 are arranged at intervals along the circumference of the annular main body 71 to form a trumpet-shaped petal structure; an annular protrusion 74 with a conical outer circumferential surface is provided on the side wall of the annular main body 71 near the second end.

[0034] In this embodiment, the annular protrusion 74 of the outer conductor 7 is nested and tangential to the conical groove of the outer shell. When the outer conductor 7 floats axially, the annular protrusion 74 slides axially within the conical groove.

[0035] Understandably, the multiple contact springs 72 increase the number of contact points, and the snap ring structure and trumpet-shaped petals of the outer conductor 7 after heat treatment are elastic, ensuring the reliability of the contact.

[0036] It should be noted that the adaptive board-to-board solderless RF connector in this embodiment is a fixed form such as threaded mounting.

[0037] In this embodiment, when the adaptive solderless RF connector is used for PCB board connection, the end of the inner conductor 1 is pressed into contact with the metallized via of the PCB board, and the multiple contact springs 72 of the outer conductor 7 are pressed into contact with the metallized coating of the PCB board. The axial float range of the inner conductor 1 and the outer conductor 7 is 0-0.5 mm.

[0038] Furthermore, please refer to [see also] Figure 3 and Figure 4 The example shown illustrates the application of the adaptive board-to-board solderless RF connector and explains the working process of the adaptive board-to-board solderless RF connector in this embodiment.

[0039] First, the adaptive inter-board solderless RF connector is installed on the supporting structure cavity 11. PCBs 8 are installed on the top and bottom of the supporting structure cavity 11 and secured with screws, thus clamping the adaptive inter-board solderless RF connector between the two PCBs 8. At this time, the two ends of the inner conductor 1 of the adaptive inter-board solderless RF connector form a pressing contact with the metallized vias 9 of the two PCBs 8, ensuring reliable transmission of high-frequency signals; the multiple contact springs 72 of the two outer conductors 7 form a pressing contact with the metallized coatings 10 of the two PCBs 8, achieving reliable grounding.

[0040] Since the adaptive board-to-board solderless RF connector is not a rigid connection, both its inner and outer conductors have the ability to float in the axial direction, that is, in the direction perpendicular to the PCB board 8.

[0041] like Figure 3 The diagram shows the installation of an adaptive solderless RF connector when the PCB spacing is large. When the PCB spacing is large, the axial pressure applied to the inner conductor 1 is small. At this time, the elastic force of the elastic element 2 will push the inner conductor 1 outward, that is, extend a certain distance towards the PCB board 8, ensuring that its end can be tightly pressed against the metallized via 9 of the PCB board 8 to form a stable electrical connection.

[0042] When the PCB spacing is large, the annular main body 71 of the outer conductor 7, i.e., the snap ring structure, experiences less pressure. The elasticity of the outer conductor 7 itself causes it to slide along the conical groove of the outer casing towards the PCB 8, resulting in axial elongation of the outer conductor 7. The multiple contact springs 72 of the outer conductor 7, i.e., the trumpet-shaped petals, can fully open to make sufficient pressure to contact the metal coating 10 of the PCB 8 over a large area, ensuring good low-frequency and DC grounding circuits.

[0043] like Figure 4 The diagram shows the installation of the adaptive inter-board solderless RF connector when the PCB spacing is small. When the PCB spacing is small, the axial pressure applied to the inner conductor 1 increases. At this time, the pressure overcomes the elastic force of the elastic element 2, pushing the inner conductor 1 to contract inward, avoiding damage to the PCB board 8 or the adaptive inter-board solderless RF connector itself due to excessive compression, while still maintaining sufficient contact pressure with the metallized via 9 of the PCB board 8 to ensure signal transmission quality.

[0044] When the PCB spacing is small, the annular main body 71 of the outer conductor 7, i.e., the snap ring structure, is subjected to enormous axial pressure. This pressure forces the outer conductor 7 to slide along the conical groove of the outer casing in a direction away from the PCB board 8, causing the diameter of the annular main body 71 of the outer conductor 7 to elastically contract, resulting in axial shortening of the outer conductor 7. Although the outer conductor 7 is compressed, the multiple contact springs 72 of the outer conductor 7, i.e., the trumpet-shaped petals, can still maintain reliable contact with the metal plating 10 of the PCB board 8 through elasticity, while avoiding structural damage caused by excessively small spacing.

[0045] Throughout the adaptive floating process, the inner conductor 1 slides smoothly within the aperture of the insulating dielectric component, and its floating range is controlled by the limiting steps within the insulating dielectric component. The insulating dielectric component not only provides a sliding channel and limiting mechanism for the inner conductor 1, but its nested structure design also ensures sufficient creepage distance even at maximum floating distance, preventing high-frequency signal leakage or breakdown. The synchronous, unidirectional floating design of the inner and outer conductors minimizes the relative positional change between them, effectively maintaining the characteristic impedance stability of the transmission line and ensuring stable transmission of RF signals within the DC~40GHz frequency range.

[0046] It is understood that in this embodiment, the inner diameters of the first insulating dielectric 3 and the second insulating dielectric 4 are slightly larger than those of the inner conductor 1 and the elastic element 2, forming a clearance fit. Therefore, when there is a radial (i.e., horizontal) misalignment or tolerance between the two PCB boards 8, the entire first elastic conductor (inner conductor 1 and elastic element 2) can make a small radial movement within the hole of the insulating dielectric, thereby adaptively aligning with the metallized via 9 of the PCB board 8. The range of this radial movement is determined by the size of the gap (e.g., a gap of 0.05mm to 0.2mm in the diameter direction). The elasticity of the elastic element 2 ensures that even in the case of radial offset, the inner conductor 1 can still maintain reliable elastic contact with the metallized via 9 of the PCB board 8, rather than a hard collision.

[0047] Secondly, the radial floating of the second elastic conductor is mainly achieved through the cooperation between the outer conductor 7 with the first outer shell 5 and the second outer shell 6 via the trumpet-shaped petal spring structure. The fit between the outer conductor 7 and the tapered boss-tapered groove of the first and second outer shells allows for a certain angle of misalignment. Furthermore, the outer conductor 7 possesses elasticity after heat treatment. When there is a radial deviation in the PCB board 8, the force applied to the multiple contact springs 72 will be uneven, and each contact spring 72 can undergo independent elastic deformation. For example, one side of the contact spring 72 may be compressed, while the other side may remain unchanged or slightly extended. This localized, non-uniform elastic deformation allows the contact end (contact spring 72) of the outer conductor 7 to produce a small angular deflection and center offset relative to the fixed end (outer shell end), thereby compensating for the radial deviation.

[0048] Therefore, the radial adaptive capability of the adaptive solderless RF connector in this embodiment is the result of the superposition of the radial clearance of the inner conductor 1 and the radial deflection capability of the outer conductor 7. When a radial deviation occurs in the PCB board 8, the force is transmitted to the outer conductor 7 and the inner conductor 1 through the PCB board 8. The outer conductor 7 absorbs most of the deviation through elastic deformation using a snap ring structure, while the inner conductor 1 moves within the hole for further fine-tuning. Ultimately, even in cases of imperfect alignment between boards, the inner and outer conductors can automatically find their positions and establish a reliable connection.

[0049] The adaptive solderless RF connector in this embodiment automatically compensates for the deviation between the actual spacing and the ideal value between PCB boards by expanding and contracting the inner and outer conductors. Regardless of whether the spacing is too large or too small, it can automatically adjust its own length to always provide a stable impedance, reliable contact and physically robust transmission path for RF signals, while achieving excellent grounding performance.

[0050] The adaptive solderless RF connector of this invention achieves stable electrical contact with the PCB board through the elastic compression structure of the inner and outer conductors, transforming product interconnection from hard contact to soft connection. This avoids the high-temperature thermal stress and board deformation problems caused by traditional soldering processes, improving installation reliability and PCB board lifespan. The inner conductor achieves axial floating through internal elastic elements, while the outer conductor achieves axial expansion and contraction through the cooperation of a trumpet-shaped petal spring structure and a conical groove on the outer shell. Together, they provide bidirectional floating in both axial and radial directions, effectively compensating for displacement caused by inter-board installation errors, thermal expansion and contraction, and vibration, resulting in strong adaptability. The outer conductor is a detachable structure, requiring no soldering, making installation and replacement simple and significantly reducing assembly and maintenance difficulty and time costs, making it particularly suitable for applications requiring frequent debugging or replacement. The outer conductor adopts a multi-petal elastic contact structure, which, after heat treatment, has good elasticity and wear resistance, providing multi-point contact protection and maintaining a stable electrical connection even under vibration and shock environments.

[0051] The adaptive board-to-board solderless RF connector of this invention has a simple overall design, fewer parts, and supports multi-channel parallel arrangement. It is especially suitable for modular, high-density integrated electronic devices, which is beneficial for miniaturization and lightweight design of the whole machine.

[0052] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion, such that an article or device comprising a list of elements includes not only those elements but also other elements not expressly listed. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device comprising said element. Terms such as "connected" or "linked" are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect. The orientations or positional relationships indicated by terms such as "upper," "lower," "left," and "right" are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0053] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0054] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. An adaptive, solderless inter-board RF connector, characterized in that, include: The components include a first elastic conductor, an insulating dielectric component, a housing component, and a second elastic conductor, wherein... The first elastic conductor includes an inner conductor (1) and an elastic element (2) located inside the inner conductor (1), wherein the inner conductor (1) achieves axial floating through the elastic element (2); The insulating dielectric element is sleeved on the outside of the first elastic conductor element through a stepped structure, and is in clearance fit with the first elastic conductor element; The outer casing is fixed to the outside of the insulating medium by a baffle structure, and a conical groove is provided on the inner wall of the outer casing near the end. The second elastic conductor includes two outer conductors (7), which are respectively sleeved on both ends of the insulating medium. The outer conductors (7) have a trumpet-shaped petal snap ring structure. The outer conductors (7) are nested with the outer shell through an annular protrusion (74) that cooperates with the conical groove. The outer conductors (7) achieve axial floating by utilizing the elastic contraction and expansion of the snap ring structure.

2. The adaptive inter-board solderless RF connector according to claim 1, characterized in that, The inner conductor (1) includes a first inner conductor portion and a second inner conductor portion; The first inner conductor portion has a first step on its outer periphery near the first end, and the second inner conductor portion has a second step on its outer periphery near the second end. The two ends of the elastic member (2) are in close contact with the second end of the first inner conductor portion and the first end of the second inner conductor portion, respectively.

3. The adaptive inter-board solderless RF connector according to claim 1, characterized in that, The elastic element (2) is a bobby button.

4. The adaptive inter-board solderless RF connector according to claim 2, characterized in that, The insulating medium includes a nested first insulating medium (3) and a second insulating medium (4); The first insulating medium (3) has a first limiting step that cooperates with the first step on its inner wall near the first end, and the second insulating medium (4) has a second limiting step that cooperates with the second step on its inner wall near the second end.

5. The adaptive inter-board solderless RF connector according to claim 1, characterized in that, The outer casing includes a nested first outer casing (5) and a second outer casing (6); The first outer shell (5) has a first conical groove (51) on its inner wall near the first end, and the second outer shell (6) has a second conical groove (61) on its inner wall near the second end.

6. The adaptive inter-board solderless RF connector according to claim 5, characterized in that, The larger end of the first conical groove (51) is close to the first end of the first housing (5), and the larger end of the second conical groove (61) is close to the second end of the second housing (6).

7. The adaptive inter-board solderless RF connector according to claim 1, characterized in that, The outer conductor (7) includes an annular body (71) and a plurality of contact springs (72). An opening (73) penetrating the annular main body (71) is provided on the side wall along the axial direction, so that the outer conductor (7) has radial elastic deformation capability. A plurality of contact springs (72) are disposed on the side wall of the annular main body (71) near the first end, and the plurality of contact springs (72) are arranged at intervals along the circumference of the annular main body (71) to form a trumpet-shaped petal structure; The annular main body (71) has an annular protrusion (74) with a conical outer circumferential surface on the side wall near the second end.

8. The adaptive inter-board solderless RF connector according to claim 1, characterized in that, The insulating dielectric element is made of rigid plastic.

9. The adaptive inter-board solderless RF connector according to claim 1, characterized in that, The axial floating range of the inner conductor (1) and the outer conductor (7) is 0-0.5 mm.

10. The adaptive inter-board solderless RF connector according to claim 7, characterized in that, When the adaptive board-to-board solderless RF connector is used for PCB board connection, the end of the inner conductor (1) is pressed into contact with the metallized via of the PCB board, and the plurality of contact springs (72) of the outer conductor (7) are pressed into contact with the metallized coating of the PCB board.

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