An extremely thin flexible electronic chip etching device

Abstract

The application discloses an extremely thin flexible electronic chip etching equipment, which comprises a shell, two supporting frames are symmetrically and fixedly connected to the lower end of the shell, a vertical plate is fixedly connected to the upper end of the shell, and a horizontal plate is fixedly connected to the upper end of the vertical plate; a placing mechanism is arranged below the vertical plate, the placing mechanism comprises a first lifting plate and a second lifting plate, the first lifting plate is fixedly connected with the second lifting plate through a plurality of connecting rods, two connecting plates are symmetrically and fixedly connected to the upper end of the second lifting plate, a placing box is fixedly connected to the upper end of the two connecting plates, and a plurality of through holes are formed in the outer side of the placing box; and an etching mechanism is installed in the shell. In the actual use process, the equipment can be used for high-temperature etching, can reduce temperature dissipation, reduces heat energy waste, and can filter liquid when etching, so that the etching effect is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the field of chip etching, in particular to a very thin flexible electronic chip etching device. BACKGROUND

[0002] With the rapid development of electronic technology, as a new electronic component, the very thin flexible electronic chip is gradually becoming the focus of market attention. Compared with traditional rigid chips, the very thin flexible electronic chip has many advantages such as thinness, bendability and foldability, and can meet the diversified needs of electronic product form and function in many emerging fields such as wearable devices, flexible display screens and intelligent packaging. Etching is one of the core processes in chip manufacturing, which selectively removes the material on the surface of the chip through physical or chemical methods, so as to form the required circuit pattern and structure. For the very thin flexible electronic chip, the precision and quality of the etching process directly affect the performance and reliability of the chip.

[0003] In order to increase the etching efficiency, the existing device generally performs high-temperature etching. In the running process of the existing wet etching device, since the discharge port is in an open state, the temperature is dissipated quickly, and the heat energy is wasted.

[0004] In addition, the existing wet etching device has defects in liquid flow control, and it is often difficult to ensure uniform flow of the liquid in the entire etching area, which affects the etching efficiency. SUMMARY

[0005] The purpose of the present application is to solve the problems in the prior art, and a very thin flexible electronic chip etching device is provided. The device can perform high-temperature etching in actual use, reduce temperature dissipation and heat energy waste, and the liquid is in a flowing state during etching. The liquid can be filtered to improve the etching effect.

[0006] In order to achieve the above purpose, the application adopts the following technical scheme:

[0007] A very thin flexible electronic chip etching device, comprising a shell, two support frames are symmetrically fixedly connected to the lower end of the shell, a vertical plate is fixedly connected to the upper end of the shell, and a horizontal plate is fixedly connected to the upper end of the vertical plate; a placing mechanism is arranged below the vertical plate, the placing mechanism comprises a first lifting plate and a second lifting plate, the first lifting plate and the second lifting plate are fixedly connected through a plurality of connecting rods, two connecting plates are symmetrically fixedly connected to the upper end of the second lifting plate, a placing box is fixedly connected to the upper end of the two connecting plates, and a plurality of through holes are formed in the outer side of the placing box; an etching mechanism is installed in the shell and used for etching the chip; and a lifting mechanism is used for lifting the placing mechanism.

[0008] Preferably, the etching mechanism comprises an etching cavity opened in the inside of the shell, the etching cavity is filled with etching liquid, and a rectangular opening is opened in the inner top of the etching cavity.

[0009] Preferably, the first lifting plate is located above the rectangular opening, the second lifting plate is located below the rectangular opening, and the length and width of the first lifting plate and the second lifting plate are greater than the left-right interval and the front-rear interval of the rectangular opening.

[0010] Preferably, the first lifting plate is located above the rectangular opening, the second lifting plate is located below the rectangular opening, and the length and width of the first lifting plate and the second lifting plate are greater than the left-right interval and the front-rear interval of the rectangular opening.

[0011] Preferably, the upper end of the first lifting plate is fixedly connected with two guide rods in a symmetrical manner, the upper ends of the two guide rods penetrate through the horizontal plate and are connected in a sliding manner.

[0012] Preferably, the liquid flow mechanism comprises a mounting frame mounted at the lower end of the shell, a driving motor is mounted on the mounting frame, the output shaft of the driving motor extends into the etching cavity, a reciprocating screw rod is mounted, the upper end of the reciprocating screw rod extends to the outside, a rotating disc is mounted, the upper end of the rotating disc is eccentrically connected with a connecting rod, and the other end of the connecting rod is rotatably connected with the left side of the piston block.

[0013] Preferably, two shunt cavities are symmetrically arranged in the inner bottom of the shell, a plurality of shunt holes are arranged in the opposite side walls of the two shunt cavities, the right side space of the piston cylinder is in communication with the inside of the right shunt cavity through a second one-way pipe, a filter box is mounted on the left side of the shell, the right side space of the piston cylinder is in communication with the inner top space of the filter box through a first one-way pipe, an operating door is mounted on the left side of the filter box, the inner bottom space of the filter box is in communication with the left shunt cavity through a communication pipe, a first one-way valve is mounted in the first one-way pipe, a second one-way valve is mounted in the second one-way pipe, the flow direction of the first one-way valve is that the piston cylinder unidirectionally enters the filter box, and the flow direction of the second one-way valve is that the right shunt cavity unidirectionally enters the piston cylinder.

[0014] Preferably, a sliding block is threadedly connected in the reciprocating screw rod, the right side of the sliding block is slidably connected with the right side wall of the etching cavity, and an annular electric heating wire is fixedly connected to the left side of the sliding block.

[0015] Compared with the prior art, the present application has the following advantages:

[0016] 1. The second lifting plate seals the rectangular opening initially, and the first lifting plate reseals during etching, so that the double sealing design effectively reduces heat overflow, reduces heat waste, forms a relatively closed space in the etching cavity, improves heat utilization rate, and reduces energy consumption.

[0017] 2. The liquid flow mechanism drives the piston block to reciprocate, forms a one-way liquid flow path, and makes the etching liquid flow continuously and filter impurities through the filter box. This can not only remove etching products in time, but also ensure the cleanliness of the etching liquid, avoid scratching and contaminating the chip surface, and significantly improve the etching quality.

[0018] 3. The flowing etching liquid continuously updates the reaction environment and removes etching products, so that the etching reaction continues efficiently, greatly improving the etching uniformity and efficiency. At the same time, the annular heating wire moves up and down with the slider, so that the etching liquid is uniformly heated, further ensuring the stability and reliability of the etching quality. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A structure diagram of a very thin flexible electronic chip etching device is provided.

[0020] Figure 2 A cross-sectional view of Figure 1 A front view of

[0021] Figure 3 A front view of Figure 2 A rear view of the piston cylinder part

[0022] Figure 4 A cross-sectional view of

[0023] Figure 5 A cross-sectional view of Figure 4

[0024] In the figure: 1 housing, 2 vertical plate, 3 horizontal plate, 4 hydraulic telescopic rod, 5 guide rod, 6 first lifting plate, 7 connecting rod, 8 support frame, 9 etching cavity, 10 filter box, 11 operation door, 12 communication pipe, 13 shunt cavity, 14 shunt hole, 15 rectangular opening, 16 second lifting plate, 17 connecting plate, 18 placing box, 19 through hole, 20 slider, 21 annular heating wire, 22 mounting frame, 23 drive motor, 24 first one-way pipe, 25 second one-way pipe, 26 piston cylinder, 27 reciprocating screw rod, 28 second one-way valve, 29 rotating disc, 30 connecting rod, 31 piston block, 32 first one-way valve. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application.

[0026] ​It is to be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments consistent with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0027] Referring to Figures 1-5 A very thin flexible electronic chip etching device, including a shell 1, the lower end of the shell 1 is symmetrically fixedly connected with two support frames 8, the upper end of the shell 1 is fixedly connected with a vertical plate 2, the upper end of the vertical plate 2 is fixedly connected with a horizontal plate 3;

[0028] As an embodiment of the present application, it also includes a placing mechanism, the placing mechanism is arranged below the vertical plate 2, the placing mechanism includes a first lifting plate 6 and a second lifting plate 16, the first lifting plate 6 and the second lifting plate 16 are fixedly connected through a plurality of connecting rods 7, the upper end of the second lifting plate 16 is symmetrically fixedly connected with two connecting plates 17, the upper end of the two connecting plates 17 is commonly fixedly connected with a placing box 18, a plurality of through holes 19 are formed in the outer side of the placing box 18, the first lifting plate 6 is located above the rectangular opening 15, the second lifting plate 16 is located below the rectangular opening 15, the length and width of the first lifting plate 6 and the second lifting plate 16 are both greater than the left-right interval and the front-rear interval of the rectangular opening 15, in the initial position, the second lifting plate 16 seals the rectangular opening 15 from below, in the etching operation, the whole placing mechanism moves downward, to the first lifting plate 6 seals the rectangular opening 15 from above, avoiding the heat from the rectangular opening 15 to overflow, reducing the waste of heat energy;

[0029] As an embodiment of the present application, it also includes an etching mechanism, the etching mechanism is installed inside the shell 1, for etching treatment of the chip, the etching mechanism includes an etching cavity 9 formed in the shell 1, the etching cavity 9 is filled with etching liquid, a rectangular opening 15 is formed in the inner top of the etching cavity 9;

[0030] As an embodiment of the present application, it also includes a lifting mechanism, the lifting mechanism is used for lifting the placing mechanism, the lifting mechanism includes a hydraulic telescopic rod 4 installed on the upper end of the horizontal plate 3, the telescopic end of the hydraulic telescopic rod 4 penetrates through the horizontal plate 3 and is fixedly connected with the upper end of the first lifting plate 6, the upper end of the first lifting plate 6 is symmetrically fixedly connected with two guide rods 5, the upper ends of the two guide rods 5 commonly penetrate through the horizontal plate 3 and are slidingly connected;

[0031] As one of the embodiments of the present application, the liquid flow mechanism is used to improve the etching efficiency, and the liquid flow mechanism comprises a mounting frame 22 mounted on the lower end of the shell 1, a driving motor 23 mounted on the mounting frame 22, an output shaft of the driving motor 23 extending into the etching cavity 9, a reciprocating screw rod 27, an upper end of the reciprocating screw rod 27 extending to the outside, a rotating disc 29, a piston cylinder 26 fixedly connected to the upper end of the shell 1, a piston block 31 slidably arranged in the piston cylinder 26, a connecting rod 30 rotatably connected to the upper end of the rotating disc 29, and the other end of the connecting rod 30 rotatably connected to the left side of the piston block 31.

[0032] As one of the embodiments of the present application, the liquid flow mechanism comprises a mounting frame 22 mounted on the lower end of the shell 1, a driving motor 23 mounted on the mounting frame 22, an output shaft of the driving motor 23 extending into the etching cavity 9, a reciprocating screw rod 27, an upper end of the reciprocating screw rod 27 extending to the outside, a rotating disc 29, a piston cylinder 26 fixedly connected to the upper end of the shell 1, a piston block 31 slidably arranged in the piston cylinder 26, a connecting rod 30 rotatably connected to the upper end of the rotating disc 29, and the other end of the connecting rod 30 rotatably connected to the left side of the piston block 31.

[0033] As one of the embodiments of the present application, the reciprocating screw rod 27 is threadedly connected with a sliding block 20 in the etching cavity 9, the right side of the sliding block 20 is slidably connected with the right side wall of the etching cavity 9, and the left side of the sliding block 20 is fixedly connected with an annular electric heating wire 21.

[0034] In the present application, when the device is in the initial state, the second lifting plate 16 in the placing mechanism is located below the rectangular through hole 15 and seals the rectangular through hole 15 from below to prevent the heat in the etching cavity 9 from being lost.

[0035] The ultra-thin flexible electronic chip to be etched is placed in the placing box 18, and the multiple through holes 19 formed on the outer side of the placing box 18 facilitate the full contact of the etching liquid with the chip. Then, the hydraulic telescopic rod 4 in the lifting mechanism is started, and the telescopic end of the hydraulic telescopic rod 4 extends downward to drive the first lifting plate 6 fixedly connected thereto to move downward. Since the first lifting plate 6 is fixedly connected with the second lifting plate 16 through the multiple connecting rods 7, the second lifting plate 16 will also move downward synchronously. During the downward movement, the second lifting plate 16 gradually moves away from the rectangular opening 15, and at the same time, the first lifting plate 6 gradually moves closer to the rectangular opening 15. When the first lifting plate 6 moves to seal the rectangular opening 15 from above, the action of the hydraulic telescopic rod 4 is stopped. At this time, the etching cavity 9 forms a relatively closed space, effectively avoiding the heat from overflowing from the rectangular opening 15, and reducing the waste of heat energy.

[0036] The driving motor 23 in the liquid flow mechanism is started, and the output shaft of the driving motor 23 starts to rotate to drive the reciprocating screw rod 27 connected thereto to rotate. The upper end of the reciprocating screw rod 27 extends to the outside and is provided with a rotating disc 29. The rotating disc 29 rotates synchronously with the reciprocating screw rod 27. The connecting rod 30 rotatably connected to the upper end of the rotating disc 29 eccentrically is rotatably connected to the other end of the piston block 31 in the piston cylinder 26. With the rotation of the rotating disc 29, the connecting rod 30 drives the piston block 31 to slide left and right in the piston cylinder 26. By the cooperation of the first one-way valve 32 and the second one-way valve 28, the one-way flow paths of the etching cavity 9, the right side shunt cavity 13, the piston cylinder 26, the filter box 10, the left side shunt cavity 13 and the etching cavity 9 are formed. During the flow of the etching liquid, when the etching liquid passes through the filter box 10, the filter box 10 filters the impurities in the etching liquid, blocks the etching products, impurities and particulate matters in the filter box 10, keeps the etching liquid entering the etching cavity 9 relatively clean, avoids the problems of scratching and pollution of the chip surface caused by impurities, and ensures the etching quality.

[0037] When the etching liquid reaches the appropriate temperature and is in a state of continuous flow and filtration, the etching liquid fully contacts the chip through the through holes 19 on the outer side of the placing box 18, chemical reactions occur, and the chip is etched. Since the etching liquid is in a flowing state, it can continuously remove the etching products, so that the etching reaction continuously and efficiently proceeds, and the uniformity and efficiency of etching are improved. At the same time, when the reciprocating screw rod 27 rotates, the sliding block 20 connected therewith moves up and down in the etching cavity 9 (since the right side of the sliding block 20 is slidably connected with the right side wall of the etching cavity 9, the rotation of the sliding block 20 is limited), and the ring-shaped electric heating wire 21 moves up and down in the etching cavity 9 driven by the sliding block 20, so that the etching liquid is heated more uniformly, and the etching quality is further ensured.

[0038] When the chip etching is completed, the annular electric heating wire 21 and the driving motor 23 are turned off, and the heating and flow promotion of the etching liquid are stopped; then, the hydraulic telescopic rod 4 is started, and the telescopic end is retracted upwards, driving the first lifting plate 6 to move upwards, and then driving the second lifting plate 16 and the placing box 18 to move upwards through the connecting rod 7; when the second lifting plate 16 moves to reseal the rectangular through hole 15 from below, the action of the hydraulic telescopic rod 4 is stopped, and the equipment returns to the initial state; at this time, the etching completed ultra-thin flexible electronic chip can be taken out from the placing box 18, and the equipment is cleaned and maintained, so as to prepare for the next etching operation.

[0039] It should be noted that the terms "first", "second", and the like in the description and in the claims of the present application and in the above-described drawings are used to distinguish similar objects and are not necessarily used to describe a particular sequential or chronological order. It should be understood that the data thus used can be interchanged, where appropriate, so that the embodiments of the present application described herein can be carried out in a different order than that illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover not exclusively containing, for example, a process, method, system, product, or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products, or devices.

[0040] The above description is only the preferred embodiment of the present application, and the protection scope of the present application is not limited thereto. Any person skilled in the art, according to the technical solution and the inventive concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. An ultra-thin flexible electronic chip etching apparatus, characterized by, include: The shell (1) has two support frames (8) symmetrically fixedly connected to its lower end, and a vertical plate (2) is fixedly connected to its upper end. A horizontal plate (3) is fixedly connected to the upper end of the vertical plate (2). The placement mechanism is located below the vertical plate (2). The placement mechanism includes a first lifting plate (6) and a second lifting plate (16). The first lifting plate (6) and the second lifting plate (16) are fixedly connected by multiple connecting rods (7). Two connecting plates (17) are symmetrically fixedly connected to the upper end of the second lifting plate (16). The upper ends of the two connecting plates (17) are jointly fixedly connected to a placement box (18). Multiple through holes (19) are opened on the outside of the placement box (18). An etching mechanism is installed inside the housing (1) and is used to etch the chip. A lifting mechanism, which is used to lift the placement mechanism; A liquid flow mechanism is provided to improve etching efficiency. 2.The ultra-thin flexible electronic chip etching device of claim 1, wherein, The etching mechanism includes an etching cavity (9) inside the housing (1), the etching cavity (9) is filled with etching liquid, and a rectangular opening (15) is provided at the top of the etching cavity (9).

3. The etching device of claim 2, wherein the etching device is configured to etch the electronic chip to a thickness of less than 100 microns. The first lifting plate (6) is located above the rectangular opening (15), and the second lifting plate (16) is located below the rectangular opening (15). The length and width of the first lifting plate (6) and the second lifting plate (16) are both greater than the left-right spacing and the front-back spacing of the rectangular opening (15).

4. The ultra-thin flexible electronic chip etching equipment according to claim 1, characterized in that, The lifting mechanism includes a hydraulic telescopic rod (4) installed on the upper end of the horizontal plate (3). The telescopic end of the hydraulic telescopic rod (4) passes through the horizontal plate (3) and is fixedly connected to the upper end of the first lifting plate (6).

5. The ultra-thin flexible electronic chip etching equipment according to claim 4, characterized in that, The upper end of the first lifting plate (6) is symmetrically fixedly connected with two guide rods (5), and the upper ends of the two guide rods (5) pass through the horizontal plate (3) and are slidably connected.

6. The ultra-thin flexible electronic chip etching equipment according to claim 2, characterized in that, The liquid flow mechanism includes a mounting bracket (22) installed at the lower end of the housing (1). A drive motor (23) is mounted on the mounting bracket (22). The output shaft of the drive motor (23) extends into the etching cavity (9) and is equipped with a reciprocating screw (27). The upper end of the reciprocating screw (27) extends to the outside and is equipped with a rotating disk (29). A piston cylinder (26) is fixedly connected to the upper end of the housing (1). A piston block (31) that can slide left and right is provided inside the piston cylinder (26). A connecting rod (30) is rotatably connected to the upper eccentric part of the rotating disk (29). The other end of the connecting rod (30) is rotatably connected to the left side of the piston block (31).

7. The ultra-thin flexible electronic chip etching equipment according to claim 6, characterized in that, Two flow-diverting chambers (13) are symmetrically arranged at the bottom of the housing (1). Multiple flow-diverting holes (14) are opened on the opposite sidewalls of the two flow-diverting chambers (13). The right side space of the piston cylinder (26) is connected to the inside of the right flow-diverting chamber (13) through a second one-way pipe (25). A filter box (10) is installed on the left side of the housing (1). The right side space of the piston cylinder (26) is connected to the inner top space of the filter box (10) through a first one-way pipe (24). An operating door (11) is installed on the left side of the filter box (10). The bottom space inside the filter box (10) is connected to the left diversion chamber (13) through a connecting pipe (12). A first one-way valve (32) is installed inside the first one-way pipe (24), and a second one-way valve (28) is installed inside the second one-way pipe (25). The flow direction of the first one-way valve (32) is that the piston cylinder (26) enters the filter box (10) in one direction, and the flow direction of the second one-way valve (28) is that the right diversion chamber (13) enters the piston cylinder (26) in one direction.

8. The ultra-thin flexible electronic chip etching equipment according to claim 7, characterized in that, The reciprocating lead screw (27) is threadedly connected to a slider (20) inside the etching cavity (9). The right side of the slider (20) is slidably connected to the right side wall of the etching cavity (9), and the left side of the slider (20) is fixedly connected to an annular heating wire (21).

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