Wafer cleaning apparatus with defect and quantity detection function

Abstract

The application discloses a wafer cleaning equipment with defect and quantity detection functions, and relates to the technical field of wafer cleaning, which comprises a mounting frame, an anti-back-splashing unit, a feeding unit, a water pressure adjusting unit, a supporting unit and a detection unit, wherein the mounting frame is used for mounting and fixing the anti-back-splashing unit, the feeding unit, the water pressure adjusting unit and the supporting unit; the anti-back-splashing unit is used for avoiding the backflow of cleaning liquid to the wafer surface; the feeding unit is used for automatically compensating the feeding of the brush wear; the water pressure adjusting unit is used for adjusting the fluctuating water pressure to ensure the constant cleaning pressure; the supporting unit is used for supporting and rotating the wafer; and the detection unit is used for detecting the defects and quantity of the wafer surface after cleaning. After the wafer is placed on the supporting unit, the water pressure adjusting unit ensures the constant cleaning pressure, and the feeding unit ensures the automatic compensation of the cleaning brush wear; the anti-back-splashing unit avoids the rebound of liquid drops after cleaning to the wafer surface to cause secondary pollution; and the detection unit detects the defects and quantity of the wafer after cleaning.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer cleaning, and particularly relates to a wafer cleaning device with defect and quantity detection functions. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafers are the basic materials for chip manufacturing, and their quality directly determines the performance and reliability of the final chips. Wafers will inevitably be contaminated with various pollutants such as particles, organic matter, and metal impurities during the production process, so wafer cleaning is a crucial process in semiconductor manufacturing. With the continuous development of semiconductor technology, wafer size is increasing and integration is becoming higher and higher, which puts forward more stringent requirements for the quality and efficiency of wafer cleaning. Traditional wafer cleaning equipment has many shortcomings in defect detection, cleaning water pressure control, brush wear compensation, and anti-back splash, and cannot meet the needs of modern semiconductor manufacturing.

[0003] In the wafer cleaning process, cleaning water pressure is one of the key factors affecting the cleaning effect. Traditional wafer cleaning equipment usually uses fixed water pressure for cleaning, and fluctuations in cleaning water pressure can result in poor cleaning effect or damage to the wafer. Meanwhile, in wafer cleaning, brush cleaning is a common cleaning method that removes contaminants through the friction between the brush and the wafer surface. However, as the use time increases, the brush will gradually wear out, resulting in a decrease in the contact pressure between the brush and the wafer surface and a decrease in the friction force, thereby affecting the cleaning effect.

[0004] In the wafer cleaning process, the high-speed injection of cleaning liquid and the rotational motion of the brush will cause the cleaning liquid to splash back. The splashed cleaning liquid not only pollutes the environment around the cleaning equipment, but also may fall on the cleaned wafer surface, causing secondary pollution and affecting the cleaning quality. In addition, the splashed cleaning liquid may also cause corrosion to the mechanical parts of the cleaning equipment, shortening the service life of the equipment.

[0005] In the wafer cleaning process, timely and accurate detection of defects and their quantity on the wafer surface is crucial for evaluating the cleaning effect, adjusting the cleaning process parameters, and ensuring product quality. Traditional wafer defect detection methods mainly rely on manual visual inspection or simple optical microscope observation. Manual visual inspection is not only inefficient, but also easily affected by the subjective factors of the detector, resulting in high rates of missed detection and false detection. SUMMARY

[0006] The present application aims to provide a wafer cleaning device with defect and quantity detection functions to solve the problems in the prior art.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0008] The wafer cleaning equipment with defect and quantity detection function comprises a mounting frame, an anti-splashing unit, a feeding unit, a water pressure adjusting unit, a supporting unit and a detection unit, the mounting frame is placed on the horizontal ground, the anti-splashing unit is fixedly connected with the mounting frame, the anti-splashing unit has the function of avoiding secondary pollution of the wafer, the feeding unit is fixedly connected with the mounting frame, the water pressure adjusting unit is fixedly connected with the mounting frame, the supporting unit is fixedly connected with the mounting frame, and the detection unit is fixedly connected with the mounting frame.

[0009] The mounting frame is used for mounting and fixing the anti-splashing unit, the feeding unit, the water pressure adjusting unit and the supporting unit, the anti-splashing unit is used for avoiding backflow of the cleaning liquid to the wafer surface, the feeding unit is used for automatic compensation feeding of the brush wear, the water pressure adjusting unit is used for adjusting fluctuating water pressure to ensure constant cleaning pressure, the supporting unit is used for supporting and rotating the wafer, and the detection unit is used for detecting defects and quantity of the wafer surface after cleaning.

[0010] Further, the anti-splashing unit has two groups, the two groups of anti-splashing units are symmetrically arranged on both sides of the wafer, the anti-splashing unit comprises a motor, a positive plate, a support, a negative plate, a bracket, a moving frame and a brush, the motor is fixedly installed on the mounting frame, the positive plate is fixedly connected with the mounting frame through the support, the negative plate is fixedly connected with the mounting frame through the bracket, the moving frame has two, the two moving frames are fixedly installed at the telescopic ends of the double-head telescopic motor, the fixed end of the double-head telescopic motor is fixedly installed on the mounting frame, the brush is uniformly arranged on the moving frame, the positive plate is a closed disc, the negative plate is an arc-shaped disc, the mounting frame is provided with a drainage groove below the negative plate, the brush is made of Teflon, the motor is connected with the positive plate through a wire, and the motor is connected with the negative plate through a wire.

[0011] In the wafer cleaning process, a thin liquid film is left on the surface of the wafer, the double extension motor retracts to drive the moving frame to move closer to each other, and the brush slightly rubs with the liquid film. Since Teflon can easily obtain negative charge in the frictional electric series, and water solution usually tends to be positively charged, this process will enhance the overall positive charge characteristics of the liquid film. Those liquid droplets that are about to splash out of the liquid film therefore carry a net positive charge. At this time, the controller controls the motor to start, and delivers positive charge to the positive plate and negative charge to the negative plate. An electrostatic field is formed between the positive plate and the negative plate. When a positively charged liquid droplet splashes from the wafer surface and tries to fall back to the wafer, it will immediately enter the electrostatic field. According to Coulomb's law, the positively charged liquid droplet will be repelled by the positive plate and attracted by the negative plate. Under the action of the resultant force of the two forces, the trajectory of the liquid droplet will be severely deflected, and the flight path will be forced to change. Finally, the liquid droplet flows out of the drain groove of the mounting frame, thereby avoiding the contamination of the wafer surface caused by the splashing of the liquid droplets after cleaning.

[0012] Further, the feeding unit comprises a rotary motor, a rotating rod, a roller, an electromagnet, a magnetic block and a straight cylinder. The fixed end of the rotary motor is fixedly installed on the mounting frame. The output end of the rotary motor is fixedly connected with one end of the rotating rod. The other end of the rotating rod is rotatably connected with the mounting frame. The roller is fixedly installed on the rotating rod. The electromagnet is fixedly installed on the rotating rod. The magnetic block is fixedly installed on the outer surface of one end of the straight cylinder close to the electromagnet. The straight cylinder is arranged in the roller.

[0013] Further, the feeding unit further comprises a support plate, an induction coil, a bar magnet, a buffer spring and a bristle assembly. The support plate is fixedly installed in the straight cylinder. The induction coil is arranged in the straight cylinder. One end of the bar magnet is fixedly connected with the bristle assembly. One end of the buffer spring is fixedly connected with the bristle assembly. The other end of the buffer spring is fixedly connected with the support plate. The bar magnet is slidably connected with the support plate. The bristle assembly is slidably connected with the roller.

[0014] The controller starts the rotary motor, which drives the rotating rod to rotate, thereby rotating the drum. The bristle assembly cleans the wafer surface. During the long cleaning process, wear occurs due to contact between the bristle assembly and the wafer surface. As the bristle assembly wears down, the pressure on the wafer surface decreases. Under the pushing force of the wafer, the bristle assembly compresses the buffer spring and simultaneously causes the bar magnet to move a shorter distance within the cylinder. As the bar magnet moves within the induction coil, the magnetic flux changes, resulting in a decrease in the instantaneous current generated by the induction coil. The controller detects this decrease in instantaneous current and increases the input current to the electromagnet. The polarity of the electromagnet increases, pushing the magnetic block to move the cylinder outward. Under the action of the support plate and the buffer spring, the bristle assembly moves outward, thus compensating for the reduced contact force between the bristle assembly and the wafer caused by wear, and preventing a deterioration in the cleaning effect of the wafer surface.

[0015] Furthermore, the water pressure regulating unit includes a water pipe, a nozzle, a valve disc, and a return spring. The water pipe is fixedly installed on the mounting bracket. One end of the water pipe inlet is connected to an external water pump. The nozzles are evenly arranged on the water pipe. One end of the valve disc is rotatably connected to the inside of the water pipe. The other end of the valve disc is fixedly connected to one end of the return spring. The other end of the return spring is fixedly connected to the inner wall of the water pipe.

[0016] During the process of the controller controlling the water pump to deliver water into the water pipe, due to fluctuations in water flow velocity and pressure, when the water pressure increases, the water flow pushes the valve discs to stretch the return spring and move them closer together, reducing the water flow and pressure, and spraying it from the nozzle onto the wafer surface. When the water pressure decreases, the return spring's own restoring force pulls the valve discs away from each other, increasing the water flow rate, so that the water pressure sprayed from the nozzle onto the wafer surface remains constant, avoiding damage to the wafer surface or a decrease in cleaning effect due to excessive or insufficient water pressure.

[0017] Furthermore, the support unit includes an electric push rod, a connecting frame, a drive motor, and a baffle plate. The fixed end of the electric push rod is fixedly mounted on the mounting frame, and the output end of the electric push rod is fixedly connected to the connecting frame via a bent rod. The fixed end of the drive motor is fixedly connected to the connecting frame, and the output end of the drive motor is fixedly connected to the rotating roller. The baffle plate is fixedly mounted on the rotating roller.

[0018] When the wafer is placed on the rotating roller, the controller starts the drive motor, which drives the baffle and the rotating roller to rotate, thus causing the wafer to rotate. In conjunction with the cleaning process, after the wafer is cleaned, the controller starts the electric push rod and stops the drive motor. The electric push rod drives the drive motor and the baffle to move upward through the connecting frame, so that the cleaned wafer moves upward, leaves the cleaning area, and returns to the wafer cell.

[0019] Furthermore, the detection unit includes a worktable, a telescopic motor, a movable plate, a guide rail, a mapping sensor, and a dust cover. The worktable is fixedly connected to the mounting frame. The fixed end of the telescopic motor is fixedly installed on the worktable. The telescopic end of the telescopic motor is fixedly connected to the movable plate. The movable plate is slidably installed on the guide rail via a slide rod. The guide rail is fixedly installed on the worktable. The mapping sensor is fixedly installed on the movable plate near the mounting frame. The dust cover is fixedly installed on the worktable.

[0020] After the wafer cleaning is completed, the controller starts the telescopic motor, which moves the moving plate on the guide rail. At the same time, the mapping sensor on the moving plate detects the cleaned wafers, checking whether there is an odd number of wafers in each compartment of the wafer box, whether the thickness is uniform, and whether there are defects on the wafer surface. The computer records the detection information. After the detection is completed, the controller controls the telescopic motor to retract, which moves the mapping sensor back to its initial position.

[0021] Furthermore, the end of the bar magnet closest to the rotating rod is the N pole.

[0022] In order for the controller to detect the distance the bar magnet moves downward in the induction coil and the magnitude of the current generated in a fixed direction, it is possible to deliver different currents to the electromagnet and avoid poor wafer cleaning effect caused by wear of the brush assembly.

[0023] Furthermore, the sliding friction between the bristle assembly and the roller is greater than the centrifugal force of the roller.

[0024] To prevent the brush assembly from detaching from the roller when the rotating motor drives the rod and roller to rotate, thus preventing the wafer surface from being effectively cleaned.

[0025] Furthermore, a controller is provided on the mounting bracket.

[0026] To enable automated control of the device while facilitating staff intervention and thus preventing unexpected situations.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] 1. This invention utilizes the process of leaving a thin liquid film on the surface of a wafer during the cleaning process. A dual-head telescopic motor retracts, causing the moving frames to move closer together. The electrostatic brushes experience slight friction with this liquid film. Since Teflon readily acquires a negative charge in the triboelectric series, and aqueous solutions typically tend to be positively charged, this process enhances the overall positive charge of the liquid film. Droplets about to splash out of this liquid film thus carry a net positive charge. At this point, the controller activates the electrostatic motor to deliver positive charge to the positive electrode and negative charge to the negative electrode. An electrostatic field is formed between the positive and negative electrode disks. When a positively charged droplet splashes off the wafer surface and attempts to fall back onto the wafer, it immediately enters this electrostatic field. According to Coulomb's law, the positively charged droplet will be subjected to the repulsive force of the positive electrode disk and the attractive force of the negative electrode disk. Under the combined action of these two forces, the trajectory of the droplet will be drastically deflected, and its flight path will be forcibly changed. Finally, it will flow out from the drain channel of the mounting rack, thus preventing the cleaned droplets from splashing back onto the wafer surface and causing contamination to the wafer cleaning process.

[0029] 2. This invention uses a controller to start a rotary motor, which drives the rotating rod to rotate, thereby rotating the drum. The bristle assembly cleans the wafer surface. During prolonged cleaning, wear occurs due to contact between the bristle assembly and the wafer surface. As the pressure on the bristle assembly from the wafer surface decreases, the bristle assembly, under the pushing force of the wafer, compresses the buffer spring and simultaneously causes the bar magnet to move a shorter distance within the cylinder. Because the bar magnet moves within the induction coil, the magnetic flux changes, resulting in a decrease in the instantaneous current generated by the induction coil. The controller detects this decrease in instantaneous current and increases the input current to the electromagnet. This increases the polarity of the electromagnet, thereby pushing the magnetic block and moving the cylinder outward. Under the action of the support plate and the buffer spring, the bristle assembly moves outward to compensate for the reduced contact force between the bristle assembly and the wafer caused by the wear of the bristle assembly, thus avoiding the problem of poor cleaning effect on the wafer surface. During the process of the controller controlling the water pump to deliver water into the water pipe, due to the fluctuation of water flow rate and water pressure, when the water pressure increases, the water flow pushes the valve discs to stretch the return spring and move them closer together, reducing the water flow and water pressure, and spraying it from the nozzle to the wafer surface. When the water pressure decreases, under the action of the return spring's own restoring force, the valve discs are pulled away from each other to increase the water flow, so that the water pressure sprayed from the nozzle to the wafer surface remains constant, avoiding the situation where the wafer surface is damaged or the cleaning effect is reduced due to excessive or insufficient water pressure.

[0030] 3. In this invention, after the wafer cleaning is completed, the controller starts the telescopic motor, which drives the moving plate to move on the guide rail. At the same time, the mapping sensor on the moving plate detects the cleaned wafers, detecting whether there is an odd number of wafers in each compartment of the wafer box, whether the thickness is uniform, and whether there are defects on the wafer surface. The detection information is then fed back to the computer. After the detection is completed, the controller controls the telescopic motor to retract, driving the mapping sensor back to its initial position. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall appearance structure of a wafer cleaning device with defect and quantity detection functions according to the present invention.

[0032] Figure 2 This invention relates to a wafer cleaning device with defect and quantity detection functions. Figure 1 Another perspective structural diagram;

[0033] Figure 3 This is a schematic diagram of the detection unit of a wafer cleaning device with defect and quantity detection functions according to the present invention after removing the dust cover;

[0034] Figure 4 This is a schematic diagram of the external structure of a partial anti-splash unit of a wafer cleaning device with defect and quantity detection functions according to the present invention.

[0035] Figure 5 This is a schematic diagram of the external structure of a portion of the feed unit of a wafer cleaning device with defect and quantity detection functions according to the present invention.

[0036] Figure 6 This is a schematic diagram of the installation position of the moving frame and the electrostatic brush in a wafer cleaning device with defect and quantity detection functions according to the present invention.

[0037] Figure 7 This is a schematic diagram of the internal structure of the drum in a wafer cleaning device with defect and quantity detection functions according to the present invention.

[0038] Figure 8 This is a schematic diagram of the internal structure of a straight cylinder in a wafer cleaning device with defect and quantity detection functions according to the present invention.

[0039] Figure 9 This is a schematic diagram of the internal structure of the water pipes in a wafer cleaning device with defect and quantity detection functions according to the present invention.

[0040] In the diagram: 1. Mounting bracket; 2. Anti-splash unit; 21. Starter motor; 22. Positive electrode plate; 23. Bracket; 24. Negative electrode plate; 25. Bracket; 26. Moving frame; 27. Starter brush; 3. Feeding unit; 31. Rotary motor; 32. Rotating rod; 33. Roller; 34. Electromagnet; 35. Magnetic block; 36. Straight cylinder; 37. Support plate; 38. Induction coil; 39. Bar magnet; 310. Buffer spring; 311. Brush assembly; 4. Water pressure regulating unit; 41. Water pipe; 42. Nozzle; 43. Valve disc; 44. Return spring; 5. Support unit; 51. Electric push rod; 52. Connecting frame; 53. Drive motor; 54. Baffle plate; 6. Detection unit; 61. Workbench; 62. Telescopic motor; 63. Moving plate; 64. Guide rail; 65. Mapping sensor; 66. Dust cover. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example: Figures 1-9 As shown, the present invention provides a technical solution:

[0043] like Figure 1 , Figure 2 , Figure 4 As shown, a wafer cleaning device with defect and quantity detection functions includes a mounting frame 1, an anti-splash unit 2, a feeding unit 3, a water pressure regulating unit 4, a support unit 5, and a detection unit 6. The mounting frame 1 is placed on a horizontal ground. The anti-splash unit 2 is fixedly connected to the mounting frame 1 and has the function of preventing secondary contamination of the wafer. The feeding unit 3 is fixedly connected to the mounting frame 1, the water pressure regulating unit 4 is fixedly connected to the mounting frame 1, the support unit 5 is fixedly connected to the mounting frame 1, and the detection unit 6 is fixedly connected to the mounting frame 1.

[0044] Mounting bracket 1 is used to mount and fix anti-splash unit 2, feeding unit 3, water pressure regulating unit 4, and support unit 5. Anti-splash unit 2 is used to prevent cleaning fluid from flowing back to the wafer surface. Feeding unit 3 is used to automatically compensate for brush bristle wear during feeding. Water pressure regulating unit 4 is used to regulate fluctuating water pressure to ensure constant cleaning pressure. Support unit 5 supports the rotation of the wafer. Detection unit 6 is used to detect the defects and quantity on the wafer surface after cleaning. After the wafer is placed in support unit 5, water pressure regulating unit 4 ensures constant cleaning pressure, feeding unit 3 ensures automatic compensation for cleaning brush wear, anti-splash unit 2 prevents cleaning droplets from bouncing back to the wafer surface and causing secondary contamination, and detection unit 6 detects the defects and quantity on the wafer after cleaning.

[0045] like Figure 4 , Figure 6 As shown, there are two sets of anti-splash units 2, which are symmetrically arranged on both sides of the wafer. Each anti-splash unit 2 includes a starter motor 21, a positive electrode disk 22, a bracket 23, a negative electrode disk 24, a support 25, a moving frame 26, and a starter brush 27. The starter motor 21 is fixedly mounted on the mounting frame 1. The positive electrode disk 22 is fixedly connected to the mounting frame 1 through the bracket 23. The negative electrode disk 24 is fixedly connected to the mounting frame 1 through the support 25. There are two moving frames 26, which are fixedly mounted on the telescopic end of the double-head telescopic motor. The fixed end of the double-head telescopic motor is fixedly mounted on the mounting frame 1. The starter brushes 27 are evenly arranged on the moving frames 26. The positive electrode disk 22 is a closed circular disk, and the negative electrode disk 24 is an arc-shaped disk. The mounting frame 1 is provided with a drainage groove below the negative electrode disk 24. The starter brushes 27 are made of Teflon. The starter motor 21 is connected to the positive electrode disk 22 through wires, and the starter motor 21 is connected to the negative electrode disk 24 through wires.

[0046] During wafer cleaning, a thin liquid film is left on the surface. The dual-head telescopic motor retracts, causing the moving frames 26 to move closer together. The electrostatic brush 27 experiences slight friction with this liquid film. Because Teflon readily acquires negative charges in triboelectric series, and aqueous solutions typically tend to be positively charged, this process enhances the overall positive charge of the liquid film. The droplets about to splash out of this liquid film thus carry a net positive charge. At this point, the controller activates the electrostatic motor 21, supplying positive charge to the positive electrode disk 22 and negative charge to the negative electrode disk 24. An electrostatic field is formed between disk 22 and negative disk 24. When a positively charged droplet splashes from the wafer surface and attempts to fall back onto the wafer, it immediately enters this electrostatic field. According to Coulomb's law, the positively charged droplet will be subjected to the repulsive force of positive disk 22 and the attractive force of negative disk 24. Under the combined action of these two forces, the trajectory of the droplet will be drastically deflected and forced to change its flight path. Finally, it will flow out from the drain channel of mounting bracket 1, thereby preventing the cleaned droplets from splashing back onto the wafer surface and causing contamination to the wafer cleaning process.

[0047] likeFigure 5 , Figure 7 , Figure 8 As shown, the feeding unit 3 includes a rotary motor 31, a rotating rod 32, a roller 33, an electromagnet 34, a magnetic block 35, and a straight cylinder 36. The fixed end of the rotary motor 31 is fixedly mounted on the mounting frame 1. The output end of the rotary motor 31 is fixedly connected to one end of the rotating rod 32, and the other end of the rotating rod 32 is rotatably connected to the mounting frame 1. The roller 33 is fixedly mounted on the rotating rod 32, the electromagnet 34 is fixedly mounted on the rotating rod 32, and the magnetic block 35 is fixedly mounted on the outer surface of the straight cylinder 36 near the end of the electromagnet 34. The straight cylinder 36 is disposed inside the roller 33.

[0048] like Figure 7 , Figure 8 As shown, the feeding unit 3 also includes a support plate 37, an induction coil 38, a bar magnet 39, a buffer spring 310, and a bristle assembly 311. The support plate 37 is fixedly installed inside the straight cylinder 36, the induction coil 38 is disposed inside the straight cylinder 36, one end of the bar magnet 39 is fixedly connected to the bristle assembly 311, one end of the buffer spring 310 is fixedly connected to the bristle assembly 311, the other end of the buffer spring 310 is fixedly connected to the support plate 37, the bar magnet 39 is slidably connected to the support plate 37, and the bristle assembly 311 is slidably connected to the roller 33.

[0049] The controller starts the rotary motor 31, which drives the rotating rod 32 to rotate, thereby rotating the roller 33. The bristle assembly 311 cleans the wafer surface. During the long cleaning process, as the bristle assembly 311 wears down due to contact with the wafer surface, the pressure on the bristle assembly 311 from the wafer surface decreases. At this time, under the action of the wafer's thrust, the bristle assembly 311 compresses the buffer spring 310, while simultaneously causing the bar magnet 39 to move a shorter distance within the straight cylinder 36. As the 9 moves within the induction coil 38, the magnetic flux changes. At this time, the instantaneous current generated by the induction coil 38 decreases. When the controller detects that the instantaneous current has decreased, it increases the input current to the electromagnet 34. The polarity generated by the electromagnet 34 increases, thereby pushing the magnetic block 35 to move the straight cylinder 36 outward. Under the action of the support plate 37 and the buffer spring 310, the brush assembly 311 moves outward, thereby compensating for the reduced contact force between the brush assembly 311 and the wafer caused by wear of the brush assembly 311, and avoiding the problem of poor cleaning effect on the wafer surface.

[0050] like Figure 9As shown, the water pressure regulating unit 4 includes a water pipe 41, a nozzle 42, a valve disc 43, and a return spring 44. The water pipe 41 is fixedly installed on the mounting bracket 1. One end of the water pipe 41 is connected to an external water pump. The nozzles 42 are evenly arranged on the water pipe 41. One end of the valve disc 43 is rotatably connected to the inside of the water pipe 41. The other end of the valve disc 43 is fixedly connected to one end of the return spring 44. The other end of the return spring 44 is fixedly connected to the inner wall of the water pipe 41.

[0051] During the process of the controller controlling the water pump to deliver water into the water pipe 41, due to fluctuations in water flow velocity and pressure, when the water pressure increases, the water flow pushes the valve discs 43 to stretch the return spring 44 and move them closer together, reducing the water flow and pressure, and spraying it from the nozzle 42 onto the wafer surface. When the water pressure decreases, the return spring 44 pulls the valve discs 43 away from each other under its own restoring force, increasing the water flow rate, so that the water pressure sprayed from the nozzle 42 onto the wafer surface remains constant, avoiding damage to the wafer surface or a decrease in cleaning effect due to excessive or insufficient water pressure.

[0052] like Figure 5 As shown, the support unit 5 includes an electric push rod 51, a connecting frame 52, a drive motor 53, and a baffle 54. The fixed end of the electric push rod 51 is fixedly installed on the mounting frame 1, and the output end of the electric push rod 51 is fixedly connected to the connecting frame 52 through a bent rod. The fixed end of the drive motor 53 is fixedly connected to the connecting frame 52, and the output end of the drive motor 53 is fixedly connected to the rotating roller. The baffle 54 is fixedly installed on the rotating roller.

[0053] When the wafer is placed on the rotating roller, the controller controls the drive motor 53 to start, which drives the baffle 54 and the rotating roller to rotate, thereby causing the wafer to rotate. In conjunction with the cleaning process, after the wafer cleaning is completed, the controller controls the electric push rod 51 to start and the drive motor 53 to stop rotating. The electric push rod 51 drives the drive motor 53 and the baffle 54 to move upward through the connecting frame 52, so that the cleaned wafer moves upward, leaves the cleaning area, and returns to the wafer grid.

[0054] like Figure 1 , Figure 3 As shown, the detection unit 6 includes a worktable 61, a telescopic motor 62, a moving plate 63, a guide rail 64, a mapping sensor 65, and a dust cover 66. The worktable 61 is fixedly connected to the mounting frame 1. The fixed end of the telescopic motor 62 is fixedly installed on the worktable 61. The telescopic end of the telescopic motor 62 is fixedly connected to the moving plate 63. The moving plate 63 is slidably installed on the guide rail 64 via a slide rod. The guide rail 64 is fixedly installed on the worktable 61. The mapping sensor 65 is fixedly installed on the moving plate 63 near the mounting frame 1. The dust cover 66 is fixedly installed on the worktable 61.

[0055] After the wafer cleaning is completed, the controller starts the telescopic motor 62, which drives the moving plate 63 to move on the guide rail 64. At the same time, the mapping sensor 65 on the moving plate 63 detects the cleaned wafers, detects whether there is an odd number of wafers in each compartment of the wafer box, whether the thickness is uniform, and whether there are defects on the wafer surface. The computer records the detection information feedback value. After the detection is completed, the controller controls the telescopic motor 62 to retract, which drives the mapping sensor 65 back to the initial position.

[0056] like Figure 7 , Figure 8 As shown, the end of the bar magnet 39 closest to the rotating rod 32 is the N pole.

[0057] In order for the controller to detect the distance the bar magnet 39 moves downward in the induction coil 38, and the magnitude of the current generated in a fixed direction, it is convenient to send different magnitudes of current to the electromagnet 34, so as to avoid the situation where the wafer cleaning effect is poor due to the wear of the brush assembly 311.

[0058] like Figure 8 As shown, the sliding friction between the bristle assembly 311 and the roller 33 is greater than the centrifugal force of the roller 33.

[0059] To prevent the brush assembly 311 from detaching from the roller 33 when the rotary motor 31 drives the rotating rod 32 and the roller 33 to rotate, thus preventing the wafer surface from being effectively cleaned.

[0060] like Figure 1 As shown, a controller is installed on the mounting bracket 1.

[0061] To enable automated control of the device while facilitating staff intervention and thus preventing unexpected situations.

[0062] Working principle of the invention:

[0063] When the wafer is placed on the rotating roller, the controller starts the drive motor 53, which drives the baffle 54 and the rotating roller to rotate, thereby causing the wafer to rotate. In conjunction with the cleaning process, the controller controls the water pump to deliver water into the water pipe 41. During this process, due to fluctuations in water flow rate and water pressure, when the water pressure increases, the water flow pushes the valve discs 43 to stretch the return spring 44 and move them closer together, reducing the water flow and water pressure. The water is then sprayed from the nozzle 42 onto the wafer surface. When the water pressure decreases, the return spring 44 pulls the valve discs 43 away from each other under its own restoring force, increasing the water flow rate. This ensures that the water pressure sprayed from the nozzle 42 onto the wafer surface remains constant, preventing damage to the wafer surface or a decrease in cleaning effect due to excessive or insufficient water pressure.

[0064] The controller starts the rotary motor 31, which drives the rotating rod 32 to rotate, thereby rotating the roller 33. The bristle assembly 311 cleans the wafer surface. During the long cleaning process, as the bristle assembly 311 wears down due to contact with the wafer surface, the pressure on the bristle assembly 311 from the wafer surface decreases. At this time, under the action of the wafer's thrust, the bristle assembly 311 compresses the buffer spring 310, while simultaneously causing the bar magnet 39 to move a shorter distance within the straight cylinder 36. As the 9 moves within the induction coil 38, the magnetic flux changes. At this time, the instantaneous current generated by the induction coil 38 decreases. When the controller detects that the instantaneous current has decreased, it increases the input current to the electromagnet 34. The polarity generated by the electromagnet 34 increases, thereby pushing the magnetic block 35 to move the straight cylinder 36 outward. Under the action of the support plate 37 and the buffer spring 310, the brush assembly 311 moves outward, thereby compensating for the reduced contact force between the brush assembly 311 and the wafer caused by wear of the brush assembly 311, and avoiding the problem of poor cleaning effect on the wafer surface.

[0065] During wafer cleaning, a thin liquid film is left on the surface. The dual-head telescopic motor retracts, causing the moving frames 26 to move closer together. The electrostatic brush 27 experiences slight friction with this liquid film. Because Teflon readily acquires negative charges in triboelectric series, and aqueous solutions typically tend to be positively charged, this process enhances the overall positive charge of the liquid film. The droplets about to splash out of this liquid film thus carry a net positive charge. At this point, the controller activates the electrostatic motor 21, supplying positive charge to the positive electrode disk 22 and negative charge to the negative electrode disk 24. An electrostatic field is formed between disk 22 and negative disk 24. When a positively charged droplet splashes from the wafer surface and attempts to fall back onto the wafer, it immediately enters this electrostatic field. According to Coulomb's law, the positively charged droplet will be subjected to the repulsive force of positive disk 22 and the attractive force of negative disk 24. Under the combined action of these two forces, the trajectory of the droplet will be drastically deflected and forced to change its flight path. Finally, it will flow out from the drain channel of mounting bracket 1, thereby preventing the cleaned droplets from splashing back onto the wafer surface and causing contamination to the wafer cleaning process.

[0066] After wafer cleaning is completed, the controller starts the electric push rod 51 and stops the drive motor 53. The electric push rod 51 drives the drive motor 53 and the baffle 54 upward through the connecting frame 52, causing the cleaned wafer to move upward, leave the cleaning area, and return to the wafer cell. After wafer cleaning is completed, the controller starts the telescopic motor 62, which moves the moving plate 63 on the guide rail 64. At the same time, the mapping sensor 65 on the moving plate 63 detects the cleaned wafers, checking whether there is an odd number of wafers in each cell of the wafer cassette, whether the thickness is uniform, and whether there are defects on the wafer surface. The detected information is fed back to the computer and recorded. After the detection is completed, the controller retracts the telescopic motor 62, causing the mapping sensor 65 to return to its initial position.

[0067] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer cleaning device with defect and quantity detection functions, characterized in that: The wafer cleaning equipment with defect and quantity detection functions includes a mounting frame (1), an anti-splash unit (2), a feeding unit (3), a water pressure regulating unit (4), a support unit (5), and a detection unit (6). The mounting frame (1) is placed on a horizontal ground. The anti-splash unit (2) is fixedly connected to the mounting frame (1). The anti-splash unit (2) has the function of preventing secondary contamination of the wafer. The feeding unit (3) is fixedly connected to the mounting frame (1). The water pressure regulating unit (4) is fixedly connected to the mounting frame (1). The support unit (5) is fixedly connected to the mounting frame (1). The detection unit (6) is fixedly connected to the mounting frame (1). The feeding unit (3) includes a rotary motor (31), a rotating rod (32), a drum (33), an electromagnet (34), a magnetic block (35), and a straight cylinder (36). The fixed end of the rotary motor (31) is fixedly mounted on the mounting frame (1). The output end of the rotary motor (31) is fixedly connected to one end of the rotating rod (32). The other end of the rotating rod (32) is rotatably connected to the mounting frame (1). The drum (33) is fixedly mounted on the rotating rod (32). The electromagnet (34) is fixedly mounted on the rotating rod (32). The magnetic block (35) is fixedly mounted on the outer surface of the straight cylinder (36) near the end of the electromagnet (34). The straight cylinder (36) is located inside the drum (33). The feeding unit (3) also includes a support plate (37), an induction coil (38), a bar magnet (39), a buffer spring (310), and a bristle assembly (311). The support plate (37) is fixedly installed inside the straight cylinder (36). The induction coil (38) is located inside the straight cylinder (36). One end of the bar magnet (39) is fixedly connected to the bristle assembly (311). One end of the buffer spring (310) is fixedly connected to the bristle assembly (311). The other end of the buffer spring (310) is fixedly connected to the support plate (37). The bar magnet (39) is slidably connected to the support plate (37). The bristle assembly (311) is slidably connected to the roller (33).

2. The wafer cleaning equipment with defect and quantity detection functions according to claim 1, characterized in that: The anti-splash unit (2) has two sets, which are symmetrically arranged on both sides of the wafer. The anti-splash unit (2) includes a generator (21), a positive electrode disk (22), a bracket (23), a negative electrode disk (24), a bracket (25), a moving frame (26), and a generator brush (27). The generator (21) is fixedly mounted on the mounting frame (1). The positive electrode disk (22) is fixedly connected to the mounting frame (1) through the bracket (23). The negative electrode disk (24) is fixedly connected to the mounting frame (1) through the bracket (25). The moving frame (26) has two brushes. Two movable frames (26) are fixedly installed on the telescopic end of the double-head telescopic motor. The fixed end of the double-head telescopic motor is fixedly installed on the mounting frame (1). The starting brush (27) is evenly arranged on the movable frame (26). The positive electrode plate (22) is a closed disc. The negative electrode plate (24) is an arc-shaped disc. The mounting frame (1) is provided with a drainage groove below the negative electrode plate (24). The starting brush (27) is made of Teflon. The starting motor (21) is connected to the positive electrode plate (22) by a wire. The starting motor (21) is connected to the negative electrode plate (24) by a wire.

3. The wafer cleaning equipment with defect and quantity detection functions according to claim 1, characterized in that: The water pressure regulating unit (4) includes a water pipe (41), a nozzle (42), a valve disc (43), and a return spring (44). The water pipe (41) is fixedly installed on the mounting bracket (1). One end of the water inlet of the water pipe (41) is connected to an external water pump. The nozzle (42) is evenly arranged on the water pipe (41). One end of the valve disc (43) is rotatably connected to the inside of the water pipe (41). The other end of the valve disc (43) is fixedly connected to one end of the return spring (44). The other end of the return spring (44) is fixedly connected to the inner wall of the water pipe (41).

4. A wafer cleaning device with defect and quantity detection functions according to claim 1, characterized in that: The support unit (5) includes an electric push rod (51), a connecting frame (52), a drive motor (53), and a baffle (54). The fixed end of the electric push rod (51) is fixedly installed on the mounting frame (1). The output end of the electric push rod (51) is fixedly connected to the connecting frame (52) through a bent rod. The fixed end of the drive motor (53) is fixedly connected to the connecting frame (52). The output end of the drive motor (53) is fixedly connected to the rotating roller. The baffle (54) is fixedly installed on the rotating roller.

5. A wafer cleaning device with defect and quantity detection functions according to claim 1, characterized in that: The detection unit (6) includes a workbench (61), a telescopic motor (62), a moving plate (63), a guide rail (64), a mapping sensor (65), and a dust cover (66). The workbench (61) is fixedly connected to the mounting frame (1). The fixed end of the telescopic motor (62) is fixedly installed on the workbench (61). The telescopic end of the telescopic motor (62) is fixedly connected to the moving plate (63). The moving plate (63) is slidably installed on the guide rail (64) via a slide rod. The guide rail (64) is fixedly installed on the workbench (61). The mapping sensor (65) is fixedly installed on the moving plate (63) near the mounting frame (1). The dust cover (66) is fixedly installed on the workbench (61).

6. A wafer cleaning device with defect and quantity detection functions according to claim 1, characterized in that: The bar magnet (39) has its N pole at the end closest to the rotating rod (32).

7. A wafer cleaning device with defect and quantity detection functions according to claim 1, characterized in that: The sliding friction between the bristle assembly (311) and the roller (33) is greater than the centrifugal force of the roller (33).

8. A wafer cleaning device with defect and quantity detection functions according to claim 1, characterized in that: The mounting bracket (1) is equipped with a controller.

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