Multi-chamber temperature control device and control method for environmental chamber

Abstract

The invention discloses an environmental chamber multi-chamber temperature control device and method. The environmental chamber multi-chamber temperature control device comprises a placing frame, and T-shaped sliding grooves are formed in the front side and the rear side of the right side of the placing frame. By adopting the T-shaped sliding grooves and the T-shaped sliding strips between the placement frame and the environment cabin shells, flexible sliding installation and disassembly of the multiple environment cabin shells are achieved, the number and layout of the cabin bodies can be rapidly adjusted according to experiment requirements, and the use flexibility of the device is remarkably improved. An electric heating plate arranged in the temperature control cavity and a semiconductor chilling plate form a two-way temperature adjusting system which is matched with a rotating disc connecting rod mechanism driven by a motor to drive a stirring frame to slide back and forth in a reciprocating mode, heat-conducting media in the temperature control cavity can be effectively stirred, and local temperature gathering is avoided. The storage cavity forms an air internal circulation system through the air outlet pipe, the air inlet pipe, the conveying pipe and the built-in fan, so that air in the storage cavity flows, the environment temperature in the storage cavity is more uniform, and the device has the advantage of being accurate in temperature control.

Description

Technical Field

[0001] This invention relates to the field of environmental chamber temperature control technology, specifically to a multi-chamber temperature control device and control method for environmental chambers. Background Technology

[0002] Environmental chambers, as crucial devices capable of simulating diverse environmental conditions, are widely used in numerous fields, including modern scientific research, industrial production, and quality inspection. For example, the automotive industry requires testing the performance of automotive components under different temperature environments; the electronics industry needs to verify the reliability of electronic devices under various temperature conditions; and materials science studies the changes in the physical and chemical properties of materials under different temperature environments. With continuous technological advancements and increasingly stringent experimental requirements, multi-chamber environmental chambers, capable of simultaneously simulating multiple different temperature environments and meeting the need for testing multiple samples under varying temperature conditions, are gradually becoming a research and application hotspot.

[0003] Currently, most mainstream environmental chambers employ fixed installation structures for their heating and cooling modules, such as wrapping electric heating wires around the inside of the chamber wall or fixing semiconductor cooling chips to the corners of the chamber. This fixed layout reveals the following significant drawbacks in multi-chamber environments:

[0004] Poor temperature uniformity: Taking a 10m³ cabin as an example, the heating wire fixed at the top will cause a vertical temperature difference of 3-5℃ in the cabin. When multiple cabins are set up side by side, the heat radiation of adjacent cabins will also cause temperature interference between cabins, further aggravating the temperature gradient problem. The temperature difference between the area near the heating / cooling source and the area far away is obvious, which cannot meet the needs of independent and precise temperature control of multiple cabins.

[0005] Dynamic response lag: When rapid heating and cooling are required, the fixed temperature control module has difficulty in affecting the entire chamber space in a synchronous manner. Especially when multiple chambers are combined or the chamber size is large, the heat conduction efficiency of a single temperature control module is low, resulting in a temperature equilibrium time of up to several hours. This makes it unsuitable for scenarios where multiple samples are tested for dynamic temperature at the same time.

[0006] Local temperature extreme value problem: When performing high-power heating or deep cryogenic operations, temperature extreme values ​​are prone to occur in the area near the fixed module. In a multi-compartment environment, the temperature control requirements of each compartment are different. The traditional fixed layout cannot adjust the local temperature in a targeted manner, which leads to the distortion of sample test data and seriously affects the reliability of experimental results.

[0007] Insufficient flexibility in cabin layout: Existing multi-cabin environmental chambers are usually fixedly installed, making it impossible to quickly adjust the number or layout of cabins according to experimental needs. Furthermore, the temperature control systems of each cabin are independent of each other but lack a collaborative control mechanism, making it difficult to achieve precise synchronous control of the temperature of multiple cabins.

[0008] Therefore, there is an urgent need to design a multi-compartment temperature control device and method for environmental chambers that can solve the above problems. Through dynamic heat exchange, efficient circulation and intelligent regulation, it can achieve accurate and uniform temperature control in multi-compartment environments, and meet the needs of scientific research and industrial production for high-precision temperature environments. Summary of the Invention

[0009] To address the problems mentioned in the background art, the present invention aims to provide a multi-compartment temperature control device and method for an environmental chamber, which has the advantage of precise temperature control.

[0010] To achieve the above objectives, the present invention provides the following technical solution: a multi-compartment temperature control device for an environmental chamber, comprising a placement rack, wherein T-shaped grooves are provided on the front and rear sides of the right side of the placement rack, an environmental chamber shell is provided above the placement rack, and the number of environmental chamber shells is several, wherein T-shaped sliding strips are fixedly connected to the front and rear sides of the bottom of the environmental chamber shell, and the T-shaped grooves are slidably connected to the T-shaped sliding strips, the environmental chamber shell includes a storage cavity and a temperature control cavity, wherein electric heating plates are fixedly connected to both sides of the inner wall of the temperature control cavity, a stirring rack is slidably connected inside the temperature control cavity, a movable column is fixedly connected to the back of the stirring rack, the movable column is slidably connected to the environmental chamber shell, the back of the movable column extends to the back of the environmental chamber shell, and the back of the environmental chamber shell is open to the outside. A motor is fixedly connected to a bracket, and a turntable is fixedly connected to the output end of the motor. A connecting rod is rotatably connected to the surface of the turntable, and the end of the connecting rod away from the turntable is hinged to a movable column. Semiconductor cooling chips are fixedly connected to both sides inside the temperature control chamber. The cold end of the semiconductor cooling chip extends into the interior of the temperature control chamber, and the hot end of the semiconductor cooling chip extends to the back of the environmental chamber shell. Air outlet pipes are connected to both sides of the bottom back of the inner wall of the storage chamber, and air inlet pipes are connected to both sides of the top back of the inner wall of the storage chamber. A conveying pipe is connected to the surface of the air outlet pipe, and the end of the conveying pipe away from the air outlet pipe is connected to the air inlet pipe. A fan is fixedly connected to the interior of the air outlet pipe via a bracket. The backs of both the air outlet pipe and the air inlet pipe extend to the back of the environmental chamber shell.

[0011] As a preferred embodiment of the present invention, multiple evenly distributed support strips are fixedly connected to both sides of the inner wall of the storage cavity, and a bearing plate is provided on the top of the support strips, with ventilation holes opened on the top of the bearing plate.

[0012] As a preferred embodiment of the present invention, temperature detectors are fixedly connected to the top and bottom perimeters of the inner wall of the storage cavity.

[0013] As a preferred embodiment of the present invention, both sides of the front of the environmental chamber are hinged with insulated doors, the surface of the insulated doors is provided with observation windows, and the surface of the insulated doors is provided with handles.

[0014] As a preferred embodiment of the present invention, fixing blocks are fixedly connected to the front and rear sides of the bottom of both sides of the environmental chamber shell. A threaded rod is threadedly connected to the inside of the fixing block. A brake block is rotatably connected to the bottom of the threaded rod. The bottom of the brake block fits against the top of the placement frame. The top of the placement frame is roughened. A rotating handle is fixedly connected to the top of the threaded rod.

[0015] In a preferred embodiment of the present invention, the hot end of the semiconductor cooling chip extends to the back of the environmental chamber shell and is fixedly connected to a heat dissipation fin. Both sides of the back of the environmental chamber shell are fixedly connected to a heat dissipation fan via a bracket. The heat dissipation fan is located on the back of the heat dissipation fin. Dustproof nets are fixedly connected inside the air inlet pipe and the air outlet pipe.

[0016] As a preferred embodiment of the present invention, the surface of the environmental chamber shell is provided with a heat insulation layer, the heat insulation layer includes a first heat insulation layer disposed on the surface of the environmental chamber shell, a second heat insulation layer disposed on the surface of the first heat insulation layer, and a third heat insulation layer disposed on the surface of the second heat insulation layer.

[0017] A control method for a multi-compartment temperature control device for an environmental chamber includes the following steps:

[0018] S1: When the multi-compartment temperature control device of the environmental chamber is started, the central control system first initializes and calibrates the temperature detectors in each environmental chamber shell to ensure the accuracy of temperature monitoring data. Subsequently, the operator sets the target temperature for the storage cavity of each environmental chamber through the control panel. After receiving the setting command, the central control system compares the target temperature of each chamber with the actual temperature in the current storage cavity in real time. Based on the temperature difference, it calculates the required temperature adjustment amount and then controls the electric heating plate or semiconductor cooling chip in the temperature control cavity to start working. During the temperature adjustment process, the heat generated by the electric heating plate or the heat absorbed by the semiconductor cooling chip first acts on the heat transfer oil in the temperature control cavity. At this time, the motor drives the turntable to rotate, which drives the movable column to move back and forth through the connecting rod. This causes the stirring frame to continuously stir the heat transfer oil in the temperature control cavity, so as to promote the uniform distribution of heat in the heat transfer oil and avoid local excessively high or low temperatures. At the same time, the fan in the storage cavity starts, and draws the air from the bottom of the storage cavity through the exhaust pipe, delivers it to the intake pipe through the delivery pipe, and then sends it back to the top of the storage cavity from the intake pipe, forming an internal gas circulation system. This allows the air in the storage cavity to transfer heat to the temperature control cavity during the flow process, thereby achieving uniform temperature regulation in the storage cavity.

[0019] S2: Throughout the temperature control process, temperature sensors around the top and bottom of the storage cavity continuously monitor the temperature of each area in real time and transmit the monitoring data to the central control system. The central control system analyzes and processes this data to calculate the temperature distribution and average temperature within the storage cavity. If a deviation is detected in the temperature of a certain area from the target temperature, the power of the electric heating plate or the operating status of the thermoelectric cooler will be adjusted in a timely manner, while the fan speed will be adjusted to optimize gas circulation efficiency, so that the temperature of each area reaches the target value as quickly as possible. When the storage cavity temperature of a certain environmental chamber approaches the target temperature, the central control system will gradually reduce the operating power of the electric heating plate or the thermoelectric cooler, using a fine-tuning method to slowly bring the temperature closer to the set value, avoiding overshoot during temperature adjustment. Once the storage cavity temperature reaches the target temperature, the central control system will control the electric heating plate and the thermoelectric cooler to maintain operation at a lower power. Maintaining the operation of the fan and agitator ensures a stable temperature within the storage chamber through continuous gas circulation and heat transfer oil agitation, minimizing temperature fluctuations. Furthermore, the insulation layer on the environmental chamber shell effectively reduces heat exchange between the chamber and the outside environment, lowering energy loss and enabling the temperature control system to maintain a more stable temperature within the storage chamber. In the event of an emergency during temperature control, such as an abnormal rise or fall in temperature in a certain area, the central control system will immediately issue an alarm and automatically adjust the corresponding temperature control components, increasing the adjustment intensity to quickly restore temperature balance and ensure that the experimental samples are in a stable temperature environment. The entire temperature control process, through precise regulation by the central control system combined with the coordinated work of components such as the electric heating plate, semiconductor cooling chip, agitator, fan, and insulation layer, achieves precise temperature control across multiple compartments of the environmental chamber, ensuring the uniformity and stability of temperature within each compartment and meeting the high-precision temperature control requirements of scientific research, industrial production, and other fields.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] 1. This invention employs a T-shaped sliding groove and T-shaped sliding strip structure between the placement rack and the environmental chamber shell, enabling flexible sliding installation and disassembly of multiple environmental chamber shells. This allows for rapid adjustment of the number and layout of chambers according to experimental needs, significantly improving the device's operational flexibility. The electric heating plate and semiconductor cooling chip within the temperature control chamber form a bidirectional temperature regulation system. Combined with a motor-driven turntable linkage mechanism, this drives the stirring rack to slide back and forth, effectively agitating the heat-conducting medium, such as heat-conducting oil, within the temperature control chamber, promoting uniform heat diffusion and preventing localized temperature accumulation. The storage chamber forms an internal gas circulation system through an exhaust pipe, an intake pipe, a delivery pipe, and a built-in fan, ensuring airflow within the storage chamber and resulting in a more uniform environmental temperature. This dynamic agitation and circulating air design not only shortens the temperature equilibrium time within the chamber but also maintains synchronized temperature changes in different areas during heating and cooling processes, ensuring the sample is in a more uniform temperature environment. This effectively improves the accuracy of temperature control and the reliability of experimental data, giving the device the advantage of precise temperature control.

[0022] 2. This invention provides a stable support structure for the support plate by using multiple evenly distributed support strips on both sides of the inner wall of the storage cavity. The placement of the support plate can be flexibly adjusted according to the size and quantity of samples to meet the placement requirements of samples of different volumes and types. The vent holes at the top of the support plate break the obstruction of gas flow inherent in traditional flat plate structures, allowing the circulating airflow within the storage cavity to pass through the upper and lower surfaces of the support plate, avoiding localized airflow stagnation and temperature stratification caused by the support plate's obstruction. This design not only improves the stability of sample placement but also enhances the efficiency of gas circulation within the storage cavity, ensuring consistent temperature between the areas above and below the support plate, further optimizing the temperature uniformity within the chamber, and providing a more consistent testing environment for samples requiring multi-layer placement. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic cross-sectional view of the environmental cabin structure of the present invention from the left side;

[0025] Figure 3 This is a schematic diagram of the stirring frame structure of the present invention;

[0026] Figure 4 This is a schematic diagram of the bearing plate structure of the present invention;

[0027] Figure 5 This is a cross-sectional schematic diagram of the insulation layer structure of the present invention;

[0028] Figure 6 For the present invention Figure 1 Enlarged schematic diagram of the structure at point A in the middle.

[0029] In the diagram: 1. Placement rack; 2. Environmental chamber shell; 3. T-shaped slide bar; 4. Storage cavity; 5. Temperature control cavity; 6. Stirring rack; 7. Movable column; 8. Motor; 9. Turntable; 10. Connecting rod; 11. Semiconductor cooling chip; 12. Air outlet pipe; 13. Air inlet pipe; 14. Delivery pipe; 15. Insulated door; 16. Heat dissipation fins; 17. Radiator fan; 18. Insulation layer; 19. First insulation layer; 20. Second insulation layer; 21. Third insulation layer; 22. Support bar; 23. Bearing plate; 24. Fixing block; 25. Threaded rod; 26. Braking block. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] like Figures 1 to 6 As shown, a multi-compartment temperature control device and method for an environmental chamber includes a placement frame 1. T-shaped grooves are provided on the front and rear sides of the right side of the placement frame 1. An environmental chamber shell 2 is positioned above the placement frame 1. Several environmental chamber shells 2 are included. T-shaped sliding strips 3 are fixedly connected to the front and rear sides of the bottom of each environmental chamber shell 2. The T-shaped grooves and T-shaped sliding strips 3 are slidably connected. Each environmental chamber shell 2 includes a storage cavity 4 and a temperature control cavity 5. Electric heating plates are fixedly connected to both sides of the inner wall of the temperature control cavity 5. A stirring frame 6 is slidably connected inside the temperature control cavity 5. A movable column 7 is fixedly connected to the back of the stirring frame 6. The movable column 7 is slidably connected to the environmental chamber shell 2, and its back extends to the back of the environmental chamber shell 2. A motor 8 is fixedly connected to the back of the environmental chamber shell 2 via a bracket. A turntable 9 is fixedly connected to the output end of the motor 8. A connecting rod 10 is rotatably connected to the surface of the turntable 9. The end of the connecting rod 10 away from the turntable 9 is hinged to the movable column 7. Both sides of the temperature control cavity 5 are fixedly connected to a semiconductor cooling chip 11. The cold end of the semiconductor cooling chip 11 extends into the interior of the temperature control cavity 5, and the hot end of the semiconductor cooling chip 11 extends into the back of the environmental chamber shell 2. Both sides of the bottom back of the inner wall of the storage cavity 4 are connected to an air outlet pipe 12. Both sides of the top back of the inner wall of the storage cavity 4 are connected to an air inlet pipe 13. The surface of the air outlet pipe 12 is connected to a conveying pipe 14. The end of the conveying pipe 14 away from the air outlet pipe 12 is connected to the air inlet pipe 13. A fan is fixedly connected to the interior of the air outlet pipe 12 by a bracket. The backs of the air outlet pipe 12 and the air inlet pipe 13 both extend into the back of the environmental chamber shell 2. The T-shaped slide bar 3 slides left and right in the T-shaped slide groove. The movable column 7 slides back and forth inside the environmental chamber shell 2. A sealing ring is fixedly connected inside the environmental chamber shell 2. The inner wall of the sealing ring is in contact with the surface of the movable column 7. The interior of the temperature control cavity 5 is filled with heat-conducting oil. The stirring frame 6 slides back and forth during operation.

[0032] refer to Figure 4 Multiple evenly distributed support bars 22 are fixedly connected to both sides of the inner wall of the storage cavity 4. A bearing plate 23 is provided on the top of the support bar 22, and a ventilation hole is provided on the top of the bearing plate 23.

[0033] As a technical optimization of this invention, multiple evenly distributed support strips 22 arranged on both sides of the inner wall of the storage cavity 4 provide a stable support structure for the support plate 23. The placement position of the support plate 23 can be flexibly adjusted according to the sample size and quantity to meet the placement requirements of samples of different volumes and types. The vent holes on the top of the support plate 23 break the obstruction of gas flow by the traditional flat plate structure, allowing the circulating airflow in the storage cavity 4 to pass through the upper and lower surfaces of the support plate 23, avoiding local airflow stagnation and temperature stratification caused by the support plate 23 blocking the flow. This design not only improves the stability of sample placement but also enhances the efficiency of gas circulation in the storage cavity 4, ensuring that the temperature above and below the support plate 23 remains consistent, further optimizing the temperature uniformity within the chamber, and providing a more consistent testing environment for samples requiring multi-layer placement.

[0034] refer to Figure 4 Temperature detectors are fixedly connected to the top and bottom of the inner wall of storage cavity 4.

[0035] As a technical optimization of this invention, temperature detectors are fixedly connected to the top and bottom of the storage cavity 4, forming a comprehensive temperature monitoring network covering the upper and lower areas and corners of the cabin. An external central control system is installed on the device to analyze the data from the temperature detectors and calculate the average temperature inside the storage cavity 4. Compared to traditional single-point or localized temperature detection methods, this multi-location synchronous monitoring design can more accurately reflect the actual temperature distribution in different areas of the cabin. The control system can accurately determine whether there are localized temperature deviations based on the real-time data from each temperature detector and adjust the power of the electric heating plate, the operating status of the semiconductor cooling chip 11, or the fan speed accordingly to achieve dynamic correction of the temperature field.

[0036] refer to Figure 1 Both sides of the front of the environmental chamber hull 2 ​​are hinged with insulated doors 15. The surface of the insulated doors 15 is provided with observation windows and handles.

[0037] As a technical optimization of this invention, the heat-insulating doors 15, hinged on both sides of the front of the environmental chamber shell 2, employ a sealing design that matches the chamber structure. This effectively reduces heat exchange between the chamber and the outside environment, lowering energy loss during temperature control. The observation windows on the door surface are made of high-temperature resistant, high-transmittance materials, allowing researchers to observe the sample status in real time without opening the door, avoiding temperature fluctuations caused by frequent door opening and closing. The ergonomic design of the handle enhances the ease of door operation, enabling researchers to easily open and close the door. This combined design ensures both the thermal insulation performance of the chamber and the convenience of experimental observation, while reducing temperature changes inside the chamber due to improper operation, providing a reliable guarantee for long-term stable temperature control experiments.

[0038] refer to Figure 4 Fixed blocks 24 are fixedly connected to the front and rear sides of the bottom of both sides of the environmental chamber shell 2. Threaded rods 25 are threadedly connected inside the fixed blocks 24. Brake blocks 26 are rotatably connected to the bottom of the threaded rods 25. The bottom of the brake blocks 26 fits against the top of the placement rack 1. The top of the placement rack 1 is rough-surfaced. A rotating handle is fixedly connected to the top of the threaded rods 25.

[0039] As a technical optimization of this invention, a reliable chamber fixing structure is formed by the cooperation of the fixing blocks 24 on both sides of the bottom of the environmental chamber 2 with the threaded rod 25 and the braking block 26. By rotating the handle to drive the threaded rod 25 downward, the bottom of the braking block 26 is tightly fitted with the rough surface of the top of the placement frame 1, thereby increasing the friction force to firmly lock the environmental chamber 2 onto the placement frame 1. This design effectively solves the problem of accidental displacement that may occur after multiple chambers are slidably installed, and avoids problems such as twisting of the gas circulation pipeline and displacement of the temperature detector position caused by the sliding of the chamber. During the experiment, even if the device is subjected to slight vibration or external collision, the environmental chamber 2 can maintain a stable installation position, ensuring that the components of the temperature control system, such as the electric heating plate, the semiconductor cooling chip 11, and the fan, are always in the preset working state, further improving the stability of temperature control and the accuracy of experimental results.

[0040] refer to Figure 2 The hot end of the semiconductor cooling chip 11 extends to the back of the environmental chamber shell 2 and is fixedly connected to the heat dissipation fins 16. Both sides of the back of the environmental chamber shell 2 are fixedly connected to the heat dissipation fans 17 by brackets. The heat dissipation fans 17 are located on the back of the heat dissipation fins 16. Dustproof nets are fixedly connected inside the air inlet pipe 13 and the air outlet pipe 12.

[0041] As a technical optimization of this invention, the heat dissipation fins 16 on the hot end of the thermoelectric cooler 11 increase the contact area between the hot end and the air. Combined with the forced convection cooling of the cooling fan 17, this significantly improves the heat dissipation efficiency of the hot end of the thermoelectric cooler 11. This design allows the thermoelectric cooler 11 to transfer the heat absorbed by the cold end to the outside more efficiently, avoiding the decrease in cooling efficiency caused by heat accumulation at the hot end and extending the service life of the thermoelectric cooler 11. The dustproof nets fixedly connected inside the air inlet pipe 13 and the air outlet pipe 12 effectively intercept dust, particulate matter, and other impurities in the outside air, preventing them from entering the storage cavity 4 and affecting the heat exchange efficiency. By improving cooling efficiency and maintaining internal cleanliness, this structure not only reduces the maintenance frequency of the equipment but also ensures the long-term stability of the temperature control system, providing a reliable guarantee for high-precision, long-term temperature control experiments.

[0042] refer to Figure 5 The surface of the environmental chamber shell 2 is provided with a heat insulation layer 18, which includes a first heat insulation layer 19 disposed on the surface of the environmental chamber shell 2, a second heat insulation layer 20 disposed on the surface of the first heat insulation layer 19, and a third heat insulation layer 21 disposed on the surface of the second heat insulation layer 20.

[0043] As a technical optimization of this invention, a multi-layer composite insulation layer 18 is provided on the surface of the environmental chamber shell 2. The first insulation layer 19, the second insulation layer 20, and the third insulation layer 21 are made of different insulation materials. Through the synergistic effect of each layer, the overall insulation performance of the chamber is significantly enhanced. This multi-layer insulation design greatly reduces the amount of heat exchange between the chamber and the outside environment, allowing the temperature control system to maintain the set temperature without continuous high-power operation. This saves energy consumption, reduces the workload of the temperature control components, and extends the service life of the equipment. At the same time, the stable insulation performance of the chamber can also avoid the interference of changes in the external ambient temperature on the temperature field inside the chamber, further improving the accuracy and stability of temperature control. The first insulation layer 19 is made of aerogel felt, the second insulation layer 20 is made of rock wool, and the third insulation layer 21 is made of polyurethane foam.

[0044] refer to Figure 1 A control method for a multi-compartment temperature control device for an environmental chamber includes the following steps:

[0045] S1: When the multi-compartment temperature control device of the environmental chamber is activated, the central control system first initializes and calibrates the temperature detectors in each environmental chamber shell 2 to ensure the accuracy of temperature monitoring data. Subsequently, the operator sets the target temperature for the storage cavity 4 of each environmental chamber shell 2 via the control panel. After receiving the setting command, the central control system compares the target temperature of each chamber with the actual temperature in the current storage cavity 4 in real time, calculates the required temperature adjustment based on the temperature difference, and then controls the electric heating plate or semiconductor cooling chip 11 in the temperature control cavity 5 to start working. During the temperature adjustment process, the heat generated by the electric heating plate or absorbed by the semiconductor cooling chip 11 first acts on the heat transfer oil in the temperature control cavity 5. At this time, the motor 8 drives the turntable 9 to rotate, through... The connecting rod 10 drives the movable column 7 to reciprocate back and forth, thereby causing the stirring frame 6 to continuously stir the heat transfer oil in the temperature control chamber 5, promoting the uniform distribution of heat in the heat transfer oil and avoiding local overheating or underheating. At the same time, the fan in the storage chamber 4 starts, drawing air from the bottom of the storage chamber 4 through the air outlet pipe 12, conveying it to the air inlet pipe 13 through the conveying pipe 14, and then sending it back to the top of the storage chamber 4 from the air inlet pipe 13, forming an internal gas circulation system. This allows the air in the storage chamber 4 to transfer heat to the temperature control chamber 5 during the flow process, thereby achieving uniform temperature regulation in the storage chamber 4.

[0046] S2: Throughout the temperature control process, temperature sensors around the top and bottom of the inner wall of storage cavity 4 continuously monitor the temperature of each area in real time and transmit the monitoring data to the central control system. The central control system analyzes and processes this data to calculate the temperature distribution and average temperature within storage cavity 4. If a deviation is detected between the temperature of a certain area and the target temperature, the power of the electric heating plate or the working state of the semiconductor cooling chip 11 will be adjusted in a timely manner, while the fan speed will be adjusted to optimize gas circulation efficiency, so that the temperature of each area reaches the target value as quickly as possible. When the temperature of storage cavity 4 in a certain environmental chamber 2 approaches the target temperature, the central control system will gradually reduce the working power of the electric heating plate or the semiconductor cooling chip 11, using a fine-tuning method to slowly bring the temperature closer to the set value, avoiding overshoot during temperature adjustment. Once the temperature of storage cavity 4 reaches the target temperature, the central control system will control the electric heating plate and the semiconductor cooling chip 11 to maintain operation at a lower power. By maintaining the operation of the fan and agitator 6, the temperature inside the storage chamber 4 is kept stable through continuous gas circulation and agitation of the heat transfer oil, reducing temperature fluctuations. In addition, the insulation layer 18 on the surface of the environmental chamber shell 2 can effectively reduce heat exchange between the chamber and the outside, reduce energy loss, and enable the temperature control system to maintain the temperature inside the storage chamber 4 more stably. If an emergency occurs during the temperature control process, such as an abnormal rise or fall in temperature in a certain area, the central control system will immediately issue an alarm and automatically adjust the corresponding temperature control components to increase the adjustment force to quickly restore temperature balance and ensure that the experimental sample is in a stable temperature environment. The entire temperature control process, through the precise regulation of the central control system and the coordinated work of components such as the electric heating plate, semiconductor cooling chip 11, agitator 6, fan, and insulation layer 18, achieves precise temperature control of multiple chambers in the environmental chamber, ensuring the uniformity and stability of temperature in each chamber and meeting the needs of scientific research, industrial production and other fields for high-precision temperature control.

[0047] The working principle and usage process of this invention are as follows: When the multi-compartment temperature control device for the environmental chamber is activated, the central control system first initializes and calibrates the temperature detectors inside each environmental chamber shell 2 to ensure the accuracy of the temperature monitoring data. Subsequently, the operator sets the target temperature for the storage cavity 4 of each environmental chamber shell 2 via the control panel. After receiving the setting command, the central control system compares the target temperature of each chamber with the actual temperature in the current storage cavity 4 in real time, calculates the required temperature adjustment amount based on the temperature difference, and then controls the electric heating plate or semiconductor cooling chip 11 in the temperature control cavity 5 to start working. During the temperature adjustment process, the heat generated by the electric heating plate or absorbed by the semiconductor cooling chip 11 first acts on the heat transfer oil in the temperature control cavity 5. At this time, the motor 8 drives the turntable 9 to rotate, through... The connecting rod 10 drives the movable column 7 to reciprocate back and forth, thereby causing the stirring frame 6 to continuously stir the heat transfer oil in the temperature control chamber 5, promoting the uniform distribution of heat in the heat transfer oil and avoiding local overheating or underheating. At the same time, the fan in the storage chamber 4 starts, drawing air from the bottom of the storage chamber 4 through the air outlet pipe 12, conveying it to the air inlet pipe 13 through the conveying pipe 14, and then sending it back to the top of the storage chamber 4 from the air inlet pipe 13, forming an internal gas circulation system. This allows the air in the storage chamber 4 to transfer heat to the temperature control chamber 5 during the flow process, thereby achieving uniform temperature regulation in the storage chamber 4.

[0048] Throughout the temperature control process, temperature sensors around the top and bottom of the inner wall of storage cavity 4 continuously monitor the temperature of each area in real time and transmit the monitoring data to the central control system. The central control system analyzes and processes this data to calculate the temperature distribution and average temperature within storage cavity 4. If a deviation is detected between the temperature of a certain area and the target temperature, the power of the electric heating plate or the working state of the semiconductor cooling chip 11 will be adjusted in a timely manner, while the fan speed will be adjusted to optimize gas circulation efficiency, so that the temperature of each area reaches the target value as quickly as possible. When the temperature of storage cavity 4 in a certain environmental chamber 2 approaches the target temperature, the central control system will gradually reduce the working power of the electric heating plate or the semiconductor cooling chip 11, using a fine-tuning method to slowly bring the temperature closer to the set value, avoiding overshoot during temperature adjustment. Once the temperature of storage cavity 4 reaches the target temperature, the central control system will control the electric heating plate and the semiconductor cooling chip 11 to maintain operation at a lower power, while maintaining... The operation of the fan and agitator 6, through continuous gas circulation and heat transfer oil agitation, keeps the temperature inside the storage chamber 4 stable and reduces temperature fluctuations. In addition, the insulation layer 18 on the surface of the environmental chamber shell 2 can effectively reduce heat exchange between the chamber and the outside, reduce energy loss, and enable the temperature control system to maintain the temperature inside the storage chamber 4 more stably. If an emergency occurs during the temperature control process, such as an abnormal rise or fall in temperature in a certain area, the central control system will immediately issue an alarm and automatically adjust the corresponding temperature control components to increase the adjustment force to quickly restore temperature balance and ensure that the experimental sample is in a stable temperature environment. The entire temperature control process, through the precise regulation of the central control system, combined with the coordinated work of components such as the electric heating plate, semiconductor cooling chip 11, agitator 6, fan, and insulation layer 18, achieves precise temperature control of multiple chambers in the environmental chamber, ensuring the uniformity and stability of the temperature in each chamber, and meeting the needs of scientific research, industrial production and other fields for high-precision temperature control.

[0049] When the temperature detector detects that the actual temperature inside the storage cavity 4 is lower than the target temperature and requires heating, the central control system immediately issues a command to activate the electric heating plate inside the temperature control cavity 5 and shut down the semiconductor cooling chip 11. After the electric heating plate starts working, the heat it generates is quickly transferred to the heat transfer oil inside the temperature control cavity 5. At this time, the motor 8 drives the turntable 9 to rotate, which in turn drives the movable column 7 to move back and forth through the connecting rod 10. This causes the stirring frame 6 to continuously stir the heat transfer oil inside the temperature control cavity 5, promoting a uniform distribution of heat in the heat transfer oil and preventing local overheating. At the same time, the fan inside the storage cavity 4 starts, drawing air from the bottom of the storage cavity 4 through the exhaust pipe 12, conveying it through the delivery pipe 14 to the intake pipe 13, and then sending it back to the top of the storage cavity 4 from the intake pipe 13, forming an internal gas circulation system. This allows the air inside the storage cavity 4 to transfer heat with the temperature control cavity 5 during the flow process, thereby achieving a uniform temperature rise inside the storage cavity 4. During the heating process, temperature sensors around the top and bottom of the inner wall of the storage cavity 4 continuously monitor the temperature of each area in real time and transmit the data to the central control system. The system adjusts the power of the electric heating plate in a timely manner according to the temperature deviation. When the temperature approaches the target value, the working power of the electric heating plate is gradually reduced, and the temperature is slowly brought closer to the set value by fine adjustment to avoid overshoot. When the temperature reaches the target value, the electric heating plate continues to work at a lower power, while the fan and stirring frame 6 continue to run, maintaining a stable temperature through continuous gas circulation and heat transfer oil stirring.

[0050] When the temperature sensor detects that the actual temperature inside the storage cavity 4 is higher than the target temperature and cooling is required, the central control system reacts quickly, activating the thermoelectric cooler 11 and shutting off the electric heating plate. The cold end of the thermoelectric cooler 11 begins to absorb heat from the heat transfer oil in the temperature control cavity 5, while the hot end transfers the heat to the back of the environmental chamber 2. At this time, the heat dissipation fins 16 and the cooling fan 17 on the hot end work together to increase the heat dissipation area and accelerate airflow, efficiently dissipating the heat generated by the thermoelectric cooler 11. While the thermoelectric cooler 11 is working, the motor 8 drives the agitator 6 to continuously agitate the heat transfer oil in the temperature control cavity 5, causing the temperature of the heat transfer oil to drop evenly. The fan in the storage cavity 4 also starts simultaneously, forming an internal gas circulation through the exhaust pipe 12 and the intake pipe 13, transferring the heat in the storage cavity 4 to the temperature control cavity 5, where it is then absorbed by the thermoelectric cooler 11, achieving a uniform reduction in temperature within the storage cavity 4. Temperature detectors continuously monitor the temperature of each area and feed it back to the central control system. The system adjusts the working status of the thermoelectric cooler 11 and the fan speed based on the real-time data. When the temperature approaches the target value, the working power of the thermoelectric cooler 11 is gradually reduced to make the temperature reach the set value smoothly in a fine-tuning manner, so as to avoid the temperature from being too low. Once the target temperature is reached, the semiconductor cooling chip 11 operates at a lower power, while the fan and agitator 6 continue to run. Through continuous heat exchange and airflow circulation, the temperature inside the storage cavity 4 is kept stable. At the same time, the insulation layer 18 on the surface of the environmental chamber shell 2 effectively reduces heat exchange between the chamber and the outside, ensuring the accuracy and stability of temperature control. A number of heat-conducting blocks are fixedly connected to the inner wall of the temperature control cavity 5. The heat-conducting blocks can accelerate the transfer of heat from the heat-conducting oil in the temperature control cavity 5 to the storage cavity 4. The heat-conducting blocks, temperature detectors, electric heating plates, and external central controllers are not shown. The aforementioned heat-conducting blocks, fans, cooling fans 17, motors 8, semiconductor cooling chips 11, electric heating plates, temperature detectors, and external central controllers are all existing common technologies and are common knowledge to those skilled in the art. Therefore, this application will not elaborate further.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-compartment temperature control device for an environmental chamber, comprising a placement rack (1), characterized in that: The right side of the placement rack (1) is provided with T-shaped grooves on the front and rear sides. An environmental chamber shell (2) is provided above the placement rack (1). There are several environmental chamber shells (2). T-shaped slide bars (3) are fixedly connected to the front and rear sides of the bottom of the environmental chamber shell (2). The T-shaped grooves are slidably connected to the T-shaped slide bars (3). The environmental chamber shell (2) includes a storage cavity (4) and a temperature control cavity (5). Electric heating plates are fixedly connected to both sides of the inner wall of the temperature control cavity (5). A stirring rack (6) is slidably connected inside the temperature control cavity (5). A movable column (7) is fixedly connected to the back of the stirring rack (6). The movable column (7) is slidably connected to the environmental chamber shell (2). The back of the movable column (7) extends to the back of the environmental chamber shell (2). A motor (8) is fixedly connected to the back of the environmental chamber shell (2) through a bracket. A turntable (9) is fixedly connected to the output end of the motor (8). A connecting rod (10) is rotatably connected to the surface of the turntable (9). The end of the connecting rod (10) away from the turntable (9) is hinged to the movable column (7). Both sides of the interior of the temperature control cavity (5) are fixedly connected to a semiconductor cooling chip (11). The cold end of the semiconductor cooling chip (11) extends into the interior of the temperature control cavity (5). The hot end of the semiconductor cooling chip (11) extends into the back of the environmental chamber shell (2). Both sides of the bottom back of the inner wall of the storage cavity (4) are connected to an air outlet pipe (12). Both sides of the top back of the inner wall of the storage cavity (4) are connected to an air inlet pipe (13). The surface of the air outlet pipe (12) is connected to a conveying pipe (14). The end of the conveying pipe (14) away from the air outlet pipe (12) is connected to the air inlet pipe (13). The interior of the air outlet pipe (12) is fixedly connected to a fan by a bracket. The backs of the air outlet pipe (12) and the air inlet pipe (13) both extend into the back of the environmental chamber shell (2).

2. The multi-compartment temperature control device for an environmental chamber according to claim 1, characterized in that: Multiple evenly distributed support strips (22) are fixedly connected to both sides of the inner wall of the storage cavity (4). A bearing plate (23) is provided on the top of the support strip (22), and a ventilation hole is provided on the top of the bearing plate (23).

3. The multi-compartment temperature control device for an environmental chamber according to claim 2, characterized in that: Temperature detectors are fixedly connected to the top and bottom of the inner wall of the storage cavity (4).

4. The multi-compartment temperature control device for an environmental chamber according to claim 3, characterized in that: Both sides of the front of the environmental chamber shell (2) are hinged with heat-insulated doors (15), and the surface of the heat-insulated doors (15) is provided with observation windows and handles.

5. The multi-compartment temperature control device for an environmental chamber according to claim 4, characterized in that: The environmental chamber shell (2) has fixed blocks (24) fixedly connected to the front and rear sides of the bottom of both sides. The fixed blocks (24) have threaded rods (25) internally connected. The bottom of the threaded rods (25) is rotatably connected to brake blocks (26). The bottom of the brake blocks (26) is in contact with the top of the placement rack (1). The top of the placement rack (1) is rough. The top of the threaded rods (25) is fixedly connected to a handle.

6. The multi-compartment temperature control device for an environmental chamber according to claim 5, characterized in that: The hot end of the semiconductor cooling chip (11) extends to the back of the environmental chamber shell (2) and is fixedly connected to a heat dissipation fin (16). Both sides of the back of the environmental chamber shell (2) are fixedly connected to a heat dissipation fan (17) by a bracket. The heat dissipation fan (17) is located on the back of the heat dissipation fin (16). The inside of the air inlet pipe (13) and the air outlet pipe (12) are fixedly connected to a dustproof net.

7. The multi-compartment temperature control device for an environmental chamber according to claim 6, characterized in that: The surface of the environmental chamber shell (2) is provided with a heat insulation layer (18), the heat insulation layer (18) includes a first heat insulation layer (19) provided on the surface of the environmental chamber shell (2), a second heat insulation layer (20) provided on the surface of the first heat insulation layer (19), and a third heat insulation layer (21) provided on the surface of the second heat insulation layer (20).

8. The control method of a multi-compartment temperature control device for an environmental chamber according to claim 7, characterized in that: Includes the following steps: S1: When the multi-compartment temperature control device of the environmental chamber is started, the central control system first initializes and calibrates the temperature detectors in each environmental chamber shell (2) to ensure the accuracy of temperature monitoring data. Then, the operator sets the target temperature for the storage cavity (4) of each environmental chamber shell (2) through the control panel. After receiving the setting command, the central control system compares the target temperature of each chamber with the actual temperature in the current storage cavity (4) in real time, calculates the required temperature adjustment amount based on the temperature difference, and then controls the electric heating plate or semiconductor cooling chip (11) in the temperature control cavity (5) to start working. During the temperature adjustment process, the heat generated by the electric heating plate or the heat absorbed by the semiconductor cooling chip (11) first acts on the temperature control cavity. (5) The heat transfer oil is in the storage chamber (5). At this time, the motor (8) drives the turntable (9) to rotate, and through the connecting rod (10) drives the movable column (7) to move back and forth. This causes the stirring frame (6) to continuously stir the heat transfer oil in the temperature control chamber (5), so that the heat in the heat transfer oil is evenly distributed and the local temperature is not too high or too low. At the same time, the fan in the storage chamber (4) starts and draws out the air at the bottom of the storage chamber (4) through the air outlet pipe (12), and delivers it to the air inlet pipe (13) through the conveying pipe (14). Then it is sent back to the top of the storage chamber (4) from the air inlet pipe (13), forming a gas internal circulation system. This allows the air in the storage chamber (4) to transfer heat to the temperature control chamber (5) during the flow process, thereby achieving uniform temperature regulation in the storage chamber (4). S2: Throughout the temperature control process, temperature detectors around the top and bottom of the inner wall of the storage cavity (4) continuously monitor the temperature of each area in real time and transmit the monitoring data to the central control system in real time. The central control system analyzes and processes this data to calculate the temperature distribution and average temperature in the storage cavity (4). If a deviation is found between the temperature of a certain area and the target temperature, the power of the electric heating plate or the working state of the semiconductor cooling chip (11) will be adjusted in time, and the fan speed will be adjusted at the same time to optimize the gas circulation efficiency so that the temperature of each area reaches the target value as soon as possible. When the temperature of the storage cavity (4) of a certain environmental chamber (2) is close to the target temperature, the central control system will gradually reduce the working power of the electric heating plate or the semiconductor cooling chip (11) and use fine adjustment to make the temperature slowly approach the set value to avoid overshoot during the temperature adjustment process. When the temperature of the storage cavity (4) reaches the target temperature, the central control system will control the electric heating plate and the semiconductor cooling chip (11) to maintain operation at a lower power. By keeping the fan and stirring rack (6) running, the temperature inside the storage chamber (4) is kept stable through continuous gas circulation and heat transfer oil stirring, reducing temperature fluctuations. In addition, the heat insulation layer (18) on the surface of the environmental chamber shell (2) can effectively reduce the heat exchange between the chamber and the outside, reduce energy loss, and enable the temperature control system to maintain the temperature inside the storage chamber (4) more stably. If an emergency occurs during the temperature control process, such as an abnormal increase or decrease in temperature in a certain area, the central control system will immediately issue an alarm and automatically adjust the corresponding temperature control components to increase the adjustment intensity in order to quickly restore the temperature balance and ensure that the experimental sample is in a stable temperature environment. The entire temperature control process, through the precise regulation of the central control system, combined with the coordinated work of components such as electric heating plate, semiconductor cooling chip (11), stirring rack (6), fan and heat insulation layer (18), achieves precise control of the temperature of multiple chambers in the environmental chamber, ensuring the uniformity and stability of the temperature in each chamber, and meeting the needs of scientific research, industrial production and other fields for high-precision temperature control.

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