Charging base temperature control protection structure and method for improving temperature monitoring precision

Abstract

The invention relates to a charging base temperature control protection structure and a method for improving temperature monitoring precision. The structure comprises a base, a main fixing piece arranged on the base and a terminal fixing piece arranged on the main fixing piece. The main fixing piece is provided with a heat-conducting material limiting groove, and the heat-conducting glue is arranged in the heat-conducting material limiting groove; the PCB is installed on the main fixing piece in the first direction and extrudes the heat-conducting glue. The power terminal is arranged in the terminal fixing piece along a second direction and extrudes the heat-conducting glue; the SMD thermistor is attached to the PCB and is close to the power terminal. By adjusting the connection method of the power terminal, the heat-conducting glue and the patch thermistor, the heat conduction efficiency of the whole system is enhanced to improve the monitoring precision.

Description

Technical Field

[0001] This invention relates to the field of new energy technology, and in particular to a temperature control protection structure for a charging base and a method for improving temperature monitoring accuracy. Background Technology

[0002] Currently available electric vehicle charging docks incorporate temperature monitoring and electronic locking features to effectively prevent overheating and accidental detachment. Existing temperature monitoring methods generally fall into two categories: 1. Using a φ4 cylindrical or semi-cylindrical thermistor (NTC), it is installed close to the power terminal using terminal fixing parts. However, the NTC structure itself contains an NTC chip inside. It is first placed in a metal or plastic shell and then encapsulated with epoxy resin / thermal conductive silicone grease. The heat conduction path is power terminal → shell wall → potting compound → NTC chip. The thermal conductivity of this method is generally 0.3W / (m·K), and the temperature monitoring temperature difference is 10℃.

[0003] 2. Inject thermal silicone into a sleeve and mount it on the PCB board using a surface-mount NTC. The thermally conductive sleeve is placed on the surface-mount NTC, and the other end of the thermally conductive sleeve is pressed onto the power terminal and in contact with the power terminal. The heat conduction path is power terminal → silicone sleeve → surface-mount NTC chip → PCB board. The thermal conductivity of this solution is generally 1.2W / (m·K), and the temperature monitoring temperature difference is 7℃.

[0004] As can be seen from the above, the maximum temperature transmitted by traditional temperature monitoring solutions will differ from the actual maximum heat source temperature by 7℃-10℃. With the improvement of battery capacity and charging efficiency, the current carried by the charging dock during charging is getting larger and larger, and the temperature rises rapidly. If the temperature monitoring method fails to monitor and feed back to the vehicle charging control system in a timely manner, it can easily lead to vehicle combustion. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention discloses a temperature control protection structure for a charging base and a method for improving temperature monitoring accuracy.

[0006] The technical solution adopted in this invention is as follows: Firstly, a temperature control protection structure for a charging dock is provided, comprising: Base; A main fixing member is provided on the base; the main fixing member has a heat-conducting material limiting groove; Terminal fixing members are provided on the main fixing members; Thermally conductive adhesive is disposed within the limiting groove of the thermally conductive material; The PCB board is mounted on the main fixing member along the first direction and the thermally conductive adhesive is extruded. A power terminal is installed in the terminal holder along the second direction and the thermally conductive adhesive is pressed out. A surface-mount thermistor is attached to the PCB board and close to the power terminal.

[0007] In one embodiment of the present invention, a groove is formed on the surface of the power terminal.

[0008] In one embodiment of the present invention, the terminal fixing member includes a body; the body has a mounting groove formed along a second direction; the opening of the mounting groove faces the edge of the base; the mounting groove is provided with a stop portion, and the groove is engaged in the stop portion; the stop portion is configured to restrict the rotation of the power terminal.

[0009] In one embodiment of the present invention, a backstop is provided at the opening of the stop near the mounting groove; the backstop is configured to restrict the power terminal from retracting after being installed in the terminal fixing member.

[0010] In one embodiment of the present invention, the anti-reverse portion protrudes from the stop portion and contacts the power terminal.

[0011] In one embodiment of the present invention, in the second direction, the patch thermistor is 2mm-3mm away from the power terminal.

[0012] In one embodiment of the present invention, the thermally conductive material limiting groove is provided with a plurality of reinforcing ribs; the reinforcing ribs are configured to prevent the thermally conductive adhesive from falling out of the thermally conductive material limiting groove.

[0013] In one embodiment of the present invention, the plurality of reinforcing ribs are arranged in a grid pattern, which is formed by equidistant horizontal and vertical ribs crisscrossing each other to form a continuous rectangular or rhomboid grid unit; the horizontal ribs and the vertical ribs are rigidly connected at the nodes.

[0014] Secondly, a method for improving temperature monitoring accuracy is provided, utilizing the charging base temperature control protection structure as described above, including the following steps: A pre-drilled groove for thermally conductive material is provided on the main fastener. Thermally conductive adhesive is then placed into the groove. Surface mount thermistors are attached to the PCB board; The PCB board is mounted on the main fixing component along the first direction and the thermally conductive adhesive is squeezed to deform it. The power terminal is installed on the terminal fixing member along the second direction and the thermally conductive adhesive is squeezed to expel air. After the thermally conductive adhesive is squeezed and deformed, it is consistent with the cavity shape of the thermally conductive material limiting groove.

[0015] In one embodiment of the present invention, before the thermally conductive adhesive is deformed, the volume of the thermally conductive adhesive is greater than the cavity volume of the thermally conductive material limiting groove.

[0016] The technical solution of the present invention has the following advantages over the prior art: The charging base temperature control protection structure of this invention features a pre-drilled groove for thermally conductive material on the main fixing component. Thermally conductive adhesive is placed within this groove, and a surface-mount thermistor is attached to the PCB board. First, the PCB board is mounted downwards onto the main fixing component, and the thermally conductive adhesive is compressed to deform it. Then, the power terminals are installed into the main fixing component from the side, allowing the power terminals to further compress the thermally conductive adhesive from the side to expel air. After deformation, the thermally conductive adhesive forms a structure consistent with the shape of the thermally conductive material groove cavity. By adjusting the connection method of the power terminals, high thermal conductivity material, and surface-mount thermistor, the overall system's heat conduction efficiency is enhanced, thereby improving monitoring accuracy. Attached Figure Description

[0017] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the temperature control protection structure of the charging base in this invention.

[0019] Figure 2 This is a schematic diagram of the power terminal structure in this invention.

[0020] Figure 3 This is a partially enlarged schematic diagram of the temperature control protection structure of the charging base in this invention.

[0021] Figure 4 yes Figure 3 Enlarged diagram of point A in the middle.

[0022] Explanation of reference numerals on the accompanying drawings: 10. PCB board; 20. Power terminal; 201. Groove; 30. Main fixing component; 40. Thermally conductive adhesive; 50. Surface mount thermistor; 60. Thermally conductive material limiting groove; 601. Reinforcing rib; 70. Terminal fixing component; 701. Anti-retraction part; 702. Stop part. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0024] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention. Furthermore, in all embodiments, the same reference numerals denote the same elements.

[0025] Combination Figure 1 and Figure 3 As shown, a charging base temperature control protection structure includes a base, a PCB board 10, a power terminal 20, a main fixing component 30, thermally conductive adhesive 40, a surface mount thermistor 50, and a terminal fixing component 70.

[0026] In this embodiment, to describe the relationship between the various parts and components, a local coordinate system is established with the center point of the base as the origin. The length direction of the base is defined as the X-axis, the width direction of the base as the Y-axis, and the height direction of the base as the Z-axis. The Z-axis is defined as the first direction, and the X-axis is defined as the second direction.

[0027] The main fixing member 30 is mounted on the base. The main fixing member 30 has a heat-conducting material limiting groove 60. Heat-conducting adhesive 40 is disposed within the heat-conducting material limiting groove 60. Furthermore, the heat-conducting material limiting groove 60 is provided with multiple reinforcing ribs 601. The reinforcing ribs 601 are configured to prevent the heat-conducting adhesive 40 from falling out of the heat-conducting material limiting groove 60. Specifically, the multiple reinforcing ribs 601 are arranged in a grid pattern, consisting of equidistantly arranged transverse and longitudinal ribs forming a continuous rectangular or rhomboid grid unit. The transverse and longitudinal ribs are rigidly connected at their nodes.

[0028] Furthermore, those skilled in the art can, as needed, select silicone-based thermal conductive putty, epoxy thermal conductive putty, and flame-retardant mastic for the thermal conductive adhesive 40.

[0029] The PCB board 10 is mounted on the main fixing member 30 along the first direction, i.e. the Z-axis direction, and thermally conductive adhesive 40 is extruded.

[0030] The power terminal 20 is mounted within the terminal holder 70 along the second direction, i.e., the X-axis direction, and thermally conductive adhesive 40 is pressed in. For example... Figure 2 As shown, a groove 201 is formed on the surface of the power terminal 20. A surface mount thermistor 50 is attached to the PCB board 10 and close to the power terminal 20. Furthermore, in order to reduce the distance between the monitoring point and the heat source and reduce the loss in the conduction process, in the second direction, the distance between the surface mount thermistor 50 and the power terminal 20 is 2mm-3mm.

[0031] Terminal fixing member 70 is provided on main fixing member 30. Specifically, in combination with Figure 3 and Figure 4The terminal fixing member 70 includes a main body. A mounting groove is formed in the main body along a second direction. The opening of the mounting groove faces the edge of the base. The mounting groove is provided with a stop portion 702, and a recess 201 engages within the stop portion 702. The stop portion 702 is configured to restrict the rotation of the power terminal 20. A retraction portion 701 is provided in the stop portion 702 near the opening of the mounting groove. The retraction portion 701 is configured to restrict the power terminal 20 from retracting after being installed in the terminal fixing member 70. The retraction portion 701 protrudes from the stop portion 702 and contacts the power terminal 20.

[0032] Preferably, two grooves 201 are symmetrically formed on the surface of the power terminal 20. The two grooves 201 cooperate with the mounting groove of the terminal fixing member 70 and the stop part 702 to form a 180° symmetrical mechanical interference, completely eliminating the rotation of the power terminal 20 caused by torque during operation. The torque is evenly distributed by the two grooves 201, and the stress peak is reduced by about half compared to a single groove 201, improving fatigue life under high load. The power terminal 20 is simply pushed in by aligning the groove 201 with the stop part 702. The stop part 701 locks the power terminal 20, restricting its installation in the terminal fixing member 70, and then retracts to complete the assembly. It can be removed by reversing the operation during maintenance.

[0033] The working principle of this invention is as follows: A thermally conductive material limiting groove 60 is reserved on the main fixing component 30, and the thermally conductive adhesive 40 is placed into the thermally conductive material limiting groove 60.

[0034] A surface mount thermistor 50 is attached to PCB board 10.

[0035] The PCB board 10 is mounted on the main fixing member 30 along the first direction and the thermally conductive adhesive 40 is squeezed to deform it.

[0036] The power terminal 20 is mounted on the terminal fixing member 70 along the second direction, and the thermally conductive adhesive 40 is squeezed to expel air. After being squeezed and deformed, the thermally conductive adhesive 40 conforms to the shape of the thermally conductive material limiting groove 60. In this embodiment, the shape of the thermally conductive adhesive after being squeezed and deformed matches the mesh-like reinforcing ribs 601, forming an isolation plate-like structure. It can be understood that in the initial state, the thermally conductive adhesive 40 is in the form of paste or mud, and is stuffed into each grid hole of the mesh-like reinforcing ribs 601, filling slightly more than the volume of the grid hole, and is in a pre-compressed and compacted state.

[0037] During the extrusion process, when the PCB board 10 is mounted on the main fixing component 30 along the first direction and the thermally conductive adhesive 40 is extruded, the thermally conductive adhesive 40 in each grid hole of the reinforcing rib 601 is subjected to a vertical compressive force, and at the same time, it is constrained laterally by the surrounding reinforcing ribs 601. Therefore, the thermally conductive adhesive 40 can only flow towards the side walls of the ribs around the grid hole and cannot overflow as a whole. Since the grid holes formed by the transverse and longitudinal ribs are equivalent to molds, the paste is pressed into thin sheets or plates that conform to the shape of the grid holes, with a thickness approximately equal to the height of the ribs. The thermally conductive adhesive 40 in adjacent grid holes is not interconnected, forming a discrete isolation plate-like structure. Each plate-like thermally conductive adhesive 40 is surrounded by reinforcing ribs 601, which not only acts as a thermal pad but also physically isolates adjacent heat-generating areas to prevent thermal crosstalk. This design can increase thermal conductivity and improve the electrical performance indicators between the power terminal 20 and the surface mount thermistor 50.

[0038] It should be noted that before the thermal conductive adhesive 40 is deformed, the volume of the thermal conductive adhesive 40 is larger than the cavity volume of the thermal conductive material limiting groove 60, ensuring that the thermal conductive adhesive 40 will be fully squeezed out of the air between the contact parts after installation.

[0039] Furthermore, in the charging base temperature control protection structure provided by the present invention, if thermally conductive adhesive 40 with a thermal conductivity of 6 W / (m·K) is used, the temperature monitoring temperature difference can reach 1.5℃; if thermally conductive silicone putty 40 with a thermal conductivity of 8 W / (m·K) is used, the temperature monitoring temperature difference can reach 1℃. The charging base temperature control protection structure and method provided by the present invention greatly improve the accuracy of temperature monitoring.

[0040] Currently, the main thermal conductive adhesive 40 products with a thermal conductivity of 6W / (m·K) on the market are as follows (see Table 1). All of them meet the requirements of insulation, flame retardancy (UL94 V-0) and long-term reliability, and can be selected directly.

[0041]

[0042] The following are the main types of 8W / (m·K) thermal conductive adhesive 40 that are already in mass production and can be purchased directly, as shown in Table 2. All of them meet the requirements of insulation and flame retardancy UL94-V0.

[0043] Table 2. List of Mass-Produced 8W / (m·K) Thermal Conductive Adhesive Models

[0044] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0045] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A temperature control and protection structure for a charging base, characterized in that, include: Base; The main fixing member (30) is provided on the base; the main fixing member (30) has a heat-conducting material limiting groove (60); Terminal fixing member (70) is provided on the main fixing member (30); Thermally conductive adhesive (40) is disposed within the thermally conductive material limiting groove (60); The PCB board (10) is mounted on the main fixing member (30) along the first direction and the thermally conductive adhesive (40) is pressed out. Power terminals (20) are installed in the terminal holder (70) along the second direction and the thermally conductive adhesive (40) is pressed out. A surface mount thermistor (50) is attached to the PCB board (10) and close to the power terminal (20).

2. The charging base temperature control protection structure according to claim 1, characterized in that, The power terminal (20) has a groove (201) on its surface.

3. The charging base temperature control protection structure according to claim 2, characterized in that, The terminal fixing member (70) includes a main body; the main body has a mounting groove along a second direction; the opening of the mounting groove faces the edge of the base; the mounting groove is provided with a stop (702), and the groove (201) is engaged in the stop (702); the stop (702) is configured to restrict the rotation of the power terminal (20).

4. The charging base temperature control protection structure according to claim 3, characterized in that, A stop portion (701) is provided at the opening of the mounting groove near the stop portion (702); the stop portion (701) is configured to restrict the power terminal (20) from retracting after it is installed in the terminal fixing member (70).

5. The charging base temperature control protection structure according to claim 4, characterized in that, The stop portion (701) protrudes from the stop portion (702) and contacts the power terminal (20).

6. The charging base temperature control protection structure according to claim 1, characterized in that, In the second direction, the patch thermistor (50) is 2mm-3mm away from the power terminal (20).

7. The charging base temperature control protection structure according to claim 1, characterized in that, The thermally conductive material limiting groove (60) is provided with a plurality of reinforcing ribs (601); the reinforcing ribs (601) are configured to prevent the thermally conductive adhesive (40) from falling out of the thermally conductive material limiting groove (60).

8. The charging base temperature control protection structure according to claim 7, characterized in that, The multiple reinforcing ribs (601) are arranged in a grid pattern, consisting of crisscrossing transverse and longitudinal ribs arranged at equal intervals to form a continuous rectangular or rhomboid grid unit; the transverse ribs and the longitudinal ribs are rigidly connected at their nodes.

9. A method for improving the accuracy of temperature monitoring, characterized in that, The charging dock temperature control protection structure as described in any one of claims 1-8 includes the following steps: A thermally conductive material limiting groove (60) is reserved on the main fixing component (30), and the thermally conductive adhesive (40) is placed into the thermally conductive material limiting groove (60); A surface-mount thermistor (50) is attached to a PCB board (10); The PCB board (10) is mounted on the main fixing member (30) along the first direction and the thermally conductive adhesive (40) is squeezed to deform it; The power terminal (20) is installed on the terminal fixing member (70) along the second direction and the thermally conductive adhesive (40) is squeezed to expel air. After the thermally conductive adhesive (40) is squeezed and deformed, it is consistent with the cavity shape of the thermally conductive material limiting groove (60).

10. The method for improving temperature monitoring accuracy according to claim 9, characterized in that, Before the thermally conductive adhesive (40) is deformed, the volume of the thermally conductive adhesive (40) is greater than the cavity volume of the thermally conductive material limiting groove (60).

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