Heat dissipation module with dip angle groove fins and electronic device with heat dissipation module

Abstract

The invention provides a heat dissipation module with inclined groove fins and an electronic device with the heat dissipation module. The heat dissipation module with the inclined groove fins comprises a heat dissipation base, a plurality of heat conduction elements and a plurality of heat dissipation fins. A plurality of grooves inclined at a preset angle are formed in the surfaces of the two sides of each heat dissipation fin, and the grooves are arranged in a staggered mode and extend in the length direction of the heat dissipation fins, so that the three-dimensional eddy current effect is formed, and heat resistance is reduced; an air inlet side of each heat dissipation fin is provided with an inverted inclined plane so as to eliminate heat dissipation dead angles. The heat dissipation module with the dip angle groove fins can effectively improve the heat dissipation efficiency, and is suitable for heat dissipation of various electronic devices.

Description

Technical Field

[0001] This invention relates to a heat dissipation module and an electronic device having the same, and more specifically, to a heat dissipation module with inclined grooved fins for use in an electronic device, wherein the heat dissipation module improves heat dissipation efficiency by designing an inclined groove structure on the heat dissipation fins. Background Technology

[0002] With the advancement of electronic technology, the processing speed of electronic components is constantly increasing, and the heat generated is correspondingly increasing significantly. In order to ensure the long-term stable operation of electronic components, heat dissipation modules are usually installed in electronic devices to conduct the heat generated by the electronic components and dissipate it to the external environment in a timely manner.

[0003] Traditional heat dissipation modules typically consist of a heat sink base and heat dissipation fins mounted on the base. The fins are often flat or columnar, with parallel heat dissipation channels formed between them to increase the contact area with the air. However, this structure has low heat dissipation efficiency and is insufficient to meet the heat dissipation requirements of modern electronic devices.

[0004] To further improve heat dissipation efficiency, several improved heat sink fin structures have emerged. For example, needle-like or columnar protrusions are placed on the surface of the heat sink fins to disrupt airflow and enhance heat transfer. However, these structures are difficult to manufacture, costly, and offer limited improvement in heat dissipation performance.

[0005] Therefore, it is necessary to provide a new heat sink fin structure that can significantly improve the heat dissipation efficiency of the heat dissipation module while taking into account manufacturing costs, so as to meet the growing heat dissipation needs of electronic components. Summary of the Invention

[0006] The main objective of this invention is to provide a heat dissipation module with angled grooved fins to solve the problem of insufficient heat dissipation efficiency in the prior art. This heat dissipation module with angled grooved fins eliminates heat dissipation dead zones by providing grooves at a predetermined angle on the heat dissipation fins and a beveled surface on the air inlet side, thereby significantly improving heat dissipation efficiency compared to traditional flat fins and making it suitable for the heat dissipation needs of various electronic devices.

[0007] To achieve the above objectives, the present invention provides an embodiment of a heat dissipation module with inclined grooved fins, comprising:

[0008] A heat dissipation base;

[0009] Multiple heat-conducting elements, one end of which is connected to the heat dissipation base; and

[0010] Multiple heat dissipation fins, wherein the heat dissipation fins are connected to the other end of the heat-conducting element;

[0011] Each heat dissipation fin has multiple grooves on both sides of its surface, and the grooves are set at a predetermined tilt angle.

[0012] In one embodiment of the heat dissipation module with inclined grooved fins of the present invention, the grooves on both sides of the heat dissipation fins are set at a predetermined tilt angle ranging from 20 degrees to 40 degrees; preferably, the predetermined tilt angle is 30 degrees, which is the optimal tilt angle obtained by comprehensively considering factors such as heat dissipation effect and manufacturing cost.

[0013] In one embodiment of the heat dissipation module with angled grooved fins of the present invention, the plurality of grooves on the heat dissipation fins are arranged alternately on both sides of each heat dissipation fin. This alternate arrangement of grooves allows airflow to form a "Z"-shaped flow path between the heat dissipation fins, increasing the contact area and time between the airflow and the heat dissipation fins, thereby enhancing the heat exchange effect.

[0014] In one embodiment of the heat dissipation module with angled grooved fins of the present invention, a plurality of grooves on the heat dissipation fins extend along the length direction of the heat dissipation fins to induce airflow to generate a rotating flow along the groove direction, thereby forming a three-dimensional vortex effect between the heat dissipation fins and reducing the thermal resistance of the heat dissipation fins. This is because the grooves extending along the length direction of the heat dissipation fins can guide the airflow to form a stable rotating flow between the heat dissipation fins, further enhancing the heat dissipation effect.

[0015] In one embodiment of the heat dissipation module with angled grooved fins of the present invention, each heat dissipation fin has an incised surface on its air inlet side, and the incised surface forms a preset angle with the main body of the heat dissipation fin; wherein, the preset angle ranges from 45 degrees to 85 degrees, and preferably, the preset angle is 60 degrees. The incised surface can effectively eliminate the heat dissipation dead angle at the connection between the heat dissipation fin and the heat-conducting element.

[0016] Furthermore, the present invention also provides an electronic device, which includes a housing and a motherboard disposed within the housing, and the motherboard is provided with a plurality of electronic components; the electronic device further includes a heat dissipation module with inclined grooved fins as described in any of the preceding embodiments, and the heat dissipation module with inclined grooved fins is disposed on the motherboard.

[0017] In one embodiment, the electronic device is selected from the group consisting of servers, switches, routers, gateways, industrial computers, desktop computers, all-in-one computers, smart TVs, in-vehicle entertainment systems, gaming consoles, and game consoles. As modern electronic devices become increasingly powerful, their heat dissipation requirements also rise. The heat dissipation module with angled grooved fins of the present invention can provide an efficient heat dissipation solution for the aforementioned common high-power electronic devices. Attached Figure Description

[0018] Figure 1A This is a perspective view of an embodiment of the heat dissipation module with an inverted bevel surface of the present invention;

[0019] Figure 1B This is a perspective view of another embodiment of the heat dissipation module with an inverted bevel surface of the present invention;

[0020] Figure 1C This is an exploded view of an embodiment of the heat dissipation module with an inverted bevel surface of the present invention;

[0021] Figure 2 This is a three-dimensional schematic diagram of the heat dissipation fins with inverted bevels and inclined grooves in the heat dissipation module of the present invention;

[0022] Figure 3A This is a partially enlarged schematic diagram of the heat dissipation module with inclined grooved fins of the present invention, showing the detailed structure of the beveled surface and the grooves; and

[0023] Figure 3B This is a schematic diagram of the groove structure of the heat dissipation fins of the present invention and the inclined surface on the air inlet side relative to the airflow direction.

[0024] [Symbol Explanation]

[0025] 10: Heat dissipation base

[0026] 20: Thermal conductive element

[0027] 30: Heat dissipation fins

[0028] 32: Trench

[0029] 34: Inclined Plane

[0030] α: Predetermined tilt angle

[0031] β: Preset included angle

[0032] W: Wind inlet side Detailed Implementation

[0033] To more clearly describe the heat dissipation module with angled grooved fins proposed in this invention, the preferred embodiments of the invention will be described in detail below with reference to the accompanying drawings. Furthermore, the same reference numerals (component symbols) in the drawings can be used to denote similar components.

[0034] Please refer to Figures 1A to 1CThis embodiment provides a heat dissipation module with an inverted slope, which includes a heat dissipation base 10, a plurality of heat-conducting elements 20, and a plurality of heat dissipation fins 30. One end of each heat-conducting element 20 is connected to the heat dissipation base 10, and the other end is connected to the heat dissipation fins 30 to quickly conduct absorbed heat to the heat dissipation fins 30. The air inlet side of each heat dissipation fin 30 is provided with an inverted slope 34, which forms a preset angle β with the main body of the heat dissipation fin 30. Preferably, the preset angle β is 45 degrees to 85 degrees, and more preferably 60 degrees.

[0035] Please refer to again Figure 2 and Figure 3A In another embodiment, the heat dissipation fins 30 have multiple grooves 32 on both sides, and the grooves 32 are arranged at a predetermined tilt angle α. Preferably, the grooves 32 are staggered on both sides of the heat dissipation fins 30 and extend along the length of the heat dissipation fins 30. Through the tilting and staggered design of the grooves 32, a three-dimensional rotating airflow can be formed between the fins, enhancing the heat dissipation effect and reducing the heat dissipation resistance. In addition, the predetermined tilt angle α is preferably 20 to 40 degrees, more preferably 30 degrees.

[0036] Furthermore, by Figure 3A and Figure 3B It is understood that the airflow passing through the inverted slope 34 of the air inlet side W of the heat dissipation fins 30 can avoid the formation of heat dissipation dead zones and reduce ineffective heat dissipation areas. The inclined grooves 32 can guide the airflow to form a rotating flow along the direction of the grooves 32 between the heat dissipation fins 30. Combined with the staggered arrangement of the grooves 32, the airflow can form a Z-shaped three-dimensional flow path, increasing the contact area and time between the airflow and the heat dissipation fins 30, thereby enhancing the heat exchange effect and improving heat dissipation efficiency.

[0037] In summary, in one embodiment, the heat dissipation module with inclined grooved fins provided by the present invention includes:

[0038] A heat dissipation base 10;

[0039] Multiple heat-conducting elements 20, one end of each heat-conducting element 20 being connected to the heat dissipation base 10; and

[0040] Multiple heat dissipation fins 30 are connected to the other end of the heat-conducting element 20;

[0041] Among them, each heat dissipation fin 30 has a plurality of grooves 32 on both sides of its surface, and the grooves 32 are set at a predetermined tilt angle α.

[0042] The predetermined tilt angle α ranges from 20 degrees to 40 degrees, and is preferably 30 degrees.

[0043] The grooves 32 are arranged alternately on both sides of each heat dissipation fin 30, and the grooves 32 extend along the length of the heat dissipation fin 30 to induce airflow to generate a rotating flow along the direction of the grooves 32, thereby forming a three-dimensional vortex effect between the heat dissipation fins 30 and reducing the thermal resistance of the heat dissipation fins 30.

[0044] Each of the heat dissipation fins 30 has an inverted inclined surface 34 on one air inlet side W, and the inverted inclined surface 34 forms a preset angle β with the main body of the heat dissipation fin 30.

[0045] The preset included angle β has an angle range of 45 degrees to 85 degrees, with a preferred angle of 60 degrees.

[0046] Furthermore, in one embodiment, the present invention also provides an electronic device, which includes a housing, a motherboard disposed within the housing, and a plurality of electronic components disposed on the motherboard. The electronic device further includes a heat dissipation module with angled grooved fins as described above, which is disposed on the motherboard and used to dissipate heat from the electronic components. In addition, the electronic device may be a server, switch, router, gateway, industrial computer, desktop computer, all-in-one computer, smart TV, in-vehicle entertainment device, gaming console, or game console, etc.

[0047] In summary, the heat dissipation module with inclined grooved fins provided by the present invention can effectively improve heat dissipation efficiency by setting inclined grooves and inclined surfaces on the heat dissipation fins, and is suitable for the heat dissipation needs of various electronic devices.

[0048] The foregoing description has fully and clearly illustrated a heat dissipation module with angled grooved fins and an electronic device having therein, according to the present invention. It must be emphasized that the detailed description above is a specific description of feasible embodiments of the present invention, but these embodiments are not intended to limit the patent scope of the present invention. All equivalent implementations or modifications that do not depart from the spirit of the present invention should be included within the patent scope of this case.

Claims

1. A heat dissipation module with inclined grooved fins, characterized in that, It includes: A heat dissipation base; Multiple heat-conducting elements, one end of which is connected to the heat dissipation base; as well as Multiple heat dissipation fins, wherein the heat dissipation fins are connected to the other end of the heat-conducting element; Each heat dissipation fin has multiple grooves on both sides of its surface, and the grooves are set at a predetermined tilt angle.

2. The heat dissipation module with inclined grooved fins as described in claim 1, characterized in that, The predetermined tilt angle ranges from 20 degrees to 40 degrees.

3. The heat dissipation module with inclined grooved fins as described in claim 1, characterized in that, The predetermined tilt angle is 30 degrees.

4. The heat dissipation module with inclined grooved fins as described in claim 1, characterized in that, The grooves are arranged alternately on both sides of each heat dissipation fin.

5. The heat dissipation module with inclined grooved fins as described in claim 1, characterized in that, Multiple grooves are provided to extend along the length of the heat dissipation fins to induce airflow to generate a rotating flow along the direction of the grooves, thereby forming a three-dimensional vortex effect between the heat dissipation fins and reducing the thermal resistance of the heat dissipation fins.

6. The heat dissipation module with inclined grooved fins as described in claim 1, characterized in that, Each of the heat dissipation fins has an inverted slope on one air inlet side, and the inverted slope forms a preset angle with the main body of the heat dissipation fin.

7. The heat dissipation module with inclined grooved fins as described in claim 6, characterized in that, The preset included angle ranges from 45 degrees to 85 degrees.

8. The heat dissipation module with inclined grooved fins as described in claim 6, characterized in that, The preset included angle is 60 degrees.

9. An electronic device comprising a housing and a motherboard disposed within the housing, wherein the motherboard has a plurality of electronic components, characterized in that, The electronic device further includes a heat dissipation module with angled grooved fins as described in any one of claims 1 to 8, and the heat dissipation module with angled grooved fins is disposed on the motherboard.

10. The electronic device as claimed in claim 9, characterized in that, The electronic device is selected from any of the group consisting of servers, switches, routers, gateways, industrial computers, desktop computers, all-in-one computers, smart TVs, in-vehicle entertainment devices, gaming consoles, and game consoles.

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