Electromagnetic compatibility testing device of photoelectric conversion module and testing method thereof

Abstract

The invention belongs to the technical field of electromagnetic compatibility testing, and particularly relates to an electromagnetic compatibility testing device of a photoelectric conversion module and a testing method thereof.The electromagnetic compatibility testing device of the photoelectric conversion module comprises a signal generation box and further comprises a signal generation heat dissipation net plate installed at the top of the signal generation box in a penetrating mode; a signal generation mainboard is fixedly installed in the signal generation box, a signal source module is electrically installed at the top of the signal generation mainboard, heat dissipation is conducted on modules in the signal generation box through a signal generation heat dissipation net plate, and then a periodic code signal with the specific frequency and amplitude is generated through the signal source module and used for simulating an interference source; the signal intensity is enhanced by using the power amplifier, and then the current injection probe is used for conducting sensitivity test and injecting interference to the power line or the signal line, so that the photoelectric frequency can be simulated, the electromagnetic compatibility test intensity is high, and the overall intensity of the electromagnetic compatibility test is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electromagnetic compatibility test, and particularly relates to an electromagnetic compatibility test device for an optoelectronic conversion module and a test method thereof. BACKGROUND

[0002] Electromagnetic compatibility test (EMC) refers to the ability of a device or system to operate in its electromagnetic environment without causing intolerable electromagnetic interference to any device in the environment, and an electromagnetic compatibility test device for an optoelectronic conversion module is provided.

[0003] For example, a Chinese patent with the authorization announcement number CN209247919U discloses an electromagnetic compatibility test device, which comprises a test chamber, a placement disc, a partition plate and a hand-operated lifting assembly. The partition plate is fixed below the inside of the test chamber, the top end of the hand-operated lifting assembly is fixedly connected with the lower surface of the placement disc through the partition plate, and a part of the hand-operated lifting assembly extends to the outside of the test chamber through the front side wall of the test chamber.

[0004] The patent has the following problems: The prior art document is inconvenient to imitate the optoelectronic frequency in use, has low electromagnetic compatibility test strength, reduces the strength of electromagnetic compatibility test, is inconvenient to positionally simulate electromagnetic compatibility data in use, and reduces the accuracy of electromagnetic data compatibility test. In view of this, an electromagnetic compatibility test device for an optoelectronic conversion module and a test method thereof are provided. SUMMARY

[0005] The application aims to solve the above technical problems, provide an electromagnetic compatibility test device for an optoelectronic conversion module and a test method thereof, improve the strength of electromagnetic compatibility test, and improve the accuracy of electromagnetic data compatibility test.

[0006] Therefore, the application provides an electromagnetic compatibility test device for an optoelectronic conversion module, which comprises a signal generation box and further comprises: a signal generation heat dissipation net plate installed through the top of the signal generation box, a signal generation mainboard fixedly installed in the inside of the signal generation box, a signal source module electrically installed on the top of the signal generation mainboard, a power amplifier electrically installed on one side of the signal source module, a current injection probe electrically installed on one side of the power amplifier, a signal receiving box movably installed at the bottom of the signal generation box, a signal receiving heat dissipation net plate installed through the top of the signal receiving box, a signal receiving mainboard fixedly installed in the inside of the signal receiving box, a spectrum analyzer electrically installed on the top of the signal receiving mainboard, an electromagnetic compatibility analyzer electrically installed on one side of the spectrum analyzer, and a near-field probe electrically installed on one side of the electromagnetic compatibility analyzer.

[0007] Based on the above structure, the internal modules of the signal generation box are cooled by a heat dissipation mesh plate. Then, a periodic code signal with a specific frequency and amplitude is generated by the signal source module to simulate an interference source. The signal strength is then enhanced by a power amplifier. Next, a current injection probe is used for conducted sensitivity testing, injecting interference into the power line or signal line to simulate photoelectric frequencies, thereby improving the intensity of electromagnetic compatibility testing. Then, a spectrum analyzer is used in conjunction with an electromagnetic compatibility analyzer to scan the electromagnetic radiation intensity, and the curve is used to determine whether it meets the standard. Finally, a near-field probe is used to locate local interference sources inside the module to assist in radiation source analysis, enabling the location and simulation of electromagnetic compatibility data, thereby improving the accuracy of electromagnetic data compatibility testing.

[0008] Preferably, a data box is movably mounted on the top of the signal generating box, and a detection outer casing is movably mounted on the outside of the data box.

[0009] Preferably, a data heat dissipation mesh is installed through the top of the data box, a data motherboard is fixedly installed inside the data box, and a data jack is installed through the surface of the data box.

[0010] Preferably, a networking module is electrically installed on the top of the data motherboard, a transmission module is electrically installed on one side of the networking module, and a storage chip is electrically installed on one side of the transmission module.

[0011] Preferably, an inner testing box is fixedly installed inside the outer testing box, and a testing partition is fixedly installed inside the inner testing box. A lifting top plate is fixedly installed on the top of the outer testing box, and a handle is fixedly installed on the top of the lifting top plate. A battery box is fixedly installed at the bottom of the outer testing box.

[0012] Preferably, a battery pad is fixedly installed inside the battery box, a storage battery is movably installed inside the battery pad, and a support base plate is fixedly installed at the bottom of the battery box.

[0013] Preferably, an anti-slip pad is fixedly installed on the bottom of the supporting base plate, and the anti-slip pad is made of rubber.

[0014] Preferably, an electromagnetic compatibility testing method for a photoelectric conversion module includes the following steps: S1. First, the heat dissipation mesh plate of the signal generator is used to dissipate heat from the modules inside the signal generator box. Then, the signal source module generates a periodic code signal with a specific frequency and amplitude to simulate an interference source. The signal strength is enhanced by a power amplifier. Next, a current injection probe is used for conducted sensitivity testing to inject interference into the power line or signal line. Then, a spectrum analyzer is used in conjunction with an electromagnetic compatibility analyzer to scan the electromagnetic radiation intensity. The curve is used to determine whether it meets the standard. Finally, a near-field probe is used to locate the local interference source inside the module to assist in the analysis of the radiation source.

[0015] S2. Then, the signal generator box and signal receiver box 7 are installed. Next, the heat generated by the module inside the data box is dissipated by the data heat dissipation mesh plate to avoid the problem of aging and failure of the device and circuit due to heat accumulation. The data is externally connected by the data jack. Then, the detection data is transmitted by the network module in conjunction with the transmission module.

[0016] S3. Finally, the data is stored and recorded using a storage chip. Then, multiple testing boxes are stably installed using the outer and inner testing boxes. The equipment is then easily lifted using a handle. The battery pad inside the battery box protects the battery. The battery then provides external power to the testing module. Finally, a support base plate with anti-slip pads provides anti-slip support for the equipment, preventing it from tilting or collapsing during use, thus effectively improving the overall stability and robustness of the equipment.

[0017] The beneficial effects of this invention are: This invention relates to an electromagnetic compatibility (EMC) testing device and method for a photoelectric conversion module. The device uses a heat dissipation mesh to cool the module inside the signal generator box. Then, a signal source module generates a periodic code signal with a specific frequency and amplitude to simulate an interference source. A power amplifier is then used to enhance the signal strength. Finally, a current injection probe is used for conducted sensitivity testing, injecting interference into the power line or signal line. This method can mimic photoelectric frequencies and provides a high level of EMC testing intensity, thereby improving the overall strength of the EMC test.

[0018] This invention relates to an electromagnetic compatibility (EMC) testing device and method for a photoelectric conversion module. By using a spectrum analyzer in conjunction with an EMC analyzer to scan the electromagnetic radiation intensity and judging whether it meets the standard through curves, a near-field probe is used to locate local interference sources inside the module, thereby achieving auxiliary radiation source analysis. This method can locate and simulate EMC data, thus improving the accuracy of EMC data compatibility testing. Attached Figure Description

[0019] Figure 1 This is an overall perspective view of the present invention; Figure 2 This is a schematic diagram of the overall structure of the present invention; Figure 3 This is a partial structural diagram of the signal generator box in this invention; Figure 4 This is a partial structural diagram of the data box in this invention; Figure 5 This is a partial perspective view of the outer casing used in the present invention.

[0020] The markings in the diagram are as follows: 1. Inspect the outer casing; 101. Inspect the inner casing; 102. Inspect the partition; 2. Lift-up top panel; 201. Handle; 3. Battery box; 301. Battery pad; 302. Battery; 4. Support base plate; 401. Anti-slip pad; 5. Data box; 501. Data heat dissipation mesh plate; 502. Data motherboard; 503. Network module; 504. Transmission module; 505. Storage chip; 506. Data jack; 6. Signal generator box; 601. Signal generator heat dissipation mesh plate; 602. Signal generator motherboard; 603. Signal source module; 604. Power amplifier; 605. Current injection probe; 7. Signal receiver box; 701. Signal receiver heat dissipation mesh plate; 702. Signal receiver motherboard; 703. Spectrum analyzer; 704. Electromagnetic compatibility analyzer; 705. Near-field probe. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] This application discloses an electromagnetic compatibility testing device for a photoelectric conversion module. Please refer to [link to relevant documentation]. Figures 1-5 The system includes a signal generating box 6, and further includes: a signal generating heat dissipation mesh plate 601 installed through the top of the signal generating box 6; a signal generating main board 602 fixedly installed inside the signal generating box 6; a signal source module 603 electrically installed on the top of the signal generating main board 602; a power amplifier 604 electrically installed on one side of the signal source module 603; a current injection probe 605 electrically installed on one side of the power amplifier 604; a signal receiving box 7 movably installed at the bottom of the signal generating box 6; a signal receiving heat dissipation mesh plate 701 installed through the top of the signal receiving box 7; a signal receiving main board 702 fixedly installed inside the signal receiving box 7; a spectrum analyzer 703 electrically installed on the top of the signal receiving main board 702; an electromagnetic compatibility analyzer 704 electrically installed on one side of the spectrum analyzer 703; and a near-field probe 705 electrically installed on one side of the electromagnetic compatibility analyzer 704.

[0023] Based on the above structure, the heat dissipation mesh plate 601 dissipates heat from the modules inside the signal generation box 6. Then, the signal source module 603 generates a periodic code signal with a specific frequency and amplitude to simulate an interference source. Next, the power amplifier 604 enhances the signal strength. Then, the current injection probe 605 is used for conducted sensitivity testing, injecting interference into the power line or signal line. This can simulate photoelectric frequencies and provides a high intensity of electromagnetic compatibility testing, thereby improving the intensity of electromagnetic compatibility testing. Then, the spectrum analyzer 703, together with the electromagnetic compatibility analyzer 704, scans the electromagnetic radiation intensity. The curve is used to determine whether it meets the standard. Finally, the near-field probe 705 locates local interference sources inside the module to assist in radiation source analysis. This allows for the location and simulation of electromagnetic compatibility data, thereby improving the accuracy of electromagnetic data compatibility testing.

[0024] In one embodiment, a data box 5 is movably mounted on the top of the signal generating box 6, and a detection outer casing 1 is movably mounted on the outside of the data box 5.

[0025] Specifically, the signal generator box 6 detects the internal movement of the outer casing 1 on top of the data box 5.

[0026] In this embodiment, the signal generator box 6 and the signal receiver box 7 can be installed in a movable manner, thereby improving the convenience of electromagnetic compatibility testing.

[0027] In one embodiment, a data heat dissipation mesh plate 501 is installed through the top of the data box 5, a data motherboard 502 is fixedly installed inside the data box 5, and a data jack 506 is installed through the surface of the data box 5.

[0028] Specifically, a data heat dissipation mesh plate 501 is installed through the top of the data box 5, and a data motherboard 502 is fixedly installed inside the data box 5.

[0029] In this embodiment, the heat dissipation mesh plate 501 can be used to dissipate heat from the modules inside the data box 5, and then the data jack 506 can be used to connect and use the data, thereby improving the convenience of data transmission.

[0030] In one embodiment, a networking module 503 is electrically mounted on the top of the data motherboard 502, a transmission module 504 is electrically mounted on one side of the networking module 503, and a storage chip 505 is electrically mounted on one side of the transmission module 504.

[0031] Specifically, a network module 503 is electrically installed on the top of the data motherboard 502, a transmission module 504 is electrically installed on one side of the network module 503, and a storage chip 505 is electrically installed on one side of the transmission module 504.

[0032] In this embodiment, the network module 503 and the transmission module 504 can be used to transmit the detected data over the network, and then the storage chip 505 can be used to store and record the data, thereby improving the convenience of data transmission.

[0033] In one embodiment, an inner detection box 101 is fixedly installed inside the outer detection box 1, and a detection partition 102 is fixedly installed inside the inner detection box 101. A lifting top plate 2 is fixedly installed on the top of the outer detection box 1, and a handle 201 is fixedly installed on the top of the lifting top plate 2. A battery box 3 is fixedly installed at the bottom of the outer detection box 1.

[0034] Specifically, an inner testing box 101 is fixedly installed inside the outer testing box 1, and a testing partition 102 is fixedly installed inside the inner testing box 101.

[0035] In this embodiment, multiple testing boxes can be stably installed using the outer testing box 1 and the inner testing box 101, and then the device can be easily lifted using the handle 201, thereby improving the ease of moving the testing device.

[0036] In one embodiment, a battery pad 301 is fixedly installed inside the battery box 3, a storage battery 302 is movably installed inside the battery pad 301, and a support base plate 4 is fixedly installed at the bottom of the battery box 3.

[0037] Specifically, a battery pad 301 is fixedly installed inside the battery box 3, and a storage battery 302 is movably installed inside the battery pad 301.

[0038] In this embodiment, the battery pad 301 inside the battery box 3 can be used to protect the storage battery 302, and then the storage battery 302 can be used to provide external power to the detection module, thereby improving the battery life of the detection equipment when used outside.

[0039] In one embodiment, an anti-slip pad 401 is fixedly installed on the bottom of the support base plate 4. The anti-slip pad 401 is made of rubber.

[0040] Specifically, an anti-slip pad 401 is fixedly installed on the bottom of the support base plate 4.

[0041] In this embodiment, the support base plate 4 and the anti-slip pad 401 can be used to provide anti-slip support for the equipment, thereby improving the stability of the equipment placement.

[0042] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. An electromagnetic compatibility testing device for a photoelectric conversion module, comprising a signal generator box (6), characterized in that, Also includes: A signal generating heat dissipation mesh plate (601) is installed through the top of the signal generating box (6). A signal generating motherboard (602) is fixedly installed inside the signal generating box (6). A signal source module (603) is electrically installed on the top of the signal generating motherboard (602). A power amplifier (604) is electrically installed on one side of the signal source module (603). A current injection probe (605) is electrically installed on one side of the power amplifier (604). A signal receiving box (7) is movably installed at the bottom of the signal generating box (6). A signal receiving heat dissipation mesh plate (701) is installed through the top of the signal receiving box (7). A signal receiving motherboard (702) is fixedly installed inside the signal receiving box (7). A spectrum analyzer (703) is electrically installed on the top of the signal receiving motherboard (702). An electromagnetic compatibility analyzer (704) is electrically installed on one side of the spectrum analyzer (703). A near-field probe (705) is electrically installed on one side of the electromagnetic compatibility analyzer (704).

2. The electromagnetic compatibility testing device for a photoelectric conversion module according to claim 1, characterized in that: A data box (5) is movably mounted on the top of the signal generating box (6), and a detection outer casing (1) is movably mounted on the outside of the data box (5).

3. The electromagnetic compatibility testing device for a photoelectric conversion module according to claim 2, characterized in that: A data heat dissipation mesh plate (501) is installed through the top of the data box (5), a data motherboard (502) is fixedly installed inside the data box (5), and a data jack (506) is installed through the surface of the data box (5).

4. The electromagnetic compatibility testing device for a photoelectric conversion module according to claim 3, characterized in that: A network module (503) is electrically installed on the top of the data motherboard (502), a transmission module (504) is electrically installed on one side of the network module (503), and a storage chip (505) is electrically installed on one side of the transmission module (504).

5. The electromagnetic compatibility testing device for a photoelectric conversion module according to claim 2, characterized in that: The outer detection box (1) is fixedly installed with an inner detection box (101), and the inner detection box (101) is fixedly installed with a detection partition (102). The top of the outer detection box (1) is fixedly installed with a lifting top plate (2), and the top of the lifting top plate (2) is fixedly installed with a handle (201). The bottom of the outer detection box (1) is fixedly installed with a battery box (3).

6. The electromagnetic compatibility testing device for a photoelectric conversion module according to claim 5, characterized in that: A battery pad (301) is fixedly installed inside the battery box (3), and a storage battery (302) is movably installed inside the battery pad (301). A support base plate (4) is fixedly installed at the bottom of the battery box (3).

7. The electromagnetic compatibility testing device for a photoelectric conversion module according to claim 6, characterized in that: The bottom of the support base plate (4) is fixedly installed with an anti-slip pad (401), which is made of rubber.

8. An electromagnetic compatibility testing method for a photoelectric conversion module according to claims 1-7, characterized in that: Its testing method includes the following steps: S1. First, the heat dissipation mesh plate (602) is used to dissipate heat from the modules inside the signal generator box (6). Then, the signal source module (603) generates a periodic code signal with a specific frequency and amplitude to simulate an interference source. The signal strength is enhanced by the power amplifier (604). Then, the current injection probe (605) is used for conduction sensitivity testing to inject interference into the power line or signal line. Then, the spectrum analyzer (703) is used in conjunction with the electromagnetic compatibility analyzer (704) to scan the electromagnetic radiation intensity. The curve is used to determine whether it meets the standard. Then, the near-field probe (705) is used to locate the local interference source inside the module to assist in the analysis of the radiation source. S2. Then, the signal generator box (6) and the signal receiver box (7) are installed. Then, the heat generated by the module inside the data box (5) is dissipated by the data heat dissipation mesh plate (501) to avoid the problem of aging and failure of the device and the line due to the accumulation of internal heat. The data is externally connected by the data jack (506). Then, the detection data is transmitted by the network module (503) in conjunction with the transmission module (504). S3. Finally, the data is stored and recorded using the storage chip (505). Then, multiple detection boxes are stably installed using the detection outer box (1) and the detection inner box (101). The device is then easily lifted using the handle (201). The battery pad (301) inside the battery box (3) is used to protect the battery (302). The battery (302) is used to provide external power to the detection module. The support base plate (4) is used in conjunction with the anti-slip pad (401) to provide anti-slip support for the device, thus preventing the device from tilting and collapsing during use and effectively improving the overall stability and robustness of the device.

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