Electronic assembly for a motor vehicle having a cold plate with a stamped
By forming cavities in metal sheets and filling them with thermal paste, the design of electronic components solves the problem of low cooling efficiency of metal sheet cold plates, achieving lightweight and efficient cooling, and is suitable for electronic components in motor vehicles.
Patent Information
- Application Number
- CN202480023371.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-04-27
- Filing Date
- 2024-04-23
- Publication Date
- 2025-11-11
AI Technical Summary
Existing sheet metal cold plates have low cooling efficiency in high heat power density cooling applications, and the cost of increasing heat exchange is high and the structure is bulky. Existing fin or pin structures are expensive and complex.
Electronic components consisting of printed circuit boards, metal sheets, and enclosed plates improve heat exchange efficiency by forming cavities in the metal sheets and filling them with thermal paste, combined with liquid cooling technology, and using a stamping process to form raised structures.
It achieves efficient cooling under high heat power density, has a lightweight and low-cost structure, optimized cooling efficiency, and is suitable for electronic components in motor vehicles.
Smart Images
Figure CN120937512A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic enclosures, particularly for power electronics, and especially to electronic enclosures comprising electronic components and systems for cooling electronic components. Such electronic enclosures can be implemented in motor vehicles. Background Technology
[0002] To cool the power electronic components housed within an electronic enclosure, a technique known as liquid cooling is employed, in which a (single) refrigerant liquid circulates within a plate called a "cold plate." Within this cold plate, the power electronic components are arranged to abut against a substantially flat sheet of metal. Heat exchange, thus effective in cooling the power electronic components, is achieved through friction between the refrigerant liquid and the metal sheet within a cooling channel.
[0003] Dissipator technology that implements metal structures with fins or pins is also known. Structures with fins or pins are formed by casting or die casting, and these elements are solid.
[0004] In dissipator technology, the exchange surface is increased by means of fins or pins, and heat exchange is efficient because these elements are positioned to face the path of the fluid. However, this technology is expensive and bulky (and therefore heavy).
[0005] While the manufacturing process is simpler and more economical when using sheet metal, the protrusions in the structure obtained by stamping are much less noticeable compared to manufacturing by die casting. In fact, the amount of metal to be deformed remains substantially constant in the stamping direction, resulting in hollow fins or pins. Heat exchange via friction is therefore less efficient compared to techniques using dissipators with increased exchange surface area and solid fins or pins.
[0006] The problem with cooling efficiency lies in the high heat power density to be dissipated (i.e., greater than 10 W / cm²). 2 Some demanding assemblies exist (top-cooled MOSFETs, IGBT transistors, diode cooling).
[0007] Increasing heat exchange with the metal sheet means introducing additional processing constraints (e.g., brazing of additional components, such as Z-shaped components, which are known by the English name "turbulator"). Summary of the Invention
[0008] The purpose of this invention is to overcome the shortcomings of the prior art, especially to improve the cooling efficiency of metal sheet cold plate technology, and to propose an economical, less bulky and weight-reduced solution.
[0009] To achieve this objective, the present invention provides an electronic component comprising: - Printed circuit boards; - Electronic components, especially power electronic components, are mounted on printed circuit boards; - A metal sheet is mounted on a printed circuit board. A cavity is formed in the metal sheet. Electronic components are housed in the cavity and between the printed circuit board and the metal sheet. The cavity is filled with an interface material, which is thermal paste. - A sealing plate, which is mounted on a metal sheet, is held to face the electronic components and is at least partially spaced from the metal sheet and the cavity, so as to form a circulation channel configured to allow the refrigerant liquid to enter.
[0010] Advantageously, the present invention allows for the combination of liquid cooling technology, which includes metal sheets (which is easy and economical to manufacture), and technology that increases the heat exchange surface (which is thermally efficient) in the same structure.
[0011] Depending on the specific variant, the electronic components can be MOSFETs, IGBTs, diodes, GaN-type transistors, or SiC-type transistors.
[0012] In certain variations, within the cavity housing the electronic components, gaps can be formed between the electronic components and the metal sheet, and these gaps are filled with the interface material. This configuration allows for good thermal conductivity.
[0013] According to a specific variation, the gap can be formed on the side of the electronic component facing away from the printed circuit board and on at least one lateral side of the electronic component that crosses the printed circuit board, preferably both on the side of the electronic component facing away from the printed circuit board and on all lateral sides of the electronic component that cross the printed circuit board. Such a configuration allows for further optimization of heat conduction, especially when the gap is formed on both the side of the electronic component facing away from the printed circuit board and on all lateral sides of the electronic component that cross the printed circuit board.
[0014] According to a specific variant: - The maximum length of the cavity in the total extension plane of the metal sheet can be between 5 and 25 mm; and / or - The distance between the side of the electronic component facing away from the printed circuit board and the bottom of the cavity can be less than 1mm.
[0015] Depending on the specific variant, the height of the circulation channel in the direction perpendicular to the total extension plane of the metal sheet can be between 5 and 10 mm.
[0016] According to a specific variant, the height of the protrusion forming the cavity is between 0.8 and 1.2 times the height of the body of the electronic component housed in the cavity.
[0017] According to a specific variant, the electronic assembly includes at least four electronic components, which may in particular be power electronic components. At least four cavities corresponding to the at least four electronic components are formed on a metal sheet, and each cavity respectively houses an electronic component. The at least four cavities are distributed in a non-rectangular parallelepiped pattern. This configuration allows for optimized cooling while providing a dense distribution of components.
[0018] Depending on the specific variant, thermal paste can be made of epoxy resin, silicone, or compressible flexible polymer foam.
[0019] Depending on the specific variant, the interface material includes an electrically insulating component.
[0020] Electrical insulation components include, for example, pre-folded adhesives, surface treatment components, or spray coating components.
[0021] The present invention may also relate to a housing that includes the electronic components as described above.
[0022] The present invention may also relate to a method for manufacturing the aforementioned electronic components, comprising the following steps: - Stamping a metal sheet to form at least one cavity; - Fill the cavity using interface material; - To mount electronic components, especially power electronic components, onto a printed circuit board to form a printed circuit subassembly; - Printed circuit subassemblies are assembled using metal sheets by inserting electronic components into the cavity through contact with interface material.
[0023] This approach allows for the production of electronic components with reduced mass and good cooling efficiency at a lower cost. Attached Figure Description
[0024] The invention will be further described in detail by way of non-limiting embodiments and based on the accompanying figures, which illustrate variations of the invention, wherein: [ Figure 1The diagram schematically illustrates a longitudinal section of an electronic component according to the present invention; [ Figure 2 [This is a top view of a specific embodiment of an electronic assembly having components arranged in a stepped or staggered pattern;] [ Figure 3 [Illustration used for manufacturing] Figure 1 A flowchart of the steps of a method for making electronic components; [ Figure 4 Another specific embodiment of the invention is illustrated schematically. Detailed Implementation
[0025] exist Figure 1 The diagram illustrates a housing 5 including electronic components 10. The housing 5 and / or electronic components 10 can be implemented in a motor vehicle without limitation.
[0026] Electronic component 10 includes: - Printed circuit board 50, hereinafter referred to as board 50; - Electronic component 20, which is preferably, but not limited to, power electronic component 20, is mounted on board 50; - A metal sheet 40, referred to below as sheet 40, is mounted on a plate 50 and a cavity 30 is formed therein, a component 20 is accommodated in the cavity 30 and between the plate 50 and the sheet 40, and the cavity 30 is filled with interface material 300.
[0027] - A sealing plate 80 is mounted on the sheet 40 and is held facing the component 20, at least partially spaced from the sheet 40 and the cavity 30, to form a circulation channel 70 configured to allow refrigerant liquid to enter.
[0028] Component 20 can be a MOSFET, IGBT, diode, GaN-type transistor, or SiC-type transistor, particularly a top-cooled transistor. Alternatively, electronic assembly 10 includes an assembly of electronic component 20 selected from MOSFET, IGBT, diode, GaN-type transistor, or SiC-type transistor.
[0029] In the cavity 30 that houses the component 20, a gap 31 is formed between the component 20 and the sheet 40 and is filled with interface material 300.
[0030] This gap 31 is formed both on the side of component 20 facing away from plate 50 and on all the lateral sides of component 20 that are transverse to plate 50.
[0031] Preferably: - The maximum length A of cavity 30 in the total extension plane P1 of sheet 40 is between 5 and 25 mm; and - The distance C between the side of the electronic component 20 facing away from the plate 50 and the bottom of the cavity 30 is less than 1 mm; - The height B of the circulation channel 70 in the direction perpendicular to the total extension plane P1 of the sheet 40 is between 5 and 10 mm; - The height E of the protrusion 60 (e.g., fin or pin) forming the cavity 30 is between 0.8 and 1.2 times the height D of the body of the component 20 housed in the cavity 30.
[0032] Interface material 300 is selected from thermal paste, electrical insulation, epoxy resin and silicone.
[0033] In a particular embodiment, without limitation, the electronic component 10 includes a plurality of (i.e., at least four of each of the following elements): components 20; cavities 30 corresponding to the components 20, formed on a sheet 40, each cavity correspondingly accommodating one component 20, and preferably arranged in an alternating pattern in a non-rectangular or elongated rhomboid parallelepiped manner. Figure 2 )distributed.
[0034] In this configuration, the protrusions 60 (and therefore the cavities 30 and components 20) can be distributed both in rows 611, 612, and 613 (correspondingly in columns 621, 622, and 623) and aligned along axes L1, L2, and L3 within the same row (correspondingly aligned along axes H1, H2, and H3 within the same column), alternating every other row (correspondingly every other column). Two successive protrusions 60 within the same row (correspondingly the same column) are then arranged every other axis (e.g., on L1, L3, etc.), either in rows with even subscripts or rows with odd subscripts (correspondingly either in columns with even subscripts or columns with odd subscripts). This arrangement optimizes refrigerant circulation and cooling efficiency.
[0035] In alternative embodiments of the present invention, such as in Figure 4 The electronic component 110 is implemented as shown in the figure. The electronic component 110 includes opposing first and second printed circuit boards 151 and 152 as described in previous embodiments. Both the first and second printed circuit boards 151 and 152 include one or more electronic components and a metal sheet. The metal sheet forms a channel 170 configured to allow refrigerant liquid to pass through. The first printed circuit board 151 has at least a first protrusion 161 and a second protrusion 162. The second printed circuit board 152 has at least a protrusion 163 disposed between the first protrusion 161 and the second protrusion 162 of the first printed circuit board 151.
[0036] Electronic component 10 can be manufactured using manufacturing method E100, which includes the following steps: - Stamping E110 sheet 40 to form at least one protrusion 60 having a cavity 30, preferably a fin or a pin; - Fill the E120 cavity 30 with interface material 300; - Mount component 20 onto board 50 to form printed circuit subassembly 15; - The E140 subassembly 15 is assembled using the sheet 40 by inserting the component 20 into the cavity 30 in contact with the interface material 300.
Claims
1. An electronic component (10), comprising: - Printed circuit board (50); - Electronic components (20), especially power electronic components (20), are mounted on a printed circuit board (50); - A metal sheet (40) is mounted on a printed circuit board (50), a cavity (30) is formed in the metal sheet (40), an electronic component (20) is housed in the cavity (30) and between the printed circuit board (50) and the metal sheet (40), and the cavity (30) is filled with an interface material (300), which is a thermal paste; - A sealing plate (80) is mounted on a metal sheet (40), the sealing plate (80) being held facing the electronic component (20) and at least partially spaced from the metal sheet (40) and the cavity (30) to form a circulation channel (70) configured to allow the refrigerant liquid to pass through.
2. The electronic component (10) as claimed in claim 1, characterized in that, The electronic component (20) is a MOSFET, IGBT, diode, GaN type transistor or SiC type transistor.
3. The electronic component (10) as claimed in any one of claims 1 or 2, characterized in that, In the cavity (30) in which the electronic component (20) is housed, a gap (31) is formed between the electronic component (20) and the metal sheet (40), and the gap (31) is filled with the interface material (300).
4. The electronic component (10) as described in claim 3, characterized in that, The gap (31) is formed on the side of the electronic component (20) facing away from the printed circuit board (50) and on at least one lateral side of the electronic component (20) that is transverse to the printed circuit board (50), preferably both on the side of the electronic component (20) facing away from the printed circuit board (50) and on all lateral sides of the electronic component (20) that are transverse to the printed circuit board (50).
5. The electronic component (10) as claimed in any one of claims 1 to 4, characterized in that: - The maximum length (A) of the cavity (30) in the total extension plane (P1) of the metal sheet (40) is between 5 and 25 mm; and / or - The distance (C) between the side of the electronic component (20) facing away from the printed circuit board (50) and the bottom of the cavity (30) is less than 1 mm.
6. The electronic component (10) as claimed in any one of claims 1 to 5, characterized in that, The height (B) of the circulation channel (70) in the direction perpendicular to the total extension plane (P1) of the metal sheet (40) is between 5 and 10 mm.
7. The electronic component (10) as claimed in any one of claims 1 to 6, characterized in that, The height (E) of the protrusion (60) forming the cavity (30) is between 0.8 and 1.2 times the height (D) of the main body of the electronic component (20) housed in the cavity (30).
8. The electronic component (10) as claimed in any one of claims 1 to 7, characterized in that, The electronic component (10) includes at least four electronic parts (20), which may be, in particular, power electronic parts (20). At least four cavities (30) corresponding to the at least four electronic parts (20) are formed on a metal sheet (40), and each cavity (30) respectively accommodates an electronic part (20). The at least four cavities (30) are distributed in a non-rectangular parallelepiped pattern.
9. The electronic component (10) as claimed in any one of claims 1 to 8, characterized in that, Thermal paste is made of epoxy resin, silicone, or compressible flexible polymer foam.
10. The electronic component (10) as claimed in any one of claims 1 to 9, characterized in that, The interface material (300) includes an electrically insulating portion.
11. A housing (5) comprising an electronic component (10) as claimed in any one of claims 1 to 10.
12. A method (E100) for manufacturing an electronic component as claimed in any one of claims 1 to 10, comprising the following steps: - Stamp (E110) metal sheet (40) to form at least one cavity (30); - Fill the cavity (30) with interface material (300); - Electronic components (20), especially power electronic components (20), are mounted (E130) on a printed circuit board (50) to form a printed circuit subassembly (15). - The printed circuit subassembly (15) is assembled using a metal sheet (40) by inserting the electronic component (20) into the cavity (30) through contact with the interface material (300).