Waterproof packaging device for PCB production

By coordinating the design of Y-axis, X-axis, and Z-axis moving components and clamping components, the problems of uneven glue mixing and inaccurate positioning in waterproof encapsulation of PCB circuit boards are solved, achieving efficient and precise waterproof encapsulation results.

CN120940173APending Publication Date: 2025-11-14HUNAN HUAQIU DIGITAL TECH CO LTD
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Patent Information

Application Number
CN202511322342.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-16
Publication Date
2025-11-14

AI Technical Summary

Technical Problem

Existing waterproof PCB encapsulation equipment suffers from problems such as uneven glue mixing, poor adaptability of clamping components, and inaccurate glue injection position, making it difficult to meet the encapsulation requirements of different specifications and irregularly shaped circuit boards.

Method used

A waterproof encapsulation device employs Y-axis, X-axis, and Z-axis moving components working in tandem. Combined with a stirrer and mixer, it achieves uniform mixing of the adhesive. The clamping components, through the design of elastic elements and rollers, adapt to different sized circuit boards, ensuring precise dispensing.

Benefits of technology

It achieves thorough and uniform mixing of the adhesive, ensuring stable clamping and precise dispensing of the circuit board, adapting to multi-area packaging needs, and improving the waterproof sealing and adhesive strength of the packaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of circuit board processing, in particular to a waterproof packaging device for PCB production, which comprises a case, a mounting table is arranged on the rear side of the top of the case, a control panel is arranged on the front side of the top of the case, and a Y-axis moving assembly moving along the Y-axis direction is arranged on the top of the mounting table. An X-axis moving assembly moving in the X-axis direction is arranged on the Y-axis moving assembly. The stirrer is arranged in the glue box, so that single glue can be stirred in advance to prevent precipitation; the vortex blades in the mixer can forcibly stir various glue materials in the glue conveying process, full and uniform mixing is achieved, the problem that natural mixing of traditional equipment is insufficient is solved, the glue strength and waterproof sealing performance are effectively improved, and the packaging defect caused by uneven glue mixing is avoided.
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Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, and in particular to a waterproof encapsulation device for PCB circuit board production. Background Technology

[0002] In today's rapidly developing electronics and information industry, PCB circuit boards, as core components of electronic devices, operate in increasingly complex and diverse environments. Waterproofing performance has become a key indicator of PCB reliability. Especially in applications such as outdoor electronic equipment, industrial control devices, and automotive electronic systems, PCBs are constantly exposed to humid, dusty, or liquid-splashed environments. Inadequate waterproofing can easily lead to short circuits, component corrosion, and other malfunctions due to moisture intrusion, directly impacting the lifespan and operational stability of the equipment. Therefore, developing efficient and reliable waterproofing encapsulation devices for PCB circuit boards is of significant practical importance.

[0003] Currently, the industry primarily uses manual glue application or semi-automated equipment for waterproof encapsulation of PCB circuit boards. This makes it difficult to ensure uniform glue distribution, easily leading to problems such as incomplete or over-sealing, resulting in unstable waterproof performance. Furthermore, most waterproof encapsulations require mixing two or more glue ingredients in specific proportions. Existing equipment often has simple mixing mechanisms, relying solely on natural mixing during pipeline transport, which fails to achieve thorough and uniform glue fusion, directly impacting the strength of the encapsulated adhesive and its waterproof seal. The diverse specifications of PCB circuit boards and mounting boxes mean that the clamping components of existing equipment have poor adaptability, easily resulting in loosening or over-tightening during fixation, causing circuit board displacement during glue application and affecting the accuracy of the glue application position. Traditional equipment's glue application components often use fixed trajectory movement, making it difficult to adapt to the complex glue application requirements of different circuit board sizes. For irregularly shaped or multi-area encapsulated circuit boards, comprehensive coverage is often impossible.

[0004] Therefore, there is a need to design a waterproof encapsulation device for PCB circuit board production that can efficiently mix adhesives and accurately position PCB circuit boards and mounting boxes. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, the present invention provides a waterproof encapsulation device for PCB circuit board production.

[0006] The technical embodiment of the present invention is as follows: A waterproof encapsulation device for PCB circuit board production includes a chassis, a mounting platform, a control panel, a Y-axis moving assembly, an X-axis moving assembly, a Z-axis moving assembly, a glue dispensing assembly, a glue tank, a mixer, a square platform, a clamping assembly, a stirrer, and a material pushing assembly. The mounting platform is located on the rear side of the top of the chassis, and the control panel is located on the front side of the top of the chassis. A Y-axis moving assembly that moves along the Y-axis direction is located on the top of the mounting platform. An X-axis moving assembly that moves along the X-axis direction is located on the Y-axis moving assembly, and a Z-axis moving assembly that moves along the Z-axis direction is located on the X-axis moving assembly. The glue dispensing assembly is mounted on... Mounted on the Z-axis moving assembly, the dispensing assembly is equipped with a mixer capable of mixing different adhesives. Two adhesive tanks are located on the top left side of the chassis, each equipped with an agitator. The dispensing assembly is connected to the adhesive tanks. A square platform is located on the front top of the chassis. A clamping assembly for positioning and fixing the PCB circuit board box is located between the square platform and the mounting platform. A pusher assembly capable of pushing the PCB circuit board box is located on the Y-axis moving assembly. The controller in the control panel is connected to the power components in the Y-axis moving assembly, X-axis moving assembly, Z-axis moving assembly, dispensing assembly, agitator, and pusher assembly via wiring.

[0007] As a further preferred embodiment, the clamping assembly includes a fixed platform, linear guide rails, sliding plates, a fixed shaft, swing rods, sliding shafts, elastic elements, mounting housings, rollers, and baffles. A fixed platform is positioned between the square platform and the mounting platform. Linear guide rails are symmetrically arranged on the top of the fixed platform, front and back. Two sliding plates are slidably mounted on the linear guide rails, moving laterally towards each other. A slot is formed on the front and back of the side of the two sliding plates closest to each other. A fixed shaft is located at the center of the top of the fixed platform. Two swing rods are arranged in a cross-rotation configuration on the fixed shaft. Sliding shafts are arranged on both the front and back sides of the top of the swing rods, slidingly engaging with the slots of the adjacent sliding plates. Two elastic elements are symmetrically arranged on the left and right sides of the top of the fixed platform. One end of each elastic element connects to the adjacent swing rod, and the other end connects to the top of the fixed platform. A mounting housing is provided on the top of each sliding plate, with rollers arranged in a rotatable manner at intervals within the mounting housing. A baffle with a groove is located on the rear side of the top of the fixed platform.

[0008] As a further preferred embodiment, the glue injection assembly includes a glue injection head, a pipe, a mixing pipe, a branch pipe, and a hose. The Z-axis moving assembly is equipped with a glue injection head, a pipe, and a mixing pipe. The inlet end of the glue injection head is connected to the lower end of the mixing pipe through a pipe. The upper end of the mixing pipe is symmetrically connected to a branch pipe, which is connected to the corresponding glue tank through a hose. A mixer is installed inside the mixing pipe.

[0009] As a further preferred embodiment, the mixer includes a rotating shaft and vortex blades, with the rotating shaft rotatably disposed at the center of the top of the mixing tube, and vortex blades spaced apart on the rotating shaft.

[0010] As a further preferred embodiment, the material pushing assembly includes a third cylinder and a push plate. The third cylinder is provided on the front side wall of the fixed plate, and the push plate is provided on the telescopic rod of the third cylinder. The push plate cooperates with the groove on the upper part of the baffle. The third cylinder is connected to the controller in the control panel through a circuit.

[0011] As a further preferred option, it also includes a cover plate and a vibrator. A rectangular groove is opened on the rear side of the top of the square platform, and a cover plate is fixedly connected to the rectangular groove by screws. A vibrator is set at the bottom of the cover plate, and the vibrator is connected to the controller in the control panel through a wire.

[0012] As a further preferred embodiment, the Y-axis moving assembly includes a straight slide rail, a slider, a fixed plate, an N-shaped bracket, a lead screw, a motor, and a nut. The straight slide rail is embedded in the front top of the mounting platform, and the slider is slidably mounted on the straight slide rail. The fixed plate is mounted in the rear top of the mounting platform, and the N-shaped bracket is mounted in the front top of the mounting platform. A lead screw is rotatably mounted between the fixed plate and the N-shaped bracket. The motor is mounted on the top of the fixed plate, and the output shaft of the motor is connected to the lead screw. A nut is embedded in the upper part of the slider, and the nut is screwed into the lead screw. The motor is connected to the controller in the control panel via wiring.

[0013] As a further preferred embodiment, the X-axis moving assembly includes a mounting plate, a mounting bracket, a first guide rod, a first sliding block, and a first cylinder. The mounting plate is provided on the upper part of the front side wall of the slider. The mounting brackets are symmetrically arranged on the left and right sides of the front side wall of the mounting plate. The first guide rods are symmetrically arranged between the two mounting brackets. The first sliding block is slidably arranged between the two first guide rods. The first cylinder is provided on the mounting bracket on the right side. The extension rod of the first cylinder is connected to the first sliding block. The first cylinder is connected to the controller in the control panel through a circuit.

[0014] As a further preferred embodiment, the Z-axis movement assembly includes a vertical plate, a second guide rod, a second sliding block, and a second cylinder. The vertical plate is located on the front side of the first sliding block, and the second guide rods are symmetrically arranged on the left and right sides of the vertical plate. The second sliding block is slidably arranged on the second guide rods. The second cylinder is located on the upper part of the vertical plate. The telescopic rod of the second cylinder is connected to the second sliding block. The dispensing head and the mixing tube are fixedly installed on the second sliding block. The second cylinder is connected to the controller in the control panel via wiring.

[0015] As a further preferred embodiment, a support assembly is also included, which includes a support frame, a connecting rod, a strip frame, and a straight rod. The support frame is provided on the left side wall of the slider, and the connecting rod is provided on the top of the support frame. The strip frames are symmetrically arranged on the left and right sides of the connecting rod, and the straight rods are symmetrically arranged between the two strip frames. The straight rods are used to support the wound hose.

[0016] The present invention has the following advantages:

[0017] 1. By installing a stirrer in the glue tank, a single glue material can be pre-stirred to prevent sedimentation; the vortex blades in the mixer can force-stir multiple glue materials during glue delivery to achieve full and uniform mixing, solving the problem of insufficient natural mixing in traditional equipment, effectively improving the glue strength and waterproof sealing performance, and avoiding encapsulation defects caused by uneven glue mixing.

[0018] 2. The clamping assembly, through the design of elastic elements, sliding plates, rollers and baffles, can adapt to PCB circuit boards and mounting boxes of different specifications. While providing stable clamping force, it avoids being too tight or loose, solving the problems of poor adaptability and inaccurate positioning of traditional clamping assemblies. It ensures that the circuit board does not shift during the glue injection process and guarantees the accuracy of the glue injection position.

[0019] 3. With the synergistic effect of the Y-axis, X-axis and Z-axis moving components, the dispensing assembly can achieve multi-dimensional and high-precision movement control, which can adapt to the dispensing needs of circuit boards of different specifications, irregular shapes and multi-area packaging. It effectively solves the problems of fixed dispensing trajectory and incomplete coverage of traditional equipment, avoids missed sealing and over-sealing, and ensures uniform glue distribution. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0021] Figure 2 This is a partial three-dimensional structural schematic diagram of the present invention.

[0022] Figure 3 This is a schematic diagram of the installation structure of the X-axis moving component and the Z-axis moving component of the present invention.

[0023] Figure 4 This is an exploded structural diagram of the glue injection assembly of the present invention.

[0024] Figure 5 This is an exploded structural diagram of the clamping assembly of the present invention.

[0025] Figure 6 This is a partial three-dimensional structural diagram of the clamping component of the present invention.

[0026] Figure 7 This is a schematic diagram of the three-dimensional installation structure of the support component of the present invention.

[0027] Figure 8 This is a schematic diagram of the exploded structure of the cover plate and vibrator of the present invention.

[0028] In the attached diagrams: 1. Chassis; 2. Mounting platform; 3. Control panel; 4. Y-axis moving assembly; 41. Straight slide rail; 42. Slider; 43. Fixing plate; 44. N-shaped bracket; 45. Lead screw; 46. Motor; 47. Nut; 5. X-axis moving assembly; 51. Mounting plate; 52. Mounting bracket; 53. First guide rod; 54. First sliding block; 55. First cylinder; 6. Z-axis moving assembly; 61. Vertical plate; 62. Second guide rod; 63. Second sliding block; 64. Second cylinder; 7. Glue injection assembly; 71. Glue injection head; 72. Pipe; 73. Mixing pipe; 74. Branch pipe; 75. Hose; 8. Glue tank. 9_Mixer, 91_Rotating shaft, 92_Vortex blade, 10_Square platform, 11_Clamping assembly, 111_Fixed platform, 112_Linear slide rail, 113_Sliding plate, 114_Slotted groove, 115_Fixed shaft, 116_Swing rod, 117_Sliding shaft, 118_Elastic element, 119_Mounting shell, 1110_Roller, 1111_Baffle, 12_Agitator, 13_Pushing assembly, 131_Third cylinder, 132_Push plate, 14_Support assembly, 141_Support frame, 142_Connecting rod, 143_Strip frame, 144_Straight rod, 15_Rectangular groove, 16_Cover plate, 17_Vibrator. Detailed Implementation

[0029] The following description is only a preferred embodiment of the present invention and does not limit the scope of protection of the present invention.

[0030] Example: Figures 1-6As shown, a waterproof encapsulation device for PCB circuit board production includes a chassis 1, a mounting platform 2, a control panel 3, a Y-axis moving assembly 4, an X-axis moving assembly 5, a Z-axis moving assembly 6, a dispensing assembly 7, a glue tank 8, a mixer 9, a square table 10, a clamping assembly 11, a stirrer 12, and a pushing assembly 13. The mounting platform 2 is located on the rear top of the chassis 1, and the control panel 3 is located on the front top of the chassis 1. A Y-axis moving assembly 4, which moves along the Y-axis, is located on the top of the mounting platform 2. An X-axis moving assembly 5, which moves along the X-axis, is located on the Y-axis moving assembly 4. A Z-axis moving assembly 6, which moves along the Z-axis, is located on the X-axis moving assembly 5. The dispensing assembly 7 is mounted on the Z-axis moving assembly 6 and includes a dispensing head. 71. Pipe 72. Mixing pipe 73. Branch pipe 74. Hose 75. The Z-axis moving assembly 6 is equipped with a dispensing head 71, a pipe 72, and a mixing pipe 73. The inlet end of the dispensing head 71 is connected to the lower end of the mixing pipe 73 through the pipe 72. The upper end of the mixing pipe 73 is symmetrically connected to the branch pipe 74. The branch pipe 74 is connected to the corresponding glue tank 8 through the hose 75. A mixer 9 is installed inside the mixing pipe 73. The mixer 9 includes a rotating shaft 91 and vortex blades 92. The rotating shaft 91 is rotatably installed at the top center of the mixing pipe 73. Vortex blades 92 are spaced on the rotating shaft 91. The dispensing assembly 7 is equipped with a mixer 9 capable of mixing different glues. Two glue tanks 8 are installed on the top left side of the casing 1. The glue tanks 8 are connected to an external air compressor. Each glue tank 8 is equipped with a stirrer 12, which consists of a motor and stirring blades. The glue dispensing assembly 7 is connected to the glue tank 8. A square platform 10 is provided on the front top of the casing 1. A clamping assembly 11 for positioning and fixing the PCB circuit board box is provided between the square platform 10 and the mounting platform 2. The clamping assembly 11 includes a fixed platform 111, a linear slide rail 112, a sliding plate 113, a fixed shaft 115, a swing rod 116, a sliding shaft 117, an elastic element 118, a mounting shell 119, rollers 1110, and a baffle 1111. The fixed platform 111 is provided between the square platform 10 and the mounting platform 2. The fixed platform 111 has linear slide rails 112 symmetrically arranged on the top of the fixed platform 111. Two sliding plates 113 are slidably mounted on the linear slide rails 112. On the top, two sliding plates 113 move towards each other from left to right. Each sliding plate 113 has a slot 114 on its front and back sides where they are close to each other. A fixed shaft 115 is located at the center of the top of the fixed platform 111. Two swing rods 116 are rotatably mounted on the fixed shaft 115. Sliding shafts 117 are located on both the front and back sides of the top of each swing rod 116. The sliding shafts 117 slide in conjunction with the slots 114 of the sliding plates 113. Two elastic elements 118 are symmetrically arranged on the left and right sides of the top of the fixed platform 111. One end of each elastic element 118 is connected to the adjacent swing rod 116, and the other end is connected to the top of the fixed platform 111. Each sliding plate 113 has a mounting shell 119 on its top. Rollers 1110 are rotatably mounted at intervals within the mounting shell 119.A baffle 1111 with a groove is provided on the rear side of the top of the fixed platform 111. A pusher assembly 13 capable of pushing out the PCB circuit board box is provided on the Y-axis moving assembly 4. The pusher assembly 13 includes a third cylinder 131 and a pusher plate 132. The third cylinder 131 is provided on the front side wall of the fixed plate 43. The pusher plate 132 is provided on the telescopic rod of the third cylinder 131. The pusher plate 132 cooperates with the groove on the upper part of the baffle 1111. The third cylinder 131 is connected to the controller in the control panel 3 via wiring. The controller in the control panel 3 is connected to the power components in the Y-axis moving assembly 4, X-axis moving assembly 5, Z-axis moving assembly 6, glue dispensing assembly 7, mixer 12, and pusher assembly 13 via wiring.

[0031] like Figure 8 As shown, it also includes a cover plate 16 and a vibrator 17. A rectangular groove 15 is opened on the rear side of the top of the square platform 10. The cover plate 16 is fixedly connected to the rectangular groove 15 by screws. The vibrator 17 is provided at the bottom of the cover plate 16. The vibrator 17 is connected to the controller in the control panel 3 through a wire.

[0032] like Figure 1 and Figure 2 As shown, the Y-axis moving assembly 4 includes a straight slide rail 41, a slider 42, a fixed plate 43, an N-shaped frame 44, a lead screw 45, a motor 46, and a nut 47. The straight slide rail 41 is embedded in the front top of the mounting platform 2, and the slider 42 is slidably mounted on the straight slide rail 41. The fixed plate 43 is mounted in the rear top of the mounting platform 2, and the N-shaped frame 44 is mounted in the front top of the mounting platform 2. The lead screw 45 is rotatably mounted between the fixed plate 43 and the N-shaped frame 44. The motor 46 is mounted on the top of the fixed plate 43, and the output shaft of the motor 46 is connected to the lead screw 45. The nut 47 is embedded in the upper part of the slider 42 and is connected to the lead screw 45. The motor 46 is connected to the controller in the control panel 3 through wiring.

[0033] like Figure 1 and Figure 3 As shown, the X-axis moving assembly 5 includes a mounting plate 51, a mounting bracket 52, a first guide rod 53, a first sliding block 54, and a first cylinder 55. The mounting plate 51 is provided on the upper part of the front side wall of the slider 42. The mounting brackets 52 are symmetrically arranged on the left and right sides of the front side wall of the mounting plate 51. The first guide rods 53 are symmetrically arranged between the two mounting brackets 52. The first sliding block 54 is slidably arranged between the two first guide rods 53. The first cylinder 55 is provided on the mounting bracket 52 on the right side. The telescopic rod of the first cylinder 55 is connected to the first sliding block 54. The first cylinder 55 is connected to the controller in the control panel 3 through a circuit.

[0034] like Figure 1 and Figure 3As shown, the Z-axis moving assembly 6 includes a vertical plate 61, a second guide rod 62, a second sliding block 63, and a second cylinder 64. The vertical plate 61 is provided on the front side of the first sliding block 54. The second guide rod 62 is symmetrically arranged on the left and right sides of the vertical plate 61. The second sliding block 63 is slidably arranged on the second guide rod 62. The second cylinder 64 is provided on the upper part of the vertical plate 61. The telescopic rod of the second cylinder 64 is connected to the second sliding block 63. The glue injection head 71 and the mixing tube 73 are fixedly installed on the second sliding block 63. The second cylinder 64 is connected to the controller in the control panel 3 through a circuit.

[0035] like Figure 2 and Figure 7 As shown, it also includes a support assembly 14, which includes a support frame 141, a connecting rod 142, a strip frame 143, and a straight rod 144. The support frame 141 is provided on the left side wall of the slider 42, and the connecting rod 142 is provided on the top of the support frame 141. The strip frames 143 are symmetrically arranged on the left and right sides of the connecting rod 142. The straight rod 144 is symmetrically arranged between the two strip frames 143. The straight rod 144 is used to support the wound hose 75. The function of the strip frame 143 is to prevent the hose 75 from sagging or bending during the pulling process, and to ensure that the glue can smoothly enter the branch pipe 74.

[0036] When waterproof encapsulation of a PCB circuit board is required, the circuit board is installed in the corresponding mounting box, and then the mounting box is placed on the square platform 10 and pushed backward. The mounting box presses the arc surface on the front side of the mounting shell 119, which causes the two mounting shells 119 to drive the sliding plate 113 to move backward. The slot 114 of the sliding plate 113 drives the two swing rods 116 to rotate around the fixed axis 115 through the sliding shaft 117. The elastic element 118 is compressed, and the mounting box is pushed into the two mounting shells 119. The roller 1110 can guide the outside of the mounting box. When the rear side wall of the mounting box abuts against the baffle 1111, the pushing of the mounting box stops. At this time, operated via control panel 3, motor 46 drives lead screw 45 to rotate, and lead screw 45 drives slider 42 to move forward on straight slide rail 41. When the dispensing head 71 is above the mounting shell 119, motor 46 stops working, and first cylinder 55 operates, which can drive first sliding block 54 to move left and right for position adjustment. Second cylinder 64 operates, which can drive second sliding block 63 and dispensing head 71 to move up and down for adjustment. Agitator 12 mixes the glue in glue tank 8, and then the air compressor in glue tank 8 operates, and compressed air enters glue tank 8. Glue enters mixing tube 73 through hose 75 and branch pipe 74. In mixing tube 73, the two glue raw materials are squeezed by vortex blades 92, which in turn drive... As the vortex blade 92 rotates, the adhesive, after being sprayed out through the mixing tube 73 into the dispensing head 71, undergoes further mixing. Through the coordinated movement of the Y-axis moving component 4, X-axis moving component 5, and Z-axis moving component 6, adhesive can be injected into various parts of the mounting box, thereby flooding the PCB circuit board and achieving a waterproof encapsulation effect. After encapsulation, the control panel 3 controls the dispensing component 7 to stop dispensing adhesive, and starts the third cylinder 131 to drive the push plate 132 to push the mounting box forward, disengaging it from the clamping component 11 and moving it to the position of the cover plate 16 on the square platform 10. The vibrator 17 at the bottom of the cover plate 16 works to drive the cover plate 16 and the mounting box to vibrate at high frequency, making the adhesive in the mounting box evenly vibrate. This device has a simple structure and is easy to operate.

[0037] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A waterproof encapsulation device for PCB circuit board production, characterized in that, The system includes a chassis (1), a mounting platform (2) on the rear top of the chassis (1), a control panel (3) on the front top of the chassis (1), a Y-axis moving assembly (4) on the top of the mounting platform (2) that moves along the Y-axis, an X-axis moving assembly (5) on the Y-axis moving assembly (4) that moves along the X-axis, a Z-axis moving assembly (6) on the X-axis moving assembly (5) that moves along the Z-axis, a glue dispensing assembly (7) mounted on the Z-axis moving assembly (6), a mixer (9) on the glue dispensing assembly (7) capable of mixing different glues, and two glue tanks (8) on the left side of the top of the chassis (1). Each component is equipped with a stirrer (12). The glue injection assembly (7) is connected to the glue tank (8). A square platform (10) is provided on the front side of the top of the chassis (1). A clamping assembly (11) for positioning and fixing the PCB circuit board box is provided between the square platform (10) and the mounting platform (2). A pusher assembly (13) for pushing the PCB circuit board box is provided on the Y-axis moving assembly (4). The controller in the control panel (3) is connected to the power components in the Y-axis moving assembly (4), the X-axis moving assembly (5), the Z-axis moving assembly (6), the glue injection assembly (7), the stirrer (12), and the pusher assembly (13) via wiring.

2. A waterproof encapsulation device for PCB circuit board production according to claim 1, characterized in that, The clamping assembly (11) includes a fixed platform (111), which is positioned between the square platform (10) and the mounting platform (2). A linear slide rail (112) is symmetrically arranged on the top of the fixed platform (111). Two sliding plates (113) are slidably mounted on the linear slide rail (112). The two sliding plates (113) move towards each other from left to right. A slot (114) is formed on the front and back sides of the two sliding plates (113) that are close to each other. A fixed shaft (115) is located at the center of the top of the fixed platform (111). Two swing rods (116) are arranged in a cross-rotational manner on the fixed shaft (115). The top of the swing rods (116) is positioned front and back. Both sides are provided with sliding shafts (117), and the sliding shafts (117) are slidably engaged with the slots (114) of the sliding plate (113). The top of the fixed platform (111) is symmetrically provided with two elastic elements (118) on the left and right sides. One end of the elastic element (118) is connected to the swing rod (116) nearby, and the other end of the elastic element (118) is connected to the top of the fixed platform (111). The top of the sliding plate (113) is provided with a mounting shell (119), and the mounting shell (119) is provided with rollers (1110) arranged in a rotating manner at intervals. The rear side of the top of the fixed platform (111) is provided with a baffle (1111), and the baffle (1111) has a groove.

3. A waterproof encapsulation device for PCB circuit board production according to claim 2, characterized in that, The glue injection assembly (7) includes a glue injection head (71). The Z-axis moving assembly (6) is provided with a glue injection head (71), a pipe (72) and a mixing pipe (73). The inlet end of the glue injection head (71) is connected to the lower end of the mixing pipe (73) through the pipe (72). The upper end of the mixing pipe (73) is symmetrically connected with a branch pipe (74). The branch pipe (74) is connected to the corresponding glue tank (8) through a hose (75). The mixer (9) is provided inside the mixing pipe (73).

4. A waterproof encapsulation device for PCB circuit board production according to claim 3, characterized in that, The mixer (9) includes a rotating shaft (91), and the rotating shaft (91) is rotatably arranged at the top center of the mixing tube (73). Vortex blades (92) are arranged at intervals on the rotating shaft (91).

5. A waterproof encapsulation device for PCB circuit board production according to claim 4, characterized in that, The feeding assembly (13) includes a third cylinder (131). The front side wall of the fixed plate (43) is provided with the third cylinder (131). The telescopic rod of the third cylinder (131) is provided with a push plate (132). The push plate (132) cooperates with the groove on the upper part of the baffle (1111). The third cylinder (131) is connected to the controller in the control panel (3) through a line.

6. A waterproof encapsulation device for PCB circuit board production according to claim 5, characterized in that, It also includes a cover plate (16), a rectangular groove (15) is opened on the rear side of the top of the square platform (10), the cover plate (16) is fixedly connected to the rectangular groove (15) by screws, and a vibrator (17) is provided at the bottom of the cover plate (16). The vibrator (17) is connected to the controller in the control panel (3) through a line.

7. A waterproof encapsulation device for PCB circuit board production according to claim 6, characterized in that, The Y-axis moving assembly (4) includes a straight slide rail (41). The straight slide rail (41) is embedded in the front top of the mounting platform (2). A slider (42) is slidably mounted on the straight slide rail (41). A fixing plate (43) is mounted on the rear top of the mounting platform (2). An N-shaped frame (44) is mounted on the front top of the mounting platform (2). A lead screw (45) is rotatably mounted between the fixing plate (43) and the N-shaped frame (44). A motor (46) is mounted on the top of the fixing plate (43). The output shaft of the motor (46) is connected to the lead screw (45). A nut (47) is embedded in the upper part of the slider (42). The nut (47) is screwed into the lead screw (45). The motor (46) is connected to the controller in the control panel (3) via a circuit.

8. A waterproof encapsulation device for PCB circuit board production according to claim 7, characterized in that, The X-axis moving assembly (5) includes a mounting plate (51). The upper part of the front side wall of the slider (42) is provided with the mounting plate (51). The front side wall of the mounting plate (51) is symmetrically provided with mounting brackets (52). The two mounting brackets (52) are symmetrically provided with first guide rods (53). The two first guide rods (53) are slidably provided with first sliding blocks (54). The mounting bracket (52) on the right side is provided with a first cylinder (55). The telescopic rod of the first cylinder (55) is connected to the first sliding block (54). The first cylinder (55) is connected to the controller in the control panel (3) through a line.

9. A waterproof encapsulation device for PCB circuit board production according to claim 8, characterized in that, The Z-axis moving assembly (6) includes a vertical plate (61), a vertical plate (61) is provided on the front side of the first sliding block (54), a second guide rod (62) is symmetrically provided on the left and right sides of the vertical plate (61), a second sliding block (63) is slidably provided on the second guide rod (62), a second cylinder (64) is provided on the upper part of the vertical plate (61), the telescopic rod of the second cylinder (64) is connected to the second sliding block (63), the glue injection head (71) and the mixing tube (73) are fixedly installed on the second sliding block (63), and the second cylinder (64) is connected to the controller in the control panel (3) through a line.

10. A waterproof encapsulation device for PCB circuit board production according to claim 9, characterized in that, It also includes a support assembly (14), which includes a support frame (141). The support frame (141) is provided on the left side wall of the slider (42). A connecting rod (142) is provided on the top of the support frame (141). A strip frame (143) is symmetrically arranged on the left and right sides of the connecting rod (142). A straight rod (144) is symmetrically arranged between the two strip frames (143) and front and back. The straight rod (144) is used to support the wound hose (75).