A solid-state nanopore structure, testing device and method of fabrication thereof

By designing a three-layer solid material structure and a conductive material layer, the morphological instability and resolution reduction issues of solid nanopore structures during testing are solved, achieving higher current resolution and optimized current noise, making it suitable for nanopore electrochemical analysis, DNA sequencing, and protein sequencing.

CN120971522BActive Publication Date: 2026-05-26SHANGHAI BAICE TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI BAICE TECH CO LTD
Filing Date
2025-08-15
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing solid-state nanoporous structures suffer from morphological instability and reduced resolution during testing, especially as the thickness increases, where the test resolution decreases significantly and it is difficult to maintain the morphology for a long time.

Method used

A three-layer solid material structure is adopted, with a conductive material layer in the middle for conducting test current. Interconnected nanopores are formed on each material layer through an etching process to increase the structural robustness and resolution.

Benefits of technology

It improves the robustness of nanopore structures and the resolution of test current, reduces current noise, and is suitable for fields such as nanopore electrochemical analysis, DNA sequencing, and protein sequencing. It can generate current signals with single-base or single-amino acid resolution.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention relates to a solid-state nanopore structure and its fabrication method. The structure includes: a second solid material layer with an opening in its central region for blocking a test object (DAMP) to generate a test current; and a conductive material layer for conducting current, located below the second solid material layer, also with an opening in its central region. The openings in the second solid material layer and the conductive material layer are interconnected, and the sizes of the openings in the second solid material layer and the conductive material layer may be the same or different. The solid-state nanopore structure provided by this invention features interconnected nanopores in the central regions of three solid material layers, thereby increasing the overall robustness of the solid-state nanopore structure. Since the test current is conducted through the conductive material layer, it does not affect the resolution of the solid-state nanopore for the DAMP that passes through it.
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