Dimming film manufacturing method and dimming film

Abstract

The invention provides a light adjusting film manufacturing method and a light adjusting film. According to the light adjusting film manufacturing method, at least a first base material and a second base material are attached to form the light adjusting film, and the first base material is at least provided with a first conductive layer; the second base material is at least provided with a second conductive layer, a dimming functional layer and an adhesive layer which are sequentially arranged in a stacked manner; the manufacturing method of the dimming film comprises the following steps: cutting a first base material, and forming a first electrode reserved position on a first conductive layer; cutting the second base material, and forming a second electrode reserved position on the second conductive layer; the first conductive layer is attached to the adhesive layer to form a pre-composite film structure; and respectively manufacturing a first electrode and a second electrode at the first electrode reserved position and the second electrode reserved position. According to the invention, by adjusting the post-processing mode of the light adjusting film, the light adjusting film does not need to be half-cut, so that the quality and safety risks of the light adjusting film caused by half-cutting can be avoided, and meanwhile, the requirements of complexity and diversification of partition patterns on the light adjusting film can still be met.

Description

Technical Field

[0001] This invention relates to the field of glass technology, and further to a method for manufacturing a dimming film and a dimming film, particularly to a method for manufacturing a dimming film using a lamination process and a dimming film. Background Technology

[0002] As a smart film with the function of adjusting transparency, dimming film can change its optical properties when the power is turned on and off to control the transmission and scattering of light, thereby achieving different light transmission performance. It is precisely because of this function that dimming film is widely used in automotive glass and architectural glass and has broad application prospects.

[0003] Currently, the post-processing of dimming films mainly involves processing the complete dimming film material (including shape making, electrode making, and other related processes). The specific processing procedure generally involves processing the incoming roll material of the dimming film according to the drawing requirements, making auxiliary marks (alignment marks or reference marks), making functional zones, half-cutting the electrode positions, coating the conductive material at the electrode positions (or attaching conductive adhesive), sealing the edges, bonding the conductive layer, and conducting withstand voltage testing and off-site testing, etc., to finally complete the post-processing of the dimming film.

[0004] The structure and specific manufacturing process of dimming film materials are as follows: Figure 1 and Figure 2 As shown, the structure of the dimming film material includes a liquid crystal layer 100 located in the middle, and on both sides of the liquid crystal layer 100, from the inside to the outside, there are a conductive layer 200, a PET substrate layer 300 and a protective film 400 stacked in sequence. During the production of the dimming film, the electrode position (i.e., the conductive layer 200) cannot be exposed due to the structure of the dimming film material. Therefore, it is necessary to perform half-cutting on the two sides of the dimming film material or the position near the edge to expose the electrode position. The entire production process begins by cutting the roll material into sheets (establishing a preset shape and target), then performing half-cuts on side A and side B according to the drawings. After cutting, the liquid crystal on the conductive layer 200 at the electrode positions needs to be processed (the liquid crystal processing can also be completed before half-cutting, so that the liquid crystal can be removed when tearing off the cut part after half-cutting). After the liquid crystal processing is completed, silver paste is applied and cured to the electrode positions on side A, and then silver paste is applied and cured to the electrode positions on side B. After the conductive silver paste is applied, the cut surface A and the cut surface B are sealed and cured respectively. After the sealing and curing of side A and side B are completed, the FPC bonding of side A and side B begins. Finally, after passing the inspection process, the dimming film is completed.

[0005] However, with the increasing application of dimming films in automotive glass, more and more car models have begun to be equipped with dimming glass. Users not only have higher and higher requirements for the aesthetics of the glass, but also for the shape of the dimming film, which is becoming more diverse and complex. At the same time, it is difficult to meet the requirements for the dimming effect of the dimming film and the diverse dimming patterns by using the above-mentioned post-processing methods. In addition, the existing technology still has the risk of damaging the ITO conductive film layer during the semi-cutting process. The ITO dust generated during the dimming film's dimming process and the damage to the liquid crystal layer can cause obvious dimming lines to appear. This can lead to the finished glass having disadvantages such as poor dimming visibility, the presence of burst points, and the risk of short circuits.

[0006] Currently, there are no effective solutions to the problems in related technologies, such as damage to the conductive film layer during the half-cutting process of the dimming film, poor zonal visibility, potential burst points, and short circuit risks caused by dust generated during cutting. Therefore, this invention proposes a method for manufacturing a dimming film and a dimming film to overcome the shortcomings of the prior art. Summary of the Invention

[0007] The purpose of this invention is to provide a method for manufacturing a dimming film and a dimming film. By adjusting the post-processing method of the dimming film, the post-processing of the dimming film can be completed without half-cutting, thereby avoiding the quality and safety risks caused by half-cutting and improving the quality and reliability of the product. In addition, it can meet the demand for complex and diversified partitioned patterns on the dimming film, and can better meet market demands.

[0008] The objective of this invention can be achieved through the following methods: This invention provides a method for manufacturing a dimming film, wherein the dimming film is formed by laminating a first substrate and a second substrate together. The first substrate has at least a first conductive layer; The second substrate has at least a second conductive layer, a dimming functional layer, and an adhesive layer arranged sequentially and in a stacked manner; The method for manufacturing the dimming film includes the following steps: Cut the first substrate and form a first electrode pre-reserved position on the first conductive layer; Cut the second substrate and form a second electrode pre-reserved position on the second conductive layer; The first conductive layer is bonded to the adhesive layer to form a pre-composite film structure; The first electrode and the second electrode are respectively fabricated at the first electrode reserved position and the second electrode reserved position.

[0009] In a preferred embodiment of the present invention The first electrode pre-reserved position is located at or near the edge of the first conductive layer; The second electrode pre-reserved position is located at or near the edge of the second conductive layer; When the first conductive layer and the adhesive layer are bonded together, the first electrode reserved position and the second electrode reserved position are located on both sides of the pre-composite film structure, respectively.

[0010] In a preferred embodiment of the present invention, the first conductive layer and the adhesive layer are misaligned and bonded, and the first electrode reserved position and the second electrode reserved position are respectively located at positions offset from the first substrate and the second substrate.

[0011] In a preferred embodiment of the present invention, the first substrate is cut to form a preset shape, and then the first substrate is sequentially partitioned and surface cleaned. And / or, the second substrate is cut to form a predetermined shape, and then the second substrate is surface cleaned.

[0012] In a preferred embodiment of the present invention, conductive structures are provided at the first electrode reserved position and the second electrode reserved position, respectively, to form the first electrode and the second electrode.

[0013] In a preferred embodiment of the present invention, after forming the first electrode and the second electrode, the method further includes: The gap area formed by the first electrode, the first substrate, and the second substrate is sealed and cured. The gap area formed by the second electrode, the first substrate, and the second substrate is sealed and cured. Electrical connection structures are provided at the first electrode and the second electrode, respectively; After the testing is completed, the dimming film is fabricated.

[0014] In a preferred embodiment of the present invention, the second substrate includes the adhesive layer disposed independently and the second conductive layer and the dimming functional layer stacked together; The dimming film manufacturing method further includes: bonding the adhesive layer to the dimming functional layer to form the second substrate.

[0015] This invention provides a dimming film, which is formed using the dimming film manufacturing method described above, and the dimming film includes: A first substrate, the first substrate having at least a first conductive layer, on which a first electrode reservation is formed; The second substrate has at least a second conductive layer, a dimming functional layer and an adhesive layer arranged sequentially and stacked, and a second electrode reservation is formed on the second conductive layer; The first conductive layer is bonded to the adhesive layer so that the first substrate and the second substrate cooperate to form a pre-composite film structure, and the first electrode and the second electrode are respectively provided at the first electrode reserved position and the second electrode reserved position.

[0016] In a preferred embodiment of the present invention, the first conductive layer and the adhesive layer are misaligned and bonded, the first electrode reserved position and the second electrode reserved position are respectively located on both sides of the pre-composite film structure, and the first electrode reserved position is located at the edge or near the edge of the first conductive layer, and the second electrode reserved position is located at the edge or near the edge of the second conductive layer.

[0017] In a preferred embodiment of the present invention, the first substrate further includes a first substrate layer, wherein the first conductive layer is stacked with the first substrate layer. The first substrate and the second substrate are not bonded together, and a protective film is stacked on the first conductive layer on the other side opposite to the first substrate layer.

[0018] In a preferred embodiment of the present invention, the second substrate further includes a second substrate layer, which is stacked on the second conductive layer and located on the other side opposite to the dimming functional layer. The first substrate and the second substrate are not bonded together, and a release film is stacked on the adhesive layer on the other side opposite to the dimming functional layer.

[0019] In a preferred embodiment of the present invention, the first substrate and the second substrate are in a bonded state, and a protective film is stacked on the first substrate layer on the side opposite to the first conductive layer; and / or, a protective film is stacked on the second substrate layer on the side opposite to the second conductive layer.

[0020] In a preferred embodiment of the present invention, the first substrate and the second substrate are in an unattached state, and the second substrate includes: The adhesive layer is set independently, and release films are stacked on both sides of the adhesive layer; A second conductive layer and a dimming functional layer are stacked together, and a release film is stacked on the dimming functional layer on the other side opposite to the second conductive layer.

[0021] Based on the above, the dimming film manufacturing method and the characteristics and advantages of the dimming film of the present invention are as follows: While cutting the first substrate and the second substrate to form a preset shape, a first electrode reservation position is reserved on the first conductive layer of the first substrate, and a second electrode reservation position is reserved on the second conductive layer of the second substrate. Then, by bonding and curing the first conductive layer of the first substrate and the adhesive layer of the second substrate, a pre-composite film structure is formed. The aforementioned first electrode reservation position and second electrode reservation position are respectively left on the pre-composite film structure. The first electrode and the second electrode can be directly formed on the first electrode reservation position and the second electrode reservation position, respectively. There is no need to perform half-cutting of the dimming film to lead out the first electrode and the second electrode. This can avoid quality problems such as damage to the conductive film caused by half-cutting and poor visibility caused by dust generated by cutting. Moreover, it avoids safety problems such as potential explosion points and short circuit risks caused by dust generated by cutting, effectively improving the quality and reliability of the dimming film.

[0022] Furthermore, the invention avoids the problems of poor zoning effect and low operability in the post-processing of existing dimming films. By bonding the first substrate and the second substrate to form the dimming film, the invention makes the post-processing of the dimming film more flexible. The specific composition and zoning effect of the dimming film can be transferred from the dimming film material manufacturer to the dimming film and dimmable glass manufacturers for control, which can better control the quality of the product and meet the needs for complex and diversified zoning patterns on the dimming film, thus better meeting market demands. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings: The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of the invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely illustrative to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, guided by the teachings of this invention, can select various possible shapes and proportions to implement the invention according to specific circumstances.

[0024] Figure 1 A cross-sectional view of the material used to fabricate dimming films in the prior art; Figure 2 A flowchart illustrating the existing process for fabricating dimming films; Figure 3 This is a cross-sectional view of the first substrate in the dimming film of the present invention; Figure 4 This is a cross-sectional view of the second substrate in the dimming film of the present invention; Figure 5 This is one of the schematic diagrams showing the bonding positions of the first substrate and the second substrate in the dimming film of the present invention; Figure 6 This is one of the flowcharts for the dimming film manufacturing method of the present invention; Figure 7 This is a cross-sectional view of the dimming film of the present invention in its forming state; Figure 8 A cross-sectional view of the second conductive layer and the dimming functional layer stacked in the second substrate of the present invention; Figure 9 This is a cross-sectional view of the adhesive layer separately provided in the second substrate of the present invention; Figure 10 This is the second flowchart of the dimming film manufacturing method of the present invention; Figure 11 This is a second schematic diagram showing the bonding position of the first substrate and the second substrate in the dimming film of the present invention.

[0025] The reference numerals in the background art are: 100, Liquid crystal layer; 200, Conductive layer; 300, PET substrate layer; 400, Protective film.

[0026] The reference numerals in the accompanying drawings of this invention are: 1. First substrate; 101. First conductive layer; 102. First substrate layer; 103. Protective film; 2. Second substrate; 201. Second conductive layer; 202. Dimming function layer; 203. Adhesive layer; 204. Second substrate layer; 205. Release film; 3. First electrode; 4. Second electrode; 5. FPC; 6. Protective film; 7. Release film. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0028] It should be noted that when an element is referred to as being "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] Implementation Method 1

[0031] like Figures 3 to 6 As shown, the present invention provides a method for manufacturing a dimming film, wherein the dimming film is formed by laminating a first substrate 1 and a second substrate 2 together, wherein the first substrate 1 (i.e., material A) and the second substrate 2 (i.e., material B) are both pre-formed rolls, the first substrate 1 having at least a first conductive layer 101; and the second substrate 2 having at least a second conductive layer 201, a dimming functional layer 202 and an adhesive layer 203 arranged sequentially and in layers.

[0032] The method for manufacturing this dimming film includes the following steps: Step S1: Cut the first substrate 1 according to the preset shape, and form the first electrode reservation position on the first conductive layer 101; Step S2: Cut the second substrate 2 according to the preset shape, and form the second electrode reservation position on the second conductive layer 201; Step S3: The first substrate 1 and the second substrate 2 are bonded together, that is, the first conductive layer 101 and the adhesive layer 203 are bonded together to form a pre-composite film structure. Step S4: Set a conductive structure at the reserved position of the first electrode to form the first electrode 3; set a conductive structure at the reserved position of the second electrode to form the second electrode 4. Step S5: Seal and cure the gap area formed by the edge of the first electrode 3 and the edge of the first substrate 1 and the edge of the second substrate 2; Step S6: Seal and cure the gap area formed by the edge of the second electrode 4 and the edge of the first substrate 1 and the edge of the second substrate 2; Step S7: Set electrical connection structures at the first electrode 3 and the second electrode 4 respectively; Step S8: After the test is completed, the dimming film is manufactured.

[0033] The order of steps S1 and S2 can be interchanged. For example, the first substrate 1 can be cut into shape first, and then the second substrate 2 can be cut into shape according to the product requirements. Alternatively, the second substrate 2 can be cut into shape first, and then the first substrate 1 can be cut into shape according to the product requirements.

[0034] The order of steps S5 and S6 can be interchanged. For example, the gaps between the first electrode 3 and the edges of the first substrate 1 and the second substrate 2 can be sealed and cured first, and then the gaps between the second electrode 4 and the edges of the first substrate 1 and the second substrate 2 can be sealed and cured. Alternatively, the gaps between the second electrode 4 and the edges of the first substrate 1 and the second substrate 2 can be sealed and cured first, and then the gaps between the first electrode 3 and the edges of the first substrate 1 and the second substrate 2 can be sealed and cured.

[0035] In this process, steps S4, S5, and S6 can be completed before step S3. Specifically, the first electrode 3 and the second electrode 4 are first fabricated, followed by sealing and curing, and then the first substrate 1 and the second substrate 2 are bonded together. Alternatively, if high precision is required in the product's shape and bonding dimensions, the shape can be precisely cut again after the first substrate 1 and the second substrate 2 are bonded together to ensure that the product's precision requirements are met.

[0036] In this invention, while cutting the first substrate 1 and the second substrate 2 to form a preset shape, a first electrode reservation position is reserved on the first conductive layer 101 of the first substrate 1, and a second electrode reservation position is reserved on the second conductive layer 201 of the second substrate 2. Then, by bonding and curing the first conductive layer 101 of the first substrate 1 and the adhesive layer of the second substrate 2, a pre-composite film structure is formed. The aforementioned first electrode reservation position and second electrode reservation position are respectively retained on the pre-composite film structure. The first electrode 3 and the second electrode 4 can be directly formed on the first electrode reservation position and the second electrode reservation position, respectively. There is no need to perform half-cutting on the dimming film to lead out the first electrode 3 and the second electrode 4. This avoids quality problems such as damage to the conductive film caused by half-cutting and poor visibility caused by dust generated by cutting. It also avoids safety problems such as potential explosion points and short circuit risks caused by dust generated by cutting, effectively improving the quality and reliability of the dimming film.

[0037] In some alternative embodiments of the present invention, the first conductive layer 101 and the second conductive layer 201 may be formed using, but not limited to, ITO (indium tin oxide) in conjunction with a metal mesh.

[0038] In some alternative embodiments of the present invention, the dimming functional layer 202 may be fabricated using, but is not limited to, SPD materials, polymer EC materials, or PDLC (polymer dispersed liquid crystal).

[0039] In some alternative embodiments of the present invention, the adhesive layer 203 may be made of, but is not limited to, OCA material, SCA material, etc.

[0040] In an optional embodiment of the present invention, after step S3 above: the pre-composite film structure is subjected to degassing treatment to avoid residual bubbles affecting the quality of the dimming film.

[0041] In an optional embodiment of the present invention, such as Figure 6 As shown, the first electrode pre-reserved position is located at or near the edge of the first conductive layer 101; the second electrode pre-reserved position is located at or near the edge of the second conductive layer 201, so that the first electrode 3 and the second electrode 4 can be led out from the first conductive layer 101 and the second conductive layer 201, respectively. When the first conductive layer 101 and the adhesive layer 203 are bonded together, the first substrate 1 and the second substrate 2 are bonded together to form a pre-composite film structure. At this time, the first electrode pre-reserved position and the second electrode pre-reserved position are located on both sides of the pre-composite film structure, thereby providing positional convenience for the fabrication of the first electrode 3 and the second electrode 4 and the setting of the electrical connection structure.

[0042] In this embodiment, in step S7 above, electrical connection structures are provided at the first electrode 3 and the second electrode 4 respectively, specifically by binding FPC (flexible circuit board) 5 at the first electrode 3 and the second electrode 4 respectively.

[0043] Furthermore, such as Figure 5 and Figure 6 As shown, in the misaligned bonding state of the first conductive layer 101 and the adhesive layer 203, the first electrode reserved position and the second electrode reserved position are respectively located at positions offset from the first substrate 1 and the second substrate 2. The width h of the offset between the first substrate 1 and the second substrate 2 can be, but is not limited to, 1 mm to 50 mm.

[0044] In the bonding process between the first substrate 1 and the second substrate 2, this invention allows for bonding operations to be performed in an existing workshop with a bonding environment using existing bonding equipment, thereby forming a pre-composite film structure with reserved positions for the first and second electrodes. The specific environment for the bonding operation and the specific bonding equipment used are not limited herein.

[0045] In an optional embodiment of the present invention, during the cutting of the first substrate 1 in step S1, a first target position is reserved; and / or, during the cutting of the second substrate 2 in step S2, a second target position is reserved. The first and second target positions serve as precision markers, thereby ensuring accurate alignment in subsequent production processes and the manufacturing of dimming glass (e.g., meeting the requirements for precise alignment of the subsequent production marking).

[0046] In an optional embodiment of the present invention, in step S1 above, after the first substrate 1 is cut to form a preset shape, the first substrate 1 is partitioned according to the pre-designed product. After partitioning, the surface of the first substrate 1 is cleaned by washing with water. Of course, the surface of the first substrate 1 can also be cleaned by attaching a protective film with a certain viscosity to remove dust and foreign matter.

[0047] Similarly, in step S2 above, after the second substrate 2 is cut to form a preset shape, the surface of the second substrate 2 is cleaned by washing with water; of course, the surface of the second substrate 2 can also be cleaned by attaching a protective film with a certain viscosity to remove dust and foreign matter.

[0048] The dimming film manufacturing method of the present invention avoids the problems of poor zoning effect and low operability in the post-processing of existing dimming films. By bonding the first substrate 1 and the second substrate 2 to form the dimming film, the post-processing of the dimming film is more flexible. The specific composition structure and zoning effect of the dimming film can be transferred from the dimming film material manufacturer to the dimming film and dimmable glass manufacturers for control, which can better control the quality of the product and meet the needs of complex and diversified zoning patterns on the dimming film, thus better meeting market demands.

[0049] In an optional embodiment of the present invention, in step S4 above, setting conductive structures at the first electrode reserved position and the second electrode reserved position can specifically be done by: forming a first electrode 3 at the first electrode reserved position and a second electrode 4 at the second electrode reserved position by means of applying silver paste and curing it or by means of setting conductive materials. When forming the electrodes by means of setting conductive materials, the conductive material can be, but is not limited to, conductive tape.

[0050] In this invention, the conductive layer located in the area where the first electrode 3 and the second electrode 4 are located needs to be cleaned before being coated with silver paste and cured, or conductive tape is set as an electrode, and then sealed and cured. Then, FPC5 is bound to the positions of the first electrode 3 and the second electrode 4 respectively, and various tests (such as optical performance, electrical performance, appearance quality, reliability, etc.) are performed to complete the production of the dimming film.

[0051] In another optional embodiment of the invention, such as Figures 8 to 11 As shown, the second substrate 2 is formed by bonding two parts (i.e., material B and material C). The second substrate 2 includes an independently disposed adhesive layer 203 and a stacked second conductive layer 201 and a dimming functional layer 202. At this time, before performing the above step S1, the second substrate 2 needs to be bonded together. That is, the dimming film manufacturing method also includes: bonding the adhesive layer 203 and the dimming functional layer 202 to form the second substrate 2.

[0052] like Figure 10 As shown, the first substrate 1 and the second substrate 2 are cut according to a preset shape, and a first electrode pre-reserved position is formed on the first conductive layer 101. Then, during the bonding process of the second substrate 2, the second electrode pre-reserved position is directly reserved when the adhesive layer 203 is bonded to the dimming functional layer 202, without further cutting. Then, the dimming film is formed according to the above steps S3 to S8. Wherein, as Figure 11 As shown, when the first substrate 1 and the second substrate 2 are bonded together, the offset width h between them can still be, but is not limited to, 1mm to 50mm. In this embodiment, the adhesive layer 203 is set separately, and during manufacturing, the adhesive layer 203 is bonded to the second conductive layer 201 and the dimming functional layer 202 to form the second substrate 2. Of course, the separately set adhesive layer 203 can also be bonded to the first conductive layer 101 of the first substrate 1 first, and then the second conductive layer 201 and the dimming functional layer 202 can be bonded to the adhesive layer 203. Compared with the directly formed second substrate 2, this embodiment requires an additional bonding process, but it has better flexibility. The order of the adhesive layer 203 can be selected according to the actual situation. That is, the adhesive layer 203 can be bonded to the first conductive layer 101 of the first substrate 1, or the adhesive layer 203 can be bonded to the dimming functional layer 202 in the second substrate 2.

[0053] The main difference between the dimming film manufacturing method of the present invention and the existing dimming film manufacturing methods is as follows: 1) Difference in raw materials: Existing materials for making dimming films are multi-layer composites, which are fully or partially cut to form electrodes; while the present invention uses multiple substrates, which are cut and electrode positions are reserved before lamination. The method of forming dimming films can be controlled by the manufacturer, the source of raw materials is wider, and the degree of restriction on raw materials is greatly reduced, greatly improving the flexibility of dimming film production.

[0054] 2) Difference in electrode fabrication methods: Existing processes fabricate electrodes by laser half-cutting on the basis of multi-layer composite materials; while the present invention fabricates electrodes by bonding multiple substrates. Its advantages are that it avoids the damage that laser half-cutting may cause to the conductive layer, as well as the problems caused by dust generated by laser half-cutting, such as poor zoning visibility, explosion points, and short circuit risks.

[0055] 3) Differences in partitioning: Existing dimming films partition by using a laser to penetrate the substrate and act on the conductive layer. This method results in a low success rate for partitioning the conductive layer, and excessive partitioning energy may damage another conductive layer. In addition, because the laser partitioning is performed in a sealed environment, the visibility of the circuitry is poor after partitioning. This application uses a bonding method for partitioning, which effectively avoids the above problems. Since different conductive layers are located on different substrates before bonding, the partitioning process can be directly applied to the surface of one conductive layer. Furthermore, the surface of the conductive layer can be cleaned after partitioning, avoiding the possibility of laser partitioning damaging another conductive layer.

[0056] The features and advantages of the method for manufacturing the dimming film of the present invention are as follows: By pre-fabricating electrode pre-positions and then performing the bonding process, the dimming film no longer needs to be half-cut to bring out the first electrode 3 and the second electrode 4. This avoids quality problems caused by half-cutting, such as damage to the conductive film and poor visibility due to dust generated during cutting. It also avoids safety issues such as potential explosion points and short circuit risks caused by dust generated during cutting, effectively improving the quality and reliability of the dimming film. Furthermore, it avoids the problems of poor zoning effects and low operability in the post-processing of existing dimming films. The invention uses the bonding of the first substrate 1 and the second substrate 2 to form the dimming film, making the post-processing of the dimming film more flexible. The specific composition and zoning pattern of the dimming film can be transferred from the dimming film material manufacturer to the dimming film and smart glass manufacturers for control, allowing for better quality control and meeting the needs for more complex and diverse zoning patterns on the dimming film, thus better meeting market demands.

[0057] Implementation Method 2

[0058] like Figures 3 to 11 As shown, the present invention provides a dimming film, which is formed using the dimming film manufacturing method described above. The dimming film includes a first substrate 1 and a second substrate 2. The first substrate 1 has at least a first conductive layer 101, on which a first electrode pre-reservation position is formed. The second substrate 2 has at least a second conductive layer 201, a dimming functional layer 202, and an adhesive layer 203 arranged sequentially and in layers, on which a second electrode pre-reservation position is formed. During the forming process of the dimming film, the first conductive layer 101 and the adhesive layer 203 are bonded together, thereby bonding and fixing the first substrate 1 and the second substrate 2 through the adhesive layer 203, so that the first substrate 1 and the second substrate 2 cooperate to form a pre-composite film structure. A first electrode 3 is formed at the first electrode pre-reservation position by means of coating silver paste and curing or by means of setting conductive material. A second electrode 4 is formed at the second electrode pre-reservation position by means of coating silver paste and curing or by means of setting conductive material.

[0059] Furthermore, such as Figures 5 to 7 As shown, the first conductive layer 101 and the adhesive layer 203 are misaligned and bonded, that is, when the first substrate 1 and the second substrate 2 are bonded, the edge of the first substrate 1 and the edge of the second substrate 2 are misaligned, so that the first electrode reserved position and the second electrode reserved position can be located on both sides of the pre-composite film structure, and the first electrode reserved position can be formed at or near the edge of the first conductive layer 101, while the second electrode reserved position can be formed at or near the edge of the second conductive layer 201. Subsequently, the first electrode 3 and the second electrode 4 can be led out from both sides of the dimming film to avoid short circuits and ensure the stable operation of the dimming film.

[0060] In an optional embodiment of the present invention, such as Figure 3 and Figure 7 As shown, the first substrate 1 further includes a first substrate layer 102. The first conductive layer 101 and the first substrate layer 102 are stacked together. The first substrate layer 102 serves as a carrier for the first conductive layer 101, providing support and protection for the first conductive layer 101. The first substrate layer 102 may be, but is not limited to, a PET substrate.

[0061] Furthermore, such as Figure 3 As shown, when the first substrate 1 and the second substrate 2 are not bonded, a protective film 6 can be laminated on the first conductive layer 101 on the side opposite to the first substrate layer 102, and also on the first substrate layer 102 on the side opposite to the first conductive layer 101. The protective film 6 can be peeled off during the installation of the dimming film. The protective film 6 provides scratch and dust protection for the first substrate 1.

[0062] In an optional embodiment of the present invention, such as Figure 4 and Figure 8 As shown, the second substrate 2 further includes a second substrate layer 204, which is stacked on the second conductive layer 201 and located on the opposite side from the dimming functional layer 202. The second substrate layer 204 serves as a carrier for the second conductive layer 201 and the dimming functional layer 202, providing support and protection for them. The second substrate layer 204 may be, but is not limited to, a PET substrate.

[0063] Furthermore, such as Figure 4 As shown, when the first substrate 1 and the second substrate 2 are not bonded, a release film 7 can be laminated on the adhesive layer 203 on the side opposite to the dimming functional layer 202, and a protective film 6 can be laminated on the second substrate layer 204 on the side opposite to the second conductive layer 201. The release film 7 and the protective film 6 can prevent the second substrate 2 from scratching and dusting, and the release film 7 can temporarily support and cover the adhesive layer 203 and the dimming functional layer 202. When it is necessary to bond the first substrate 1 and the second substrate 2, the release film 7 can be easily peeled off, which is convenient for the production of the dimming film; in addition, the protective film 6 can also be peeled off when installing the dimming film.

[0064] In an optional embodiment of the present invention, such as Figure 7 As shown, when the first substrate 1 and the second substrate 2 are in a bonded state, a protective film 6 can be stacked on the first substrate layer 102 on the side opposite to the first conductive layer 101, and a protective film 6 can be stacked on the second substrate layer 204 on the side opposite to the second conductive layer 201. Each protective film 6 can provide support and protection for the dimming film. By combining the two protective films 6, they are attached to the outermost two surfaces of the dimming film, thus protecting the finished dimming film from physical damage and chemical contamination such as scratches, contamination, and impacts during subsequent processing, transportation, storage, and installation.

[0065] In an optional embodiment of the present invention, such as Figures 8 to 11As shown, the second substrate 2 is formed by bonding two parts: an independently disposed adhesive layer 203 and a stacked second conductive layer 201 and a dimming functional layer 202. When the first substrate 1 and the second substrate 2 are not bonded, release films 7 are stacked on both sides of the adhesive layer 203, and on the dimming functional layer 202 opposite to the second conductive layer 201. The release films 7 temporarily support and cover the independent adhesive layer 203, as well as the stacked second conductive layer 201 and dimming functional layer 202. When it is necessary to form the second substrate 2 (i.e., bond the adhesive layer 203 and the dimming functional layer 202), it is convenient to peel off the outermost release film 7 to form the second substrate 2.

[0066] The dimming film of the present invention is formed by the dimming film manufacturing method described above. During the manufacturing process, it has the characteristics and advantages described in the dimming film manufacturing method described above, which will not be repeated here.

[0067] It should be noted that in the description of this application, the terms "first," "second," etc., are used only for descriptive purposes and to distinguish similar objects; there is no order between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more.

[0068] The various embodiments described in this specification are presented in a progressive manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0069] The above are merely a few embodiments of the present invention. Although the embodiments disclosed in the present invention are as described above, the content is only for the purpose of facilitating understanding of the present invention and is not intended to limit the present invention. Any equivalent changes and modifications made by those skilled in the art without departing from the concept and principles of the present invention should fall within the scope of protection of the present invention.

Claims

1. A method for manufacturing a dimming film, characterized in that, The dimming film manufacturing method involves at least laminating a first substrate and a second substrate together to form the dimming film. The first substrate has at least a first conductive layer; The second substrate has at least a second conductive layer, a dimming functional layer, and an adhesive layer arranged sequentially and in a stacked manner; The method for manufacturing the dimming film includes the following steps: Cut the first substrate and form a first electrode pre-reserved position on the first conductive layer; Cut the second substrate and form a second electrode pre-reserved position on the second conductive layer; The first conductive layer is bonded to the adhesive layer to form a pre-composite film structure; The first electrode and the second electrode are respectively fabricated at the first electrode reserved position and the second electrode reserved position.

2. The method for manufacturing a dimming film as described in claim 1, characterized in that, The first electrode pre-reserved position is located at or near the edge of the first conductive layer; The second electrode pre-reserved position is located at or near the edge of the second conductive layer; When the first conductive layer and the adhesive layer are bonded together, the first electrode reserved position and the second electrode reserved position are located on both sides of the pre-composite film structure.

3. The method for manufacturing a dimming film as described in claim 2, characterized in that, The first conductive layer is misaligned with the adhesive layer, and the first electrode reserved position and the second electrode reserved position are respectively located at positions offset from the first substrate and the second substrate.

4. The method for manufacturing a dimming film as described in claim 1, characterized in that, The first substrate is cut to form a preset shape, and then the first substrate is sequentially partitioned and surface cleaned. And / or, the second substrate is cut to form a predetermined shape, and then the surface of the second substrate is cleaned.

5. The method for manufacturing a dimming film as described in claim 4, characterized in that, Conductive structures are provided at the first electrode reserved position and the second electrode reserved position respectively to form the first electrode and the second electrode respectively.

6. The method for manufacturing a dimming film as described in claim 1, characterized in that, After forming the first electrode and the second electrode, the process further includes: The gap area formed by the first electrode, the first substrate, and the second substrate is sealed and cured. The gap area formed by the second electrode, the first substrate, and the second substrate is sealed and cured. Electrical connection structures are provided at the first electrode and the second electrode, respectively; After the testing is completed, the dimming film is manufactured.

7. The method for manufacturing a dimming film as described in claim 1, characterized in that, The second substrate includes the independently disposed adhesive layer and the stacked second conductive layer and the dimming functional layer; The dimming film manufacturing method further includes: bonding the adhesive layer to the dimming functional layer to form the second substrate.

8. A dimming film, wherein the dimming film is formed using the dimming film manufacturing method according to any one of claims 1 to 7, characterized in that, The dimming film includes: A first substrate, the first substrate having at least a first conductive layer, on which a first electrode reservation is formed; The second substrate has at least a second conductive layer, a dimming functional layer and an adhesive layer arranged sequentially and stacked, and a second electrode reservation is formed on the second conductive layer; The first conductive layer is bonded to the adhesive layer so that the first substrate and the second substrate cooperate to form a pre-composite film structure, and the first electrode and the second electrode are respectively provided at the first electrode reserved position and the second electrode reserved position.

9. The dimming film as described in claim 8, characterized in that, The first conductive layer is misaligned with the adhesive layer. The first electrode pre-reserved position and the second electrode pre-reserved position are respectively located on both sides of the pre-composite film structure. The first electrode pre-reserved position is located at the edge or near the edge of the first conductive layer, and the second electrode pre-reserved position is located at the edge or near the edge of the second conductive layer.

10. The dimming film as described in claim 8, characterized in that, The first substrate further includes a first substrate layer, wherein the first conductive layer is stacked with the first substrate layer; The first substrate and the second substrate are not bonded together, and a protective film is stacked on the first conductive layer on the other side opposite to the first substrate layer.

11. The dimming film as described in claim 10, characterized in that, The second substrate further includes a second substrate layer, which is stacked on the second conductive layer and located on the opposite side of the dimming functional layer; The first substrate and the second substrate are not bonded together, and a release film is stacked on the adhesive layer on the other side opposite to the dimming functional layer.

12. The dimming film as described in claim 11, characterized in that, The first substrate and the second substrate are in a bonded state, and a protective film is stacked on the first substrate layer on the side opposite to the first conductive layer; and / or, a protective film is stacked on the second substrate layer on the side opposite to the second conductive layer.

13. The dimming film as described in claim 8, characterized in that, The first substrate and the second substrate are in an unbonded state, and the second substrate includes: The adhesive layer is set independently, and release films are stacked on both sides of the adhesive layer; A second conductive layer and a dimming functional layer are stacked together, and a release film is stacked on the dimming functional layer on the other side opposite to the second conductive layer.

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