Plasma cleaning tool and equipment for ceramic capacitor substrate

Abstract

The invention provides a plasma cleaning tool and equipment for a ceramic capacitor substrate, and belongs to the technical field of cleaning equipment. The plasma cleaning tool comprises a jig plate and a plurality of clamping parts; a plurality of rows of placing grooves are formed in the top of the jig plate, and a plurality of placing grooves are formed in each row; each clamping part comprises a central shaft and a plurality of clamping rings; the jig plate is provided with an avoiding groove used for containing the center shaft. The side wall of the clamping ring is provided with an abutting structure capable of abutting against the ceramic capacitor substrate. One end of the center shaft extends out of the jig plate, a driving structure and a limiting structure are arranged on the side portion of the jig plate, and the driving end of the driving structure is connected with the extending end of the center shaft; the limiting structure comprises supporting plates symmetrically arranged about the axis of the center shaft, and the supporting plates can make contact with protruding parts on the center shaft so as to limit the rotating position of the center shaft. And vacuum breaking is not needed when the ceramic capacitor substrate is turned over, so that the time for breaking vacuum and vacuumizing again can be saved, and the overall processing time is shortened.

Description

Technical Field

[0001] This application belongs to the field of cleaning equipment technology, specifically relating to a plasma cleaning fixture and equipment for ceramic capacitor substrates. Background Technology

[0002] Ceramic capacitors are capacitors whose dielectric material is ceramic. Depending on the ceramic material, they can be divided into two categories: low-frequency ceramic capacitors and high-frequency ceramic capacitors. After the ceramic capacitor substrate is produced, metal coating is applied to both sides of the ceramic capacitor substrate using magnetron sputtering vacuum coating equipment. After the coating is completed, metal leads are welded to both sides of the ceramic capacitor substrate, and then the ceramic capacitor substrate is packaged.

[0003] Before coating a ceramic capacitor substrate, it needs to be cleaned. The existing cleaning method is plasma cleaning, which removes organic matter and grease from the surface of the ceramic capacitor substrate, improving its electrochemical performance. When cleaning the ceramic capacitor substrate with plasma cleaning equipment, the ceramic capacitor substrate is placed in a vacuum chamber, and then argon or nitrogen gas is introduced into the vacuum chamber. By ionizing the argon or nitrogen gas, a plasma composed of free electrons, ions, and free radicals is formed. Under the action of an electric field, the plasma bombards the ceramic capacitor substrate, achieving the purpose of cleaning the ceramic capacitor substrate.

[0004] During plasma cleaning of ceramic capacitor substrates, several ceramic capacitor substrates are placed on a fixture plate, which is then placed on a support platform within a vacuum chamber. A cathode plate is positioned on the support platform, and an anode plate is positioned above the cathode plate. Argon or nitrogen gas is introduced into the side of the vacuum chamber. After connecting the radio frequency power supply, plasma is formed between the anode plate and the cathode plate, and the ceramic capacitors on the fixture plate are plasma cleaned.

[0005] The above cleaning method is a single-sided cleaning method. After cleaning, it is necessary to break the vacuum, flip the ceramic capacitor over, and then clean the other side of the ceramic capacitor. Therefore, the above cleaning method is inefficient. Summary of the Invention

[0006] This application provides a plasma cleaning fixture and equipment for ceramic capacitor substrates, aiming to improve the cleaning efficiency in the prior art.

[0007] To achieve the above objectives, the technical solution adopted in this application is as follows: A plasma cleaning fixture for ceramic capacitor substrates is provided, comprising: The jig plate has several rows of placement slots on its top, and each row of placement slots contains several slots. Several clamping components, each including a central shaft and several clamping rings connected to the central shaft, the clamping rings corresponding one-to-one with the placement slots; the fixture plate has clearance slots for placing the central shaft; the sidewalls of the clamping rings have abutting structures that can abut against the ceramic capacitor substrate. The central shaft extends from one end of the fixture plate. The fixture plate has a driving structure and a limiting structure on its side. The driving end of the driving structure is connected to the extended end of the central shaft to drive the central shaft to rotate. The limiting structure includes a support plate symmetrically arranged about the axis of the central shaft. The support plate can contact a protruding part on the central shaft to limit the rotational position of the central shaft.

[0008] In one possible implementation, each of the placement slots is a hemispherical slot, and the diameter of the end face of the clamping ring is the same as the diameter of the hemispherical slot. The central axis is located in the diametrical direction of the hemispherical groove, and the clamping ring can rotate 180 degrees around the central axis to flip the ceramic capacitor substrate.

[0009] In one possible implementation, the jig plate is provided with a pressure plate at the position of the outermost clearance groove of each row, and the pressure plate is fixed to the top of the jig plate by bolts; The bottom of the pressure plate is inserted into the clearance groove and has an arc surface that contacts the outer peripheral wall of the central shaft; one end of the pressure plate is tangent to the outer peripheral wall of the clamping ring, and the other end of the pressure plate is coplanar with the side of the fixture plate.

[0010] In one possible implementation, the support plate is fixed to the side wall of the fixture plate, and the protruding member is fixed to the outer peripheral wall of the central shaft extension end; When the protruding component contacts the support plate, both the protruding component and the clamping ring are in a horizontal state.

[0011] In one possible implementation, the bottom and top of the protruding component are provided with arc-shaped inserts, the center of which is on the axis of the central shaft; The support plate has an arc-shaped groove that engages with the arc-shaped insert plate. An elastic piece is provided on one side of the arc-shaped groove. One end of the elastic piece is fixed at the opening of the arc-shaped groove, and the other end of the elastic piece is a free end. When the arc-shaped insert plate is inserted into the arc-shaped groove, the elastic sheet abuts against the arc-shaped insert plate.

[0012] In one possible implementation, the fixture plate has a protective cover on one side of the central shaft extension end, and both the drive structure and the limiting structure are located inside the protective cover.

[0013] In one possible implementation, the driving structure includes: A gear is connected to an extension of the central shaft; A rack is slidably disposed on the side of the fixture plate; the rack meshes with the gear; A housing is connected to the side of the fixture plate; the housing contains a sliding cavity, and a drive rod is slidably disposed within the sliding cavity. One end of the drive rod extends out of the housing, and the extended end of the drive rod abuts against the end of the rack. The inner end of the drive rod is connected to a piston, and the outer peripheral wall of the piston is sealed to the inner peripheral wall of the housing. The housing is divided into two chambers by the piston, and each chamber is connected to a vent pipe. The other end of the vent pipe is connected to the outside of the cleaning equipment.

[0014] In one possible implementation, the driving gas source inside the housing is nitrogen, and the two chambers inside the housing are a large chamber and a small chamber, respectively; when the driving rod pushes the rack, nitrogen is introduced into the large chamber to make the driving rod extend out of the housing; A valve is located on the vent pipe that connects to the large cavity. The valve is located on the outside of the cleaning equipment. One of the valve's ports is connected to the vent pipe, and the other port is connected to the vacuum chamber of the cleaning equipment. When the drive rod pushes the rack into place, the valve connects the vent pipe to the vacuum chamber to discharge nitrogen gas from the housing into the vacuum chamber.

[0015] In one possible implementation, a counterweight structure is connected to the side of the protruding member facing away from the fixture plate to increase the torque of the protruding member on the central axis. When the protruding component contacts the support plate, the protruding component tends to rotate downwards.

[0016] The ceramic capacitor substrate is placed on the clamping ring, and the outer peripheral wall of the ceramic capacitor substrate is pressed against the clamping structure to fix the ceramic capacitor substrate on the clamping ring. Then, the clamping components are placed on the jig plate so that each clamping ring is located in the corresponding placement groove, and the clamping ring is in a horizontal position. The protruding component contacts the support plate to restrict the position of the clamping ring. During the plasma cleaning of the ceramic capacitor substrate, the plasma is insufficient to drive the clamping ring to rotate around the central axis, so the clamping ring will not rotate during the plasma cleaning process. After the top of the ceramic capacitor substrate is cleaned, the plasma cleaning is stopped, and the central axis is driven to rotate 180 degrees by the driving structure to flip the bottom of the ceramic capacitor substrate to the top position, and then the plasma cleaning continues.

[0017] This application provides a plasma cleaning fixture for ceramic capacitor substrates. Compared with the prior art, the cleaning process of this application allows for the cleaning of the other side of the ceramic capacitor substrate by flipping it after one side has been cleaned. The flipping of the ceramic capacitor substrate does not require vacuum breaking, which saves the time of vacuum breaking and re-vacuuming, and shortens the overall processing time.

[0018] To achieve the above objectives, another technical solution adopted in this application is: A plasma cleaning apparatus for ceramic capacitor substrates is provided, comprising: Box; A support platform is located inside the housing; A plasma cleaning fixture is mounted on the support platform; The support platform has a limiting frame for circumferentially limiting plasma cleaning fixtures.

[0019] The beneficial effects of the plasma cleaning equipment provided in this application are the same as those of the plasma cleaning tooling, and will not be repeated here. Attached Figure Description

[0020] Figure 1 A schematic diagram of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 2 for Figure 1 Enlarged diagram of section A in the middle; Figure 3 A schematic diagram of a plate-shaped structure portion of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 4 yes Figure 3 Enlarged diagram of section B; Figure 5 yes Figure 3 Enlarged diagram of section C; Figure 6 A schematic diagram of a support plate portion of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 7 A schematic diagram of the rack portion of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 8 A schematic diagram of a protective cover portion of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 9 A schematic diagram of the housing portion of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 10 for Figure 9Enlarged schematic diagram of section D in the middle; Figure 11 A schematic diagram of a clamping component of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 12 A schematic diagram of the clamping ring portion of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 13 A schematic diagram of the placement tank portion of a plasma cleaning fixture for ceramic capacitor substrates provided in an embodiment of this application; Figure 14 for Figure 13 Enlarged schematic diagram of section E in the middle; Figure 15 This is a schematic diagram showing the valve positions of the plasma cleaning equipment provided in the embodiments of this application.

[0021] Explanation of reference numerals in the attached drawings: 1. Fixture plate; 11. Placement slot; 12. Clearance slot; 13. Pressure plate; 131. Connecting plate; 14. Plate-like structure; 15. T-shaped slide; 16. Support component; 2. Clamping component; 21. Central shaft; 22. Clamping ring; 23. Tightening bolt; 3. Drive structure; 31. Gear; 311. Sleeve; 32. Rack; 321. T-shaped slide; 33. Housing; 331. Large cavity; 332. Small cavity; 333. Positioning frame; 34. Drive rod; 35. Piston; 36. Vent pipe; 37. Valve; 4. Limiting structure; 41. Support plate; 411. Arc groove; 42. Protruding component; 421. Connecting rod; 43. Arc insert plate; 44. Elastic sheet; 45. Counterweight structure; 5. Protective cover; 6. Box; 7. Support platform; 8. Limiting frame. Detailed Implementation

[0022] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0023] Please refer to the following: Figures 1 to 15The present application provides a description of a plasma cleaning fixture and equipment for ceramic capacitor substrates. The plasma cleaning fixture for ceramic capacitor substrates includes a jig plate 1 and several clamping components 2. The top of the jig plate 1 has several rows of placement slots 11, and each row of placement slots 11 contains several components. Each clamping component 2 includes a central shaft 21 and several clamping rings 22 connected to the central shaft 21, with each clamping ring 22 corresponding to a placement slot 11. The jig plate 1 has clearance slots 12 for placing the central shaft 21. The sidewalls of the clamping rings 22 have a clamping structure that can abut against the ceramic capacitor substrate. One end of the central shaft 21 extends out of the jig plate 1. The side of the jig plate 1 is provided with a driving structure 3 and a limiting structure 4. The driving end of the driving structure 3 is connected to the extended end of the central shaft 21 to drive the central shaft 21 to rotate. The limiting structure 4 includes a support plate 41 symmetrically arranged about the axis of the central shaft 21. The support plate 41 can contact the protruding components 42 on the central shaft 21 to limit the rotation position of the central shaft 21.

[0024] This application provides a plasma cleaning fixture for ceramic capacitor substrates. Compared with the prior art, the cleaning process of this application allows for the cleaning of the other side of the ceramic capacitor substrate by flipping it after one side has been cleaned. The flipping of the ceramic capacitor substrate does not require vacuum breaking, which saves the time of vacuum breaking and re-vacuuming, and shortens the overall processing time.

[0025] By setting several rows of placement slots 11 on the fixture plate 1, the clamping component 2 with clamping ring 22 cooperates with the placement slots 11, and the entire row of ceramic capacitor substrates can be placed in the placement slots 11; the clamping structure includes a clamping bolt 23, the outer peripheral wall of the clamping ring 22 has a threaded hole, the threaded hole is a countersunk hole, the clamping bolt 23 is threadedly engaged with the threaded hole, and the threaded section of the clamping bolt 23 can clamp the outer peripheral wall of the ceramic capacitor substrate, thereby achieving the clamping and fixing of the ceramic capacitor substrate; the nut of the clamping bolt 23 is located in the countersunk hole.

[0026] By having the protruding part 42 contact the support plate 41, the placement position of the clamping part 2 can be restricted, reducing the possibility of the clamping part 2 rotating too far. After the clamping part 2 rotates to the correct position, the protruding part 42 contacts the support plate 41, and the clamping part 2 is in a stable state during the plasma cleaning process, and the clamping ring 22 will not rotate. The thickness obtained by plasma cleaning is between 3 nanometers and 30 nanometers.

[0027] In some embodiments, such as Figures 1 to 15 As shown, each placement slot 11 is a hemispherical slot, and the end face diameter of the clamping ring 22 is the same as the diameter of the hemispherical slot; wherein, the central axis 21 is located in the diametrical direction of the hemispherical slot, and the clamping ring 22 can rotate 180 degrees around the central axis 21 to flip the ceramic capacitor substrate.

[0028] By setting the placement groove 11 as a hemispherical groove, space can be provided to allow the rotation of the clamping ring 22, thus enabling the ceramic capacitor substrate to be rotated 180 degrees; the placement groove 11 can also be a groove of other shapes, as long as it can provide space to allow the rotation of the clamping ring 22.

[0029] By placing the central shaft 21 in the diameter direction of the hemispherical groove, interference between the clamping ring 22 and the inner peripheral wall of the hemispherical groove is avoided during the rotation of the clamping ring 22, thereby facilitating the flipping of the ceramic capacitor substrate.

[0030] In some embodiments, such as Figures 1 to 15 As shown, each row of the jig plate 1 has a pressure plate 13 at the position of the outermost clearance groove 12. The pressure plate 13 is fixed to the top of the jig plate 1 by bolts. The bottom of the pressure plate 13 is inserted into the clearance groove 12 and has an arc surface that contacts the outer peripheral wall of the central shaft 21. One end of the pressure plate 13 is tangent to the outer peripheral wall of the clamping ring 22, and the other end of the pressure plate 13 is coplanar with the side of the jig plate 1.

[0031] By setting an arc surface on the pressure plate 13 that contacts the outer peripheral wall of the central shaft 21, the rotation of the central shaft 21 can be limited in height. Since one end of the pressure plate 13 is tangent to the outer peripheral wall of the clamping ring 22, the two pressure plates 13 in the same row on the fixture plate 1 can be used to limit the axial movement of the clamping ring 22 and the central shaft 21. Therefore, during the rotation of the clamping ring 22, the movement of the clamping ring 22 in the height direction and the axial direction can be restricted, and the clamping ring 22 can still be located in the placement groove 11 after it is flipped.

[0032] The bottom of the pressure plate 13 is inserted into the relief groove 12, and the top of the pressure plate 13 extends outward to form a connecting plate 131. The bottom of the connecting plate 131 contacts the top of the jig plate 1. The top of the jig plate 1 is provided with a threaded hole, and the connecting plate 131 has a through hole aligned with the threaded hole on the jig plate 1. The connecting plate 131 and the jig plate 1 are fixed by bolts.

[0033] By tangenting one end of the pressure plate 13 to the outer peripheral wall of the clamping ring 22 and making the other end of the pressure plate 13 coplanar with the side of the fixture plate 1, the two ends of the central shaft 21 can be protected.

[0034] In some embodiments, such as Figures 1 to 15As shown, the support plate 41 is fixed to the side wall of the fixture plate 1, and the protruding part 42 is fixed to the outer peripheral wall of the extension end of the central shaft 21. When the protruding part 42 contacts the support plate 41, both the protruding part 42 and the clamping ring 22 are in a horizontal state. The bottom and top of the protruding part 42 are provided with arc-shaped insert plates 43, and the center of the arc-shaped insert plates 43 is on the axis of the central shaft 21. Both support plates 41 have arc-shaped grooves 411 that are inserted and matched with the arc-shaped insert plates 43. An elastic piece 44 is provided on one side of the arc-shaped groove 411. One end of the elastic piece 44 is fixed at the opening position of the arc-shaped groove 411, and the other end of the elastic piece 44 is a free end. When the arc-shaped insert plate 43 is inserted and matched with the arc-shaped groove 411, the elastic piece 44 abuts against the arc-shaped insert plate 43.

[0035] By engaging the arc-shaped insert plate 43 on the protruding component 42 with the arc-shaped groove 411 on the support plate 41, the connection between the protruding component 42 and the support plate 41 can be improved. By pressing the arc-shaped insert plate 43 with the elastic sheet 44, a pre-tightening force can be continuously provided to the arc-shaped insert plate 43, further ensuring the connection between the arc-shaped insert plate 43 and the support plate 41, and reducing the possibility of separation between the arc-shaped insert plate 43 and the arc-shaped groove 411 during the plasma cleaning process. Therefore, through the above-mentioned settings of this application, the stability of the clamping ring 22 during the plasma cleaning process can be improved.

[0036] In some embodiments, such as Figures 1 to 15 As shown, the drive structure 3 includes a gear 31, a rack 32, and a housing 33. The gear 31 is connected to the extension end of the central shaft 21. The rack 32 is slidably disposed on the side of the fixture plate 1. The rack 32 meshes with the gear 31. The housing 33 is connected to the side of the fixture plate 1. The housing 33 has a sliding cavity, in which a drive rod 34 is slidably disposed. One end of the drive rod 34 extends out of the housing 33, and the extended end of the drive rod 34 abuts against the end of the rack 32. A piston 35 is connected to the inner end of the drive rod 34, and the outer peripheral wall of the piston 35 is sealed to the inner peripheral wall of the housing 33. The housing 33 is divided into two chambers by the piston 35, and each chamber is connected to a vent pipe 36. The other end of the vent pipe 36 is connected to the outside of the cleaning device. The side of the fixture plate 1 has a support member 16 for supporting the housing 33.

[0037] In the initial state, the ceramic capacitor substrate is placed horizontally in the placement groove 11; after the top surface of the ceramic capacitor substrate is cleaned by plasma, the plasma cleaning is stopped; then the rack 32 drives the gear 31 to rotate, flipping the clamping ring 22 and the ceramic capacitor substrate 180 degrees, flipping the bottom surface of the ceramic capacitor substrate to the top surface, and continuing to clean the ceramic capacitor substrate by plasma; after cleaning, the double-sided cleaning of the ceramic capacitor substrate can be completed.

[0038] A plate-like structure 14 is fixedly provided on the side of the fixture plate 1. A T-shaped slide rail 15 is fixedly provided on the plate-like structure 14. The bottom of the rack 32 has a T-shaped groove 321 that slides with the T-shaped slide rail 15. There is a certain distance between the end of the T-shaped slide rail 15 and the drive rod 34 to avoid interference of the T-shaped slide rail 15 with the sliding of the drive rod 34. The T-shaped groove 321 is connected to one end of the rack 32, and the T-shaped groove 321 is not connected to the other end of the rack 32, so the initial position of the rack 32 can be limited. The end of the T-shaped groove 321 connected to the rack 32 is in contact with the drive rod 34.

[0039] The gear 31 on the central shaft 21 is fixed in relative position to the central shaft 21 by bolts; specifically, the gear 31 has a sleeve 311 that fits into the central shaft 21, the outer peripheral wall of the sleeve 311 has a threaded hole, the threaded hole of the outer peripheral wall of the sleeve 311 is provided with a fixing bolt, the threaded end of the fixing bolt can abut against the outer peripheral wall of the central shaft 21 so that the gear 31 and the central shaft 21 remain relatively fixed; the central shaft 21 has a socket that fits into the threaded end of the fixing bolt.

[0040] In some embodiments, such as Figures 1 to 15 As shown, the driving gas source inside the housing 33 is nitrogen. The housing 33 has two chambers: a large chamber 331 and a small chamber 332. When the driving rod 34 pushes the rack 32, nitrogen is introduced into the large chamber 331 to allow the driving rod 34 to extend out of the housing 33. A valve 37 is located on the vent pipe 36 connected to the large chamber 331, outside the cleaning device. One port of the valve 37 is connected to the vent pipe 36, and the other port is connected to the vacuum chamber of the cleaning device. When the driving rod 34 pushes the rack 32 to its final position, the valve 37 connects the vent pipe 36 to the vacuum chamber, allowing the nitrogen in the housing 33 to be discharged into the vacuum chamber. A positioning frame 333 is fixedly installed inside the housing 33 near the vent pipe of the small chamber 332 to limit the final sliding position of the piston. After the piston contacts the positioning frame 333, the vent pipe of the small chamber 332 is located between the piston and the end of the small chamber 332.

[0041] The housing 33 is connected to the fixture plate 1. When it is necessary to push the rack 32, nitrogen gas is introduced into the large cavity 331 of the housing 33 so that the drive rod 34 slides outward. The drive rod 34 pushes the rack 32 to slide, which can drive the central shaft 21 to rotate and realize the process of flipping the clamping ring 22.

[0042] After stopping the supply of nitrogen to the large cavity 331, the valve 37 connected to the gas source is closed, and the valve 37 connected to the vacuum chamber is opened, so that the vent pipe 36 of the large cavity 331 is connected to the vacuum chamber of the cleaning equipment, allowing the nitrogen in the large cavity 331 to be discharged into the vacuum chamber of the cleaning equipment; by ionizing the nitrogen, a plasma composed of free electrons, ions, free radicals, etc. is formed, which impacts the ceramic capacitor substrate under the action of an electric field, thereby achieving the purpose of cleaning the ceramic capacitor substrate.

[0043] There are two valves 37 on the vent pipe 36 on the large cavity 331 of the housing 33. Both valves 37 are located on the outside of the cleaning equipment. One valve 37 is connected to the gas source, and the other valve 37 is connected to the vacuum chamber. Before introducing nitrogen into the large cavity 331 inside the housing 33, the air in the large cavity 331 needs to be extracted first. Then, the valve 37 on the vent pipe 36 on the large cavity 331 is connected to the gas source, and nitrogen is introduced into the large cavity 331. After the rack 32 slides into place, the valve 37 connected to the gas source is closed, and then the valve 37 connected to the vacuum chamber is opened. At this time, the nitrogen in the large cavity 331 will be discharged into the vacuum chamber.

[0044] During the process of nitrogen gas being discharged from the large chamber 331 into the vacuum chamber, the piston 35 will move towards the large chamber 331. At this time, the drive rod 34 will retract into the housing 33. During the retraction of the drive rod 34, the drive rod 34 will not drive the rack 32 to move back. Therefore, the retraction process of the drive rod 34 will not cause the clamping ring 22 to flip again.

[0045] In some embodiments, such as Figures 1 to 15 As shown, a counterweight structure 45 is connected to the side of the protruding component 42 away from the fixture plate 1 to increase the torque of the protruding component 42 on the central axis 21; wherein, when the protruding component 42 contacts the support plate 41, the protruding component 42 has a tendency to rotate downward. Two connecting rods 421 are fixedly provided on the protruding component 42, and the free end of the connecting rod 421 is provided with external thread. The counterweight structure 45 has through holes for inserting and engaging with the connecting rods 421; after the counterweight structure 45 and the connecting rods 421 are inserted and engaged, the counterweight structure 45 is fixed to the protruding component 42 by nuts.

[0046] A counterweight structure 45 is provided on the protruding part 42, which can increase the torque of the protruding part 42 on the central shaft 21. When the protruding part 42 contacts the support plate 41, the protruding part 42 has a downward rotation tendency, ensuring the stability of the central shaft 21 after it rotates into place.

[0047] In some embodiments, such as Figures 1 to 15 As shown, the fixture plate 1 has a protective cover 5 on one side of the extension end of the central shaft 21, and the drive structure 3 and the limiting structure 4 are both located inside the protective cover 5.

[0048] The protective cover 5 can protect the gear 31, rack 32, extension end of central shaft 21, support plate 41 and protruding part 42. The housing 33 of drive structure 3 is located outside the protective cover 5. The housing 33 contacts the protective cover 5 on one side of the extension end of drive rod 34. The protective cover 5 has a through hole for drive rod 34 to pass through. The protective cover 5 is fixed to the fixture plate 1 by bolts. The housing 33 is fixed to the support member 16 by bolts. The connecting plate 131 on the pressure plate 13 has a clearance space to avoid the protective cover 5 near the edge of the fixture plate 1.

[0049] After placing the clamping ring 22 and the central shaft 21 in place, the pressure plate 13 is installed into the clearance groove 12 at the edge of the jig plate 1 and fixed with bolts; at this time, the rack 32 is installed on the side of the jig plate 1 and the rack 32 is meshed with the gear 31. Then the protective cover 5 and the housing 33 are installed on the side of the jig plate 1.

[0050] Based on the same inventive concept, this application also provides a plasma cleaning device, including a housing 6, a support platform 7, and a plasma cleaning fixture. The support platform 7 is disposed inside the housing 6; the plasma cleaning fixture is disposed on the support platform 7; wherein, the support platform 7 has a limiting frame 8 for circumferentially limiting the plasma cleaning fixture.

[0051] It should be noted that the other structures of the plasma cleaning equipment are existing technologies and will not be described in detail here.

[0052] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A plasma cleaning fixture for ceramic capacitor substrates, characterized in that, include: The fixture plate has several rows of placement slots on the top, and each row of placement slots has several slots. Several clamping components, each including a central shaft and several clamping rings connected to the central shaft, the clamping rings corresponding one-to-one with the placement slots; the fixture plate has clearance slots for placing the central shaft; the sidewalls of the clamping rings have abutting structures that can abut against the ceramic capacitor substrate. The central shaft extends from one end of the fixture plate. The fixture plate has a driving structure and a limiting structure on its side. The driving end of the driving structure is connected to the extended end of the central shaft to drive the central shaft to rotate. The limiting structure includes a support plate symmetrically arranged about the axis of the central shaft. The support plate can contact a protruding part on the central shaft to limit the rotational position of the central shaft.

2. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 1, characterized in that, Each of the placement slots is a hemispherical slot, and the diameter of the end face of the clamping ring is the same as the diameter of the hemispherical slot; The central axis is located in the diametrical direction of the hemispherical groove, and the clamping ring can rotate 180 degrees around the central axis to flip the ceramic capacitor substrate.

3. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 1, characterized in that, The fixture plate is provided with pressure plates at the outermost edge of each row of clearance slots, and the pressure plates are fixed to the top of the fixture plate by bolts; The bottom of the pressure plate is inserted into the clearance groove and has an arc surface that contacts the outer peripheral wall of the central shaft; one end of the pressure plate is tangent to the outer peripheral wall of the clamping ring, and the other end of the pressure plate is coplanar with the side of the fixture plate.

4. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 1, characterized in that, The support plate is fixed to the side wall of the fixture plate, and the protruding part is fixed to the outer peripheral wall of the extension end of the central shaft. When the protruding component contacts the support plate, both the protruding component and the clamping ring are in a horizontal state.

5. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 4, characterized in that, The bottom and top of the protruding component are provided with arc-shaped inserts, and the center of the arc-shaped inserts is on the axis of the central shaft. The support plate has an arc-shaped groove that engages with the arc-shaped insert plate. An elastic piece is provided on one side of the arc-shaped groove. One end of the elastic piece is fixed at the opening of the arc-shaped groove, and the other end of the elastic piece is a free end. When the arc-shaped insert plate is inserted into the arc-shaped groove, the elastic sheet abuts against the arc-shaped insert plate.

6. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 1, characterized in that, The fixture plate has a protective cover on one side of the extended end of the central shaft, and both the driving structure and the limiting structure are located inside the protective cover.

7. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 1, characterized in that, The driving structure includes: A gear is connected to an extension of the central shaft; A rack is slidably disposed on the side of the fixture plate; the rack meshes with the gear; A housing is connected to the side of the fixture plate; the housing contains a sliding cavity, and a drive rod is slidably disposed within the sliding cavity. One end of the drive rod extends out of the housing, and the extended end of the drive rod abuts against the end of the rack. The inner end of the drive rod is connected to a piston, and the outer peripheral wall of the piston is sealed to the inner peripheral wall of the housing. The housing is divided into two chambers by the piston, and each chamber is connected to a vent pipe. The other end of the vent pipe is connected to the outside of the cleaning equipment.

8. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 7, characterized in that, The driving gas source inside the housing is nitrogen, and the two chambers inside the housing are a large chamber and a small chamber, respectively; when the driving rod pushes the rack, nitrogen is introduced into the large chamber to make the driving rod extend out of the housing; A valve is located on the vent pipe that connects to the large cavity. The valve is located on the outside of the cleaning equipment. One of the valve's ports is connected to the vent pipe, and the other port is connected to the vacuum chamber of the cleaning equipment. When the drive rod pushes the rack into place, the valve connects the vent pipe to the vacuum chamber to discharge nitrogen gas from the housing into the vacuum chamber.

9. The plasma cleaning fixture for ceramic capacitor substrates as described in claim 1, characterized in that, The protruding component is connected to a counterweight structure on the side opposite to the fixture plate to increase the torque of the protruding component on the central axis. When the protruding component contacts the support plate, the protruding component tends to rotate downwards.

10. A plasma cleaning device for ceramic capacitor substrates, characterized in that, include: Box; A support platform is located inside the housing; The plasma cleaning fixture as described in any one of claims 1-9 is disposed on the support platform; in, The support platform has a limiting frame for circumferentially limiting plasma cleaning fixtures.

Images