Power supply module

Abstract

A power module is disclosed that includes a device layer and an inductor assembly. The device layer and the inductor assembly each have a first surface and a second surface opposite each other. The device layer comprises a first power device chip, a second power device chip, a first heat dissipation layer at least partially covering the first power device chip, and a second heat dissipation layer at least partially covering the second power device chip. The first heat dissipation layer and the second heat dissipation layer are partially exposed on the first surface of the device layer. The inductor assembly includes a magnetic core, a first winding and a second winding at least partially embedded within the magnetic core, and a first heat sink and a second heat sink wrapping at least a portion of the inductor assembly. The first end and the second end of the first winding and the first end and the second end of the second winding are both exposed to the second surface of the inductor assembly. The first radiating fin, the first end part of the first winding and the first radiating layer are electrically connected, and the second radiating fin, the first end part of the second winding and the second radiating layer are electrically connected.

Description

Technical Field

[0001] Embodiments of the present invention relate to electronic devices, and more specifically, to power modules. Background Technology

[0002] Typically, power converters are used to convert input power into output power with appropriate voltage and current to supply a load. Multiphase power converters consist of multiple parallel, staggered power stages, thus offering advantages such as low output voltage ripple, fast transient response, and low rated ripple current requirements for the input capacitor. Due to these advantages, multiphase power converters are widely used in applications requiring high output current and low voltage, such as servers and microprocessors.

[0003] The rapid development of modern GPUs (Graphics Processing Units) and CPUs (Central Processing Units) has placed increasingly higher demands on the current-carrying capacity of multiphase power converters. At the same time, these processors are becoming smaller and smaller, meaning that the size of the multiphase power converter needs to be reduced accordingly. The increasing current and decreasing size further complicate the heat dissipation of multiphase power converters. In other words, a power converter with high current density, high efficiency, and excellent heat dissipation capabilities is needed. Summary of the Invention

[0004] Therefore, the purpose of this invention is to solve the above-mentioned technical problems of the prior art and to provide a power module with a stacked structure, and with low packaging resistance and good thermal performance.

[0005] According to an embodiment of the present invention, a power module is provided, including a device layer and an inductor assembly. The device layer has a first surface and a second surface opposite to the first surface of the device layer. The device layer includes a first power device chip, a second power device chip, a first heat dissipation layer at least partially covering the first power device chip, and a second heat dissipation layer at least partially covering the second power device chip. The first heat dissipation layer has a surface exposed to the first surface of the device layer, and the second heat dissipation layer has a surface exposed to the first surface of the device layer. The inductor assembly has a first surface and a second surface opposite to the first surface of the inductor assembly. The inductor assembly includes a magnetic core, a first winding and a second winding at least partially embedded in the magnetic core, and a first heat sink and a second heat sink enclosing at least a portion of the inductor assembly. Both the first winding and the second winding have a first end and a second end, and the first end and the second end of the first winding and the second end of the second winding are exposed to the second surface of the inductor assembly. The first heat sink, the first end of the first winding, and the first heat dissipation layer are electrically connected, and the second heat sink, the first end of the second winding, and the second heat dissipation layer are electrically connected.

[0006] According to an embodiment of the present invention, a power module is provided, including an inductor assembly and a device layer. The inductor assembly has a first surface and a second surface opposite to the first surface of the inductor assembly. The inductor assembly includes a magnetic core, a first winding and a second winding at least partially embedded in the magnetic core, and both the first winding and the second winding have a first end and a second end exposed on the second surface of the inductor assembly. The device layer has a first surface and a second surface opposite to the first surface of the device layer. The device layer includes a first power device chip and a second power device chip at least partially embedded in the device layer, a first heat dissipation layer, a second heat dissipation layer, a first connection post, and a second connection post. The first power device chip and the second power device chip each have a first switch, a second switch, and a switch pin, the switch pin being electrically connected to a common node of the first switch and the second switch. The first heat dissipation layer at least partially covers the first power device chip, the second heat dissipation layer at least partially covers the second power device chip, the first connection post is electrically connected to the switch pin of the first power device chip, and the second connection post is electrically connected to the switch pin of the second power device chip. The first end of the first winding is electrically connected to the first heat dissipation layer and the first connecting post, and the first end of the second winding is electrically connected to the second heat dissipation layer and the second connecting post.

[0007] According to an embodiment of the present invention, a power module is provided, including an inductor assembly and a device layer. The inductor assembly has a first surface and a second surface opposite to the first surface. The inductor assembly includes a magnetic core, a first winding, and a second winding. The first and second windings are at least partially embedded within the magnetic core. Each of the first and second windings has a first end and a second end, which are exposed on the second surface of the inductor assembly. The device layer has a first surface and a second surface opposite to the first surface of the device layer. The device layer includes a first power device chip and a second power device chip, a first heat dissipation layer, and a second heat dissipation layer. The first and second power device chips are at least partially embedded within the device layer. The first heat dissipation layer at least partially covers the first power device chip, and the second heat dissipation layer at least partially covers the second power device chip. A first end of the first winding is electrically connected to the first heat dissipation layer, and a first end of the second winding is electrically connected to the second heat dissipation layer. Attached Figure Description

[0008] To better understand this invention, it will be described in detail with reference to the following figures:

[0009] Figure 1 The circuit module structure of an existing multiphase power converter 10 is shown;

[0010] Figure 2An external view of a power module 20 that implements a two-phase power converter according to an embodiment of the present invention is shown;

[0011] Figure 3 It shows Figure 2 3D exploded and perspective view of power module 20 in the image;

[0012] Figure 4 A power module 20 according to an embodiment of the present invention is shown along... Figure 2 A schematic diagram of the cross-section of the dashed line AA' shown;

[0013] Figure 5 A bottom view of an inductor assembly 203 according to an embodiment of the present invention is shown;

[0014] Figure 6 A top view of the device layer 202 according to an embodiment of the present invention is shown;

[0015] Figure 7 A bottom view of the device layer 202 according to an embodiment of the present invention is shown;

[0016] Figure 8 A bottom view of the underlying substrate 201 according to an embodiment of the present invention is shown;

[0017] Figure 9 A side view of a system 90 employing a power module 20 according to an embodiment of the present invention is shown;

[0018] Figure 10 A power module 30 implementing a two-phase power converter according to another embodiment of the present invention is shown;

[0019] Figure 11 An embodiment of the present invention is shown. Figure 10 3D exploded perspective view of the power supply module 30;

[0020] Figure 12 A bottom view of an inductor assembly 303 according to an embodiment of the present invention is shown;

[0021] Figure 13 A top view of device layer 302 according to an embodiment of the present invention is shown;

[0022] Figure 14 A bottom view of the device layer 302 according to an embodiment of the present invention is shown;

[0023] Figure 15 An example of an embodiment of the invention is shown. Figure 10 Cross-sectional view of the power module 30 taken from the CC' line;

[0024] Figure 16 An example of an embodiment of the invention is shown. Figure 10Cross-sectional view of the power module taken from the DD' line (30mm section);

[0025] Figure 17 A power supply module 40 implementing a two-phase power converter according to another embodiment of the present invention is shown;

[0026] Figure 18 An embodiment of the present invention is shown. Figure 17 3D exploded perspective view of the power supply module 40;

[0027] Figure 19 A bottom view of an inductor assembly 403 according to an embodiment of the present invention is shown;

[0028] Figure 20 A bottom view of device layer 402 according to an embodiment of the present invention is shown;

[0029] Figure 21 A power module 40 according to an embodiment of the present invention is shown. Figure 17 Cross-sectional view of the EE' line;

[0030] Figure 22 A power module 50 implementing a two-phase power converter according to another embodiment of the present invention is shown;

[0031] Figure 23 An embodiment of the present invention is shown. Figure 22 Exploded perspective view of power module 50 in the middle;

[0032] Figure 24 A bottom view of an inductor assembly 503 according to an embodiment of the present invention is shown;

[0033] Figure 25 A bottom view of device layer 502 according to an embodiment of the present invention is shown;

[0034] Figure 26 A power module 50 according to an embodiment of the present invention is shown. Figure 22 Cross-sectional view of the FF' line;

[0035] Figure 27 A power module 50 according to an embodiment of the present invention is shown. Figure 22 Cross-sectional view of the GG' line.

[0036] In the accompanying drawings, the same or corresponding reference numerals are used to denote the same or corresponding elements. Detailed Implementation

[0037] Specific embodiments of the present invention will now be described in detail. It should be noted that the embodiments described herein are for illustrative purposes only and are not intended to limit the invention. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, it will be apparent to those skilled in the art that these specific details are not necessary to practice the invention. In other instances, well-known circuits, materials, or methods have not been specifically described to avoid obscuring the invention.

[0038] Throughout this specification, references to “an embodiment,” “an example,” or “an example” mean that a particular feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment of the invention. Therefore, the phrases “in an embodiment,” “in an embodiment,” “an example,” or “an example” appearing in various places throughout the specification do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, or characteristics can be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. Moreover, those skilled in the art will understand that the accompanying drawings provided herein are for illustrative purposes and are not necessarily drawn to scale. It should be understood that when an element is referred to as “coupled to” or “connected to” another element, it can be directly coupled to or coupled to the other element, or there may be intermediate elements. Conversely, when an element is referred to as “directly coupled to” or “directly connected to” another element, there are no intermediate elements. The same reference numerals indicate the same elements. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items.

[0039] Figure 1 The circuit module structure of a conventional multiphase power converter 10 is shown. This multiphase power converter 10 includes a controller 101, N power supply modules 103-1 to 103-N, and N inductors L-1 to LN for supplying power to a load 104, where N is an integer greater than or equal to 1. Figure 1 In this diagram, a power module 103 and an inductor L represent a power stage 102, also known as a single-phase circuit 102. Each power module 103 includes switching transistors M1 and M2 and a driver DR1 for providing drive signals G1 and G2 to the switching transistors M1 and M2. The controller 101 provides N switching control signals 105-1 to 105-N to N power modules 103-1 to 103-N to control the N-phase circuits 102-1 to 102-N to operate in staggered phases, that is, the N inductors L-1 to LN sequentially draw power from the input to supply the load 104. Figure 1 In this configuration, the outputs of all phase circuits are connected together, operating as a multiphase power converter. It should be understood that... Figure 1In this example, connecting the outputs of each phase of the multiphase power converter 10 together to provide energy to the load is just one application. In other applications, the multiphase power converter 10 can also operate as multiple single-phase power converters, meaning that each phase can be connected to an independent load and provide different output voltages to meet the needs of different loads.

[0040] Figure 1 The power stage 102 with BUCK topology shown is merely an example. Those skilled in the art will understand that power stages with other topologies (e.g., Boost, Buck-Boost, etc.) are also applicable to the multiphase power converters of this embodiment.

[0041] In the following embodiments of the invention, the inductors L-1 to LN can be implemented using coupled inductors or using N single inductors.

[0042] When N=2, the multiphase power converter 10 is used as a two-phase power converter, or two independent power converters. For ease of description, the invention will be explained below using a two-phase power supply module that implements a two-phase power converter as an example.

[0043] Figure 2 An external view of a power module 20 implementing a two-phase power converter according to an embodiment of the present invention is shown. Figure 1 In this configuration, when N=2, a power module 20 can be used to implement the function of the power stage 102. The power module 20 includes a bottom substrate 201, a device layer 202, and an inductor assembly 203. The bottom substrate 201 is located at the bottom of the power module 20. The device layer 202 is located above the bottom substrate 201. The inductor assembly 203 is located above the device layer 202. Figure 1 In this configuration, the power device chip integrating the power module is embedded in the device layer 202 and cannot be directly seen from the outside. The inductor L is integrated into the inductor assembly 203.

[0044] Figure 3 It shows Figure 2 A three-dimensional exploded and perspective view of the power module 20. (See attached image.) Figure 3 As shown, device layer 202 includes a first power device chip 202-1, a second power device chip 202-2, a first pair of connecting posts 202-3 and 202-4, a second pair of connecting posts 202-5 and 202-6, and multiple discrete devices 202-p, embedded within device layer 202. Both the first power device chip 202-1 and the second power device chip 202-2 integrate... Figure 1 The device shown in a power module 103 integrates switching transistors M1 and M2, driver DR1, and other components not shown in the diagram. Figure 1Other auxiliary circuits are shown in the diagram. The first pair of connecting posts includes a first connecting post 202-3 and a second connecting post 202-4, as shown in the diagram. Figure 3 The two sides of the first power device chip 202-1 are shown. The second pair of connecting posts includes a third connecting post 202-5 and a fourth connecting post 202-6, as shown respectively. Figure 3 The two sides of the second power device chip 202-2 are shown. Each connecting post has a first end extending out of the device layer 202 and connected to a corresponding winding end in the inductor assembly 203, and a second end connected to the bottom substrate 201. The discrete device 202-p is a collective term, including devices such as resistors and capacitors of the power converter 10, such as the input capacitor located at the input terminal T1 that receives the input voltage Vin to provide pulse current, and the filter capacitor and resistor for powering the driver DR1 and internal logic circuits.

[0045] exist Figure 3 In this embodiment, the inductor assembly 203 includes a magnetic core 203-5, and a first winding 203-1 and a second winding 203-2 passing through the magnetic core 203-5. The first winding 203-1 and the magnetic core 203-5 are configured as follows: Figure 1 The first inductor L-1 is shown. The second winding 203-2 and the magnetic core 203-5 form a structure as shown. Figure 1 The second inductor L-2 is shown. Furthermore, the inductor assembly 203 also includes a first heat sink 203-3 and a second heat sink 203-4. Figure 3 In this embodiment, the first heat sink 203-3 and the second heat sink 203-4 are C-shaped and cover a portion of the surface of the magnetic core 203-5. For example... Figure 3As shown, the first heat sink 203-3 has a first portion 203-3a covering a portion of the first surface 203-5a of the magnetic core 203-5, a second portion 203-3b covering a portion of the second surface 203-5b of the magnetic core 203-5, and a third portion 203-3c covering a portion of the third surface 203-5c of the magnetic core 203-5, and connects the first portion 203-3a and the second portion 203-3b. The first surface 203-5a and the second surface 203-5b of the magnetic core 203-5 are opposite to each other, and the third surface 203-5c is perpendicular to the first surface 203-5a and the second surface 203-5b. The second heat sink 203-4 has a first portion 203-4a covering the first surface 203-5a of the magnetic core 203-5, a second portion 203-4b covering the second surface 203-5b of the magnetic core 203-5, and a third portion 203-4c covering the fourth surface 203-5d of the magnetic core 203-5, and connects the first portion 203-4a and the second portion 203-4b. The fourth surface 203-5d is opposite to the third surface 203-5c and perpendicular to the first surface 203-5a and the second surface 203-5b. The surface of the magnetic core 203-5 is the surface of the inductor assembly 203. It should be understood that the shapes of the first heat sink 203-3 and the second heat sink 203-4 may vary depending on the application. For example, in some applications, the first heat sink 203-3 may be "L" shaped, i.e., including... Figure 3 Similarly, the second heat sink 203-4 can also be L-shaped, including the second part 203-3b and the third part 203-3c shown. Figure 3 The second part 203-4b and the third part 203-4c are shown.

[0046] Figure 4 A power module 20 according to an embodiment of the present invention is shown along... Figure 2 The cross-sectional diagram of the dashed line AA' shown. Figure 5 A bottom view of an inductor assembly 203 according to an embodiment of the present invention is shown, showing the second surface 203-5b of the inductor assembly 203. Figure 6 A top view of the device layer 202 according to an embodiment of the present invention is shown, that is, the first surface 202-a of the device layer 202 is shown. Figure 7 A bottom view of the device layer 202 according to an embodiment of the present invention is shown, specifically showing the second surface 202-b of the device layer 202. The following will refer to... Figure 3-7 Let's describe the structure of the power module 20 in detail.

[0047] like Figure 4 As shown, the first power device chip 202-1 has a first surface 202-1a and a second surface 202-1b opposite to it. Figure 4 and 6 As shown, the first surface 202-1a is covered by a heat dissipation layer 202-7. The second surface 202-1b has multiple pins 202-1e (including input pin PVIN, ground pin PGND, switch pin PSW1, drive pin PDRV1, etc.), as... Figure 4 and 7 The second surface 202-b shown is exposed to the device layer 202 and connected to the underlying substrate 201. Similarly, the second power device chip 202-2 has a first surface 202-2a and a second surface 202-2b opposite to it. Figure 6 As shown, the first surface 202-2a is covered by a heat dissipation layer 202-8. The second surface 202-2b has multiple pins 202-2e (including input pin PVIN, ground pin PGND, switch pin PSW2, drive pin PDRV2, etc.), as... Figure 7 The second surface 202-b shown is exposed to the device layer 202 and connected to the underlying substrate 201. It should be understood that, as Figure 4 and 7 The pins of the power device chips shown are for illustrative purposes only and do not limit the scope of the invention. In practical applications, each power device chip may have more pins. Furthermore, the size and position distribution of the pins also vary in different applications. The heat dissipation layers 202-7 and 202-8 are used to dissipate heat from the chip. In some embodiments, heat dissipation layers 202-7 and 202-8 are made of copper. In other embodiments, the heat dissipation layers may be made of other materials. Those skilled in the art should understand that any device that can transfer heat away from the power device chip can be used as the heat dissipation layer of the present invention. In one embodiment, the second portion 203-3b of the first heat sink 203-3 and the second portion 203-4b of the second heat sink 203-4 extend toward each other and are connected together to form a single structure. In one embodiment, the first portion 203-3a of the first heat sink 203-3 and the first portion 203-4a of the second heat sink 203-4 extend toward each other and are connected together to form a single structure. In one embodiment, the first portion 203-3a of the first heat sink 203-3 and the first portion 203-4a of the second heat sink 203-4 are removed, and an external heat sink dissipates heat from the first power device chip 202-1 and the second power device chip 202-2 through the third portion 203-3c of the first heat sink 203-3 and the third portion 203-4c of the second heat sink 203-4. Similarly, the heat dissipation layers 202-7 and 202-8 covering the first power device chip 202-1 and the second power device chip 202-2 can also extend and connect together to form a whole structure.

[0048] As mentioned earlier, the first power device chip 202-1 integrates, for example, Figure 1 The shown switches M1, M2, and driver DR1, as well as others not shown in the diagram, are also included. Figure 1 Some auxiliary circuits are shown in the diagram. The pins 202-1e of the first power device chip 202-1 include, for example... Figure 7 The input pin PVIN, switch pin PSW1, ground pin PGNG, and drive pin PDRV1 are shown. The first switch M1 has a first terminal coupled to the input pin PVIN (corresponding to...). Figure 1 The input terminal T1 shown is used to receive the input voltage Vin (e.g., ...). Figure 1 As shown), it has a second terminal coupled to the switch pin PSW1 (corresponding to, as shown in the figure). Figure 1 The switch terminal S1 shown has a control terminal for receiving the first drive signal G1. The second switch M2 has a first terminal switch pin PSW1, a second terminal coupled to the ground pin PGND, and a control terminal for receiving the second drive signal G2. The driver DR1 is coupled to the drive pin PDRV1 to receive the switch control signal 105, and provides the first drive signal G1 and the second drive signal G2 based on the switch control signal 105. The pins of the first power device chip 202-1 and the second power device chip 202-2 are electrically connected to external circuits, devices, or components through the underlying substrate 201. The underlying substrate 201 may be placed on the motherboard where the load (such as CPU, GPU, etc.) is located, and there may be other circuits, devices, or components on the motherboard for providing the input voltage Vin, the switch control signal 105, and the reference ground voltage GND. This reference ground is provided to the first power device chip 202-1 and the second power device chip 202-2 through the ground pin PGND.

[0049] Those skilled in the art should understand that the second power device chip 202-2 has the same structure as the first power device chip 202-1, and will not be described in detail here.

[0050] The first winding 203-1 and the second winding 203-2 have an inverted "U"-shaped structure embedded within the magnetic core 203-5 and are parallel to each other. Figure 4 In the illustrated embodiment, the first winding 203-1 has a first portion 203-1a, a second portion 203-1b, and a third portion 203-1c. The third portion 203-1c is parallel to the first surface 203-5a and the second surface 203-5b of the magnetic core 203-5, and to the first surface of the device layer 202, and connects the first portion 203-1a and the second portion 203-1b. The first portion 203-1a and the second portion 203-1b each have endpoints 203-1ae and 203-1be extending from the second surface 203-5b of the magnetic core 203-5, respectively. Figure 5As shown, the endpoint 203-1ae of the first portion 203-1a of the first winding 203-1 extends from the second plane 203-5b of the magnetic core 203-5 and is electrically connected to the first connecting post 202-3 embedded in the device layer 202 by welding or other similar means, as shown. Figure 4 As shown. Figure 5 As shown, the endpoint 203-1be of the second portion 203-1b of the first winding 203-1 extends from the second plane 203-5b of the magnetic core 203-5 and is electrically connected to the second connecting post 202-4 embedded in the device layer 202 by welding or other similar means, as shown. Figure 4 As shown. It should be understood that the structure and connection method of the second winding 203-2 are similar to those of the first winding 203-1, that is, the two ends 203-2ae and 203-2be of the second winding 203-2 are electrically connected to the third connecting post 202-5 and the fourth connecting post 202-6, respectively.

[0051] like Figure 5 As shown, the second portion 203-3b of the first heat sink 203-3 partially covers the second surface 203-5b of the magnetic core 203-5, and directly or indirectly contacts the heat dissipation layer 202-7 through thermally conductive adhesive, as shown. Figure 4 As shown. Similarly, the second portion 203-4b of the second heat sink 203-4 partially covers the second surface 203-5b of the magnetic core 203-5 and contacts the heat dissipation layer 202-8 directly or indirectly through conductive adhesive. In one embodiment, the first heat sink 203-3 and the second heat sink 203-4 are made of copper and transfer heat by contacting the heat dissipation layers on the power device chips 202-1 and 202-2. Accordingly, the heat of the power device chips is transferred through their respective heat dissipation layers and heat sinks. The heat sinks 203-3 and 203-4 are attached to the surface of the magnetic core 203-5 through thermal adhesive, thermal paste, or direct contact.

[0052] like Figure 6 As shown, the first connecting post 202-3 has one end extending from the first surface 202-a of the device layer 202, and as... Figure 4 The first portion 203-1a of the first winding 203-1 is shown connected to one end 203-1ae, and the other end is connected to the bottom substrate 201 via the first switch terminal SSW1. Furthermore, the first end 203-1ae of the first portion 203-1a of the first winding 203-1 is electrically connected to the switch pin PSW1 of the first power device chip 202-1 via the first connecting post 202-3 and the conductive lines in the bottom substrate 201. Thus, the first power device chip 202-1 further dissipates heat through the first connecting post 202-3 and the first winding 203-1. The second connecting post 202-4 has one end extending from the first surface 202-a of the device layer 202, and as shown... Figure 4 The second portion 203-1b of the first winding 203-1 is shown connected at one end 203-1be, and the other end is connected to the underlying substrate 201 via the first output voltage terminal SVOUT1. Figure 6 As shown, the third connecting post 202-5 has one end extending from the first surface 202-a of the device layer 202 and connected to one end 203-2ae of the first portion 203-2a of the second winding 203-2, and the other end connected to the bottom substrate 201 via the second switching terminal SSW2. Furthermore, one end 203-2ae of the first portion 203-2a of the second winding 203-2 is electrically connected to the switching pin PSW2 of the second power device chip 202-2 through the conductive lines in the third connecting post 202-5 and the bottom substrate 201. Thus, the second power device chip 202-2 further dissipates heat through the third connecting post 202-5 and the second winding 203-2. The fourth connecting post 202-6 has one end extending from the first surface 202-a of the device layer 202 and connected to one end 203-2be of the second portion 203-2b of the second winding 203-2, and the other end connected to the bottom substrate 201 via the second output voltage terminal SVOUT2. In some embodiments of the present invention, the connecting posts 202-3 to 202-6 are soldered to the bottom substrate 201, and the first switching terminal SSW1, the first output voltage terminal SVOUT1, the second switching terminal SSW2, and the second output voltage terminal SVOUT2 are soldered to the ends of the connecting posts 202-3 to 202-6. It should be understood that in other embodiments, the connecting posts 202-3 to 202-6 can be directly connected to the bottom substrate 201, or they can be connected to the bottom substrate 201 through other existing methods. For example, the connecting posts 202-3 to 202-6 can extend from the bottom surface 202-b of the device layer 202 and be inserted into the corresponding grooves of the bottom substrate 201.

[0053] like Figure 7 As shown, the first power device chip 202-1 has a signal pin PSIG1, which can be used to transmit signals between the first power device chip 201 and external circuits, such as temperature detection signals, current detection signals, and other necessary signals. The second power device chip 202-2 has a signal pin PSIG2, which can be used to transmit signals between the second power device chip 202 and external circuits, such as temperature detection signals, current detection signals, and other necessary signals. Figure 7 In this diagram, drive pin PDRV1 is one of multiple signal pins PSIG1, and drive pin PDRV2 is one of multiple signal pins PSIG2. Drive pins PDRV1 and PDRV2 are used as examples to illustrate the connection method of signal pins. Other signal pins, such as those used to transmit temperature or current detection signals, are... Figure 7Not specifically shown in the text, for the sake of simplicity. For example... Figure 7 As shown in the embodiment, each discrete component 202-p, i.e., a capacitor and a resistor, has two leads or pads exposed on the second surface 202-b of the device layer 202 and connected to the underlying substrate 201. These discrete components 202-p are electrically connected to the power device chips 202-1 and 202-2 and some other external components and circuits through the underlying substrate 201. Those skilled in the art will understand that... Figure 7 The pins shown are for illustrative purposes only and should not be construed as limiting the invention. In practical applications, the pin and solder joint distribution on the second surface of device layer 202 will vary depending on the specific application requirements.

[0054] Figure 8 A bottom view of the substrate 201 according to an embodiment of the present invention is shown, specifically a schematic diagram of the second surface 201-b of the substrate 201. The second surface 201-b of the substrate 201 includes a signal pad area TSIG, an input pad area TVIN, a ground pad area TGND, a first output voltage pad area TVOUT1, and a second output voltage pad area TVOUT2, wherein each pad area includes multiple pads. The pads on the second surface 201-b of the substrate 201 are electrically connected to its first surface 201-a through vias and conductive lines in the substrate 201. Multiple pads in the signal pad area TSIG are respectively connected to the signal pins PSIG1 of the corresponding first power device chip 202-1 and PSIG2 of the corresponding second power device chip 202-2. These signal pins include drive pins PDRV1, PDRV2, temperature detection pins, etc. Multiple pads in the input pad area TVIN are electrically connected to the input voltage pins PVIN of the first power device chip 202-1 and the second power device chip 202-2. Multiple pins in the ground pad area TGND are electrically connected to the ground pins PGND of the first power device chip 202-1 and the second power device chip 202-2. Multiple pads in the first output voltage pad area TVOUT1 are electrically connected to the second portion 203-1b of the first winding 203-1 via the second connecting post 202-4. Multiple pads in the second output voltage pad area TVOUT2 are electrically connected to the second portion 203-2b of the second winding 203-2 via the fourth connecting post 202-6. In one embodiment, the pads in the first output voltage pad area TVOUT1 and the second output voltage pad area TVOUT2 are not interconnected, and the power module 20 includes two independent voltage converters. In some embodiments, the pads in the first output voltage pad area TVOUT1 and the second output voltage pad area TVOUT2 are electrically connected to each other via conductive lines on the underlying substrate 201 or external lines, thereby enabling the power module 20 to operate as a single two-phase voltage converter.

[0055] This invention improves the power integration of a power module by stacking a base substrate 201, a device layer 202, and an inductor assembly 203 vertically. In the illustrated embodiment of this invention, the first portion and the second portion of the first winding and the second winding of the inductor assembly are exposed on the surface of the magnetic core. It should be understood that in some embodiments, the first portion and the second portion of the first winding and the second winding of the inductor assembly may also be located inside the magnetic core and not exposed on its surface, thereby utilizing the magnetic core 205 and the device layer 202 in the inductor assembly to shield switching noise and provide better noise immunity than existing power modules.

[0056] In this embodiment of the invention, the power device chip embedded in the device layer dissipates heat through the heat dissipation layer on the top surface and the pins connected to the bottom substrate 201 on the bottom surface. It can also dissipate heat through the windings and magnetic core of the inductor assembly, so that the power module as a whole has good heat dissipation characteristics.

[0057] In one embodiment, the device layer 202 is formed by the following steps: first, power device chips 202-1 and 202-2, discrete components 202-p, and connecting posts 202-3 to 202-6 are attached to the base plate 201; then, all the above-mentioned devices are encapsulated with a molding compound, and the device layer 202 is formed by molding. After placing the inductor assembly 203 on the device layer 202, the power module 20 is formed. Compared with the prior art, the above-mentioned power module 20 has a simple manufacturing process, high process reliability, and high device yield.

[0058] It should be understood that the device layer 202 can also be fabricated in other ways. For example, the power device chips 202-1 and 202-2, discrete components 202-p, and connecting posts 202-3 to 202-6 can be integrated into a printed circuit board or between multiple printed circuit boards using the process of fabricating a printed circuit board layer.

[0059] In one embodiment, the underlying substrate 201 is a PCB board.

[0060] Figure 9 A side view of a system 90 employing a power module 20 according to an embodiment of the present invention is shown. The system 90 includes a motherboard 901, a load 902, external components 903 and 904, a power module 20, and a heat sink 905. Figure 9In this embodiment, the load 902 and the power module 20 are respectively attached to opposite sides of the motherboard 901, which greatly shortens the power transmission path and improves power efficiency. The load 902 can be a CPU, GPU, or any other microprocessor. The power module 20 is fixed to the motherboard 901 via a bottom substrate 201. A heatsink 905 covers the top of the power module 20 for heat dissipation. External components 903 and 904 can be devices that provide power (e.g., input voltage Vin) to the power module 20 or provide switching control signals 105. In other embodiments, the power module 20 and the load 902 can also be placed on the same surface of the motherboard 901.

[0061] This invention uses a power module integrating a two-phase power converter as an example to illustrate the structure of the power module of this invention. It should be understood that the power module of this invention can also realize a single-phase power converter with a single power device chip and a single inductor, and can be expanded to include multiple power device chips and inductor assemblies with multiple inductors to realize multiple power converters or multi-phase power converters.

[0062] Figure 10 A power supply module 30 for a two-phase power converter according to another embodiment of the present invention is shown. The power supply module 30 can be used to implement... Figure 1 The power stage 102 (N=2) is included. The power module 30 includes a bottom substrate 301, a device layer 302, and an inductor assembly 303. For example... Figure 10 As shown, the power module 30 has a stacked structure, i.e., a bottom substrate 301 is disposed at the bottom of the power module 30, having a first surface facing the device layer 302 and a second surface facing away from the first surface. The second surface is used for external connection. The device layer 302 is disposed on the bottom substrate 301, and the inductor assembly 303 is disposed on the device layer 302. The inductor assembly 303 includes a first winding 303-1, a second winding 303-2, and a magnetic core 303-5, thereby integrating inductors L (e.g., L-1 and L-2) within the inductor assembly 303. Figure 10 In the illustrated embodiment, the inductor assembly 303 further includes heat sinks 303-3 and 303-4.

[0063] In one embodiment, the second surface of the bottom substrate 301 includes an output first voltage pad area, a second output voltage pad area, an input pad area, a ground pad area, and a signal pad area, wherein the structure and connection method of each pad area are consistent with... Figure 8 The corresponding pad areas on the second surface 201-b of the bottom substrate 201 shown are the same, and for the sake of simplicity, they will not be described in detail here.

[0064] Figure 11 An embodiment of the present invention is shown. Figure 10 A three-dimensional exploded perspective view of the power supply module 30. (See attached image.) Figure 11 As shown, device layer 302 includes a first power device chip 302-1, a second power device chip 302-2, connecting posts 302-3, 302-4, 302-5, and 302-6, and a plurality of discrete devices 302-p, which are at least partially embedded within device layer 302. Both the first power device chip 302-1 and the second power device chip 302-2 integrate devices such as... Figure 1 The devices in the power module 103 shown integrate switching transistors M1 and M2, driver DR1, and other components not shown in the diagram. Figure 1 Other auxiliary circuits are shown in the diagram. For example... Figure 11 As shown, device layer 302 has a first surface 302-a and an opposite second surface 302-b. A first power device chip 302-1 is at least partially covered by a heat dissipation layer 302-7, and a second power device chip 302-2 is at least partially covered by a heat dissipation layer 302-8. Heat dissipation layers 302-7 and 302-8 each have a surface exposed to the first surface 302-a of device layer 302. Figure 11 In the illustrated embodiment, the switch pin of the first power device chip 302-1 is electrically connected to the heat dissipation layer 302-7 through the conductive lines of the bottom substrate 301, the connecting post 302-3, and the heat sink 303-3; similarly, the switch pin of the second power device chip 302-2 is electrically connected to the heat dissipation layer 302-8 through the conductive lines of the bottom substrate, the connecting post 302-5, and the heat sink 303-4. This connection structure will... Figure 14 Further explanation is provided in subsequent illustrations. Each of the connecting posts 302-3, 302-4, 302-5, and 302-6 has a first end and a second end. The first end is exposed on a first surface 302-a of the device layer 302 to connect to the inductor assembly 303, and the second end is exposed on a second surface 302-b to connect to the underlying substrate 301. It should be noted that: Although Figure 11 The connecting post shown is cylindrical, but embodiments of the present invention can use connecting posts of any geometric shape. Discrete device 302-p includes resistors and capacitors for the power converter 10, such as an input capacitor disposed at the input terminal T1 of the power converter 10 to receive the input voltage Vin and provide pulse current, and power supplies for the driver DR1 and internal logic circuitry. Figure 1 (Not shown) Filter capacitors and resistors, etc.

[0065] exist Figure 11 In the illustrated embodiment, the first winding 303-1 and the second winding 303-2 pass through the magnetic core 303-5. The first winding 303-1 and the magnetic core 303-5 together constitute... Figure 1 The first inductor L-1, the second winding 303-2, and the magnetic core 303-5 together constitute the structure shown. Figure 1The second inductor L-2 is shown. In one embodiment, the first winding 303-1 and the second winding 303-2 are made of copper. Heat sinks 303-3 and 303-4 are both C-shaped and cover a portion of the surface of the magnetic core 303-5. Specifically, the heat sink 303-3 includes a first portion 303-3a, a second portion 303-3b, and a third portion 303-3c, wherein the first portion 303-3a covers at least a portion of the first surface 303-5a, the second portion 303-3b covers at least a portion of the second surface 303-5b of the magnetic core 303-5, and the third portion 303-3c connects the first portion 303-3a and the second portion 303-3b and covers at least a portion of the magnetic core 303-5. The first surface 303-5a of the magnetic core 303-5 faces the second surface 303-5b, while the third surface 303-5c is perpendicular to both the first and second surfaces 303-5a and 303-5b. Similarly, the heat sink 303-4 includes a first portion 303-4a, a second portion 303-4b, and a third portion 303-4c, wherein the first portion 303-4a covers at least a portion of the first surface 303-5a, the second portion 303-4b covers at least a portion of the second surface 303-4b of the magnetic core 303-5, and the third portion 303-4c connects the first portion 303-4a and the second portion 303-4b and covers at least a portion of the magnetic core 303-5. The fourth surface 303-5d of the magnetic core 303-5 faces the third surface 303-5c and is also perpendicular to the first and second surfaces 303-5a and 303-5b. Figure 11 As shown, the magnetic core 303-5 also includes a fifth surface 303-5e and a sixth surface 303-5f that are opposite to each other. Both surfaces are perpendicular to the first surface 303-5a and the second surface 303-5b. It should be noted that each surface of the magnetic core 303-5 is equivalent to the corresponding surface of the inductor assembly 303. The geometry of the heat sinks 303-3 and 303-4 can be adjusted according to the application scenario. For example, heat sink 303-3 can adopt an "L"-shaped structure including only the second part 303-3b and the third part 303-3c, and heat sink 303-4 can also adopt an "L"-shaped structure including only parts 303-4b and 303-4c. In one embodiment, both heat sinks 303-3 and 303-4 are made of copper.

[0066] exist Figure 11 In the illustrated embodiment, the first winding 303-1 and the second winding 303-2 are at least partially embedded within the magnetic core 303-5. Specifically, both the first winding 303-1 and the second winding 303-2 are at least partially exposed on one or more surfaces of the magnetic core 303-5. Figure 11In the illustrated embodiment, the first winding 303-1 includes a first portion 303-1a, a second portion 303-1b, and a third portion 303-1c connecting the first portion 303-1a and the second portion 303-1b. The second winding 303-2 includes a first portion 303-2a, a second portion 303-2b, and a third portion 303-2c connecting the first portion 303-2a and the second portion 303-2b. The third portion 303-1c of the first winding 303-1 and the third portion 303-2c of the second winding 303-2 are parallel to each other, and their top surfaces are both parallel to the first surface 303-5a of the magnetic core 303-5. The first portion 303-1a and the second portion 303-1b of the first winding 303-1 are both partially exposed to the second surface 303-5b of the magnetic core 303-5, and the first portion 303-2a and the second portion 303-2b of the second winding 303-2 are also partially exposed to the second surface 303-5b of the magnetic core 303-5. In one embodiment, the first portion 303-1a of the first winding 303-1 is further partially exposed to the fifth surface 303-5e of the magnetic core 303-5, and the second portion 303-1b of the first winding 303-1 is further partially exposed to the sixth surface 303-5f of the magnetic core 303-5; similarly, the first portion 303-2a of the second winding 303-2 is further partially exposed to the fifth surface 303-5e of the magnetic core 303-5, and the second portion 303-2b of the second winding 303-2 is further partially exposed to the sixth surface 303-5f of the magnetic core 303-5.

[0067] After the bottom substrate 301, device layer 302, and inductor assembly 303 are assembled, the second surface 302-b of device layer 302 faces the first surface of bottom substrate 301, and the second surface 303-5b of inductor assembly 303 faces the first surface 302-a of device layer 302. The first portion 303-1a of the first winding 303-1 is electrically connected to heat dissipation layer 302-7, and the first portion 303-2a of the second winding 303-2 is electrically connected to heat dissipation layer 302-8. The second portion 303-1b of the first winding 303-1 is electrically connected to connecting post 302-4, and the second portion 303-2b of the second winding 303-2 is electrically connected to connecting post 302-6. The second portion 303-1b of the first winding 303-1 and the second portion 303-2b of the second winding 303-2 are electrically connected to the first output voltage pad area and the second output voltage pad area through device layer 302 and bottom substrate 301, respectively. The second portion 303-3b of heat sink 303-3 is electrically connected to connecting post 302-3 and heat dissipation layer 302-7, and the second portion 303-4b of heat sink 303-4 is electrically connected to connecting post 302-5 and heat dissipation layer 302-8. In one embodiment, the second portion 303-3b of heat sink 303-3 is physically connected to the first end of connecting post 302-3 by welding or conductive adhesive, and the second portion 303-4b of heat sink 303-4 is physically connected to the first end of connecting post 302-5 by welding or conductive adhesive. By electrically connecting heat sinks 303-3 and 303-4 to device layer 302, heat sinks 303-3 and 303-4 are configured to simultaneously transfer heat and current. Specifically, when the power module 30 is powered on, heat sinks 303-3 and 303-4 transfer heat from the first power device chip 302-1 and the second power device chip 302-2 to the environment or external components, while simultaneously transferring current from the first power device chip 302-1 and the second power device chip 302-2 to the first winding 303-1 and the second winding 303-2. Therefore, the heat flow of the power module 30 is optimized, which will... Figure 15 Further explanation will be provided in the accompanying diagrams.

[0068] Figure 12 A bottom view of an inductor assembly 303 according to an embodiment of the present invention is shown, specifically the second surface 303-5b of the inductor assembly 303. Figure 12 In the illustrated embodiment, the first portion 303-1a of the first winding 303-1 has an end 303-1ae, and the second portion 303-1b of the first winding 303-1 has an end 303-1be. For example... Figure 12As shown, the end 303-1ae of the first portion 303-1a of the first winding 303-1 is exposed to the second surface 303-5b of the magnetic core 303-5 and is electrically connected to the heat dissipation layer 302-7. The end 303-1be of the second portion 303-1b of the first winding 303-1 is also exposed to the second surface 303-5b of the magnetic core 303-5 and is electrically connected to the connecting post 302-4. In one embodiment, the end 303-1ae of the first portion 303-1a of the first winding 303-1 is physically in contact with the surface of the heat dissipation layer 302-7 by welding or conductive adhesive, and the end 303-2be of the second winding 303-2 is physically in contact with the connecting post 302-6 by welding or conductive adhesive. Those skilled in the art should understand that the structure of the second winding 303-2 is similar to... Figure 11 The structure of the first winding 303-1 shown is similar, and the end 303-2ae of the second winding 303-2 is electrically connected to the heat dissipation layer 302-8, and the other end 303-2be of the second winding 303-2 is electrically connected to the connecting post 302-6. In one embodiment, the end 303-2ae of the second winding 303-2 is in physical contact with the surface of the heat dissipation layer 302-8 by welding or conductive adhesive, and the end 303-2be of the second winding 303-2 is in physical contact with the connecting post 302-6 by welding or conductive adhesive.

[0069] Figure 13 A top view of device layer 302 according to an embodiment of the present invention is shown. Figure 13 As shown, the top surface 302-1a of the first power device chip 302-1 is partially covered by a heat dissipation layer 302-7, and the top surface 302-2a of the second power device chip 302-2 is partially covered by a heat dissipation layer 302-8. The top surface 302-1a of the first power device chip 302-1 has a long side x1 and a short side y1, and the top surface 302-2a of the second power device chip 302-2 has a long side x2 and a short side y2. In the aforementioned embodiment, the power module 20 sets the connecting posts on two opposite edges of the top surface of the corresponding power device chip. Unlike the power module 20, in Figure 13 In the illustrated embodiment, the connecting posts 302-3 and 302-4 of the power module 30 are arranged on adjacent edges of the top surface 302-1a of the first power device chip 302-1. Specifically, connecting post 302-3 is adjacent to the long side x1 of the top surface 302-1a of the first power device chip 302-1, and connecting post 302-4 is adjacent to the short side y1 of the top surface 302-1a of the first power device chip 302-1. Similarly, connecting post 302-5 is adjacent to the long side x2 of the top surface 302-2a of the second power device chip 302-2, and connecting post 302-6 is adjacent to the short side y2 of the top surface 302-2a of the second power device chip 302-2.

[0070] Figure 14 A bottom view of the device layer 302 according to an embodiment of the present invention is shown. As previously described, both the first power device chip 302-1 and the second power device chip 302-2 integrate... Figure 1 The switches M1 and M2, driver DR1, and other auxiliary circuits are shown. Therefore, as... Figure 14 As shown, the first power device chip 302-1 and the second power device chip 302-2 each include multiple pins, specifically including: at least one input pin PVIN, at least one switch pin PSW1, at least one ground pin PGND, and a drive pin PDRV1 (for clarity of the diagram, ...). Figure 14 (Not all switch pins PSW1 and ground pin PGND are labeled). Taking the first power device chip 302-1 as an example, the common node of switches M1 and M2 is connected to at least one switch pin PSW1. Specifically, the first end of switch M1 is connected to the input pin PVIN (corresponding to...). Figure 1 The input terminal T1 is used to receive the input voltage Vin (see input terminal T1). Figure 1 The second terminal of switch M1 is connected to at least one switch pin PSW1 (corresponding to...). Figure 1 The control terminal of switch M1 receives the first drive signal G1; the first terminal of switch M2 is connected to at least one switch pin PSW1, the second terminal of switch M2 is connected to the ground pin PGND, and the control terminal of switch M2 receives the second drive signal G2. Driver DR1 receives the second drive signal G2 through the drive pin PDRV1. Figure 1 The switch control signal 105 is shown, and a first drive signal G1 and a second drive signal G2 are generated based on this signal. Multiple pins of the first power device chip 302-1 and the second power device chip 302-2 are electrically connected to external circuits, devices, or components through the bottom substrate 301. The bottom substrate 301 can be mounted on a motherboard that carries a load (CPU, GPU, etc.). The motherboard is provided with a power supply circuit that provides input voltage Vin, a control unit that generates the switch control signal 105, and a reference ground GND that provides a common ground for the first power device chip 302-1 and the second power device chip 302-2 through the ground pin PGND.

[0071] exist Figure 14In the illustrated embodiment, the second end of connecting post 302-3 is connected to the underlying substrate 301 via a first switch terminal SSW1, and connecting post 302-3 and heat sink 303-3 are electrically connected to at least one switch pin PSW1 of the first power device chip 302-1 via conductive lines inside the underlying substrate 301. The second end of connecting post 302-4 is connected to the underlying substrate 301 via a first output voltage terminal SVOUT1, and the second end of connecting post 302-5 is connected to the underlying substrate 301 via a second switch terminal SSW2, and connecting post 302-5 and heat sink 303-4 are electrically connected to at least one switch pin PSW2 of the second power device chip 302-2 via conductive lines inside the underlying substrate 301. The second end of connecting post 302-6 is connected to the underlying substrate 301 via a second output voltage terminal SVOUT2. In some embodiments, connecting posts 302-3, 302-4, 302-5, and 302-6 are soldered to the bottom substrate 301, and the first switch terminal SSW1, the first output voltage terminal SVOUT1, the second switch terminal SSW2, and the second output voltage terminal SVOUT2 are solder paste structures connected to the ends of each connecting post. Those skilled in the art will understand that the connecting posts can also be connected to the bottom substrate 301 by other connection methods known in the art, such as extending from the bottom surface 302-b of the device layer 302 and inserting into a groove in the bottom substrate 301.

[0072] like Figure 14 As shown, the first power device chip 302-1 also has a signal pin PSIG1, which can be configured to transmit temperature monitoring signals, current monitoring signals, and other necessary signals for communication with external circuits. Similarly, the second power device chip 302-2 also has a signal pin PSIG2, which can be configured to transmit temperature monitoring signals, current monitoring signals, and other necessary signals for communication with external circuits. Figure 14 In the diagram, drive pin PDRV1 is an example of signal pin PSIG1, and drive pin PDRV2 is an example of signal pin PSIG2. Other signal pins (such as pins transmitting temperature monitoring signals, current monitoring signals, etc.) are not included for simplicity. Figure 14 The discrete components 302-p (including capacitors, resistors, etc.) and power device chips 302-1 and 302-2, encapsulated within device layer 302, have connection terminals on the second surface of device layer 302. (See annotation). Figure 14As shown in the embodiment, each discrete component 302-p (i.e., capacitor, resistor) exposes two pins or pads on the second surface 302-b of the device layer 302 and is connected to the underlying substrate 301. The discrete component 302-p forms an electrical connection with the first power device chip 302-1, the second power device chip 302-2, and external components or external circuits through the underlying substrate 301. Those skilled in the art will understand that... Figure 14 The pin layout shown is for illustrative purposes only, and the invention is not limited thereto. The pin arrangement on the second surface of device layer 302 is determined by specific application requirements, and different applications have different pin arrangements.

[0073] Figure 15 An example of an embodiment of the invention is shown. Figure 10 Cross-sectional view of the power module taken from the CC' line. Figure 16 An example of an embodiment of the invention is shown. Figure 10 Cross-sectional view of the power module 30 taken from the DD' line. Figure 15 and Figure 16 The shaded areas in the diagram represent multiple pins of the first power device chip 302-1 and the second power device chip 302-2.

[0074] Return to reference Figure 1 Each inductor has a first terminal connected to the corresponding phase's switch terminal S1 and a second terminal providing the output voltage Vout. Taking phase 102-1 as an example, in the power module 30, the switch terminal S1 is connected to the first terminal of inductor L-1 (corresponding to the end 303-1ae of the first winding 303-1) via the first power device chip 302-1 and the first part 303-1a of the first winding 303-1. This connection path has a certain impedance and causes a certain power loss. Figure 15 , 16 The solid arrow in the diagram illustrates the current path from the first power device chip 302-1 to the first portion 303-1a of the first winding 303-1. (As shown...) Figure 15 As shown, current flows from the first power device chip 302-1 through at least one switch pin PSW1 to the bottom substrate 301, then through the conductive lines inside the bottom substrate 301 and the first switch terminal SSW1 to the connecting post 302-3, and then through the connecting post 302-3 to the heat sink 303-3. Figure 16 As shown, the current continues to flow: from the heat sink 303-3 to the heat dissipation layer 302-7, and finally through the heat dissipation layer 302-7 to reach the first part 303-1a of the first winding 303-1. It should be noted that: in Figure 15In the embodiment shown, the current path from the second power device chip 302-2 to the first part 303-2a of the second winding 303-2 is the same as the current path from the first power device chip 302-1 to the first part 303-1a of the first winding 303-1, and will not be described again for the sake of brevity.

[0075] As mentioned earlier, in Figures 2-7 In the power module 20 shown in the embodiment, the first end 203-1ae of the first winding 203-1 (corresponding to Figure 1 The first end of inductor L-1 is electrically connected to at least one switch pin PSW1 of the first power device chip 202-1 via connecting post 202-3, the first switch terminal SSW1, and the conductive lines inside the bottom substrate 201. Figure 1 The switching terminal S1). Since the connecting post 202-3 is located near the short side of the top surface of the first power device chip 202-1, the conductive lines inside the bottom substrate 201 need to extend along the long side of the top surface of the first power device chip 202-1 to connect the first switching terminal SSW1 and the switching pin PSW1, resulting in a longer conductive line, which is not conducive to reducing the packaging resistance of the power module 20.

[0076] In the power module 30, due to the use of larger heat sinks 303-3 and 303-4 and heat dissipation layers 302-7 and 302-8 to conduct current, the portion of the current path using the conductive lines within the bottom substrate 301 is reduced. Therefore, using heat sinks 303-3 and 303-4 and heat dissipation layers 302-7 and 302-8 to conduct current can significantly reduce the module packaging resistance. Furthermore, as... Figure 13 As shown, the connecting posts 302-3 and 302-5 are positioned close to the long side x1 of the top surface 302-1a of the first power device chip 302-1 and the long side x2 of the top surface 302-2a of the second power device chip 302-2, respectively, which greatly shortens the length of the conductive lines connecting the switch pin PSW1 and the first switch terminal SSW1 and the second switch terminal SSW2 inside the bottom substrate 301.

[0077] In addition, compared to heat dissipation through narrower conductive lines, the heat of the power module 30 is mainly dissipated through conductors with larger areas (including heat dissipation layer 302-7, heat dissipation layer 302-8, heat sink 303-3, heat sink 303-4, first winding 302-1, and second winding 302-2), thus improving the thermal performance of the power module 30.

[0078] Continue to refer to Figure 15 , 16 The dashed arrows 31-35 show the main heat flow paths of the power module 30. For example... Figure 15As shown by arrow 31, the heat generated by device layer 302 is conducted to heat sinks 303-3 and 303-4 through connecting posts 302-3 and 302-5. Figure 16 As shown by arrow 34, this portion of heat is further transferred through connecting columns 302-4 and 302-6 ( Figure 16 (Not shown 302-6) is conducted to the first winding 303-1 and the second winding 303-2, and then through the magnetic core 303-5 to finally reach the first surface 303-5a of the inductor assembly 303. For example... Figure 15 As shown by arrow 32, the heat generated by the first power device chip 302-1 is conducted to the heat sink 303-3 through the heat dissipation layer 302-7. Since the connecting post 302-3 is connected to the switch pin PSW1 through the internal conductive lines of the bottom substrate 301 and the first switch terminal SSW1, as... Figure 15 As shown by arrow 33, the heat generated by the first power device chip 302-1 is further conducted along the conductive lines inside the bottom substrate 301, the first switch terminal SSW1, the connecting post 302-3, and the first winding 303-1. Figure 16 As shown by arrow 35, the heat generated by the first power device chip 302-1 is also conducted to the first winding 303-1 through the heat dissipation layer 302-7, and then reaches the first surface 303-5a via the magnetic core 303-5. The heat conduction of the second power device chip 302-2 follows the same principle as that of the first power device chip 302-1, and will not be described in detail here.

[0079] It should be noted that: Figure 15 Arrows 31-33 indicate only the heat conduction path from the heat source to the heat sinks 303-3 and 303-4. After the heat reaches the heat sinks 303-3 and 303-4, some of the heat is directly dissipated through the heat sinks 303-3 and 303-4 to the top of the inductor assembly 303, while the other part of the heat is conducted through the heat sinks 303-3 and 303-4 to the magnetic core 303-5, and finally reaches the first surface 303-5a of the inductor assembly 303 via the magnetic core 303-5.

[0080] Figure 17 A power supply module 40 implementing a two-phase power converter according to another embodiment of the present invention is shown. This power supply module 40 can be used to implement… Figure 1The power stage 102 (N=2) is included. The power module 40 includes a bottom substrate 401, a device layer 402, and an inductor assembly 403. The bottom substrate 401 is disposed at the bottom of the power module 40, and has a first surface facing the device layer 402 and a second surface for external connection. The device layer 402 is disposed on the bottom substrate 401, and the inductor assembly 403 is disposed on the device layer 402. Inductors L (e.g., L-1 and L-2) are integrated inside the inductor assembly 403. Unlike the power modules 20 and 30 in the previous embodiments, in this embodiment, the first winding 403-1 and the second winding 403-2 of the inductor assembly 403, which embeds a magnetic core 403-5, also have a heat dissipation function. Therefore, the power module 40 can omit the heat sink.

[0081] In one embodiment, the second surface of the bottom substrate 401 includes a first output voltage pad area, a second output voltage pad area, an input pad area, a ground pad area, and a signal pad area. The structure and connection method of these pad areas are similar to... Figure 8 The corresponding pad areas on the second surface 201-b of the bottom substrate 201 shown are the same, and will not be described further for the sake of simplicity.

[0082] Figure 18 An embodiment of the present invention is shown. Figure 17 A three-dimensional exploded perspective view of the power supply module 40. (See attached image.) Figure 18 As shown, device layer 402 has a first surface 402-a and a second surface 402-b opposite thereto. Device layer 402 includes a first power device chip 402-1, a second power device chip 402-2, a heat dissipation layer 402-7, and a heat dissipation layer 402-8, wherein heat dissipation layer 402-7 at least partially covers the first power device chip 402-1, and heat dissipation layer 402-8 at least partially covers the second power device chip 402-2. Both heat dissipation layers 402-7 and 402-8 have a surface exposed to the first surface 402-a of device layer 402. Device layer 402 further includes connecting posts 402-3, 402-4, 402-5, 402-6, and a plurality of discrete devices 402-p, which are at least partially embedded within device layer 402. Each of the connecting posts 402-3, 402-4, 402-5, and 402-6 has a first end and a second end. The first end is exposed on the first surface 402-a of the device layer 402, and the second end is exposed on the second surface 402-b of the device layer 402. The specific structure and placement of the connecting posts 402-3, 402-4, 402-5, and 402-6, as well as the multiple discrete components 402-p, are the same as those of the connecting posts 202-3, 202-4, 202-5, and 202-6 and the multiple discrete components 202-p of the power module 20, and will not be described further for the sake of simplicity. Figure 18In the illustrated embodiment, the switching pin of the first power device chip 402-1 is electrically connected to the heat dissipation layer 402-7 through the conductive lines of the bottom substrate 401, the connecting post 402-3, and the first winding 403-1; similarly, the switching pin of the second power device chip 402-2 is electrically connected to the heat dissipation layer 402-8 through the conductive lines of the bottom substrate, the connecting post 402-5, and the second winding 403-2. This connection structure will... Figure 20 Further explanation will be provided in subsequent illustrations.

[0083] like Figure 18 As shown, the first winding 403-1 and the second winding 403-2 are at least partially embedded within the magnetic core 403-5, meaning that the first winding 403-1 and the second winding 403-2 each have at least one end exposed on a surface of the magnetic core 403-5. The first winding 403-1 and the magnetic core 403-5 are configured as follows: Figure 1 The first inductor L-1 is shown. The second winding 403-2 and the magnetic core 403-5 constitute the structure as shown. Figure 1 The second inductor L-2 is shown. In Figure 18 In the illustrated embodiment, the first winding 403-1 has a first portion 403-1a, a second portion 403-1b, and a third portion 403-1c connecting the first portion 403-1a and the second portion 403-1b. Similarly, the second winding 403-2 has a first portion 403-2a, a second portion 403-2b, and a third portion 403-2c connecting the first portion 403-2a and the second portion 403-2b. The third portion 403-1c of the first winding 403-1 is parallel to the third portion 403-2c of the second winding 403-2.

[0084] like Figure 18 As shown, the top surface of the third portion 403-1c of the first winding 403-1 and the top surface of the third portion 403-2c of the second winding 403-2 are both exposed on the first surface 403-5a of the magnetic core 403-5. The first winding 403-1 and the second winding 403-2g each have two ends exposed on the second surface 403-5b of the magnetic core 403-5, where the second surface 403-5b of the magnetic core 403-5 is opposite to the first surface 403-5a. Surfaces 403-5a and 403-5b of the magnetic core 403-5 are also surfaces of the inductor assembly 403. In one embodiment, the first winding 403-1 and the second winding 403-2 are also partially exposed on other surfaces of the magnetic core 403-5. In one embodiment, the first winding 403-1 and the second winding 403-2 are made of copper.

[0085] exist Figure 18In the illustrated embodiment, when the bottom substrate 401, device layer 402, and inductor assembly 403 are assembled together, the second surface 402-b of device layer 402 faces the first surface of bottom substrate 401, and the second surface 403-5b of inductor assembly 403 faces the first surface 402-a of device layer 402. The first portion 403-1a of the first winding 403-1 is electrically connected to the connecting post 402-3 and heat dissipation layer 402-7, and the second portion 403-1b of the first winding 403-1 is electrically connected to the connecting post 402-4. Similarly, the first portion 403-2a of the second winding 403-2 is electrically connected to the connecting post 402-5 and heat dissipation layer 402-8, and the second portion 403-2b of the second winding 403-2 is electrically connected to the connecting post 402-6.

[0086] Figure 19 A bottom view of an inductor assembly 403 according to an embodiment of the present invention is shown, namely the second surface 403-5b of the inductor assembly 403. Figure 19 In the illustrated embodiment, the bottom surface of the first portion 403-1a of the first winding 403-1 forms the end portion 403-1ae of the first winding 403-1, and the bottom surface of the second portion 403-2a of the second winding 403-2 forms the end portion 403-2ae of the second winding 403-1. Similarly, the bottom surface of the second portion 403-1b of the first winding 403-1 forms the end portion 403-1be of the first winding 403-1, and the bottom surface of the second portion 403-2b of the second winding 403-2 forms the end portion 403-2be of the second winding 403-2. Figure 19 As shown, the end 403-1ae of the first winding 403-1 is exposed on the second surface 403-5b of the magnetic core 403-5. The end 403-1be of the first winding 403-1 is electrically connected to the first end of the connecting post 402-3 and the heat dissipation layer 402-7. The end 403-1be of the first winding 403-1 is exposed on the second surface 403-5b of the magnetic core 403-5 and is electrically connected to the first end of the connecting post 402-4. Those skilled in the art should understand that the structure of the second winding 403-2 is similar to... Figure 18Similar to the first winding 403-1 shown, the end 403-2ae of the second winding 403-2 is electrically connected to the first end of the connecting post 402-5 and the heat dissipation layer 402-8, and the other end 403-2be of the second winding 403-2 is electrically connected to the first end of the connecting post 402-6. In one embodiment, the ends 403-1ae and 403-1be of the first winding 403-1 are physically in contact with the first ends of the connecting posts 402-3 and 402-4 respectively by welding or conductive adhesive, and the ends 403-2ae and 403-2be of the second winding 403-2 are physically in contact with the first ends of the connecting posts 402-5 and 402-6 respectively by welding or conductive adhesive.

[0087] Figure 20 A bottom view of the device layer 402 according to an embodiment of the present invention is shown, namely the second surface 402-b of the device layer 402. As previously described, both the first power device chip 402-1 and the second power device chip 402-2 integrate Figure 1 The diagram shows switches M1 and M2, driver DR1, and other auxiliary circuits. Therefore, both the first power device chip 402-1 and the second power device chip 402-2 have multiple pins, whose functions are similar to... Figure 7 The power device chips 202-1 and 202-2 of the power module 20 shown have multiple identical pins, wherein the common node of switches M1 and M2 is connected to at least one switch pin PSW1. Figure 20 In the illustrated embodiment, device layer 402 further includes a first switch terminal SSW1, a second switch terminal SSW2, a first output voltage terminal SVOUT1, and a second output voltage terminal SVOUT2. Connecting post 402-3 is connected to the underlying substrate 401 via the first switch terminal SSW1, connecting post 402-4 is connected to the underlying substrate 401 via the first output voltage terminal SVOUT1, connecting post 402-5 is connected to the underlying substrate 401 via the second switch terminal SSW2, and connecting post 402-6 is connected to the underlying substrate 401 via the second output voltage terminal SVOUT2.

[0088] Figure 21 A power module 40 according to an embodiment of the present invention is shown. Figure 17 A cross-sectional view of line EE' in the middle. (See diagram below.) Figure 21 As shown, the first surface portion of the first power device chip 402-1 is covered by a heat dissipation layer 402-7, and the second surface of the first power device chip 402-1 is connected via... Figure 20 The multiple pins shown are connected to the underlying substrate 401, and these multiple pins are... Figure 21 The shaded area in the image represents... Figure 21In the illustrated embodiment, dashed arrows 41-43 represent the main heat flow paths of the power module 40. As shown by arrow 41, the heat from the power device chip 402-1 is dissipated to the first winding 403-1 through the heat dissipation layer 402-7. Since the connecting post 402-3 is connected to at least one switch pin PSW1 through conductive lines within the bottom substrate 401 and the first switch terminal SSW1, the heat from the first power device chip 402-1 is further dissipated through conductive lines within the bottom substrate 401, the first switch terminal SSW1, the connecting post 402-3, and the first winding 403-1, as shown by arrow 42. The heat dissipation method of the second power device chip 402-2 is the same as that of the first power device chip 402-1, and will not be described further here for the sake of simplicity. Figure 21 As shown by arrow 43, the heat of device layer 402 is dissipated through connecting posts 402-3, 402-4, 402-5 and 402-6, the first winding 403-1 and the second winding 403-2. Figure 21 (Connecting posts 402-5 and 402-6 and the second winding 403-2 are not shown in the diagram). Therefore, in the power module 40, the first winding 403-1 and the second winding 403-2 serve the functions of both conducting heat and conducting current, thereby simplifying the structure of the power module 40 and saving costs because no additional heat sink is required. It should be noted that... Figure 21 Arrows 41-43 in the diagram only show the heat flow path from the heat source to the winding. When the heat generated by the first power device chip 402-1, the second power device chip 402-2, and the device layer 402 is conducted to the first winding 403-1 and the second winding 403-2, part of the heat is further dissipated directly to the first surface 403-5a of the inductor assembly 403 through the first winding 403-1 and the second winding 403-2, and another part of the heat is further dissipated to the magnetic core 403-5 through the first winding 403-1 and the second winding 403-2, and finally dissipated to the first surface 403-5a of the inductor assembly 403.

[0089] Figure 22 A power module 50 implementing a two-phase power converter according to another embodiment of the present invention is shown. This power module 50 can be used to implement… Figure 1 The power stage 102 (N=2) is included. The power module 50 includes a bottom substrate 501, a device layer 502, and an inductor assembly 503. The bottom substrate 501 is disposed at the bottom of the power module 50, having a first surface facing the device layer 502 and a second surface for external connection. The device layer 502 is disposed on the bottom substrate 501, and the inductor assembly 503 is disposed on the device layer 502. Inductors L (e.g., L-1 and L-2) are integrated inside the inductor assembly 503. Similar to the power module 40 in the aforementioned embodiment, the power module 50 does not require an additional heat sink.

[0090] In one embodiment, the second surface of the bottom substrate 501 of the power module 50 includes a first output voltage pad area, a second output voltage pad area, an input pad area, a ground pad area, and a signal pad area, wherein the structure and connection of the pad areas on the second surface of the bottom substrate 501 are consistent with those previously described on the bottom substrate 501. Figure 8 The pad area on the second surface 201-b of the bottom substrate 201 described herein is the same, and will not be repeated here for the sake of brevity.

[0091] Figure 23 An embodiment of the present invention is shown. Figure 22 An exploded perspective view of the power module 50. (See attached image.) Figure 23 As shown, device layer 502 has a first surface 502-a and a second surface 502-b opposite to the first surface 502-a. Device layer 502 includes a first power device chip 502-1, a second power device chip 502-2, a heat dissipation layer 502-7 that at least partially covers the first power device chip 502-1, a heat dissipation layer 502-8 that at least partially covers the second power device chip 502-2, connecting posts 502-3, 502-4, 502-5, 502-6, and a plurality of discrete components 502-p, wherein all these components of device layer 502 are at least partially embedded within device layer 502. Each connecting post 502-3, 502-4, 502-5, 502-6 has a first end exposed on the first surface. Figure 23 In the example, the switching pin of the first power device chip 502-1 is electrically connected to the heat dissipation layer 502-7 through the device layer 502, the bottom substrate 501, the connecting post 502-3, and the first winding 502-1; similarly, the switching pin of the second power device chip 502-2 is electrically connected to the heat dissipation layer 502-8 through the device layer 502, the bottom substrate 501, the connecting post 502-5, and the second winding 502-2. This part will be... Figure 25 Further details will be provided in the accompanying drawings. The specific structure of device layer 502 is the same as that of device layer 302 in power module 30, and will not be described in detail here for the sake of simplicity.

[0092] like Figure 23 As shown, the first winding 503-1 and the second winding 503-2 are at least partially embedded within the magnetic core 503-5, meaning that the first winding 503-1 and the second winding 503-2 each have at least one end exposed on a surface of the magnetic core 503-5. The first winding 503-1 and the magnetic core 503-5 constitute... Figure 1 The first inductor L-1 is shown. The second winding 503-2 and the magnetic core 503-5 constitute... Figure 1The second inductor L-2 is shown. The magnetic core 503-5 has a first surface 503-5a and a second surface 503-5b opposite to the first surface 503-5a. The surface of the magnetic core 503-5 is also the surface of the inductor module 503. Figure 1 In the illustrated embodiment, the first winding 503-1 has a first portion 503-1a, a second portion 503-1b, a third portion 503-1c, and a fourth portion 503-1d. The bottom surface of the first portion 503-1a of the first winding 503-1 is exposed on the second surface 503-5b of the magnetic core 503-5. The first portion 503-1a and the third portion 503-1c are connected via the fourth portion 503-1d located within the magnetic core 503-5. The second portion 503-1b is connected to the third portion 503-1c, and the bottom surface of the second portion 503-1b is exposed on the second surface 503-5b of the magnetic core 503-5. Similarly, the second winding 503-2 has a first portion 503-2a, a second portion 503-2b, a third portion 503-2c, and a fourth portion 503-2d, and their connection method is the same as that between the portions of the first winding 503-1. Figure 23 As shown, the top surface of the third portion 503-1c of the first winding 503-1 and the top surface of the third portion 503-2c of the second winding 503-2 are exposed on the first surface 503-5a of the magnetic core 503-5, and the fourth portions 503-1d and 503-2d are perpendicular to the first surface 503-5a of the magnetic core 503-5. In one embodiment, the first winding 503-1 and the second winding 503-2 also have portions exposed on other surfaces of the magnetic core 503-5. In a vertical view of the inductor assembly 503 (i.e., viewed from a direction perpendicular to the first surface 503-5a of the inductor assembly 503, for example from...) Figure 23 (Observing in the direction of the middle arrow H1 or arrow H2), the first portion 503-1a and the third portion 503-1c of the first winding 503-1 at least partially overlap, and the first portion 503-2a and the third portion 503-2c of the second winding 503-2 at least partially overlap. In one embodiment, both the first winding 503-1 and the second winding 503-2 are made of copper.

[0093] exist Figure 23 In the illustrated embodiment, when the bottom substrate 501, device layer 502, and inductor assembly 503 are assembled together, the first portion 503-1a of the first winding 503-1 is electrically connected to the connecting post 502-3 and the heat dissipation layer 502-7, and the second portion 503-1b of the first winding 503-1 is electrically connected to the connecting post 502-4. Similarly, the first portion 503-2a of the second winding 503-2 is electrically connected to the connecting post 502-5 and the heat dissipation layer 502-8, and the second portion 503-2b of the second winding 503-2 is electrically connected to the connecting post 502-6.

[0094] Figure 24 A bottom view of an inductor assembly 503 according to an embodiment of the present invention is shown, namely the second surface 503-5b of the inductor assembly 503. Figure 24 As shown, the bottom surface of the first portion 503-1a of the first winding 503-1 forms the end portion 503-1ae of the first winding 503-1, and the bottom surface of the second portion 503-2a of the second winding 503-2 forms the end portion 503-2ae of the second winding 503-1. The bottom surface of the second portion 503-1b of the first winding 503-1 forms the end portion 503-1be of the first winding 503-1, and the bottom surface of the second portion 503-2b of the second winding 503-2 forms the end portion 503-2be of the second winding 503-2. Figure 24 As shown, the end 503-1ae of the first winding 503-1 is exposed on the second surface 503-5b of the magnetic core 503-5, and is in physical contact with the surface of the heat dissipation layer 502-7 and the first end of the connecting post 502-3 by welding or conductive adhesive. The end 503-1be of the first winding 503-1 is exposed on the second surface 503-5 of the magnetic core 503-5, and is in physical contact with the first end of the connecting post 502-4 by welding or conductive adhesive. Similarly, the end 503-2ae of the second winding 503-2 is in physical contact with the surface of the heat dissipation layer 502-8 and the first end of the connecting post 502-5 by welding or conductive adhesive, and the end 503-2be of the second winding 503-2 is in physical contact with the first end of the connecting post 502-6 by welding or conductive adhesive.

[0095] Figure 25 A bottom view of device layer 502 (i.e., the second surface 502-b of device layer 502) according to an embodiment of the present invention is shown. Figure 25 As shown, both the first power device chip 502-1 and the second power device chip 502-2 have multiple pins, whose functions are similar to... Figure 14 The power device chips 302-1 and 302-2 of the power module 30 shown have many identical pins, which will not be described further here for the sake of simplicity. Figure 25 In the illustrated embodiment, device layer 502 further includes a first switch terminal SSW1, a second switch terminal SSW2, a first output voltage terminal SVOUT1, and a second output voltage terminal SVOUT2. Connecting post 502-3 is connected to the underlying substrate 501 via the first switch terminal SSW1, connecting post 502-4 is connected to the underlying substrate 501 via the first output voltage terminal SVOUT1, connecting post 502-5 is connected to the underlying substrate 501 via the second switch terminal SSW2, and connecting post 502-6 is connected to the underlying substrate 501 via the second output voltage terminal SVOUT2.

[0096] Figure 26 A power module 50 according to an embodiment of the present invention is shown. Figure 22 Cross-sectional view of the FF' line.

[0097] Figure 27 A power module 50 according to an embodiment of the present invention is shown. Figure 22 A cross-sectional view of the GG' line. (See diagram below.) Figure 26 As shown, the first surface of the first power device chip 502-1 is covered by a heat dissipation layer 502-7, and the second surface of the first power device chip 502-1 is connected through... Figure 25 The multiple pins described herein are connected to the underlying substrate 501. The first surface of the second power device chip 502-2 is covered by a heat dissipation layer 502-8, and the second surface of the second power device chip 502-2 is connected to the underlying substrate 501 through multiple pins. Figure 26 and Figure 27 The area is indicated by shaded regions.

[0098] Figure 26 The solid arrow in the diagram shows the current path from the first power device chip 502-1 to the first portion 503-1a of the first winding 503-1 of the power module 50. (See image.) Figure 26 As shown, current flows from the first power device chip 502-1 through at least one switch pin PSW1 to the bottom substrate 501, then through the conductive lines inside the bottom substrate 501 and the first switch terminal SSW1 to the connecting post 502-3, and then through the connecting post 502-3 to the first part 503-1a of the first winding 503-1.

[0099] exist Figure 26 and Figure 27 In the illustrated embodiment, dashed arrows 51-53 indicate the main heat flow path of the power module 50. Since the connecting post 502-3 is connected to at least one switch pin PSW1 of the first device chip 502-1 via conductive lines within the bottom substrate 501 and the first switch terminal SSW1, the heat generated by the first power device chip 502-1 is dissipated through the conductive lines, the first switch terminal SSW1, the connecting post 502-3, and the first winding 503-1, as shown... Figure 26 As shown by arrow 51 in the image. Figure 27 As shown by arrow 52, ​​the heat from the first power device chip 502-1 is further dissipated through the heat dissipation layer 502-7, and then through the first winding 503-1. The heat dissipation method for the second power device chip 502-2 is the same as that for the first power device chip 502-1, and will not be described further here for the sake of simplicity. Figure 26 and Figure 27As indicated by arrow 53, the heat of device layer 502 is dissipated through connecting posts 502-3, 502-4, 502-5 and 502-6, the first winding 503-1 and the second winding 503-2. Figure 27 (Connecting post 502-6 is not shown). It should be noted that arrows 51 to 53 only show the heat flow path from the heat source to the winding. When the heat generated by the first power device chip 502-1, the second power device chip 502-2, and the device layer 502 is conducted to the first winding 503-1 and the second winding 503-2, part of the heat is directly dissipated to the first surface 503-5a of the inductor assembly 503 through the first winding 503-1 and the second winding 503-2, and the other part of the heat is dissipated to the magnetic core 503-5 through the first winding 503-1 and the second winding 503-2, and finally dissipated to the first surface 503-5a of the inductor assembly 503.

[0100] Similar to power module 40, the first winding 503-1 and the second winding 503-2 of power module 50 also serve as heat sinks, conducting both heat and current. This simplifies the structure of power module 50 and saves cost by eliminating the need for additional heat sinks. Furthermore, since the connecting posts 502-3 and 502-5 are located near the long sides of the top surfaces of the first power device chip 502-1 and the second power device chip 502-2, respectively, the portion of the heat flow path in power module 50 that dissipates heat through the conductive lines within the bottom substrate 501 is shorter. Similarly, the portion of the current path in power module 50 that conducts current through the conductive lines within the bottom substrate 501 is also shorter. In other words, power module 50, similar to power module 30, exhibits good thermal performance and low package resistance.

[0101] Although the invention has been described with reference to several exemplary embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Since the invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A power supply module, comprising: A device layer having a first surface and a second surface opposite to the first surface of the device layer, wherein the device layer includes a first power device chip, a second power device chip, a first heat dissipation layer that at least partially covers the first power device chip, and a second heat dissipation layer that at least partially covers the second power device chip, wherein the first heat dissipation layer has a surface exposed to the first surface of the device layer, and the second heat dissipation layer has a surface exposed to the first surface of the device layer. as well as An inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, the inductor assembly comprising: magnetic core; A first winding and a second winding, at least partially embedded in a magnetic core, wherein both the first winding and the second winding have a first end and a second end, and the first end and the second end of the first winding and the second end of the second winding are exposed on a second surface of the inductor assembly; and A first heat sink and a second heat sink enclose at least a portion of the inductor assembly; wherein The first heat sink, the first end of the first winding, and the first heat dissipation layer are electrically connected, and the second heat sink, the first end of the second winding, and the second heat dissipation layer are electrically connected.

2. The power module as described in claim 1, further comprising: A substrate having a first surface and a second surface opposite to the first surface, the second surface of the substrate comprising: A first output voltage pad area having at least one pad; A second output voltage pad area having at least one pad; An input pad area having at least one pad; A ground pad area having at least one pad; and Signal pad area with at least two pads; where The device layer is disposed on the bottom substrate, with its second surface facing the first surface of the bottom substrate; an inductor assembly is disposed on the device layer, with its second surface facing the first surface of the device layer; and The second end of the first winding is electrically connected to at least one pad in the first output voltage pad area via the device layer, and the second end of the second winding is electrically connected to at least one pad in the second output voltage pad area via the device layer.

3. The power module as claimed in claim 2, wherein each of the first power device chip and the second power device chip respectively comprises: drive; First switching transistor and second switching transistor; The switch pin is electrically connected to the common node of the first and second switching transistors; An input pin is electrically connected to at least one pad in the input pad area; A grounding pin is electrically connected to at least one pad in the grounding pad area; and The drive pin is electrically connected to at least one pad in the signal pad area; wherein The first and second switching transistors each have a first terminal, a second terminal, and a control terminal. The first terminal of the first switching transistor is electrically connected to the input pin, the second terminal of the first switching transistor is electrically connected to the switch pin, and the control terminal of the first switching transistor is configured to receive a first drive signal. The first terminal of the second switching transistor is electrically connected to the switch pin, the second terminal of the second switching transistor is electrically connected to a ground pin, and the control terminal of the second switching transistor is configured to receive a second drive signal. The driver is electrically connected to the drive pin to receive the switch control signal and to provide the first drive signal and the second drive signal according to the switch control signal.

4. The power module as described in claim 1, wherein: The first power device chip and the second power device chip each include a first switching transistor and a second switching transistor switching pin, wherein the switching pin is electrically connected to a common node of the first and second switching transistors; and The device layer further includes a first connection post and a second connection post, wherein the first connection post is electrically connected to the switch pin of the first power device chip, and the second connection post is electrically connected to the switch pin of the second power device chip.

5. The power module as described in claim 4, wherein: The device layer further includes a third connecting post and a fourth connecting post, wherein the second end of the first winding is electrically connected to the third connecting post, and the second end of the second winding is electrically connected to the fourth connecting post.

6. The power module as described in claim 4, wherein: The first power device chip and the second power device chip each have a top surface. The top surface of the first power device chip is at least partially covered by a first heat dissipation layer, and the top surface of the second power device chip is at least partially covered by a second heat dissipation layer. Both the first and second power device chips have a short side and a long side on their top surfaces. A first connecting post is disposed adjacent to the long side of the top surface of the first power device chip, and a second connecting post is disposed adjacent to the long side of the top surface of the second power device chip. The first heat dissipation layer is electrically connected to the first connecting post, and the second heat dissipation layer is electrically connected to the second connecting post.

7. The power module as described in claim 6, wherein: The first heat dissipation layer is in physical contact with the end of the first connecting post by welding or conductive adhesive, and the second heat dissipation layer is in physical contact with the end of the second connecting post by welding or conductive adhesive.

8. The power module as described in claim 1, wherein: The first power device chip and the second power device chip each include a first switching transistor, a second switching transistor, and a switching pin, wherein the switching pin is electrically connected to a common node of the first and second switching transistors; and The switching pin of the first power device chip is electrically connected to the first heat dissipation layer, the first heat sink, and the first end of the first winding, and the switching pin of the second power device chip is electrically connected to the second heat dissipation layer, the second heat sink, and the first end of the second winding.

9. The power module as described in claim 1, wherein: The first heat sink has a first portion, a second portion and a third portion. The first portion of the first heat sink covers at least a portion of the second surface of the inductor assembly, and the second portion of the first heat sink covers at least a portion of the third surface of the inductor assembly. The third surface of the inductor assembly is perpendicular to the first surface and the second surface of the inductor assembly. as well as The second heat sink has a first portion, a second portion and a third portion. The first portion of the second heat sink covers at least a portion of the second surface of the inductor assembly, and the second portion of the second heat sink covers at least a portion of the fourth surface of the inductor assembly. The fourth surface of the inductor assembly is perpendicular to the first and second surfaces of the inductor assembly and is opposite to the third surface of the inductor assembly.

10. The power module of claim 9, wherein a first portion of the first heat sink and a first end of the first winding are physically in contact with the surface of the first heat dissipation layer by welding or conductive adhesive, and a first portion of the second heat sink and a first end of the second winding are physically in contact with the surface of the second heat dissipation layer by welding or conductive adhesive.

11. A power supply module, comprising: An inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, wherein the inductor assembly includes a magnetic core, a first winding and a second winding at least partially embedded in the magnetic core, the first winding and the second winding each having a first end and a second end exposed on the second surface of the inductor assembly; as well as A device layer having a first surface and a second surface opposite to the first surface of the device layer, the device layer comprising: A first power device chip and a second power device chip are at least partially embedded in the device layer, wherein the first power device chip and the second power device chip each have a first switch transistor, a second switch transistor, and a switch pin, and the switch pin is electrically connected to a common node of the first switch transistor and the second switch transistor. The first heat dissipation layer at least partially covers the first power device chip; The second heat dissipation layer at least partially covers the second power device chip; The first connection post is electrically connected to the switch pin of the first power device chip; and The second connection post is electrically connected to the switch pin of the second power device chip; wherein The first end of the first winding is electrically connected to the first heat dissipation layer and the first connecting post, and the first end of the second winding is electrically connected to the second heat dissipation layer and the second connecting post.

12. The power module of claim 11, further comprising: A bottom substrate has a first surface and a second surface opposite to the first surface of the bottom substrate, wherein the second surface of the bottom substrate includes a first output voltage pad area and a second output voltage pad area, each of the first output voltage pad area and the second output voltage pad area having at least one pad; wherein The device layer is disposed on the bottom substrate, with the second surface of the device layer facing the first surface of the bottom substrate, and the inductor assembly is disposed on the device layer with the second surface of the inductor assembly facing the first surface of the device layer.

13. The power module as described in claim 12, wherein: The second surface of the underlying substrate further includes an input pad area with at least one pad, a ground pad area with at least one pad, and a signal pad area with at least two pads; and Each of the first power device chip and the second power device chip further includes a driver, an input pin electrically connected to at least one pad in the input pad area, a ground pin electrically connected to at least one pad in the ground pad area, and a drive pin electrically connected to at least one pad in the signal pad area; wherein The first switching transistor of the first power device chip is electrically connected between the input pin and the switching pin of the first power device chip, and the second switching transistor of the first power device chip is electrically connected between the switching pin and the ground pin of the first power device chip. The driver of the first power device chip receives a first switching control signal through the driving pin of the first power device chip, and drives the first switching transistor and the second switching transistor of the first power device chip respectively based on the first switching control signal; and The first switch of the second power device chip is electrically connected between the input pin and the switch pin of the second power device chip, and the second switch of the second power device chip is electrically connected between the switch pin and the ground pin of the second power device chip. The driver of the second power device chip receives the second switch control signal through the drive pin of the second power device chip, and drives the first switch and the second switch of the second power device chip respectively based on the second switch control signal.

14. The power module as claimed in claim 12, wherein: The device layer further includes a third connecting post and a fourth connecting post; and The second end of the first winding is electrically connected to at least one pad in the first output voltage pad area via a third connecting post, and the second end of the second winding is electrically connected to at least one pad in the second output voltage pad area via a fourth connecting post.

15. The power module of claim 11, wherein the first winding and the second winding each comprise a first portion, a second portion, and a third portion, wherein: A first portion of the first winding provides a first end of the first winding, and a first portion of the second winding provides a first end of the second winding; The second portion of the first winding provides a second end of the first winding, and the second portion of the second winding provides a second end of the second winding; as well as The third portion of the first winding and the third portion of the second winding each have a top surface exposed to the first surface of the inductor assembly.

16. The power module as claimed in claim 15, wherein: In a vertical view of the inductor assembly, a first portion of the first winding at least partially overlaps with a third portion, and a first portion of the second winding at least partially overlaps with a third portion.

17. The power module as claimed in claim 16, wherein: The top surface of the first power device chip is at least partially covered by a first heat dissipation layer, and the top surface of the second power device chip is at least partially covered by a second heat dissipation layer; and The top surfaces of the first power device chip and the second power device chip both have a short side and a long side. The first connecting post is located adjacent to the long side of the top surface of the first power device chip, and the second connecting post is located adjacent to the long side of the top surface of the second power device chip.

18. The power module as claimed in claim 11, wherein: The first heat dissipation layer has a surface exposed to the first surface of the device layer, the second heat dissipation layer has a surface exposed to the first surface of the device layer, the first connecting post has an end exposed to the first surface of the device layer, and the second connecting post has an end exposed to the first surface of the device layer. as well as The first end of the first winding is in physical contact with the surface of the first heat dissipation layer and the end of the first connecting post by welding or conductive adhesive, and the first end of the second winding is in physical contact with the surface of the second heat dissipation layer and the end of the second connecting post by welding or conductive adhesive.

19. A power supply module, comprising: An inductor assembly having a first surface and a second surface opposite to the first surface of the inductor assembly, the inductor assembly including a magnetic core, a first winding and a second winding, the first winding and the second winding being at least partially embedded in the magnetic core, the first winding and the second winding each having a first end and a second end, the first end and the second end being exposed on the second surface of the inductor assembly. as well as A device layer having a first surface and a second surface opposite to the first surface of the device layer, the device layer comprising: The first power device chip and the second power device chip are at least partially embedded in the device layer; A first heat dissipation layer, at least partially covering the first power device chip; and The second heat dissipation layer at least partially covers the second power device chip; wherein The first end of the first winding is electrically connected to the first heat dissipation layer, and the first end of the second winding is electrically connected to the second heat dissipation layer.

20. The power module of claim 19, further comprising: A bottom substrate has a first surface and a second surface opposite to the first surface, wherein the second surface of the bottom substrate includes a first output voltage pad area and a second output voltage pad area; wherein The first output voltage pad area has at least one pad electrically connected to the second end of the first winding, and the second output voltage pad area has at least one pad electrically connected to the second end of the second winding; and The device layer is disposed on the bottom substrate, with the second surface of the device layer facing the first surface of the bottom substrate. The inductor assembly is disposed on the device layer, with the second surface of the inductor assembly facing the first surface of the device layer.

21. The power module of claim 19, wherein the inductor assembly further comprises: The first and second heat sinks enclose at least a portion of the inductor assembly; in The first heat sink is electrically connected to the first heat dissipation layer, and the second heat sink is electrically connected to the second heat dissipation layer.

22. The power module as claimed in claim 21, wherein: A portion of the first heat sink is in physical contact with the surface of the first heat dissipation layer by welding or conductive adhesive, and a portion of the second heat sink is in physical contact with the surface of the second heat dissipation layer by welding or conductive adhesive.

23. The power module as claimed in claim 21, wherein: The first heat sink has a first portion, a second portion and a third portion. The first portion of the first heat sink covers at least a portion of the second surface of the inductor assembly, and the second portion of the first heat sink covers at least a portion of the third surface of the inductor assembly. The third surface of the inductor assembly is perpendicular to the first surface and the second surface of the inductor assembly. as well as The second heat sink has a first portion, a second portion and a third portion. The first portion of the second heat sink covers at least a portion of the second surface of the inductor assembly, and the second portion of the second heat sink covers at least a portion of the fourth surface of the inductor assembly. The fourth surface of the inductor assembly is perpendicular to the first and second surfaces of the inductor assembly and is opposite to the third surface of the inductor assembly.

24. The power module as claimed in claim 19, wherein: Both the first power device chip and the second power device chip include a first switching transistor, a second switching transistor, and a switching pin, wherein the switching pin is electrically connected to a common node of the first and second switching transistors; and The first heat dissipation layer is electrically connected to the switch pin of the first power device chip, and the second heat dissipation layer is electrically connected to the switch pin of the second power device chip.

25. The power module as claimed in claim 24, wherein: The device layer further includes a first connection post and a second connection post, the first connection post being electrically connected to a switch pin of the first power device chip, and the second connection post being electrically connected to a switch pin of the second power device chip; and The first heat sink is electrically connected to the first connecting post, and the second heat sink is electrically connected to the second connecting post.

26. The power module as claimed in claim 24, wherein: The device layer further includes a first connecting post and a second connecting post, wherein the first connecting post is electrically connected to the switch pin of the first power device chip and the first end of the first winding, and the second connecting post is electrically connected to the switch pin of the second power device chip and the first end of the second winding.

27. The power module of claim 26, wherein both the first winding and the second winding are partially exposed on the first surface of the inductor assembly.

28. The power module of claim 24, wherein each of the first power device chip and the second power device chip further comprises: drive; Input pins; Ground pin; as well as Drive pin; in The first switching transistor of the first power device chip is electrically connected between the input pin and the switching pin of the first power device chip, and the second switching transistor of the first power device chip is electrically connected between the switching pin and the ground pin of the first power device chip. The driver of the first power device chip receives a first switching control signal through the driving pin of the first power device chip, and drives the first switching transistor and the second switching transistor of the first power device chip respectively based on the first switching control signal; and The first switch of the second power device chip is electrically connected between the input pin and the switch pin of the second power device chip, and the second switch of the second power device chip is electrically connected between the switch pin and the ground pin of the second power device chip. The driver of the second power device chip receives the second switch control signal through the drive pin of the second power device chip, and drives the first switch and the second switch of the second power device chip respectively based on the second switch control signal.

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