Spindle frame body precision adjusting method
By detecting and adjusting the horizontal and vertical accuracy of the spindle support, the problem of insufficient perpendicularity between the silent linear guide assembly and the mounting reference surface of the support was solved, achieving high-precision operation of the spindle support and long life of the silent slider, thus ensuring the stability and accuracy of wafer transfer.
Patent Information
- Application Number
- CN202511132902.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-13
- Publication Date
- 2025-11-14
AI Technical Summary
How to ensure the perpendicularity of the silent linear guide assembly of the spindle frame to the mounting reference surface of the frame in a chemical vapor deposition equipment, so as to ensure the positional accuracy and stability of the wafer during the transfer process.
By setting up a spindle frame leveling mechanism and a frame mounting reference surface level detection mechanism on a horizontal reference detection platform, the horizontal accuracy of the spindle frame is detected and adjusted. Then, the vertical accuracy of the silent linear guide assembly is detected and adjusted on a vertical reference detection platform. Using tools such as a 00-grade marble platform and a magnetic dial indicator, the perpendicularity of the silent linear guide to the mounting reference surface is ensured to meet the accuracy requirements.
It effectively improves the running accuracy and stability of the spindle support, extends its service life, reduces the wear of the silent slider, and improves the positional accuracy during wafer transfer.
Smart Images
Figure CN120945352A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chemical vapor deposition equipment installation or maintenance technology, and in particular to a method for adjusting the precision of a spindle support. Background Technology
[0002] The spindle frame of a chemical vapor deposition (CVD) system houses the spindle, with a transfer tray mounted above it. The spindle frame contains linear and rotary drive mechanisms that lift and rotate the spindle, thus enabling wafer transfer. Precise wafer positioning is crucial during transfer; each wafer must maintain a consistent height as the spindle rotates the transfer tray. Ensuring consistent wafer height (without deflection) during rotation is critical. The perpendicularity of the spindle frame's mounting reference plane to the silent linear guide assembly on the spindle frame is essential for maintaining this accuracy. Ensuring this perpendicularity during installation is a critical technical challenge that needs to be addressed. Summary of the Invention
[0003] This invention proposes a method for adjusting the precision of the spindle support body to address the above-mentioned problems. The technical means employed in this invention are as follows: A method for adjusting the precision of a spindle support body includes the following steps: Step 1: Install the two sets of silent linear guide assemblies onto the spindle frame respectively; Step 2: Set up a spindle frame leveling mechanism and a frame mounting reference surface level detection mechanism on the horizontal reference detection platform. Place the spindle frame on the spindle frame leveling mechanism. Use the frame mounting reference surface level detection mechanism to detect the horizontal accuracy value between the frame mounting reference surface at the upper end of the spindle frame and the reference surface of the horizontal reference detection platform. Determine whether the horizontal accuracy value is less than or equal to a set first threshold. If yes, proceed to the next step. If no, adjust the spindle frame using the spindle frame leveling mechanism until the horizontal accuracy value is less than or equal to the set first threshold. Step 3: Set up a vertical reference detection platform on the horizontal reference detection platform. The vertical reference detection platform is located on one side of the spindle frame. Set up a vertical detection mechanism on the silent slider of a set of silent linear guide assemblies. The vertical detection mechanism detects the vertical accuracy value between the silent linear guide of the silent linear guide assembly and the reference surface of the vertical reference detection platform. Determine whether the vertical accuracy value is less than or equal to a set second threshold. If not, adjust the silent linear guide assembly until the vertical accuracy value is less than or equal to the set second threshold and lock the silent linear guide. If yes, repeat step 3 to detect and adjust another set of silent linear guide assemblies.
[0004] Furthermore, the horizontal reference testing platform is a Grade 00 marble platform; the vertical reference testing platform is a Grade 00 marble right-angle ruler; the main shaft frame leveling mechanism includes three adjustable jacks arranged in a triangle. The frame mounting reference plane level detection mechanism includes a dial indicator and a dial indicator fixing frame; The vertical detection mechanism is a magnetic dial indicator.
[0005] Furthermore, the step of mounting the two sets of silent linear guide assemblies onto the spindle frame includes the following steps: The silent linear guide assembly is installed on the spindle frame using screws, and the gap between the silent linear guide and the mounting reference surface on the spindle frame is detected by a feeler gauge. When the gap between the silent linear guide and the mounting reference surface on the spindle frame meets the set requirements, the silent linear guide is locked with a first set locking force.
[0006] Furthermore, the specific process of detecting the horizontal accuracy value between the mounting reference surface at the upper end of the spindle frame and the reference surface of the horizontal reference detection platform through the mounting reference surface horizontal detection mechanism is as follows: The dial indicator mounting bracket is set on the 00 grade marble platform and located on one side of the main shaft frame; Adjust the dial indicator on the dial indicator mounting bracket so that the dial indicator needle contacts the mounting reference surface of the bracket and the reading is returned to zero; The dial indicator is moved and fixed, and the dial indicator is used to sequentially detect three points on the mounting reference surface of the frame to obtain the horizontal accuracy value between the mounting reference surface of the frame and the reference surface of the horizontal reference detection platform.
[0007] Furthermore, the first threshold is 0.005 mm.
[0008] Furthermore, the specific process of detecting the vertical accuracy value between the silent rail of the silent rail assembly and the reference plane of the vertical reference detection platform through the vertical detection mechanism is as follows: Magnetize the frame of the magnetic dial indicator onto the silent slider, adjust the pointer of the magnetic dial indicator so that the pointer contacts the reference surface of the 00 grade marble right angle ruler and reset the reading to zero. Pushing the silent slider up and down along the silent rail causes the pointer of the magnetic dial indicator to slide up and down along the reference surface of the 00-grade marble right-angle ruler to obtain the vertical accuracy value between the silent rail and the reference surface of the vertical reference detection platform.
[0009] Furthermore, the second threshold is 0.005 mm.
[0010] Furthermore, it also includes step 4: after both sets of silent linear guide assemblies have been tested, adjusted and locked, the frame mounting reference surface is re-inspected by the frame mounting reference surface level detection mechanism to determine whether the horizontal accuracy value between the frame mounting reference surface and the reference surface of the horizontal reference detection platform is less than or equal to the set first threshold. If yes, the spindle frame accuracy adjustment is completed; if no, the silent guide rail assembly is readjusted. Compared with the prior art, the spindle frame precision adjustment method disclosed in this invention has the following beneficial effects: This application first detects and adjusts the horizontal precision of the spindle frame mounting reference surface and the reference platform, and then detects and adjusts the vertical precision of the silent linear rails, thereby effectively ensuring the vertical precision of the two silent linear rails and the mounting reference surface, so that the running precision of the mounting reference surface and the carrier can be effectively maintained during movement, resulting in smoother operation and extended service life. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of the main shaft support and main shaft of the chemical vapor deposition apparatus in this invention; Figure 2 This is a structural diagram of the main shaft frame of the chemical vapor deposition equipment in this invention; Figure 3 This is a flowchart of the spindle frame precision adjustment method disclosed in this invention; Figure 4 This is a physical installation diagram of the spindle frame precision adjustment method disclosed in this invention.
[0012] In the diagram: 1. Spindle frame; 10. Linear drive mechanism mounting cavity; 11. Rotary drive mechanism mounting cavity; 12. Silent slide rail mounting surface; 13. Silent linear rail; 14. Silent slider; 15. Rotary drive mechanism fixing frame; 16. Frame mounting reference surface; 2. Spindle; 3. Linear drive mechanism; 4. Rotary drive mechanism; 5. Horizontal reference detection platform; 6. Horizontal detection mechanism for frame mounting reference surface; 60. Dial indicator; 61. Dial indicator fixing frame; 7. Vertical reference detection platform; 8. Vertical detection mechanism. Detailed Implementation
[0013] like Figure 1 and Figure 2As shown, the spindle support 1 of the chemical vapor deposition equipment includes a linear drive mechanism mounting cavity 10 for mounting a linear drive mechanism 3 and a rotary drive mechanism mounting cavity 11 for mounting a rotary drive mechanism 4. Silent linear guide mounting surfaces 12 are provided on both sides of the rotary drive mechanism mounting cavity 11, on which silent linear guide assemblies are mounted. A rotary drive mechanism mounting bracket 15 is provided inside the rotary drive mechanism mounting cavity 11, and the rotary drive mechanism 4 is mounted in the rotary drive mechanism mounting bracket 15. Both sides of the rotary drive mechanism mounting bracket 15 are connected to the silent sliders 14 of the silent linear guide assemblies. The lower end of the rotary drive mechanism mounting bracket 15 is connected to the output end of the linear drive mechanism 3. The linear drive mechanism 3 can drive the rotary drive mechanism mounting bracket 15 to move up and down, thereby driving the rotary drive mechanism 4 to move up and down. The output end of the rotary drive mechanism 4 is connected to the spindle 2, and the rotary drive mechanism 4 can drive the spindle 2 to rotate. When the linear drive mechanism 3 drives the rotary drive mechanism mounting bracket 15 to move up and down, the rotary drive mechanism 4 can drive the spindle 2 to move up and down, thus realizing the lifting and rotating motion of the spindle 2. A mounting reference surface 16 is provided at the upper end of the spindle frame 1. The spindle frame 1 is fixedly mounted on the frame of the chemical vapor deposition equipment via the mounting reference surface 16. A transmission tray is fixed on the spindle 2. By lifting and rotating the spindle 2, the wafer placed in the transmission tray can be lifted and rotated, thereby completing the transfer of the wafer. During the lifting and rotation of the wafer, high positional accuracy is required. That is, the perpendicularity between the silent linear guide 13 and the mounting reference surface 16 needs to meet certain accuracy requirements to ensure that the wafer meets its positional accuracy requirements during the lifting and rotation of the transmission tray driven by the spindle. This application aims to achieve the installation and adjustment of the silent linear guide so that the perpendicularity between the silent linear guide and the mounting reference surface meets its accuracy requirements, thereby ensuring that the wafer meets its positional accuracy requirements during the lifting and rotation of the transmission tray driven by the spindle.
[0014] like Figure 3 and Figure 4 As shown, the specific process of the spindle frame precision adjustment method disclosed in this application is as follows: Step 1: Install the two sets of silent linear guide assemblies onto the spindle frame respectively; Specifically, standard screws are first used to install the two sets of silent linear guide assemblies on the silent linear guide mounting surfaces on both sides of the rotary drive mechanism mounting cavity of the spindle frame, and they are initially fixed to facilitate subsequent loosening and adjustment. In this embodiment, M3X8 screws are used to install the silent linear guides on the silent linear guide mounting surfaces and to lock them with a locking torque of approximately 1.5 Nm. Step 2: Set up a spindle frame leveling mechanism and a frame mounting reference surface level detection mechanism on the horizontal reference detection platform. Place the spindle frame on the spindle frame leveling mechanism. Use the frame mounting reference surface level detection mechanism to detect the horizontal accuracy value between the frame mounting reference surface at the upper end of the spindle frame and the reference surface of the horizontal reference detection platform. Determine whether the horizontal accuracy value is less than or equal to a set first threshold. If yes, proceed to the next step. If no, adjust the spindle frame using the spindle frame leveling mechanism until the horizontal accuracy value is less than or equal to the set first threshold. Step 3: Set up a vertical reference detection platform on the horizontal reference detection platform. The vertical reference detection platform is located on one side of the spindle frame. Set up a vertical detection mechanism on the silent slider of a set of silent linear guide assemblies. The vertical detection mechanism detects the vertical accuracy value between the silent linear guide of the silent linear guide assembly and the reference surface of the vertical reference detection platform. Determine whether the vertical accuracy value is less than or equal to a set second threshold. If not, adjust the silent linear guide assembly until the vertical accuracy value is less than or equal to the set second threshold and lock the silent linear guide. If yes, repeat step 3 to detect and adjust another set of silent linear guide assemblies.
[0015] This application first detects and adjusts the horizontal accuracy of the mounting reference surface of the spindle frame and the reference platform, and then detects and adjusts the vertical accuracy of the silent linear guide. This effectively ensures the vertical accuracy of the two silent linear guides with respect to the mounting reference surface, so that the running accuracy of the mounting reference surface and the carrier can be effectively maintained during movement, resulting in smoother operation and extended service life.
[0016] Meanwhile, the parallelism of the silent linear guides on both sides reaches a high precision, for example, within 0.005. When the silent slider is combined with other carriers, the extremely high parallelism on both sides will reduce the running noise of the silent slider, greatly increase the service life of the silent slider and silent linear guides, and reduce the wear of the steel balls inside the silent slider.
[0017] Furthermore, the parallelism accuracy of the silent linear guides on both sides reaches within 0.005. When the spindle is installed, the flatness of the mounting reference surface is measured to ensure perfect accuracy, with the overall accuracy reaching within 0.01, which can well meet the accuracy requirements in the industry.
[0018] Furthermore, the horizontal reference testing platform is a Grade 00 marble platform; the vertical reference testing platform is a Grade 00 marble right-angle ruler; the main shaft frame leveling mechanism includes three adjustable jacks arranged in a triangle. The frame mounting reference plane level detection mechanism includes a dial indicator and a dial indicator fixing frame; The vertical detection mechanism is a magnetic dial indicator.
[0019] Specifically, in this embodiment, the horizontal reference testing platform is a 00-grade marble platform; the vertical reference testing platform is a 00-grade marble right angle ruler; since the marble platform has the characteristics of precise structure, uniform texture, and good stability, using it as a testing platform can further ensure the accuracy of the main spindle frame precision adjustment; The main shaft frame leveling mechanism includes three adjustable jacks arranged in a triangle. The frame mounting reference plane level detection mechanism includes a dial indicator and a dial indicator fixing frame; The vertical detection mechanism is a magnetic dial indicator. The above-mentioned structure has the advantages of simple structure and convenient operation. In this embodiment, the spindle frame leveling mechanism adopts a three-adjustable jack structure. The three adjustable jacks are set on the detection reference surface of the 00 grade marble platform and arranged in a triangular pattern. The lower end face of the spindle frame can be placed on the three adjustable jacks. The three adjustable jacks are adjusted according to the three-point plane principle to ensure that the frame installation reference surface of the spindle frame is adjusted to the set accuracy range.
[0020] Furthermore, the step of mounting the two sets of silent linear guide assemblies onto the spindle frame includes the following steps: The silent linear guide assembly is installed on the spindle frame using screws, and the gap between the silent linear guide and the mounting reference surface on the spindle frame is detected by a feeler gauge. When the gap between the silent linear guide and the mounting reference surface on the spindle frame meets the set requirements, the silent linear guide is locked with a first set locking force.
[0021] Specifically, in this embodiment, M3X8 standard screws are used to install the silent linear guide on the silent linear guide mounting surface, and the locking torque is approximately 1.5Nm to facilitate subsequent precision adjustment. During locking, one side of the silent linear guide should be aligned with the reference surface on the silent linear guide mounting surface, and a 0.02 feeler gauge is used to check whether it is qualified. Through this step, the silent linear guide can be initially installed on the spindle frame and given a certain degree of precision to facilitate subsequent adjustment.
[0022] Furthermore, the specific process of detecting the horizontal accuracy value between the mounting reference surface at the upper end of the spindle frame and the reference surface of the horizontal reference detection platform through the mounting reference surface horizontal detection mechanism is as follows: The dial indicator mounting bracket is set on the 00 grade marble platform and located on one side of the main shaft frame; Adjust the dial indicator on the dial indicator mounting bracket so that the dial indicator needle contacts the mounting reference surface of the bracket and the reading is returned to zero; The dial indicator is moved and fixed, and the dial indicator is used to sequentially detect three points on the mounting reference surface of the frame to obtain the horizontal accuracy value between the mounting reference surface of the frame and the reference surface of the horizontal reference detection platform.
[0023] Specifically, the flatness of the frame mounting reference surface is ensured to be less than 0.005 during machining. In this embodiment, a dial indicator is used to measure the horizontal accuracy of the frame mounting reference surface at the upper end of the spindle frame. The specific steps are as follows: the dial indicator is mounted on the 00-grade marble platform via a dial indicator holder, located on one side of the spindle frame. The position of the dial indicator on the dial indicator holder is adjusted so that the dial indicator is higher than the frame mounting reference surface of the spindle frame, and the dial indicator needle is in contact with the frame mounting reference surface and the reading is zeroed. Then, the dial indicator holder is moved, and the dial indicator is used to sequentially detect three points on the frame mounting reference surface to obtain the horizontal accuracy value between the frame mounting reference surface and the reference surface of the 00-grade marble platform. When the horizontal accuracy value is greater than the set accuracy value, at least one of the three adjustable jacks can be adjusted to achieve the set accuracy value. After adjustment, the dial indicator can be moved to detect multiple points on the frame mounting reference surface to achieve the detection of the flatness of the frame mounting reference surface.
[0024] Furthermore, the first threshold is 0.005 mm.
[0025] Specifically, in this embodiment, the first threshold is set to 0.005mm according to actual needs, which can effectively ensure the installation accuracy of the subsequent silent rail and the mounting reference surface of the frame, thereby improving the accuracy of the subsequent wafer lifting and rotation process.
[0026] Furthermore, the specific process of detecting the vertical accuracy value between the silent rail of the silent rail assembly and the reference plane of the vertical reference detection platform through the vertical detection mechanism is as follows: Magnetize the frame of the magnetic dial indicator onto the silent slider, adjust the pointer of the magnetic dial indicator so that the pointer contacts the reference surface of the 00 grade marble right angle ruler and reset the reading to zero. Pushing the silent slider up and down along the silent rail causes the pointer of the magnetic dial indicator to slide up and down along the reference surface of the 00-grade marble right-angle ruler to obtain the vertical accuracy value between the silent rail and the reference surface of the vertical reference detection platform.
[0027] Specifically, in this embodiment, the vertical accuracy of the silent track is detected using a magnetic dial indicator and a 00-grade marble right-angle ruler. The process involves placing a 00-grade marble right-angle ruler on a 00-grade marble platform, magnetically attaching the dial indicator's frame to the silent slider, adjusting the dial indicator's needle so that it is approximately one degree perpendicular to the silent track, slowly moving the 00-grade marble right-angle ruler to the needle position until the needle tip contacts the side (reference surface) of the 00-grade marble right-angle ruler and the reading is zeroed, and then pushing the silent slider along... The silent guide rail moves up and down. The vertical accuracy of the silent guide rail is obtained by reading the magnetic dial indicator. If the reading is greater than 0.5 divisions (0.005mm), loosen the standard screws (M3X8 screws), adjust the silent guide rail, and then tighten it again for testing. Continue this process until the accuracy is within 0.5 divisions (0.005mm) on the dial indicator. Then tighten the silent guide rail. The tightening torque at this point should be greater than the installation torque. The installation torque was approximately 1.5Nm, and the adjusted torque is approximately 3.5Nm. Then, adjust and tighten another silent guide rail assembly in the same way to ensure that the parallelism of the two silent guide rails is within 0.005mm.
[0028] Furthermore, the second threshold is 0.005 mm.
[0029] Specifically, in this embodiment, the second threshold is set to 0.005mm according to actual needs, which can effectively ensure the installation accuracy of the subsequent silent linear guide and the mounting reference surface of the frame, thereby improving the accuracy of the subsequent wafer lifting and rotation process.
[0030] Furthermore, it also includes step 4: after both sets of silent linear guide assemblies have been tested, adjusted and locked, the frame mounting reference surface is re-inspected by the frame mounting reference surface level detection mechanism to determine whether the horizontal accuracy value between the frame mounting reference surface and the reference surface of the horizontal reference detection platform is less than or equal to the set first threshold. If yes, the spindle frame accuracy adjustment is completed; if no, the silent guide rail assembly is readjusted. Specifically, after both sets of silent linear guide assemblies have been inspected, adjusted and locked, the horizontal accuracy value is obtained by re-inspecting the mounting reference surface of the frame. The specific inspection process is the same as the inspection process in step 2, and will not be described again here. It is determined whether the horizontal accuracy value is less than or equal to the set first threshold. If yes, the accuracy adjustment of the spindle frame is completed. If no, the silent guide rail assembly is readjusted.
[0031] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. A method for adjusting the precision of a spindle support body, characterized in that, Includes the following steps: Step 1: Install the two sets of silent linear guide assemblies onto the spindle frame respectively; Step 2: Set up a spindle frame leveling mechanism and a frame mounting reference surface level detection mechanism on the horizontal reference detection platform. Place the spindle frame on the spindle frame leveling mechanism. Use the frame mounting reference surface level detection mechanism to detect the horizontal accuracy value between the frame mounting reference surface at the upper end of the spindle frame and the reference surface of the horizontal reference detection platform. Determine whether the horizontal accuracy value is less than or equal to a set first threshold. If yes, proceed to the next step. If no, adjust the spindle frame using the spindle frame leveling mechanism until the horizontal accuracy value is less than or equal to the set first threshold. Step 3: Set up a vertical reference detection platform on the horizontal reference detection platform. The vertical reference detection platform is located on one side of the spindle frame. Set up a vertical detection mechanism on the silent slider of a set of silent linear guide assemblies. The vertical detection mechanism detects the vertical accuracy value between the silent linear guide of the silent linear guide assembly and the reference surface of the vertical reference detection platform. Determine whether the vertical accuracy value is less than or equal to a set second threshold. If not, adjust the silent linear guide assembly until the vertical accuracy value is less than or equal to the set second threshold and lock the silent linear guide. If yes, repeat step 3 to detect and adjust another set of silent linear guide assemblies.
2. The spindle support body precision adjustment method according to claim 1, characterized in that: The horizontal reference testing platform is a Grade 00 marble platform; the vertical reference testing platform is a Grade 00 marble right angle ruler; the main shaft frame leveling mechanism includes three adjustable jacks arranged in a triangle; The frame mounting reference plane level detection mechanism includes a dial indicator and a dial indicator fixing frame; The vertical detection mechanism is a magnetic dial indicator.
3. The method for adjusting the precision of the spindle support body according to claim 1, characterized in that: The process of installing the two sets of silent linear guide assemblies onto the spindle frame includes the following steps: The silent linear guide assembly is installed on the spindle frame using screws, and the gap between the silent linear guide and the mounting reference surface on the spindle frame is detected by a feeler gauge. When the gap between the silent linear guide and the mounting reference surface on the spindle frame meets the set requirements, the silent linear guide is locked with a first set locking force.
4. The method for adjusting the precision of the spindle support body according to claim 2, characterized in that: The specific process of detecting the horizontal accuracy value between the mounting reference surface at the upper end of the spindle frame and the reference surface of the horizontal reference detection platform through the mounting reference surface horizontal detection mechanism is as follows: The dial indicator mounting bracket is set on the 00 grade marble platform and located on one side of the main shaft frame; Adjust the dial indicator on the dial indicator mounting bracket so that the dial indicator needle contacts the mounting reference surface of the bracket and the reading is returned to zero; The dial indicator is moved and fixed, and the dial indicator is used to sequentially detect three points on the mounting reference surface of the frame to obtain the horizontal accuracy value between the mounting reference surface of the frame and the reference surface of the horizontal reference detection platform.
5. The method for adjusting the precision of the spindle support body according to claim 1, characterized in that: The first threshold is 0.005 mm.
6. The method for adjusting the precision of the spindle support body according to claim 2, characterized in that: The specific process of detecting the vertical accuracy value between the silent rail of the silent rail assembly and the reference plane of the vertical reference detection platform using the vertical detection mechanism is as follows: The magnetic dial indicator frame is magnetically attached to the silent slider. The pointer of the magnetic dial indicator is adjusted so that it contacts the reference surface of the 00 grade marble right-angle ruler and the reading is returned to zero. Pushing the silent slider up and down along the silent rail causes the pointer of the magnetic dial indicator to slide up and down along the reference surface of the 00-grade marble right-angle ruler to obtain the vertical accuracy value between the silent rail and the reference surface of the vertical reference detection platform.
7. The method for adjusting the precision of the spindle support body according to claim 1, characterized in that: The second threshold is 0.005 mm.
8. The method for adjusting the precision of the spindle support body according to claim 1, characterized in that: The process also includes step 4: after both sets of silent linear guide assemblies have been tested, adjusted and locked, the mounting reference surface of the frame is re-inspected by the mounting reference surface level detection mechanism to determine whether the horizontal accuracy value between the mounting reference surface of the frame and the reference surface of the horizontal reference detection platform is less than or equal to the set first threshold. If yes, the spindle frame accuracy adjustment is completed; if no, the silent guide rail assembly is readjusted.