Packaging process of detector with back-fire chip

Abstract

The invention discloses a process for packaging a detector with a back-reflection chip, which comprises the steps of material preparation, bonding of the chip and a planar heat sink, flip chip mounting, tube cap sealing and welding and the like, and is characterized in that the chip is attached to a U-shaped heat sink in a flip manner, the back surface with a micro lens is completely exposed and is in light contact, the chip does not need to be placed in the middle, the mounting precision is low, the operation is simple, the efficiency is high, and the labor intensity is low; the light utilization rate is high, the light transmission is good, and the use effect effectively meets the use requirements.

Description

Technical Field

[0001] This invention belongs to the field of communications, and specifically relates to a back-emitting chip detector packaging process that is simple to manufacture, easy to operate, requires little labor, has good light transmittance, high light utilization, and excellent performance. Background Technology

[0002] The detector chip is usually mounted upright on the heat sink and fixed inside the socket, with the front of the chip exposed and in direct contact with light. This upright structure can meet certain usage requirements, but it also has significant drawbacks. When mounted upright, the chip needs to be placed completely in the center, requiring high installation accuracy, making the operation cumbersome and inefficient, and requiring a lot of labor. It also has low light utilization, poor light transmission, and unsatisfactory performance, failing to effectively meet usage requirements.

[0003] The technical problem to be solved by the present invention is to provide a back-emitting chip detector packaging process that does not require centered placement, has low installation precision, is simple to operate and highly efficient, has low labor intensity, high light utilization, good light transmittance, excellent performance, and effectively meets the requirements of use. Summary of the Invention

[0004] To address the problems of existing technologies, such as the chip needing to be perfectly centered during installation, high precision requirements, cumbersome operation, low efficiency, high labor intensity, low light utilization, poor light transmittance, unsatisfactory performance, and inability to effectively meet usage requirements, the present invention adopts the following technical solution:

[0005] This invention provides a detector packaging process with a backlit chip, comprising the following steps: S1, material preparation: preparing a chip, a planar heat sink, a U-shaped heat sink, a socket, and a cap; a microlens is pre-fixed on the back of the chip; S2, chip bonding to the planar heat sink: bonding the P and N poles on the front of the chip to the two ends of the planar heat sink with gold wires; S3, flip-chip bonding: flip-chip bonding the bonded chip onto the U-shaped heat sink, i.e., attaching the front of the chip to the U-shaped heat sink while completely exposing the back with the microlens; S4, socket pin connection: placing the U-shaped heat sink on the socket and connecting the pins of the U-shaped heat sink and the socket electrically through gold wires; S5, cap sealing: sealing and fixing the cap on the socket, thus packaging a complete detector.

[0006] The beneficial effects of this invention are as follows: the chip is flip-chip bonded to the U-shaped heat sink, and the back of the microlens is completely exposed to light, eliminating the need for centered placement, reducing installation precision, simplifying operation and increasing efficiency, reducing labor intensity, increasing light utilization, and improving light transmittance, thus effectively meeting the usage requirements. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of step S1 in one embodiment of the present invention.

[0008] Figure 2 This is a schematic diagram of step S2 in the present invention.

[0009] Figure 3 This is a schematic diagram of step S3 in the present invention.

[0010] Figure 4 This is a schematic diagram of step S4 in the present invention.

[0011] Figure 5 This is a schematic diagram of step S5 in the present invention. Detailed Implementation

[0012] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0013] A detector packaging process with a back-emitting chip includes the following steps:

[0014] S1. Material preparation, such as Figure 1 The preparation includes a chip, a planar heat sink, a U-shaped heat sink, a socket, and a cap. A microlens is pre-fixed on the back of the chip.

[0015] S2, chip bonding to planar heat sink, such as Figure 2 As shown, the P and N electrodes on the front side of the chip are bonded to both ends of the planar heat sink with gold wires, respectively.

[0016] S3, flip chip, such as Figure 3 As shown, the bonded chip is flip-chip bonded to the U-shaped heat sink, meaning the front side of the chip is attached to the U-shaped heat sink while the back side with the microlens is completely exposed. The chip does not need to be perfectly centered, making installation simple and convenient. The light source is focused by the microlens and then conducted to the front side of the chip, resulting in good light transmittance and high light utilization. It also increases the chip contact area, leading to better heat dissipation.

[0017] S4, the socket pin is on, such as Figure 4 As shown, a U-shaped heat sink is placed on the tube socket, and the U-shaped heat sink is electrically connected to the pins of the tube socket through gold wire leads.

[0018] S5, pipe cap sealing welding, such as Figure 5 As shown, the cap is sealed and fixed to the tube base, thus encapsulating a complete detector.

[0019] The beneficial effects of this invention are as follows: the chip is flip-chip bonded to the U-shaped heat sink, and the back of the microlens is completely exposed to light, eliminating the need for centered placement, reducing installation precision, simplifying operation and increasing efficiency, reducing labor intensity, increasing light utilization, and improving light transmittance, thus effectively meeting the usage requirements.

[0020] The above embodiments are not intended to limit the product form and style of the present invention. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of the present invention.

Claims

1. A detector packaging process with a back-emitting chip, characterized in that, Includes the following steps: S1. Material preparation: Prepare chips, planar heat sinks, U-shaped heat sinks, tube sockets, and tube caps. Microlenses are pre-fixed on the back of the chips. S2. Chip bonding to planar heat sink: The P and N poles on the front side of the chip are bonded to the two ends of the planar heat sink using gold wires. S3. Flip chip bonding: The bonded chip is flip-chip bonded to the U-shaped heat sink, meaning the front side of the chip is attached to the U-shaped heat sink while the back side with the microlens is completely exposed. S4. Connecting the socket pins: The U-shaped heat sink is placed on the socket, and the pins of the U-shaped heat sink and the socket are connected electrically through gold wires. S5. Sealing the cap: The cap is sealed and fixed on the socket, thus encapsulating a complete detector.

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