Production method of anti-falling combined double-layer circuit board

Abstract

The application discloses a production method of an anti-falling combined double-layer circuit board and relates to the technical field of combined double-layer circuit boards. The method comprises the following steps: S1, milling an annular groove I on the bottom surface of a first circuit board; S2, milling an annular groove II on the top surface of a second circuit board; S3, embedding a frame-shaped curing glue into the annular groove II of the second circuit board from top to bottom; S4, buckling the annular groove I of the first circuit board on the outer part of the upper half of the frame-shaped curing glue from top to bottom; S5, taking out a support; S6, tightly attaching the exposed part of a guard plate to the bottom surface of the second circuit board; S7, tightly attaching the exposed part of the guard plate to the outer side wall of a strip-shaped through groove; S8, supporting the two exposed parts of the support on the table surface of a machine table; and S9, after a certain period of pressure maintaining, a first combined double-layer circuit board B is finally produced. The application has the beneficial effect of improving the production quality of the combined double-layer circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of producing a combined double-layer circuit board, and particularly relates to a production method of a combined double-layer circuit board. BACKGROUND

[0002] The structure of a combined double-layer circuit board A produced by a workshop is shown in Figure 1 , which comprises a first circuit board 1 and a second circuit board 2, and a connecting glue layer A3 is formed between the first circuit board 1 and the second circuit board 2. The top surface of the first circuit board 1 and the bottom surface of the second circuit board 2 are both formed with a circuit layer. The combined double-layer circuit board A is mainly used for being installed in a control box, and the circuit layer is electrically connected with each executing component of a machine tool, so as to control the action of each executing component of the machine tool.

[0003] The method used by workers in the workshop to produce the combined double-layer circuit board A by using resources in the workshop is as follows:

[0004] S1, the worker takes out a second circuit board 2, and lays the second circuit board 2 on a table top 4, as shown in Figure 2 ;

[0005] S2, the worker takes out a solidified glue sheet 5, and lays the solidified glue sheet 5 on the top surface of the second circuit board 2, as shown in Figure 3 ;

[0006] S3, the worker takes out a first circuit board 1, and covers the first circuit board 1 on the top surface of the solidified glue sheet 5, as shown in Figure 4 , so as to stack the first circuit board 1, the solidified glue sheet 5 and the second circuit board 2 together;

[0007] S4, the worker controls a hot pressing head 6 of a pressing machine to move downward, so that the hot pressing head 6 is pressed on the top surface of the first circuit board 1, as shown in Figure 5 . At this time, the heat on the hot pressing head 6 is transferred to the first circuit board 1, and the first circuit board 1 further transfers the heat to the solidified glue sheet 5. When the solidified glue sheet 5 is heated, it becomes a flowable connecting glue layer A6, and the connecting glue layer A3 bonds and fixes the first circuit board 1 and the second circuit board 2 together. After a certain period of pressure maintaining, the first combined double-layer circuit board A is finally produced, and the structure of the produced combined double-layer circuit board A is shown in Figure 1 ;

[0008] S5, the worker repeatedly performs the steps S1-S4 for multiple times, so as to continuously produce multiple combined double-layer circuit boards A.

[0009] However, the method used in the workshop can produce the combined double-layer circuit board A which can be used, but there are still the following technical defects in the technology:

[0010] I, the outer edge of the connecting adhesive layer A3 of the combined double-layer circuit board A is exposed to the air, so that the connecting adhesive layer A3 will fall off due to aging after the combined double-layer circuit board A is used for a long time, and then the first circuit board 1 will naturally fall off from the second circuit board 2

and the process requires that the first circuit board 1 will not naturally fall off from the second circuit board 2 after long-term use

[0011] II, the machine tool works will produce vibration, which will make the combined double-layer circuit board A installed in the control box vibrate synchronously, and the first circuit board 1 and the second circuit board 2 of the combined double-layer circuit board A can only be connected by a single connecting adhesive layer A3, so that the connecting strength is insufficient, and thus the first circuit board 1 of the combined double-layer circuit board A will be separated from the second circuit board 2 after the combined double-layer circuit board A is used for a long time in a vibrating environment, so that the entire combined double-layer circuit board A cannot continue to be used, and thus the combined double-layer circuit board A produced by the production method in the workshop has the technical defect of short service life.

[0012] Therefore, there is an urgent need for a production method of a combined double-layer circuit board capable of greatly improving the production quality of the combined double-layer circuit board and prolonging the service life of the combined double-layer circuit board. SUMMARY

[0013] The purpose of the present application is to overcome the shortcomings of the prior art and provide a production method of a combined double-layer circuit board capable of greatly improving the production quality of the combined double-layer circuit board and prolonging the service life of the combined double-layer circuit board.

[0014] The purpose of the present application is achieved by the following technical solution: a production method of a combined double-layer circuit board capable of preventing falling off, comprising the following steps:

[0015] S1, a worker takes out a first circuit board, and mills an annular groove I on the bottom surface of the first circuit board and along the outer edge thereof by using a milling cutter of a milling machine;

[0016] S2, a worker takes out a second circuit board, and mills an annular groove II on the top surface of the second circuit board and along the outer edge thereof by using a milling cutter of a milling machine, and then mills a strip-shaped through groove on the bottom surface of the second circuit board and at the left and right ends thereof, wherein the strip-shaped through groove penetrates the front and back end surfaces of the second circuit board;

[0017] S3, a worker takes out a frame-shaped curing adhesive, and embeds the frame-shaped curing adhesive into the annular groove II of the second circuit board from top to bottom, at this time, the upper half of the frame-shaped curing adhesive is exposed outside the second circuit board;

[0018] S4, the worker buckles the annular groove I of the first circuit board from top to bottom on the outside of the upper half of the frame-shaped curing glue, and then the worker presses the first circuit board downward with hands to make the bottom surface of the first circuit board contact with the top surface of the second circuit board, so as to pre-assemble the first circuit board, the second circuit board and the frame-shaped curing glue together;

[0019] S5, the worker takes out a support, the support includes a top plate and a guard plate respectively fixed on the left and right edges of the top plate, a central large groove is formed in the top plate, and the horizontal distance between the inner end faces of the two guard plates is equal to the horizontal width of the first circuit board;

[0020] S6, the worker presses the top plate of the support from top to bottom on the top surface of the first circuit board, at this time, the two guard plates of the support are respectively located on the outside of the second circuit board, and the lower end portions of the two guard plates are just exposed below the second circuit board; the worker uses the roller wheels of the roller press to horizontally roll the exposed portions of the two guard plates to make the exposed portions of the guard plates tightly adhere to the bottom surface of the second circuit board, so as to realize the preliminary fixation of the first circuit board and the second circuit board between the top plate and the exposed portions of the support, at this time, the two exposed portions are respectively located directly below the two strip-shaped through grooves;

[0021] S7, the worker uses the roller wheels of the roller press to roll the two exposed portions from bottom to top to make the exposed portions of the guard plates tightly adhere to the outer side walls of the strip-shaped through grooves, so as to realize the fixation of the first circuit board and the second circuit board between the top plate and the exposed portions of the support;

[0022] S8, the worker supports the two exposed portions of the support on the table surface of the machine table;

[0023] S9, the worker controls the hot press head of the press to move downward, when the hot press head passes through the central large groove of the top plate of the support downward, the hot press head is pressed on the top surface of the first circuit board, at this time, the heat on the hot press head is transferred to the first circuit board, and the first circuit board further transfers the heat to the curing glue sheet, when the frame-shaped curing glue is heated to become a flowable connecting glue layer B, the connecting glue layer B bonds and fixes the first circuit board and the second circuit board together; after a certain pressure maintaining time, the first combined double-layer circuit board B is finally produced;

[0024] S10, the worker repeatedly performs the steps S1-S9 multiple times to continuously produce multiple combined double-layer circuit boards B.

[0025] The groove depth of the annular groove II in the step S2 is equal to the groove depth of the annular groove I.

[0026] The two guard plates of the support in the step S5 are left-right symmetrical about the top plate.

[0027] The step S4, when the first circuit board, the second circuit board and the frame-shaped curing glue are initially combined together, the four side end faces of the first circuit board are flush with the four end faces of the second circuit board respectively.

[0028] The production quality of the combined double-layer circuit board is greatly improved, and the service life of the combined double-layer circuit board is prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 The structure diagram of the combined double-layer circuit board A produced by a workshop is shown in the figure.

[0030] Figure 2 The schematic diagram of placing the second circuit board on the table top is shown in the figure.

[0031] Figure 3 The schematic diagram of laying the curing glue sheet on the top surface of the second circuit board is shown in the figure.

[0032] Figure 4 The schematic diagram of covering the first circuit board on the top surface of the curing glue sheet is shown in the figure.

[0033] Figure 5 The schematic diagram of pressing the hot head on the top surface of the first circuit board is shown in the figure.

[0034] Figure 6 The schematic diagram of milling an annular groove I on the bottom surface of the first circuit board is shown in the figure.

[0035] Figure 7 The schematic diagram of the C of Figure 6 is shown in the figure.

[0036] Figure 8 The schematic diagram of the main section of Figure 6 is shown in the figure.

[0037] Figure 9 The schematic diagram of milling an annular groove II on the top surface of the second circuit board is shown in the figure.

[0038] Figure 10 The schematic diagram of the main section of Figure 9 is shown in the figure.

[0039] Figure 11 The schematic diagram of milling a strip-shaped through groove on the bottom surface of the second circuit board and at the left and right ends is shown in the figure.

[0040] Figure 12 The schematic diagram of the main section of Figure 11 is shown in the figure.

[0041] Figure 13 The structure diagram of the frame-shaped curing glue is shown in the figure.

[0042] Figure 14 The schematic diagram ofFigure 13 the main cross-sectional view of the frame-shaped solidifying glue;

[0043] Figure 15 the schematic view of embedding the frame-shaped solidifying glue into the annular groove II of the second circuit board from top to bottom;

[0044] Figure 16 the schematic view of buckling the annular groove I of the first circuit board on the outside of the upper half of the frame-shaped solidifying glue from top to bottom;

[0045] Figure 17 the schematic view of the structure of the support;

[0046] Figure 18 the schematic view of Figure 17 the main cross-sectional view of the frame-shaped solidifying glue;

[0047] Figure 19 the schematic view of pressing the top plate of the support on the top surface of the first circuit board from top to bottom;

[0048] Figure 20 the schematic view of tightly attaching the exposed part of the guard plate on the bottom surface of the second circuit board;

[0049] Figure 21 the schematic view of tightly attaching the exposed part of the guard plate on the outer sidewall of the strip-shaped through groove;

[0050] Figure 22 the schematic view of supporting the two exposed parts of the support on the table top of the machine;

[0051] Figure 23 the schematic view of pressing the hot pressing head on the top surface of the first circuit board;

[0052] Figure 24 the schematic view of the structure of the combined double-layer circuit board B produced by the present application;

[0053] in the figure:

[0054] 1 - the first circuit board, 2 - the second circuit board, 3 - the connecting glue layer A, 4 - the machine, 5 - the solidifying glue sheet, 6 - the hot pressing head;

[0055] 7 - the annular groove I, 8 - the annular groove II, 9 - the strip-shaped through groove, 10 - the frame-shaped solidifying glue, 11 - the top plate, 12 - the guard plate, 13 - the central large groove, 14 - the exposed part, 15 - the connecting glue layer B. DETAILED DESCRIPTION

[0056] The present application will be further described in conjunction with the accompanying drawings, and the protection scope of the present application is not limited to the following description:

[0057] A production method of a combined double-layer circuit board against falling off, which comprises the following steps:

[0058] S1, the worker takes out a first circuit board 1, through the milling cutter of milling machine on the bottom surface of the first circuit board 1 and along its outer edge, milling machining a annular groove I7, as shown in Figures 6-8 ;

[0059] S2, the worker takes out a second circuit board 2, through the milling cutter of milling machine on the top surface of the second circuit board 2 and along its outer edge, milling machining a annular groove II8, as shown in Figures 9-10 ; then milling machining a strip through groove 9 on the bottom surface of the second circuit board 2 and at its left and right ends, as shown in Figures 11-12 ; wherein, the strip through groove 9 penetrates the front and back end surface of the second circuit board 2; the groove depth of the annular groove II8 is equal to the groove depth of the annular groove I7;

[0060] S3, the worker takes out a frame curing glue 10 as shown in Figures 13-14 , the frame curing glue 10 is embedded into the annular groove II8 of the second circuit board 2 from top to bottom, as shown in Figure 15 , at this time, the upper half of the frame curing glue 10 is exposed outside the second circuit board 2;

[0061] S4, the worker buckles the annular groove I7 of the first circuit board 1 from top to bottom outside the upper half of the frame curing glue 10, as shown in Figure 16 ; then the worker presses the first circuit board 1 down with his hand, so that the bottom surface of the first circuit board 1 is in contact with the top surface of the second circuit board 2, thereby pre-assembling the first circuit board 1, the second circuit board 2 and the frame curing glue 10 together; when the first circuit board 1, the second circuit board 2 and the frame curing glue 10 are initially assembled together, the four side end faces of the first circuit board 1 are flush with the four end faces of the second circuit board 2 respectively;

[0062] S5, the worker takes out a bracket as shown in Figures 17-18 , the bracket includes a top plate 11, a guard plate 12 respectively fixed on the left and right edges of the top plate 11, a central large groove 13 is opened in the top plate 11, the horizontal distance between the inner end faces of the two guard plates 12 is equal to the horizontal width of the first circuit board 1, the two guard plates 12 of the bracket are left-right symmetrical about the top plate 11;

[0063] S6, the worker presses the top plate 11 of the bracket on the top surface of the first circuit board 1 from top to bottom, as shown in Figure 19 , at this time, the two guard plates 12 of the bracket are respectively outside the second circuit board 2, and the lower end of the two guard plates 12 is just exposed below the second circuit board 2; the worker uses the roller of the roller press to horizontally roll the exposed part 14 of the two guard plates 12, so that the exposed part 14 of the guard plate 12 is tightly attached to the bottom surface of the second circuit board 2, as shown in Figure 20As shown, thereby achieving the first circuit board 1 and the second circuit board 2 preliminary fixed between the top plate 11 and the exposed part 14 of the bracket, at this time, two exposed parts 14 are respectively located directly below the two strip-shaped through slots 9;

[0064] S7, the worker uses the roller of the roller press to roll the two exposed parts 14 from below to above, so that the exposed part 14 of the guard plate 12 is tightly attached to the outer side wall of the strip-shaped through slot 9, as shown in Figure 21 As shown, thereby achieving the first circuit board 1 and the second circuit board 2 fixed between the top plate 11 and the exposed part 14 of the bracket;

[0065] S8, the worker supports the two exposed parts 14 of the bracket on the table surface of the machine table 4, as shown in Figure 22 As shown;

[0066] S9, the worker controls the hot head 6 of the press to move downward, when the hot head 6 passes through the center slot 13 of the top plate 11 of the bracket, the hot head 6 is pressed on the top surface of the first circuit board 1, as shown in Figure 23 At this time, the heat on the hot head 6 is transferred to the first circuit board 1, and the first circuit board 1 transfers the heat to the curing film 5, when the frame-shaped curing film 10 is heated to become a flowable connecting glue layer B15, the connecting glue layer B15 bonds the first circuit board 1 and the second circuit board 2 to be integrated; after a certain period of pressure retention, the first combined double-layer circuit board B is finally produced, and the structure of the produced combined double-layer circuit board B is as shown in Figure 24 As shown;

[0067] In step S9, since the connecting glue layer B15 in the produced combined double-layer circuit board B is always limited between the annular groove I7 of the first circuit board 1 and the annular groove II8 of the second circuit board 2, the connecting glue layer B15 is not exposed to the air, therefore, when the combined double-layer circuit board B is used for a long time, the connecting glue layer B15 will not fall off due to aging, thereby effectively avoiding the first circuit board 1 from falling off from the second circuit board 2. As can be seen, compared with the production method as shown in Figures 1-5 As shown, the production quality of the combined double-layer circuit board is greatly improved.

[0068] S10, the worker repeats the steps S1-S9 multiple times, thereby continuously producing multiple combined double-layer circuit boards B.

[0069] In addition, in step S7, since the first circuit board 1 and the second circuit board 2 are fixed between the top plate 11 and the exposed part 14 of the support, and in step S9, the connecting adhesive layer B15 also adhesively connects the first circuit board 1 and the second circuit board 2 together, under the two forces, the first circuit board 1 and the second circuit board 2 are tightly fixed together. Therefore, when the combined double-layer circuit board B is used for a long time in a vibrating environment, the first circuit board 1 of the combined double-layer circuit board B will not be separated from the second circuit board 2, and the service life is longer than that of the combined double-layer circuit board A produced in the workshop.

Claims

1. A method for producing a fall-preventing combined double-layer circuit board, characterized by comprising: It comprises the following steps: ​ S1, the worker takes out a first circuit board (1), and mills a circular groove I (7) on the bottom surface of the first circuit board (1) and along the outer edge thereof by a milling cutter of a milling machine; S2, the worker takes out a second circuit board (2), and mills a circular groove II (8) on the top surface of the second circuit board (2) and along the outer edge thereof by a milling cutter of a milling machine, and then mills a strip-shaped through groove (9) on the bottom surface of the second circuit board (2) and at the left and right ends thereof, wherein the strip-shaped through groove (9) penetrates the front and rear end surfaces of the second circuit board (2); S3, the worker takes out a frame-shaped curing glue (10), and embeds the frame-shaped curing glue (10) into the circular groove II (8) of the second circuit board (2) from top to bottom, at this time, the upper half of the frame-shaped curing glue (10) is exposed outside the second circuit board (2); S4, the worker buckles the circular groove I (7) of the first circuit board (1) from top to bottom outside the upper half of the frame-shaped curing glue (10), and then the worker presses the first circuit board (1) downward by hand, so that the bottom surface of the first circuit board (1) is in contact with the top surface of the second circuit board (2), thereby pre-assembling the first circuit board (1), the second circuit board (2) and the frame-shaped curing glue (10) together; S5, the worker takes out a support, which comprises a top plate (11) and a guard plate (12) respectively fixed on the left and right edges of the top plate (11), a central large groove (13) is formed in the top plate (11), and the horizontal distance between the inner end faces of the two guard plates (12) is equal to the horizontal width of the first circuit board (1); S6, the worker presses the top plate (11) of the support on the top surface of the first circuit board (1) from top to bottom, at this time, the two guard plates (12) of the support are respectively located outside the second circuit board (2), and the lower end portions of the two guard plates (12) are just exposed below the second circuit board (2); the worker uses the rolling wheels of a rolling machine to horizontally roll the exposed portions (14) of the two guard plates (12), so that the exposed portions (14) of the guard plates (12) are tightly attached to the bottom surface of the second circuit board (2), thereby realizing the preliminary fixation of the first circuit board (1) and the second circuit board (2) between the top plate (11) and the exposed portions (14) of the support, at this time, the two exposed portions (14) are respectively located directly below the two strip-shaped through grooves (9); S7, the worker uses the rolling wheels of a rolling machine to roll the two exposed portions (14) from below to above, so that the exposed portions (14) of the guard plates (12) are tightly attached to the outer side walls of the strip-shaped through grooves (9), thereby realizing the fixation of the first circuit board (1) and the second circuit board (2) between the top plate (11) and the exposed portions (14) of the support; S8, the worker supports the two exposed portions (14) of the support on the table surface of a machine table (4); S9, the worker controls the hot pressing head (6) of the pressing machine to move downward, when the hot pressing head (6) passes through the center groove (13) of the top plate (11) of the support, the hot pressing head (6) presses on the top surface of the first circuit board (1), at this time, the heat on the hot pressing head (6) is transferred to the first circuit board (1), and the first circuit board (1) further transfers the heat to the solidified adhesive sheet (5), when the frame-shaped solidified adhesive (10) is heated to become a flowable connecting adhesive layer B (15), the connecting adhesive layer B (15) bonds the first circuit board (1) and the second circuit board (2) to be integrated; after a certain period of pressure maintaining, the first combined double-layer circuit board B is finally produced; S10, the worker repeats the steps S1-S9 multiple times, so that multiple combined double-layer circuit boards B can be continuously produced.

2. The method of claim 1, wherein the method further comprises: The groove depth of the annular groove II (8) in the step S2 is equal to that of the annular groove I (7). ​ 3. The method of claim 1, wherein the method further comprises: The two guard plates (12) of the support in the step S5 are symmetric about the top plate (11). ​ 4. The method of claim 1, wherein the method further comprises: In the step S4, after the first circuit board (1), the second circuit board (2) and the frame-shaped solidified adhesive (10) are initially combined together, the four side end faces of the first circuit board (1) are flush with the four end faces of the second circuit board (2). ​

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