Server, cooling system and method for automatically detecting server

By using an automatic server cooling system that combines local heat dissipation components and passive detection components, the system achieves precise temperature detection and targeted cooling of server circuit boards. This solves the problem of irregular load periods for different circuit boards, improving heat dissipation efficiency and system reliability.

CN120936006BActive Publication Date: 2025-12-16INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202511461429.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-10-13
Publication Date
2025-12-16
Estimated Expiration
2045-10-13

AI Technical Summary

Technical Problem

In existing technologies, the load periods of different circuit boards inside the server are irregular, making it impossible to perform targeted temperature detection and cooling, thus increasing the energy consumption of the cooling system.

Method used

An automatic server detection and cooling system is adopted, including coil components, air supply components, multiple local heat dissipation components and passive detection components. Through the mechanical displacement of the local heat dissipation components and the electrical signal transmission of the passive detection components, accurate temperature detection and targeted cooling of the circuit control board are achieved.

Benefits of technology

This improves the accuracy of temperature detection and heat dissipation efficiency, reduces the energy consumption of the cooling system, and ensures the stable operation of the server and the continuity of data processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a kind of server automatic detection cooling system, method and server, it is related to server technical field, the system includes coil assembly, gas supply component, multiple heat dissipation components, passive detection component and controller, coil assembly is configured to receive gas from gas supply component, multiple local heat dissipation components are spaced along the length direction of coil assembly, local heat dissipation component is along the thickness direction of circuit control panel and is arranged through coil assembly, local heat dissipation component is configured to when the temperature of corresponding position on circuit control panel with the local heat dissipation component rises to preset temperature, the partial structure of itself moves towards the side away from circuit control panel, passive detection component sends electric signal to controller after being triggered by local heat dissipation component, controller receives electric signal and controls gas supply component to operate, by setting multiple local heat dissipation components, can be deformed with temperature to trigger passive detection component, realize the targeted temperature detection of circuit control panel.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and particularly relates to a server automatic detection cooling system and method and a server. BACKGROUND

[0002] As a kind of high-performance computer equipment, server is usually used to store, process and transmit a large amount of data, and provides various services such as file storage, database management and website hosting for other computers or devices in the network, and since server will generate a large amount of heat during operation, it is necessary to detect the temperature and cool the server.

[0003] In the related art, the working temperature of the server is detected by a temperature sensor, and the heat is dissipated by a refrigeration system, however, multiple circuit boards are usually arranged inside the server, including CPU (Central Processing Unit) mainboard, baseboard management controller circuit board and expansion card, and the load period of different circuit boards is irregular. The existing detection and cooling method is to detect and cool at the same time, and this detection and cooling method is not targeted, which will increase the energy consumption of the refrigeration system. Therefore, the present application is proposed. SUMMARY

[0004] The present application provides a server automatic detection cooling system and method and a server to at least solve the problem that different circuit boards or different positions of the circuit board cannot be targeted for temperature detection in the related art.

[0005] The present application provides a server automatic detection cooling system, which is configured to detect and cool the temperature of the circuit control board of the server, and the server automatic detection cooling system comprises a coil assembly, a gas supply assembly, multiple local heat dissipation assemblies, a passive detection assembly and a controller.

[0006] The gas supply assembly is used to deliver gas, the coil assembly is arranged on one side of the circuit control board along the thickness direction, the gas inlet end of the coil assembly is communicated with the gas outlet end of the gas supply assembly, and the coil assembly is configured to receive the gas from the gas supply assembly to cool the circuit control board.

[0007] The multiple local heat dissipation assemblies are arranged at intervals along the length direction of the coil assembly, and the local heat dissipation assemblies are arranged through along the thickness direction of the coil assembly, and the local heat dissipation assemblies are configured to move part of the structure of the local heat dissipation assemblies away from the side of the circuit control board when the temperature of the corresponding position of the circuit control board corresponding to the local heat dissipation assemblies rises to a preset temperature,

[0008] The passive detection assembly is arranged on the side of the local heat dissipation assembly away from the circuit control board, and the pressure detection assembly is configured to send an electrical signal to the controller when part of the structure of any local heat dissipation assembly moves towards the side away from the circuit control board.

[0009] The controller is electrically connected with the passive detection assembly and the air supply assembly respectively, and is configured to issue a cooling instruction after receiving the electrical signal from the passive detection assembly, and control the air supply assembly to supply air to the coil assembly to cool the circuit control board.

[0010] The application also provides a server automatic detection and cooling method, which is used for temperature detection and cooling of a circuit control board of a server, and the method comprises the following steps of:

[0011] When the local temperature of the circuit control board rises, part of the structure of the local heat dissipation assembly at the corresponding position moves towards the side away from the circuit control board and triggers the passive detection assembly.

[0012] The passive detection assembly sends an electrical signal to the controller.

[0013] The controller receives the electrical signal and starts the refrigerating machine and the first fan, and stops the electromagnetic valve and the second fan, so as to guide the cold air generated by the refrigerating machine into the coil assembly and blow air to the circuit control board through the local heat dissipation assembly triggering the passive detection assembly.

[0014] The application also provides a server, which comprises:

[0015] A shell assembly is internally provided with a containing cavity.

[0016] A circuit control board is arranged in the containing cavity.

[0017] The server automatic detection and cooling system is configured to detect the temperature of each position of the circuit control board and cool the circuit control board when the temperature exceeds a preset temperature.

[0018] The server automatic detection and cooling system, method and server convert the high temperature of the corresponding area into mechanical displacement through the local heat dissipation assembly arranged at intervals and penetrating the coil assembly, accurately locate a single hot spot, accept triggering and transmit an electrical signal to the controller through the passive detection assembly arranged on the side of the local heat dissipation assembly away from the circuit control board, exclude background heat interference to ensure the reliability of the signal, then the controller links the air supply assembly based on the electrical signal, and combines the corresponding relationship between the coil assembly and the circuit control board to cool the circuit controller, effectively solving the problem that the circuit control board cannot be locally measured and cooled in the related solutions. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only some of the embodiments of the present application, and for those skilled in the art, on the premise of not paying the creative labor, can also obtain other drawings according to these drawings.

[0020] Figure 1 The structural diagram of the server provided by the embodiments of the present application is shown in the figure.

[0021] Figure 2 The exploded view of the server provided by the embodiments of the present application is shown in the figure.

[0022] Figure 3 The partial exploded view of the server provided by the embodiments of the present application is shown in the figure.

[0023] Figure 4 The another partial exploded view of the server provided by the embodiments of the present application is shown in the figure.

[0024] Figure 5 The sectional view of the heat dissipation driving assembly provided by the embodiments of the present application is shown in the figure.

[0025] Figure 6 The still another partial exploded view of the server provided by the embodiments of the present application is shown in the figure.

[0026] Figure 7 The structural diagram of the fixed vertical plate provided by the embodiments of the present application is shown in the figure.

[0027] Figure 8 The assembly diagram of the coil assembly and the local heat dissipation assembly provided by the embodiments of the present application is shown in the figure.

[0028] Figure 9 The Figure 8 The enlarged view of the A position in the figure.

[0029] Figure 10 The exploded view of the coil assembly and the local heat dissipation assembly provided by the embodiments of the present application is shown in the figure.

[0030] Figure 11 The structural diagram of the local heat dissipation assembly provided by the embodiments of the present application is shown in the figure.

[0031] Figure 12 The partial structural diagram of the local heat dissipation assembly provided by the embodiments of the present application is shown in the figure.

[0032] Figure 13 The partial exploded view of the local heat dissipation assembly provided by the embodiments of the present application is shown in the figure.

[0033] Figure 14 The partial structural diagram of the built-in shell provided by the embodiments of the present application is shown in the figure.

[0034] Figure 15 Figure 1 is a perspective view of a refrigeration device according to an embodiment of the present application; Figure 14 Figure 2 is an enlarged view of the B position in Figure 1;

[0035] Figure 16 Figure 3 is another partial exploded view of a local heat dissipation assembly provided by an embodiment of the present application;

[0036] Figure 17 Figure 4 is a partial structural schematic view of an air inflation component provided by an embodiment of the present application;

[0037] Figure 18 Figure 5 is an exploded view of the air inflation component provided by an embodiment of the present application.

[0038] In the above figures, the following reference signs are used:

[0039] 1 - cabinet assembly; 11 - side shell; 12 - rear mesh plate; 13 - circuit board; 14 - cover plate;

[0040] 15 - heat dissipation mechanism; 16 - operation control box; 17 - partition plate; 18 - refrigeration machine; 19 - fixed through hole;

[0041] 2 - circuit control board;

[0042] 3 - heat dissipation driving assembly; 31 - air collecting box; 32 - sleeve pipe; 33 - rubber sleeve ring;

[0043] 341 - first front cylinder shell; 342 - second front cylinder shell; 351 - first fan; 352 - second fan;

[0044] 361 - first one-way valve; 362 - second one-way valve; 37 - air collecting cavity;

[0045] 4 - passive detection assembly; 41 - fixed vertical plate; 42 - elastic telescopic rod; 43 - pressure detection component;

[0046] 44 - movable plate; 45 - air guide through hole;

[0047] 5 - coil pipe assembly; 51 - coil pipe; 52 - inlet pipe; 53 - outlet pipe; 54 - electromagnetic valve;

[0048] 55 - disc-shaped channel; 56 - fixed pipe opening;

[0049] 6 - local heat dissipation assembly; 61 - embedded shell assembly; 611 - built-in shell; 612 - built-in cavity;

[0050] 613 - first through hole; 614 - second through hole; 615 - third through hole;

[0051] 616 - fourth through hole; 617 - air blowing pipe;

[0052] 618 - inclined pipe; 619 - inclined chute; 62 - elastic member; 63 - built-in slide rod; 64 - topsheet; 65 - cylindrical plate;

[0053] 66 - gas expansion component; 661 - tube shell; 662 - heat exhaust port; 663 - guide rod;

[0054] 664 - second sealing ring; 665 - gas storage cavity; 6651 - first chamber; 6652 - gap;

[0055] 67 - first sealing ring. DETAILED DESCRIPTION

[0056] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0057] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, which is determined by the ordinary skilled person considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, less than or equal to 5% of the difference between the two. For the ordinary skilled person in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0058] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0059] The server is a high-performance computer device, which is usually used to store, process and transmit a large amount of data, and provides various services for other computers or devices in the network, such as file storage, database management, website hosting, etc. Because the server will generate a large amount of heat during operation, it is necessary to monitor its temperature state in real time through automatic detection cooling system, and start corresponding cooling measures when the temperature is too high, so as to ensure the stable operation of the server and avoid performance degradation or hardware damage caused by overheating, so as to ensure that it can continuously and efficiently provide services for users.

[0060] In the related art, the working temperature of the server is detected by a temperature sensor during the detection and cooling process of the server, and the heat is dissipated by a refrigeration system.

[0061] However, multiple circuit boards, including CPU mainboards, baseboard management controller circuit boards, and expansion cards, are usually arranged inside the server. When the workload of these circuit boards is small, they can be cooled by air cooling at room temperature. The load period of a certain circuit board is irregular, and the cooling strength changes accordingly. The detection and cooling method in the related art is to detect and cool at the same time, which is not targeted and increases the energy consumption of the refrigeration system.

[0062] Based on the above, the embodiments of the present application propose a server automatic detection and cooling system, method and server

[0063] The server automatic detection and cooling system is a heat dissipation solution for real-time monitoring of the temperature state of the server room or equipment operating environment. When the temperature exceeds the preset threshold, the system automatically starts the auxiliary cooling equipment to quickly reduce the ambient temperature and ensure the stable operation of the server within a safe temperature range. This system reduces the frequency of manual intervention, improves the heat dissipation efficiency, reduces equipment failure problems caused by high temperature, and thus guarantees the reliability of the server and the continuity of data processing, especially suitable for data centers, server rooms and other scenes with high heat dissipation requirements.

[0064] Referring to Figure 1 , Figure 2 The server includes a housing assembly 1 and a circuit control board 2. The housing assembly 1 forms the appearance profile of the server, and the circuit control board 2 is installed inside the housing assembly 1.

[0065] Referring to Figure 1 , the direction indicated by the X-axis arrow is the front side, and the opposite direction indicated by the X-axis arrow is the rear side. The X-axis is the length direction of the server, the Y-axis is the width direction of the server, and the Z-axis is the height direction of the server.

[0066] Referring to Figure 2 , Figure 3 The server includes a side shell 11. The side shell 11 is fixedly connected to a rear net plate 12 and a circuit plugboard 13 on one side close to the rear end. The rear net plate 12 is located at the rear end of the circuit plugboard 13. The circuit plugboard 13 is inserted with the circuit control board 2 on the inner side (the side away from the rear net plate 12). The circuit plugboard 13 is fixedly connected to the side shell 11 on both sides along the width direction of the server.

[0067] The top end and the bottom end of the side shell 11 are fixed by bolts and a cover plate 14. The cover plate 14 forms the top and bottom of the server.

[0068] The side shell 11 is fixedly connected with a partition plate 17 on one side close to the front end. The partition plate 17 is mainly used for mounting some components inside the server. The partition plate 17 and the circuit plugboard 13 are arranged along the length direction of the server. The partition plate 17 is fixedly connected with the side shell 11 on both sides along the width direction of the server.

[0069] The side shell 11 is fixedly connected with an operation control box 16 on the front end. The operation control box 16 is arranged on the front side of the server. The operation control box 16 includes a display screen and operation buttons. The operation buttons can be triggered to issue instructions. The running parameters and state of the server can be viewed through the display screen.

[0070] The operation control box 16 is further provided with a controller. The controller can be electrically connected with the components inside the server, receive electrical signals from the components and send electrical signals to the corresponding components.

[0071] The connection mode between the components of the above-mentioned shell assembly 1 is only an example. The connection mode of the components is not limited in the embodiment of the application. The skilled in the art can set it according to the needs.

[0072] Through the above-mentioned setting, the structure design makes the shell assembly 1 be able to stably fix the components and provide basic support for the subsequent heat dissipation operation.

[0073] The server further includes a server automatic detection cooling system for temperature detection and cooling of the circuit control board 2 of the server. Referring to Figure 3 、 Figure 6 The server automatic detection cooling system includes a gas supply assembly, a coil assembly 5, a plurality of local heat dissipation assemblies 6, a passive detection assembly 4 and a controller.

[0074] The gas supply assembly is used for conveying gas. The gas is used for cooling the circuit control board 2. It should be noted that the gas can include cold air or the gas inside the shell assembly 1.

[0075] The coil assembly 5 is arranged on one side along the thickness direction of the circuit control board 2. The gas inlet end of the coil assembly 5 is in communication with the gas outlet end of the gas supply assembly. The coil assembly 5 is configured to receive the gas from the gas supply assembly to cool the circuit control board 2.

[0076] Referring to Figure 6 The plurality of local heat dissipation assemblies 6 are arranged along the length direction of the coil assembly 5 to detect the temperature changes of different positions of the circuit control board 2. The local heat dissipation assemblies 6 are arranged through the coil assembly 5 along the thickness direction of the circuit control board 2.

[0077] The local heat dissipation assembly 6 is configured to move the partial structure thereof toward the side away from the circuit control panel 2 when the temperature of the corresponding position of the local heat dissipation assembly 6 on the circuit control panel 2 rises to the preset temperature.

[0078] The passive detection assembly 4 is arranged on the side of the local heat dissipation assembly 6 away from the circuit control panel 2, and the passive detection assembly 4 is configured to send an electric signal to the controller when the partial structure of any local heat dissipation assembly 6 moves toward the side away from the circuit control panel 2 and triggers the passive detection assembly 4.

[0079] The controller can be installed in the operation control box 16. The controller is electrically connected with the air supply assembly and the passive detection assembly 4. The controller is configured to issue a cooling instruction to control the air supply assembly to supply air to the coil assembly 5 after receiving the electric signal.

[0080] By arranging multiple local heat dissipation assemblies 6, the temperatures of multiple components of the circuit control panel 2 can be detected, thereby improving the temperature detection range of the server, laying a foundation for targeted local cooling of the server in the later period. At the same time, this detection method changes the detection method of the traditional temperature sensor, can reduce the failure rate, and provides the durability of the system.

[0081] In some embodiments, as shown in Figure 11 , Figure 12 The local heat dissipation assembly 6 includes an embedded shell assembly 61, the embedded shell assembly 61 is fixedly connected with an elastic member 62 on the inner side of the side away from the circuit control panel 2, the left side of the elastic member 62 is fixedly connected with a cylindrical plate 65, the side away from the circuit control panel 2 of the cylindrical plate 65 is sequentially fixedly connected with an embedded slide rod 63 and a top sheet 64. The side close to the circuit control panel 2 of the cylindrical plate 65 is fixedly connected with an air inflation component 66, the outer side of the cylindrical plate 65 is fixedly connected with a first sealing ring 67, and the outer side of the embedded shell assembly 61 is fixedly connected to the inner side of the fixed pipe opening 56.

[0082] In some embodiments, as shown in Figure 13 , 14 The local heat dissipation assembly 6 includes an embedded shell assembly 61, the embedded shell assembly 61 is fixedly connected with an elastic member 62 on the inner side of the side away from the circuit control panel 2, the left side of the elastic member 62 is fixedly connected with a cylindrical plate 65, the side away from the circuit control panel 2 of the cylindrical plate 65 is sequentially fixedly connected with an embedded slide rod 63 and a top sheet 64. The side close to the circuit control panel 2 of the cylindrical plate 65 is fixedly connected with an air inflation component 66, the outer side of the cylindrical plate 65 is fixedly connected with a first sealing ring 67, and the outer side of the embedded shell assembly 61 is fixedly connected to the inner side of the fixed pipe opening 56. Figure 9 The embedded shell 611 is fixedly connected to the inner side of the fixed pipe opening 56.

[0083] Figure 14 The embedded shell 611 is formed with an embedded cavity 612, and a first through hole 613, a second through hole 614, a third through hole 615 and a fourth through hole 616 communicating with the embedded cavity 612, the third through hole 615 communicates with the inside of the coil assembly 5, and the third through hole 615 provides a structural basis for subsequent cooling of the circuit control panel 2.

[0084] ​The opening of the second through hole 614 allows the gas on the right side of the cylindrical plate 65 to be discharged quickly, reducing the resistance when the cylindrical plate 65 moves.

[0085] In some configurations, the second through hole 614 is connected to the first through hole 613. Of course, the first through hole 613 and the second through hole 614 can also be configured independently.

[0086] The built-in slide rod 63 is partially housed within the built-in cavity 612. The built-in slide rod 63 extends along the length of the built-in shell 611, and one end of the built-in slide rod 63 extends out of the built-in shell 611 through the first through hole 613. The outer side of the built-in slide rod 63 and the inner side of the first through hole 613 are slidably connected.

[0087] The cylindrical plate 65 is disposed in the internal cavity 612. The cylindrical plate 65 is connected to the side of the internal slide rod 63 near the circuit control board 2. The cylindrical plate 65 can slide along the length of the internal shell 611.

[0088] The elastic element 62 is sleeved on the built-in slide rod 63. One end of the elastic element 62 is connected to the side of the cylindrical plate 65 near the built-in slide rod 63, and the other end of the elastic element 62 is connected to the inner wall of the inner shell 611. Here, the elastic element 62 serves to assist in the repositioning of the cylindrical plate 65.

[0089] Reference Figure 12 As shown, the air-expanding component 66 extends into the fourth through hole 616 along its length away from the circuit control board 2 and connects to the cylindrical plate 65 away from the built-in slide rod 63. The air-expanding component 66 is configured such that when the temperature at the position corresponding to the air-expanding component 66 on the circuit control board 2 rises to a preset temperature, a portion of its structure moves toward the side away from the circuit control board 2.

[0090] The elastic element 62 is provided on the spring. The spring is sleeved on the built-in slide rod 63, one end of the spring is connected to the side of the cylindrical plate 65 near the built-in slide rod 63, and the other end of the spring is connected to the inner wall of the built-in shell 611.

[0091] When passive detection component 4 is not triggered, refer to Figure 12 , Figure 13 The cylindrical plate 65 is located on the side of the third through hole 615 closer to the air expansion component. When the passive detection component 4 is triggered, the cylindrical plate 65 is located on the side of the third through hole 615 away from the air expansion component 66. At this time, the third through hole 615 is connected to the air blowing pipe 617, which can be used for local cooling of the circuit control board 2.

[0092] In some embodiments, to increase the contact area between the built-in slide bar 63 and the passive detection component 4, the local heat dissipation component 6 further includes a top plate 64, which is connected to the side of the built-in slide bar 63 that extends out of the built-in housing 611. The cross-section of the top plate 64 is larger than the cross-section of the built-in slide bar 63.

[0093] To ensure the connection between the cylindrical plate 65 and the inner side wall of the built-in shell 611, the partial heat dissipation assembly 6 further comprises a first sealing ring 67, which is sleeved on the periphery of the cylindrical plate 65. The outer side of the first sealing ring 67 is in close contact with the inner side of the built-in cavity 612. For example, the first sealing ring 67 is made of rubber.

[0094] Through the above arrangement, this sliding connection mode enables the built-in slide rod 63 to move flexibly inside the first through hole 613, cooperates with the close contact between the first sealing ring 67 and the built-in cavity 612, realizes precise mechanical action, and provides a reliable physical basis for temperature detection and heat dissipation control.

[0095] In some embodiments, as shown in Figure 16 、 Figure 17 、 Figure 18 , the air inflation component 66 further comprises a tube shell 661, a guide rod 663 and a second sealing ring 664, the tube shell 661 has a gas storage cavity 665 formed inside, the guide rod 663 is partially arranged in the gas storage cavity 665, the guide rod 663 extends into the fourth through hole 616 from the side of the circuit control board 2 along the length direction of the guide rod 663 and is connected to the side of the cylindrical plate 65 away from the built-in slide rod 63, and the guide rod 663 and the tube shell 661 are in sliding connection. For example, the tube shell 661 is made of copper.

[0096] By enabling the guide rod 663 to slide flexibly inside the gas storage cavity 665, the precise mechanical action is realized by the close contact between the second sealing ring 664 and the inner side wall of the tube shell 661, and a reliable physical basis is provided for temperature detection and heat dissipation control.

[0097] By extending the guide rod 663 into the fourth through hole 616 and fixedly connecting it with the cylindrical plate 65, the guide rod 663 can be closely matched with the fourth through hole 616, the transmission of mechanical action is realized by sliding, and it is ensured that the temperature detection and heat dissipation control of the system can be accurately and efficiently performed.

[0098] As shown in Figure 13 , the air inflation component 66 is provided with two. The two guide rods 663 can be independently arranged, or the two guide rods 663 can be arranged as a whole and then connected with the cylindrical plate 65. The structure in which the two guide rods 663 are arranged as a whole is defined as a double-column guide rod 663, the double-column guide rod 663 is embedded and installed inside the fourth through hole 616, the double-column guide rod 663 slides inside the fourth through hole 616, and the double-column guide rod is fixedly connected with the side of the cylindrical plate 65 close to the circuit control board 2 from the side of the circuit control board 2.

[0099] The second sealing ring 664 is sleeved on the side of the guide rod 663 away from the cylindrical plate 65, and as shown in Figure 17As shown, the outer periphery of the second sealing ring 664 is in abutment and slidable connection with the inner side wall of the tube shell 661, and the second sealing ring 664, the guide rod 663 and the tube shell 661 jointly form a first chamber 6651.

[0100] When the temperature of the circuit control board 2 rises, the temperature of the corresponding tube shell 661 rises, and the gas in the first chamber 6651 expands after being heated, and the guide rod 663 moves towards the cylindrical plate 65 under the action of the gas pressure.

[0101] In some embodiments, referring to Figure 17 As shown, a gap 6652 is provided between the guide rod 663 and the tube shell 661, and a heat exhaust port 662 is further provided on the tube shell 661, which is in communication with the gap 6652, and the heat exhaust port 662 is configured to exhaust the air in the gap 6652.

[0102] Referring to Figure 2 As shown, when the temperature of the plurality of circuit control boards 2 is detected, the local heat dissipation assembly 6 of the same group is integrally installed at the right end of the circuit control board 2, and the plurality of air expansion components 66 are close to the components of the circuit control board 2, so as to facilitate the heat conduction of the heat emitted by the circuit control board 2 to the tube shell 661 of the air expansion component 66.

[0103] It can be known that the drawings in the specification of the present application are only illustrative, and the local heat dissipation assembly 6 can also be integrally installed on the left side of the circuit control board 2.

[0104] When the temperature of the circuit control board 2 rises, the temperature of the tube shell 661 of the air expansion component 66 rises due to the effect of heat radiation. Due to thermal expansion and contraction, the gas in the gap 6652 will flow out from the heat exhaust port 662, and the gas in the first chamber 6651 will expand. Due to the effect of gas expansion, the guide rod 663 is pushed to move to the right by the pressure of the gas, and the guide rod 663 will drive the cylindrical plate 65 and the first sealing ring 67 to move to the right, and the cylindrical plate 65 will press the elastic member 62, and the elastic member 62 will contract.

[0105] At the same time, the cylindrical plate 65 drives the built-in slide rod 63 and the top sheet 64 to move to the right, and the built-in slide rod 63 gradually slides from inside the first through hole 613.

[0106] When the temperature reaches the preset temperature, the top sheet 64 will contact the movable plate 44 at this time, and the movable plate 44 is pushed to move to the right by the top sheet 64. When the right side of the movable plate 44 presses the pressure detection component 43, the pressure detection component 43 receives the pressure and sends an electrical signal to the controller, indicating that the temperature reaches a certain limit.

[0107] The temperature of the plurality of components of the circuit control board 2 can be detected by the plurality of local heat dissipation assemblies 6 distributed on the right end of the circuit control board 2, thereby improving the temperature detection range of the circuit control board 2, laying the foundation for subsequent targeted cooling of the local part of the circuit control board 2, and changing the detection mode of the traditional temperature sensor, which can reduce the failure rate and improve the durability of the system.

[0108] In some embodiments, as shown in Figure 14 , Figure 15 The local heat dissipation assembly 6 further comprises a blowing pipe 617 arranged on the side of the built-in shell 611 close to the circuit control board 2, the blowing pipe 617 is in communication with the accommodating cavity, and the side of the blowing pipe 617 away from the built-in shell 611 is provided with a first communication hole configured to communicate the inside and outside of the blowing pipe 617.

[0109] In some embodiments, the side wall of the blowing pipe 617 is provided with a second communication hole, and the local heat dissipation assembly 6 further comprises an inclined pipe 618 arranged in the blowing pipe 617, and the inclined pipe 618 is configured to be inclined from the side away from the circuit control board 2 to the side close to the circuit control board 2 towards the direction of the second communication hole.

[0110] The inner side of the blowing pipe 617 and the inclined pipe 618 is provided with an inclined groove 619, the inclined groove 619 penetrates the outside of the blowing pipe 617, and the inclined groove 619 is in communication with the inner side of the blowing pipe 617.

[0111] Through the above arrangement, the complex internal structure design enables the built-in shell 611 to realize multiple functions such as gas flow control and temperature regulation, thereby supporting the efficient operation of the system.

[0112] When the passive detection assembly 4 is triggered, the cylindrical plate 65 is located on the side of the third communication hole 615 away from the air inflation component 66, at this time, the third communication hole 615 and the blowing pipe 617 are in communication, the cold air in the coil pipe assembly 5 can enter the built-in cavity 612 through the third communication hole 615, and then blow to the circuit control board 2 through the blowing pipe 617, which can be used for local cooling of the circuit control board 2.

[0113] In some embodiments, as shown in Figure 8 , Figure 10 The coil pipe assembly 5 comprises an import pipe 52, a coil pipe 51 and an export pipe 53.

[0114] The import pipe 52 is connected with the gas outlet end of the gas supply assembly, and the gas inlet end of the coil pipe 51 is connected with the gas outlet end of the import pipe 52.

[0115] Referring to Figure 9As shown, the coil pipe 51 is formed with a disc-shaped channel 55 and a fixed pipe orifice 56 communicating with the disc-shaped channel 55. The fixed pipe orifice 56 is arranged along the width direction of the coil pipe 51, and the local heat dissipation assembly 6 is installed at the fixed pipe orifice 56, and the air inlet end of the lead-out pipe 53 is connected with the air outlet end of the coil pipe 51.

[0116] The materials of the above-mentioned lead-in pipe 52, lead-out pipe 53 and coil pipe 51 are copper. The inner side of the lead-in pipe 52 and lead-out pipe 53 is hollow.

[0117] The outer side of the lead-out pipe 53 is fixedly connected with the inner side of the fixed through hole 19 of the circuit board 13, and the rear end of the lead-out pipe 53 extends out of the rear end of the circuit board 13.

[0118] Through the above-mentioned arrangement, the hollow communication structure enables the cold air to flow freely between the lead-in pipe 52, disc-shaped channel 55 and lead-out pipe 53, ensures that the cold air can be efficiently transmitted to the part needing cooling, and improves the heat dissipation effect.

[0119] In some embodiments, referring to Figure 8 As shown, the coil pipe assembly 5 includes an electromagnetic valve 54 arranged at the lead-out pipe 53, which is used to determine whether the inside of the coil pipe assembly 5 communicates with the outside through the lead-out pipe 53.

[0120] In order to improve the detection range, the coil pipe 51 is arranged in a meandering manner along the length direction of the circuit control board 2. Of course, the demand of the detection range can also be met by arranging multiple coil pipes 51.

[0121] In some embodiments, the air supply assembly includes a refrigerating machine 18 and a heat dissipation driving assembly 3, wherein the refrigerating machine 18 is used to generate cold air, and the heat dissipation driving assembly 3 is at least used to lead the cold air generated by the refrigerating machine 18 into the coil pipe assembly 5.

[0122] The refrigerating machine 18 is installed on the side of the partition plate 17 away from the circuit control board 2. The refrigerating machine 18 and the partition plate 17 are electrically connected.

[0123] In some embodiments, referring to Figure 4 , Figure 5 As shown, the heat dissipation driving assembly 3 includes a wind collecting box 31, at least one sleeve pipe 32, a first front barrel shell 341, a first one-way valve 361 and a first fan 351. The wind collecting box 31 is formed with an air collecting cavity 37. The air inlet end of the sleeve pipe 32 communicates with the air collecting cavity 37, and the air outlet end of the sleeve pipe 32 communicates with the lead-in pipe 52. The air inlet end of the first front barrel shell 341 communicates with the air outlet of the refrigerating machine 18, and the air outlet end of the first front barrel shell 341 communicates with the air collecting cavity 37. The first one-way valve 361 is arranged in the first front barrel shell 341. The first fan 351 is arranged in the first front barrel shell 341. The above-mentioned first one-way valve 361 is a silica gel duckbill valve.

[0124] Through the above structure, the first fan 351 and the one-way valve can effectively control the flow direction of the air flow, cooperate with the air outlet of the refrigerating machine 18, realize accurate cold air delivery, and improve the heat dissipation efficiency.

[0125] The heat dissipation driving assembly 3 further comprises a rubber collar 33 fixedly arranged on the inner side of the sleeve pipe 32, the sleeve pipe 32 being sleeved on the outer side of the lead-in pipe 52, and the inner side of the rubber collar 33 being in abutment with the outer side of the lead-in pipe 52.

[0126] Through the above arrangement, the sleeve pipe 32 and the rubber collar 33 can closely cooperate with the lead-in pipe 52, ensuring the smoothness of the gas flow and providing a stable channel for the subsequent cooling gas transmission.

[0127] In some embodiments, the heat dissipation driving assembly 3 further comprises a second front cylinder shell 342, a second one-way valve 362 and a second fan 352. The air inlet end of the second front cylinder shell 342 is in communication with the external air, and the air outlet end of the second front cylinder shell 342 is in communication with the air collecting cavity 37. The second one-way valve 362 is arranged in the second front cylinder shell 342. The second fan 352 is arranged in the second front cylinder shell 342.

[0128] The above-mentioned second one-way valve 362 is arranged as a silica gel duckbill valve.

[0129] It should be noted that the number of the above-mentioned front cylinder shells, one-way valves and fans is two. Those skilled in the art can set the number of the front cylinder shells, one-way valves and fans as needed.

[0130] In some embodiments, referring to FIGS. Figure 6 , Figure 7 The passive detection assembly 4 further comprises a movable plate 44, a fixed vertical plate 41, an elastic telescopic rod 42 and a pressure detection component 43.

[0131] The movable plate 44 is installed on the side of the local heat dissipation assembly 6 away from the circuit control panel 2, and the movable plate 44 is provided with a wind guide through hole 45.

[0132] The fixed vertical plate 41 is arranged on the side of the movable plate 44 away from the movable plate 44. The top end and the bottom end of the fixed vertical plate 41 are fixedly connected with the cover plate 14.

[0133] The elastic telescopic rod 42 is connected with the fixed vertical plate 41 and the movable plate 44 at both ends along the extension direction thereof.

[0134] The pressure detection component 43 is electrically connected with the controller, and the pressure detection component 43 is arranged on the side of the fixed vertical plate 41 close to the movable plate 44. The end of the pressure detection component 43 away from the fixed vertical plate 41 has a spacing from the end of the movable plate 44 away from the circuit control panel 2. The pressure detection component 43 can be a pressure sensor, for example.

[0135] When the partial structure of any local heat dissipation assembly 6 moves towards the side away from the circuit controller, the movable plate 44 moves towards the direction of the pressure detection component 43 and triggers the pressure detection component 43, and the pressure detection component 43 sends an electric signal to the controller.

[0136] In the above, the movable plate 44 is pressed against the pressure detection component 43, the pressure detection component 43 detects the pressure, and sends an electric signal to the controller, so that the movable plate 44 and the pressure detection component 43 can transmit the pressure information through the electric signal.

[0137] The air guide through hole 45 provides space for subsequent mechanical action, enhancing the response capability of the system. In some embodiments, the heat dissipation mechanism 15 is electrically connected to the controller, as shown in Figure 2 The heat dissipation mechanism 15 is arranged on one side of the circuit control board 2 along the thickness direction.

[0138] Taking the heat dissipation mechanism 15 on the left side of the figure as an example, the heat dissipation structure includes a shell plate and an electric fan arranged on the shell plate. The electric fan is fixedly installed inside the shell plate, and the shell plate is provided with a through hole.

[0139] The heat dissipation mechanism 15 is fixedly connected with the side shell 11, and the side shell 11 is provided with a ventilation hole, so that the electric fan can blow air from the outside to the circuit control board 2. The air from the outside enters the inside of the machine shell assembly 1 through the through hole and the ventilation hole.

[0140] The server automatic detection cooling method provided in the embodiments of the present application is used for temperature detection and cooling of the circuit control board 2 of the server, and the method comprises the following steps:

[0141] When the local temperature of the circuit control board 2 rises, the partial structure of the local heat dissipation assembly 6 at the corresponding position moves towards the side away from the circuit control board 2 and triggers the passive detection assembly 4.

[0142] The passive detection assembly 4 sends an electric signal to the controller.

[0143] The controller receives the electric signal and starts the refrigerating machine 18, the first fan 351 and the electromagnetic valve 54, so as to guide the cold air generated by the refrigerating machine 18 into the coil assembly 5.

[0144] When the local temperature of the circuit control board 2 is relatively high, the circuit control board 2 with a relatively high temperature and the local part of the circuit control board 2 with a relatively high temperature are cooled.

[0145] When the temperature of the circuit control board 2 rises, the temperature of the tube shell 661 of the air inflation component 66 rises through the action of heat radiation. The gas in the time gap 6652 flows out from the heat exhaust air port 662, and the gas in the first chamber 6651 expands, pushing the guide rod to move to the right through the pressure of the gas, and the guide rod moves the cylindrical plate 65 and the first sealing ring 67 to the right, the cylindrical plate 65 presses the elastic member 62, and the elastic member 62 shrinks.

[0146] The cylindrical plate 65 moves the built-in slide rod 63 and the top sheet 64 to the right, and the built-in slide rod 63 gradually slides from inside the first through hole 613. At this time, the cylindrical plate 65 and the first sealing ring 67 move to the right end of the third through hole 615, and the first sealing ring 67 seals between the cylindrical plate 65 and the built-in shell 611, at this time, the electromagnetic valve 54 and the second fan 352 are closed, and the first fan 351 and the refrigerator 18 are opened.

[0147] The cold air generated by the refrigerator 18 is transported by the first fan 351, at this time, the first one-way valve 361 is opened under pressure, and the second one-way valve 362 is tightly closed under pressure, and the cold air enters the air guide pipe and the inner part of the coil pipe 51 through the first front cylinder shell 341, the air collecting chamber 37 and the sleeve pipe 32. Due to the blockage of the electromagnetic valve 54, the cold air can be prevented from flowing out from the air outlet pipe 53.

[0148] The outer side of the built-in shell 611 and the inner side of the disc-shaped channel 55 are provided with a gap, which can facilitate the free flow of cold air in the disc-shaped channel 55, and the cold air flows out through the air blowing pipe 617.

[0149] Since the inclined pipe 618 is protruded in the inner part of the air blowing pipe 617, at this time, part of the cold air can pass through the inclined groove 619 of the inclined pipe 618 to cool the tube shell 661, and most of the cold air blows to the circuit control board 2 through the through hole in the middle position of the air blowing pipe 617, so as to realize the effect of locally cooling the circuit control board 2.

[0150] This cooling method can quickly cool the local part of the circuit control board 2 with excessively high temperature, thereby improving the cooling effect of the circuit control board 2 and ensuring the safe use of the circuit control board 2. This targeted cooling method can avoid waste of cold air and has a certain energy-saving effect.

[0151] The refrigerator 18, the local cooling assembly 6 and the coil pipe assembly 5 are arranged in the embodiment, when the temperature of the server is high, the local part of the server with high temperature is cooled, the local part of the server is quickly cooled, the cooling effect of the server is improved, the safe use of the server is ensured, the waste of cold air is avoided, and a certain energy-saving effect is achieved.

[0152] In some embodiments, when the passive detection assembly 4 is not triggered, the server is running, the cooling mechanism 15 is turned on to guide the external air to the surrounding of the circuit control board 2, and / or the second fan 352 and the electromagnetic valve 54 are turned on to guide the external air to the coil assembly 5.

[0153] In the above process, the refrigeration machine 18 and the first fan 351 are turned off.

[0154] In the normal operation of the server, the workload in the server is small and the overall temperature is not high. At this time, the movable plate 44 and the pressure detection component 43 are in a far-away state. At this time, the first sealing ring 67 is in the third through hole 615, and the controller controls the electric fan in the cooling mechanism 15 and the second fan 352 to be turned on, and controls the electromagnetic valve 54 to be opened. The electric fan in the cooling mechanism 15 introduces the external air into the inside of the cooling mechanism 15.

[0155] In this process, the air is blown to the coil 51 and the circuit control board 2 through the gap 6652 of the fixed vertical plate 41 and the air guide through hole 45, thereby achieving the effect of air cooling on the circuit control board 2.

[0156] The material of the coil 51 is copper, which can absorb the heat emitted by the circuit control board 2 and further cool the circuit control board 2.

[0157] After the second fan 352 is turned on, the external air enters the inside of the second one-way valve 362 through the second front cylinder shell 342. The second one-way valve 362 is in an open state after being pressed, and the first one-way valve 361 is in a tightly closed state after being pressed. This can ensure that the air volume will not be weakened. At this time, the external gas enters the inside of the sleeve pipe 32 and the lead-in pipe 52 through the gas collection cavity 37.

[0158] The rubber sleeve ring 33 emphasizes the sealing effect between the sleeve pipe 32 and the lead-in pipe 52. The air enters the disc-shaped channel 55 through the lead-in pipe 52, and then leaves the rear end of the circuit plug board 13 through the lead-out pipe 53 and the rear mesh plate 12, thereby achieving the effect of cooling the coil 51 and improving the persistence of the coil 51 in cooling the circuit control board 2.

[0159] The cooling mechanism 15, the cooling driving assembly 3 and the coil assembly 5 provided in the embodiment can realize the air cooling effect on the server when the workload of the server is small and the temperature is not high by turning on the electric fan and the related valve, absorbing the heat emitted by the server by using the copper component, further cooling the server, and controlling the opening and closing of the valve to ensure that the air volume will not be weakened, thereby realizing the cooling of the cooling component and improving the persistence of the cooling component in cooling the server.

[0160] The above describes in detail the server automatic detection cooling system and method provided by the present application. The principles and implementation manners of the present application are described by using specific examples, and the above description of the embodiments is only used to help understand the method of the present application and the core idea thereof. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A server automatic detection and cooling system, wherein the server automatic detection and cooling system is configured to detect and cool the circuit control board (2) of the server, characterized in that, include: Gas supply assembly, used to transport gas; A coil assembly (5) is provided on one side along the thickness direction of the circuit control board (2). The air inlet of the coil assembly (5) is connected to the air outlet of the air supply assembly. The coil assembly (5) is configured to receive gas from the air supply assembly to cool the circuit control board (2). Multiple local heat dissipation components (6) are spaced apart along the length direction of the coil assembly (5). The local heat dissipation components (6) are arranged through the coil assembly (5) along the thickness direction of the circuit control board (2). The local heat dissipation components (6) are configured such that when the temperature at the position corresponding to the local heat dissipation component (6) on the circuit control board (2) rises to a preset temperature, a part of its structure moves toward the side away from the circuit control board (2). The local heat dissipation component (6) includes: The inner shell (611) has an inner cavity (612) and a first through hole (613), a second through hole (614), a third through hole (615) and a fourth through hole (616) communicating with the inner cavity (612). The third through hole (615) is connected to the interior of the coil assembly (5). An internal slide rod (63) is partially located in the internal cavity (612). The internal slide rod (63) extends along the length of the internal shell (611), and one end of the internal slide rod (63) extends out of the internal shell (611) through the first through hole (613). A cylindrical plate (65) is disposed in the inner cavity (612). The cylindrical plate (65) is connected to the inner slide rod (63) on the side near the circuit control board (2). The cylindrical plate (65) can slide along the length direction of the inner shell (611). An air-expanding component (66) extends into the fourth through hole (616) along its own length direction away from the circuit control board (2) and is connected to the cylindrical plate (65) away from the built-in slide rod (63). The air-expanding component (66) is configured such that when the temperature of the position corresponding to the air-expanding component (66) on the circuit control board (2) rises to a preset temperature, part of its own structure moves toward the side away from the circuit control board (2) to drive the cylindrical plate (65) to move in the same direction. An air blowing tube (617) is disposed on the side of the inner shell (611) near the circuit control board (2). The air blowing tube (617) communicates with the receiving cavity. A first connecting hole is provided on the side of the air blowing tube (617) away from the inner shell (611). The first connecting hole is configured to connect the inside and outside of the air blowing tube (617). A passive detection component (4) is located on the side of the local heat dissipation component (6) away from the circuit control board (2). The passive detection component (4) is configured to send an electrical signal to a controller when the built-in slide bar (63) of any of the local heat dissipation components (6) moves toward the side away from the circuit control board (2) to squeeze the passive detection component (4). When the passive detection component (4) is not triggered, the cylindrical plate (65) is located on the side of the third through hole (615) close to the air expansion component (66). When the passive detection component (4) is triggered, the cylindrical plate (65) is located on the side of the third through hole (615) away from the air expansion component (66). The controller is electrically connected to the passive detection component (4) and the gas supply component respectively. The controller is configured to issue a cooling command after receiving the electrical signal and control the gas supply component to supply gas to the coil component (5).

2. The server automatic detection and cooling system according to claim 1, characterized in that, The local heat dissipation assembly (6) also includes: An elastic element (62) is sleeved on the built-in slide rod (63). One end of the elastic element (62) is connected to the side of the cylindrical plate (65) near the built-in slide rod (63), and the other end of the elastic element (62) is connected to the inner wall of the built-in shell (611).

3. The server automatic detection and cooling system according to claim 2, characterized in that, The air-expanding component (66) further includes: The shell (661) has an internal gas storage cavity; The guide rod (663) is partially located in the gas storage cavity. The guide rod (663) extends into the fourth through hole (616) along its own length direction away from the circuit control board (2) and connects with the cylindrical plate (65) on the side away from the built-in slide rod (63). The guide rod (663) and the tube shell (661) are slidably connected. The second sealing ring (664) is sleeved on the side of the guide rod (663) away from the cylindrical plate (65). The outer periphery of the second sealing ring (664) is slidably connected to the inner wall of the tube shell (661). The second sealing ring (664), the guide rod (663) and the tube shell (661) together form the first chamber (6651). When the temperature of the circuit control board (2) rises, the temperature of the shell (661) rises accordingly. After the gas in the first chamber (6651) expands due to heat, the guide rod (663) moves toward the cylindrical plate (65) under the action of gas pressure.

4. The server automatic detection and cooling system according to claim 3, characterized in that, A gap (6652) is provided between the guide rod (663) and the tube shell (661). A heat exhaust port (662) is also provided on the tube shell (661). The heat exhaust port (662) is connected to the gap (6652). The heat exhaust port (662) is configured to exhaust the air in the gap (6652).

5. The server automatic detection and cooling system according to claim 4, characterized in that, The air blowing pipe (617) has a second connecting hole on its side wall. The local heat dissipation assembly (6) also includes an inclined pipe (618) disposed inside the air blowing pipe (617). The inclined pipe (618) is configured to be inclined from the side away from the circuit control board (2) toward the side closer to the circuit control board (2) toward the second connecting hole.

6. The server automatic detection and cooling system according to any one of claims 1-4, characterized in that, The coil assembly (5) includes: The inlet pipe (52) is connected to the outlet end of the air supply assembly; The coil (51) has an air inlet end connected to the air outlet end of the inlet pipe (52). The coil (51) forms a disc-shaped channel (55) and a fixed pipe opening (56) communicating with the disc-shaped channel (55). The fixed pipe opening (56) is spaced along the width direction of the coil (51). The local heat dissipation component (6) is installed at the fixed pipe opening (56). Outlet pipe (53), the inlet end of which is connected to the outlet end of the coil (51); A solenoid valve (54) is located at the outlet pipe (53).

7. The server automatic detection and cooling system according to claim 6, characterized in that, The gas supply assembly includes: Refrigeration unit (18), used to generate cold air; The heat dissipation drive assembly (3) is used at least to introduce the cold air generated by the refrigerator (18) into the coil assembly (5).

8. The server automatic detection and cooling system according to claim 7, characterized in that, The heat dissipation drive component (3) includes: The air collecting box (31) has an air collecting chamber (37) inside. At least one sleeve (32), the air inlet end of the sleeve (32) is connected to the air collection chamber (37), and the air outlet end of the sleeve (32) is connected to the inlet pipe (52); The first front shell (341) has an air inlet end connected to the air outlet of the refrigerator (18) and an air outlet end connected to the air collection chamber (37). The first check valve (361) is located on the first front shell (341). The first fan (351) is located on the first front shell (341).

9. The server automatic detection and cooling system according to claim 8, characterized in that, The heat dissipation drive assembly (3) also includes: The second front shell (342) has an air inlet end that is connected to the outside air and an air outlet end that is connected to the air collection chamber (37). The second check valve (362) is located in the second front shell (342); The second fan (352) is located in the second front casing (342).

10. The server automatic detection and cooling system according to claim 1, characterized in that, The passive detection component (4) also includes: An active plate (44) is located on the side of the local heat dissipation assembly (6) away from the circuit control board (2), and the active plate (44) has air guide holes. A fixed upright plate (41) is provided on the side of the movable plate (44) away from the movable plate (44); An elastic telescopic rod (42) is provided, with its two ends along its extension direction connected to the fixed upright plate (41) and the movable plate (44), respectively. A pressure detection component (43) is disposed on the side of the fixed plate (41) close to the movable plate (44), and the end of the pressure detection component (43) away from the fixed plate (41) and the end of the movable plate (44) away from the circuit control board (2) are spaced apart. When a portion of the structure of any of the local heat dissipation components (6) moves toward the side away from the circuit control board (2), the movable plate (44) moves toward the pressure detection component (43) and squeezes the pressure detection component (43), which sends the electrical signal to the controller.

11. The server automatic detection and cooling system according to claim 1, characterized in that, It also includes a heat dissipation mechanism (15), which is electrically connected to the controller and is located on one side of the circuit control board (2) along the thickness direction.

12. A server automatic detection and cooling method, implemented using the server automatic detection and cooling system according to any one of claims 1-11, wherein the server automatic detection and cooling method is used to detect the temperature of the server's circuit control board (2) and assist in cooling, characterized in that, The server automatic cooling detection method includes: When the local temperature of the circuit control board (2) rises, part of the structure of the local heat dissipation component (6) at the corresponding position moves toward the side away from the circuit control board (2) and triggers the passive detection component (4). The passive detection component (4) sends an electrical signal to the controller; The controller receives the electrical signal and turns on the refrigerator (18) and the first fan (351), closes the solenoid valve (54) and the second fan (352) to introduce the cold air generated by the refrigerator (18) into the coil assembly (5), and triggers the passive detection assembly (4) to make the local heat dissipation assembly (6) blow towards the circuit control board (2).

13. The server automatic detection and cooling method according to claim 12, characterized in that, During server operation, the heat dissipation mechanism (15) is activated to direct outside air to the vicinity of the circuit control board (2), and / or the second fan (352) and the solenoid valve (54) are activated to direct outside air to the coil assembly (5).

14. A server, characterized in that, include: The housing assembly (1) has an internal receiving cavity; The circuit control board (2) is located in the receiving cavity; The server automatic detection and cooling system according to any one of claims 1-11 is configured to detect the temperature at each location of the circuit control board (2) and cool the circuit control board (2) when the temperature exceeds a preset temperature.

Citation Information

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