Connection member and electronic device including the same

Abstract

An electronic device according to an embodiment of the present disclosure may include: a housing including at least one first conductive portion divided along at least a portion of a sidewall and a second conductive portion disposed inside the sidewall and spaced apart from the first conductive portion; a connecting member electrically connecting the first conductive portion to the second conductive portion; and a printed circuit board disposed inside the housing and electrically connected with the first conductive portion through a connection member. The connection member may include a first metal layer configured to have at least a portion bonded to the first conductive portion, a second metal layer configured to have at least a portion bonded to the second conductive portion, and a dielectric layer disposed between the first metal layer and the second metal layer.

Description

Technical Field

[0001] Embodiments of this disclosure relate to connecting members and electronic devices including connecting members. Background Technology

[0002] With the significant development of information and communication technologies, semiconductor technologies, and other fields, the distribution and use of various electronic devices are rapidly increasing. In particular, in recent years, electronic devices have been developed to be portable and capable of communication.

[0003] The term "electronic device" can refer to a device that performs a specific function according to installed programs, such as home appliances, electronic schedulers, portable multimedia players, mobile communication terminals, tablet computers, imaging and sound devices, desktop or laptop computers, or vehicle navigation systems. For example, these electronic devices can output stored information as sound or images. With the increasing integration of electronic devices and the growing prevalence of ultra-high-speed and high-capacity wireless communication, individual electronic devices, such as mobile communication terminals, can now be equipped with a wide variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music and video playback, communication and security functions such as mobile banking, and schedule management and e-wallet functions are all being integrated into a single electronic device. These electronic devices are being miniaturized for easy portability. Summary of the Invention

[0004] Technical solution According to embodiments of this disclosure, an electronic device may include: a housing including at least one first conductive portion divided along at least a portion of a sidewall and a second conductive portion disposed inside the sidewall and spaced apart from the first conductive portion; a connecting member electrically connecting the first conductive portion and the second conductive portion; and a printed circuit board disposed within the housing and electrically connected to the first conductive portion via the connecting member. The connecting member may include: a first metal layer configured to at least partially bond to the first conductive portion; a second metal layer configured to at least partially bond to the second conductive portion; and a dielectric layer disposed between the first metal layer and the second metal layer.

[0005] According to embodiments of this disclosure, an electronic device may include: a housing including at least one first conductive portion divided along at least a portion of a sidewall and a second conductive portion disposed inside the sidewall and spaced apart from the first conductive portion; a connecting member electrically connecting the first conductive portion and the second conductive portion; and a printed circuit board disposed within the housing and electrically connected to the first conductive portion via the connecting member. The connecting member may include: a first metal layer configured to be bonded to at least a portion of the first conductive portion; a second metal layer configured to be bonded to at least a portion of the second conductive portion; and a dielectric layer disposed between the first metal layer and the second metal layer. The first metal layer may be configured to be bonded to the first conductive portion by at least one of laser bonding or ultrasonic bonding, and the second metal layer may be configured to be bonded to the second conductive portion by at least one of laser bonding or ultrasonic bonding. Attached Figure Description

[0006] Figure 1 It is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] Figure 2 This is a view showing an electronic device in an unfolded state according to an embodiment of the present disclosure.

[0008] Figure 3 This is a view showing an electronic device in a folded state according to an embodiment of the present disclosure.

[0009] Figure 4 This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0010] Figure 5 This is a view showing an electronic device in an unfolded state according to an embodiment of the present disclosure, with internal components installed inside the electronic device.

[0011] Figure 6 This is a view showing the conductive portion and connecting member according to an embodiment of the present disclosure.

[0012] Figure 7a and Figure 7b These are front and rear perspective views of the connecting member according to embodiments of the present disclosure.

[0013] Figure 8a This is a view showing the state of the conductive portion of the housing before it is coupled to the connecting member according to an embodiment of the present disclosure.

[0014] Figure 8b and Figure 8cThis is a view showing the state of the conductive portion of the housing after it is coupled to the connecting member according to an embodiment of the present disclosure.

[0015] Figure 9a This is a view showing the state of the housing and connecting member before they are coupled according to an embodiment of the present disclosure.

[0016] Figure 9b This is a view showing the state after the housing and connecting member are coupled according to an embodiment of the present disclosure.

[0017] Figure 10 It is along Figure 7a The cross-sectional view taken along line A-A' shows the state of coupling between the connecting member and the shell.

[0018] Figure 11a , Figure 11b and Figure 11c This illustrates the connection member along an embodiment of the present disclosure. Figure 7b A view of the cross section intercepted by line A-A'. Detailed Implementation

[0019] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0020] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160).

[0021] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 can be implemented separately from the main processor 121, or as part of the main processor 121.

[0022] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) can include hardware architectures dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed by electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. The artificial neural network can be a deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted Boltzmann machine (RBM), deep belief network (DBN), bidirectional recurrent deep neural network (BRDNN), or deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model can include software structures in addition to hardware structures.

[0023] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0024] The program 140 can be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0025] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0026] The audio output module 155 can output audio signals to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver can be implemented separately from the speaker, or as part of the speaker.

[0027] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0028] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0029] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0030] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0031] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0033] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0034] The power management module 188 can manage the power supply to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0035] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0036] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0037] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0038] Antenna module 197 can transmit or receive signals or power to or from the outside of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0039] According to various embodiments, antenna module 197 can form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top or side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0040] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via inter-peripheral communication schemes (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0041] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations to be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0042] The electronic device 101 according to various embodiments can be one of a variety of types of electronic devices. The electronic device 101 may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to embodiments of this disclosure, the electronic device 101 is not limited to those electronic devices described above.

[0043] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0044] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0045] The various embodiments set forth herein can be implemented as software (e.g., a program) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal or external memory). For example, under the control of a processor, the processor of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media can be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0046] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0047] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0048] Figure 2 This is a view showing an electronic device in an unfolded state according to an embodiment of the present disclosure. Figure 3 This is a view showing an electronic device in a folded state according to an embodiment of the present disclosure.

[0049] Reference Figure 2 and Figure 3 The electronic device 101 may include: a housing 201; a hinge cover 240 configured to cover a foldable portion of the housing 201; and a display 230 disposed within a space defined by the housing 201. According to an embodiment, a surface on which an image output from the display 230 is exposed is defined as the front surface of the electronic device 101 (e.g., a first front surface 210a and a second front surface 220a). A surface opposite the front surface is defined as the rear surface of the electronic device 101 (e.g., a first rear surface 210b and a second rear surface 220b). Furthermore, a surface surrounding the space between the front and rear surfaces is defined as the side surface of the electronic device 101 (e.g., a first side surface 210c and a second side surface 220c). The side of the electronic device 101 may be a side of at least one of the first housing 210 or the second housing 220. Figure 2 and Figure 3 The electronic device 101 may be referred to as a "foldable electronic device," a "portable electronic device," or a "portable foldable electronic device." According to an embodiment, the housing 201 may be referred to as a "foldable housing." The display 230 may be referred to as a "flexible display."

[0050] According to an embodiment, the housing 201 may include a first housing 210, a second housing 220 rotatable relative to the first housing 210, a first rear surface cover 280, and a second rear surface cover 290. The housing 201 of the electronic device 101 is not limited to... Figure 2 and Figure 3 The shapes and components shown are not necessarily those of other shapes or parts, but can be achieved through combinations and / or components. For example, in an embodiment, the first housing 210 and the first rear surface cover 280 may be integrally configured, and the second housing 220 and the second rear surface cover 290 may be integrally configured.

[0051] According to an embodiment, the first housing 210 may be connected to a hinge structure (e.g., Figure 4 The hinge assembly 202 may include a first front surface 210a facing a first direction and a first rear surface 210b facing a second direction opposite to the first direction. The second housing 220 may include a second front surface 220a and a second rear surface 220b, the second front surface 220a being connected to the hinge assembly 202 and facing a third direction, the second rear surface 220b facing a fourth direction opposite to the third direction, and the second housing 220 being rotatable about the hinge assembly 202 relative to the first housing 210. Therefore, the electronic device 101 can be changed to a folded state or an unfolded state. When the electronic device 101 is in the folded state, the first front surface 210a may face the second front surface 220a, and when the electronic device 101 is in the unfolded state, the third direction may be the same as the first direction. Hereinafter, unless otherwise stated, the orientation will be described with reference to the unfolded state of the electronic device 101.

[0052] According to an embodiment, the first housing 210 and the second housing 220 may be positioned on opposite sides about the folding axis A and may have a generally symmetrical shape about the folding axis A. As will be described later, the angle or distance between the first housing 210 and the second housing 220 may vary depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. According to an embodiment, the second housing 220 further includes a sensor region 224 where a sensor (e.g., a front-facing camera) is disposed, but the second housing 220 may have a mutually symmetrical shape in other areas.

[0053] According to an embodiment, the folding axis A may be a plurality of (e.g., two) parallel folding axes. In this disclosure, the folding axis A is arranged along the longitudinal direction (Y-axis direction) of the electronic device 101, but the direction of the folding axis A is not limited thereto. For example (not shown), the electronic device 101 may include a folding axis A extending along the width direction (e.g., the X-axis direction).

[0054] According to an embodiment, the electronic device 101 may include a structure for attaching a digital pen. For example, the electronic device 101 may include a magnetic body configured to attach the digital pen to a side surface of a first housing 210 or a side surface of a second housing 220. According to an embodiment, the electronic device 101 may include a structure in which a digital pen can be inserted. For example, a hole (not shown) in which a digital pen can be inserted may be provided in a side surface of the first housing 210 or a side surface of the second housing 220 of the electronic device 101.

[0055] According to an embodiment, the first housing 210 and the second housing 220 may be at least partially made of a metallic or non-metallic material having a selected level of rigidity to support the display 230. At least a portion made of a metallic material may provide a ground plane for the electronic device 101 and may be electrically connected to a circuit board (e.g., Figure 4 The grounding wire on the board unit 260 in the middle.

[0056] According to embodiments, sensor region 224 can be defined as having a predetermined area adjacent to an edge or corner of second housing 220. However, the arrangement, shape, and size of sensor region 224 are not limited to the examples shown. For example, in other embodiments, sensor region 224 may be located at another corner of second housing 220 or first housing 210, or in any area between an upper corner and a lower corner. In embodiments, components embedded in electronic device 101 to perform various functions may be exposed to the front surface of electronic device 101 through sensor region 224 or through one or more openings provided in sensor region 224. In various embodiments, components may include various types of sensors. Sensors may include at least one of, for example, a front-facing camera, a receiver, or a proximity sensor.

[0057] According to an embodiment, a first rear surface cover 280 may be disposed on one side of the folding axis A on the rear surface of the electronic device 101, and may have an outer periphery, for example, generally rectangular, surrounded by a first housing 210. Similarly, a second rear surface cover 290 may be disposed on the other side of the folding axis A on the rear surface of the electronic device 101, and the outer periphery of the second rear surface cover 290 may be surrounded by a second housing 220.

[0058] According to an embodiment, the first rear cover 280 and the second rear cover 290 may have a shape that is generally symmetrical about the folding axis (axis A). However, the first rear cover 280 and the second rear cover 290 do not necessarily have mutually symmetrical shapes, and in another embodiment, the electronic device 101 may include the first rear cover 280 and the second rear cover 290 having various shapes.

[0059] According to an embodiment, the first rear surface cover 280, the second rear surface cover 290, the first housing 210, and the second housing 220 may define spaces in which various components (e.g., printed circuit boards or batteries) of the electronic device 101 are disposed. According to an embodiment, one or more components may be disposed on or visually exposed on the rear surface of the electronic device 101. For example, a sub-display (e.g., Figure 4 At least a portion of the sub-display 244 may be visually exposed through at least a portion of the first rear surface cover 280. In another embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear surface cover 290. In various embodiments, the sensor may include a proximity sensor and / or a camera module 206 (e.g., a rear camera).

[0060] According to an embodiment, a front-facing camera exposed to the front surface of the electronic device 101 through one or more openings provided in the sensor region 224, or a camera module 206 exposed through at least a portion of the second rear surface cover 290, may include one or more lenses, an image sensor, and / or an image signal processor. In some embodiments, two or more lenses (e.g., an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be arranged on a side surface of the electronic device 101.

[0061] According to an embodiment, the hinge cover 240 is disposed between the first housing 210 and the second housing 220, and can cover internal components (e.g., Figure 4 (Hinge assembly 202 in the device). According to an embodiment, depending on the state of the electronic device 101 (expanded state (flat state) or folded state), the hinge cover 240 may be covered by a portion of the first housing 210 and a portion of the second housing 220, or it may be exposed to the outside.

[0062] According to the embodiments, such as Figure 2 As shown, when the electronic device 101 is in the unfolded state, the hinge cover 240 can be concealed by being covered by the first housing 210 and the second housing 220. As another example, such as... Figure 3 As shown, when the electronic device 101 is in a folded state (e.g., a fully folded state), the hinge cover 240 may be exposed to the outside between the first housing 210 and the second housing 220. As another example, when the first housing 210 and the second housing 220 are in an intermediate state where they are folded at an angle between them, the hinge cover 240 may be partially exposed to the outside between the first housing 210 and the second housing 220. However, in this case, the exposed area may be smaller than the area exposed in the fully folded state. According to an embodiment, the hinge cover 240 may include a curved surface.

[0063] According to an embodiment, the display 230 can be placed in the space defined by the housing 201. For example, the display 230 can be seated in a recess defined by the housing 201 and can constitute a large portion of the front surface of the electronic device 101. Therefore, the front surface of the electronic device 101 may include the display 230 and the portion of the first housing 210 and the second housing 220 adjacent to the display 230. The rear surface of the electronic device 101 may include a first rear surface cover 280, the portion of the first housing 210 adjacent to the first rear surface cover 280, a second rear surface cover 290, and the portion of the second housing 220 adjacent to the second rear surface cover 290.

[0064] According to an embodiment, the display 230 may include a plurality of displays spaced apart from each other. For example, the display 230 may include a first display area 231 disposed on a first housing 210 and a second display area 232 disposed on a second housing 220. According to an embodiment, the first display area 231 and the second display area 232 may be rotatable about a folding axis A.

[0065] According to an embodiment, display 230 may refer to a display that is at least partially deformable into a flat surface or a curved surface. For example, display 230 may be a foldable display or a flexible display. According to an embodiment, display 230 may include a folding region 233, and a component disposed on one side of the folding region 233 (e.g., Figure 2 The first display area 231 (shown on the left side of the folded area 233) and the other side of the folded area 233 (e.g., Figure 2 The second display area 232 is located to the right of the folded area 233 shown in the diagram. However, the area division of the display 230 is exemplary, and the display 230 may be divided into multiple areas (e.g., four or more areas or two areas) depending on its structure or function. For example, in Figure 2 In the embodiment shown, the area of ​​display 230 may be divided by a folded region 233 extending parallel to the Y-axis or a folding axis (axis A). However, in another embodiment, the area of ​​display 230 may be divided based on another folded region (e.g., a folded region parallel to the X-axis) or another folding axis (e.g., a folding axis parallel to the X-axis). According to embodiments, display 230 may be coupled to or adjacent to touch-sensitive circuitry, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer (not shown) configured to detect a magnetic field type stylus.

[0066] According to an embodiment, the first display area 231 and the second display area 232 may have a shape that is generally symmetrical with respect to the folded area 233. According to an embodiment (not shown), unlike the first display area 231, the second display area 232 may include a cutout due to the presence of the sensor area 224, but the area outside the sensor area may have a shape symmetrical to the first display area 231. In other words, the first display area 231 and the second display area 232 may include portions with mutually symmetrical shapes and portions with mutually asymmetrical shapes.

[0067] The operation of the first housing 210 and the second housing 220, as well as the various areas of the display 230, will be described below depending on the state of the electronic device 101 (e.g., flat, unfolded, or folded).

[0068] According to an embodiment, when the electronic device 101 is in an unfolded state (flat state) (e.g., Figure 2 The first housing 210 and the second housing 220 can be arranged to form an angle of approximately 180 degrees between them and face the same direction. The surfaces of the first display area 231 and the second display area 232 of the display 230 can form an angle of 180 degrees between them and face the same direction (e.g., the front of the electronic device). The folding area 233 can define the same plane as the first display area 231 and the second display area 232.

[0069] According to an embodiment, when the electronic device 101 is in a folded state (e.g., Figure 3 The first housing 210 and the second housing 220 can be arranged to face each other. The surfaces of the first display area 231 and the second display area 232 of the display 230 can face each other while forming a narrow angle (e.g., between 0 and 10 degrees) between them. At least a portion of the folded area 233 can be formed as a curved surface with a predetermined curvature.

[0070] According to an embodiment, when the electronic device 101 is in an intermediate state (not shown), the first housing 210 and the second housing 220 can be arranged to form a specific angle between them. The surfaces of the first display area 231 and the second display area 232 of the display 230 can form an angle larger than that in the folded state and smaller than that in the unfolded state. At least a portion of the folded area 233 can form a curved surface with a predetermined curvature, and in this case, the curvature can be smaller than that in the folded state.

[0071] According to an embodiment, the key input device 217 may be disposed on the front surface (e.g., the first surface 210a and the second surface 220a) of the foldable housing 201. According to an embodiment, the key input device 217 may be disposed on the side surfaces (e.g., the first side surface 210c and the second side surface 220ca). In another embodiment, the electronic device 101 may not include some or all of the above-described key input devices 217, and the un-included key input devices 217 may be implemented in another form, such as soft keys on the display 301.

[0072] Figure 4 This is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.

[0073] refer to Figure 4 The electronic device 101 may include a housing 201, a display 230, a hinge assembly 202, a battery 250, and a board unit 260. The housing 201 may include a first housing 210, a second housing 220, a first rear cover 280, and a second rear cover 290. Figure 4 The configuration of the first housing 210, the second housing 220, the hinge cover 240, the first rear surface cover 280, and the second rear surface cover 290 can be consistent with... Figure 2 and / or Figure 3 The configurations of the first housing 210, the second housing 220, the hinge cover 240, the first rear surface cover 280, and the second rear surface cover 290 are completely or partially identical.

[0074] According to an embodiment, the first housing 210 and the second housing 220 may be assembled to each other to couple to opposite sides of the hinge assembly 202. According to an embodiment, the first housing 210 may include a first support region 212 capable of supporting components of the electronic device 101 (e.g., the first circuit board 262 and / or the first battery 252) and a first sidewall 211 surrounding at least a portion of the first support region 212. The first sidewall 211 may include a first side surface of the electronic device 101 (e.g., Figure 2 The first side surface 210c in the middle). According to an embodiment, the second housing 220 may include a second support region 222 capable of supporting components of the electronic device 101 (e.g., the second circuit board 264 and / or the second battery 254) and a second sidewall 221 surrounding at least a portion of the second support region 222. The second sidewall 221 may include a second side surface of the electronic device 101 (e.g., the first side surface 210c in the middle). Figure 2 The second side surface 220c in the middle.

[0075] According to an embodiment, the first housing 210 may include a first waterproof component 219. The second housing 220 may include a second waterproof component 229. The first waterproof component 219 may be disposed in the first support region 212. The second waterproof component 229 may be disposed in the second support region 222.

[0076] According to an embodiment, the display 230 may include a first display area 231, a second display area 232, a folding area 233, and a sub-display 244. Figure 3 The configuration of the first display area 231, the second display area 232, and the folding area 233 can be consistent with... Figure 1 and / or Figure 2 The configurations of the first display area 231, the second display area 232, and the folding area 233 are completely or partially the same or similar.

[0077] According to an embodiment, the sub-display 244 can display an image in an orientation different from that of the display areas 231 and 232. For example, the sub-display 244 can output an image in an orientation opposite to that of the first display area 231. According to an embodiment, the sub-display 244 can be disposed on the first rear surface cover 280.

[0078] According to an embodiment, battery 250 may include a first battery 252 disposed in a first housing 210 and a second battery 254 disposed in a second housing 220. According to an embodiment, the first battery 252 may be connected to a first circuit board 262, and the second battery 254 may be connected to a second circuit board 264. According to an embodiment, battery 250 may supply power to at least one component of electronic device 101. According to an embodiment, battery 250 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0079] According to an embodiment, board unit 260 may include a first circuit board 262 disposed within a first housing 210 and a second circuit board 264 disposed within a second housing 220. According to an embodiment, the first circuit board 262 and the second circuit board 264 may be electrically connected to each other via at least one flexible circuit board 266. According to an embodiment, at least a portion of the flexible circuit board 266 may be arranged to span the hinge assembly 202. According to an embodiment, the first circuit board 262 and the second circuit board 264 may be disposed within a space defined by the first housing 210, the second housing 220, the first rear surface cover 280, and the second rear surface cover 290. Components for implementing various functions of the electronic device 101 may be mounted on the first circuit board 262 and the second circuit board 264.

[0080] According to an embodiment, the electronic device 101 may include speakers 208a and 208b. According to an embodiment, speakers 208a and 208b can convert electrical signals into sound. According to an embodiment, speakers 208a and 208b may be disposed within a space defined by a first housing 210, a second housing 220, a first rear surface cover 280, and a second rear surface cover 290. According to an embodiment, speakers 208a and 208b may include an upper speaker 208a located at the upper part (+Y direction) of the electronic device 101 and a lower speaker 208b located at the lower part (-Y direction) of the electronic device 101. In this disclosure, speakers 208a and 208b are shown as being located within a housing (e.g., Figure 4 The speakers 208a and 208b may be located within the first housing 210 or the second housing 220, but this is an optional configuration. For example, the speakers 208a and 208b may be located within at least one of the first housing 210 or the second housing 220. Figure 4 The configuration of speakers 208a and 208b in the middle can be with Figure 1 The configuration of the audio output module 155 is completely or partially the same.

[0081] According to an embodiment, the electronic device 101 may include a rear member 270 (or a rear housing). According to an embodiment, the rear member 270 may be disposed within a housing 201 (e.g., a second housing 220). According to an embodiment, the rear member 270 may accommodate at least one antenna 275.

[0082] According to an embodiment, electronic device 101 may include antenna 275. Antennas 275a and 275b may include, for example, an ultra-wideband (UWB) antenna 275a, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna 275b. For example, antenna 275 may perform short-range communication with external devices, or may wirelessly send / receive power required for charging from external devices.

[0083] In embodiments, the antenna structure may be provided by a portion or combination thereof of housing 201. For example, antenna 275 may include communication antenna 275c, which is at least partially exposed to the exterior of electronic device 101 and defines at least a portion of the exterior of electronic device 101. Communication antenna 275c may be used to communicate with external electronic devices (e.g., Wi-Fi). Communication antenna 275c may be connected to the upper portion 271a or the lower portion 271b of rear member 270.

[0084] In the following detailed description, paired housings may be illustrated with respect to a configuration in which the housings are rotatably coupled to each other via a hinge structure. Note that the electronic devices according to the various embodiments disclosed herein are not limited to these embodiments. For example, the electronic devices according to the various embodiments disclosed herein may include three or more housings, and in the embodiments disclosed below, "paired housings" may mean "two housings among three or more housings that are rotatably coupled to each other."

[0085] Figure 5 This is a view showing an electronic device 101 in an unfolded state according to an embodiment of the present disclosure, in which internal components are installed.

[0086] refer to Figure 5 The electronic device 101 may include a foldable housing 400 (hereinafter referred to as housing 400) configured to house components of the electronic device 101, a key input device 404, a printed circuit board 430, a battery 440, and a magnet 450. The electronic device 101 may further include an antenna structure, and at least one component of the antenna structure (e.g., a first conductive portion 401) may be formed in a region of the housing 400. The electronic device 101 may further include various components (e.g., a camera module) disposed within the housing 400.

[0087] Figure 5 The configuration of the housing 400, key input device 404, printed circuit board 430, and battery 440 can be related to Figures 1 to 4 The housing 201, key input device 217, printed circuit board 260 and battery 189 are partially or entirely the same. Figure 5 The components in can be with Figures 1 to 4 The components are selectively combined.

[0088] According to the embodiments, refer to Figure 5 The housing 400 can be defined as the first housing of the foldable housing 400 (e.g., Figure 2 The first housing 210) or the second housing (e.g., Figure 2 (Second housing 220 in the middle). However, housing 400 is not limited to foldable housing and can be modified in various ways in design.

[0089] According to an embodiment, the housing 400 can form the appearance of the electronic device 101 and may include a first conductive portion 401, which forms at least a portion of the sidewall of the electronic device 101. According to an embodiment, the first conductive portion 401 of the housing can form the outer peripheral side surface of the electronic device 101 and can serve as the side appearance. According to an embodiment, at least one component can be disposed on the first conductive portion 401, which serves as the outer surface of the electronic device 101. For example, a plurality of key input devices 404 can be disposed on the first conductive portion 401 of the housing. According to an embodiment, the key input device 404 may have fingerprint recognition sensor functionality. However, various sensor modules (e.g., HRM sensors) can replace or be arranged together with the fingerprint recognition sensor.

[0090] According to an embodiment, the sidewall may include a first conductive portion 401 as a conductive structure or a non-conductive structure.

[0091] According to an embodiment, the housing 400 may include a second conductive portion 402 disposed inside a sidewall and forming a support member surrounded by the sidewall. The second conductive portion 402 may be configured such that internal components of an electronic device 101, such as a printed circuit board 430, are mounted on the second conductive portion 402, and that the second conductive portion 402 protects and supports the internal components. The second conductive portion 402 may be electrically connected to the printed circuit board 430, which will be described later. According to an embodiment, the support member may include the second conductive portion 402 as a conductive structure or a non-conductive structure.

[0092] According to an embodiment, the first conductive portion 401 may comprise a metallic material, and at least a portion of the first conductive portion 401 may be used as an antenna. According to an embodiment, the first conductive portion 401 may be at least one antenna segmented along at least a portion of a sidewall. The first conductive portion 401, which can be used as an antenna using a metal frame, may comprise one or more portions along the sidewall of the housing 400 (e.g., Figure 5 (411, 412, 413, 414, 415, 416, 417 and 418).

[0093] According to embodiments, the antenna can be configured using single-band and / or multi-band antenna structures. As an example of communication frequency bands that can be covered by the antenna, a typical antenna used in electronic device 101 can have a PIFA or monopole radiator as its basic structure, and the volume and number of antennas to be installed can be determined based on the service frequency, bandwidth, and type. Typically, the low-frequency band (low frequency) of 700MHz to 900MHz, the mid-frequency band of 1700MHz to 2100MHz, and the high-frequency band (high frequency) of 2300MHz to 2700MHz are used as the main communication frequency bands, and various wireless communication services such as Bluetooth (BT), GPS, and Wi-Fi can be additionally used. As another example, service frequency bands with approximate frequency ranges can be grouped and designed to be divided into multiple antennas. For example, in the case of a first antenna (main antenna) responsible for the device's main communications (such as voice / data communications (e.g., GPRS, WCDMA, and LTE)), the antenna can be located at the lower part of electronic device 101 (e.g., Figure 5 The lower part (in the Y-axis direction) contains fewer metal components that interfere with antenna performance, and the antenna can support a total of 24 frequency bands, including, for example, 2G (GSM850, EGSM, DCS, PCS), WCDMA (B1, B2, B5, B8), and LTE (B1, B2, B3, B4, B5, B7, B8, B12, B17, B18, B19, B20, B26, B38, B39, B40, B41). According to an embodiment, the electronic device 101 can implement the antenna by grouping service bands with approximate frequency ranges across two regions. For example, 2G (GSM850, EGSM, DCS, PCS), WCDMA (B1, B2, B5, B8) and LTE (B1, B2, B3, B4, B5, B8, B12, B17, B18, B19, B20, B26, B39) can be implemented in the first antenna (main antenna), and the antenna for LTE (B7, B38, B40, B41) can be designed in the second antenna (sub-antenna).

[0094] According to an embodiment, the first conductive portion 401 may be configured along the sidewall. According to an embodiment, the first conductive portion 401 may include: first-first conductive portions 411, 412, 413, 414, 416, 417, and 418, which overlap at least one surface of the printed circuit board 430 and can be physically connected to the printed circuit board 430; and a first-second conductive portion 415, which does not contact the printed circuit board 430 and may be difficult to physically connect to the printed circuit board 430.

[0095] According to an embodiment, the first-second conductive portion 415 and the second conductive portion 402 may be spaced apart from each other. For example, the first-second conductive portion 415 and the second conductive portion 402 may be integrated. According to an embodiment, the non-conductive portion 403 (see...) Figure 9a A non-conductive portion 403 can be disposed between the first conductive portion 401 and the second conductive portion 402. For example, a non-conductive portion 403 can be disposed between the first conductive portion 415 and the second conductive portion 402. Alternatively, a non-conductive portion 403 can be disposed between the first conductive portion 415 and the first conductive portion 416. The non-conductive portion 403 can be, for example, an injection-molded product.

[0096] According to an embodiment, the electronic device 101 may include a printed circuit board 430 disposed on a support member. The printed circuit board 430 may include an upper region located within a housing (e.g., Figure 5 The first printed circuit board 431 (in the +Y axis direction) and the lower region (e.g., in the housing) located within the housing. Figure 5 The second printed circuit board 432 (in the Y-axis direction). According to an embodiment, the first-1 conductive portions 411, 412, 413, 414, 416, 417, and 418 can be configured to be adjacent to the first printed circuit board 431 or the second printed circuit board 432. The first-1 conductive portions 411, 412, 413, 414, 416, 417, and 418 can be electrically connected to the first printed circuit board 431 or the second printed circuit board 432. For example, the first-1 conductive portions 411, 412, 413, 414, 416, 417, and 418 can be connected to an antenna contact element, and the antenna contact element can be connected to a varistor or multilayer ceramic capacitor (MLCC) disposed on the first printed circuit board 430 or the second printed circuit board 430 to prevent leakage current corrosion of the housing 400.

[0097] According to an embodiment, the electronic device 101 may include a battery 440 disposed on a support member. The battery 440 may be disposed between a first printed circuit board 431 and a second printed circuit board 432. According to an embodiment, the battery 440 may be positioned adjacent to a first-second conductive portion 415 of a first conductive portion 401. According to an embodiment, at least one surface of the battery 440 may contact the first-second conductive portion 415. Because the first-second conductive portion 415 is positioned adjacent to the battery 440 rather than the printed circuit board 430, it may be difficult to physically connect it to the printed circuit board 430. According to an embodiment of this disclosure, the first-second conductive portion 415 may be connected to a second conductive portion 402, which is connected to the printed circuit board 430 via a connecting member 420.

[0098] According to an embodiment, a magnet 450 may be disposed in each housing to maintain the folded state by the attractive force of the magnet 450 when the foldable housing 400 is in a folded state. According to an embodiment, at least one magnet 450 may be disposed between a sidewall of the housing and a battery 440. The magnet 450 may be disposed between a first-second conductive portion 415 of the first conductive portion 401 and the battery 440. Since the first-second conductive portion 415 is positioned adjacent to the magnet 450 and the battery 440 but not the printed circuit board 430, it may be difficult to connect the first-second conductive portion 415 to the printed circuit board 430 using a flexible printed circuit board in terms of layout. According to an embodiment of this disclosure, the first-second conductive portion 415 may be connected to a second conductive portion 402, which is connected to the printed circuit board 430 via a connecting member 420.

[0099] According to an embodiment, the first-second conductive portion 415 may be configured to be adjacent to the battery 440 located between the first printed circuit board 430 and the second printed circuit board 430. The first-second conductive portion 440 may be configured not to be adjacent to either the first or second printed circuit board 430, and therefore may be difficult to physically connect. According to an embodiment of this disclosure, the electronic device 101 may further include a connection member 420 to prevent the housing 400 including the first-second conductive portion 440 from being corroded due to leakage current.

[0100] The configuration and structure of the connecting member 420 will be described in detail below.

[0101] Figure 6 This is a view showing the conductive portion of the housing 400 and the connecting member 420 according to an embodiment of the present disclosure. Figure 6 For ease of description, non-conductive structures (e.g., ...) are omitted. Figure 9a The non-conductive part 403). Figure 7a and Figure 7b These are front and rear perspective views of the connecting member 420 according to embodiments of the present disclosure. Figure 8a This is a view showing the state of the conductive portion of the housing 400 and the connecting member 420 before coupling, according to an embodiment of the present disclosure. Figure 8b and Figure 8c This is a view showing the state of the conductive portion of the housing 400 and the connecting member 420 after coupling according to an embodiment of the present disclosure. Figure 9a This is a view showing the state of the housing 400 and the connecting member 420 before coupling according to an embodiment of the present disclosure. Figure 9b This is a view showing the state of the housing 400 and the connecting member 420 after coupling according to an embodiment of the present disclosure. Figure 10 It is along Figure 7aThe cross-sectional view taken along line A-A' shows the coupling state between the connecting member 420 and the housing.

[0102] refer to Figures 6 to 10 The electronic device 101 may include a foldable housing 400 (hereinafter referred to as "housing 400") configured to house components of the electronic device 101 and a connecting member 420. The electronic device 101 may further include an antenna structure, and at least one component of the antenna structure (e.g., a first conductive portion 401) may be located in a region of the housing 400. The electronic device 101 may further include various components (e.g., a camera module) disposed within the housing 400.

[0103] Figures 6 to 10 The configuration of the housing 400 in the middle can be with Figures 1 to 4 The configuration of the housing 201 is partially or entirely the same. Figures 6 to 10 The structure can optionally be with Figure 5 The structures are combined.

[0104] According to an embodiment, the connecting member 420 may contact the first conductive portion 401 and the second conductive portion 402. The connecting member 420 may electrically connect the first conductive portion 401 and the second conductive portion 402. According to an embodiment, the connecting member 420 may electrically connect a first-second conductive portion 415 of the first conductive portion 401 and the second conductive portion 402. For example, the connecting member 420 may contact the end of the first-second conductive portion 415 in the Y-axis direction.

[0105] According to an embodiment, the connecting member 420 may have a capacitor structure configured to block direct current and allow alternating current to pass through, for corrosion protection and electric shock protection related to leakage current from the first-second conductive portion 415. According to an embodiment, in the connecting member 420, voltage can be applied between the first metal layer 421 and the second metal layer 423 due to radiated current, and negative and positive charges can be induced in the first metal layer 421 and the second metal layer 423, respectively. As a result, electrical energy can be stored due to the electrostatic attraction between the first metal layer 421 and the second metal layer 423, allowing the connecting member 420 to perform substantially the same function as a capacitor.

[0106] According to an embodiment, the connecting member 420 may include: a first metal layer 421 configured to be at least partially bonded to the second conductive portion 402; a second metal layer 423 configured to be at least partially bonded to the first conductive portion 401; and a dielectric layer 422 sandwiched between the first metal layer 421 and the second metal layer 423.

[0107] According to an embodiment, the first metal layer 421 may include a first-1 region 421a in contact with the second conductive portion 402 and a first-2 region 421b stacked with the dielectric layer 422. The second metal layer 423 may include a second-1 region 423a in contact with the first conductive portion 401 and a second-2 region 423b stacked with the dielectric layer 422. The dielectric layer 422 may be disposed between the first-2 region 421b of the first metal layer 421 and the second-2 region 423b of the second metal layer 423.

[0108] According to an embodiment, the first metal layer 421 can be joined to electrically connect to the second conductive portion 402. For example, the first metal layer 421 can be joined to electrically connect to a second protrusion 402a of the second conductive portion 402. The second protrusion 402a of the second conductive portion 402 may protrude in the -X-axis direction where the first conductive portion 401 is located. For example, the first metal layer 421 can be joined to the second conductive portion 402 by a joining method such as laser bonding or ultrasonic bonding. For example, the first region 421a of the first metal layer 421 can be joined to the second conductive portion 402 by a joining method such as laser bonding or ultrasonic bonding. The first metal layer 421 and the second conductive portion 402 can be joined by a joining method such as laser bonding or ultrasonic bonding, so that the function and shape of the electronic device 101 can be maintained even when the electronic device 101 is subjected to an impact such as a drop.

[0109] According to an embodiment, the second metal layer 423 can be joined to electrically connect to the first conductive portion 401. According to an embodiment, the second metal layer 423 can be joined to electrically connect to the first-second conductive portion 415. For example, the first metal layer 421 can be joined to electrically connect to the first protrusion 415a of the first-second conductive portion 415. The first protrusion 415a of the first-second conductive portion 415 may protrude in the +X axis direction where the second conductive portion 402 is located. For example, the second metal layer 423 can be joined to the first conductive portion 401 by a joining method such as laser bonding or ultrasonic bonding. For example, the second-first region 423a of the second metal layer 423 can be joined to the first conductive portion 401 by a joining method such as laser bonding or ultrasonic bonding. The first metal layer 421 and the second conductive portion 402 can be joined by a joining method such as laser bonding or ultrasonic bonding, so that the function and shape of the electronic device 101 can be maintained even when the electronic device 101 is subjected to an impact such as a drop.

[0110] According to embodiments, the capacitance of the connecting member 420 can be determined by the dielectric constant of the dielectric layer 422 and the distance and overlap area between the first metal layer 421 and the second metal layer 423. For example, the dielectric constant of the dielectric layer 422 according to an embodiment of the present disclosure can be more than about 1.0 (F / m) and less than 5.0 (F / m). For example, the dielectric constant of the dielectric layer 422 according to an embodiment of the present disclosure can be about 3.0 (F / m). For example, the thickness of the dielectric layer 422 according to the present disclosure can be more than about 0.005 mm and less than 0.015 mm. For example, the thickness of the dielectric layer 422 according to an embodiment of the present disclosure can be about 0.01 mm. For example, the width (e.g., t1 in FIG. 9) or length (e.g., t2 in FIG. 9) of the stacked portion of the connecting member 420 (e.g., the first-second region 421b of the first metal layer 421, and the second-second region 423b of the dielectric layer 422 and the second metal layer 423) can be more than about 1 mm and less than 4 mm. For example, the width or length of the stacked portion of the connecting member 420 according to an embodiment of the present disclosure (e.g., the first-second region 421b of the first metal layer 421, the second-second region 423b of the dielectric layer 422 and the second metal layer 423) may be about 2 mm.

[0111] According to an embodiment, a groove 4200 corresponding to the shape of the connecting member 420 can be formed in a portion of the housing 400, which includes a first conductive portion 401, a second conductive portion 402, and a non-conductive portion 403, and is configured to be coupled to the connecting member 420. When the housing 400, including the first conductive portion 401, the second conductive portion 402, and the non-conductive portion 403, is coupled to the connecting member 420, the front surface of the electronic device 101 (e.g., Figure 6 The surface along the +Z axis can be formed to be flat.

[0112] Figures 11a to 11c This illustrates the alignment of embodiments according to this disclosure. Figure 7b The cross-sectional view of the connecting member 420 taken from the A-A' line.

[0113] refer to Figures 11a to 11c The electronic device 101 may include a foldable housing 400 (hereinafter referred to as housing 400) configured to house components of the electronic device 101, a key input device 404, a printed circuit board 430, a battery 440, and a magnet 450. The electronic device 101 may further include an antenna structure, and at least one component of the antenna structure (e.g., a first conductive portion 401) may be located in a region of the housing 400. The electronic device 101 may further include various components (e.g., a camera module) disposed within the housing 400.

[0114] Figures 11a to 11cThe configuration of the housing 400, key input device 404, printed circuit board 430, and battery 440 can be related to Figures 1 to 4 The housing 201, key input device 217, printed circuit board 260 and battery 189 are partially or entirely the same. Figures 11a to 11c The structure can be with Figures 5 to 10 The structures are selectively combined.

[0115] According to the embodiments, refer to Figure 11a The dielectric layer 422a forming the connecting member 420 can be formed of a flexible copper clad layer (FCCL). For example, the dielectric layer 422a can be formed of a double-sided flexible copper clad layer (FCCL). The flexible copper clad layer (FCCL) can be formed by methods such as casting, sputtering, or electroless plating. For example, the capacitance of the dielectric layer 422a can be more than about 15 pF and less than 25 pF. For example, the capacitance of the dielectric layer 422a can be about 20 pF. For example, the dielectric layer 422a can have a thickness of about 15 μm or less. For example, the dielectric layer 422a can have a thickness of about 12 µm or less. According to an embodiment, the dielectric layer 422a can be attached to the first metal layer 421 and the second metal layer 423 by surface mount technology (SMT). For example, dielectric layer 422a can be attached to support members (not shown) disposed on the upper and lower surfaces by soldering (SMT), and the support members (not shown) can be connected to the first metal layer 421 and the second metal layer 423 by laser soldering.

[0116] According to the embodiments, refer to Figure 11b The dielectric layer 422b forming the connecting member 420 can be in the form of a thin film. For example, the dielectric layer 422b can have a thickness of about 40 μm or more and about 60 μm or less. For example, the dielectric layer 422b can have a thickness of about 50 μm. According to this embodiment ( Figure 11b The capacitance of dielectric layer 422b can be higher than that according to the foregoing embodiment ( Figure 11a The capacitance of dielectric layer 422a.

[0117] According to the embodiments, refer to Figure 11c The dielectric layer 422c forming the connecting member 420 may include metal sheets 4221 and 4223 and bonding tabs 4222 disposed between the metal sheets. The dielectric layer 422c can be manufactured by hot pressing. For example, the dielectric layer 422c can be manufactured by a hot pressing process applying 45 kg of weight at a temperature of about 160 degrees Celsius. For example, the dielectric layer 422c may have a thickness of about 10 μm or more and about 20 μm or less.

[0118] According to embodiments of this disclosure, the electronic device may include: a housing comprising at least one first conductive portion (e.g., divided along at least a portion of a sidewall) Figure 5 The housing includes a first and second conductive portion 415 and a second conductive portion disposed on the inner sidewall and spaced apart from the first conductive portion; a connecting member electrically connecting the first and second conductive portions; and a printed circuit board disposed within the housing and electrically connected to the first conductive portion via the connecting member. The connecting member may include a first metal layer, a second metal layer, and a dielectric layer, the first metal layer being configured to be bonded to at least a portion of the first conductive portion, the second metal layer being configured to be bonded to at least a portion of the second conductive portion, and the dielectric layer being disposed between the first and second metal layers.

[0119] According to an embodiment, the first metal layer may include a first-1 region 421a in contact with the first conductive portion and a first-2 region 421b stacked with the dielectric layer, the second metal layer may include a second-1 region 423a in contact with the second conductive portion and a second-2 region 423b stacked with the dielectric layer, and the dielectric layer may be configured to be disposed between the first-2 region of the first metal layer and the second-2 region of the second metal layer.

[0120] According to an embodiment, the connecting member can be configured to block direct current and allow alternating current to pass through the connecting member.

[0121] According to an embodiment, the housing may further include a groove 4200 formed at a location coupled to the connecting member. The groove may have a shape corresponding to the shape of the connecting member.

[0122] According to an embodiment, the connecting member may include a flexible copper clad layer (FCCL).

[0123] According to an embodiment, the dielectric layer of the connecting member may include a first metal sheet 4221 in contact with the first metal layer, a second metal sheet 4223 in contact with the second metal layer, and a bonding piece 4222 disposed between the first metal sheet and the second metal sheet.

[0124] According to an embodiment, the housing may further include a non-conductive portion 403 disposed between the first conductive portion and the second conductive portion.

[0125] According to an embodiment, the printed circuit board may include a first printed circuit board 431 located in the upper region of the housing and a second printed circuit board 432 located in the lower region of the housing.

[0126] According to an embodiment, the electronic device may further include a battery 440 disposed on the second conductive portion, and the battery may be configured to be adjacent to the first conductive portion.

[0127] According to an embodiment, the electronic device may further include a magnet 450 disposed between the first conductive portion and the battery.

[0128] According to an embodiment, the second conductive portion can be configured to be electrically connected to a printed circuit board.

[0129] According to an embodiment, the first conductive portion may be spaced apart from the printed circuit board.

[0130] According to an embodiment, the first metal layer may be configured to be bonded to the first conductive portion by at least one of laser bonding or ultrasonic bonding.

[0131] According to an embodiment, the second metal layer may be configured to be bonded to the second conductive portion by at least one of laser bonding or ultrasonic bonding.

[0132] According to an embodiment, at least one key input device may be disposed on the first conductive portion.

[0133] According to embodiments of this disclosure, an electronic device may include: a housing including at least one first conductive portion divided along at least a portion of a sidewall and a second conductive portion disposed inside the sidewall and spaced apart from the first conductive portion; a connecting member electrically connecting the first conductive portion and the second conductive portion; and a printed circuit board disposed within the housing and electrically connected to the first conductive portion via the connecting member. The connecting member may include a first metal layer, a second metal layer, and a dielectric layer, the first metal layer being configured to be bonded to at least a portion of the first conductive portion, the second metal layer being configured to be bonded to at least a portion of the second conductive portion, and the dielectric layer being disposed between the first metal layer and the second metal layer. The first metal layer may be configured to be bonded to the first conductive portion by at least one of laser bonding or ultrasonic bonding, and the second metal layer may be configured to be bonded to the second conductive portion by at least one of laser bonding or ultrasonic bonding.

[0134] According to an embodiment, the connecting member can be configured to block direct current and allow alternating current to pass through it.

[0135] According to an embodiment, the first metal layer may include a first-1 region 421a in contact with the first conductive portion and a first-2 region 421b stacked with the dielectric layer, the second metal layer may include a second-1 region 423a in contact with the second conductive portion and a second-2 region 423b stacked with the dielectric layer, and the dielectric layer may be configured to be disposed between the first-2 region of the first metal layer and the second-2 region of the second metal layer.

[0136] According to an embodiment, the housing may further include a groove 4200 formed at a location coupled to the connecting member. The groove may have a shape corresponding to the shape of the connecting member.

[0137] According to an embodiment, the connecting member may include a flexible copper clad layer (FCCL).

[0138] During charging of electronic device 101 using a charger (e.g., a third-party fast charger), oxidation (corrosion) of the metal components may occur when electrolytes (e.g., sweat or water) enter the interior of the metal components of electronic device 101 due to leakage current. During this process, gases generated by corrosion (e.g., hydrogen) may push against the anodized layer and may cause delamination of the anodized layer (corrosion caused by leakage current). To prevent this, the sidewall housing, including the fingerprint key and the support member, can be configured to be separable. An antenna contact element can be provided between a first conductive portion 401 (antenna) of the sidewall where the fingerprint key is located and a second conductive portion 402 forming at least a portion of the support member, and a varistor or multilayer ceramic capacitor (MLCC) can be mounted on the printed circuit board (PCB) 430 to prevent leakage current after vertical or lateral contact, thereby blocking the DC current between the second conductive portion 402 and ground. However, in the case of an antenna not adjacent to the printed circuit board 430, current blocking may be difficult.

[0139] In the electronic device 101 according to an embodiment of the present disclosure, the first conductive portion 401 (antenna) with a fingerprint key can be physically separated from the second conductive portion 402 (support member) and can be electrically connected via a connection member 420 that performs substantially the same function as a capacitor, so as to maintain antenna performance and prevent electric shock or corrosion caused by leakage current.

Claims

1. An electronic device, the electronic device comprising: The housing (400) includes at least one first conductive portion (e.g., first-second conductive portion (415)) and a second conductive portion (402), the at least one first conductive portion being divided along at least a portion of a sidewall, and the second conductive portion being disposed inside the sidewall and spaced apart from the first conductive portion. A connecting member (420) electrically connects the first conductive portion and the second conductive portion; as well as A printed circuit board (430) is disposed in the housing and electrically connected to the first conductive portion via the connecting member. The connecting component includes: A first metal layer (421) is configured to at least partially bond to the first conductive portion. A second metal layer (423), configured to at least partially bond to the second conductive portion, and A dielectric layer (422) is disposed between the first metal layer and the second metal layer.

2. The electronic device according to claim 1, wherein, The first metal layer includes a first region (421a) in contact with the first conductive portion and a first region (421b) stacked with the dielectric layer. The second metal layer includes a second-1 region (423a) in contact with the second conductive portion and a second-2 region (423b) stacked with the dielectric layer. The dielectric layer is disposed between the first-2 region of the first metal layer and the second-2 region of the second metal layer.

3. The electronic device according to any one of claims 1 and 2, wherein, The connecting member is configured to block direct current and allow alternating current to pass through it.

4. The electronic device according to any one of claims 1 to 3, wherein, The housing also includes a groove (4200) formed at the location where it is coupled to the connecting member, the groove having a shape corresponding to the shape of the connecting member.

5. The electronic device according to any one of claims 1 to 4, wherein, The connecting component includes a flexible copper clad layer (FCCL).

6. The electronic device according to any one of claims 1 to 4, wherein, The dielectric layer of the connecting member includes: The first metal sheet (4221) is in contact with the first metal layer. The second metal sheet (4223) is in contact with the second metal layer, and A bonding piece (4222) is disposed between the first metal sheet and the second metal sheet.

7. The electronic device according to any one of claims 1 to 6, wherein, The housing also includes a non-conductive portion (403) disposed between the first conductive portion and the second conductive portion.

8. The electronic device according to any one of claims 1 to 7, wherein, The printed circuit board includes: The first printed circuit board (431) is located in the upper region within the housing, and The second printed circuit board (432) is located in the lower region within the housing.

9. The electronic device according to any one of claims 1 to 8, wherein the electronic device further comprises: A battery (440) is disposed on the second conductive portion. The battery is positioned adjacent to the first conductive portion.

10. The electronic device according to claim 9, further comprising: A magnet (450) is disposed between the first conductive portion and the battery.

11. The electronic device according to any one of claims 1 to 10, wherein, The second conductive portion is configured to be electrically connected to the printed circuit board.

12. The electronic device according to any one of claims 1 to 11, wherein, The first conductive portion is spaced apart from the printed circuit board.

13. The electronic device according to any one of claims 1 to 12, wherein, The first metal layer is configured to be bonded to the first conductive portion by at least one of laser bonding or ultrasonic bonding.

14. The electronic device according to any one of claims 1 to 13, wherein, The second metal layer is configured to be bonded to the second conductive portion by at least one of laser bonding or ultrasonic bonding.

15. The electronic device according to any one of claims 1 to 14, wherein, At least one key input device is provided on the first conductive portion.

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