A wafer batch clamping and transfer device

Abstract

This invention provides a wafer batch clamping and transfer device, comprising: a driving mechanism and a clamping mechanism. The driving mechanism includes a lifting mechanism and a rotating mechanism. The clamping mechanism includes a first clamping member and a second clamping member. The rotating mechanism drives one end of the first clamping member and the second clamping member to move closer together to batch clamp a number of wafers supported by a wafer basket. The lifting mechanism drives the rotating mechanism to move back along the height direction to raise the first clamping member and the second clamping member. The rotating mechanism drives the first clamping member and the second clamping member to flip to the other end to clamp the protrusions on both sides of the wafer basket. This invention can separately clamp and transfer the wafer basket and separately clamp and transfer wafers in batches. It has the advantage of high transfer efficiency for scenarios that only require batch clamping and transfer of wafers, and also has the advantage of simple structure.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor production equipment, in particular to a wafer batch clamping and transferring device. BACKGROUND

[0002] In the process of wafer processing, the wafer surface is contaminated by various pollutants such as organic matter, particles and metal impurities, so the wafer needs to be cleaned. In the process of tank cleaning of the wafer, the wafer basket is used to store the wafer in batches, and after cleaning is completed, the wafer is taken out from the tank cleaning equipment by taking out the wafer basket.

[0003] The existing patent CN114267610B discloses a wafer basket clamping and taking mechanical hand with anti-falling and alarm function, which comprises a rotating assembly fixed on a lifting shaft, a rotating rod, a bearing positioning seat, a buffer assembly, a clamping assembly for taking and placing a wafer basket, and an alarm flash and a touch sensor sheet. The rotating assembly comprises a push cylinder, an inclined slide block, a rotating seat arranged symmetrically left and right, a pin shaft and a rolling ball. The two ends of the rotating rod are positioned with the bearing positioning seat. One end of the rotating rod is fixedly connected with the rotating assembly, and the other end is connected with the clamping jaw through the buffer assembly. The clamping jaw comprises a locking block, a tightening nut, a clamping rod and a clamping arm. The tightening nut is further fixedly connected with the touch sensor sheet.

[0004] The above-mentioned existing technology uses a mechanical hand to take and place the wafer basket as a whole. It should be noted that the wafer basket in the tank cleaning equipment is used to support the wafer in batches. The mechanical hand in the above-mentioned existing technology needs to take out the wafer basket and the wafer stored in it from the tank cleaning equipment at the same time each time, which causes the mechanical hand to have the problems of large floor area and complex structure, and the efficiency of taking out the wafer basket is low.

[0005] Therefore, it is necessary to improve the wafer batch clamping mechanical hand of the tank cleaning equipment in the prior art to solve the above-mentioned problems. It should be noted that the above-mentioned introduction of background technology is only for the convenience of clearly and completely describing the technical scheme of the present application, and for the convenience of understanding by those skilled in the art. The above-mentioned technical scheme cannot be considered as known by those skilled in the art only because it is described in the background technology part of the present application. SUMMARY

[0006] The purpose of the present application is to disclose a wafer batch clamping and transferring device, which can realize clamping and transferring of the wafer basket and batch clamping and transferring of the wafer separately. It has the advantages of high transfer efficiency and simple structure in the scene of only needing to batch clamp and transfer the wafer.

[0007] In order to achieve the above object, the present application provides a wafer batch clamping and transferring device, comprising a driving mechanism and a clamping mechanism, the driving mechanism comprising a lifting mechanism and a rotating mechanism, the clamping mechanism comprising a first clamping member and a second clamping member, the rotating mechanism driving one end of the first clamping member and the second clamping member to approach each other to clamp a plurality of wafers supported by a wafer basket in batches.

[0008] The lifting mechanism drives the rotating mechanism to reciprocate along the height direction to lift the first clamping member and the second clamping member, and the rotating mechanism drives the first clamping member and the second clamping member to overturn to the other end to clamp the protrusions on both sides of the wafer basket through the first clamping member and the second clamping member.

[0009] As a further improvement of the present application, the first clamping member is uniformly provided with a plurality of first clamping grooves at the end driven to overturn by the rotating mechanism, and the second clamping member is symmetrically provided with a plurality of second clamping grooves corresponding to the number of the first clamping grooves, and the rotating mechanism drives the plurality of first clamping grooves and second clamping grooves to approach each other to synchronously clamp the upper edges of the plurality of wafers protruding from the opening on the top of the wafer basket.

[0010] The lifting mechanism drives the first clamping member and the second clamping member to rise, and the first clamping member far from the side provided with the first clamping grooves and the second clamping member far from the side provided with the second clamping grooves are driven to overturn by the rotating mechanism and approach each other to synchronously clamp the lower edges of the protrusions on both sides of the wafer basket.

[0011] As a further improvement of the present application, the rotating mechanism comprises a driving motor and a gear set, the gear set comprising a first driving wheel, a first driven wheel, a second driven wheel and a second driving wheel arranged perpendicular to the height direction of the lifting mechanism and meshing with each other, the driving end of the driving motor being coaxially fixed with the first driving wheel, the first driving wheel being coaxially fixed with a first rotating shaft at the end far from the driving motor, the first rotating shaft being axially fixed to the side wall of the first clamping member;

[0012] The first driving wheel rotates while driving the second driving wheel to rotate in the direction opposite to the first driving wheel through the first driven wheel and the second driven wheel, the second driving wheel being coaxially fixed with a second rotating shaft, the second rotating shaft being axially fixed to the side wall of the second clamping member.

[0013] As a further improvement of the present invention, the first clamping member and the second clamping member are both composed of a mounting frame, a first clamping member and a second clamping member. The first rotating shaft and the second rotating shaft are respectively connected to the mounting frames of the first clamping member and the second clamping member on the side close to each other. A plurality of the first clamping grooves are evenly opened along the length direction on the side of the first clamping member away from the mounting frame.

[0014] The second clamping member is configured as a rod and connected to the mounting frame on the side away from the first clamping member. The second clamping member forms a relief groove on the side that contacts the sidewall of the wafer basket.

[0015] As a further improvement of the present invention, the mounting frame includes two parallel connecting rods and a connecting seat. The connecting seat is vertically fixed between the two connecting rods, and the first rotating shaft and the second rotating shaft are respectively fixed to the side wall of the connecting seat along the length direction.

[0016] Both the first rotating shaft and the second rotating shaft have a first mounting surface and a second mounting surface along their length. The first mounting surface and the second mounting surface are symmetrical about the diameter distribution of the first rotating shaft and the second rotating shaft. The first mounting surface is fitted to the connecting seat, and the second mounting surface is fitted to and fixed to the first clamping member.

[0017] As a further improvement of the present invention, the first clamping member includes a connector and a clamping device. The connector has a first connecting plate and a second connecting plate that are perpendicular to each other. The side of the first connecting plate away from the second connecting plate is attached to and fixed to the second mounting surface.

[0018] Several first clamping slots and second clamping slots are respectively formed on the side of the two clamping devices away from the second connecting plate. During the flipping process of the first clamping member and the second clamping member, the first clamping slots and the second clamping slots gradually approach and clamp several wafers at the edge extending from above the wafer basket.

[0019] As a further improvement of the present invention, it also includes: a mounting base, the mounting base including a base plate, a first mounting plate and a second mounting plate, the first mounting plate and the second mounting plate being vertically fixed to both sides of the base plate along its length direction, the first driving wheel, the first driven wheel, the second driven wheel and the second driving wheel being rotatably connected between the first mounting plate and the second mounting plate, the first rotating shaft and the second rotating shaft passing through the second mounting plate and being connected to the first clamping member and the second clamping member respectively, and the first mounting plate being connected to the driving end of the lifting mechanism.

[0020] As a further improvement of the present invention, the side of the second clamping member away from the relief groove is formed into an arc-shaped surface, and a plurality of hollow grooves are formed at the contact point between the arc-shaped surface and the protrusion of the wafer basket.

[0021] As a further improvement of the present invention, the connecting seat is configured as an H-shaped component and has a plurality of first mounting holes, the first connecting plate has a plurality of first waist-shaped holes formed along the length direction, and the connecting seat and the first connecting plate are locked and fixed by a connector passing through the first waist-shaped holes, the first rotating shaft or the second rotating shaft and the first mounting holes in sequence.

[0022] The second connecting plate has several second mounting holes, and the clamping device has several second waist-shaped holes along the height direction. The second connecting plate and the clamping device are fixed to each other by a connector passing through the second waist-shaped holes and the second mounting holes.

[0023] Compared with the prior art, the beneficial effects of the present invention are: it has a driving mechanism and a clamping mechanism, wherein the driving mechanism includes a lifting mechanism and a rotating mechanism. The rotating mechanism controls the flipping of the first clamping member and the second clamping member constituting the clamping mechanism. When it is necessary to perform batch clamping of the wafers themselves, the rotating mechanism controls one end of the first clamping member and the second clamping member to move closer to each other to batch clamp several wafers stored in the wafer basket. When it is necessary to lift the wafer basket as a whole, the rotating mechanism drives the first clamping member and the second clamping member to rise a certain distance along the driving mechanism. Then, the rotating mechanism controls the first clamping mechanism and the second clamping member to flip so that the first clamping member and the second clamping member move away from the side of the first clamping member used to clamp the wafers and clamp the wafer basket. Then, the wafer batch clamping and transfer equipment is lifted from the equipment containing the wafer basket (e.g., a tank cleaning equipment) by other driving mechanisms. Compared with existing technologies, by controlling the flipping action of the first clamping component and the second clamping component through a rotating mechanism, the first clamping component and the second clamping component can achieve different clamping functions on both sides. This allows for the batch clamping and transfer of wafers stored in the wafer basket without lifting the wafer basket, resulting in higher wafer clamping and transfer efficiency. This can, to a certain extent, improve the efficiency of the entire wafer production process. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the state of wafer batch clamping and transfer equipment in this invention.

[0025] Figure 2 This is a schematic diagram illustrating the state of wafer basket clamping in the wafer batch clamping and transfer equipment of the present invention;

[0026] Figure 3 for Figure 1 Enlarged view of section A in the middle;

[0027] Figure 4 for Figure 2 Enlarged view of section B in the middle;

[0028] Figure 5 This is a schematic structural diagram for embodying the second clamping member in the present invention;

[0029] Figure 6 This is an exploded view for embodying the connection relationship between the mounting frame and the first clamping member in the present invention;

[0030] Figure 7 is Figure 2 an enlarged view of part C in Detailed implementation manners

[0031] The present invention will be described in detail below in conjunction with the embodiments shown in the drawings. It should be noted that these embodiments are not limitations on the present invention, and any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art according to these embodiments shall fall within the protection scope of the present invention.

[0032] Refer Figures 1 to 7 As shown, a wafer batch clamping and transferring device disclosed by the present invention has a driving mechanism 1 and a clamping mechanism 2 compared with the prior art. The driving mechanism 1 includes a lifting mechanism 11 and a rotating mechanism 12. The rotation of the first clamping member 21 and the second clamping member 22 constituting the clamping mechanism 2 is controlled by the rotating mechanism 12. When batch clamping of the wafers 5 themselves is required, the rotating mechanism 12 controls one ends of the first clamping member 21 and the second clamping member 22 to approach each other to batch clamp a plurality of wafers 5 stored in the wafer carrier 4. When the wafer carrier 4 needs to be lifted as a whole, the rotating mechanism 12 is made to drive the first clamping member 21 and the second clamping member 22 to rise a certain distance along the lifting mechanism 11, and then the rotating mechanism 12 controls the first clamping member 21 and the second clamping member 22 to flip so that the first clamping member 21 and the second clamping member 22 are away from the side for clamping the wafers 5 to clamp the wafer carrier 4. It should be noted that for clamping the wafers 5 or the wafer carrier 4 by the aforementioned first clamping member 21 and the second clamping member 22, the wafer batch clamping and transferring device as a whole needs to be lifted from the device accommodating the wafer carrier 4 (such as a tank-type cleaning device, not shown) by other driving mechanisms (not shown). Compared with the prior art, by controlling the flipping actions of the first clamping member 21 and the second clamping member 22 by the rotating mechanism 12, the effect of achieving different clamping functions on both sides of the first clamping member 21 and the second clamping member 22 can be achieved, and the purpose of batch clamping and transferring the wafers 5 stored in the wafer carrier 4 without lifting the wafer carrier 4 can be realized. It has a higher wafer clamping and transferring efficiency, and thus can, to a certain extent, improve the efficiency of the entire wafer production process.

[0033] Refer Figures 1 to 7As shown in the figure, in this embodiment, the wafer batch clamping and transfer device (hereinafter simply referred to as the clamping and transfer device) includes a driving mechanism 1 and a clamping mechanism 2. The driving mechanism 1 includes a lifting mechanism 11 and a rotating mechanism 12. The clamping mechanism 2 includes a first clamping member 21 and a second clamping member 22. The rotating mechanism 12 drives one ends of the first clamping member 21 and the second clamping member 22 to approach each other to batch clamp a plurality of wafers 5 supported by a wafer carrier 4. The lifting mechanism 11 drives the rotating mechanism 12 to reciprocate in the height direction so that the first clamping member 21 and the second clamping member 22 rise. The rotating mechanism 12 drives the first clamping member 21 and the second clamping member 22 to flip to the other end to clamp the protruding portions 41 on both sides of the wafer carrier 4 through the first clamping member 21 and the second clamping member 22.

[0034] As shown in the figure Figures 2 to 7 As shown, a plurality of first clamping grooves 211 are evenly distributed at one end of the first clamping member 21 driven by the rotating mechanism 12 to flip. The second clamping member 22 is symmetrically provided with a plurality of second clamping grooves 221 having the same number as the first clamping grooves 211. The rotating mechanism 12 drives the plurality of first clamping grooves 211 and the second clamping grooves 221 to approach each other to synchronously clamp the upper edges of a plurality of wafers 5 extending from the upper opening of the wafer carrier 4. The lifting mechanism 11 drives the first clamping member 21 and the second clamping member 22 to rise. The side of the first clamping member 21 away from the side where the first clamping grooves 211 are provided and the side of the second clamping member 22 away from the side where the second clamping grooves 221 are provided are driven by the rotating mechanism 12 to flip and approach each other to synchronously clamp the lower edges of the protruding portions 41 on both sides of the wafer carrier 4. The rotating mechanism 12 includes a driving motor 121 and a gear set 122. The gear set 122 includes a first driving wheel 1221, a first driven wheel 1222, a second driven wheel 1223, and a second driving wheel 1224 that are arranged along the height direction perpendicular to the lifting mechanism 11 and mesh with each other. The driving end of the driving motor 121 is coaxially fixed to the first driving wheel 1221. One end of the first driving wheel 1221 away from the driving motor 121 is coaxially fixed to a first rotating shaft 123. The first rotating shaft 123 is axially fixed to the side wall of the first clamping member 21. While the first driving wheel 1221 rotates, it drives the second driving wheel 1224 to rotate in a direction opposite to that of the first driving wheel 1221 through the first driven wheel 1222 and the second driven wheel 1223. The second driving wheel 1224 is coaxially fixed to a second rotating shaft 124. The second rotating shaft 124 is axially fixed to the side wall of the second clamping member 22.

[0035] As shown in the figure Figure 1 and Figure 2As shown, the clamping and transfer device also includes a mounting base 3. The mounting base 3 includes a base plate 31, a first mounting plate 32, and a second mounting plate 33. The first mounting plate 32 and the second mounting plate 33 are vertically fixed to both sides of the base plate 31 along its length. The first drive wheel 1221, the first driven wheel 1222, the second driven wheel 1223, and the second drive wheel 1224 are rotatably connected between the first mounting plate 32 and the second mounting plate 33. The first rotating shaft 123 and the second rotating shaft 124 pass through the second mounting plate 33 and are respectively connected to the first clamping member 21 and the second clamping member 22. The first mounting plate 32 is connected to the drive end of the lifting mechanism 11. It should be noted that the lifting mechanism 11 can be selected as a linear motor, a screw and nut driven by a motor for lifting, or any other linear drive structure that can achieve lifting. These will not be elaborated here.

[0036] Specifically, refer to Figure 1 and Figure 2As shown, the first rotating shaft 123 and the second rotating shaft 124 are respectively connected to positions close to 1 / 7 of the length direction of the first clamping member 21 and the second clamping member 22. The first clamping groove 211 and the second clamping groove 221 are opened on the first clamping member 21 and the second clamping member 22 on the side closer to their edges relative to the first rotating shaft 123 and the second rotating shaft 124, so that the first clamping member 21 and the second clamping member 22 form a labor-saving lever when used to batch clamp one side of the wafer 5, thereby achieving a more stable clamping effect on the wafer 5. Further, in this embodiment, through the gear set 122 composed of the first driving wheel 1221, the first driven wheel 1222, the second driven wheel 1223 and the second driving wheel 1224, when the driving motor 121 is started, the first driven wheel 1222 meshing with the first driving wheel 1221 rotates in a direction opposite to that of the first driving wheel 1221. Through the transmission of the second driven wheel 1223, the second driving wheel 1224 is driven to rotate in the same direction as the first driven wheel 1222, so that the second rotating shaft 124 coaxially fixed with the second driving wheel 1224 can drive the second clamping member 22 to rotate in a direction opposite to that of the first clamping member 21. That is, when batch clamping and transferring the wafer 5 itself, the gear set 122 is used to drive the bottoms of the first clamping member 21 and the second clamping member 22 to approach each other until the first clamping groove 211 and the second clamping groove 221 opened at the bottoms of the first clamping member 21 and the second clamping member 22 approach each other until the top of the wafer 5 is stably clamped at the position where it extends from the wafer carrier 4. In this embodiment, through the meshing of four gears, the relative approach of the first clamping member 21 and the second clamping member 22 is controlled to synchronously batch clamp the wafer 5 through a plurality of first clamping grooves 211 and second clamping grooves 221. Moreover, through the design of four gears, the distance between the first clamping member 21 and the second clamping member 22 is effectively controlled. While having sufficient rotation space, the first clamping member 21 and the second clamping member 22 can achieve the effects of batch clamping the wafer 5 and supporting the wafer carrier 4 at the same time. Specifically, the attitude of the first clamping member 21 and the second clamping member 22 supporting the wafer carrier 4 is as Figure 2 shown. At this time, the first clamping member 21 and the second clamping member 22 are presented in an attitude parallel to the height direction of the lifting mechanism 11.

[0037] Refer Figures 2 to 7 As shown, both the first clamping member 21 and the second clamping member 22 are composed of a mounting frame 23, a first clamping piece 24 and a second clamping piece 25. The first rotating shaft 123 and the second rotating shaft 124 are respectively connected to the mounting frames 23 of the first clamping member 21 and the second clamping member 22 at Figure 1In the flipped state shown, the first clamping grooves 211 are evenly distributed along the length of the first clamping member 24 on the side away from the mounting frame 23, and the second clamping member 25 is a rod-shaped member connected to the mounting frame 23 on the side away from the first clamping member 24. The side of the second clamping member 25 that contacts the sidewall of the wafer basket 4 forms a relief groove 251. It should be noted that the second clamping member 25 is selected as a rod-shaped member with a certain degree of elasticity (e.g., plastic material). The side of the second clamping member 25 away from the relief groove 251 forms an arc-shaped surface 252. Several hollow grooves 253 are formed at the contact point between the arc-shaped surface 252 and the protrusion 41 of the wafer basket 4.

[0038] It should be noted that the specific process of the first clamping member 21 and the second clamping member 22 clamping the wafer 5 in batches has been described above. When the wafer basket 4 and the wafer 5 supported inside it are clamped and transferred together by the first clamping member 21 and the second clamping member 22, the first clamping member 21 and the second clamping member 22 are first lifted together by the mounting base 3 driven by the drive mechanism 1 until there is sufficient space for the first clamping member 21 and the second clamping member 22 to rotate. Then the drive end of the drive motor 121 drives the first drive wheel 1221 to rotate in the opposite direction to that described above, so that the mounting frame 23 of the first clamping member 21 and the second clamping member 22 is rotated in the opposite direction to that described above until the second clamping member 25 connected to the two mounting frames 23 is relatively close to each other until... Figure 2 As shown, both mounting frames 23 are in a state where their length direction is parallel to the height direction of the drive mechanism 1, and the two second clamping members 25 are clamping the left and right sides of the wafer basket 4 respectively.

[0039] More specifically, as described above, when the wafer 5 is clamped by the first clamping groove 211 and the second clamping groove 221, the first clamping member 21 and the second clamping member 22 form a force-saving lever, the purpose of which is to make the batch clamping of wafers 5 more stable. Therefore, in this state, the first rotating shaft 123 and the second rotating shaft 124 are at the lowest point of displacement along the lifting mechanism 11. When the first clamping member 21 and the second clamping member 22 need to be flipped to the state of clamping and supporting the wafer basket 4, the first rotating shaft 123 and the second rotating shaft 124 need to be moved up with the mounting base 3 to the highest point of the lifting mechanism 11, and then the first clamping member 21 and the second clamping member 22 are flipped to the position of supporting the left and right protrusions 41 of the wafer basket 4. Since the first clamping member 21 and the second clamping member 22 support the protrusion 41 of the wafer basket 4, the second clamping member 25 can effectively clamp and support the wafer basket 4 when the length direction of the first clamping member 21 and the second clamping member 22 is parallel to the height direction of the lifting mechanism 11.

[0040] Furthermore, the arc-shaped surface 252 formed on the side wall in the length direction of the second clamping member 25 can ensure that during the flipping process of the first clamping member 21 and the second clamping member 22, the two second clamping members 25 can effectively avoid interference with the protrusions 41 of the wafer carrier 4, enabling it to be smoothly flipped to the state of clamping the wafer carrier 4 and supporting the protrusions 41 on the left and right sides of the wafer carrier 4. Moreover, since the second clamping member 25 is arranged as an elastic rod-shaped member, the relief grooves 251 distributed along its length direction and the hollow groove body 253 formed at the contact position with the protrusions 41 of the wafer carrier 4 can generate elastic deformation when interfering with the protrusions 41 of the wafer carrier 4 during the rotation of the second clamping member 25, so that the second clamping member 25 can smoothly clamp and support the wafer carrier 4. Through the above design, the clamping and transfer device can respectively achieve the clamping and transfer of the wafer carrier 4 and the batch clamping and transfer of wafers alone, having the advantages of high transfer efficiency and simple structure in the scenario where only batch clamping and transfer of wafers are required. Specifically, in this embodiment, the bottom plate 31 constituting the mounting seat 3 is connected to other conventional transfer devices (not shown) so that the entire clamping and transfer device can be lifted from a trough-type cleaning device or any other device accommodating the wafer carrier 4.

[0041] See Figures 2 to 7As shown, the mounting frame 23 includes two parallel linkages 231 and a connecting seat 232. The connecting seat 232 is vertically and fixedly connected between the two linkages 231. The first rotating shaft 123 and the second rotating shaft 124 are respectively fixedly connected along the length direction to the side walls of the connecting seat 232. Both the first rotating shaft 123 and the second rotating shaft 124 form a first mounting surface 125 and a second mounting surface 126 along the length direction. The first mounting surface 125 and the second mounting surface 126 are symmetrically distributed with respect to the diameters of the first rotating shaft 123 and the second rotating shaft 124. The first mounting surface 125 is arranged in contact with the connecting seat 232, and the second mounting surface 126 is arranged in contact with and fixed to the first clamping member 24. It should be noted that in this embodiment, since the first clamping member 21 and the second clamping member 22 need to hold the wafer 5 in a state of a labor-saving lever, the first rotating shaft 123 and the second rotating shaft 124 need to be distributed at a position close to 1 / 7 of the side walls of the first clamping member 21 and the second clamping member 22. In this embodiment, first, the two linkages 231 and the connecting seat 232 form the main body of the mounting frame 23. The second clamping member 25 is connected to the ends of the two linkages 231 away from the connecting seat 232, so that the first clamping member 21 and the second clamping member 22 respectively form a hollow frame structure and are fixed to the first rotating shaft 123 and the second rotating shaft 124 through the connecting seat 232. The connecting seat 232 is located at the ends of the two linkages 231. By fixedly connecting the first rotating shaft 123 or the second rotating shaft 124 to the connecting seat 232, and then fixedly connecting the first clamping member 24 to the first rotating shaft 123 or the second rotating shaft 124, it can achieve a state of a labor-saving lever when clamping the wafer 5 by means of a number of first clamping grooves 211 and second clamping grooves 221 arranged on the first clamping member 24.

[0042] Refer Figure 6 and Figure 7As shown, the first clamping member 24 includes a connector 241 and a clamping device 242. The connector 241 has a first connecting plate 2411 and a second connecting plate 2412 that are perpendicular to each other. The side of the first connecting plate 2411 away from the second connecting plate 2412 is attached to and fixed to the second mounting surface 126. A plurality of first clamping grooves 211 and second clamping grooves 221 are respectively formed on the side of the two clamping devices 242 away from the second connecting plate 2412. During the flipping process of the first clamping member 21 and the second clamping member 22, the first clamping grooves 211 and the second clamping grooves 221 gradually approach and clamp the edge of the wafer 5 extending from the top of the wafer basket 4. The connecting seat 232 is configured as an H-shaped component and has several first mounting holes 233. The first connecting plate 2411 has several first waist-shaped holes 2413 formed along the length direction. The connecting seat 232 and the first connecting plate 2411 are locked and fixed by a connector (not shown, such as a bolt) passing through the first waist-shaped holes 2413, the first rotating shaft 123 or the second rotating shaft 124 and the first mounting holes 233 in sequence. The second connecting plate 2412 has several second mounting holes 2414. The clamping device 242 has several second waist-shaped holes 2415 along the height direction. The second connecting plate 2412 and the clamping device 242 are fixed to each other by a connector (not shown, such as a bolt) passing through the second waist-shaped holes 2415 and the second mounting holes 2414.

[0043] Specifically, in the above manner, the first clamping member 24 is detachably connected to the connecting seat 232. When the wafer 5 arrangement density or number in the wafer basket 4 changes, the clamping device 242 of the first clamping member 24 can be replaced by disassembling it to adapt to the batch clamping needs of the current wafer basket 4 and the wafers 5 inside it. Furthermore, the relative position between the clamping device 242 and the connecting member 241 can be finely adjusted by the second oblong hole 2415 opened in the clamping device 242 and the second mounting hole 2414 opened in the connecting member 241; the relative position between the first clamping member 24 and the connecting seat 232 can be adjusted by the first oblong hole 2413 opened in the connecting member 241, so that the first clamping groove 211 and the second clamping groove 221 opened in the clamping device 242 can accurately align and clamp the wafers 5.

[0044] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0045] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0046] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer batch clamping and transfer apparatus, characterized by, The utility model relates to a kind of wafer clamping mechanism, including: drive mechanism and clamping mechanism, the drive mechanism includes lifting mechanism and rotating mechanism, the clamping mechanism includes first clamping member and second clamping member, the rotating mechanism drives the end of the first clamping member and second clamping member to each other to batch clamping by wafer basket supported several wafers; The lifting mechanism drives rotating mechanism to reciprocate displacement along height direction to make the first clamping member and second clamping member rise, and the rotating mechanism drives the first clamping member and second clamping member to overturn to the other end to clamp the protruding part of wafer basket by the first clamping member and second clamping member on both sides; The first clamping member is uniformly distributed with several first clamping grooves by the end of the rotating mechanism that overturns, and the second clamping member is symmetrically provided with several second clamping grooves consistent with the number of first clamping grooves, and the rotating mechanism drives several first clamping grooves and second clamping grooves to each other to synchronously clamp the upper edge of several wafers extending from the opening of wafer basket above; The lifting mechanism drives the first clamping member and second clamping member to rise, and the side of the first clamping member away from the first clamping groove and the side of the second clamping member away from the second clamping groove are driven by the rotating mechanism to overturn and approach each other to synchronously clamp the lower edge of the protruding part of wafer basket on both sides. The rotating mechanism includes a drive motor and a gear set, the gear set includes a first drive wheel, a first driven wheel, a second driven wheel and a second drive wheel arranged perpendicular to the height direction of the lifting mechanism and meshed with each other, the drive end of the drive motor is coaxially fixed with the first drive wheel, the side of the first drive wheel away from the drive motor is coaxially fixed with a first rotating shaft, and the first rotating shaft is axially fixed to the side wall of the first clamping member; 2. The wafer batch clamping and transferring apparatus according to claim 1, wherein The first drive wheel drives the second drive wheel to rotate towards the opposite direction of the first drive wheel through the first driven wheel and the second driven wheel while rotating, the second drive wheel is coaxially fixed with a second rotating shaft, and the second rotating shaft is axially fixed to the side wall of the second clamping member. The first clamping member and the second clamping member are both composed of a mounting frame, a first clamping piece and a second clamping piece, the first rotating shaft and the second rotating shaft are respectively connected to the mounting frame of the first clamping member and the second clamping member on the side approaching each other, and the first clamping grooves are uniformly arranged on the side of the first clamping piece away from the mounting frame along the length direction; 3. The wafer batch clamping and transferring apparatus according to claim 2, wherein The second clamping piece is arranged as a rod and connected to the side of the mounting frame away from the first clamping piece, and the side of the second clamping piece in contact with the side wall of the wafer basket forms a clearance groove. The mounting frame includes two parallel connecting rods and a connecting seat, the connecting seat is perpendicularly fixed between the two connecting rods, and the first rotating shaft and the second rotating shaft are respectively fixed to the side wall of the connecting seat along the length direction.

4. The wafer batch clamping and transferring apparatus according to claim 3, wherein ​ The first rotation shaft and the second rotation shaft are both provided with a first mounting surface and a second mounting surface along the length direction, the first mounting surface and the second mounting surface are symmetrically distributed with respect to the diameters of the first rotation shaft and the second rotation shaft, the first mounting surface is arranged in abutment with the connecting seat, and the second mounting surface is arranged in abutment with and fixed to the first clamping member.

5. The wafer batch clamping and transferring apparatus according to claim 4, wherein The first clamping member comprises a connecting member and a clamping device, the connecting member is provided with a first connecting plate and a second connecting plate which are perpendicular to each other, the first connecting plate is arranged in abutment with and fixed to the second mounting surface on the side away from the second connecting plate; A plurality of first clamping grooves and second clamping grooves are formed on the sides away from the second connecting plate of the two clamping devices, respectively, and the first clamping grooves and the second clamping grooves gradually approach and clamp the edges of the plurality of wafers which extend from the wafer baskets during the overturning of the first clamping member and the second clamping member.

6. The wafer batch clamping and transferring apparatus according to claim 2, wherein Further comprising: The mounting seat comprises a bottom plate, a first mounting plate and a second mounting plate, the first mounting plate and the second mounting plate are fixed perpendicularly to the length direction of the two sides of the bottom plate, the first driving wheel, the first driven wheel, the second driven wheel and the second driving wheel are rotatably connected between the first mounting plate and the second mounting plate, the first rotation shaft and the second rotation shaft are connected to the first clamping member and the second clamping member, respectively, after penetrating through the second mounting plate, and the first mounting plate is connected to the driving end of the lifting mechanism.

7. The wafer batch clamping and transferring apparatus according to claim 4, wherein The side away from the positioning groove of the second clamping member is formed into a circular arc surface, and a plurality of hollow grooves are formed at the contact position between the circular arc surface and the protruding part of the wafer basket.

8. The wafer batch clamping and transferring apparatus according to claim 5, wherein The connecting seat is provided as an H-shaped member and is provided with a plurality of first mounting holes, the first connecting plate is provided with a plurality of first waist-shaped holes formed along the length direction, and the connecting seat and the first connecting plate are locked and fixed through the connecting member penetrating through the first waist-shaped hole, the first rotation shaft or the second rotation shaft and the first mounting hole in sequence; The second connecting plate is provided with a plurality of second mounting holes, the clamping device is provided with a plurality of second waist-shaped holes along the height direction, and the second connecting plate and the clamping device are fixed to each other through the connecting member penetrating through the second waist-shaped hole and the second mounting hole. The second clamping member is provided with a plurality of second clamping grooves formed along the length direction, the second clamping grooves are arranged in abutment with and fixed to the protruding part of the wafer basket on the side away from the positioning groove, and the second clamping grooves are gradually separated from each other during the overturning of the second clamping member.

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