Etching equipment for ultra-thin flexible electronic chip

Abstract

The invention discloses ultra-thin flexible electronic chip etching equipment which comprises a shell, two supporting frames are symmetrically and fixedly connected to the lower end of the shell, a vertical plate is fixedly connected to the upper end of the shell, and a transverse plate is fixedly connected to the upper end of the vertical plate; the placing mechanism is arranged below the vertical plate, the placing mechanism comprises a first lifting plate and a second lifting plate, the first lifting plate and the second lifting plate are fixedly connected through a plurality of connecting rods, and two connecting plates are symmetrically and fixedly connected to the upper end of the second lifting plate; the upper ends of the two connecting plates are jointly and fixedly connected with a containing box, and a plurality of through holes are formed in the outer side of the containing box. And the etching mechanism is arranged in the shell. In the actual use process of the equipment, high-temperature etching can be carried out, temperature dissipation can be reduced, heat energy waste can be reduced, in addition, during etching, liquid is in a flowing state, the liquid can be filtered, and the etching effect is improved.

Description

Technical Field

[0001] This invention relates to the field of chip etching, and more particularly to an etching apparatus for ultra-thin flexible electronic chips. Background Technology

[0002] With the rapid development of electronic technology, ultra-thin flexible electronic chips, as an emerging electronic component, are gradually becoming the focus of market attention. Compared with traditional rigid chips, ultra-thin flexible electronic chips have many advantages such as being lightweight, thin, flexible, and foldable, which can meet the diverse needs of many emerging fields such as wearable devices, flexible displays, and smart packaging for electronic product forms and functions. Etching is one of the core processes in chip manufacturing. It selectively removes material from the chip surface through physical or chemical methods to form the required circuit patterns and structures. For ultra-thin flexible electronic chips, the precision and quality of the etching process directly affect the chip's performance and reliability. To increase etching efficiency, existing equipment generally performs high-temperature etching. During operation, existing wet etching equipment has an open discharge port, which leads to rapid heat dissipation and significant waste of heat energy. In addition, existing wet etching equipment has shortcomings in liquid flow control, often making it difficult to ensure uniform liquid flow throughout the etching area, which affects etching efficiency. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing an ultra-thin flexible electronic chip etching device. In practical use, this device can perform high-temperature etching while reducing heat loss and energy waste. Furthermore, during etching, the liquid is in a flowing state and can be filtered, thereby improving the etching effect.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: An ultra-thin flexible electronic chip etching device includes a housing with two support frames symmetrically fixedly connected to its lower end, a vertical plate fixedly connected to its upper end, and a horizontal plate fixedly connected to the upper end of the vertical plate; a placement mechanism disposed below the vertical plate, comprising a first lifting plate and a second lifting plate, the first and second lifting plates being fixedly connected by multiple connecting rods, two connecting plates symmetrically fixedly connected to the upper end of the second lifting plate, and a placement box being fixedly connected to the upper end of the two connecting plates, the placement box having multiple through holes on its outer side; an etching mechanism installed inside the housing for etching the chip; and a lifting mechanism for raising and lowering the placement mechanism.

[0005] Preferably, the etching mechanism includes an etching cavity formed inside the housing, the etching cavity being filled with etching fluid, and a rectangular opening being formed at the top of the etching cavity.

[0006] Preferably, the first lifting plate is located above the rectangular opening, and the second lifting plate is located below the rectangular opening. The length and width of the first lifting plate and the second lifting plate are both greater than the left-right spacing and the front-back spacing of the rectangular opening.

[0007] Preferably, the first lifting plate is located above the rectangular opening, and the second lifting plate is located below the rectangular opening. The length and width of the first lifting plate and the second lifting plate are both greater than the left-right spacing and the front-back spacing of the rectangular opening.

[0008] Preferably, two guide rods are symmetrically fixedly connected to the upper end of the first lifting plate, and the upper ends of the two guide rods pass through the horizontal plate and are slidably connected.

[0009] Preferably, the liquid flow mechanism includes a mounting bracket installed at the lower end of the housing, on which a drive motor is mounted. The output shaft of the drive motor extends into the etching cavity and is fitted with a reciprocating lead screw. The upper end of the reciprocating lead screw extends to the outside and is fitted with a rotating disk. A piston cylinder is fixedly connected to the upper end of the housing. A piston block that can slide left and right is provided inside the piston cylinder. A connecting rod is rotatably connected to the upper eccentric part of the rotating disk. The other end of the connecting rod is rotatably connected to the left side of the piston block.

[0010] Preferably, two flow-diverting chambers are symmetrically arranged at the bottom of the housing. Each of the two flow-diverting chambers has multiple flow-diverting holes on its opposite sidewalls. The right side space of the piston cylinder is connected to the inside of the right flow-diverting chamber via a second one-way pipe. A filter box is installed on the left side of the housing. The right side space of the piston cylinder is connected to the top inner space of the filter box via a first one-way pipe. An operating door is installed on the left side of the filter box. The bottom inner space of the filter box is connected to the left flow-diverting chamber via a connecting pipe. A first one-way valve is installed inside the first one-way pipe, and a second one-way valve is installed inside the second one-way pipe. The flow direction of the first one-way valve is unidirectional, from the piston cylinder into the filter box, and the flow direction of the second one-way valve is unidirectional, from the right flow-diverting chamber into the piston cylinder.

[0011] Preferably, the reciprocating lead screw is threadedly connected to a slider inside the etching cavity, the right side of the slider is slidably connected to the right side wall of the etching cavity, and the left side of the slider is fixedly connected to an annular heating wire.

[0012] Compared with the prior art, the beneficial effects of this invention are as follows: 1. The second lifting plate seals the rectangular opening at the initial stage of the equipment, and the first lifting plate seals it again during etching. The double sealing design effectively reduces heat loss and heat energy waste, and makes the etching chamber a relatively closed space, improving heat utilization and reducing energy consumption.

[0013] 2. The liquid flow mechanism drives the piston block to reciprocate, forming a unidirectional liquid flow path, allowing the etching solution to flow continuously and filter impurities through the filter box. This not only removes etching products in a timely manner but also ensures the cleanliness of the etching solution, preventing scratches and contamination of the chip surface and significantly improving etching quality.

[0014] 3. The flowing etching solution continuously refreshes the reaction environment and carries away etching products, ensuring a sustained and efficient etching reaction, greatly improving etching uniformity and efficiency. Simultaneously, the annular heating wire moves up and down with the slider, ensuring uniform heating of the etching solution and further guaranteeing stable and reliable etching quality. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an ultra-thin flexible electronic chip etching device proposed in this invention; Figure 2 for Figure 1 A cross-sectional schematic diagram; Figure 3 for Figure 2 Front view; Figure 4 This is a schematic diagram of the rear side of the piston cylinder section; Figure 5 for Figure 4 A schematic diagram of the cross-sectional structure.

[0016] In the diagram: 1. Housing, 2. Vertical plate, 3. Horizontal plate, 4. Hydraulic telescopic rod, 5. Guide rod, 6. First lifting plate, 7. Connecting rod, 8. Support frame, 9. Etching chamber, 10. Filter box, 11. Operating door, 12. Connecting pipe, 13. Diverting chamber, 14. Diverting hole, 15. Rectangular opening, 16. Second lifting plate, 17. Connecting plate, 18. Placement box, 19. Through hole, 20. Slider, 21. Annular heating wire, 22. Mounting bracket, 23. Drive motor, 24. First one-way tube, 25. Second one-way tube, 26. Piston cylinder, 27. Reciprocating screw, 28. Second one-way valve, 29. Rotating disk, 30. Connecting rod, 31. Piston block, 32. First one-way valve. Detailed Implementation

[0017] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0018] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0019] Reference Figures 1-5 An ultra-thin flexible electronic chip etching device includes a housing 1, with two support frames 8 symmetrically fixedly connected to the lower end of the housing 1, a vertical plate 2 fixedly connected to the upper end of the housing 1, and a horizontal plate 3 fixedly connected to the upper end of the vertical plate 2. As one embodiment of the present invention, a placement mechanism is also included. The placement mechanism is located below the vertical plate 2 and includes a first lifting plate 6 and a second lifting plate 16. The first lifting plate 6 and the second lifting plate 16 are fixedly connected by multiple connecting rods 7. Two connecting plates 17 are symmetrically fixedly connected to the upper end of the second lifting plate 16. The upper ends of the two connecting plates 17 are jointly fixedly connected to a placement box 18. Multiple through holes 19 are opened on the outer side of the placement box 18. The first lifting plate 6 is located above the rectangular through hole 15, and the second lifting plate 16 is located below the rectangular through hole 15. The length and width of the first lifting plate 6 and the second lifting plate 16 are both greater than the left-right distance and the front-back distance of the rectangular through hole 15. In the initial position, the second lifting plate 16 seals the rectangular through hole 15 from below. During the etching operation, the entire placement mechanism moves down until the first lifting plate 6 seals the rectangular through hole 15 from above, which prevents heat from dissipating from the rectangular through hole 15 and reduces the waste of heat energy. As one embodiment of the present invention, it also includes an etching mechanism, which is installed inside the housing 1 and is used to etch the chip. The etching mechanism includes an etching cavity 9 opened inside the housing 1, the etching cavity 9 is filled with etching liquid, and a rectangular through-hole 15 is opened at the top of the inner side of the etching cavity 9. As one embodiment of the present invention, it also includes a lifting mechanism for lifting the placement mechanism. The lifting mechanism includes a hydraulic telescopic rod 4 installed on the upper end of the horizontal plate 3. The telescopic end of the hydraulic telescopic rod 4 passes through the horizontal plate 3 and is fixedly connected to the upper end of the first lifting plate 6. Two guide rods 5 are symmetrically fixedly connected to the upper end of the first lifting plate 6. The upper ends of the two guide rods 5 pass through the horizontal plate 3 together and are slidably connected. As one embodiment of the present invention, a liquid flow mechanism is also included. The liquid flow mechanism is used to improve the etching efficiency. The liquid flow mechanism includes a mounting bracket 22 installed at the lower end of the housing 1. A drive motor 23 is installed on the mounting bracket 22. The output shaft of the drive motor 23 extends into the etching cavity 9 and is equipped with a reciprocating lead screw 27. The upper end of the reciprocating lead screw 27 extends to the outside and is equipped with a rotating disk 29. A piston cylinder 26 is fixedly connected to the upper end of the housing 1. A piston block 31 that can slide left and right is provided inside the piston cylinder 26. A connecting rod 30 is rotatably connected to the upper eccentric part of the rotating disk 29. The other end of the connecting rod 30 is rotatably connected to the left side of the piston block 31. In one embodiment of the present invention, the liquid flow mechanism includes a mounting bracket 22 installed at the lower end of the housing 1. A drive motor 23 is mounted on the mounting bracket 22. The output shaft of the drive motor 23 extends into the etching chamber 9 and is mounted with a reciprocating lead screw 27. The upper end of the reciprocating lead screw 27 extends to the outside and is mounted with a rotating disk 29. A piston cylinder 26 is fixedly connected to the upper end of the housing 1. A piston block 31 that can slide left and right is provided inside the piston cylinder 26. A connecting rod 30 is rotatably connected to the upper eccentric part of the rotating disk 29. The other end of the connecting rod 30 is rotatably connected to the left side of the piston block 31. By using the first one-way valve 32 and the second one-way valve 28, after the drive motor 23 is started, a one-way liquid flow can be generated in the etching chamber 9, the right side diversion chamber 13, the piston cylinder 26, the filter box 10, the left side diversion chamber 13 and the etching chamber 9, which promotes the flow of etching liquid and filters impurities in the liquid. In one embodiment of the present invention, a reciprocating lead screw 27 is threadedly connected to a slider 20 inside the etching cavity 9. The right side of the slider 20 is slidably connected to the right side wall of the etching cavity 9, and an annular heating wire 21 is fixedly connected to the left side of the slider 20.

[0020] In this invention, when the device is in its initial state, the second lifting plate 16 in the placement mechanism is located below the rectangular opening 15 and seals the rectangular opening 15 from below to prevent heat loss from the etching cavity 9. At this time, the etching cavity 9 is filled with etching fluid, and the annular heating wire 21 is in working condition to ensure that the etching fluid is at a suitable temperature. The ultra-thin flexible electronic chip to be etched is placed in the placement box 18. Multiple through holes 19 on the outside of the placement box 18 facilitate full contact between the etching solution and the chip. Then, the hydraulic telescopic rod 4 in the lifting mechanism is activated. The telescopic end of the hydraulic telescopic rod 4 extends downward, driving the first lifting plate 6, which is fixedly connected to it, to move downward. Since the first lifting plate 6 and the second lifting plate 16 are fixedly connected by multiple connecting rods 7, the second lifting plate 16 will also move downward synchronously. During the downward movement, the second lifting plate 16 gradually moves away from the rectangular opening 15, while the first lifting plate 6 gradually moves closer to the rectangular opening 15. When the first lifting plate 6 moves to seal the rectangular opening 15 from above, the action of the hydraulic telescopic rod 4 is stopped. At this time, the etching cavity 9 forms a relatively closed space, effectively preventing heat from escaping from the rectangular opening 15 and reducing the waste of heat energy. The drive motor 23 in the liquid flow mechanism is started, and the output shaft of the drive motor 23 begins to rotate, driving the reciprocating screw 27 connected to it to rotate. The upper end of the reciprocating screw 27 extends to the outside and is equipped with a rotating disk 29, which rotates synchronously with the reciprocating screw 27. The other end of the connecting rod 30, which is eccentrically connected at the upper end of the rotating disk 29, is rotatably connected to the left side of the piston block 31 inside the piston cylinder 26. As the rotating disk 29 rotates, the connecting rod 30 drives the piston block 31 to slide back and forth inside the piston cylinder 26, utilizing the first single... The cooperation of the directional valve 32 and the second one-way valve 28 can create a one-way flow path between the etching chamber 9, the right side flow chamber 13, the piston cylinder 26, the filter box 10, the left side flow chamber 13 and the etching chamber 9. During the flow of the etching solution, when the etching solution passes through the filter box 10, the filter box 10 filters the impurities in the etching solution, blocking etching products, impurities and particles in the filter box 10, so that the etching solution entering the etching chamber 9 remains relatively clean, avoiding impurities from causing scratches and contamination to the chip surface, and ensuring the etching quality. When the etching solution reaches a suitable temperature and is in a state of continuous flow and filtration, the etching solution comes into full contact with the chip through the through hole 19 on the outside of the placement box 18, and a chemical reaction occurs to etch the chip. Because the etching solution is in a flowing state, it can continuously carry away the etching products, so that the etching reaction can continue to proceed efficiently, improving the uniformity and efficiency of etching. At the same time, when the reciprocating screw 27 rotates, the slider 20 connected to its thread moves up and down in the etching cavity 9 (because the right side of the slider 20 is slidably connected to the right side wall of the etching cavity 9, its rotation is restricted). The slider 20 drives the annular heating wire 21 to move up and down in the etching cavity 9, so that the etching solution is heated more evenly, further ensuring the etching quality. After the chip etching is completed, the annular heating wire 21 and drive motor 23 are turned off to stop heating and promoting the flow of the etching solution. Then, the hydraulic telescopic rod 4 is activated, causing its telescopic end to retract upward, which moves the first lifting plate 6 upward. This, in turn, moves the second lifting plate 16 and the placement box 18 upward through the connecting rod 7. When the second lifting plate 16 moves to reseal the rectangular opening 15 from below, the action of the hydraulic telescopic rod 4 is stopped, and the equipment returns to its initial state. At this time, the etched ultra-thin flexible electronic chip can be removed from the placement box 18, and the equipment can be cleaned and maintained to prepare for the next etching operation.

[0021] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0022] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An etching apparatus for ultra-thin flexible electronic chips, characterized in that, include: The shell (1) has two support frames (8) symmetrically fixedly connected to its lower end, and a vertical plate (2) is fixedly connected to its upper end. A horizontal plate (3) is fixedly connected to the upper end of the vertical plate (2). The placement mechanism is located below the vertical plate (2). The placement mechanism includes a first lifting plate (6) and a second lifting plate (16). The first lifting plate (6) and the second lifting plate (16) are fixedly connected by multiple connecting rods (7). Two connecting plates (17) are symmetrically fixedly connected to the upper end of the second lifting plate (16). The upper ends of the two connecting plates (17) are jointly fixedly connected to a placement box (18). Multiple through holes (19) are opened on the outside of the placement box (18). An etching mechanism is installed inside the housing (1) and is used to etch the chip. A lifting mechanism, which is used to lift the placement mechanism; A liquid flow mechanism is provided to improve etching efficiency.

2. The ultra-thin flexible electronic chip etching equipment according to claim 1, characterized in that, The etching mechanism includes an etching cavity (9) inside the housing (1), the etching cavity (9) is filled with etching liquid, and a rectangular opening (15) is provided at the top of the etching cavity (9).

3. The ultra-thin flexible electronic chip etching equipment according to claim 2, characterized in that, The first lifting plate (6) is located above the rectangular opening (15), and the second lifting plate (16) is located below the rectangular opening (15). The length and width of the first lifting plate (6) and the second lifting plate (16) are both greater than the left-right spacing and the front-back spacing of the rectangular opening (15).

4. The ultra-thin flexible electronic chip etching equipment according to claim 1, characterized in that, The lifting mechanism includes a hydraulic telescopic rod (4) installed on the upper end of the horizontal plate (3). The telescopic end of the hydraulic telescopic rod (4) passes through the horizontal plate (3) and is fixedly connected to the upper end of the first lifting plate (6).

5. The ultra-thin flexible electronic chip etching equipment according to claim 4, characterized in that, The upper end of the first lifting plate (6) is symmetrically fixedly connected with two guide rods (5), and the upper ends of the two guide rods (5) pass through the horizontal plate (3) and are slidably connected.

6. The ultra-thin flexible electronic chip etching equipment according to claim 2, characterized in that, The liquid flow mechanism includes a mounting bracket (22) installed at the lower end of the housing (1). A drive motor (23) is mounted on the mounting bracket (22). The output shaft of the drive motor (23) extends into the etching cavity (9) and is equipped with a reciprocating screw (27). The upper end of the reciprocating screw (27) extends to the outside and is equipped with a rotating disk (29). A piston cylinder (26) is fixedly connected to the upper end of the housing (1). A piston block (31) that can slide left and right is provided inside the piston cylinder (26). A connecting rod (30) is rotatably connected to the upper eccentric part of the rotating disk (29). The other end of the connecting rod (30) is rotatably connected to the left side of the piston block (31).

7. The ultra-thin flexible electronic chip etching equipment according to claim 6, characterized in that, Two flow-diverting chambers (13) are symmetrically arranged at the bottom of the housing (1). Multiple flow-diverting holes (14) are opened on the opposite sidewalls of the two flow-diverting chambers (13). The right side space of the piston cylinder (26) is connected to the inside of the right flow-diverting chamber (13) through a second one-way pipe (25). A filter box (10) is installed on the left side of the housing (1). The right side space of the piston cylinder (26) is connected to the inner top space of the filter box (10) through a first one-way pipe (24). An operating door (11) is installed on the left side of the filter box (10). The bottom space inside the filter box (10) is connected to the left diversion chamber (13) through a connecting pipe (12). A first one-way valve (32) is installed inside the first one-way pipe (24), and a second one-way valve (28) is installed inside the second one-way pipe (25). The flow direction of the first one-way valve (32) is that the piston cylinder (26) enters the filter box (10) in one direction, and the flow direction of the second one-way valve (28) is that the right diversion chamber (13) enters the piston cylinder (26) in one direction.

8. The ultra-thin flexible electronic chip etching equipment according to claim 7, characterized in that, The reciprocating lead screw (27) is threadedly connected to a slider (20) inside the etching cavity (9). The right side of the slider (20) is slidably connected to the right side wall of the etching cavity (9), and the left side of the slider (20) is fixedly connected to an annular heating wire (21).

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