Supporting assembly, display module and electronic equipment

Abstract

The invention provides a supporting assembly, a display screen and electronic equipment, the supporting assembly is used for supporting the display screen, the supporting assembly comprises at least two laminated layers, and the modulus of each laminated layer is gradually increased in the direction away from the display screen. The thickness and the weight of the supporting assembly can be reduced, and the falling ball buffering capacity of the supporting assembly is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment, and in particular to a support assembly, a display module and an electronic device. BACKGROUND

[0002] A straight phone adopts a flexible organic light emitting diode (OLED) display screen. Compared with a liquid crystal display (LCD) or a hard OLED display screen, the impact resistance of the display touch layer is greatly reduced, and the risk of fracture failure under drop or extrusion is greatly increased. The root cause is that the OLED back support assembly (SCF) has insufficient buffering capacity. When falling, the whole machine frame steps, openings, back glue and foam edges produce impact on the back of the display screen, causing the OLED layer to break, and failure phenomena such as broken bright spots or black spots occur. The overall trend of the industry in the future is towards the development of thin and light mobile phones, which puts forward new requirements for the display module: 1. The support assembly is thinned and lightened; 2. The gap between the screen and the frame is reduced, and the buffering capacity of the support assembly needs to be improved, and the drop ball buffering capacity is required to be greater than 55 cm. SUMMARY

[0003] The present application provides a support assembly, a display screen and an electronic device to reduce the thickness and weight of the support assembly and improve the drop ball buffering capacity of the support assembly.

[0004] The first aspect of the present application provides a support assembly for supporting a display screen, the support assembly comprising at least two layers, the modulus of each layer gradually increasing in a direction away from the display screen.

[0005] The support assembly is used for supporting a display screen, and comprises at least two layers, the modulus of each layer gradually increases along the direction away from the display screen, that is, each layer is arranged in the order of modulus, the modulus of the layer closer to the display screen is smaller, and the layer is easier to deform; when the support assembly is impacted, the layer far away from the display screen is impacted first, the layer far away from the display screen only slightly deforms to absorb the impact energy, delays the transmission of the impact energy to the next layer, fully plays the ball drop buffering capacity of the layer, then uniformly disperses and transmits the remaining energy to the next layer, reduces the impact on the next layer, further delays the transmission of the impact energy, fully plays the ball drop buffering capacity of the next layer, so that the ball drop buffering capacity of each layer can be fully played as much as possible, the transmission of the impact energy to the next layer is reduced, and the ball drop buffering capacity of the support assembly can be improved while the thickness of the support assembly is reduced; since the layers of the support assembly can be made of light materials, and the thickness of the support assembly is small, the weight of the support assembly can be reduced.

[0006] Optionally, a relationship between the ball drop capacity of the support assembly and the single ball drop capacity of each layer satisfies the following relationship: the ball drop capacity of the support assembly ≈ linear superposition of the single ball drop capacity of each layer, and according to the formula, the thickness of each layer is distributed when the total thickness of the support assembly 3 is determined, so that the optimal design of the ball drop buffering capacity can be realized.

[0007] Optionally, the linear superposition of the single ball drop capacity of each layer satisfies -2 mm ≤ the ball drop capacity of the support assembly ≤ linear superposition of the single ball drop capacity of each layer + 2 mm, that is, the ball drop capacity of the support assembly 3 is within the range of ± 2 mm of the linear superposition of the single ball drop capacity of each layer, so that the optimal design of the buffering capacity of the support assembly 3 can be realized, and the number of experiments can be reduced, and the time cost and production cost can be reduced.

[0008] Optionally, the thickness of the support assembly is 0.1 mm to 0.3 mm, so that the ball drop buffering capacity of the support assembly 3 can meet the requirements, the whole machine can have a small thickness, and the requirements of thinning and weight reduction of the whole machine can be met.

[0009] Optionally, the support assembly comprises at least one buffer layer and at least one support layer, the modulus of the buffer layer is less than the modulus of the support layer, and the buffer layer and the support layer are arranged in a direction away from the display screen; the support layer is made of a material with a higher modulus to increase the strength of the outer surface of the support assembly 3, prevent damage such as scratching of the outer surface of the support assembly 3, and evenly distribute impact energy through the support layer that is not easily deformed, thereby reducing the impact intensity received by the buffer layer.

[0010] Optionally, the support assembly comprises a first buffer layer and a second buffer layer, the modulus of the first buffer layer is less than the modulus of the second buffer layer, and the first buffer layer and the second buffer layer are arranged in a direction away from the display screen, thereby improving the buffering capacity of the support assembly through the two buffer layers; the modulus of the first buffer layer is less than the modulus of the second buffer layer, and the first buffer layer and the second buffer layer are arranged in a direction away from the display screen, so that impact energy can be absorbed layer by layer, and the buffering capacity of the first buffer layer and the second buffer layer can be fully utilized.

[0011] Optionally, the material of the first buffer layer is foam, which has a series of characteristics such as large elasticity, light weight, free bending, ultra-thin volume, and reliable performance, and forms an isolation and protection effect on the surface of the support assembly close to the display screen, thereby reducing the impact stress received by the display screen.

[0012] Optionally, the material of the second buffer layer is polyurethane or silicone gel, which can maintain elasticity for a long time within a relatively large stable range, can protect electronic components from moisture and shock, and can extend the effective service life of the support assembly.

[0013] Optionally, the support assembly comprises a first support layer and a second support layer, the modulus of the first support layer is less than the modulus of the second support layer, and the first support layer and the second support layer are arranged in a direction away from the display screen, thereby improving the uniformity of the distribution of impact energy within the support assembly through the two support layers, and avoiding excessive local pressure; the modulus of the first support layer is less than the modulus of the second support layer, and the first support layer and the second support layer are arranged in a direction away from the display screen, so that impact can be distributed uniformly layer by layer, and the buffering capacity of the first support layer and the second support layer can be fully utilized.

[0014] Optionally, the material of the first support layer is polyester, glass fiber, or polyimide, that is, the material of the first support layer is selected from relatively hard high molecular materials, which can form reliable support and also have the effect of reducing weight.

[0015] Optionally, the material of the second support layer is metal, so as to form a surface with high strength and prevent the surface of the support assembly from being scratched.

[0016] Optionally, the support assembly further comprises a first adhesive layer, which is located on the surface of the support assembly close to the display screen, and the modulus of the first adhesive layer is smaller than the modulus of the other layers, that is, the support assembly is bonded to the surface of the display screen through the first adhesive layer with greater elasticity, so that the first adhesive layer can simultaneously play the roles of bonding and buffering, and the buffering performance of the support assembly is improved.

[0017] Optionally, the adjacent layers are bonded through a second adhesive layer, and the modulus of the second adhesive layer is between the modulus of the adjacent two layers, so that the second adhesive layer and the other layers of the support assembly form a stacking order in sequence of modulus, so that the second adhesive layer can fully play the buffering capacity while playing the role of bonding, and the buffering performance of the support assembly is improved.

[0018] The second aspect of the present application provides a display module comprising any one of the support assemblies provided by the present application.

[0019] The third aspect of the present application provides an electronic device comprising any one of the display modules provided by the present application.

[0020] It should be understood that the foregoing general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of a display module in the prior art;

[0022] Figure 2 is a structural schematic diagram of another display module in the prior art;

[0023] Figure 3 is a structural schematic diagram of a display module provided by the embodiments of the present application;

[0024] Figure 4 is a schematic diagram of an interface mechanics model on which the embodiments of the present application are based;

[0025] Figure 5 is a curve diagram drawn according to Figure 4

[0026] Figure 6 is a structural schematic diagram of a first group of experimental groups provided by the embodiments of the present application;

[0027] Figure 7 is a structural schematic diagram of a second group of experimental groups provided by the embodiments of the present application;

[0028] Figure 8 ​A structural schematic view of a first set of control groups provided for the embodiments of the present application;

[0029] Figure 9 A structural schematic view of a third set of experimental groups provided for the embodiments of the present application;

[0030] Figure 10 A structural schematic view of a second set of control groups provided for the embodiments of the present application;

[0031] Figure 11 A structural schematic view of a third set of control groups provided for the embodiments of the present application;

[0032] Figure 12 A structural schematic view of a fourth set of control groups provided for the embodiments of the present application;

[0033] Figure 13 A structural schematic view of a fifth set of control groups provided for the embodiments of the present application;

[0034] Figure 14 A structural schematic view of a sixth set of control groups provided for the embodiments of the present application;

[0035] Figure 15 A measured fold line graph of the lamination thickness distribution principle provided for the embodiments of the present application;

[0036] Figure 16 A lamination stack structure schematic view of a first support assembly provided for the embodiments of the present application;

[0037] Figure 17 A lamination stack structure schematic view of a second support assembly provided for the embodiments of the present application;

[0038] Figure 18 A lamination stack structure schematic view of a third support assembly provided for the embodiments of the present application;

[0039] Figure 19 A lamination stack structure schematic view of a fourth support assembly provided for the embodiments of the present application.

[0040] Reference signs:

[0041] 1 - display screen;

[0042] 2 - cover plate;

[0043] 3 - support assembly;

[0044] 31 - first adhesive layer;

[0045] 32 - first buffer layer;

[0046] 33 - second buffer layer;

[0047] 34 - first support layer;

[0048] 35 - second support layer;

[0049] 36 - second adhesive layer.

[0050] The accompanying drawings, which are incorporated herein and constitute part of this specification, illustrate embodiments consistent with the application and serve to explain the principles of the application. DETAILED DESCRIPTION

[0051] For better understanding of the technical solutions of the present application, the embodiments of the present application are described in detail below in conjunction with the drawings.

[0052] In a specific embodiment, the present application is further described in detail below through specific embodiments and in conjunction with the drawings.

[0053] The electronic device provided by the embodiments of the present application can be a common mobile terminal such as a mobile phone, a tablet computer or a wearable device, which comprises a display module for displaying text, images or videos, etc.

[0054] The display module provided by the embodiment of the application comprises a display screen 1, a screen cover plate 2 and a supporting assembly 3. The display screen 1 is used for displaying images, characters or videos and the like. The display screen 1 can be a flexible screen or a rigid screen. For example, the display screen 1 can be an organic light emitting diode (OLED) display screen 1, an active-matrix organic light-emitting diode (AMOLED) display screen 1, a mini organic light-emitting diode display screen 1, a micro organic light-emitting diode display screen 1, a micro organic light-emitting diode display screen 1, a quantum dot light emitting diode (QLED) display screen 1 or a liquid crystal display screen (LCD) and the like. The screen cover plate 2 is covered on the light-transmitting side of the display screen 1 to improve the flatness of the surface of the display screen 1. The screen cover plate 2 protects the display screen 1. The screen cover plate 2 has light-transmitting property, and the pattern displayed on the display screen 1 can be seen through the screen cover plate 2. The supporting assembly 3 is arranged on the back light side of the display screen 1 and is used for supporting the display screen 1. In other words, the supporting assembly 3 is arranged on the side of the display screen 1 away from the screen cover plate 2. The supporting assembly 3 supports and protects the display screen 1.

[0055] The supporting assembly 3 directly affects the impact of the middle frame steps, openings, back adhesive and foam edges of the whole machine on the back of the display screen 1 when the electronic device falls. If the buffering capacity of the supporting assembly 3 is insufficient, the electronic device may produce failure phenomena such as bright spots or black spots when falling. Therefore, the structural optimization of the supporting assembly 3 is one of the important improvement directions for improving the impact resistance of the display module.

[0056] Reference Figure 1, the support assembly 3 can adopt a multi-layer metal composite structure, and the layers of metal are bonded by pressure sensitive adhesive (abbreviation: PSA) or grid adhesive (abbreviation: EMBO) or the like, for example, the support assembly 3 is formed by superimposing and combining a first metal layer, a second metal layer and a third metal layer, the first metal layer is Al, the second metal layer is SUS, and the third metal layer is Al, and the first metal layer and the second metal layer and the second metal layer and the third metal layer are bonded by pressure sensitive adhesive or grid adhesive, that is, the support assembly 3 does not set the high polymer buffer material, and relies on the hardness of the metal to support to resist impact and extrusion. The rigidity of such structure is too high, and in general it cannot be bent, and the rebound force is extremely large after bending, so it cannot be used for curved surface mobile phones; and because it completely relies on the rigidity of the metal to resist deformation, there is no buffer material to absorb energy, resulting in insufficient buffering capacity; in addition, because the metal is extremely heavy, it is not conducive to the weight reduction of the whole machine.

[0057] Reference Figure 2 , the support assembly 3 can adopt a multi-layer structure of composite materials, for example, the support assembly 3 adopts a plurality of materials such as foam, polyimide (abbreviation: PI) or copper (Cu) and the like are combined, and an adhesive is used for interfacial bonding. The rigidity of Cu is used to resist impact, and the pressure is reduced; the foam is used to absorb dynamic impact and absorb impact energy. The typical thickness and stacking scheme of each layer can be, for example, the support assembly 3 includes a first layer, a second layer and a third layer, the first layer is PI, the thickness of the first layer is 20μm, the second layer is foam, the thickness of the second layer is 80μm~150μm, the third layer is metal, the thickness of the third layer is 30μm~70μm, the first layer and the second layer and the second layer and the third layer are bonded by pressure sensitive adhesive or grid adhesive, and the thickness of the pressure sensitive adhesive or grid adhesive is 15μm~60μm. Such structure is a multi-material composite structure, the thickness is relatively thick, generally 0.24mm~0.26mm, which is not conducive to the thinning of the whole machine, and the buffering capacity is insufficient, the ball drop buffering capacity is 40cm~50cm, and in particular, the stacking order of each layer is not fixed, and the thickness of each layer is not clear, so that the buffering capacity of the support assembly 3 has a large variation range, and it is difficult to fully exert the buffering capacity of each layer.

[0058] As Figure 3As shown, this application embodiment provides a support component 3, which includes at least two stacked layers. Along the direction away from the display screen 1, the modulus of each stacked layer gradually increases. That is, the stacked layers are arranged in a modulus-order stacking scheme. The closer the stacked layer is to the display screen 1, the smaller its modulus, making it more prone to deformation; the farther the stacked layer is from the display screen 1, the larger its modulus, making it less prone to deformation. When the support component 3 is impacted, the stacked layer farther from the display screen 1 is impacted first. This stacked layer undergoes only slight deformation to absorb the impact energy, delaying the transfer of the impact energy to the next stacked layer, thus fully utilizing the stacked layer's properties. The system effectively absorbs the impact of falling balls, then distributes the remaining energy evenly to the next layer, reducing the impact on the next layer and further delaying the transmission of impact energy. This fully utilizes the falling ball absorption capacity of the next layer, ensuring that the falling ball absorption capacity of each layer can be fully utilized, reducing the transmission of impact energy to the next layer. As a result, the falling ball absorption capacity of the support component 3 can be improved while reducing its thickness. Since the layers of the support component 3 can be made of lightweight materials and the thickness of the support component 3 is small, the weight of the support component 3 can be reduced.

[0059] like Figure 4 The diagram shown is a schematic representation of the interface mechanics model upon which this application's embodiment is based. The stack includes layer A and layer B. Layer A has a thickness of H1, a Poisson's ratio of μ1, and a modulus of E1. Layer B has a thickness of H2, a Poisson's ratio of μ2, and a modulus of E2. According to... Figure 4 It can be seen that the shear strain at the interface between layers A and B satisfies ε xy1 =ε xy2 ε can be obtained from Poisson's ratio. z2 =μ1ε z1 / μ2; the kinematic equation is H1dε1 / dt+H2dε2 / dt=vt, the dynamic equation is σ1dt=mdv, and the solution becomes:

[0060]

[0061] Therefore, the smaller E2 / E1 is, the larger μ2 / μ1 is, the larger H2 / H1 is, and the smaller the force on layer B is.

[0062] Based on the above conclusions, a curve graph is plotted as follows: Figure 5 As shown, where H1 = H2, μ1 = μ2. According to... Figure 5 It can be concluded that when the stacked structures satisfy the modulus order, the stress on display screen 1 is the minimum.

[0063] Figures 6-14 To verify the above conclusions through experimental testing, a subset of experimental and control groups were included. For each experimental or control group, the average value of the test results for one set of samples was used. Figure 6In the order of modulus, along the direction away from the display screen 1, the layers are EMBO+FOAM+PI+Cu in turn, and the tested ball drop buffering capacity is 31mm; Figure 7 Also in the order of modulus, Figure 7 The difference between Figure 6 is that the PI layer is removed, i.e. along the direction away from the display screen 1, the layers are EMBO+FOAM+Cu in turn, and the tested ball drop buffering capacity is 31.3mm; Figure 8 Not in the order of modulus, Figure 8 The difference between Figure 6 is that the PI layer is closest to the display screen 1, i.e. along the direction away from the display screen 1, the layers are PI+EMBO+FOAM+Cu in turn, and the tested ball drop buffering capacity is 30mm; Figure 9 Also in the order of modulus, Figure 9 The difference between Figure 6 is that the FOAM layer and the PI layer are removed, i.e. along the direction away from the display screen 1, the layers are EMBO+Cu in turn, and the tested ball drop buffering capacity is 20mm; Figure 10 Not in the order of modulus, Figure 10 The difference between Figure 9 is that the order of the two layers is exchanged, i.e. along the direction away from the display screen 1, the layers are Cu+EMBO in turn, and the tested ball drop buffering capacity is 15mm; Figure 11 Not in the order of modulus, along the direction away from the display screen 1, the layers are METAL+PSA+METAL in turn, and the tested ball drop buffering capacity is 12mm; Figure 12 Not in the order of modulus, along the direction away from the display screen 1, the layers are METAL+FOAM+METAL in turn, and the tested ball drop buffering capacity is 24mm; Figure 13 Not in the order of modulus, along the direction away from the display screen 1, the layers are FOAM+METAL+FOAM in turn, and the tested ball drop buffering capacity is 20mm; Figure 14 Not in the order of modulus, along the direction away from the display screen 1, the layers are FOAM+PET+FOAM in turn, and the tested ball drop buffering capacity is 30mm.

[0064] According to the actual test results, when the order of the layers is in the order of modulus, the ball drop buffering capacity is the highest, i.e. the stress on the display screen 1 is the smallest, and the order of modulus is suitable for the design of two-layer, three-layer, four-layer and other multi-layer stacking structures, and the actual test results are consistent with the theoretical conclusions.

[0065] Specifically, according to Figures 11-14 it can be seen that the ball drop buffering capacity of the layer structure not in the order of modulus is insufficient, generally within 30mm; and Figures 6-8The test results of the comparison between Figure 9 and Figure 10 can be obtained that the drop ball buffering capacity can be improved by using the stacking order of the modulus when the thickness is the same; according to the comparison between Figure 6 and Figure 7 , when the modulus order is used, the drop ball buffering capacity of the support assembly 3 can be improved while reducing the thickness of the support assembly 3 by selecting reasonable material types for matching.

[0066] With reference to Figure 3 , the support assembly 3 includes at least one buffer layer and at least one support layer, the modulus of the buffer layer is less than that of the support layer, and the buffer layer and the support layer are arranged in the direction away from the display screen 1; the support layer is made of a material with a higher modulus to increase the strength of the outer surface of the support assembly 3 and prevent damage such as scratching of the outer surface of the support assembly 3, and the impact energy can be uniformly dispersed through the support layer which is not easy to deform, thereby reducing the impact intensity received by the buffer layer; the buffer layer is made of a material with a lower modulus, and the buffer layer absorbs impact energy through elastic deformation, thereby reducing the impact energy transmitted to the surface of the display screen 1.

[0067] Further, the support assembly 3 includes a first buffer layer 32 and a second buffer layer 33, and the buffering capacity of the support assembly 3 is improved by the two buffer layers; the modulus of the first buffer layer 32 is less than that of the second buffer layer 33, and the first buffer layer 32 and the second buffer layer 33 are arranged in the direction away from the display screen 1, so that the impact energy can be absorbed layer by layer, and the buffering capacity of the first buffer layer 32 and the second buffer layer 33 can be fully utilized.

[0068] Further, the material of the first buffer layer 32 is foam (FOAM), which has a series of characteristics such as large elasticity, light weight, free bending, ultra-thin volume, and reliable performance, and the foam forms an isolation and protection effect on the surface of the support assembly 3 close to the display screen 1, thereby reducing the impact stress received by the display screen 1; the material of the second buffer layer 33 is polyurethane (TPU) or silicone gel, which can maintain elasticity for a long time within a relatively large stable range, can play a role in moisture-proof, shock-proof and insulation protection for electronic components, and can prolong the effective life of the support assembly 3.

[0069] Further, the support assembly 3 includes a first support layer 34 and a second support layer 35, and the uniformity of the distribution of impact energy in the support assembly 3 is improved by the two support layers, thereby avoiding excessive local pressure; the modulus of the first support layer 34 is less than that of the second support layer 35, and the first support layer 34 and the second support layer 35 are arranged in the direction away from the display screen 1, so that the impact can be uniformly distributed layer by layer, and the buffering capacity of the first support layer 34 and the second support layer 35 can be fully utilized.

[0070] Further, the material of the first support layer 34 is polyester (PET), glass fiber or polyimide (PI), that is, the material of the first support layer 34 is selected from hard polymer materials, which can form reliable support and reduce weight; the material of the second support layer 35 is metal, which can form a surface with high strength and prevent the surface of the support assembly 3 from being scratched.

[0071] Further, the support assembly 3 further comprises a first adhesive layer 31, which is located on the surface of the support assembly 3 close to the display screen 1, and the modulus of the first adhesive layer 31 is smaller than that of other layers, that is, the support assembly 3 is bonded to the surface of the display screen 1 through the first adhesive layer 31 with large elasticity, so that the first adhesive layer 31 can simultaneously play the roles of bonding and buffering, and the buffering performance of the support assembly 3 is improved.

[0072] Further, the adjacent layers are bonded through a second adhesive layer 36, and the modulus of the second adhesive layer 36 is between the modulus of the adjacent two layers, so that the second adhesive layer 36 and other layers of the support assembly 3 form a stacking order in sequence of modulus, so that the second adhesive layer 36 can fully play the role of buffering while playing the role of bonding, and the buffering performance of the support assembly 3 is improved.

[0073] Further, the thickness of the support assembly 3 is 0.1mm-0.3mm, for example, the thickness of the support assembly 3 can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm or 0.3mm, etc., which can not only meet the requirements of the ball drop buffering capacity of the support assembly 3, but also keep the thickness of the whole machine small, and realize the requirements of thinning and weight reduction of the whole machine. When the thickness of the support assembly 3 is less than 0.1mm, the thickness of the support assembly 3 is too small, and the thickness of each layer is small, which leads to small linear superposition of the ball drop capacity of each layer, so that the actual ball drop capacity of the support assembly 3 is difficult to meet the requirements; when the thickness of the support assembly 3 is greater than 0.3mm, although the support assembly 3 can have high ball drop buffering capacity, the thickness is too thick, which leads to increase of the thickness and weight of the whole machine, and it is difficult to realize the requirements of thinning and weight reduction of the whole machine.

[0074] To ensure a reasonable thickness match between the various layers and optimize the ball-dropping buffer capability of the support component 3 while maintaining a constant thickness, the embodiments of this application conducted experimental tests as follows: Along the direction away from the display screen 1, the layers of the support component 3 are sequentially: first layer EMB, second layer FOAM, and third layer Cu; with the total thickness of the support component 3 fixed, the thickness of each layer was allocated several times in different ways. After each allocation, the linear superposition of the ball-dropping capability of each individual layer was calculated (denoted as the individual superposition predicted value), and the ball-dropping capability of the support component 3 was measured (denoted as the experimental value); the set of individual superposition predicted values ​​and experimental values ​​that were closest among the multiple different thickness allocation methods was found, and a line graph was plotted as shown below. Figure 15 .

[0075] One set of specific experimental test results is shown in Table 1, where the total thickness of support component 3 is 0.22 mm. According to the data in Table 1, Scheme 1 is the set of predicted values ​​and experimental values ​​that are closest to those of the single-unit superposition. This set of data is plotted on... Figure 15 middle.

[0076] Table 1

[0077]

[0078] according to Figure 15 It can be seen that the upper limit of the ball drop buffering capacity of the support component 3 is approximately equal to the linear superposition of the ball drop capacity of each individual material layer. That is, the ball drop capacity of the support component 3 ≈ the linear superposition of the ball drop capacity of each individual layer. Thus, the principle of layer thickness allocation is formed. When the total thickness of the support component 3 is determined, the thickness of each layer can be allocated according to this formula to achieve the optimal design of the ball drop buffering capacity.

[0079] Specifically, the energy of the falling ball is gravitational potential energy, i.e., E = mgh, where m is the mass of the falling ball, g is the gravitational acceleration, and h is the height of the falling ball. It can be seen that the falling ball capacity is linearly related to the height. The total falling ball capacity of the stack is approximately equal to the linear sum of the falling ball capacities of each individual layer. This means that the energy absorbed by the stack is approximately equal to the linear sum of the energy that each individual layer can absorb. This also means that the buffering capacity of each layer is maximized, and the energy of each layer is completely absorbed and not transferred to the next layer. As a result, the impact energy cannot be transferred to the display screen 1, and thus the display screen 1 will not be damaged such as cracking.

[0080] Based on the above-mentioned principle of thickness distribution of the stack, the material and thickness distribution are optimized in the application, and compared with the conventional scheme, the thickness is reduced by 40% (for example, the thickness is reduced from 0.26 to 0.16), the buffering capacity is increased by 60% (for example, the buffering capacity is reduced from 55 cm to 88 cm), and the weight is reduced by 15%. Thus, the buffering capacity is improved while the thickness and weight are reduced, the screen reliability competitiveness is greatly improved, and the low reliability problem of the existing scheme is overcome.

[0081] Further, in the case where the total thickness of the support assembly 3 is determined, the thickness distribution of each stack can be determined by the following method: step S1, randomly distributing the thickness of each stack, and calculating the linear superposition of the drop ball capacity of each stack. Step S2, test the actual drop ball capacity of the support assembly 3, and compare whether the actual drop ball capacity is close to the linear superposition of the drop ball capacity of each stack (the range of the closeness can be set according to the actual buffering capacity requirement, for example, ±0.5mm, ±1mm, ±1.5mm, ±2mm, ±2.5mm or ±3mm, etc.). Step S3, when the actual drop ball capacity is close to the linear superposition of the drop ball capacity of each stack, it is determined that the thickness distribution of the stack meets the requirements, and the experiment is terminated; when the actual drop ball capacity is not close to the linear superposition of the drop ball capacity of each stack, it is determined that the thickness distribution of the stack does not meet the requirements, and step S4 is performed. Step S4, adjust the thickness of each stack, and perform steps S1-S3 again.

[0082] In an embodiment, the linear superposition of the single drop ball capacity of each stack -2mm≤drop ball capacity of the support assembly 3≤linear superposition of the single drop ball capacity of each stack+2mm, that is, the drop ball capacity of the support assembly 3 can be within the range of ±2mm of the linear superposition of the single drop ball capacity of each stack, which can not only realize the optimal design of the buffering capacity of the support assembly 3, but also avoid too many experimental times and increase the time cost and production cost.

[0083] Some specific embodiments provided by the application can be referred to as follows:

[0084] Embodiment one

[0085] As Figure 16As shown, the layers of the support component 3, along the direction away from the display screen 1, are as follows: OCA / EMBO, i.e., optical adhesive / mesh adhesive, used for bonding, with a thickness of 15μm to 150μm; FOAM, i.e., foam, used for cushioning, with a thickness of 50μm to 180μm; OCA / EMBO, i.e., optical adhesive / mesh adhesive, used for bonding, with a thickness of 15μm to 60μm; TPU / silicone gel, i.e., polyurethane / silicone gel, used for cushioning, with a thickness of 5μm to 60μm. The thickness of each layer is 0μm to 150μm; OCA / EMBO, i.e., optical adhesive / mesh adhesive, is used for bonding, with a thickness of 15μm to 60μm; PET / glass fiber / PI, i.e., polyester / glass fiber / polyimide, is a relatively rigid polymer film material used for support, with a thickness of 20μm to 100μm; OCA / EMBO, i.e., optical adhesive / mesh adhesive, is used for bonding, with a thickness of 15μm to 60μm; metal is used for support, with a thickness of 30μm to 70μm. This stacking order satisfies the modulus order, and the thickness of each layer can be specifically allocated according to the stacking thickness distribution principle. Not every layer in the support component 3 is necessary; it can be added or removed reasonably according to the actual situation. That is, the number of layers in the support component 3 can be 2, 3, 4, etc., as long as the stacking of each layer satisfies the modulus order. For example, some optional embodiments are as follows:

[0086] Example 2

[0087] like Figure 17 As shown, the layers of the support component 3, along the direction away from the display screen 1, are as follows: OCA / EMBO, i.e., optical adhesive / mesh adhesive, used for bonding, with a thickness of 100μm to 200μm; and metal, used for support, with a thickness of 30μm to 70μm. This stacking order satisfies the modulus order, and the thickness of each layer can be specifically allocated according to the stacking thickness allocation principle.

[0088] Example 3

[0089] like Figure 18 As shown, the layers of the support component 3, along the direction away from the display screen 1, are as follows: OCA / EMBO, i.e., optical adhesive / mesh adhesive, used for bonding, with a thickness of 15μm to 150μm; TPU / silicone gel, i.e., polyurethane / silicone gel, used for cushioning, with a thickness of 50μm to 150μm; OCA / EMBO, i.e., optical adhesive / mesh adhesive, used for bonding, with a thickness of 15μm to 60μm; and metal, used for support, with a thickness of 30μm to 70μm. This layer stacking order satisfies the modulus order, and the thickness of each layer can be specifically allocated according to the layer thickness allocation principle.

[0090] Example 4

[0091] like Figure 19As shown, each stack of the support assembly 3 in turn comprises, in the direction away from the display screen 1, OCA / EMBO, i.e. optical adhesive / grid adhesive, for bonding, with a thickness of 15 μm to 150 μm; TPU / silicone gel, i.e. polyurethane / silicone gel, for buffering, with a thickness of 50 μm to 150 μm; metal, for support, with a thickness of 30 μm to 70 μm. The metal is integrally formed with the TPU / silicone gel, so that no adhesive is required for bonding. The stacking order of the layers satisfies the order of modulus, and the thickness of each layer can be specifically allocated according to the principle of layer thickness allocation.

[0092] It should be noted that a portion of this patent application file contains material subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the Patent and Trademark Office patent file or records, but otherwise reserves all copyright rights whatsoever.

Claims

1. A support assembly for supporting a display screen, characterized in that, The support assembly includes a first adhesive layer, at least one buffer layer, and at least one support layer, wherein the at least one buffer layer includes a first buffer layer and a second buffer layer; The first adhesive layer is located on the surface of the support assembly near the display screen, and the modulus of the first adhesive layer is less than that of the first buffer layer; The modulus of the at least one buffer layer is less than the modulus of the at least one support layer, the at least one buffer layer and the at least one support layer are arranged in a direction away from the display screen, the modulus of the first buffer layer is less than the modulus of the second buffer layer, and the first buffer layer and the second buffer layer are arranged in a direction away from the display screen.

2. The support component according to claim 1, characterized in that, The material of the first buffer layer is foam.

3. The support component according to claim 1 or 2, characterized in that, The material of the second buffer layer is polyurethane or silicone gel.

4. The support component according to any one of claims 1-3, characterized in that, The thickness of the support component is 0.1mm to 0.3mm.

5. The support component according to any one of claims 1-4, characterized in that, The thickness of the first buffer layer is 50 μm to 180 μm; and / or, The thickness of the second buffer layer is 50 μm to 150 μm; and / or, At least one support layer has a thickness of 30μm to 70μm.

6. The support component according to any one of claims 1-5, characterized in that, Along the direction away from the display screen, the modulus of each layer in the support assembly gradually increases.

7. The support component according to any one of claims 1-5, characterized in that, The modulus of the first adhesive layer is less than the modulus of the other layers in the support assembly.

8. The support component according to any one of claims 1-7, characterized in that, The material of at least one support layer is metal.

9. The support component according to any one of claims 1-8, characterized in that, The support assembly further includes a second adhesive layer, through which the second buffer layer and the at least one support layer are bonded.

10. The support component according to any one of claims 1-7, characterized in that, The support component includes a first support layer and a second support layer, wherein the modulus of the first support layer is less than that of the second support layer, and the first support layer and the second support layer are arranged along a direction away from the display screen.

11. The support component according to claim 10, characterized in that, The material of the first support layer is polyester, glass fiber or polyimide.

12. The support component according to claim 10, characterized in that, The material of the second support layer is metal.

13. The support component according to any one of claims 1-8, characterized in that, The support component further includes a second adhesive layer, and the first buffer layer and the second buffer layer are bonded together by the second adhesive layer.

14. The support component according to claim 13, characterized in that, The modulus of the second adhesive layer is between that of the first buffer layer and the second buffer layer.

15. The support component according to any one of claims 1-14, characterized in that, The relationship between the ball-dropping capacity of the support component and the individual ball-dropping capacity of each of the stacks satisfies the following formula: the ball-dropping capacity of the support component ≈ the linear superposition of the individual ball-dropping capacities of each of the stacks.

16. The support component according to claim 15, characterized in that, The linear superposition of the individual ball-dropping capacity of each layer -2mm ≤ the ball-dropping capacity of the support component ≤ the linear superposition of the individual ball-dropping capacity of each layer +2mm.

17. A display module, characterized in that, The device includes a screen cover, a display screen, and a support assembly as described in any one of claims 1-16, wherein the screen cover is disposed on the light-transmitting side of the display screen, and the support assembly is used to support the display screen.

18. An electronic device, characterized in that, Includes the display module as described in claim 17.

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