Semiconductor coating equipment

Abstract

The invention belongs to the technical field of coating equipment, and particularly relates to semiconductor coating equipment which is characterized in that the semiconductor coating equipment comprises a box body, a cover plate is rotatably connected to the outer wall of one side of the box body, fixing plates are fixedly connected to the two ends of the inner wall of the box body, and a lifting plate is arranged between the two ends of each fixing plate; a height adjusting mechanism is arranged between the lifting plate and the fixing plate, a bearing table is arranged at the top of the lifting plate, a limiting and fixing mechanism is arranged at the top of the bearing table, and a wiping and cleaning mechanism is arranged at one end of the top of the bearing table. According to the device, an air pump introduces high-pressure airflow into the side box through an air inlet pipe, gas-liquid mixed jet flow is formed through a liquid spraying pipe, the stripping effect on tiny impurities is enhanced, a third motor of the wiping and cleaning mechanism drives a rotating plate to adjust the position of a cleaning brush head, a fourth motor drives the brush head to rotate at a high speed, and stubborn residual impurities are removed; waste liquid is filtered and purified through a filter plate and a purification box of the cleaning circulation mechanism and flows back to the liquid spraying system through a liquid pump to be recycled.

Description

Technical Field

[0001] This invention relates to the field of coating equipment technology, and more particularly to a semiconductor coating equipment. Background Technology

[0002] Semiconductor coating technology, as one of the key processes in semiconductor manufacturing, aims to precisely deposit one or more thin films with specific properties on the surface of semiconductor wafers. These films can achieve functions such as conductivity, insulation, and protection, playing a decisive role in the performance and reliability of semiconductor devices. With the continuous trend towards miniaturization and high performance in semiconductor devices, the quality requirements for coating processes are becoming increasingly stringent. This necessitates that coating equipment not only possess high-precision thin film deposition capabilities but also meet multiple performance indicators such as high uniformity and high purity.

[0003] However, existing semiconductor coating equipment has a significant drawback in practical applications: the lack of an effective pre-cleaning mechanism for semiconductor wafers. During the production, transportation, and storage of semiconductor wafers, their surfaces easily adsorb various impurities, such as airborne dust particles, organic residues, metal ion contaminants, and natural oxide layers. If these impurities are not thoroughly removed before coating, they will seriously affect the coating quality. Impurities can reduce the adhesion between the thin film and the wafer substrate, making the film prone to peeling and delamination in subsequent processes. Therefore, a semiconductor coating equipment is proposed. Summary of the Invention

[0004] To address the lack of effective pre-cleaning mechanisms for semiconductor wafers in existing equipment, this invention proposes a semiconductor coating device.

[0005] This invention discloses a semiconductor coating equipment, comprising a housing, a cover plate rotatably connected to one outer wall of the housing, fixed plates fixedly connected to both ends of the inner wall of the housing, a lifting plate disposed between the two ends of the fixed plates, a height adjustment mechanism disposed between the lifting plate and the fixed plates, a support platform disposed on the top of the lifting plate, a limit fixing mechanism disposed on the top of the support platform, a wiping cleaning mechanism disposed at one end of the top of the support platform, a rotation adjustment mechanism disposed at the bottom of the support platform, a universal adjustment mechanism disposed at the other end of the support platform, a rotating liquid spraying mechanism disposed on one side of the inner wall of the housing, a bottom box fixedly connected to the bottom of the housing, a cleaning circulation mechanism disposed between the bottom box and the housing, a liquid outlet pipe fixedly connected to one end of the outer wall of the bottom box, an electronic valve fixedly connected to the outer wall of the liquid outlet pipe, and a coating mechanism disposed on the top of the housing.

[0006] Preferably, the height adjustment mechanism includes a first slider and a second motor. A first groove is provided on the outer wall of the fixed plate. The first slider and the first groove are slidably connected. The second motor is fixedly connected to the top outer wall of the housing. A first threaded rod is fixedly connected to the bottom of the second motor. The first slider and the first threaded rod are threadedly connected. The first slider and the lifting plate are fixedly connected. A sealing base plate is provided on the top of the lifting plate. Multiple springs and dampers are fixedly connected between the sealing base plate and the lifting plate.

[0007] Preferably, the limiting and fixing mechanism includes a second slider and a vacuum adsorption device. The top outer wall of the support platform is provided with multiple second sliding grooves. The second slider and the second sliding grooves are slidably connected. The support platform is rotatably connected with multiple second threaded screws. The second slider and the second threaded screws are threadedly connected. The top of the second slider is fixedly connected with a limiting claw. The support platform is hollow. An adsorption plate is fixedly connected to the top of the support platform. The vacuum adsorption device is fixedly connected to the support platform.

[0008] Preferably, the wiping and cleaning mechanism includes a first vertical plate and a rotating plate. The first vertical plate is fixedly connected to one end of the top outer wall of the sealing base plate. The first vertical plate has a movable groove. The rotating plate is rotatably connected to the movable groove. A third motor is fixedly connected to the top of the first vertical plate. The bottom output end of the third motor is fixedly connected to the rotating plate. A fourth motor is fixedly connected to the top of the rotating plate. A cleaning brush head is fixedly connected to the bottom of the fourth motor.

[0009] Preferably, the rotation adjustment mechanism includes a sixth motor and a universal ball joint. The sixth motor is fixedly connected to the bottom of the sealing base plate, the top of the output end of the sixth motor is fixedly connected to the universal ball joint, and the top of the universal ball joint is fixedly connected to the support platform.

[0010] Preferably, the universal adjustment mechanism includes a third slider and a fifth motor. A second vertical plate is fixedly connected to the top outer wall of the sealing base plate. A third sliding groove is opened on the outer wall of the second vertical plate. The third slider and the third sliding groove are slidably connected. The fifth motor and the top outer wall of the second vertical plate are fixedly connected. A third threaded rod is fixedly connected to the bottom of the fifth motor. The third slider and the third threaded rod are threadedly connected. A connecting plate is fixedly connected to the third slider. A connecting rod is fixedly connected to the top of the connecting plate. A roller is rotatably connected to the top of the connecting rod. The roller is located at one end of the bottom outer wall of the support platform and is in natural contact with the bottom of the support platform.

[0011] Preferably, the rotating spraying mechanism includes a first motor and a liquid guide plate. A rotating shaft is rotatably connected to one side of the inner wall of the box, and the rotating shaft and the liquid guide plate are fixedly connected. Multiple spray pipes are fixedly connected to the outer wall of the liquid guide plate. A side box is fixedly connected to one side of the outer wall of the box. The rotating shaft passes through the side box. The first motor and the side box are fixedly connected. The output end of the first motor is fixedly connected to the rotating shaft. A liquid guide hose is fixedly connected to the bottom of the side box. The rotating shaft is hollow, and a liquid guide hole is opened on the outer wall of the rotating shaft. The liquid guide hole is located inside the side box.

[0012] Preferably, an air inlet pipe is fixedly connected to the top of the side box, and an air pump is fixedly connected to the top of the air inlet pipe.

[0013] Preferably, the cleaning circulation mechanism includes a filter plate and a purification box. The box body and the bottom box are provided with a leakage groove. The filter plate and the inner wall of the leakage groove are fixedly connected. The purification box and the inner wall of the bottom box are fixedly connected. The purification box is provided with filter material. The outer wall of the purification box is provided with multiple filter holes. A liquid pump is fixedly connected to one side of the inner wall of the bottom box. The bottom of the liquid guiding hose is fixedly connected to the liquid pump.

[0014] Preferably, the coating mechanism includes a steam coating device and a vacuum treatment device. A coating box is fixedly connected to the top of the box. A through groove is opened on the outer wall of the coating box and the outer wall of the box. A sealing sleeve is fixedly connected to the outer wall of the sealing bottom plate. The sealing sleeve and the through groove are in natural contact. The steam coating device and the vacuum treatment device are respectively fixedly connected to the outer wall of the coating box.

[0015] Compared with the prior art, the present invention provides a semiconductor coating apparatus having the following features:

[0016] Beneficial effects:

[0017] 1. This semiconductor coating equipment solves the core problem of the lack of effective pre-cleaning in existing equipment through a combined pre-cleaning system. In the rotating spray mechanism, the first motor drives the guide plate to rotate the spray pipe at multiple angles. The guide hole of the hollow rotating shaft delivers cleaning fluid, achieving all-round rinsing of the wafer surface. The air pump introduces high-pressure airflow into the side box through the air inlet pipe, forming a gas-liquid mixed jet through the spray pipe, which enhances the removal effect on small impurities. The third motor of the wiping cleaning mechanism drives the rotating plate to adjust the position of the cleaning brush head, and the fourth motor drives the brush head to rotate at high speed to remove stubborn residual impurities. The filter plate and purification box of the cleaning circulation mechanism filter and purify the waste liquid, which is then returned to the spray system for recycling by the liquid pump. This ensures that the impurity removal rate of the wafer surface is improved, avoiding problems such as film delamination and insufficient adhesion after coating.

[0018] 2. This semiconductor coating equipment ensures coating uniformity through multi-dimensional adjustment and precise fixing. In the limiting and fixing mechanism, the second threaded screw drives the second slider to move the limiting claw to clamp the wafer synchronously from multiple directions. With the help of the vacuum adsorption equipment, the adsorption plate generates negative pressure to achieve stress-free fixing and prevent wafer deformation. The sixth motor of the rotation adjustment mechanism drives the universal ball joint to move the carrier platform flexibly. The fifth motor of the universal adjustment mechanism drives the third slider to rise and fall through the third threaded screw, so that the roller pushes the carrier platform to tilt at multiple angles. Combined with the second motor of the height adjustment mechanism driving the first threaded screw, the lifting plate is precisely adjusted to adjust the distance between the wafer and the coating mechanism, which greatly improves the coating uniformity.

[0019] 3. This semiconductor coating equipment improves operational efficiency and cleanliness through an integrated sealing design. The sealing base plate and sealing sleeve work together in a through-slot, allowing the wafer to complete the entire process of pre-cleaning, transfer, and coating within the same equipment, reducing secondary contamination caused by transfer. Springs and dampers buffer vibrations during equipment operation, preventing any impact on wafer positioning accuracy. The vacuum processing equipment of the coating mechanism quickly evacuates the coating tank to a vacuum state, allowing the vapor deposition equipment to accurately deposit thin films in a clean environment. The entire process requires no manual intervention. At the same time, the liquid outlet pipe and electronic valve of the bottom tank facilitate the replacement and maintenance of the cleaning solution, balancing high-efficiency production with ease of use. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the main structure of a semiconductor coating equipment proposed in this invention;

[0021] Figure 2 This is a schematic diagram of the back structure of a semiconductor coating device proposed in this invention;

[0022] Figure 3 This is a schematic diagram of the internal main structure of a semiconductor coating equipment proposed in this invention;

[0023] Figure 4 This is a side cross-sectional view of a semiconductor coating equipment proposed in this invention;

[0024] Figure 5 This is a schematic diagram of the internal structure of the side chamber of a semiconductor coating equipment proposed in this invention;

[0025] Figure 6 This is a schematic diagram of the main structure of the lifting plate of a semiconductor coating equipment proposed in this invention;

[0026] Figure 7 for Figure 6 Enlarged structural diagram at point A in the middle;

[0027] Figure 8 This is a schematic diagram of the main structure of the support platform of a semiconductor coating equipment proposed in this invention;

[0028] Figure 9 for Figure 8 Enlarged structural diagram at point B.

[0029] In the diagram: 1. Box body; 2. Coating box; 3. Fixing plate; 4. Cover plate; 5. Bottom box; 6. Electronic valve; 7. Liquid outlet pipe; 8. Liquid guide hose; 9. First motor; 10. Side box; 11. Air pump; 12. Through groove; 13. Steam coating equipment; 14. Vacuum treatment equipment; 15. Leakage tank; 16. Filter plate; 17. Spray pipe; 18. Liquid guide plate; 19. Liquid pump; 20. Purification box; 21. Filter hole; 22. Liquid guide hole; 23. Air inlet pipe; 24. Rotating shaft; 25. First slider; 26. First threaded screw; 27. Second motor; 28. First slide groove; 29. ​​Movable groove. 30 First vertical plate, 31 Third motor, 32 Rotating plate, 33 Fourth motor, 34 Support platform, 35 Lifting plate, 36 Damper, 37 Spring, 38 Sealing base plate, 39 Second slide groove, 40 Second threaded screw, 41 Second slider, 42 Adsorption plate, 43 Limiting claw, 44 Cleaning brush head, 45 Fifth motor, 46 Second vertical plate, 47 Universal ball joint, 48 Sixth motor, 49 Third slider, 50 Vacuum adsorption equipment, 51 Roller, 52 Connecting rod, 53 Connecting plate, 54 Third slide groove, 55 Third threaded screw. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0031] Reference Figure 1-9A semiconductor coating equipment includes a housing 1, with a cover plate 4 rotatably connected to one outer wall of the housing 1. Fixed plates 3 are fixedly connected to both ends of the inner wall of the housing 1. A lifting plate 35 is provided between the two ends of the fixed plates 3. A height adjustment mechanism is provided between the lifting plate 35 and the fixed plates 3. A support platform 34 is provided on the top of the lifting plate 35, with a limit fixing mechanism on the top of the support platform 34. A wiping cleaning mechanism is provided at one end of the top of the support platform 34, a rotation adjustment mechanism is provided at the bottom of the support platform 34, and a universal adjustment mechanism is provided at the other end of the support platform 34. A rotating spraying mechanism is provided on one side of the inner wall of the housing 1. A bottom box 5 is fixedly connected to the bottom of the housing 1, with a cleaning and circulation mechanism between the bottom box 5 and the housing 1. A liquid outlet pipe 7 is fixedly connected to one outer wall of the bottom box 5, with an electronic valve 6 fixedly connected to the outer wall of the liquid outlet pipe 7. A coating mechanism is provided on the top of the housing 1. The combined pre-cleaning system addresses the core issue of the lack of effective pre-cleaning in existing equipment. In the rotating spray mechanism, the first motor 9 drives the liquid guide plate 18 to rotate the spray pipe 17 at multiple angles. This, combined with the liquid guide hole 22 of the hollow rotating shaft 24, delivers cleaning fluid, achieving all-round rinsing of the wafer surface. The air pump 11 introduces high-pressure airflow into the side chamber 10 through the air inlet pipe 23, forming a gas-liquid mixed jet through the spray pipe 17, enhancing the removal effect on minute impurities. The third motor 31 of the wiping cleaning mechanism drives the rotating plate 32 to adjust the position of the cleaning brush head 44, and the fourth motor 33 drives the brush head to rotate at high speed to remove stubborn residual impurities. The filter plate 16 and purification box 20 of the cleaning circulation mechanism filter and purify the waste liquid, which is then returned to the spray system for recycling via the liquid pump 19. This ensures that the impurity removal rate of the wafer surface is improved, avoiding problems such as film delamination and insufficient adhesion after coating.

[0032] In this invention, the height adjustment mechanism includes a first slider 25 and a second motor 27. A first groove 28 is provided on the outer wall of the fixed plate 3. The first slider 25 and the first groove 28 are slidably connected. The second motor 27 is fixedly connected to the top outer wall of the housing 1. A first threaded screw 26 is fixedly connected to the bottom of the second motor 27. The first slider 25 and the first threaded screw 26 are threadedly connected. The first slider 25 is fixedly connected to the lifting plate 35. A sealing base plate 38 is provided on the top of the lifting plate 35. Multiple springs 37 and dampers 36 are fixedly connected between the sealing base plate 38 and the lifting plate 35. The second motor 27 of the height adjustment mechanism drives the first threaded screw 26, thereby driving the lifting plate 35 to precisely adjust the distance between the wafer and the coating mechanism, which greatly improves the coating uniformity.

[0033] The limiting and fixing mechanism includes a second slider 41 and a vacuum adsorption device 50. The top outer wall of the support platform 34 is provided with multiple second sliding grooves 39. The second slider 41 and the second sliding grooves 39 are slidably connected. The support platform 34 is rotatably connected with multiple second threaded screws 40. The second slider 41 and the second threaded screws 40 are threadedly connected. The top of the second slider 41 is fixedly connected with a limiting claw 43. The support platform 34 is hollow. The top of the support platform 34 is fixedly connected with an adsorption plate 42. The vacuum adsorption device 50 is fixedly connected to the support platform 34. In the limiting and fixing mechanism, the second threaded screw 40 drives the second slider 41 to drive the limiting claw 43 to clamp the wafer synchronously from multiple directions. With the help of the vacuum adsorption device 50, negative pressure is generated through the adsorption plate 42 to achieve stress-free fixing and prevent wafer deformation.

[0034] The wiping and cleaning mechanism includes a first vertical plate 30 and a rotating plate 32. The first vertical plate 30 is fixedly connected to one end of the top outer wall of the sealing base plate 38. The first vertical plate 30 has a movable groove 29. The rotating plate 32 is rotatably connected to the movable groove 29. A third motor 31 is fixedly connected to the top of the first vertical plate 30. The bottom output end of the third motor 31 is fixedly connected to the rotating plate 32. A fourth motor 33 is fixedly connected to the top of the rotating plate 32. A cleaning brush head 44 is fixedly connected to the bottom of the fourth motor 33. The third motor 31 of the wiping and cleaning mechanism drives the rotating plate 32 to adjust the position of the cleaning brush head 44. The fourth motor 33 drives the brush head to rotate at high speed to remove stubborn residual impurities.

[0035] The rotation adjustment mechanism includes a sixth motor 48 and a universal ball joint 47. The sixth motor 48 is fixedly connected to the bottom of the sealing base plate 38. The top of the output end of the sixth motor 48 is fixedly connected to the universal ball joint 47. The top of the universal ball joint 47 is fixedly connected to the support platform 34. The universal adjustment mechanism includes a third slider 49 and a fifth motor 45. A second vertical plate 46 is fixedly connected to the top outer wall of the sealing base plate 38. A third sliding groove 54 is opened on the outer wall of the second vertical plate 46. The third slider 49 and the third sliding groove 54 are slidably connected. The fifth motor 45 is fixedly connected to the top outer wall of the second vertical plate 46. The bottom of the fifth motor 45 is fixedly connected to... The third threaded screw 55 and the third slider 49 are threadedly connected. The third slider 49 is fixedly connected to the connecting plate 53. The top of the connecting plate 53 is fixedly connected to the connecting rod 52. The top of the connecting rod 52 is rolledly connected to the roller 51. The roller 51 is located at one end of the bottom outer wall of the support platform 34 and is in natural contact with the bottom of the support platform 34. The sixth motor 48 of the rotation adjustment mechanism drives the universal ball joint 47 to drive the support platform 34 to rotate flexibly. The fifth motor 45 of the universal adjustment mechanism drives the third slider 49 to rise and fall through the third threaded screw 55, so that the roller 51 pushes the support platform 34 to achieve multi-angle tilting.

[0036] The rotating spray mechanism includes a first motor 9 and a liquid guide plate 18. A rotating shaft 24 is rotatably connected to one side of the inner wall of the housing 1. The rotating shaft 24 and the liquid guide plate 18 are fixedly connected. Multiple spray pipes 17 are fixedly connected to the outer wall of the liquid guide plate 18. A side box 10 is fixedly connected to one side of the outer wall of the housing 1. The rotating shaft 24 passes through the side box 10. The first motor 9 and the side box 10 are fixedly connected. The output end of the first motor 9 is fixedly connected to the rotating shaft 24. A liquid guide hose 8 is fixedly connected to the bottom of the side box 10. The rotating shaft 24 is hollow. A liquid guide hole 22 is opened on the outer wall of the rotating shaft 24. The liquid guide hole 22 is located inside the side box 10. An air inlet pipe 23 is fixedly connected to the top of the side box 10. An air pump 11 is fixedly connected to the top of the air inlet pipe 23. The cleaning circulation mechanism includes a filter plate 16 and a purification box 20. A leakage groove is opened in the housing 1 and the bottom box 5. 15. The filter plate 16 and the inner wall of the leakage tank 15 are fixedly connected. The purification box 20 and the inner wall of the bottom box 5 are fixedly connected. The purification box 20 is equipped with filter material. Multiple filter holes 21 are opened on the outer wall of the purification box 20. A liquid pump 19 is fixedly connected to one side of the inner wall of the bottom box 5. The bottom of the liquid guiding hose 8 is fixedly connected to the liquid pump 19. The first motor 9 in the rotating spray mechanism drives the liquid guiding plate 18 to drive the spray pipe 17 to rotate at multiple angles. The liquid guiding hole 22 of the hollow rotating shaft 24 delivers the cleaning liquid to achieve all-round rinsing of the wafer surface. The air pump 11 introduces high-pressure airflow into the side box 10 through the air inlet pipe 23. The air-liquid mixed jet is formed through the spray pipe 17 to enhance the stripping effect of small impurities. The filter plate 16 and the purification box 20 of the cleaning circulation mechanism filter and purify the waste liquid. The waste liquid is returned to the spray system for recycling through the liquid pump 19.

[0037] The coating mechanism includes a vapor deposition equipment 13 and a vacuum treatment equipment 14. A coating box 2 is fixedly connected to the top of the box 1. A through groove 12 is opened on the outer wall of the coating box 2 and the box 1. A sealing sleeve is fixedly connected to the outer wall of the sealing base plate 38. The sealing sleeve and the through groove 12 are in natural contact. The vapor deposition equipment 13 and the vacuum treatment equipment 14 are fixedly connected to the outer wall of the coating box 2 respectively. The vacuum treatment equipment 14 of the coating mechanism quickly draws the coating box 2 into a vacuum state. The vapor deposition equipment 13 accurately deposits a thin film in a clean environment. The whole process does not require manual intervention.

[0038] In use, the second threaded screw 40 in the limiting and fixing mechanism drives the second slider 41 to slide along the second slide groove 39, thereby driving the limiting claw 43 to clamp the wafer. The vacuum adsorption device 50 is reinforced and fixed by the adsorption plate 42. The first motor 9 of the rotating spray mechanism drives the rotating shaft 24 to rotate the liquid guide plate 18. The spray pipe 17 sprays out the cleaning liquid. The air pump 11 introduces airflow to form a gas-liquid mixed jet to wash the wafer surface. The waste liquid flows into the bottom tank 5 through the leakage tank 15. After being filtered by the filter plate 16 and the purification box 20, it flows back to the spray system for circulation through the liquid pump 19 and the liquid guide hose 8. The third motor 31 of the wiping and cleaning mechanism adjusts the angle of the rotating plate 32, and the fourth motor 33 drives the cleaning brush head 44 to rotate and wipe away residual impurities. The universal ball joint 47 and the sixth motor 48 of the rotation adjustment mechanism cooperate with the roller 51 of the universal adjustment mechanism to adjust the wafer to the optimal angle. The second motor 27 of the height adjustment mechanism drives the lifting plate 35 to rise, so that the sealing base plate 38 enters the coating box 2 through the through groove 12. After the vacuum treatment equipment 14 draws a vacuum, the vapor coating equipment 13 completes the film deposition. The entire process achieves efficient connection between pre-cleaning and coating in a sealed environment.

[0039] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor coating apparatus, comprising a housing (1), wherein a cover plate (4) is rotatably connected to one outer wall of the housing (1), characterized in that, The inner walls of the box (1) are fixedly connected to two ends of a fixed plate (3). A lifting plate (35) is provided between the two ends of the fixed plate (3). A height adjustment mechanism is provided between the lifting plate (35) and the fixed plate (3). A support platform (34) is provided on the top of the lifting plate (35). A limit fixing mechanism is provided on the top of the support platform (34). A wiping cleaning mechanism is provided at one end of the top of the support platform (34). A rotation adjustment mechanism is provided at the bottom of the support platform (34). A universal adjustment mechanism is provided at the other end of the support platform (34). A rotating spraying mechanism is provided on one side of the inner wall of the box (1). A bottom box (5) is fixedly connected to the bottom of the box (1). A cleaning circulation mechanism is provided between the bottom box (5) and the box (1). A liquid outlet pipe (7) is fixedly connected to the outer wall of one end of the bottom box (5). An electronic valve (6) is fixedly connected to the outer wall of the liquid outlet pipe (7). A coating mechanism is provided on the top of the box (1).

2. The device according to claim 1, characterized in that, The height adjustment mechanism includes a first slider (25) and a second motor (27). A first groove (28) is provided on the outer wall of the fixed plate (3). The first slider (25) and the first groove (28) are slidably connected. The second motor (27) is fixedly connected to the top outer wall of the housing (1). A first threaded screw (26) is fixedly connected to the bottom of the second motor (27). The first slider (25) and the first threaded screw (26) are threadedly connected. The first slider (25) is fixedly connected to the lifting plate (35). A sealing base plate (38) is provided on the top of the lifting plate (35). Multiple springs (37) and dampers (36) are fixedly connected between the sealing base plate (38) and the lifting plate (35).

3. The device according to claim 1, characterized in that, The limiting and fixing mechanism includes a second slider (41) and a vacuum adsorption device (50). The top outer wall of the support platform (34) is provided with multiple second sliding grooves (39). The second slider (41) and the second sliding grooves (39) are slidably connected. The support platform (34) is rotatably connected with multiple second threaded rods (40). The second slider (41) and the second threaded rods (40) are threadedly connected. The top of the second slider (41) is fixedly connected with a limiting claw (43). The support platform (34) is hollow. The top of the support platform (34) is fixedly connected with an adsorption plate (42). The vacuum adsorption device (50) and the support platform (34) are fixedly connected.

4. The device according to claim 2, characterized in that, The wiping and cleaning mechanism includes a first vertical plate (30) and a rotating plate (32). The first vertical plate (30) and the top outer wall of the sealing base plate (38) are fixedly connected. The first vertical plate (30) has a movable groove (29). The rotating plate (32) and the movable groove (29) are rotatably connected. A third motor (31) is fixedly connected to the top of the first vertical plate (30). The bottom output end of the third motor (31) is fixedly connected to the rotating plate (32). A fourth motor (33) is fixedly connected to the top of the rotating plate (32). A cleaning brush head (44) is fixedly connected to the bottom of the fourth motor (33).

5. The device according to claim 4, characterized in that, The rotation adjustment mechanism includes a sixth motor (48) and a universal ball joint (47). The sixth motor (48) is fixedly connected to the bottom of the sealing base plate (38), the top of the output end of the sixth motor (48) is fixedly connected to the universal ball joint (47), and the top of the universal ball joint (47) is fixedly connected to the support platform (34).

6. The device according to claim 5, characterized in that, The universal adjustment mechanism includes a third slider (49) and a fifth motor (45). A second vertical plate (46) is fixedly connected to the top outer wall of the sealing base plate (38). A third sliding groove (54) is opened on the outer wall of the second vertical plate (46). The third slider (49) and the third sliding groove (54) are slidably connected. The fifth motor (45) is fixedly connected to the top outer wall of the second vertical plate (46). A third threaded screw (55) is fixedly connected to the bottom of the fifth motor (45). The third slider (49) and the third threaded screw (55) are threadedly connected. A connecting plate (53) is fixedly connected to the third slider (49). A connecting rod (52) is fixedly connected to the top of the connecting plate (53). A roller (51) is slidably connected to the top of the connecting rod (52). The roller (51) is located at one end of the bottom outer wall of the support platform (34) and is in natural contact with the bottom of the support platform (34).

7. The device according to claim 1, characterized in that, The rotating spray mechanism includes a first motor (9) and a liquid guide plate (18). A rotating shaft (24) is rotatably connected to one side of the inner wall of the box (1). The rotating shaft (24) and the liquid guide plate (18) are fixedly connected. Multiple spray pipes (17) are fixedly connected to the outer wall of the liquid guide plate (18). A side box (10) is fixedly connected to one side of the outer wall of the box (1). The rotating shaft (24) passes through the side box (10). The first motor (9) and the side box (10) are fixedly connected. The output end of the first motor (9) is fixedly connected to the rotating shaft (24). A liquid guide hose (8) is fixedly connected to the bottom of the side box (10). The rotating shaft (24) is hollow. A liquid guide hole (22) is opened on the outer wall of the rotating shaft (24). The liquid guide hole (22) is located inside the side box (10).

8. The device according to claim 7, characterized in that, An air inlet pipe (23) is fixedly connected to the top of the side box (10), and an air pump (11) is fixedly connected to the top of the air inlet pipe (23).

9. The device according to claim 8, characterized in that, The cleaning circulation mechanism includes a filter plate (16) and a purification box (20). The box body (1) and the bottom box (5) are provided with a leakage groove (15). The filter plate (16) and the leakage groove (15) are fixedly connected to the inner wall. The purification box (20) and the bottom box (5) are fixedly connected to the inner wall. The purification box (20) is provided with filter material. The outer wall of the purification box (20) is provided with multiple filter holes (21). A liquid pump (19) is fixedly connected to one side of the inner wall of the bottom box (5). The bottom of the liquid guiding hose (8) is fixedly connected to the liquid pump (19).

10. The device according to claim 2, characterized in that, The coating mechanism includes a steam coating device (13) and a vacuum treatment device (14). A coating box (2) is fixedly connected to the top of the box (1). A through groove (12) is opened on the outer wall of the coating box (2) and the box (1). A sealing sleeve is fixedly connected to the outer wall of the sealing bottom plate (38). The sealing sleeve and the through groove (12) are in natural contact. The steam coating device (13) and the vacuum treatment device (14) are fixedly connected to the outer wall of the coating box (2) respectively.

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