Active substance coating method and apparatus using same

Abstract

The present disclosure relates to an active material coating method and an apparatus using the same. The active material coating method includes: forming a first coating line and a second coating line on a first surface of a substrate; forming a first active material coating layer between the first coating line and the second coating line on the first surface of the substrate; forming a third coating line and a fourth coating line on the second surface of the substrate; forming a second active material coating layer between the third coating line and the fourth coating line on the second surface of the substrate; forming a first etching active material coating layer by etching a portion of the first active material coating layer; determining a positional relationship between a first etching active material coating on the first surface and a second active material coating on the second surface; and forming a second etched active material coating by etching a portion of the second active material coating based on the positional relationship.

Description

Technical Field

[0001] This disclosure relates to methods for coating active substances and apparatus for using the same. Background Technology

[0002] Unlike primary batteries, which are not designed for (re)charging, secondary (or rechargeable) batteries are designed for discharging and recharging. Low-capacity secondary batteries are used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders, while high-capacity secondary batteries are widely used as power sources for driving motors in hybrid and electric vehicles, as well as for storing electricity (e.g., household power storage and / or utility-scale power storage). A secondary battery typically includes: an electrode assembly comprising positive and negative electrodes, a housing containing the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] The electrode assembly of a secondary battery may include a plate with an active material coating. The active material coating may be present on both sides of the plate. For example, the electrode assembly may be formed by arranging a negative electrode active material coating and / or a positive electrode active material coating on both sides of the plate and winding or overlapping the plate.

[0004] Because the active material coatings formed on both sides of the plate are aligned with each other, the power of the secondary battery can be increased. However, due to the movement of the substrate or the position of the mold used to form the active material coating, it is difficult to perfectly align the positions of the active material coatings formed on both sides of the plate.

[0005] The information disclosed in this background section is intended to enhance the understanding of the background of this disclosure, and therefore may contain information that does not constitute related (or prior art). Summary of the Invention

[0006] Some aspects of this disclosure relate to an active material coating method for solving the above-mentioned problems and an apparatus using the method. Some aspects of this disclosure relate to a method for forming multiple coating lines and forming an active material coating between the coating lines, and an apparatus using the method.

[0007] These and other aspects and features of this disclosure will be described in or will be apparent from the following description of embodiments of this disclosure.

[0008] According to some embodiments of the present disclosure, an active material coating method is provided, comprising: forming a first coating line and a second coating line spaced apart from the first coating line on a first surface of a substrate by a coating line forming apparatus; forming a first active material coating between the first coating line and the second coating line on the first surface of the substrate by a coating forming apparatus; forming a third coating line and a fourth coating line spaced apart from the third coating line on a second surface of the substrate by a coating line forming apparatus; forming a second active material coating between the third coating line and the fourth coating line on the second surface of the substrate by a coating forming apparatus; forming a first etched active material coating by etching at least a portion of the first active material coating by an etching apparatus; determining a positional relationship between the first etched active material coating on the first surface of the substrate and the second active material coating on the second surface of the substrate by a controller; and forming a second etched active material coating by etching at least a portion of the second active material coating based on the positional relationship by an etching apparatus.

[0009] In some embodiments, the active material coating method further includes: conveying a substrate in one direction via a conveying device, wherein a first coating line, a second coating line, a third coating line, a fourth coating line, a first active material coating, and a second active material coating are formed parallel to the conveying direction of the substrate.

[0010] In some embodiments, forming a first coating line and a second coating line spaced apart from the first coating line includes: forming the first coating line by applying a coating solution to a first line on a first surface of a substrate using a coating line forming apparatus; and forming the second coating line by applying a coating solution to a second line on the first surface of a substrate spaced apart from the first line using a coating line forming apparatus, wherein forming a third coating line and a fourth coating line spaced apart from the third coating line includes: forming the third coating line by applying a coating solution to a third line on a second surface of a substrate using a coating line forming apparatus; and forming the fourth coating line by applying a coating solution to a fourth line on the second surface of a substrate spaced apart from the third line using a coating line forming apparatus.

[0011] In some embodiments, the viscosity of the coating solution is 8,000 CPS or greater.

[0012] In some embodiments, each of the first to fourth coating lines includes at least one of an adhesive, a ceramic, and a polyimide (PI).

[0013] In some embodiments, forming a first active material coating includes applying a first active material slurry between a first coating line and a second coating line on a first surface of a substrate using an active material coating apparatus included in a coating forming apparatus. Forming a second active material coating includes applying a second active material slurry between a third coating line and a fourth coating line on a second surface of the substrate using the active material coating apparatus. The method further includes forming at least one of the first and second active material coatings by drying the substrate using a drying apparatus of the coating forming apparatus. In this document, "dry substrate" refers to "drying the substrate and the substances on the substrate (e.g., coating solution, active material slurry, etc.)".

[0014] In some embodiments, forming a first etchable active material coating includes: receiving a first image via a controller, the first image being obtained by photographing a first surface of a substrate on which the first active material coating is formed; determining, via the controller, the positions of a first coating line and a second coating line on the first surface of the substrate based on the first image; etching, via an etching apparatus, at least a portion of the first coating line and the first active material coating at a first width based on the determined position of the first coating line; and etching, via an etching apparatus, at least a portion of the second coating line and the first active material coating at a first width based on the determined position of the second coating line.

[0015] In some embodiments, determining the positional relationship includes: receiving a second image by means of a controller, the second image being obtained by photographing a second surface of a substrate on which a second active material coating is formed; receiving a third image by means of a controller, the third image being obtained by photographing a first surface of a substrate on which a first etched active material coating is formed; and determining the positional relationship between the first etched active material coating and the second active material coating by means of a controller based on the second image and the third image.

[0016] In some embodiments, a first surface of the substrate faces a second surface of the substrate, a first etch active material coating is etched to form an edge portion on one or both sides of the first etch active material coating, and determining the positional relationship between the first etch active material coating and the second active material coating based on a second image and a third image includes: determining the positional relationship between the edge portion and the second active material coating on the second surface of the substrate by a controller.

[0017] In some embodiments, a first surface of the substrate faces a second surface of the substrate, etching a first etch-active material coating to form an edge portion on one or both sides of the first etch-active material coating, and forming a second etch-active material coating includes etching the second active material coating with a second width from a position corresponding to the edge portion on the second surface of the substrate toward the outside of the substrate using an etching apparatus.

[0018] In some embodiments, forming a first etchable active material coating includes etching at least a portion of a first coating line and at least a portion of a second coating line and at least a portion of the first active material coating using an etching apparatus, wherein etching at least a portion of the second active material coating includes etching at least a portion of a third coating line and at least a portion of a fourth coating line and at least a portion of the second active material coating using an etching apparatus.

[0019] In some embodiments, the active material coating includes a first active material coating and a second active material coating, the coating line includes a first coating line to a fourth coating line, the active material coating includes a plurality of boundary portions in contact with the coating line, and the angle between the curved areas of the plurality of boundary portions and the width direction of the plurality of boundary portions is 70 degrees to 80 degrees.

[0020] In some embodiments, the etched active material coating includes a first etched active material coating and a second etched active material coating, wherein the etched active material coating is etched to form an edge portion on one or both sides of the etched active material coating, and the angle of the curved area of ​​the edge portion relative to the width direction of the edge portion is 80 degrees to 90 degrees.

[0021] In some embodiments, the active material coating method further includes: removing foreign matter located on the substrate using a foreign matter removal device.

[0022] In some embodiments, a first surface of the substrate faces a second surface of the substrate. A first active material coating includes a first boundary portion in contact with a first coating line and a second boundary portion in contact with a second coating line. A second active material coating includes a third boundary portion in contact with a third coating line and a fourth boundary portion in contact with a fourth coating line. A first etchable active material coating includes a first edge portion formed by etching the first boundary portion and a second edge portion formed by etching the second boundary portion. A second etchable active material coating includes a third edge portion formed by etching the third boundary portion and a fourth edge portion formed by etching the fourth boundary portion. Based on the width direction of the substrate, the boundary of the first edge portion corresponds to the boundary of the third edge portion, and based on the width direction of the substrate, the boundary of the second edge portion corresponds to the boundary of the fourth edge portion.

[0023] According to some embodiments of the present disclosure, an active material coating apparatus is provided, comprising: a coating line forming apparatus configured to form a first coating line and a second coating line spaced apart from the first coating line on a first surface of a substrate, and configured to form a third coating line and a fourth coating line spaced apart from the third coating line on a second surface of the substrate; a coating forming apparatus configured to form a first active material coating between the first coating line and the second coating line, and configured to form a second active material coating between the third coating line and the fourth coating line; an etching apparatus configured to form a first etched active material coating by etching at least a portion of the first active material coating; and a controller configured to determine a positional relationship between the first etched active material coating on the first surface of the substrate and the second active material coating on the second surface of the substrate, wherein the etching apparatus is configured to form a second etched active material coating by etching at least a portion of the second active material coating based on the determined result.

[0024] In some embodiments, the coating forming apparatus further includes: an active material coating apparatus configured to coat an active material slurry between a first coating line and a second coating line on a first surface of the substrate and configured to coat an active material slurry between a third coating line and a fourth coating line on a second surface of the substrate; and a drying apparatus configured to form at least one of a first active material coating and a second active material coating by drying the substrate.

[0025] In some embodiments, the active material coating apparatus further includes: a first image sensor configured to generate a first image obtained by photographing a first surface of a substrate on which a first active material coating is formed, wherein a controller is configured to determine the positions of a first coating line and a second coating line on the first surface of the substrate based on the first image, and wherein an etching device is configured to etch at least a portion of the first coating line and the first active material coating with a first width, and is configured to etch at least a portion of the second coating line and the first active material coating with a first width.

[0026] In some embodiments, the active material coating apparatus further includes: a second image sensor configured to generate a second image obtained by photographing a second surface of a substrate on which a second active material coating is formed; and a third image sensor configured to generate a third image obtained by photographing a first surface of a substrate on which a first etched active material coating is formed, wherein a controller is configured to determine a positional relationship between the first etched active material coating and the second active material coating based on the second image and the third image.

[0027] In some embodiments, the active material coating apparatus further includes: a conveying device configured to convey a substrate in one direction; and a foreign matter removal device configured to remove foreign matter located on the substrate.

[0028] According to some embodiments of this disclosure, the sides of the active material coating on the first surface and the sides of the active material coating on the second surface are etched, so that the boundaries of the active material coating on the first surface and the active material coating on the second surface can completely coincide with each other. A secondary battery including a plate with an active material coating having coincident boundaries can have higher power and improved lifespan.

[0029] According to some embodiments of this disclosure, since the curved areas of the edge portions formed in the etched active material coating become almost vertical, the power utilization on both sides of the active material coating can be increased.

[0030] However, the aspects and features of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the detailed description below that other aspects and features not mentioned will be apparent. Attached Figure Description

[0031] The accompanying drawings illustrate embodiments of the present disclosure, and further describe aspects and features of the disclosure in conjunction with the detailed description thereof. Therefore, the disclosure should not be construed as limited to the drawings:

[0032] Figure 1 A schematic diagram illustrating a plate formed by an active material coating method according to some embodiments of the present disclosure;

[0033] Figure 2 A schematic diagram illustrating an active substance coating apparatus according to some embodiments of the present disclosure;

[0034] Figure 3 The figures illustrate examples of images obtained by photographing a substrate on which multiple coating lines are formed, according to some embodiments of the present disclosure;

[0035] Figure 4 The figures illustrate examples of images obtained by photographing a substrate on which an active material coating is formed, according to some embodiments of the present disclosure;

[0036] Figure 5 A diagram illustrating a scenario in which a first coating line and a second coating line are formed on a first surface of a substrate according to some embodiments of the present disclosure;

[0037] Figure 6 The figure is provided to illustrate a scenario in which an active material coating is formed on a first surface of a substrate according to some embodiments of the present disclosure;

[0038] Figure 7 The figure is provided to illustrate a scenario in which a third coating line and a fourth coating line are formed on a second surface of a substrate according to some embodiments of the present disclosure;

[0039] Figure 8 The figure is provided to illustrate a scenario in which an active material coating is formed on a first surface of a substrate according to some embodiments of the present disclosure;

[0040] Figure 9 A diagram illustrating a scenario in which a first etch-active material coating is formed on a first surface of a substrate according to some embodiments of the present disclosure;

[0041] Figure 10 The figure illustrates a scenario in which a second etch-active material coating is formed on a second surface of a substrate according to some embodiments of the present disclosure;

[0042] Figure 11 A diagram illustrating the boundary portion of an active material coating according to some embodiments of the present disclosure;

[0043] Figure 12 A diagram illustrating the edge portion of the etched active material coating according to some embodiments of the present disclosure; and

[0044] Figure 13 A flowchart illustrating an active substance coating method according to some embodiments of the present disclosure. Detailed Implementation

[0045] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be construed as limited to their ordinary or dictionary meanings, but should be interpreted as meanings and concepts consistent with the technical ideas of this disclosure, based on the principle that the inventor may, for his / her own lexicographer, appropriately define the concept of the term in order to best interpret his / her invention.

[0046] The embodiments described in this specification and the configurations shown in the accompanying drawings are merely some embodiments of this disclosure and do not represent all the technical ideas, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalent schemes and modifications can be made to replace or modify the embodiments described herein at the time of filing this application.

[0047] It will be understood that when an element or layer is described as being "on" another element or layer, "connected to," or "linked to" another element or layer, it may be directly on, connected to, or linked to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is described as being "directly on" another element or layer, "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "linked" or "connected" to a second element, the first element may be directly linked to or connected to the second element, or the first element may be indirectly linked to or connected to the second element via one or more intermediary elements.

[0048] In the accompanying drawings, the dimensions of various elements, layers, etc., may be enlarged for clarity of explanation. The same reference numerals denote the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated enumerated items. Furthermore, when describing embodiments of this disclosure, the use of "may" refers to "one or more embodiments of this disclosure." When preceding / following a list of elements, expressions such as "at least one of..." and "any one of..." modify the entire list of elements, not individual elements of the list. When phrases such as "at least one of A, B, and C," "at least one of A, B, or C," "at least one selected from the group consisting of A, B, and C," or "at least one selected from A, B, and C" are used to specify a list of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, and C (such as A, B, C, A and B, A and C, B and C, or A and B and C). As used herein, the terms “use,” “using,” and “used” are to be regarded as synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively. As used herein, the terms “substantially,” “about,” and similar terms are used as terms of approximation, not as terms of degree, and are intended to describe the inherent biases of measurements or calculations that will be recognized by one of ordinary skill in the art.

[0049] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0050] For ease of description, spatial relative terms (such as "below," "below," "down," "above," "upper," etc.) are used herein to describe the relationship between one element or feature and another element or feature illustrated in the figures. It will be understood that, in addition to the orientation depicted in the figures, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figure is flipped, the element described as "below" or "below" of other elements or features would then be oriented "above" of those other elements or features. Thus, the term "below" can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptors used herein should be interpreted accordingly.

[0051] The terminology used herein is for the purpose of describing embodiments of the present disclosure and is not intended to limit the disclosure. As used herein, the singular forms “a” and “an” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that, when used in this specification, the terms “includes,” “including,” “comprises,” and / or “comprising” indicate the presence of the described features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0052] Furthermore, any numerical range disclosed and / or set forth herein is intended to include all subranges containing the same numerical precision within the set forth range. For example, the range “1.0 to 10.0” is intended to include (and include) the stated minimum value of 1.0 and the stated maximum value of 10.0, i.e., all subranges having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0 (e.g., 2.4 to 7.6). Any maximum numerical limit set forth herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit set forth in this specification is intended to include all higher numerical limits contained therein. Accordingly, the applicant reserves the right to amend this specification (including the claims) to expressly set forth any subranges contained within the range expressly set forth herein. All such ranges are intended to be inherently described in this specification such that amendments to expressly set forth any such subranges will comply with the requirements of Chinese patent law.

[0053] Referring to two compared elements, features, etc., as “identical” can mean that they are “substantially identical.” Therefore, the phrase “substantially identical” can include cases with what is considered in the art to be low deviation (e.g., 5% or less). Furthermore, when a parameter is said to be uniform in a given region, this can mean that it is uniform in terms of average value.

[0054] Throughout this instruction manual, unless otherwise stated, each element may be singular or plural.

[0055] Placing any element "above (or below)" or "above (below)" another element can mean that any element can be positioned to contact the upper (or lower) surface of the element, and another element can be inserted between the element and any element positioned above (or below) the element.

[0056] Additionally, it will be understood that when a component is referred to as a “link,” “connect,” or “attached” to another component, the components can be directly “linked,” “attached,” or “attached” to each other, or another component can be “inserted” between the components.

[0057] Throughout this instruction manual, when “A and / or B” is stated, it means A, B, or A and B, unless otherwise stated. That is, “and / or” includes any or all combinations of the listed items. When “C to D” is stated, it means C or more and D or fewer, unless otherwise indicated.

[0058] Figure 1 This is a schematic diagram illustrating a plate formed by an active material coating method according to some embodiments of the present disclosure. In some embodiments, a substrate 110 (e.g., a metal thin film substrate) may be prepared for forming the plate. For example, substrate 110 may include, but is not limited to, aluminum foil, copper foil, nickel foil, polymer composite substrates coated with metal, etc. For example, various suitable materials that can be used for the plate (or electrode) may be used as substrate 110.

[0059] The active material coating equipment may include a coating line forming apparatus, a coating forming apparatus, an etching apparatus, a control unit (e.g., a controller) 200, an image sensor, conveying devices 202_1 and 202_2, and a foreign matter removal apparatus. (Reference) Figure 2 The components included in the active material coating apparatus are described in more detail. The active material coating apparatus according to some embodiments of this disclosure may further include a first adjustable image sensor and a second adjustable image sensor.

[0060] The coating line forming apparatus can form a first coating line 120_1 on a first surface of the substrate 110. The coating line forming apparatus can also form a second coating line 120_2 on the first surface of the substrate 110 at a position spaced apart from the first coating line 120_1. Subsequently, the coating forming apparatus can form a first active material coating 130_1 between the first coating line 120_1 and the second coating line 120_2 on the first surface of the substrate 110.

[0061] Similarly, the coating line forming apparatus can form a third coating line 120_3 on the second surface of the substrate 110. In some embodiments, the second surface of the substrate 110 may face the surface of the first surface of the substrate 110. The coating line forming apparatus can form a fourth coating line 120_4 on the second surface of the substrate 110 at a position spaced apart from the third coating line 120_3. Subsequently, the coating forming apparatus can form a second active material coating 130_2 between the third coating line 120_3 and the fourth coating line 120_4 on the second surface of the substrate 110.

[0062] The first active material coating 130_1 may include a first boundary portion contacting the first coating line 120_1 and a second boundary portion contacting the second coating line 120_2. The second active material coating 130_2 may include a third boundary portion contacting the third coating line 120_3 and a fourth boundary portion contacting the fourth coating line 120_4. Based on the width direction of the substrate 110, the positions of the first boundary portion and the third boundary portion may not correspond exactly to each other or be perfectly aligned. Similarly, based on the width direction of the substrate 110, the positions of the second boundary portion and the fourth boundary portion may not correspond exactly to each other or be perfectly aligned.

[0063] In some embodiments, the etching apparatus can form a first etchable active material coating 140_1 by etching at least a portion of the first active material coating 130_1. In some embodiments, the first coating line 120_1 and the second coating line 120_2 can be etched together with at least a portion of the first active material coating 130_1. By etching the first etchable active material coating 140_1, edge portions can be formed on one or both sides. For example, by etching a first boundary portion of the first active material coating 130_1, a first edge portion in the first etchable active material coating 140_1 can be formed. By etching a second boundary portion of the first active material coating 130_1, a second edge portion in the first etchable active material coating 140_1 can be formed.

[0064] The control unit (e.g., controller) 200 can determine the positional relationship between the first etch-active material coating 140_1 on the first surface of the substrate 110 and the second etch-active material coating 130_2 on the second surface of the substrate 110. The control unit 200 can transmit the determined result or a control signal generated based on the determined result to the etching apparatus. The etching apparatus can form the second etch-active material coating 140_2 by etching at least a portion of the second etch-active material coating 130_2 based on the determined result or the control signal.

[0065] In some embodiments, the etching apparatus can form a second etch-active material coating 140_2 by etching at least a portion of the second active material coating 130_2. In some embodiments, the third coating line 120_3 and the fourth coating line 120_4 can be etched together with at least a portion of the second active material coating 130_2. By etching the second etch-active material coating 140_2, edge portions can be formed on one or both sides. For example, by etching the third boundary portion of the second active material coating 130_2, a third edge portion in the second etch-active material coating 140_2 can be formed. By etching the fourth boundary portion of the second active material coating 130_2, a fourth edge portion in the second etch-active material coating 140_2 can be formed.

[0066] In some embodiments, the boundary of the first edge portion may correspond to or align with the boundary of the third edge portion in the width direction of the substrate 110. Based on the width direction of the substrate 110, the boundary of the second edge portion may correspond to or align with the boundary of the fourth edge portion. For example, based on the width direction of the substrate 110, the boundaries of the active material coating formed on the first surface of the substrate 110 and the boundaries of the active material coating formed on the second surface of the substrate 110 may coincide with each other. A secondary battery including a plate with active material coatings having coincident boundaries can have higher power and improved lifespan.

[0067] refer to Figure 1 Although it has been explained that two coating lines 120_1, 120_2 and a first active material coating 130_1 are formed on the first surface of the substrate 110, and two coating lines 120_3, 120_4 and a second active material coating 130_2 are formed on the second surface, this disclosure is not limited thereto. For example, 2n coating lines and n first active material coatings may be formed on the first surface of the substrate 110, and 2n coating lines and n second active material coatings may be formed on the second surface (where n is a natural number of 1 or greater). Accordingly, n first etch-active material coatings may be formed on the first surface of the substrate 110, and n second etch-active material coatings may be formed on the second surface. (Refer to...) Figure 3 and Figure 4A more detailed description of the multiple active material coatings.

[0068] Figure 2 A schematic diagram illustrating an active material coating apparatus according to some embodiments of the present disclosure is provided. A substrate 210 can be conveyed to the active material coating apparatus via a conveying device. (See reference...) Figure 2 The substrate 210 can be conveyed to the active material coating apparatus in direction A1. The substrate 210 coated with active material can be conveyed from the active material coating apparatus in direction A2.

[0069] First, the first coating line forming apparatus 220_1, included in the active material coating apparatus, can form a first coating line and a second coating line spaced apart from the first coating line on a first surface of the substrate 210. The coating lines can be formed by applying a coating solution. For example, the first coating line can be formed by applying a coating solution to the first line on the first surface of the substrate 210. Similarly, the second coating line can be formed by applying a coating solution to the second line spaced apart from the first line on the first surface of the substrate 210.

[0070] The coating solution can be applied using a die or similar means. For example, the viscosity of the coating solution may be 8,000 CPS or greater. For example, the coating line may include at least one of an adhesive, ceramic, and polyimide (PI). In some embodiments, the adhesive is one of the materials included in the active material slurry, and it allows the active material and conductive material to be bonded to the current collector, and allows the active material slurry to be uniformly coated onto the current collector. For example, non-aqueous adhesives, aqueous adhesives, dry adhesives, or combinations thereof may be used as adhesives.

[0071] In some embodiments, a first active material coating apparatus 230_1, included in a coating forming apparatus, can coat a first active material slurry between a first coating line and a second coating line on a first surface of a substrate 210. The active material slurry can be coated using a mold or the like. In some embodiments, the active material slurry includes a positive electrode active material (or a negative electrode active material), a conductive material, a binder, additives, etc., and can be coated onto the substrate 210 to manufacture a board. Subsequently, a first drying apparatus 240_1, included in the coating forming apparatus, can dry the substrate 210. A first active material coating can be formed by drying the active material slurry coated onto the first surface of the substrate 210.

[0072] In some embodiments, the second coating line forming apparatus 220_2 can form a third coating line and a fourth coating line spaced apart from the third coating line on the second surface of the substrate 210. The coating lines can be formed by applying a coating solution. In some embodiments, the coating solution used to form the third and fourth coating lines can be the same material as the coating solution used to form the first and second coating lines. For example, the third coating line can be formed by applying a coating solution to the third line on the second surface of the substrate 210. Similarly, the fourth coating line can be formed by applying a coating solution to the fourth line spaced apart from the third line on the second surface of the substrate 210.

[0073] In some embodiments, after the first coating line and the second coating line are formed on the substrate 210, the first adjustment image sensor can immediately capture an image of the first surface of the substrate 210. The control unit (e.g., a controller) 200 can receive the image captured by the first adjustment image sensor and determine the position and width of the first coating line and the second coating line on the first surface of the substrate 210 based on the image. The control unit 200 can correct the position of the first and second lines based on the determined position and width of the first and second coating lines. The control unit 200 can adjust the amount of coating solution applied to form the first coating line and / or the second coating line based on the determined position and width of the first and second coating lines. Information regarding the corrected position of the first and second lines and the adjusted amount of coating solution applied can be transmitted to the first coating line forming apparatus 220_1.

[0074] In some embodiments, the control unit 200 may determine the positions of the third and fourth lines based on the determined positions and widths of the first and second coating lines. For example, the control unit 200 may determine the positions of the third and fourth lines such that, based on the width direction of the substrate 210, the position of the third line on the second surface of the substrate 210 coincides with the position of the first coating line, and the position of the fourth line on the second surface of the substrate 210 coincides with the position of the second coating line. The control unit 200 may adjust the amount of coating solution applied to form the third and / or fourth coating lines such that the width of the third coating line is the same as the width of the first coating line, and the width of the fourth coating line is the same as the width of the second coating line. Information regarding the determined positions of the third and fourth lines and the adjusted amount of coating solution applied may be transmitted to the second coating line forming apparatus 220_2.

[0075] In some embodiments, after the third and fourth coating lines are formed on the substrate 210, the second adjustment image sensor can capture images of the second surface of the substrate 210. The control unit (e.g., a controller) 200 can receive the images captured by the second adjustment image sensor and determine the position and width of the third and fourth coating lines on the second surface of the substrate 210 based on the images. The control unit 200 can correct the position of the third and fourth lines based on the determined position and width. The control unit 200 can adjust the amount of coating solution applied to form the third and / or fourth coating lines based on the determined position and width. Information regarding the corrected position of the third and fourth lines and the adjusted amount of coating solution can be transmitted to the second coating line forming apparatus 220_2. Additionally, when the position of the third and fourth lines is corrected, the control unit 200 can analyze the images captured by the first adjustment image sensor together. When adjusting the amount of coating solution applied to form the third and / or fourth coating lines, the control unit 200 can analyze the images captured by the first adjustment image sensor together.

[0076] In some embodiments, the second active material coating apparatus 230_2, included in the coating forming apparatus, can coat a second active material slurry between a third coating line and a fourth coating line on the second surface of the substrate 210. The active material slurry used in the second active material coating apparatus 230_2 and the active material slurry used in the first active material coating apparatus 230_1 can be the same material or different materials. For example, the active material slurry used in the second active material coating apparatus 230_2 can be a positive electrode active material slurry, and the active material slurry used in the first active material coating apparatus 230_1 can be a negative electrode active material slurry. In some examples, the active material slurry used in the second active material coating apparatus 230_2 and the active material slurry in the first active material coating apparatus 230_1 can be a negative electrode active material slurry.

[0077] Subsequently, the second drying device 240_2 included in the coating forming apparatus can dry the substrate 210. The second active material coating can be formed by drying the active material slurry coated onto the second surface of the substrate 210.

[0078] In some embodiments, the first image sensor 250_1 can generate a first image by photographing a first surface of a substrate 210 on which a first active material coating is formed. The control unit 200 can receive the first image and determine, based on the first image, the positions and / or widths of a first coating line and a second coating line on the first surface of the substrate 210. The first etching apparatus 260_1 can etch at least a portion of the first coating line and the first active material coating on the substrate 210 with a first width. The first etching apparatus 260_1 can also etch at least a portion of the second coating line and the first active material coating on the substrate 210 with a first width. In some embodiments, the control unit 200 can determine the starting position of etching based on the positions of the first and second coating lines and can transmit information about that position to the etching apparatus. The control unit 200 can determine the size of the first width based on the widths of the first and second coating lines and can transmit information about the first width to the first etching apparatus 260_1. Furthermore, etching may include, but is not limited to, laser etching.

[0079] In some embodiments, the second image sensor 250_2 can generate a second image by photographing a second surface of the substrate 210 on which a second active material coating is formed. The third image sensor 250_3 can generate a third image by photographing a first surface of the substrate 210 on which a first etched active material coating is formed. The control unit 200 can determine the positional relationship between the first etched active material coating and the second active material coating based on the second and third images. The second etching apparatus 260_2 can form a second etched active material coating by etching at least a portion of the second active material coating based on the determined result. The second etching apparatus 260_2 can etch at least a portion of the second active material coating, a third coating line, and a fourth coating line. (Refer to...) Figure 9 and Figure 10 The process of forming the second etchant active material coating is described in more detail.

[0080] In some embodiments, foreign matter may be located on the substrate 210 on which the first etch-active material coating and the second etch-active material coating are formed. For example, foreign matter may include burrs generated by etching coating lines and active material coatings. Foreign matter on the substrate 210 on which the first etch-active material coating and the second etch-active material coating are formed can be removed by using foreign matter removal device 270.

[0081] A substrate coated with an active material using the active material coating apparatus according to this disclosure can be used as a plate for a secondary battery. Such a secondary battery can generate high power and store electrical energy (e.g., maximum electrical energy). Based on an image of the substrate 210 taken thereon, the positions of the active material coating on the first surface and the active material coating on the second surface can correspond to each other, but these positions are difficult to perfectly overlap. In some embodiments, the sides of the active material coating on the first surface and the sides of the active material coating on the second surface are etched, so that the boundaries of the sides of the active material coating on the first surface and the sides of the active material coating on the second surface can completely and to the greatest extent possible overlap.

[0082] Figure 3 The figure illustrates an example of an image obtained by photographing a substrate on which multiple coating lines are formed, according to some embodiments of the present disclosure. Figure 3 For explanation and reference Figure 2 The image described is captured by a first adjustable image sensor or by a second adjustable image sensor. For example, Figure 3 Images can be obtained by photographing a first surface of substrate 310 on which multiple coating lines 320_1 and 320_2 are formed, or images can be obtained by photographing a second surface of substrate 310 on which multiple coating lines are formed.

[0083] exist Figure 3 and Figure 4 The image obtained by photographing the first surface of the substrate 310 is described, but the same description applies to images obtained by photographing the second surface of the substrate 310. Furthermore, the first coating line 320_1, the second coating line 320_2, and the first active material coating 430 formed on the first surface of the substrate 310 are described, but the same description applies to the third coating line, the fourth coating line, and the second active material coating formed on the second surface of the substrate 310.

[0084] It can be along one direction (e.g., Figure 3 Direction B) Transport substrate 310. In some embodiments, multiple coating lines 320_1, 320_2 may be formed parallel to the transport direction of substrate 310.

[0085] In some embodiments, the control unit 200 may determine the positions of the multiple coating lines 320_1, 320_2 on the first surface of the substrate 310 based on an image obtained by photographing a first surface of the substrate 310 on which multiple coating lines 320_1, 320_2 are formed. For example, the control unit 200 may calculate the distance D1 from one side (e.g., the first side) of the substrate 310 to one side (e.g., the first side) of the first coating line 320_1. In some embodiments, one side of the substrate 310 may be the side of the two sides of the substrate 310 that is closer to the first coating line 320_1. In addition, one side of the first coating line 320_1 may be the side of the two sides of the first coating line 320_1 that is closer to the side of the substrate 310.

[0086] Similarly, the control unit 200 can calculate the distance D3 from one side of the substrate 310 to one side of the second coating line 320_2. In some embodiments, one side of the substrate 310 may be the side of the substrate 310 that is closer to the second coating line 320_2. Alternatively, one side of the second coating line 320_2 (e.g., the first side) may be the side of the second coating line 320_2 that is closer to the side of the substrate 310.

[0087] In some embodiments, the control unit 200 may calculate the widths D2 and D4 of the multiple coating lines 320_1 and 320_2 based on an image obtained by capturing an image of a first surface of the substrate 310 on which multiple coating lines 320_1 and 320_2 are formed. For example, the control unit 200 may calculate the width D2 of the first coating line 320_1 by calculating the distance between the two sides of the first coating line 320_1. Similarly, the control unit 200 may calculate the width D4 of the second coating line 320_2 by calculating the distance between the two sides of the second coating line 320_2.

[0088] Figure 4 The figures illustrate examples of images obtained by photographing a substrate on which an active material coating is formed, according to some embodiments of the present disclosure. Figure 4 For explanation and reference Figure 2 The image described is captured by the first image sensor 250_1 or by the second image sensor 250_2. For example, Figure 4 Images can be obtained by photographing the first surface of the substrate 310 on which multiple coating lines 320_1, 320_2 and an active material coating 430 are formed, or by photographing the second surface of the substrate 310 on which multiple coating lines and an active material coating are formed.

[0089] It can be along one direction (e.g., Figure 3 Direction B) Transporting substrate 310. In some embodiments, the active material coating 430 may be formed parallel to the transport direction of substrate 310. Reference Figure 4 An active material coating can be formed between the (2n-1)th coating line and the (2n)th coating line (where n is a natural number of 1 or greater) parallel to the transport direction of the substrate 310.

[0090] In some embodiments, the active material coating 430 may include a first boundary portion contacting the first coating line 320_1 and a second boundary portion contacting the second coating line 320_2. The control unit 200 may determine the position of the active material coating 430 based on an image obtained by photographing a first surface of the substrate 310 on which the active material coating 430 is formed. For example, the control unit 200 may calculate the distance D1+D2 between one side of the substrate 310 and the first boundary portion. Additionally, the control unit 200 may calculate the width D5 of the active material coating 430 based on an image obtained by photographing a first surface of the substrate 310 on which the active material coating 430 is formed. For example, the control unit 200 may calculate the width D5 of the active material coating 430 by calculating the distance between the first boundary portion and the second boundary portion of the active material coating 430.

[0091] As described above, the control unit 200 can calculate the positions and widths of multiple coating lines 320_1, 320_2 and the active material coating 430 on the first surface of the substrate 310. Similarly, the control unit 200 can calculate the positions and widths of multiple coating lines and the active material coating on the second surface of the substrate 310. In some embodiments, because these positions are calculated based on one side of the substrate 310, the control unit 200 can determine the positional relationship between the multiple coating lines 320_1, 320_2 on the first surface and the multiple coating lines on the second surface based on the width direction of the substrate 310. Similarly, the control unit 200 can determine the positional relationship between the active material coating 430 on the first surface and the active material coating on the second surface based on the width direction of the substrate 310. In addition, by the above method, the control unit 200 can determine the positional relationship between the etched active material coating on the first surface and the active material coating on the second surface.

[0092] Figure 5 A diagram illustrating a scenario in which a first coating line and a second coating line are formed on a first surface of a substrate according to some embodiments of the present disclosure. Figure 6 A diagram illustrating a scenario in which a first active material coating is formed on a first surface of a substrate according to some embodiments of the present disclosure. Figure 7 A diagram illustrating a scenario in which a third coating line and a fourth coating line are formed on a second surface of a substrate according to some embodiments of the present disclosure. Figure 8 A diagram illustrating a scenario in which a second active material coating is formed on a second surface of a substrate according to some embodiments of the present disclosure. Figure 9A diagram illustrating a scenario in which a first etch-active material coating is formed on a first surface of a substrate according to some embodiments of the present disclosure. Figure 10 A diagram illustrating a scenario in which a second etch-active material coating is formed on a second surface of a substrate according to some embodiments of the present disclosure.

[0093] Based on reference Figure 1 and Figure 2 The content described is understandable. Figures 5-10 The process of forming a first coating line 520_1, a second coating line 520_2, a first active material coating 610, and a first etchable active material coating 910 on the first surface of a substrate 510, and forming a third coating line 710_1, a fourth coating line 710_2, a second active material coating 810, and a second etchable active material coating 1010 on the second surface of a substrate 510. Additionally, a coating line 520_1, a second active material coating 810, and a second etchable active material coating 1010 can be formed on a substrate. Figures 5-10 The text describes a greater number of coating lines, active material coatings, and etched active material coatings.

[0094] refer to Figure 5 A first coating line 520_1 and a second coating line 520_2 may be formed on the first surface of the substrate 510. The first coating line 520_1 may be formed along the first line, and the second coating line 520_2 may be formed along the second line.

[0095] refer to Figure 6 A first active material coating 610 may be formed between a first coating line 520_1 and a second coating line 520_2 on a first surface of substrate 510. The first active material coating 610 may include a first boundary portion that contacts the first coating line 520_1 and a second boundary portion that contacts the second coating line 520_2.

[0096] refer to Figure 7 A third coating line 710_1 and a fourth coating line 710_2 may be formed on the second surface of the substrate 510. In some embodiments, the second surface of the substrate 510 may face the first surface of the substrate 510. The third coating line 710_1 may be formed along the third line, and the fourth coating line 710_2 may be formed along the fourth line.

[0097] In some embodiments, the control unit 200 may determine the position and width of the first coating line 520_1 and the second coating line 520_2 on the first surface based on an image obtained by photographing a first surface of the substrate 510 on which the first coating line 520_1 and the second coating line 520_2 are formed. For example, the control unit 200 may calculate the position and width of the first coating line 520_1 and the second coating line 520_2 based on one side of the substrate 510. Subsequently, the control unit 200 may determine the positions of a third line and a fourth line based on the calculated positions and widths of the first coating line 520_1 and the second coating line 520_2. For example, the control unit 200 may determine the positions of the third line and the fourth line such that, based on the width direction of the substrate 510, the position of the third line on the second surface of the substrate 510 coincides and aligns with the position of the first coating line 520_1, and the position of the fourth line coincides and aligns with the position of the second coating line 520_2. The third coating line 710_1 may be formed on the second surface of the substrate 510 based on the determined position of the third line, and the fourth coating line 710_2 may be formed on the second surface of the substrate 510 based on the determined position of the fourth line.

[0098] refer to Figure 8 A second active material coating 810 can be formed between the third coating line 710_1 and the fourth coating line 710_2 on the second surface of the substrate 510. Based on the width direction of the substrate 510, the first coating line 520_1 and the third coating line 710_1 correspond to each other, and the second coating line 520_2 and the fourth coating line 710_2 correspond to each other. Therefore, the first active material coating 610 and the second active material coating 810 can correspond to each other. However, even if the coating lines correspond to each other, there may be a set or predetermined positional difference. The second active material coating 810 may include a third boundary portion that contacts the third coating line 710_1 and a fourth boundary portion that contacts the fourth coating line 710_2.

[0099] refer to Figure 9The first etchable active material coating 910 can be formed by etching at least a portion of the first active material coating 610 formed on the first surface of the substrate 510. For example, the control unit 200 can determine the position of the first coating line 520_1 on the first surface of the substrate 510 based on a first image obtained by photographing the first surface of the substrate 510 on which the first active material coating 610 is formed. The first coating line 520_1 and at least a portion of the first active material coating 610 can be etched at a first width based on the determined position of the first coating line 520_1. Similarly, the control unit 200 can determine the position of the second coating line 520_2 on the first surface of the substrate 510 based on a first image obtained by photographing the first surface of the substrate 510 on which the first active material coating 610 is formed. The second coating line 520_2 and at least a portion of the first active material coating 610 can be etched at a first width (or a width different from the first width) based on the determined position of the second coating line 520_2.

[0100] In some examples, the first width may be greater than the width of the first coating line 520_1 and / or the width of the second coating line 520_2. Etching may be performed at a depth less than or equal to the height of the first coating line 520_1 or the height of the second coating line 520_2.

[0101] In some embodiments, at least a portion of the first coating line 520_1 and / or at least a portion of the second coating line 520_2 may be etched together with at least a portion of the first active material coating 610 formed on the first surface of the substrate 510. Reference Figure 9 Although it has been explained that the first coating line 520_1 and the second coating line 520_2 are etched as a whole, a portion of the first coating line 520_1 and / or a portion of the second coating line 520_2 may be etched.

[0102] The first etch-active material coating 910 may include a first edge portion formed by etching a first boundary portion. The first etch-active material coating 910 may include a second edge portion formed by etching a second boundary portion. A first position 920_1 may indicate the boundary of the first edge portion. A second position 920_2 may indicate the boundary of the second edge portion.

[0103] refer to Figure 10The second etch-active material coating 1010 can be formed by etching at least a portion of the second active material coating 810 formed on the second surface of the substrate 510. For example, the control unit 200 can receive a second image obtained by photographing the second surface of the substrate 510 on which the second active material coating 810 is formed, and a third image obtained by photographing the first surface of the substrate 510 on which the first etch-active material coating 910 is formed. The control unit 200 can determine the positional relationship between the first etch-active material coating 910 and the second etch-active material coating 1010 based on the second image and the third image.

[0104] For example, the control unit 200 can calculate a first position 920_1, which is the boundary of the first edge portion, and a second position 920_2, which is the boundary of the second edge portion. The control unit 200 can determine the first position 920_1 and the second position 920_2 on the second surface of the substrate 510. The control unit 200 can determine the positional relationship between the first position 920_1, the second position 920_2, and the second active material coating 810.

[0105] On the second surface of substrate 510, a second active material coating 810 can be etched from the first position 920_1 toward the outer side of substrate 510 with a second width. In some embodiments, the outer side of substrate 510 may represent the direction of the side closer to the starting point of the second active material coating 810. For example, the outer direction of substrate 510 at the first position 920_1 may represent the direction of substrate 510 located at the third coating line 710_1 (e.g., Figure 9 On one side of the substrate 510 (to the left). In other examples, the external direction of the substrate 510 at the second position 920_2 may indicate the direction of the substrate 510 located on the fourth coating line 710_2 (e.g., Figure 9 (to the right of the middle) on one side.

[0106] In some embodiments, at least a portion of the third coating line 710_1 and / or at least a portion of the fourth coating line 710_2 may be etched together with at least a portion of the second active material coating 810 formed on the second surface of the substrate 510. Reference Figure 10 Although it has been explained that the third coating line 710_1 and the fourth coating line 710_2 are etched as a whole, a portion of the third coating line 710_1 and / or a portion of the fourth coating line 710_2 may be etched.

[0107] In some examples, the second width may be greater than the width of the third coating line 710_1 and / or the width of the fourth coating line 710_2. Etching may be performed at a depth less than or equal to the height of the third coating line 710_1 or the height of the fourth coating line 710_2.

[0108] In some embodiments, the second etch-active material coating 1010 may include a third edge portion formed by etching a third boundary portion. The second etch-active material coating 1010 may also include a fourth edge portion formed by etching a fourth boundary portion. With the above configuration, even if the first active material coating 610 and the second active material coating 810 have a set or predetermined positional difference in the width direction of the substrate 510, the positions of the first etch-active material coating 910 and the second etch-active material coating 1010 can precisely correspond to each other based on the width direction of the substrate 510. For example, the boundary of the first edge portion may coincide with the boundary of the third edge portion at a first position 920_1, and the boundary of the second edge portion may coincide with the boundary of the fourth edge portion at a second position 920_2.

[0109] Figure 11 A diagram illustrating the boundary portion of an active material coating according to some embodiments of the present disclosure. Figure 11 An enlarged view illustrating the fourth boundary portion 812 can be provided. The fourth boundary portion 812 is... Figure 9 The area where the second active material coating 810 and the fourth coating line 710_2 contact. (Reference) Figure 11 The fourth boundary portion 812 is described, but the same description applies to the first to third boundary portions as well.

[0110] In some embodiments, the height of the fourth coating line 710_2 may be higher than the height of the second active material coating 810. As a result, the active material slurry used to form the second active material coating 810 rests against the side surface of the fourth coating line 710_2, thus forming a second active material coating 810 including a fourth boundary portion 812. The second active material coating 810 may include the fourth boundary portion 812 in the area contacting the fourth coating line 710_2.

[0111] In some embodiments, the fourth boundary portion 812 may have a curved region 814 at its upper end based on the height direction by contacting the fourth coating line 710_2. The angle of the curved region 814 of the fourth boundary portion 812 relative to the width direction of the fourth boundary portion 812 may be about 70 degrees to about 80 degrees. As a result, the electrical utilization rate of the regions on both sides of the active material coating may be lower.

[0112] Figure 12 A diagram illustrating the edge portion of an etched active material coating according to some embodiments of the present disclosure. Figure 12 Explainable Figure 9 A magnified view of the second edge portion 912 of the first etched active material coating 910. (Reference) Figure 12 The second edge portion 912 is described, and the same description applies to the first edge portion, the third edge portion, and the fourth edge portion.

[0113] The second edge portion 912 can be formed by etching the second boundary portion. The second edge portion 912 may include a curved region 914 at its upper end based on the height direction. The angle of the curved region 914 of the second edge portion 912 relative to the width direction of the second edge portion 912 may be about 80 degrees to about 90 degrees. Because the curved region 914 of the second edge portion 912 becomes almost vertical, the electrical utilization rate of the areas on both sides of the active material coating can be increased.

[0114] Figure 13 A flowchart illustrating an active substance coating method according to some embodiments of the present disclosure is provided. The active substance coating method according to some embodiments of the present disclosure (S1300) can be performed using an active substance coating apparatus. The active substance coating apparatus may include a conveying device, a coating line forming device, a coating forming device, an etching device, a control unit, a first image sensor to a third image sensor, and a foreign matter removal device. The coating forming device may include an active substance coating device and a drying device.

[0115] First, the active material coating method (S1300) may begin by forming a first coating line and a second coating line spaced apart from the first coating line on a first surface of a substrate by a coating line forming apparatus (S1310). In some embodiments, a conveying device may convey the substrate in one direction. For example, the coating line forming apparatus may form the first coating line by applying a coating solution to the first line on the first surface of the substrate. The coating line forming apparatus may form the second coating line by applying a coating solution to the second line spaced apart from the first line on the first surface of the substrate. In some embodiments, the viscosity of the coating solution may be 8,000 CPS or greater.

[0116] In some embodiments, the coating forming apparatus may form a first active material coating between a first coating line and a second coating line on a first surface of a substrate (S1320). For example, an active material coating apparatus included in the coating forming apparatus may coat a first active material slurry between a first coating line and a second coating line on a first surface of a substrate.

[0117] In some embodiments, the coating line forming apparatus may form a third coating line and a fourth coating line spaced apart from the third coating line on the second surface of the substrate (S1330). For example, the coating line forming apparatus may form the third coating line by applying a coating solution to the third line on the second surface of the substrate. Alternatively, the coating line forming apparatus may form the fourth coating line by applying a coating solution to the fourth line spaced apart from the third line on the second surface of the substrate.

[0118] In some embodiments, the coating forming apparatus may form a second active material coating between a third coating line and a fourth coating line on the second surface of the substrate (S1340). In some embodiments, the first surface of the substrate may face the second surface of the substrate. In some embodiments, the first coating line, the second coating line, the third coating line, the fourth coating line, the first active material coating, and the second active material coating may be formed parallel to the transport direction of the substrate. For example, the active material coating apparatus may coat a second active material slurry between the third coating line and the fourth coating line on the second surface of the substrate. Subsequently, the drying apparatus included in the coating forming apparatus may dry the substrate to form at least one of the first active material coating and the second active material coating.

[0119] In some examples, each of the first to fourth coating lines may include at least one of an adhesive, a ceramic, and a polyimide (PI).

[0120] In some embodiments, the etching apparatus can form a first etchable active material coating by etching at least a portion of the first active material coating (S1350). For example, the control unit 200 can receive a first image obtained by photographing a first surface of a substrate on which the first active material coating is formed. The control unit 200 can determine the positions of a first coating line and a second coating line on the first surface of the substrate based on the first image. The etching apparatus can etch at least a portion of the first coating line and the first active material coating with a first width based on the determined position of the first coating line. The etching apparatus can etch at least a portion of the second coating line and the first active material coating with a first width based on the determined position of the second coating line.

[0121] In some embodiments, the etching apparatus may etch at least a portion of the first coating line, at least a portion of the second coating line, and at least a portion of the first active material coating.

[0122] In some embodiments, the control unit 200 may determine the positional relationship between a first etch-active material coating on a first surface of the substrate and a second active material coating on a second surface of the substrate (S1360). For example, the control unit 200 may receive a second image obtained by photographing the second surface of the substrate on which the second active material coating is formed. The control unit 200 may receive a third image obtained by photographing the first surface of the substrate on which the first etch-active material coating is formed. The control unit 200 may determine the positional relationship between the first etch-active material coating and the second active material coating based on the second and third images. For example, the first etch-active material coating may be etched to form an edge portion on one or both sides of the first etch-active material coating. The control unit 200 may determine the positional relationship between the edge portion and the second active material coating on the second surface of the substrate.

[0123] In some embodiments, the etching apparatus can form a second etchable active material coating by etching at least a portion of the second active material coating based on a determined result (S1370). For example, the etching apparatus can etch the second active material coating from a position corresponding to an edge portion on a second surface of the substrate toward the outside of the substrate with a second width.

[0124] In some embodiments, the etching apparatus may etch at least a portion of the third coating line and at least a portion of the fourth coating line, as well as at least a portion of the second active material coating.

[0125] In some embodiments, the active material coating may include a first active material coating and a second active material coating, the coating lines may include a first coating line to a fourth coating line, the active material coating may include a plurality of boundary portions in contact with the coating lines, and the angle of the curved areas of the plurality of boundary portions relative to the width direction of the plurality of boundary portions may be about 70 degrees to about 80 degrees. In some embodiments, etching the active material coating may include a first etched active material coating and a second etched active material coating. In some embodiments, the active material coating is etched to form edge portions on one or both sides of the etched active material coating, and the angle of the curved areas of the edge portions relative to the width direction of the edge portions may be about 80 degrees to about 90 degrees.

[0126] In some embodiments, the foreign matter removal device can remove foreign matter located on the substrate.

[0127] In some embodiments, the first active material coating may include a first boundary portion contacting a first coating line and a second boundary portion contacting a second coating line, and the second active material coating may include a third boundary portion contacting a third coating line and a fourth boundary portion contacting a fourth coating line. The first etchable active material coating may include a first edge portion formed by etching the first boundary portion and a second edge portion formed by etching the second boundary portion, and the second etchable active material coating may include a third edge portion formed by etching the third boundary portion and a fourth edge portion formed by etching the fourth boundary portion. Based on the width direction of the substrate, the boundary of the first edge portion may correspond to the boundary of the third edge portion, and based on the width direction of the substrate, the boundary of the second edge portion may correspond to the boundary of the fourth edge portion.

[0128] Figure 13 The flowcharts and descriptions above are merely examples of this disclosure, and the scope of this disclosure is not limited to... Figure 13 The flowchart and the above description. For example, one or more steps in the flowchart and the above description can be added, changed, or deleted; the order of one or more steps can be changed; and one or more steps can be performed simultaneously.

[0129] Although the present disclosure has been described above with reference to embodiments thereof, the present disclosure is not limited thereto. Various modifications and variations may be made to the present disclosure by those skilled in the art within the spirit and equivalence of the claims.

Claims

1. A method for coating an active substance, comprising: A coating line forming apparatus forms a first coating line and a second coating line spaced apart from the first coating line on a first surface of a substrate. A first active material coating is formed by a coating forming apparatus between the first coating line and the second coating line on the first surface of the substrate; The coating line forming apparatus forms a third coating line and a fourth coating line spaced apart from the third coating line on the second surface of the substrate; A second active material coating is formed by the coating forming apparatus between the third coating line and the fourth coating line on the second surface of the substrate; The first etchable active material coating is formed by etching at least a portion of the first active material coating using an etching apparatus; The positional relationship between the first etch-active material coating on the first surface of the substrate and the second active material coating on the second surface of the substrate is determined by the controller. as well as The second etch-active material coating is formed by etching at least a portion of the second active material coating based on the positional relationship using the etching apparatus.

2. The active material coating method as described in claim 1, further comprising: The substrate is conveyed in one direction by a conveying device. The first coating line, the second coating line, the third coating line, the fourth coating line, the first active material coating, and the second active material coating are formed parallel to the transport direction of the substrate.

3. The active material coating method of claim 1, wherein forming the first coating line and the second coating line spaced apart from the first coating line comprises: The first coating line is formed by applying a coating solution to a first line on the first surface of the substrate using the coating line forming apparatus. as well as The second coating line is formed by applying the coating solution onto a second line spaced apart from the first line on the first surface of the substrate using the coating line forming apparatus. The formation of the third coating line and the fourth coating line spaced apart from the third coating line includes: The third coating line is formed by applying the coating solution onto a third line on the second surface of the substrate using the coating line forming apparatus. as well as The fourth coating line is formed by applying the coating solution onto a fourth line spaced apart from the third line on the second surface of the substrate using the coating line forming apparatus.

4. The active material coating method according to claim 3, wherein the viscosity of the coating solution is 8,000 CPS or greater.

5. The active material coating method of claim 1, wherein each of the first coating line to the fourth coating line comprises at least one of an adhesive, a ceramic, and a polyimide.

6. The active material coating method according to claim 1, wherein forming the first active material coating comprises: A first active substance slurry is applied between the first coating line and the second coating line on the first surface of the substrate using an active substance coating device included in the coating forming apparatus. The formation of the second active material coating includes: The active material coating apparatus applies a second active material slurry between the third and fourth coating lines on the second surface of the substrate, and The method further includes: At least one of the first active material coating and the second active material coating is formed by drying the substrate using the drying apparatus of the coating forming apparatus.

7. The active material coating method of claim 1, wherein forming the first etchable active material coating comprises: The controller receives a first image, which is obtained by photographing the first surface of the substrate on which the first active material coating is formed. The controller determines the positions of the first coating line and the second coating line on the first surface of the substrate based on the first image; At least a portion of the first coating line and the first active material coating are etched with a first width by the etching apparatus based on the determined position of the first coating line. as well as The etching apparatus etches at least a portion of the second coating line and the first active material coating at the first width based on the determined position of the second coating line.

8. The active material coating method according to claim 1, wherein determining the positional relationship includes: The controller receives a second image, which is obtained by photographing the second surface of the substrate on which the second active material coating is formed; The controller receives a third image, which is obtained by photographing the first surface of the substrate on which the first etch-active material coating is formed; as well as The controller determines the positional relationship between the first etched active material coating and the second active material coating based on the second image and the third image.

9. The active material coating method of claim 8, wherein the first surface of the substrate faces the second surface of the substrate. The first etchant coating is etched to form an edge portion on one or both sides of the first etchant coating, and Determining the positional relationship between the first etchant coating and the second active material coating based on the second image and the third image includes: The controller determines the positional relationship between the edge portion and the second active material coating on the second surface of the substrate.

10. The active material coating method of claim 1, wherein the first surface of the substrate faces the second surface of the substrate. The first etchant coating is etched to form an edge portion on one or both sides of the first etchant coating, and The formation of the second etch-active material coating includes: The second active material coating is etched with the etching apparatus from a position corresponding to the edge portion on the second surface of the substrate toward the outside of the substrate with a second width.

11. The active material coating method of claim 1, wherein forming the first etchable active material coating comprises: At least a portion of the first coating line, at least a portion of the second coating line, and at least a portion of the first active material coating are etched using the etching apparatus. The etching of at least a portion of the second active material coating includes: At least a portion of the third coating line, at least a portion of the fourth coating line, and at least a portion of the second active material coating are etched by the etching apparatus.

12. The active substance coating method as described in claim 1, wherein the active substance coating comprises the first active substance coating and the second active substance coating. The coating lines include the first coating line to the fourth coating line. The active material coating includes multiple boundary portions that contact the coating line, and The angle between the curved area of ​​the plurality of boundary portions and the width direction of the plurality of boundary portions is 70 degrees to 80 degrees.

13. The active material coating method as described in claim 1, wherein the etched active material coating comprises the first etched active material coating and the second etched active material coating. The etching active material coating is etched to form the edge portion on one or both sides of the etching active material coating, and The angle between the curved area of ​​the edge portion and the width direction of the edge portion is 80 degrees to 90 degrees.

14. The active material coating method as described in claim 1, further comprising: Foreign matter located on the substrate is removed by a foreign matter removal device.

15. The active material coating method of claim 1, wherein the first surface of the substrate faces the second surface of the substrate. The first active material coating includes a first boundary portion that contacts the first coating line and a second boundary portion that contacts the second coating line. The second active material coating includes a third boundary portion that contacts the third coating line and a fourth boundary portion that contacts the fourth coating line. The first etch-active material coating includes a first edge portion formed by etching the first boundary portion and a second edge portion formed by etching the second boundary portion. The second etch-active material coating includes a third edge portion formed by etching the third boundary portion and a fourth edge portion formed by etching the fourth boundary portion. Wherein, based on the width direction of the substrate, the boundary of the first edge portion corresponds to the boundary of the third edge portion, and Based on the width direction of the substrate, the boundary of the second edge portion corresponds to the boundary of the fourth edge portion.

16. An active substance coating apparatus, comprising: A coating line forming apparatus is configured to form a first coating line and a second coating line spaced apart from the first coating line on a first surface of a substrate, and is configured to form a third coating line and a fourth coating line spaced apart from the third coating line on a second surface of the substrate. A coating forming apparatus is configured to form a first active material coating between a first coating line and a second coating line, and to form a second active material coating between a third coating line and a fourth coating line; An etching apparatus configured to form a first etch-active material coating by etching at least a portion of the first active material coating; as well as A controller is configured to determine the positional relationship between the first etch-active material coating on the first surface of the substrate and the second active material coating on the second surface of the substrate. The etching apparatus is configured to form a second etch-active material coating by etching at least a portion of the second active material coating based on the determined result.

17. The active material coating apparatus of claim 16, wherein the coating forming apparatus comprises: An active substance coating apparatus is configured to coat an active substance slurry between a first coating line and a second coating line on a first surface of the substrate, and is also configured to coat an active substance slurry between a third coating line and a fourth coating line on a second surface of the substrate. as well as A drying apparatus is configured to form at least one of the first active material coating and the second active material coating by drying the substrate.

18. The active material coating apparatus of claim 16, further comprising: A first image sensor is configured to generate a first image by photographing the first surface of the substrate on which the first active material coating is formed. The controller is configured to determine the positions of the first coating line and the second coating line on the first surface of the substrate based on the first image, and The etching apparatus is configured to etch at least a portion of the first coating line and the first active material coating at a first width, and is also configured to etch at least a portion of the second coating line and the first active material coating at the first width.

19. The active material coating apparatus of claim 16, further comprising: A second image sensor is configured to generate a second image obtained by photographing the second surface of the substrate on which the second active material coating is formed; as well as A third image sensor is configured to generate a third image obtained by photographing the first surface of the substrate on which the first etch-active material coating is formed. The controller is configured to determine the positional relationship between the first etched active material coating and the second active material coating based on the second image and the third image.

20. The active material coating apparatus of claim 16, further comprising: A conveying device is configured to convey the substrate in one direction; as well as A foreign matter removal device is configured to remove foreign matter located on the substrate.

Images