A control method for adjusting film tearing strength and speed

Abstract

The application provides a control method for adjusting film tearing strength and speed, and belongs to the technical field of film tearing, which comprises the following steps: obtaining initial film tearing angle data and tension setting value data based on a preset film material characteristic database, obtaining a film tearing path and an expected position sequence based on wafer size and debonding process parameters, obtaining real-time film tearing tension data based on a force sensor, obtaining real-time film tearing angle data and real-time position data based on an encoder and a position sensor, obtaining a film tearing abnormality flag based on the real-time film tearing tension data and the real-time film tearing angle data, obtaining a position deviation identifier based on the real-time position data and the expected position sequence, obtaining a position control amount based on the position deviation identifier, obtaining a tension control amount based on the film tearing abnormality flag and the initial tension setting value, and obtaining a total control force command based on the position control amount and the tension control amount and executing the total control force command, so as to reduce the risk of wafer position deviation and film tearing path deviation caused by an angle deviation that is not detected.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of film tearing, more particularly relates to a control method for adjusting film tearing force and speed. BACKGROUND

[0002] In the semiconductor wafer manufacturing process, the debonding film tearing process is a link for separating the wafer from the carrier substrate. With the development of semiconductor technology towards large-size wafers and ultra-thin film materials, and the diversification of debonding process parameters, the control requirements for force and speed in the film tearing process are becoming increasingly stringent.

[0003] The existing film tearing control method relies on fixed parameters or manual experience, and it is difficult to dynamically adjust the operation strategy according to the changes of film material characteristics and wafer specifications. Only through a single force sensor to collect tension data, it lacks synchronous monitoring of the film tearing angle and real-time position, and it is difficult to fully reflect the dynamic state in the film tearing process, which leads to large angle deviation and causes wafer position deviation and film tearing path deviation. SUMMARY

[0004] In order to solve the above technical problems, the present application provides a control method for adjusting film tearing force and speed to solve the technical problems in the prior art that the traditional film tearing control method only collects tension data through a single force sensor, and it is difficult to fully reflect the dynamic state in the film tearing process, which is easy to cause wafer position deviation and film tearing path deviation due to angle deviation.

[0005] The purpose and effect of the control method for adjusting film tearing force and speed of the present application are achieved by the following specific technical means:

[0006] A control method for adjusting film tearing force and speed, comprising the following steps:

[0007] S1: obtaining initial film tearing angle data and tension setting value data based on a preset film material characteristic database, and obtaining a film tearing path and a desired position sequence based on wafer size and debonding process parameters;

[0008] S2: obtaining real-time film tearing tension data based on a force sensor, and obtaining real-time film tearing angle data and real-time position data based on an encoder and a position sensor;

[0009] S3: performing peeling state evaluation operation based on real-time film tearing tension data and real-time film tearing angle data to obtain a film tearing abnormal flag, and obtaining a position deviation identifier based on real-time position data and the desired position sequence;

[0010] S4: performing position compensation amount calculation operation based on the position deviation identifier to obtain a position control amount, and performing tension compensation amount calculation operation based on the film tearing abnormal flag and the initial tension setting value to obtain a tension control amount;

[0011] S5: Based on the position control amount and the tension control amount, a multi-objective control fusion operation is performed to obtain a total control force instruction;

[0012] S6: Based on the total control force instruction, a servo system regulation operation is performed, and the control effect is verified.

[0013] According to a preferred embodiment, the initial film tearing angle data and the tension setting value data are obtained based on a preset film material characteristic database, the film tearing path and the expected position sequence are obtained based on the wafer size and the debonding process parameters, comprising:

[0014] Obtain the film material type, thickness and adhesion force parameters in the film material characteristic database, query the standard film tearing angle range corresponding to the film material type as the initial film tearing angle data;

[0015] According to the film layer thickness value, the initial film tearing speed data is matched, wherein when the film layer thickness value is 50μm or more, the first film tearing speed is adopted, when the film layer thickness value is 20μm or less, the second film tearing speed is adopted, the first film tearing speed is less than the second film tearing speed, when the film layer thickness value is in the interval (20, 50) μm, the linear transition speed is adopted, which is expressed as the higher the film layer thickness value, the closer the film tearing speed to the first film tearing speed, and the lower the film layer thickness value, the closer the film tearing speed to the second film tearing speed;

[0016] According to the adhesion force parameter, the tension safety threshold is set, which includes the upper limit fracture prevention threshold and the lower limit residual prevention threshold;

[0017] Obtain the wafer size and the debonding process parameters, generate a spiral trajectory starting from the edge of the wafer as the moving path of the film tearing module;

[0018] Set path points every 1mm along the moving path, based on the expected three-dimensional coordinates and the expected speed of multiple path points, form the expected position sequence.

[0019] According to a preferred embodiment, the real-time film tearing tension data is obtained based on the force sensor, the real-time film tearing angle data and the real-time position data are obtained based on the encoder and the position sensor, comprising:

[0020] Based on the force sensor installed on the film tearing module and the film pressing roller, the peeling force in the vertical direction and the shear force in the horizontal direction are synchronously collected;

[0021] The resultant force of the peeling force and the shear force is calculated as the real-time film tearing tension data;

[0022] The Z-axis height of the film tearing module is measured by the encoder and the position sensor integrated in the servo lifting module to obtain the real-time film tearing angle data;

[0023] Record the current actual three-dimensional coordinates of the film tearing module and the actual moving speed as real-time position data.

[0024] According to a preferred embodiment, the peeling state evaluation operation is performed based on the real-time film tearing tension data and the real-time film tearing angle data, and an abnormal film tearing flag is obtained; the position deviation identifier is obtained based on the real-time position data and the expected position sequence, including:

[0025] The real-time film tearing tension data is compared with the set tension safety threshold, and the real-time film tearing angle data is compared with the initial film tearing angle data, to obtain the abnormal film tearing flag;

[0026] When the real-time film tearing tension data exceeds the upper limit fracture prevention threshold, the abnormal film tearing flag is represented as a "high tension" abnormality;

[0027] When the real-time film tearing tension data is lower than the lower limit residual prevention threshold, the abnormal film tearing flag is represented as a "low tension" abnormality;

[0028] When the angle deviation between the real-time film tearing angle data and the initial film tearing angle data exceeds ±5°, the abnormal film tearing flag is represented as an "angle deviation" abnormality;

[0029] Based on the real-time position data and the expected position sequence, a progress compliance check operation is performed to obtain a position deviation identifier.

[0030] According to a preferred embodiment, the progress compliance check operation is performed based on the real-time position data and the expected position sequence to obtain the position deviation identifier, including:

[0031] Based on the real-time position data, a path point at the same time is extracted from the expected position sequence, and based on the Euclidean distance deviation between the real-time position data and the path point, a position deviation amount is obtained;

[0032] Based on the real-time position data, an actual speed is obtained, and based on the difference between the actual speed and an expected speed, a speed deviation amount is obtained;

[0033] The position deviation amount and the speed deviation amount are combined into a position deviation identifier.

[0034] According to a preferred embodiment, based on the position deviation identifier, a position compensation amount calculation operation is performed to obtain a position control amount; based on the abnormal film tearing flag and an initial tension setting value, a tension compensation amount calculation operation is performed to obtain a tension control amount, including:

[0035] Based on the position deviation identifier, a PID control algorithm is used to calculate the position compensation amount, including a proportional term, an integral term, and a differential term, to obtain the position control amount;

[0036] Based on the abnormal film tearing flag, a tension compensation is performed to obtain the tension control amount;

[0037] When the film tearing abnormality flag indicates a "high tension" abnormality, the film tearing speed is reduced and the film tearing angle is decreased;

[0038] When the film tearing abnormality flag indicates a "low tension" abnormality, the film tearing speed is increased and the film tearing angle is increased;

[0039] When the film tearing abnormality flag indicates an "angle deviation" abnormality, the film tearing angle is adjusted according to the angle deviation between the real-time film tearing angle data and the initial film tearing angle data.

[0040] According to a preferred embodiment, the servo system control operation based on the total control force instruction and the control effect verification include:

[0041] Based on the total control force instruction, the lifting height of the film tearing module is adjusted to adjust the real-time film tearing angle data;

[0042] The knurling spindle winding speed is adjusted to adjust the real-time film tearing tension data;

[0043] Steps S2 to S6 are cycled, and the adjusted real-time film tearing force data and real-time position data are obtained by the force sensor and the position sensor;

[0044] When the film tearing abnormality flag and the position deviation flag do not appear, the film tearing operation continues;

[0045] When the film tearing abnormality flag or the position deviation flag still appears after 3 consecutive adjustments, the emergency stop mechanism is triggered and an alarm is given.

[0046] Compared with the prior art, the present application has the following beneficial effects:

[0047] 1. The peeling force in the vertical direction and the shear force in the horizontal direction are synchronously collected by the film tearing module and the force sensor, and the resultant force of the two is calculated as the real-time film tearing tension data, which can more accurately reflect the film stress state than single tension data. At the same time, with the help of the encoder integrated in the servo lifting module and the position sensor, the real-time film tearing angle data is obtained by measuring the Z-axis height of the film tearing module, and the actual three-dimensional coordinates and movement speed of the film tearing module are recorded as real-time position data. This multi-dimensional data collection method can cover tension, angle, and position data at the same time, avoiding the problem of missing angle deviation and position deviation due to only monitoring tension, and reducing the risk of wafer position deviation and film tearing path deviation caused by angle deviation.

[0048] 2. Through the abnormal evaluation standard and compensation logic, the angle deviation and other problems in the film peeling process can be identified, and the compensation amount is calculated to correct the deviation to avoid path deviation. First, based on the comparison of the real-time film peeling angle data and the initial film peeling angle data, if the angle deviation reaches the abnormal standard, an angle deviation abnormal flag will be generated. At the same time, combined with the real-time position data and the expected position sequence, the position deviation identifier is formed by calculating the Euclidean distance deviation and the rate deviation to clearly define the abnormal type and degree. Subsequently, for the angle deviation abnormality, the lifting height of the film peeling module is adjusted to directly correct the film peeling angle; for the position deviation identifier, the PID control algorithm is used to calculate the position compensation amount containing the proportional term, integral term and differential term to adjust the position of the film peeling module; for the tension related abnormality, the film peeling speed and angle are also adjusted synchronously to optimize the stress state. Through the scheme of identifying the abnormality first and then compensating specifically, the film peeling angle deviation can be actively corrected to prevent the wafer position from deviating due to the angle deviation, thereby ensuring that the film peeling module always moves along the preset spiral trajectory and avoids path deviation.

[0049] 3. Through the construction of the monitoring-evaluation-compensation-verification closed-loop control process, the parameter adjustment effect can be verified in real time, and the abnormality can be continuously corrected to maintain the film peeling path stable and avoid deviation accumulation leading to path deviation. After the servo system control is completed based on the total control force command, the real-time tension, angle and position data of the next round are immediately collected, and the peeling state evaluation and position deviation check are performed again to determine whether the abnormality still exists after adjustment. If the abnormality is not eliminated, the data collection, abnormality evaluation, compensation calculation and servo control steps are continuously executed until the abnormality disappears. If the abnormality still cannot be solved after continuous adjustment for multiple times, an emergency stop mechanism is triggered to prevent the problem from being enlarged. BRIEF DESCRIPTION OF DRAWINGS

[0050] Fig. 1 is the step flow chart of the present application;

[0051] Fig. 2 is the step flow chart of the present application for obtaining the film peeling abnormal flag and the position deviation identifier;

[0052] Fig. 3 is the step flow chart of the present application for servo system control operation. DETAILED DESCRIPTION

[0053] The embodiments of the present application will be further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the technical solutions of the present application, but cannot be used to limit the protection scope of the present application.

[0054] Example:

[0055] As shown in the accompanying Figs. 1 to 3 ,

[0056] The application provides a control method for adjusting film tearing strength and speed, comprising the following steps:

[0057] S1: obtaining initial film tearing angle data and tension setting value data based on a preset film material characteristic database, and obtaining a film tearing path and a desired position sequence based on wafer size and debonding process parameters;

[0058] Specifically, the film material characteristic database needs to pre-enter film material basic information in different application scenarios, covering film material types, full-specification thickness parameters and adhesion test results under different environmental temperatures. When in use, the operator inputs the model of the current film material to be processed, and the system extracts the corresponding film material type, thickness and adhesion parameters from the film material characteristic database; then, the standard film tearing angle range corresponding to the film material type is queried as the initial film tearing angle data;

[0059] According to the film layer thickness value, the initial film tearing speed data is matched. When the film layer thickness is 50 mu m or above, the first film tearing speed is adopted. Because the tensile strength of the film layer is weak when the film layer thickness is 50 mu m or above, the first film tearing speed can reduce the local stress concentration of the film material in the tearing process due to the too fast stretching speed, so as to prevent the film material from tearing. When the film layer thickness is 20 mu m or below, the second film tearing speed is adopted. Because the film layer thickness is good in flexibility when the film layer thickness is 20 mu m or below, the second film tearing speed can shorten the film tearing time of a single wafer, and improve the overall efficiency of the semiconductor production line. The first film tearing speed is less than the second film tearing speed. When the film layer thickness is between 20 mu m and 50 mu m, a linear transition speed is adopted, that is, the speed is adjusted in proportion to the thickness value. The closer the thickness is to 50 mu m, the closer the speed is to the first film tearing speed. The closer the thickness is to 20 mu m, the closer the speed is to the second film tearing speed. Avoiding the stress state of the film material changing dramatically due to sudden change of speed, causing local damage of the film material. According to the adhesion parameter, a tension safety threshold is set. If the adhesion parameter of the film material is high, the adhesion force is greater than or equal to 5 N / 25 mm, the upper limit of the fracture prevention threshold is set to a value slightly lower than the tensile fracture strength of the film material, so as to avoid the tension exceeding the limit in the subsequent film tearing process, causing the film material to break. At the same time, the lower limit of the residual prevention threshold is set to be 1.2 times higher than the adhesion force, so as to ensure that the tension is sufficient to make the film material completely separate from the wafer surface, without leaving residual glue affecting the subsequent process. If the adhesion of the film material is low, the adhesion force is less than or equal to 2 N / 25 mm, the upper limit of the fracture prevention threshold is appropriately reduced, so as to avoid excessive tension damaging the circuit structure of the wafer edge. At the same time, the lower limit of the residual prevention threshold is set to be 1.1 times higher than the adhesion force, so as to avoid residual glue while reducing the force acting on the wafer.

[0060] The wafer size and the debonding process parameters are obtained, and the system calculates the radius range of the spiral trajectory according to the wafer size. The spiral trajectory starts from the position close to the wafer positioning notch at a distance of 2 mm from the edge of the wafer, and extends to the center of the wafer with a uniform pitch. The pitch size is adjusted according to the debonding process parameters. If the debonding temperature is greater than or equal to 80℃, the adhesion of the film material will decrease slightly, and the pitch is set to 5mm. If the temperature is less than 80℃, the adhesion of the film material remains at a high level, and the pitch is set to 3mm. Such spiral trajectory can make the film material receive uniform peeling force during the movement of the film tearing module, avoiding local area damage due to force concentration, or film tearing.

[0061] A path point is set every 1mm along the movement path, and each path point contains expected three-dimensional coordinates and expected speed. The path point close to the wafer edge has a slightly higher expected speed due to the relatively weak adhesion of the film material to the wafer edge. The path point close to the wafer center has a slightly lower expected speed due to the large coverage area of the film material and the tighter combination with the wafer. Based on the expected three-dimensional coordinates and the expected speed of these path points, a complete expected position sequence is formed, which can be used as a comparison reference for real-time position data in subsequent steps to ensure that the movement of the film tearing module always follows the preset trajectory without large deviation.

[0062] For example, when processing a 12-inch wafer with a 50μm thick high-adhesion UV film, the control unit first retrieves the parameters of the UV film from the film characteristic database. Film type: high-adhesion UV film, thickness: 50μm, adhesion: 6N / 25mm. The corresponding initial film tearing angle range is 30°-45°, and 35° is selected as the initial film tearing angle data. The initial film tearing speed is set to low speed 5mm / s due to the film layer thickness of 50μm. According to the adhesion of 6N / 25mm, the upper limit of the fracture threshold is set to 8N, and the lower limit of the residual threshold is set to 7.2N. Combined with the 12-inch wafer size and the debonding temperature of 60℃, a spiral trajectory with a pitch of 4mm is generated from the wafer positioning notch near the edge coordinates X: 150mm, Y: 0mm. A path point is set every 1mm along the trajectory. The edge path point X: 150mm, Y: 0mm has a Z-axis coordinate of 10mm and an expected speed of 5mm / s. The center path point X: 0mm, Y: 0mm has a Z-axis coordinate of 25mm and an expected speed of 3mm / s. Based on the path point information, an expected position sequence is formed. The above data is only used to show the process, and the specific data should be determined according to the actual situation.

[0063] S2: Obtain real-time film tearing tension data based on the force sensor, and obtain real-time film tearing angle data and real-time position data based on the encoder and the position sensor;

[0064] Specifically, the force sensors need to be installed in the inner side of the clamping end of the film tearing module and the shaft end of the film pressing roller, respectively. The force sensor of the film tearing module is used to collect the vertical peeling force when the film material is torn off, and the force sensor of the film pressing roller is used to collect the horizontal shear force when the film tearing module moves horizontally. The two groups of force sensors are connected with the control unit through wires to ensure the synchronous collection of the data of the two forces during the film tearing process, avoiding the deviation of force analysis caused by asynchronous collection. After collecting the vertical peeling force and the horizontal shear force, the control unit will calculate the resultant force of the two forces according to the principle of vector synthesis, specifically by calculating the square root of the sum of the square of the peeling force and the square of the shear force through the Pythagorean theorem. The resultant force is taken as the real-time film tearing tension data. This method can fully reflect the actual stress state of the film material in three-dimensional space, and compared with collecting tension data in only one direction, it can avoid missing the local stress concentration in the horizontal or vertical direction.

[0065] The real-time film tearing angle data is obtained through the encoder and position sensor integrated in the servo lifting module. The encoder needs to be installed on the motor output shaft of the servo lifting module to record the number of motor rotations and convert it into the Z-axis lifting displacement of the film tearing module. The position sensor is installed beside the guide rail of the servo lifting module to assist in confirming the actual Z-axis height of the film tearing module through laser or infrared. The combination of the two data can accurately determine the real-time Z-axis height of the film tearing module. The film tearing angle is the angle between the film tearing module and the wafer surface, which can be calculated by the ratio of the Z-axis height of the film tearing module to the horizontal projection distance. The control unit will automatically convert the real-time film tearing angle data according to the real-time Z-axis height. When the Z-axis height of the film tearing module increases, the real-time film tearing angle will increase, and when the Z-axis height decreases, the angle will decrease. By monitoring the angle in real time, angle abnormalities caused by servo lifting module failure can be detected in time, avoiding incomplete separation of the film material and wafer due to too small angle, or excessive instantaneous stress of the film material caused by too large angle.

[0066] The current actual three-dimensional coordinates and actual moving speed of the film tearing module are recorded as real-time position data. X-axis and Y-axis position sensors need to be additionally installed on the horizontal moving guide rail of the film tearing module to form the actual three-dimensional coordinates of the film tearing module in combination with the data of the Z-axis position sensor. At the same time, the rotation speed of the horizontal moving motor of the film tearing module is recorded through the encoder and converted into the actual moving speed. These real-time position data are transmitted to the control unit in real time and compared with the expected position sequence generated in S1.

[0067] For example, when processing a 12-inch wafer, if the actual X-axis coordinate of the film tearing module deviates from the corresponding path point in the expected position sequence, the real-time position data will immediately feedback the deviation, avoiding continuous deviation of the film tearing module from the spiral trajectory due to mechanical vibration, and preventing the circuit structure at the edge of the wafer from being scratched and damaged by the film tearing module. This multi-dimensional data collection method can simultaneously cover the three core parameters of tension, angle, and position, avoiding the omission of angle deviation and position deviation due to only monitoring tension, and reducing the risk of wafer position deviation and film tearing path deviation caused by unnoticed angle deviation.

[0068] S3: Based on the real-time film tearing tension data and the real-time film tearing angle data, a peeling state evaluation operation is performed to obtain a film tearing abnormality flag; based on the real-time position data and the expected position sequence, a position deviation identifier is obtained; the control unit will first receive the real-time film tearing tension data, the real-time film tearing angle data, and the real-time position data transmitted by the force sensor, the encoder, and the position sensor in S2, and then process them in steps according to the preset evaluation logic to determine whether the film tearing process is stable and whether there is deviation.

[0069] Specifically, obtaining the film tearing abnormality flag and the position deviation identifier includes:

[0070] S300: The control unit first calls the tension safety threshold set based on the preset film material characteristic database in S1 and the initial film tearing angle data, then compares the real-time film tearing tension data with the tension safety threshold in real time, and compares the real-time film tearing angle data with the initial film tearing angle data, and generates a film tearing abnormality flag according to the comparison results;

[0071] When the real-time film tearing tension data exceeds the upper limit fracture prevention threshold, the film tearing abnormality flag is represented as "over-tension" abnormality, which indicates that the subsequent steps need to adjust the parameters to reduce the tension to prevent the high-adhesion UV film from being torn horizontally due to excessive force exceeding the tolerance limit, and to avoid the film fragments after tearing adhering to the wafer surface affecting the subsequent process;

[0072] When the real-time film tearing tension data is lower than the lower limit residual prevention threshold, the film tearing abnormality flag is represented as "low tension" abnormality, which indicates that the tension needs to be increased to prevent the high-adhesion UV film from not being completely separated from the wafer surface due to insufficient tension, leaving residual glue affecting the wafer circuit performance;

[0073] When the angle deviation between the real-time film tearing angle data and the initial film tearing angle data exceeds ±5°, the film tearing abnormality flag is represented as "angle deviation" abnormality, which indicates that the film tearing angle needs to be corrected to avoid unreasonable film peeling direction due to too small angle, or damage caused by excessive instantaneous force concentration due to too large angle.

[0074] S301: The control unit extracts the path point corresponding to the same time from the expected position sequence generated by S1 according to the timestamp of the real-time position data, and then obtains the Euclidean distance deviation between the real-time position and the expected path point according to the Euclidean distance calculation formula, and takes the deviation as the position deviation. The position deviation can intuitively reflect the deviation of the actual position of the film tearing module from the preset trajectory, and prevent the film tearing module from scratching the circuit structure of the wafer edge due to continuous expansion of the deviation.

[0075] S302: The control unit extracts the actual moving speed of the film tearing module from the real-time position data, and then calls the expected speed corresponding to the expected path point at the same time to calculate the difference between the actual speed and the expected speed, and takes the difference as the speed deviation. Subsequently, the position deviation and the speed deviation are combined into a position deviation identifier through data packaging. The identifier can reflect the deviation of the film tearing module in both position and speed, and avoid the film tearing rhythm disorder caused by only focusing on the position deviation and ignoring the speed deviation.

[0076] For example, if only the position deviation is corrected but the speed deviation is not adjusted, the film tearing module may return to the trajectory but move too slowly, causing subsequent path points to continuously lag, affecting the overall film tearing efficiency. The combined position deviation identifier can provide a complete basis for subsequent position compensation calculation, ensuring that the film tearing module not only returns to the preset trajectory but also maintains the same moving rhythm as the expected speed, ensuring that the 50μm thick high-adhesion UV film is always stable and orderly during the tearing process on a 12-inch wafer.

[0077] S4: Based on the position deviation identifier, perform position compensation calculation operation to obtain position control quantity; based on the film tearing abnormal flag and the initial tension setting value, perform tension compensation calculation operation to obtain tension control quantity; after receiving the position deviation identifier and the film tearing abnormal flag output by S3, the control unit will calculate the position compensation and the tension compensation according to the preset logic, to provide specific parameter basis for subsequent servo control.

[0078] Specifically, step S4 includes:

[0079] Based on the position deviation identifier, the control unit calls the built-in PID control algorithm, first extracts the position deviation and the speed deviation in the position deviation identifier, and then calculates the proportional term, the integral term and the differential term of the PID: the proportional term is obtained by multiplying the position deviation by a preset proportional coefficient, which is used to quickly respond to the current position deviation and avoid continuous expansion of the deviation; the integral term is obtained by multiplying the sum of the position deviation over a period of time by an integral coefficient, which is used to eliminate long-term small deviations; the differential term is obtained by multiplying the change rate of the adjacent two position deviations by a differential coefficient, which is used to predict the deviation trend and prevent over-adjustment; then the calculation results of the proportional term, the integral term and the differential term are added to obtain the position compensation.

[0080] For example, if the position deviation of three consecutive samples is 0.8 mm, 0.7 mm, and 0.6 mm, the total deviation is 2.1 mm, and the integral term output is 2.1 mm x 0.5 = 1.05 mm, the continuous deviation caused by mechanical clearance can be compensated; for example, the previous deviation is 0.8 mm, and the subsequent deviation is 0.7 mm, the change rate is -0.1 mm, and the differential term output is -0.1 mm x 0.3 = -0.03 mm, which can slow down the adjustment speed of the film tearing module to avoid rapid movement across the expected path point, and then add the calculation results of the proportional term, integral term, and differential term to get the position compensation amount, which is 1.6 mm + 1.05 mm - 0.03 mm = 2.62 mm, which can be directly used to adjust the X-axis, Y-axis, and Z-axis coordinates of the film tearing module to ensure that the film tearing module returns to the spiral trajectory set in S1. For example, according to the position control amount, the control unit drives the horizontal moving motor of the film tearing module to move 1.2 mm in the negative direction of the X-axis and 1.42 mm in the negative direction of the Y-axis, so that the actual position moves towards the expected path point. The above data are all hypothetical and the specific data depend on the actual situation.

[0081] Based on the film tearing abnormal flag, the control unit combines the initial tension set value set in S1 to perform tension compensation calculation to obtain a tension control amount;

[0082] When the film tearing abnormal flag indicates an "over-tension" abnormality, the control unit generates a tension control amount that reduces the film tearing speed and reduces the film tearing angle: reducing the film tearing speed is achieved by adjusting the output frequency of the horizontal moving motor of the film tearing module to reduce the actual speed from 4 mm / s to 3.2 mm / s, reducing the friction time of the film material with the wafer surface, thereby reducing the horizontal shear force; reducing the film tearing angle is achieved by controlling the servo lifting module to lower the Z-axis height of the film tearing module to adjust the real-time film tearing angle from 35° to 32°, reducing the peeling force in the vertical direction, both of which work together to make the real-time film tearing tension data fall back to the safe range, preventing horizontal tearing of high-adhesion UV film due to over-tension;

[0083] When the film tearing abnormal flag indicates an "over-tension" abnormality, the control unit generates a tension control amount that reduces the film tearing speed and reduces the film tearing angle: reducing the film tearing speed is achieved by adjusting the output frequency of the horizontal moving motor of the film tearing module to reduce the actual speed from 4 mm / s to 3.2 mm / s, reducing the friction time of the film material with the wafer surface, thereby reducing the horizontal shear force; reducing the film tearing angle is achieved by controlling the servo lifting module to lower the Z-axis height of the film tearing module to adjust the real-time film tearing angle from 35° to 32°, reducing the peeling force in the vertical direction, both of which work together to make the real-time film tearing tension data fall back to the safe range, preventing horizontal tearing of high-adhesion UV film due to over-tension;

[0084] When the film tearing abnormality flag indicates an "angle deviation" abnormality, the control unit calculates an adjustment amount based on the angle deviation and generates a tension control amount for adjusting the film tearing angle: the Z-axis height of the film tearing module is raised by the servo lifting module to adjust the Z-axis coordinate from 14 mm to 16 mm, so that the real-time film tearing angle is returned from 29° to 35°, the angle deviation is corrected, and the problem of unreasonable film peeling direction caused by too small angle, which leads to local stress concentration or incomplete separation, is avoided. Through this targeted compensation logic, it can be ensured that the tension and angle of the 50μm thick high-adhesion UV film are always within a reasonable range during the film tearing process of a 12-inch wafer, the film tearing module moves stably along the preset trajectory, and the film tearing quality is guaranteed.

[0085] S5: Based on the position control amount and the tension control amount, perform multi-objective control fusion operation to obtain total control force instruction;

[0086] Specifically, after receiving the position control amount and the tension control amount output by S4, the control unit will first determine the priority of the control requirements corresponding to the two, and the priority determination basis is the severity of the film tearing abnormality flag and the position deviation identifier generated by S3 - if there is an abnormality such as "over-tension" and "low tension" that directly affects the integrity of the film material or the cleanliness of the wafer, the priority of the tension control amount is higher than that of the position control amount; if there is only a position deviation, the priority of the position control amount is higher, to avoid adjusting the position first and causing the tension to exceed the safety threshold. Subsequently, a multi-objective control fusion logic is started, which will assign weight coefficients to the two types of control amounts according to the priority, then multiply the position control amount and the tension control amount by the corresponding weight, and at the same time check the compatibility between the adjustment amounts in different dimensions to prevent conflicts such as adjusting the position causing tension fluctuations or adjusting the tension causing position deviation. Finally, all compatible adjustment amounts are integrated into a unified total control force instruction to ensure that the instruction can meet the needs of position correction and tension optimization at the same time, without missing any control target.

[0087] For example, in the case of a 12-inch wafer with a 50-μm thick high-adhesion UV film, the position control amount in S4 is -1.2 mm in the X-axis and -1.42 mm in the Y-axis, which is used to correct the Euclidean distance deviation of 0.8 mm, so that the film tearing module returns to the expected path point X: 120 mm, Y: 30 mm, and the tension control amount is reduced from 4 mm / s to 3.2 mm / s in the film tearing speed and from 35° to 32° in the film tearing angle, which is used to solve the "over-tension" abnormality that the real-time film tearing tension of 8.5 N exceeds the upper limit of 8 N to prevent the breaking threshold. At this time, the "over-tension" abnormality directly threatens the integrity of the film material, so the control unit sets the weight coefficient of the tension control amount to 0.6 and the weight coefficient of the position control amount to 0.4. During the fusion process, first, adjust the film tearing speed to 3.2 mm / s according to the tension control amount, and at the same time, match the movement rate of the X-axis and Y-axis in the position control amount to this speed, set the negative movement rate of the X-axis to 0.8 mm / s, and set the negative movement rate of the Y-axis to 0.95 mm / s, to ensure that the film tearing module does not move too fast when moving to the expected path point, so as to avoid the increase of horizontal shear force and aggravate the over-tension problem; then, according to the tension control amount, reduce the film tearing angle to 32°, and at the same time, correct the adjustment amount of the Z-axis in the position control amount from the original plan of keeping 15 mm to 14.2 mm, so that the angle adjustment and the Z-axis position adjustment are unified, and no new position deviation is generated. The final integrated total control force instruction includes: -1.2 mm in the X-axis, -1.42 mm in the Y-axis, 14.2 mm in the Z-axis height, and 3.2 mm / s in the film tearing speed. This instruction can simultaneously achieve the two goals of correcting the position deviation and reducing the tension to the safe range, avoid adjusting the position alone to further exceed the tension, or adjusting the tension alone to expand the position deviation, and ensure that the 50-μm thick high-adhesion UV film does not break due to over-tension or deviate from the spiral trajectory due to position deviation during the film tearing process on the 12-inch wafer, so as to ensure that the film tearing operation is stable and orderly, and the above data is only used for logical reference, and the specific data needs to be determined according to the specific situation.

[0088] S6: Perform servo system control operation based on the total control force instruction, and verify the control effect.

[0089] Specifically, step S6 includes:

[0090] S600: Adjust the lifting height of the film tearing module based on the total control force instruction to adjust the real-time film tearing angle data;

[0091] S601: Adjust the knurled spindle winding rate to adjust the real-time film tearing tension data;

[0092] S602: After the regulation of S600 and S601 is completed, the control unit triggers the loop mechanism immediately to re-execute steps S2 to S6: first, the new vertical peeling force and horizontal shear force are collected by the force sensor, and the adjusted real-time film tearing tension data is calculated; the new real-time film tearing angle data and real-time position data are obtained by the encoder and the position sensor, then enter S3, compare the new data with the safety threshold, the initial angle, the expected position sequence, and evaluate whether there is still an abnormal film tearing flag or a position deviation flag; if the comparison result shows that there is no any abnormality, the control unit controls the film tearing mechanism to continue to execute the subsequent film tearing operation; if there is still abnormality, steps S4 to S6 are repeated to re-calculate the position compensation amount and the tension control amount, S5 to fuse the new control amount to generate the total control force instruction, and S6 to execute the new servo regulation, until the abnormality is eliminated; when the regulation is completed for 3 times continuously, the data re-collected still shows that there is abnormality, the control unit triggers the emergency stop mechanism immediately, cuts off the power supply circuit of the servo lifting module and the knurling spindle driving motor, so that the film tearing module stops lifting and moving, and the knurling spindle stops winding, at the same time, the alarm lamp on the device flashes continuously, and the intermittent alarm sound is emitted through the buzzer, prompting the operator to check the abnormality in time, preventing the continuous abnormality from causing damage to the film material or the wafer.

[0093] For example, when processing a 12-inch wafer using a 50-μm-thick high-adhesion UV film, the total control force command includes: the Z-axis height of the film tearing module needs to be reduced from 15 mm to 14.2 mm, and the knurling spindle winding rate needs to be reduced from 4 mm / s to 3.2 mm / s. In S600, the control unit sends a driving signal of “Z-axis reduced to 14.2 mm” to the servo lifting module, the motor of the servo lifting module reverses, and the film tearing module is driven to descend along the Z-axis through the screw transmission. The encoder records the number of motor rotations in real time, and the film tearing module corresponds to 2 rotations of the motor per 0.1 mm of descent. When the motor rotates 16 times, the encoder feeds back that the film tearing module has descended 0.8 mm, and the position sensor confirms that the actual height of the film tearing module is 14.2 mm through laser monitoring. The control unit immediately stops the motor, and the real-time film tearing angle is adjusted to 32° as the Z-axis height decreases, completing the angle control. In S601, the control unit sends a speed signal of “speed reduced to 3.2 mm / s” to the knurling spindle driving motor, the driving motor reduces the output frequency, and the knurling spindle gradually reduces the rotation rate from 4 mm / s. The encoder installed on the knurling spindle monitors the rate in real time, and when the actual rate is stably fed back at 3.2 mm / s, the control unit maintains the current motor output frequency, the knurling spindle winds the film at a rate of 3.2 mm / s, and the real-time film tearing tension begins to fall as the winding rate decreases. In S602, first, S2 is performed: the force sensor collects a new vertical peeling force of 5.2 N and a horizontal shear force of 4.8 N, and calculates a resultant force of 7.8 N; the encoder and the position sensor obtain a real-time film tearing angle of 32°, real-time position data of X: 118.9 mm, and Y: 28.6 mm; then S3 is performed: it is found by comparison that the real-time film tearing tension 7.8 N is between the upper limit anti-breaking threshold 8 N and the lower limit anti-residue threshold 7.2 N, the angle deviation -3° does not exceed ±5°, the position deviation 0.2 mm is within the preset allowable range ≤0.5 mm, there is no film tearing abnormal flag and position deviation flag, and the film tearing operation continues. If the real-time film tearing tension is still 8.2 N above the upper limit after the first adjustment, S4 is repeated: the knurling spindle rate is further reduced to 3.0 mm / s, the Z-axis height of the film tearing module is reduced to 14.0 mm, and a new tension control amount is calculated; S5: new position control amount and tension control amount are fused to generate a new total control force command; S6: new adjustment is performed. If the real-time film tearing tension is still 8.2 N, 8.1 N, and 8.3 N above the upper limit after 3 consecutive adjustments, the control unit immediately triggers an emergency stop to cut off the power supply of the servo lifting module and the knurling spindle motor, the film tearing module and the knurling spindle stop moving, the alarm light flashes and the buzzer alarms, prompting the operator to check whether the tension cannot be reduced due to local adhesion force abnormalities of the film or knurling spindle jamming, to avoid continuous over-tension causing the 50-μm-thick high-adhesion UV film to break or the 12-inch wafer edge to be damaged. The above data are all hypothetical, and the specific data depend on the actual situation.

[0094] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those ordinarily skilled in the art should understand: the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A control method for adjusting the force and speed of film tearing, characterized by: The method comprises the following steps: S1: obtaining initial film tearing angle data and tension setting value data based on a preset film material characteristic database, and obtaining a film tearing path and a desired position sequence based on wafer size and debonding process parameters, which comprises: Obtaining film material type, thickness and adhesion force parameters in the film material characteristic database, and querying the standard film tearing angle range corresponding to the film material type as the initial film tearing angle data; According to the film layer thickness value, the initial film tearing speed data is matched, wherein when the film layer thickness value is 50 μm or more, the first film tearing speed is adopted, when the film layer thickness value is 20 μm or less, the second film tearing speed is adopted, the first film tearing speed is less than the second film tearing speed, when the film layer thickness value is in the interval (20, 50) μm, the linear transition speed is adopted, and the linear transition speed is represented as the film layer thickness value is higher, the film tearing speed is closer to the first film tearing speed, and the film layer thickness value is lower, the film tearing speed is closer to the second film tearing speed; According to the adhesion force parameter, the tension safety threshold is set, and the tension safety threshold comprises an upper limit fracture prevention threshold and a lower limit residual prevention threshold; Obtaining wafer size and debonding process parameters to generate a spiral trajectory starting from the edge of the wafer as the moving path of the film tearing module; Set path points every 1 mm along the moving path, and form a desired position sequence based on the expected three-dimensional coordinates and the expected speed of a plurality of path points; S2: obtaining real-time film tearing tension data based on a force sensor, and obtaining real-time film tearing angle data and real-time position data based on an encoder and a position sensor; S3: performing a peeling state evaluation operation based on the real-time film tearing tension data and the real-time film tearing angle data, and obtaining a film tearing abnormal flag; based on the real-time position data and the desired position sequence, a position deviation identifier is obtained, which comprises: Comparing the real-time film tearing tension data with the set tension safety threshold, and comparing the real-time film tearing angle data with the initial film tearing angle data, to obtain the film tearing abnormal flag; Wherein, when the real-time film tearing tension data exceeds the upper limit fracture prevention threshold, the film tearing abnormal flag is represented as "over tension" abnormality; When the real-time film tearing tension data is lower than the lower limit residual prevention threshold, the film tearing abnormal flag is represented as "low tension" abnormality; When the angle deviation between the real-time film tearing angle data and the initial film tearing angle data exceeds ± 5°, the film tearing abnormal flag is represented as "angle deviation" abnormality; Based on the real-time position data and the desired position sequence, a progress compliance check operation is performed to obtain a position deviation identifier; S4: based on the position deviation identifier, a position compensation amount calculation operation is performed to obtain a position control amount; based on the film tearing abnormal flag and the initial tension setting value, a tension compensation amount calculation operation is performed to obtain a tension control amount; S5: based on the position control amount and the tension control amount, a multi-objective control fusion operation is performed to obtain a total control force instruction; S6: based on the total control force instruction, a servo system regulation operation is performed, and the control effect is verified.

2. The control method for adjusting the film tearing force and speed according to claim 1, characterized in that: The method comprises the following steps: Based on the force sensor installed on the film tearing module and the film pressing roller, the peeling force in the vertical direction and the shear force in the horizontal direction are synchronously collected. The resultant force of the peeling force and the shearing force is calculated as the real-time film tearing tension data; The Z-axis height of the film tearing module is measured by the encoder and the position sensor integrated in the servo lifting module to obtain the real-time film tearing angle data; The current actual three-dimensional coordinates and the actual moving speed of the film tearing module are recorded as the real-time position data.

3. The control method of claim 1, wherein: The progress compliance check operation is performed based on the real-time position data and the expected position sequence to obtain the position deviation identifier, including: The path point at the same time is extracted from the expected position sequence based on the real-time position data, and the position deviation amount is obtained based on the Euclidean distance deviation between the real-time position data and the path point; The actual speed is obtained based on the real-time position data, and the speed deviation amount is obtained based on the difference between the actual speed and the expected speed; The position deviation amount and the speed deviation amount are combined into the position deviation identifier.

4. The control method for adjusting the film tearing force and speed according to claim 1, characterized in that: The position compensation amount calculation operation is performed based on the position deviation identifier to obtain the position control amount; The tension compensation amount calculation operation is performed based on the film tearing abnormal flag and the initial tension setting value to obtain the tension control amount, including: The position compensation amount is calculated based on the position deviation identifier using the PID control algorithm, including the proportional term, the integral term and the differential term, to obtain the position control amount; The tension compensation is performed based on the film tearing abnormal flag to obtain the tension control amount; When the film tearing abnormal flag indicates the "over-tension" abnormality, the film tearing speed is reduced and the film tearing angle is decreased; When the film tearing abnormal flag indicates the "low tension" abnormality, the film tearing speed is increased and the film tearing angle is increased; When the film tearing abnormal flag indicates the "angle deviation" abnormality, the film tearing angle is adjusted according to the angle deviation between the real-time film tearing angle data and the initial film tearing angle data.

5. The control method of claim 1, wherein the control method is characterized by: The servo system regulation operation is performed based on the total control force instruction, and the control effect is verified, including: The lifting height of the film tearing module is adjusted based on the total control force instruction to adjust the real-time film tearing angle data; The rolling speed of the knurling spindle is adjusted to adjust the real-time film tearing tension data; The adjusted real-time film tearing force data and the real-time position data are obtained through the force sensor and the position sensor; When the film tearing abnormal flag and the position deviation identifier do not appear, the film tearing operation continues; When the film tearing abnormal flag or the position deviation identifier still appears after 3 consecutive adjustments, the emergency stop mechanism is triggered and an alarm is issued.

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