Wafer waxing and polishing integrated apparatus and wafer waxing and polishing method

Abstract

The application discloses a wafer waxing and polishing integrated equipment, and belongs to the technical field of semiconductor processing. After a wafer is gripped by a wafer taking and transferring assembly, the wafer is sequentially transported between various processing units for processing; a porcelain disc is transported between a porcelain disc washing assembly and a wafer pasting assembly by a disc carrying assembly, and finally, wafer pasting is realized at the wafer pasting assembly. The wafer pasting porcelain disc is transferred to each polishing device by a porcelain disc transferring assembly for further polishing processing. That is, a wafer waxing machine and a polishing machine are integrated and linked to realize automatic cleaning, waxing, wafer pasting, polishing and wafer taking of the wafer and the porcelain disc, that is, manual wafer carrying in various single-machine processing mechanisms in the related art can be omitted. In this way, the wafer polishing process efficiency is effectively improved, the instability of personnel wafer carrying is reduced, a series of risks caused by possible misoperation of employees is greatly reduced, the cleaning efficiency and the cleaning process capability of the wafer and the porcelain disc are improved, and the integrated wafer product yield is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular to a wafer waxing and polishing integrated device and a wafer waxing and polishing method. BACKGROUND

[0002] A wafer is a silicon wafer used for manufacturing integrated circuits. Since the wafer is circular in shape, it is also called a wafer. By manufacturing various circuit structures on the surface of the wafer, the wafer can become an electronic component with specific electrical properties. During the production and processing of the wafer, it usually needs to go through processes such as slicing, grinding, polishing, and cleaning. Currently, during the grinding and polishing processes, a ceramic disc is used as a carrier or base disc for the wafer, that is, the wafer is attached to the surface of the ceramic disc for processing. The ceramic disc has high surface flatness and can provide a reference plane for the grinding and polishing of the wafer.

[0003] In the prior art, when attaching the wafer to the ceramic disc, multiple process steps are required. Currently, manual methods are widely used for wafer and ceramic disc attachment. However, manual waxing has poor quality, with problems such as air bubbles and impurities, which affect the yield of the product and result in high production costs. In addition, manual handling between different processing equipment results in low process efficiency for wafer attachment and polishing, and low wafer production yield.

[0004] Therefore, there is an urgent need to provide an efficient wafer waxing and polishing device. SUMMARY

[0005] The present application provides a wafer waxing and polishing integrated device and a wafer waxing and polishing method. It can solve the problem of the urgent need for an efficient wafer waxing and polishing integrated device in the prior art. The technical solution is as follows:

[0006] In one aspect, a wafer waxing and polishing integrated device is provided, which includes:

[0007] a wafer waxing machine and a polishing machine arranged side by side;

[0008] The wafer waxing machine includes a first housing, a wafer picking and transferring assembly installed in the first housing, a wafer brushing assembly, a wax spinning assembly, a baking assembly, a wafer flipping assembly, a disc carrying assembly, a ceramic disc brushing assembly, a wafer attaching assembly, and a wafer picking assembly. The wafer attaching assembly has a wafer attaching station. The side of the first housing close to the polishing machine has a first conveying port;

[0009] The polishing machine comprises a second housing, at least one polishing device and a wafer transfer assembly installed in the second housing; the second housing is provided with a second conveying port on one side of the wafer waxing machine and is provided with a wafer standby station between the wafer transfer assembly and the second conveying port.

[0010] The wafer transfer assembly is used for sequentially transferring the wafer between the wafer brushing assembly, the waxing assembly, the baking assembly and the wafer flipping assembly; the wafer flipping assembly is used for flipping the baked wafer by a target angle and then transferring the wafer to the wafer waxing position, so that the waxing surface of the wafer is arranged opposite to the wafer waxing surface of the wafer; the wafer waxing assembly is used for combining the wafer and the wafer waxing surface of the wafer.

[0011] The wafer transfer assembly is used for sequentially transferring the wafer between the wafer brushing assembly, the waxing assembly, the baking assembly and the wafer flipping assembly; the wafer flipping assembly is used for flipping the baked wafer by a target angle and then transferring the wafer to the wafer waxing position, so that the waxing surface of the wafer is arranged opposite to the wafer waxing surface of the wafer; the wafer waxing assembly is used for combining the wafer and the wafer waxing surface of the wafer.

[0012] The wafer transfer assembly is used for sequentially transferring the wafer between the wafer brushing assembly, the waxing assembly, the baking assembly and the wafer flipping assembly; the wafer flipping assembly is used for flipping the baked wafer by a target angle and then transferring the wafer to the wafer waxing position, so that the waxing surface of the wafer is arranged opposite to the wafer waxing surface of the wafer; the wafer waxing assembly is used for combining the wafer and the wafer waxing surface of the wafer.

[0013] The wafer transfer assembly is used for sequentially transferring the wafer between the wafer brushing assembly, the waxing assembly, the baking assembly and the wafer flipping assembly; the wafer flipping assembly is used for flipping the baked wafer by a target angle and then transferring the wafer to the wafer waxing position, so that the waxing surface of the wafer is arranged opposite to the wafer waxing surface of the wafer; the wafer waxing assembly is used for combining the wafer and the wafer waxing surface of the wafer.

[0014] The wafer transfer assembly is used for sequentially transferring the wafer between the wafer brushing assembly, the waxing assembly, the baking assembly and the wafer flipping assembly; the wafer flipping assembly is used for flipping the baked wafer by a target angle and then transferring the wafer to the wafer waxing position, so that the waxing surface of the wafer is arranged opposite to the wafer waxing surface of the wafer; the wafer waxing assembly is used for combining the wafer and the wafer waxing surface of the wafer.

[0015] The wafer transfer assembly is used for sequentially transferring the wafer between the wafer brushing assembly, the waxing assembly, the baking assembly and the wafer flipping assembly; the wafer flipping assembly is used for flipping the baked wafer by a target angle and then transferring the wafer to the wafer waxing position, so that the waxing surface of the wafer is arranged opposite to the wafer waxing surface of the wafer; the wafer waxing assembly is used for combining the wafer and the wafer waxing surface of the wafer.

[0016] Optionally, the wafer waxing machine further includes: a wafer washing and spin-drying assembly and a wafer lifting assembly installed inside the first housing. The wafer washing and spin-drying assembly is stacked on top of the transfer line formed by the ceramic disc washing assembly, the wafer mounting assembly, the wafer flipping assembly, and the baking assembly. The wafer lifting assembly is used to transfer the wafers separated by the wafer unloading assembly to the wafer waiting station. The wafer washing and spin-drying assembly is used to wash and spin-dry the wafers at the wafer waiting station.

[0017] Optionally, the wafer waxing machine further includes a wafer lifting and gripping assembly that cooperates with the wafer brushing and drying assembly. The wafer lifting and gripping assembly is used to transfer the brushed and dried wafers to the wafer transfer assembly, and the wafer transfer assembly is used to transfer the wafers to the unloading station.

[0018] Optionally, the film transfer assembly includes: a first translation mechanism, a first lifting mechanism, a first rotary drive, a translation drive, and a film clamping mechanism arranged sequentially along the bottom away from the first cover. The first translation mechanism is installed at the bottom of the first cover and extends along the second direction. The first lifting mechanism is installed on the first translation mechanism and extends along a third direction. The first rotary drive is installed on the first lifting mechanism, and the rotation axis of the first rotary drive is fastened to the translation drive. The film clamping mechanism is installed on the translation drive. The third direction is perpendicular to both the first and second directions.

[0019] The translation drive is configured to drive the clamping mechanism to grip the wafer for transfer; the first rotation drive is configured to drive the translation drive and the clamping mechanism to rotate synchronously.

[0020] Optionally, the pallet assembly includes: a second translation mechanism, a second lifting mechanism, a second rotary drive, a first translation drive, and a clamping mechanism extending along a second direction. The second lifting mechanism is mounted on the second translation mechanism and extends along a third direction. The second rotary drive is mounted on the second lifting mechanism, and the rotation axis of the second rotary drive is fastened to the first translation drive. The clamping mechanism is mounted on the first translation drive. The third direction is perpendicular to both the first and second directions.

[0021] The first translation drive is configured to drive the clamping mechanism to pick up the ceramic disc for transfer; the second rotation drive is configured to drive the first translation drive and the clamping mechanism to rotate synchronously.

[0022] Optionally, at least one polishing device may be arranged along a first direction when it includes multiple polishing devices; the ceramic disc transfer assembly includes: a third translation mechanism extending along the first direction, a rotating platform, a lifting platform, and a ceramic disc transporter; the rotating platform is mounted on the third translation mechanism, and the lifting platform is mounted on the rotating platform; the ceramic disc transporter is used to clamp the ceramic disc at the ceramic disc waiting station, rotate it by a target angle, and then make the wafer on the ceramic disc face the polishing surface of the polishing device.

[0023] Optionally, the at least one polishing device includes at least one polishing device body and at least one brushing device, with each polishing device body corresponding to one and each brushing device. The brushing device is used to brush the wafer polished by the corresponding polishing device body.

[0024] On the other hand, a method for applying wax to and polishing wafers is provided, wherein the method is applied to any of the aforementioned integrated wafer wax application and polishing equipment, and the method includes:

[0025] The wafer transfer assembly transfers the wafer to the wafer brushing assembly for brushing, then transfers the brushed wafer to the wax splatter assembly for wax application, and finally transfers the wax-applied wafer to the baking assembly for baking.

[0026] The wafer flipping assembly flips the baked wafer to the target angle and then transfers it to the placement station;

[0027] The pallet transfer unit transfers the ceramic disk to the ceramic disk cleaning unit for cleaning, and then transfers the cleaned ceramic disk to the chip mounting station so that the wax-coated side of the chip is facing each other.

[0028] The surface mount assembly attaches the chip to the ceramic disk;

[0029] The pallet-transfer assembly transfers the fitted ceramic discs to the ceramic disc waiting station through two conveyor ports;

[0030] The ceramic disk transfer assembly simultaneously transports the ceramic disk and the wafer to the polishing device for wafer polishing, and then transports the polished wafer and ceramic disk to the wafer unloading assembly.

[0031] Optionally, before the wafer uncoupling assembly separates the wafer, the wafer waxing and polishing method further includes: measuring the thickness of the polished wafer to determine whether it is within a threshold range;

[0032] When the thickness of the wafer is within the threshold range, the wafer is transferred to the wafer uncoupling assembly for separation of the ceramic disk and the wafer; when the thickness of the wafer is not within the threshold range, the wafer is polished again using a polishing machine.

[0033] The beneficial effects of the technical solutions provided in this application include at least the following:

[0034] By placing the wafer waxing machine and the polishing machine side by side, with the first housing in the wafer waxing machine and the second housing in the polishing machine having a first conveying port and a second conveying port respectively, the wafer transfer assembly can pick up the wafers at the loading station and process them sequentially between the wafer brushing assembly, the wax-spinning assembly, and the baking assembly. The tray transfer assembly can move the ceramic trays between the ceramic tray brushing assembly and the wafer mounting assembly, ultimately achieving wafer mounting at the wafer mounting assembly. The ceramic tray transfer assembly in the polishing machine transfers the mounted ceramic trays from the tray waiting station to each polishing device for further polishing, and finally separates the polished wafers at the wafer unloading assembly. In other words, by integrating the wafer waxing machine and the polishing machine, the cleaning, waxing, mounting, polishing, and unloading of wafers and ceramic trays are automated. This eliminates the need for manual handling of wafers and ceramic trays in individual processing units, followed by manual transfer of the mounted ceramic trays to the polishing machine for polishing, a process previously required in related technologies. In this way, while effectively improving the efficiency of the wafer polishing process, the instability of personnel handling wafers is reduced, which greatly reduces a series of risks caused by possible employee misoperation and improves the cleaning efficiency and cleaning process capability of wafers and ceramic disks, thus ensuring the yield of integrated chip products. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a top view of a wafer waxing and polishing integrated device provided in an embodiment of this application;

[0037] Figure 2 This is a schematic diagram of the integrated wafer waxing and polishing device provided in the embodiments of this application;

[0038] Figure 3 This is a schematic diagram of the structure of a wafer waxing machine provided in an embodiment of this application;

[0039] Figure 4 This is a schematic diagram of another wafer waxing machine provided in an embodiment of this application;

[0040] Figure 5 This is a schematic diagram of the structure of a wafer brushing and spin-drying assembly provided in an embodiment of this application;

[0041] Figure 6 This is a schematic diagram of the structure of a wafer transfer assembly provided in an embodiment of this application;

[0042] Figure 7 This is a schematic diagram of the structure of a tray-moving assembly provided in an embodiment of this application;

[0043] Figure 8 This is a schematic diagram of the structure of a ceramic disc transfer assembly provided in an embodiment of this application;

[0044] Figure 9 This is a schematic diagram of the structure of a polishing device provided in an embodiment of this application;

[0045] Figure 10 This is a schematic diagram of the structure of a ceramic plate cleaning assembly provided in an embodiment of this application;

[0046] Figure 11 This is a schematic diagram of the structure of a ceramic plate washing assembly from another perspective provided in an embodiment of this application;

[0047] Figure 12 This is a front view of a ceramic plate cleaning assembly provided in an embodiment of this application;

[0048] Figure 13 This is a schematic diagram of another ceramic plate washing assembly provided in an embodiment of this application;

[0049] Figure 14 This is a schematic diagram of the structure of another ceramic plate cleaning component provided in the embodiments of this application;

[0050] Figure 15 This is a schematic diagram of another ceramic plate cleaning component provided in an embodiment of this application.

[0051] The components include: a wafer waxing machine 100, a polishing machine 200, a wafer pick-and-transfer assembly 110, a wafer brushing assembly 120, a wax-spinning assembly 130, a baking assembly 140, a wafer flipping assembly 150, a tray transfer assembly 160, a ceramic tray brushing assembly 170, a wafer placement assembly 180, a wafer unloading assembly 190, a wafer placement station W1, a wafer A1, a ceramic tray A2, a polishing device 210, a ceramic tray transfer assembly 220, a ceramic tray waiting station W2, a wafer cassette 101, a ceramic tray hopper 102, and a preheating tray. B. Wafer thickness measuring device 300, wafer brushing and spin-drying assembly 103, wafer lifting assembly 104, wafer waiting station W3, cleaning tank 1031, spin-drying chamber 1032, wafer lifting arm 1033, wafer lifting and gripping assembly 105, unloading station W4, wafer placement box 106, polishing device body 211, wafer telescopic gripper 1051, first translation mechanism 111, first lifting mechanism 112, first rotation drive 113, translation drive 114, clamping The components include: plate mechanism 115, second translation mechanism 161, second lifting mechanism 162, second rotary drive component 163, first translation drive component 164, clamping mechanism 165, third translation mechanism 221, rotating platform 222, lifting platform 223, porcelain plate transport component 224, polishing device body 211, brush washing device 212, rotating polishing pad 2111, polishing support component 2112, clamping assembly 171, drive component 172, brush assembly 173, driven wheel 1711, and drive wheel. 1721, Porcelain disc A, Annular limiting groove 101a, Telescopic drive component 1712, Support component 1713, Two driven wheels 1711, Support column 103a, U-shaped mounting plate 103b, Telescopic drive component body 102a, Slider 102b, Base plate 174, Strip guide rail 175, Photoelectric limit switch 176, Photoelectric sensor 177, Moving limit block 102c, Brush assembly body 1731, Drive mechanism 1732, Brush head T, Protective shell 178.

[0052] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0054] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0055] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0056] Please refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a top view of a wafer waxing and polishing integrated device provided in an embodiment of this application. Figure 2 This is a schematic diagram of the integrated wafer waxing and polishing equipment provided in the embodiments of this application. Figure 3 This is a schematic diagram of a wafer waxing machine provided in an embodiment of this application. The integrated wafer waxing and polishing equipment may include a wafer waxing machine 100 and a polishing machine 200 arranged side by side.

[0057] The wafer wax-coating machine 100 may include: a first housing (not shown in the figure), a wafer transfer assembly 110 installed within the first housing, a wafer brushing assembly 120, a wax-spinning assembly 130, a baking assembly 140, a wafer flipping assembly 150, a tray transfer assembly 160, a ceramic tray brushing assembly 170, a wafer placement assembly 180, and a wafer unloading assembly 190, wherein the wafer placement assembly 180 has a wafer placement station W1. The first housing has a first feed port on the side near the polishing machine 200. For example, the wafer unloading assembly 190 may refer to structures in related art to achieve separation of wafer A1 and ceramic tray A2.

[0058] The polishing machine 200 may include: a second housing (not shown in the figure), at least one polishing device 210 and a ceramic disk transfer assembly 220 installed in the second housing. The side of the second housing near the wafer waxing machine 100 may have a second conveying port and a ceramic disk waiting station W2 located between the ceramic disk transfer assembly 220 and the second conveying port.

[0059] The wafer pick-and-transfer assembly 110 is used to sequentially transfer wafers between the wafer brushing assembly 120, the wax splatter assembly 130, the baking assembly 140, and the wafer flipping assembly 150; the tray transfer assembly 160 is used to sequentially transfer a single ceramic tray between the ceramic tray brushing assembly 170 and the placement station W1; the wafer flipping assembly 150 is used to flip the baked wafer to a target angle and then transfer the wafer to the placement station W1 so that the wax-coated surface of the wafer is opposite to the placement surface of the ceramic tray; the placement assembly 180 is used to bond the oppositely positioned wafer and ceramic tray. For example, there can be one or more wafer pick-and-transfer assemblies 110. The figure shows two oppositely positioned wafer pick-and-transfer assemblies 110, which can operate simultaneously to transfer wafers.

[0060] Here, the tray transfer assembly 160 is also used to transfer the bonded ceramic tray to the ceramic tray waiting station W2 through the first and second conveying ports. The ceramic tray transfer assembly is used to transfer the ceramic tray at the ceramic tray waiting station W2 to the polishing device 210 for wafer polishing, and to transfer the polished wafer to the wafer unloading assembly 190 through the second and first conveying ports. The wafer unloading assembly 190 is used to separate the polished wafer from the ceramic tray.

[0061] In this embodiment, the wafer waxing machine 100 and the polishing machine 200 are arranged side by side, with the first housing in the wafer waxing machine 100 and the second housing in the polishing machine 200 having a first conveying port and a second conveying port, respectively. Thus, the wafer pick-up and transfer assembly 110 can pick up the wafer at the loading station and process it sequentially between the wafer brushing assembly 120, the wax-spinning assembly 130, and the baking assembly 140; the pallet transfer assembly 160 can move the ceramic pallet between the ceramic pallet brushing assembly 170 and the wafer placement assembly 180, ultimately achieving wafer placement at the wafer placement assembly 180. The ceramic pallet transfer assembly in the polishing machine 200 transfers the wafer-placed ceramic pallet at the ceramic pallet waiting station W2 to each polishing device 210 for further polishing, and finally, the polished wafer is separated at the wafer unloading assembly 190. In other words, by integrating the wafer waxing machine 100 and the polishing machine 200, the automated cleaning, waxing, mounting, polishing, and unloading of wafers and ceramic disks can be achieved. This eliminates the need for manual handling of wafers and ceramic disks in individual processing units, followed by manual transfer of the mounted disks to the polishing machine 200 for polishing. This effectively improves the efficiency of the wafer polishing process while reducing the instability of manual wafer handling, significantly reducing the risks caused by potential employee errors, and improving the cleaning efficiency and process capability of wafers and ceramic disks, thus ensuring the yield of integrated wafer products.

[0062] In summary, this application provides an integrated wafer waxing and polishing device, which may include a wafer waxing machine and a polishing machine arranged side by side. By arranging the wafer waxing machine and the polishing machine side by side, and with the first housing in the wafer waxing machine and the second housing in the polishing machine respectively having a first conveying port and a second conveying port, the wafers can be picked up from the loading station by the wafer picking and transfer assembly and then sequentially processed between the wafer brushing assembly, the wax-spinning assembly, and the baking assembly. The ceramic tray can be moved between the ceramic tray brushing assembly and the wafer placement assembly by the tray transfer assembly, ultimately achieving wafer placement at the wafer placement assembly. The ceramic tray transfer assembly in the polishing machine transfers the wafer-placed ceramic tray from the waiting ceramic tray station to each polishing device for further polishing, and finally, the polished wafers are separated at the wafer unloading assembly. In other words, by integrating the wafer waxing machine and the polishing machine, the cleaning, waxing, mounting, polishing, and unloading of wafers and ceramic disks are automated. This eliminates the need for manual handling of wafers and ceramic disks in individual processing units, followed by manual transfer of the mounted disks to the polishing machine. This significantly improves the efficiency of the wafer polishing process, reduces the instability of manual wafer handling, greatly minimizes risks caused by employee errors, and enhances the cleaning efficiency and process capability of wafers and ceramic disks, ensuring a high yield of integrated wafer products.

[0063] For example, such as Figure 3 As shown, the wafer waxing machine 100 is provided with a feeding station, at which a wafer cassette 101 is provided. The wafer cassette 101 stores wafers to be mounted. The wafer pick-up and transfer assembly 110 takes the wafers out of the wafer cassette 101 and transfers them to the edge finding and centering device. The edge finding and centering device adjusts the straight edge position and center position of the wafer. After the edge finding and centering is completed, the wafer pick-up and transfer assembly 110 transfers the wafers to the wafer brushing assembly 120 for brushing.

[0064] like Figure 3 As shown, the wafer wax bonding machine 100 also includes an upper plate station with a ceramic tray hopper 102. The ceramic tray hopper 102 stores ceramic trays to be bonded. The tray transfer assembly 160 removes the ceramic trays from the ceramic tray hopper 102 and transfers them to the ceramic tray cleaning assembly 170 for cleaning. For example, the ceramic tray hopper 102 can be positioned opposite the wafer unloading assembly 190. The tray transfer assembly 160 can transport the ceramic trays separated from the wafer unloading assembly 190 to the ceramic tray hopper 102 for reuse, reducing equipment operating costs. It should be noted that the number of uses for each ceramic tray can be set, and the tray can be replaced after accumulating the set number of uses.

[0065] In this embodiment of the application, the wafer waxing machine 100 may further include a preheating plate B disposed below the placement station W1 of the placement assembly 180, the preheating plate B being capable of preheating the ceramic disk located at the placement station W1 before placement.

[0066] Optionally, the wafer transfer assembly 110 can sequentially transfer wafers between the wafer brushing assembly 120, the wax spun assembly 130, the baking assembly 140, and the wafer flipping assembly 150, and the tray transfer assembly 160 can be synchronized with the process of sequentially transferring individual ceramic trays between the ceramic tray brushing assembly 170 and the placement station W1. In this case, by setting the wafer transfer assembly 110 and the tray transfer assembly 160 to simultaneously process wafers and ceramic trays between their respective transfer lines, the cleaning efficiency and cleaning process capability of the wafers and ceramic trays, as well as the polishing efficiency of the subsequent polishing machine 200, can be further improved.

[0067] It should be noted that the structures of the wafer brushing assembly 120, the wax slinging assembly 130, the baking assembly 140, and the wafer flipping assembly 150 will not be described in detail here. It can be understood that the mechanisms that can perform relevant processing on the wafer can be integrated into this wafer waxing and polishing integrated equipment.

[0068] In the embodiments of this application, such as Figure 1 As shown, the integrated wafer waxing and polishing equipment also includes a wafer thickness measuring device 300 disposed within the second housing and close to the wafer unloading assembly 190. The wafer thickness measuring device 300 is used to measure whether the thickness of wafer A1 is within a threshold range. In this case, by setting the wafer thickness measuring device 300 within the second housing and close to the wafer unloading assembly 190, the wafer thickness is measured and monitored before waxing. If the wafer thickness exceeds the threshold range, the defective wafer will not be waxed and will be directly sent back to the polishing device 210 for repolishing. If the wafer thickness is within the threshold range, the wafer will be transferred to the wafer unloading assembly 190. This effectively reduces the complexity of rework and eliminates the need for re-waxing and polishing.

[0069] Optional, such as Figure 1As shown, the first housing in the wafer waxing machine 100 and the second housing in the polishing machine 200 are arranged along a first direction; the wafer brushing assembly 120 and the wax-spinning assembly 130 are arranged along a second direction perpendicular to the first direction; the ceramic disc brushing assembly 170, the wafer placement assembly 180, the wafer flipping assembly 150, and the baking assembly 140 are arranged along the second direction f2. The wafer transfer assembly 110 is distributed between the flow line formed by the wafer brushing assembly 120 and the wax-spinning assembly 130 and the flow line formed by the ceramic disc brushing assembly 170, the wafer placement assembly 180, the wafer flipping assembly 150, and the baking assembly 140; the pallet transfer assembly 160 is distributed between the flow line formed by the wafer placement assembly 180, the wafer flipping assembly 150, and the baking assembly 140 and the ceramic disc waiting station W2. Here, the wafer brushing assembly 120 and the wax-spinning assembly 130 can be arranged along the second direction with the wafer cassette 101. The wafer brushing assembly 120 can be located between the wax-spinning assembly 130 and the wafer cassette 101, or the wax-spinning assembly 130 can be located between the wafer brushing assembly 120 and the wafer cassette 101.

[0070] In this configuration, the first housing in the wafer waxing machine 100 and the second housing in the polishing machine 200 are arranged along a first direction f1. The wafer brushing assembly 120, the wax-spinning assembly 130, the ceramic disc brushing assembly 170, the wafer placement assembly 180, the wafer flipping assembly 150, and the baking assembly 140 within the first housing can all be arranged along a second direction f2, perpendicular to the first direction f1. This arrangement of multiple processing components effectively reduces the overall size of the integrated wafer waxing and polishing machine, thus reducing its footprint. Furthermore, distributing the wafer transfer assembly 110 between the flow line formed by the wafer brushing assembly 120 and the wax-spinning assembly 130, and the flow line formed by the ceramic disc brushing assembly 170, the wafer placement assembly 180, the wafer flipping assembly 150, and the baking assembly 140 shortens the wafer transfer stroke of the wafer transfer assembly 110, saving wafer processing time and improving process efficiency. The pallet transfer assembly 160 is distributed between the transfer line formed by the chip mounting assembly 180, the wafer flipping assembly 150 and the baking assembly 140 and the ceramic pallet waiting station W2. This shortens the travel distance of the pallet transfer assembly 160 to transfer the ceramic pallet, saves the time of transferring the ceramic pallet to the ceramic pallet waiting station W2, and helps to improve the polishing efficiency of the wafer.

[0071] Please refer to the following in this application: Figure 3 , Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of another wafer wax application machine provided in an embodiment of this application. Figure 5This is a schematic diagram of a wafer washing and spin-drying assembly provided in an embodiment of this application. The wafer waxing machine 100 may further include: a wafer washing and spin-drying assembly 103 and a wafer lifting assembly 104 installed within a first housing in the wafer waxing machine 100. The wafer washing and spin-drying assembly 103 is stacked on top of the transfer line formed by the ceramic disc washing assembly 170, the wafer mounting assembly 180, the wafer flipping assembly 150, and the baking assembly 140. The wafer lifting assembly 104 is arranged adjacent to the wafer unloading assembly 190 and can be used to transfer the wafers separated by the wafer unloading assembly 190 to the wafer waiting station W3. The wafer washing and spin-drying assembly 103 is used to wash and spin-dry the wafers at the wafer waiting station W3. In this configuration, by installing a wafer washing and spin-drying assembly 103 within the first housing, the wafer washing and spin-drying assembly 103, along with the ceramic disc washing assembly 170, the placement assembly 180, the wafer flipping assembly 150, and the baking assembly 140, forms a stacked flow line, reducing the machine's footprint. Furthermore, the wafer lifting assembly 104 lifts the wafers separated from the wafer unloading assembly 190 to the wafer waiting station W3. The wafer washing and spin-drying assembly 103 then extracts, cleans, and spin-dries the wafers at the waiting station W3, ensuring surface cleanliness and improving the yield of integrated wafer products. It should be noted that the structures of the wafer lifting assembly 104 and the wafer unloading assembly 190 can be found in the relevant document CN 223066139 U, and will not be elaborated upon here.

[0072] For example, the wafer washing and spin-drying assembly 103 may include: multiple washing tanks 1031 arranged side by side, a spin-drying chamber 1032 and a wafer lifting arm 1033. The wafer lifting arm 1033 can sequentially transfer the wafers at the wafer waiting station W3 to the washing tanks 1031 for washing, and then transfer the washed wafers to the spin-drying chamber 1032 for spin-drying.

[0073] Optional, such as Figure 1 and Figure 5 As shown, the wafer waxing machine 100 may further include a wafer lifting and gripping assembly 105 that cooperates with the wafer washing and drying assembly 103. This assembly 105 is used to transfer the washed and dried wafers to the wafer transfer assembly 110, which then grips the wafers and transfers them along a third direction f3 to the unloading station W4. In this case, by providing the wafer lifting and gripping assembly 105, it is convenient to transfer the wafers on the upper layer to the unloading station W4 on the lower layer. It should be noted that in other possible implementations, the unloading station W4 may also be located on the same layer as the wafer washing and drying assembly 103.

[0074] For example, the wafer lifting and gripping assembly 105 may include: a lifting guide rail (not shown in the figure) arranged along a third direction f3, and a wafer telescopic gripper 1051 slidably mounted on the lifting guide rail. The wafer telescopic gripper 1051 is capable of gripping the spun-dry wafer. The lifting guide rail is used to transfer the wafer telescopic gripper 1051 holding the wafer to a lower position so that the wafer transfer assembly 110 can grip the wafer.

[0075] Here, as Figure 3 As shown, the wafer waxing machine 100 may include a wafer placement box 106 located at the unloading station W4 for storing polished wafers.

[0076] In the embodiments of this application, please refer to Figure 6 , Figure 6 This is a schematic diagram of a wafer transfer assembly provided in an embodiment of this application. The wafer transfer assembly 110 in the wafer wax attaching machine 100 may include: a first translation mechanism 111, a first lifting mechanism 112, a first rotary drive 113, a translation drive 114, and a wafer clamping mechanism 115 arranged sequentially along the bottom away from the first housing. The first translation mechanism 111 can be installed on the bottom of the first housing and extends along the second direction f2. The first lifting mechanism 112 can be installed on the first translation mechanism 111 and extends along the third direction f3. The first rotary drive 113 is installed on the first lifting mechanism 112, and the rotation axis of the first rotary drive 113 is fastened to the translation drive 114. The wafer clamping mechanism 115 is installed on the driving end of the translation drive 114. The third direction f3 can be perpendicular to both the first direction f1 and the second direction f2. The translation drive 114 is configured to drive the wafer clamping mechanism 115 to clamp the wafer A1 for transfer. The first rotary drive 113 is configured to drive the translation drive 114 and the clamping mechanism 115 to rotate synchronously.

[0077] For example, the first translation mechanism 111 can drive the first lifting mechanism 112, the first rotary drive 113, the translation drive, and the clamping mechanism to move simultaneously along the second direction to coordinate with the arrangement of the wafer brushing assembly 120, the wax slinging assembly 130, the baking assembly 140, and the wafer flipping assembly 150. The first lifting mechanism 112 can drive the first rotary drive 113, the translation drive 114, and the clamping mechanism 115 to move simultaneously along the third direction f3 to enable the clamping mechanism to transfer wafers at different heights. The first rotary drive 113 drives the translation drive 114 and the clamping mechanism 115 to rotate simultaneously, so that the clamping mechanism 115 can grasp the wafer and transport it to different processing stations. The translation drive 114 can drive the clamping mechanism 115 to move, so that the clamping mechanism 115 can smoothly clamp the wafer. Here, the first translation mechanism 111 may include a transmission connection between a drive motor and a drive screw, the first lifting mechanism 112 may include a lifting cylinder, the first rotary drive component 113 may include a rotary motor, and the translation drive component 114 may include a telescopic electric cylinder. It should be noted that this application embodiment does not specifically limit the transmission method of the above mechanisms.

[0078] Here, the translation drive 114 can drive the wafer clamping mechanism 115 to clamp the wafer and transfer it between the wafer brushing assembly 120, the wax spit assembly 130, the baking assembly 140 and the wafer flipping assembly 150.

[0079] Please refer to the following in this application: Figure 7 , Figure 7 This is a schematic diagram of a pallet-transfer assembly provided in an embodiment of this application. The pallet-transfer assembly 160 includes: a second translation mechanism 161 extending along a second direction f2, a second lifting mechanism 162, a second rotary drive 163, a first translation drive 164, and a pallet-clamping mechanism 165. The second lifting mechanism 162 is mounted on the second translation mechanism 161 and extends along a third direction f3. The second rotary drive 163 is mounted on the second lifting mechanism 162, and the rotation axis of the second rotary drive 163 is fastened to the first translation drive 164. The pallet-clamping mechanism 165 is mounted on the drive end of the first translation drive 164. The third direction f3 is perpendicular to both the first direction f1 and the second direction f2. The first translation drive 164 is configured to drive the pallet-clamping mechanism 165 to clamp and transfer a ceramic plate; the second rotary drive 163 is configured to drive the first translation drive 164 and the pallet-clamping mechanism 165 to rotate synchronously.

[0080] For example, the second translation mechanism 161 can drive the second lifting mechanism 162, the second rotary drive 163, the first translation drive 164, and the clamping mechanism 165 to move simultaneously along the second direction f2, to coordinate with the arrangement of the ceramic plate washing assembly 170, the patch assembly 180, and the ceramic plate waiting station W2. The second lifting mechanism 162 can drive the second rotary drive 163, the first translation drive 164, and the clamping mechanism 165 to move simultaneously along the third direction f3, so that the clamping mechanism 165 can transfer ceramic plates at different heights. The second rotary drive 163 drives the first translation drive 164 and the clamping mechanism 165 to rotate simultaneously, so that the clamping mechanism 165 can grab ceramic plates and transport them to different processing stations. The first translation drive 164 can drive the clamping mechanism 165 to move, so that the clamping mechanism 165 can smoothly clamp the ceramic plates. Here, the second translation mechanism 161 may include a transmission connection between a drive motor and a drive screw, the second lifting mechanism 162 may include a lifting cylinder, the second rotary drive component 163 may include a rotary motor, and the first translation drive component 164 may include a telescopic electric cylinder. It should be noted that this application embodiment does not specifically limit the transmission method of the above mechanisms; the clamping mechanism and the clamping plate mechanism may be grippers or suction cups, etc.

[0081] Optional, please refer to Figure 8 , Figure 8 This is a schematic diagram of a ceramic disc transfer assembly provided in an embodiment of this application. When at least one polishing device 210 includes multiple polishing devices, they can be arranged along a first direction f1. The ceramic disc transfer assembly 220 includes: a third translation mechanism 221 extending along the first direction f1, a rotating platform 222, a lifting platform 223, and a ceramic disc transporter 224. The rotating platform 222 is mounted on the third translation mechanism 221, and the lifting platform 223 is mounted on the rotating platform 222. The ceramic disc transporter 224 is used to clamp the ceramic disc at the ceramic disc waiting station W2 and rotate it by a target angle so that the wafers on the ceramic disc face the polishing surface of the polishing device 210. This facilitates the polishing device 210 to perform pre- and post-polishing processing on the ceramic disc. Here, the third translation mechanism 221 may include a drive motor and a drive screw transmission mechanism; the lifting platform 223 may include a lifting cylinder; the rotating platform 222 may include a rotary motor; and the ceramic disc transporter 224 may include a pneumatic gripper and a rotary drive component connected to each other. The rotary drive component can drive the pneumatic gripper to rotate by a target angle. It should be noted that the embodiments of this application do not specifically limit the transmission method of the above-mentioned mechanism. Here, multiple polishing devices can respectively complete at least two of the rough polishing, medium polishing and fine polishing of the wafer. Alternatively, a single polishing device 210 can complete a one-time polishing process on the wafer.

[0082] Please refer to the following in this application: Figure 9 , Figure 9This is a schematic diagram of a polishing apparatus provided in an embodiment of this application. At least one polishing apparatus 210 includes: at least one polishing apparatus body 211 and at least one brushing device 212. Each polishing apparatus body 211 corresponds one-to-one with each brushing device 212. Each brushing device is used to brush the wafer polished by the corresponding polishing apparatus body 211. Here, each polishing apparatus body 211 may use different polishing agents when polishing the wafer. Therefore, for each polishing apparatus body 211, the corresponding brushing device 212 is used to clean the polished wafer before it is transferred to the next polishing apparatus body 211 for further polishing. This ensures the cleanliness and humidity of the wafer surface and avoids scratching of the next polishing process by residual particles on the wafer surface.

[0083] For example, the polishing apparatus body 211 may include a rotating polishing pad 2111 and a polishing support 2112 disposed opposite to each other. The end of the polishing support 2112 near the rotating polishing pad 2111 can adsorb and fix a ceramic disk to which a wafer is attached, so that the polishing surface of the wafer faces the polishing pad 2111. The polishing support 2112 can move the wafer up and down towards or away from the polishing pad 2111, and the polishing support 2112 can rotate the wafer to cooperate with the rotating polishing pad in polishing the wafer. For example, each polishing apparatus body 211 may include one or more polishing supports 2112. Figure 9 Two polishing device bodies 211 are shown in the figure.

[0084] It should be noted that the control component in the integrated wafer wax coating and polishing equipment can be electrically connected to other components separately. For example, the control component can be connected to mechanisms such as the wafer pick-and-place assembly, wafer flipping assembly, tray transfer assembly, and ceramic tray transfer assembly in the integrated wafer wax coating and polishing equipment to control these mechanisms to perform corresponding actions. In addition, the control component is also connected to the individual wafer and ceramic tray processing mechanisms to control these processing mechanisms to perform different process treatments on the wafers and ceramic trays.

[0085] Please refer to Figure 10 and Figure 11 , Figure 10 This is a schematic diagram of the structure of a ceramic plate cleaning assembly provided in an embodiment of this application. Figure 11 This is a schematic diagram of the structure of a porcelain plate cleaning assembly from another perspective provided in an embodiment of this application. The porcelain plate cleaning assembly 170 may include: two sets of clamping assemblies 171, a driving member 172, and a brush assembly 173 arranged opposite to each other along a first direction.

[0086] The two sets of clamping assemblies 171 are capable of moving towards or away from each other along the first target direction f4. Each set of clamping assemblies 171 may have two driven wheels 1711 arranged opposite each other along the second target direction f5. The four driven wheels 1711 in the two sets of clamping assemblies 171 can be used to form a clamping space for clamping the ceramic disc A. Here, the first target direction f4 and the second target direction f5 are perpendicular to each other.

[0087] The drive component 172 in the ceramic plate cleaning assembly is mounted on one of the clamping components 171. The drive shaft of the drive component 172 has a drive wheel 1721 mounted between two driven wheels 1711 distributed within this clamping component 171. The drive wheel 1721 is arranged side-by-side with the ceramic plate A, and its axis is parallel to the axis of the ceramic plate A. After the driven wheels 1711 in the two clamping components 171 clamp the ceramic plate A, the circumferential side of the drive wheel 1721 contacts the circumferential side of the ceramic plate A. The drive component 172 is configured to drive the ceramic plate A and the driven wheels 1711 to rotate synchronously during the rotation of the drive wheel 1721. Here, the four driven wheels 1711 and the drive wheel 1721 are externally tangent to the ceramic plate A, and the four driven wheels 1711 clamp the ceramic plate A while rotating synchronously with it.

[0088] The brush assembly 173 in the porcelain plate washing assembly is arranged adjacent to the porcelain plate A, and can wash at least one of the top and bottom surfaces of the rotating porcelain plate A that are arranged opposite to each other.

[0089] In this embodiment, two opposing clamping components 171 are provided in the ceramic disk washing assembly. These two sets of clamping components 171 can move towards or away from each other to change the size of the clamping space, accommodating ceramic disks A of different sizes. Furthermore, after the four driven wheels 1711 in the two sets of clamping components 171 clamp the ceramic disk A, the side of the drive wheel 1721 in the drive member 172 can contact the side of the ceramic disk A. Thus, during the rotation of the ceramic disk A by the drive wheel 1721 in the drive member 172, the brush assembly 173 can brush at least one of the bottom and top surfaces of the ceramic disk A. In other words, this ceramic disk washing assembly integrates the functions of ceramic disk fixing and washing operations in the manual washing process, effectively saving manpower and washing costs, improving the efficiency and effect of ceramic disk washing, and minimizing damage to the ceramic disk, ensuring a high yield for subsequent ceramic disk and wafer mounting operations.

[0090] Optional, please refer to Figure 12 , Figure 12This is a front view of a ceramic disc cleaning assembly provided in an embodiment of this application. Each driven wheel 1711 in the clamping assembly 171 has an annular limiting groove 101a on its circumferential side. After the ceramic disc A is positioned in the clamping space, the edge portion of the ceramic disc A is located within the annular limiting groove 101a in the multiple driven wheels 1711. In this way, the edge of the ceramic disc A, through its engagement with the annular limiting groove 101a on the driven wheel 1711, can limit the degrees of freedom of the ceramic disc A in multiple directions, allowing the ceramic disc A to rotate stably within the clamping space under the drive of the drive wheel 1721, thereby ensuring the cleaning quality of the ceramic disc A by the brush assembly 173.

[0091] In the embodiments of this application, such as Figure 12 As shown, each clamping assembly 171 may include: a telescopic drive member 1712, a support member 1713, and two driven wheels 1711. The support member 1713 is mounted on the drive end of the telescopic drive member 1712, and the two driven wheels 1711 are rotatably mounted on the support member 1713. In this way, the driven wheels 1711 can be mounted on the support member 1713. After the drive end of the telescopic drive member 1712 is mounted on the support member 1713, the two driven wheels 1711 can be moved along the first target direction f4 by driving the support member 1713 to move along the first target direction f4.

[0092] Optional, please refer to Figure 10 , Figure 11 , Figure 12 and Figure 13 , Figure 13 This is a schematic diagram of another ceramic plate cleaning assembly provided in this application embodiment. The support member 1713 in the clamping assembly 171 may include a support column 103a and a U-shaped mounting plate 103b. The support column 103a extends along the third target direction f6, with one end connected to the driving end of the telescopic drive member 1712, and the other end connected to the U-shaped mounting plate 103b. Two driven wheels 1711 are respectively mounted at the two ends of the U-shaped mounting plate 103b, and the drive member 172 is mounted on the U-shaped mounting plate 103b. Here, the third target direction f6 is perpendicular to both the first target direction f4 and the second target direction f5. In this case, by using two driven wheels 1711 installed at both ends of the U-shaped mounting plate 103b, the installation accuracy of the two driven wheels 1711 can be guaranteed to be high, thereby ensuring that the four driven wheels 1711 in the two sets of clamping assemblies 171 clamp the ceramic disk A with high clamping accuracy, so that the ceramic disk A can rotate stably under the drive of the drive wheel 1721 and is not easily damaged.

[0093] Please refer to the following in this application: Figure 12 and Figure 14 , Figure 14This is a schematic diagram of another ceramic plate cleaning assembly provided in this application embodiment. The telescopic drive member 1712 in the clamping assembly 171 may include: a telescopic drive member body 102a and a slider 102b fastened together, and a support member 1713 fastened to the slider 102b. The telescopic drive member body 102a can drive the slider 102b to reciprocate along a first target direction f4. For example, the telescopic drive member body 102a may be a cylinder, a telescopic motor, or other mechanism; this application embodiment does not specifically limit this.

[0094] Here, the support column 103a in the support member 1713 can be securely mounted on the slider 102b.

[0095] Optional, such as Figure 14 As shown, the ceramic plate cleaning assembly may further include: a base plate 174 and a strip guide rail 175. A telescopic drive component 1712 can be mounted on the back of the base plate 174, and the strip guide rail 175 can be fixed to the back of the base plate 174 and extend along the first target direction f4. A slider 102b can be fitted onto the strip guide rail 175 and slidably connected to it. Thus, by setting the base plate 174, multiple components in the ceramic plate cleaning assembly 170 can be supported and fixed. The cooperation between the strip guide rail 175 on the base plate 174 and the slider 102b enables the stable operation of the slider 102b, thereby ensuring high movement accuracy of the clamping assembly 171 along the first target direction f4.

[0096] For example, such as Figure 14 As shown, the ceramic plate cleaning assembly may further include: a photoelectric limit switch 176 mounted on the drive end of the telescopic drive member 1712 and a photoelectric sensor 177 mounted on the base plate 174. The photoelectric limit switch 176 moves with the drive end of the telescopic drive member 1712 to cooperate with the photoelectric sensor 177 to define the initial origin position. Here, for ceramic plates of different sizes, the distance the drive end of the telescopic drive member 1712 moves the slider 102b from the initial origin position varies.

[0097] In the embodiments of this application, such as Figure 14 As shown, the telescopic drive component 1712 may further include a movable limiting block 102c that cooperates with the telescopic drive component body 102a. The two movable limiting blocks 102c in the two telescopic drive components 1712 can be distributed at preset positions between the two telescopic drive component bodies 102a. In this way, by setting the movable limiting block 102c between the two telescopic drive component bodies 102a, the defective phenomenon of damage to the ceramic plate when the telescopic drive component body 102a moves a large distance is ensured.

[0098] Optional, such as Figure 12As shown, the brush assembly 173 may include a brush assembly body 1731 and a drive mechanism 1732 connected by a transmission connection. The brush assembly body 1731 may be located below the ceramic disc A and has a brush head T. The drive mechanism 1732 may be configured to drive the brush assembly body 1731 to move so that the brush head T contacts the ceramic disc A, and then drive the brush head T to rotate to brush the ceramic disc A. For example, the drive mechanism 1732 may include a lifting component (not shown) and a rotation drive component 302a. The rotation drive component 302a is connected to the brush head T and can drive the brush head T in the brush assembly body 1731 to rotate. The lifting component is connected to both the rotation drive component 302a and the brush assembly body 1731, and can drive the brush assembly body 1731 and the rotation drive component 302a to move up and down as a whole, so that the brush head T contacts or separates from the ceramic disc. For example, the rotation drive assembly 302a may include a drive motor and a transmission belt that are connected to the rotation shaft of the brush assembly body 1731, or the output shaft of the drive motor may be directly connected to the rotation shaft of the brush assembly body 1731. The lifting assembly may include a lifting cylinder or a drive telescopic motor.

[0099] In the embodiments of this application, please refer to Figure 12 and Figure 15 , Figure 15 This is a schematic diagram of another ceramic disc cleaning assembly provided in this application embodiment. The ceramic disc cleaning assembly may further include: a protective shell 178, in which the driven wheel 1711 in the clamping assembly 171, the driving component 172, and the brush head T in the brush assembly 173 can all be disposed within the protective shell 178. In this way, by providing the protective shell 178, a closed environment can be provided for cleaning the ceramic disc A, preventing particles generated during cleaning from splashing onto other components, and ensuring the internal cleanliness of the wafer waxing machine integrating this ceramic disc cleaning assembly.

[0100] This application also provides a method for wafer wax application and polishing, which can be applied to any of the integrated wafer wax application and polishing devices given above. The method may include:

[0101] Step 1: The wafer transfer component in the integrated wafer waxing and polishing equipment transfers the wafer to the wafer brushing component for brushing.

[0102] Step 2: The wafer transfer assembly transfers the washed wafers to the wax-spraying assembly for wax dripping.

[0103] Step 3: The wafer transfer assembly transfers the wax-coated wafers to the baking assembly for baking.

[0104] Step 4: The wafer flipping assembly flips the baked wafer to the target angle and then transfers it to the placement station in the placement assembly.

[0105] Step 5: The pallet transfer assembly transfers the ceramic disk to the ceramic disk cleaning assembly for cleaning, and then transfers the cleaned ceramic disk to the chip mounting station so that the wax-coated side of the chip is facing each other.

[0106] Step 6: The chip is bonded to the ceramic disk using the surface mount assembly.

[0107] Step 7: The pallet transfer assembly transfers the fitted ceramic pallets through the first conveying port of the first cover and the second conveying port of the second cover to the ceramic pallet waiting station.

[0108] Step 8: The ceramic disk transfer assembly synchronously transfers the ceramic disk and the wafer to the polishing device for wafer polishing.

[0109] Step 9: The ceramic disk transfer assembly synchronously transfers the polished wafer and ceramic disk to the wafer unloading assembly, separating the wafer from the ceramic disk.

[0110] Additionally, the process after wafer slicing may include:

[0111] Step 10: The wafer lifting assembly transfers the wafers after slicing to the wafer waiting station;

[0112] Step 11: The chip washing and drying unit washes and dries the chips at the waiting station.

[0113] Here, steps 1 through 4 can be performed simultaneously with step 5.

[0114] Optionally, before the wafer uncoupling assembly separates the wafer, the wafer waxing and polishing method further includes: measuring the thickness of the polished wafer to determine whether it is within a threshold range;

[0115] When the thickness of the wafer is within the threshold range, the wafer is transferred to the wafer uncoupling assembly for separation of the ceramic disk and the wafer; when the thickness of the wafer is not within the threshold range, the wafer is polished again using a polishing machine.

[0116] The embodiments of the integrated wafer waxing and polishing equipment and the wafer waxing and polishing method provided in this invention can be referenced together, and will not be described again here.

[0117] The embodiments of the integrated wafer waxing and polishing equipment and the usage method of the integrated wafer waxing and polishing equipment provided in this invention can be referred to each other, and the embodiments of this invention will not be described again here.

[0118] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0119] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer waxing and polishing integrated device, characterized in that, include: Wax-applying machines and polishing machines are arranged side by side; The wafer waxing machine includes: a first housing, a wafer picking and transferring assembly, a wafer brushing assembly, a wax spinning assembly, a baking assembly, a wafer flipping assembly, a tray transfer assembly, a ceramic tray brushing assembly, a wafer placement assembly, and a wafer unloading assembly installed inside the first housing. The wafer placement assembly has a wafer placement station. The first housing has a first conveying port on the side near the polishing machine. The polishing machine includes: a second housing, at least one polishing device and a ceramic disc transfer assembly installed inside the second housing; the second housing has a second conveying port on the side near the wafer waxing machine and a ceramic disc waiting station located between the ceramic disc transfer assembly and the second conveying port; the first housing and the second housing are arranged along a first direction; the wafer brushing assembly and the wax-spinning assembly are arranged along a second direction perpendicular to the first direction; the ceramic disc brushing assembly, the wafer mounting assembly, the wafer flipping assembly and the baking assembly are arranged along the second direction; the wafer transfer assembly is distributed between the flow line formed by the wafer brushing assembly and the wax-spinning assembly and between the flow line formed by the ceramic disc brushing assembly, the wafer mounting assembly, the wafer flipping assembly and the baking assembly; the tray transfer assembly is distributed between the flow line formed by the wafer mounting assembly, the wafer flipping assembly and the baking assembly and the ceramic disc waiting station; The wafer transfer assembly is used to sequentially transfer wafers between the wafer brushing assembly, wax splatter assembly, baking assembly, and wafer flipping assembly; the tray transfer assembly is used to sequentially transfer individual ceramic trays between the ceramic tray brushing assembly and the placement station; the wafer flipping assembly is used to flip the baked wafers to a target angle and then transfer the wafers to the placement station so that the wax-coated surface of the wafers is opposite to the placement surface of the ceramic trays; the placement assembly is used to bond the oppositely positioned wafers and ceramic trays together. The pallet transfer assembly is also used to transfer the bonded ceramic pallets to the ceramic pallet waiting station through the first and second conveying ports. The ceramic pallet transfer assembly is used to transfer the ceramic pallets at the ceramic pallet waiting station to the polishing device for wafer polishing, and to transfer the polished wafers to the wafer unloading assembly through the second and first conveying ports. The wafer unloading assembly is used to separate the polished wafers from the ceramic pallets.

2. The integrated wafer waxing and polishing equipment according to claim 1, characterized in that, The process of the wafer transfer component sequentially transferring wafers between the wafer washing component, the wax spitting component, the baking component, and the wafer flipping component can be performed synchronously with the process of the tray transfer component sequentially transferring individual ceramic trays between the ceramic tray washing component and the placement station.

3. The integrated wafer waxing and polishing equipment according to claim 1, characterized in that, The integrated wafer waxing and polishing equipment further includes: a wafer thickness measuring device disposed inside the second housing and close to the wafer unloading assembly, the wafer thickness measuring device being used to measure whether the thickness of the wafer is within a threshold range.

4. The integrated wafer waxing and polishing equipment according to any one of claims 1-3, characterized in that, The wafer waxing machine further includes: a wafer washing and spin-drying assembly and a wafer lifting assembly installed in the first housing. The wafer washing and spin-drying assembly is stacked with the ceramic plate washing assembly, the wafer mounting assembly, the wafer flipping assembly and the baking assembly to form a transfer line. The wafer lifting assembly is used to transfer the wafers separated by the wafer unloading assembly to the wafer waiting station. The wafer washing and spin-drying assembly is used to wash and spin-dry the wafers at the wafer waiting station.

5. The integrated wafer waxing and polishing equipment according to claim 4, characterized in that, The wafer waxing machine further includes a wafer lifting and gripping assembly that works in conjunction with the wafer brushing and drying assembly. The wafer lifting and gripping assembly is used to transfer the brushed and dried wafers to the wafer transfer assembly, which is used to transfer the wafers to the unloading station.

6. The integrated wafer waxing and polishing equipment according to claim 1, characterized in that, The tablet transfer assembly includes: a first translation mechanism, a first lifting mechanism, a first rotary drive, a translation drive, and a tablet clamping mechanism arranged sequentially along the bottom away from the first cover. The first translation mechanism is installed at the bottom of the first cover and extends along the second direction. The first lifting mechanism is installed on the first translation mechanism and extends along the third direction. The first rotary drive is installed on the first lifting mechanism, and the rotation axis of the first rotary drive is fastened to the translation drive. The tablet clamping mechanism is installed on the translation drive. The third direction is perpendicular to both the first and second directions. The translation drive is configured to drive the clamping mechanism to grip the wafer for transfer; the first rotation drive is configured to drive the translation drive and the clamping mechanism to rotate synchronously.

7. The integrated wafer waxing and polishing equipment according to claim 1, characterized in that, The pallet assembly includes: a second translation mechanism extending along a second direction, a second lifting mechanism, a second rotary drive, a first translation drive, and a clamping mechanism. The second lifting mechanism is mounted on the second translation mechanism and extends along a third direction. The second rotary drive is mounted on the second lifting mechanism, and the rotation axis of the second rotary drive is fastened to the first translation drive. The clamping mechanism is mounted on the first translation drive. The third direction is perpendicular to both the first and second directions. The first translation drive is configured to drive the clamping mechanism to pick up the ceramic disc for transfer; the second rotation drive is configured to drive the first translation drive and the clamping mechanism to rotate synchronously.

8. The integrated wafer waxing and polishing equipment according to claim 1, characterized in that, At least one polishing device is arranged along a first direction when it includes multiple polishing devices; the ceramic disk transfer assembly includes: a third translation mechanism extending along the first direction, a rotating platform, a lifting platform, and a ceramic disk transporter; the rotating platform is mounted on the third translation mechanism, and the lifting platform is mounted on the rotating platform; the ceramic disk transporter is used to clamp the ceramic disk at the ceramic disk waiting station, rotate it by a target angle, and then make the wafer on the ceramic disk face the polishing surface of the polishing device.

9. The integrated wafer waxing and polishing equipment according to claim 8, characterized in that, The at least one polishing device includes at least one polishing device body and at least one brushing device, with each polishing device body corresponding to one and each brushing device. The brushing device is used to brush the wafer polished by the corresponding polishing device body.

10. A method for waxing and polishing wafers, characterized in that, The wafer waxing and polishing method is applied to the integrated wafer waxing and polishing equipment described in any one of claims 1-9, including: The wafer transfer assembly transfers the wafer to the wafer brushing assembly for brushing, then transfers the brushed wafer to the wax splatter assembly for wax application, and finally transfers the wax-applied wafer to the baking assembly for baking. The wafer flipping assembly flips the baked wafer to the target angle and then transfers it to the placement station; The pallet transfer unit transfers the ceramic disk to the ceramic disk cleaning unit for cleaning, and then transfers the cleaned ceramic disk to the chip mounting station so that the wax-coated side of the chip is facing each other. The surface mount assembly attaches the chip to the ceramic disk; The pallet-transfer assembly transfers the fitted ceramic discs to the ceramic disc waiting station through two conveyor ports; The ceramic disk transfer assembly simultaneously transports the ceramic disk and the wafer to the polishing device for wafer polishing, and then transports the polished wafer and ceramic disk to the wafer unloading assembly.

11. The wafer waxing and polishing method according to claim 10, characterized in that, Before the wafer is separated from the wafer by the wafer unloading assembly, the wafer waxing and polishing method further includes: measuring the thickness of the polished wafer to determine whether it is within a threshold range; When the thickness of the wafer is within the threshold range, the wafer is transferred to the wafer uncoupling assembly for separation of the ceramic disk and the wafer; when the thickness of the wafer is not within the threshold range, the wafer is polished again using a polishing machine.

Images