A wafer clamping device

Abstract

This invention discloses a wafer clamping device, comprising: a wafer stage including a placement portion and a sliding portion; the placement portion being connected to the sliding portion; the placement portion having multiple concentrically arranged placement slots, the diameter of which increases sequentially from the inside out to accommodate wafers of different sizes; a first clamping portion and a second clamping portion disposed opposite to each other, both movably located on the sliding portion to clamp wafers of different diameters; the first clamping portion and the second clamping portion being close to each other, such that they have at least three contact points to clamp the wafer; and the first clamping portion and the second clamping portion being far apart to release the wafer. This invention can accommodate wafers of different sizes and improve wafer clamping reliability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a wafer clamping device. Background Technology

[0002] In the semiconductor manufacturing industry, wafer fabrication is a crucial step, involving multiple high-precision and highly complex processes such as photolithography, etching, deposition, and polishing. During these processes, reliable clamping devices must be used to secure the wafers to ensure they are processed according to pre-defined process requirements.

[0003] In existing technologies, wafers typically have large diameters, commonly 200mm and 300mm, while their thickness is relatively small. This structural characteristic makes wafers highly susceptible to external forces during processing, potentially leading to deformation or even damage, severely impacting wafer quality and subsequent use. Furthermore, in actual production, wafers of different sizes and models are encountered, placing higher demands on clamping devices. These devices must effectively prevent adverse effects from external forces while adapting to the clamping requirements of different wafer sizes and models. Existing clamping devices often fail to simultaneously meet these requirements in terms of adaptability and reliability.

[0004] Therefore, it is necessary to provide a new wafer clamping device to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The technical problem to be solved by this application is to provide a wafer clamping device that can adapt to wafers of different sizes and improve the reliability of wafer clamping.

[0006] To address the aforementioned technical problems, according to embodiments of this application, a wafer clamping device is provided, comprising:

[0007] A wafer stage includes a placement section and a sliding section; the placement section is connected to the sliding section; the placement section has multiple concentric placement slots, the diameter of which increases sequentially from the inside to the outside, to accommodate wafers of different sizes.

[0008] A first clamping part and a second clamping part are disposed opposite to each other, and both the first clamping part and the second clamping part are movably disposed on the sliding part to clamp wafers of different diameters; the first clamping part and the second clamping part are close to each other, so that there are at least three contact points between the first clamping part, the second clamping part and the wafer to clamp the wafer; the first clamping part and the second clamping part are far apart from each other to release the wafer;

[0009] The first clamping part includes a positioning part; the positioning part includes a first positioning element and a second positioning element;

[0010] The first positioning member is disposed on the moving part, and a passage is provided on the first positioning member; the first positioning member has an abutment surface, which is used to contact the planar portion of the edge of the wafer;

[0011] The second positioning member is movably disposed on the moving part so that the second positioning member contacts the notch at the edge of the wafer after passing through the passage.

[0012] By adopting the above technical solution, multiple placement slots are provided to accommodate wafers of different diameters. At the same time, the first clamping part and the second clamping part are movably located on the sliding part. Through the relative sliding of the first clamping part and the second clamping part, wafers of different sizes can be clamped. In addition, multiple wafers can be placed in any placement slot. The first clamping part and the second clamping part can cooperate to clamp multiple wafers at the same time, which facilitates the clamping and transfer process of wafers.

[0013] According to an embodiment of this application, the moving part is movably disposed on the sliding part; the positioning part is disposed on the moving part; the positioning part is used to contact the edge of the wafer to form at least one contact point to position the wafer.

[0014] According to an embodiment of this application, the second clamping part includes a moving part and a limiting part; the moving part is movably disposed on the sliding part; the limiting part is disposed on the moving part, and the limiting part forms at least two contact points with the edge of the wafer to position the wafer.

[0015] According to an embodiment of this application, the limiting part includes a limiting body and at least two limiting members; the limiting body is provided with a plurality of limiting holes, and each limiting member is detachably disposed in the corresponding limiting hole, and cooperates with the first clamping part to form at least three contact points to clamp the wafer.

[0016] According to an embodiment of this application, the sliding part is provided with a plurality of first locking holes;

[0017] The moving part includes a moving body and a locking member; the moving body has a plurality of second locking holes through it, and each first locking hole corresponds to a placement slot; the locking member passes through the first locking hole and the second locking hole to lock the moving part, so that the first clamping part and the second clamping part clamp the wafer in one of the placement slots respectively.

[0018] According to an embodiment of this application, the placement part is provided with a first sliding channel and a second sliding channel;

[0019] The first sliding channel is provided corresponding to the first clamping part, so that the first clamping part moves closer to or further away from the wafer in the radial direction of the wafer within the first sliding channel;

[0020] The second sliding channel is provided corresponding to the second clamping part, so that the second clamping part moves closer to or further away from the wafer in the radial direction of the wafer within the second sliding channel.

[0021] According to an embodiment of this application, the placement slot has a first region and a second region; the first region is disposed around the second region and the first region is used to hold the wafer.

[0022] According to an embodiment of this application, a plurality of weight-reducing holes are spaced apart on the first region, and at least a portion of the weight-reducing holes penetrate the placement portion along the axial direction of the placement groove.

[0023] According to an embodiment of this application, the sliding part is provided with a detection element to detect the position of the wafer in the placement slot; the moving part moves to a predetermined position according to the detection result of the detection element so that the positioning part cooperates with the limiting part to clamp the corresponding wafer. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the main structure of a wafer clamping device according to an embodiment of the present invention;

[0025] Figure 2 This is a top view of the main structure of a wafer clamping device according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram illustrating the positional relationship of a second positioning member that does not extend beyond the abutment surface, according to an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram showing the positional relationship of the second positioning member extending to the outside of the abutment surface according to an embodiment of the present invention;

[0028] Figure 5 This is a cross-sectional view of the main structure of a wafer clamping device according to an embodiment of the present invention;

[0029] Figure 6 This is a schematic diagram showing the distribution of the first and second regions when the placement slot has only a first slot and a second slot, according to an embodiment of the present invention.

[0030] Figure 7 This is a schematic diagram of the main structure of a wafer clamping device according to another embodiment of the present invention;

[0031] Figure 8 for Figure 7 Enlarged view of section A;

[0032] Figure 9 This is a schematic diagram of the structure of a wafer clamping device according to an embodiment of the present invention when clamping a wafer;

[0033] Figure 10 This is a top view of the structure of a movable part according to an embodiment of the present invention.

[0034] Figure label:

[0035] 100. Wafer stage; 110. Placement part; 111. Placement slot; 112. First sliding channel; 113. Second sliding channel; 114. First region; 115. Second region; 116. Weight reduction hole; 120. Sliding part; 121. First locking hole; 122. Detection element; 200. First clamping part; 210. Positioning part; 211. First positioning element; 212. Second positioning element; 213. Through channel; 214. Abutment surface; 300. Second clamping part; 310. Limiting part; 311. Limiting body; 312. Limiting hole; 313. Limiting element; 400. Moving part; 410. Moving body; 411. Second locking hole; 420. Locking element. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0037] The following is in conjunction with the appendix Figure 1-10 The specific embodiments of the present invention will be further described in detail below.

[0038] An embodiment of the present invention provides a wafer clamping device for clamping a wafer, wherein the wafer clamping device includes:

[0039] The wafer stage 100 includes a placement part 110 and a sliding part 120; the placement part 110 is connected to the sliding part 120; a plurality of concentric placement slots 111 are formed on the placement part 110, and the diameter of the plurality of placement slots 111 increases from the inside to the outside to support wafers of different sizes.

[0040] The first clamping part 200 and the second clamping part 300 are disposed opposite to each other, and both the first clamping part 200 and the second clamping part 300 are movably disposed on the sliding part 120 to clamp wafers of different diameters; the first clamping part 200 and the second clamping part 300 are close to each other, so that there are at least three contact points between the first clamping part 200, the second clamping part 300 and the wafer to clamp the wafer; the first clamping part 200 and the second clamping part 300 are far apart from each other to release the wafer.

[0041] In some embodiments, the wafer stage 100 serves a load-bearing function, primarily for supporting the wafer. Specifically, the wafer stage 100 includes a placement portion 110 and a sliding portion 120 connected to each other. The placement portion 110 can be circular, square, or other shapes, without limitation, as long as it can support the wafer. In this embodiment, a circular placement portion 110 is used as an example.

[0042] In some specific embodiments, the sliding portion 120 can be disposed on both sides of the placement portion 110 or at the bottom of the placement portion 110, so as to enable the first clamping portion 200 and the second clamping portion 300 to clamp or release the wafer relative to the sportswear on the sliding portion 120. In this embodiment, the sliding portion 120 is disposed at the bottom of the placement portion 110, and its specific arrangement will be described later.

[0043] In some embodiments, to accommodate wafers of different sizes, placement slots 111 are provided on the placement portion 110; wherein each placement slot 111 has a different diameter. Specifically, to facilitate wafer placement, the placement slots 111 are circular, and multiple placement slots 111 are concentrically arranged, meaning their axes coincide. To facilitate wafer placement, the multiple placement slots 111 are arranged to gradually move away from the bottom of the placement portion 110 from the inside out; simultaneously, the diameters of the multiple placement slots 111 increase sequentially from the inside out, facilitating the placement of wafers of different sizes; for example, the uppermost placement slot 111 can hold larger wafers, the middle placement slots 111 can hold smaller wafers, and the bottommost placement slot 111 can hold the smallest wafers.

[0044] In some embodiments, to facilitate wafer clamping, the first clamping part 200 and the second clamping part 300 are provided to move away from or close to each other on the sliding part 120, and their specific moving structures are described later.

[0045] In some embodiments, the placement slot 111 has a first region 114 and a second region 115; the first region 114 is disposed around the second region 115 and the first region 114 is used to hold a wafer.

[0046] In some embodiments, to facilitate the placement of wafers of different sizes, the placement slot 111 is divided into a first region 114 and a second region 115. Specifically, if there is only one placement slot 111, the bottom of the placement slot 111 is flat, and the entire bottom surface of the placement slot 111 can contact the wafer. Therefore, the entire bottom surface of the placement slot 111 is the first region 114. In order to prevent the wafer from sticking to the entire bottom surface of the placement slot 111, making it difficult to remove the wafer, a hole or slot can be opened on the bottom surface of the placement slot 111 to form the second region 115, thereby reducing the possibility of the wafer sticking to the entire bottom surface of the placement slot 111 and making it difficult to remove the wafer. In this embodiment, for ease of understanding, two adjacent placement slots 111 are defined as the first slot 1111 and the second slot 1112, respectively. That is, the second slot 1112 is opened on the bottom surface of the first slot 1111. At this time, the part of the bottom surface of the first slot 1111 where the second slot 1112 is opened is the second region 115, and the region where the second slot 1112 is not opened is the first region 114. Other slots are opened at the bottom of the second slot 1112, and the principle of the first region 114 and the second region 115 is the same as that of the first slot 1111. It is worth noting that when the second slot 1112 is the bottommost slot, the second region 115 can still be formed by opening slots on the bottom surface of the second slot 1112. At this time, the slots opened on the bottom surface of the second slot 1112 are no longer used to place wafers.

[0047] In some embodiments, the placement part 110 is provided with a first sliding channel 112 and a second sliding channel 113;

[0048] The first sliding channel 112 is provided corresponding to the first clamping part 200 so that the first clamping part 200 moves closer to or further away from the wafer along the radial direction of the wafer within the first sliding channel 112;

[0049] The second sliding channel 113 is provided corresponding to the second clamping part 300 so that the second clamping part 300 moves closer to or further away from the wafer along the radial direction of the wafer within the second sliding channel 113.

[0050] In some embodiments, to facilitate the movement of the first clamping part 200 and the second clamping part 300, a first sliding channel 112 and a second sliding channel 113 are also provided on the placement part 110. Since the sliding part 120 is located at the bottom of the placement part 110, in order to facilitate the movement of the first clamping part 200 and the second clamping part 300, the first sliding channel 112 and the second sliding channel 113 are provided to pass through the placement part 110 along the axial direction of the placement groove 111, so that the first clamping part 200 can enter the first sliding channel 112 when sliding and move within the first sliding channel 112, approaching or moving away from the middle of the placement part 110; the second clamping part 300 can enter the second sliding channel 113 when sliding and move within the second sliding channel 113, approaching or moving away from the middle of the placement part 110.

[0051] In some specific embodiments, the first sliding channel 112 extends radially from the outside of the placement portion 110 towards the center of the placement groove 111, and the first sliding channel 112 communicates with multiple placement grooves 111, allowing the first clamping portion 200 to cooperate with the second clamping portion 300 to clamp the wafer placed in the bottommost placement groove 111. The second sliding channel 113 extends radially from the outside of the placement portion 110 towards the center of the placement groove 111, and the second sliding channel 113 communicates with multiple placement grooves 111, allowing the second clamping portion 300 to cooperate with the first clamping portion 200 to clamp the wafer placed in the bottommost placement groove 111.

[0052] In some embodiments, a plurality of weight-reducing holes 116 are spaced apart on the first region 114, and at least some of the weight-reducing holes 116 penetrate the placement portion 110 along the axial direction of the placement groove 111.

[0053] In some embodiments, in order to reduce the weight of the placement part 110 and facilitate its movement, a plurality of weight-reducing holes 116 are provided on the first region 114 of each placement slot 111, and the plurality of weight-reducing holes 116 are distributed circumferentially around the first region 114. By providing the weight-reducing holes 116, the weight of the placement part 110 is effectively reduced. In addition, the weight-reducing holes 116 can also provide a gripping position, making the device more convenient to use.

[0054] In some specific embodiments, some of the weight-reducing holes 116 penetrate the placement portion 110 along the axial direction of the placement groove 111 to form a through groove; the remaining weight-reducing holes 116 extend along the placement groove 111 to the middle of the placement portion 110 to form a semi-through groove.

[0055] In some specific embodiments, all weight-reducing holes 116 penetrate the placement portion 110 along the axial direction of the placement groove 111, forming a through groove.

[0056] The first clamping part 200 includes a moving part 400 and a positioning part 210; the moving part 400 is movably disposed on the sliding part 120; the positioning part 210 is disposed on the moving part 400; the positioning part 210 is used to contact the edge of the wafer to form at least one contact point to position the wafer.

[0057] In some embodiments, the first clamping part 200 positions the wafer, and the second clamping part 300 limits the wafer. The positioning part 210 is disposed on the moving part 400, and its placement method can be adhesive, bolted, or integrally formed, etc., without limitation, provided that the position of the positioning part 210 on the moving part 400 does not change, and that the positioning part 210 can move synchronously with the moving part 400.

[0058] In some specific embodiments, the positioning part 210 can contact the edge of the wafer to form at least one contact point to achieve wafer positioning; in addition, the positioning part 210 cooperates with the second clamping part 300 to form at least three contact points to clamp the wafer.

[0059] In some embodiments, the positioning part 210 includes a first positioning member 211 and a second positioning member 212;

[0060] The first positioning member 211 is provided on the moving part 400, and the first positioning member 211 has a passage channel 213; the first positioning member 211 has an abutment surface 214, which is used to contact the planar portion of the edge of the wafer.

[0061] The second positioning member 212 is movably disposed on the moving part 400 so that the second positioning member 212 passes through the passage 213 and contacts the notch at the edge of the wafer.

[0062] In some embodiments, the positioning part 210 is used to position the wafer; specifically, in order to facilitate adaptation to different wafers, the positioning part 210 is provided to include a first positioning member 211 and a second positioning member 212.

[0063] In some specific embodiments, the first positioning member 211 is fixedly disposed at the end of the moving part 400. Its fixing method can be adhesive bonding, bolt fixing, or integral molding, etc., without limitation, as long as the position of the first positioning member 211 on the moving part 400 does not change. The first positioning member 211 has an abutment surface 214; specifically, the abutment surface 214 is the end face of the first positioning member 211 facing the center of the placement part 110. The first positioning member 211 moves with the moving part 400 towards the center of the placement part 110, thereby abutting against the plane of the wafer's edge to achieve wafer positioning. It is worth noting that the contact between the abutment surface 214 and the plane of the wafer's edge is considered a single contact point. Therefore, by providing the first positioning member 211, wafers with planar edges can be positioned.

[0064] In some specific embodiments, in addition to wafers with planar edges, there are also wafers with notched edges. When the placed wafer is a wafer with notched edges, the first positioning member 211 and the abutment surface 214 cannot be accurately positioned. Therefore, a second positioning member 212 is provided. Specifically, the first positioning member 211 has a passage channel 213 that passes through the first positioning member 211 along its movement direction. The second positioning member 212 is movably disposed in the moving part 400 and can move through the passage channel 213. That is, the second positioning member 212 can move in the passage channel 213, allowing it to move closer to or away from the wafer. In the initial state, the end of the second positioning member 212 does not extend to the abutment surface 214, meaning that the first positioning member 211 can position the wafer with a planar edge. When it is necessary to position the wafer with a notch on the edge, the second positioning member 212 is controlled to move on the moving part 400, so that the end of the second positioning member 212 extends to the outside of the abutment surface 214. At this time, the end of the second positioning member 212 can cooperate with the notch on the edge of the wafer, thereby positioning the wafer.

[0065] In some more specific embodiments, the movement of the second positioning element 212 is manually controlled, that is, the second positioning element 212 is manually pushed to move in the passage channel 213 to bring it closer to or away from the wafer.

[0066] In some more specific embodiments, the movement of the second positioning member 212 is automatically controlled, for example, by providing a driving member, such as an electric cylinder or a pneumatic cylinder, on the moving body 410, so that its piston rod is connected to the second positioning member 212, so that when the electric cylinder or the pneumatic cylinder is activated, the second positioning member 212 is pushed closer to the wafer.

[0067] In some specific embodiments, the end of the second positioning member 212 is provided with two abutting guide surfaces, which reduces the width of the end of the second positioning member 212 so as to cooperate with the notch at the edge of the wafer to achieve wafer positioning.

[0068] In some specific embodiments, the end of the second positioning member 212 is provided with an abutment member, and the end of the abutment member has two abutment guide surfaces, so that the width of the end of the abutment member is reduced, so that the abutment member can cooperate with the notch at the edge of the wafer to achieve wafer positioning.

[0069] In some embodiments, the distance from the bottom of the uppermost placement slot 111 to the bottom of the lowermost placement slot 111 of the placement section 110 is defined as the placement distance; the height of the first positioning member 211 is greater than or equal to the placement distance; the height of the second positioning member 212 is greater than or equal to the placement distance; the first positioning member 211 and / or the second positioning member 212 can position the wafer in any placement slot 111.

[0070] In some embodiments, the second clamping part 300 includes a moving part 400 and a limiting part 310; the moving part 400 is movably disposed on the sliding part 120; the limiting part 310 is disposed on the moving part 400, and the limiting part 310 forms at least two contact points with the edge of the wafer to position the wafer.

[0071] In some embodiments, the movable part 400 in the second clamping part 300 is the same as the movable part 400 in the first clamping part 200, which will be described in detail later.

[0072] In some embodiments, the limiting part 310 is disposed on the moving part 400 and is capable of moving the moving part 400. At the same time, the limiting part 310 forms at least two contact points with the edge of the wafer, so that the limiting part 310 and the positioning part 210 together form at least three contact points to clamp the wafer and improve the stability of wafer clamping.

[0073] In some embodiments, the limiting part 310 includes a limiting body 311 and at least two limiting members 313; the limiting body 311 has a plurality of limiting holes 312, and each limiting member 313 is detachably disposed in the corresponding limiting hole 312, and cooperates with the first clamping part 200 to form at least three contact points to clamp the wafer. For example, five sets of limiting holes 312 are provided, each set containing two limiting holes 312, and the five sets are designated as the first set, the second set, the third set, the fourth set, and the fifth set from the inside out; the center interval of the symmetrically arranged limiting holes 312 in the first set is 45mm; the center interval of the symmetrically arranged limiting holes 312 in the second set is 70mm; the center interval of the symmetrically arranged limiting holes 312 in the third set is 110mm; the center interval of the symmetrically arranged limiting holes 312 in the fourth set is 150mm; and the center interval of the symmetrically arranged limiting holes 312 in the fifth set is 190mm; the diameter of the limiting hole 312 is 4mm, and the distance from the center of the limiting hole 312 to the end face of the limiting body 311 near the wafer is 4mm.

[0074] In some embodiments, to facilitate wafer positioning, the positioning portion 310 includes a positioning body 311 and at least two positioning members 313. The positioning body 311 is fixedly mounted on the moving portion 400, and a plurality of positioning holes 312 are formed on the positioning body 311. The positioning holes 312 are used for the positioning members 313 to pass through. During the positioning process, the positioning members 313 contact the edge of the wafer, forming contact points. Specifically, for wafer clamping stability, at least two positioning members 313 are provided to cooperate with the first clamping portion 200 to form at least three contact points.

[0075] In some specific embodiments, taking the setting of two limiting members 313 as an example, the two limiting members 313 are distributed on both sides of the sliding part 120, thereby reducing the possibility of unstable clamping caused by the three contact points being all within the same half of the wafer due to the two limiting members 313 being located on the same side of the sliding part 120. In some more specific embodiments, the two limiting members 313 are symmetrically arranged to ensure the balance of wafer clamping and avoid wafer deformation or damage due to uneven clamping force.

[0076] In some specific embodiments, the length direction of the limiting body 311 extends in a direction perpendicular to the movement of the moving part 400, and a plurality of limiting holes 312 are evenly distributed along the length direction of the limiting body 311. By adjusting the limiting members 313 in different limiting holes 312, the interval between the relatively arranged limiting members 313 is adjusted so that the two limiting members 313 can contact the edges of wafers with different diameters, thus improving the problem that the two limiting members 313 cannot contact the edges of wafers with smaller diameters due to the excessively large interval between them.

[0077] In some more specific embodiments, the multiple limiting holes 312 can also be evenly distributed at intervals along both the length and width of the limiting body 311; thus forming a matrix on the limiting body 311, so as to facilitate the setting of multiple limiting members 313, allowing the multiple limiting members 313 to simultaneously contact the edge of the wafer to form multiple contact points, thereby further improving the stability of wafer clamping.

[0078] In some specific embodiments, the opening position of each limiting hole 312 corresponds to the edge of the wafer, so that the limiting member 313 passing through the limiting hole 312 can correspond to the edge of the wafer, thereby improving the problem that the limiting member 313 cannot be passed through the limiting hole 312 due to the wafer covering part of the limiting hole 312, thus making it impossible to perform limiting.

[0079] In some more specific embodiments, the upper end face of the limiting body 311 is lower than the bottom wall of the lowest placement groove 111; so that when a wafer is placed in the lowest placement groove 111, the limiting body 311 will not collide with the wafer during movement, thereby reducing the possibility of the wafer being damaged.

[0080] In some more specific embodiments, the position of the limiting member 313 in the limiting hole 312 is adjustable. For example, the limiting member 313 is threadedly connected to the limiting hole 312. By adjusting the protrusion height of the limiting member 313 in the limiting hole 312, the position of the top of the limiting member 313 can be adjusted, so that the limiting member 313 can be adapted to wafers placed in different placement slots 111.

[0081] In some more specific embodiments, the limiting member 313 includes a positioning section and an extension section. Both the positioning section and the extension section have circular cross-sections, and the diameter of the positioning section is smaller than that of the extension section. Meanwhile, the diameter of the extension section is larger than that of the limiting hole 312, so that after the positioning section is placed in the limiting hole 312, the bottom of the extension section abuts against the end face of the limiting body 311. At this time, the height of the extension section is higher than the bottom wall of the topmost placement groove 111, so that the limiting member 313 can adapt to the wafers placed in different placement grooves 111.

[0082] In some more specific embodiments, the top surface of the movable part 400 used for mounting the limiting part 310 is lower than the bottom wall of the lowest placement groove 111; so that when a wafer is placed in the lowest placement groove 111, the movable part 400 will not collide with the wafer during movement, thereby reducing the possibility of the wafer being damaged.

[0083] In some embodiments, the sliding portion 120 is provided with a plurality of first locking holes 121;

[0084] The moving part 400 includes a moving body 410 and a locking member 420; the moving body 410 has a plurality of second locking holes 411 through it, and each first locking hole 121 corresponds to a placement slot 111; the locking member 420 passes through the first locking hole 121 and the second locking hole 411 to lock the moving part 400, so that the first clamping part 200 and the second clamping part 300 respectively clamp the wafer in one of the placement slots 111.

[0085] In some embodiments, the locking member 420 is threadedly connected to the first locking hole 121.

[0086] In some embodiments, the locking member 420 is threadedly connected to the second locking hole 411.

[0087] In some embodiments, the locking member 420 is threadedly connected to both the first locking hole 121 and the second locking hole 411.

[0088] In some embodiments, in order to facilitate the movement of the moving part 400 on the sliding part 120, the length of the sliding part 120 is set to be greater than the diameter of the placement part 110, thereby minimizing the possibility of the first clamping part 200 or the second clamping part 300 colliding with the wafer.

[0089] In some specific embodiments, in order to facilitate the adjustment of the positions of the first clamping part 200 and the second clamping part 300, a plurality of first locking holes 121 are provided on the sliding part 120, and the plurality of first locking holes 121 are evenly spaced on the sliding part 120; and each placement groove 111 has two corresponding first locking holes 121, so that when the first clamping part 200 and the second clamping part 300 are in the positions of the two first locking holes 121, the positioning part 210 and the limiting part 310 correspond to the corresponding placement groove 111, and clamp the wafer in the corresponding placement groove 111.

[0090] In some more specific embodiments, in order to facilitate the correspondence between the moving body 410 and the first locking hole 121, a second locking hole 411 is provided on the moving body 410. The second locking hole 411 penetrates the moving body 410 along the thickness direction, and the axis of the second locking hole 411 is on the same plane as the axis of the first locking hole 121. When the moving body 410 moves to the corresponding first locking hole 121, the locking member 420 is simultaneously inserted into the second locking hole 411 and the first locking hole 121. At this time, the moving body 410 cannot continue to move on the sliding part 120, that is, the moving body 410 is positioned. At the same time, the positions of the positioning part 210 and the limiting part 310 corresponding to the moving body 410 are fixed.

[0091] It is worth noting that, since the height of the first positioning member 211 is greater than the placement distance, the height of the second positioning member 212 is greater than the placement distance, and the height of the limiting member 313 is higher than the bottom wall of the top placement slot 111, the placement member can simultaneously hold multiple wafers. For example, multiple wafers of the same size can be placed in the top placement slot 111. The first positioning member 211 or the second positioning member 212 cooperates with the limiting member 313 to simultaneously position and clamp multiple wafers, thereby enabling the placement part 110 to act as a wafer storage device. In addition, the transfer placement part 110 can simultaneously transfer multiple wafers, enabling the placement part 110 to also act as a wafer transfer device.

[0092] In some embodiments, the sliding part 120 is provided with a detection element 122 to detect the position of the wafer in the placement groove 111; the moving part 400 moves to a predetermined position according to the detection result of the detection element 122 so that the positioning part 210 and the limiting part 310 cooperate to clamp the corresponding wafer.

[0093] In some embodiments, a detection element 122 is provided on the sliding part 120. The detection element 122 can detect the position of the wafer in the placement slot 111, thereby determining which placement slot 111 the wafer is placed in. Specifically, the detection element 122 is a distance sensor, which can detect the distance from the wafer to the detection element 122. This is prior art and will not be described in detail here.

[0094] In some specific embodiments, the sliding part 120 is equipped with a driving component, which is a servo electric cylinder. This is not limited here, as long as it can drive the moving part 400 to move. Specifically, when the detection component 122 detects the position of the wafer in the placement slot 111, it transmits the wafer position signal to the servo electric cylinder (the signal transmission method is conventional and will not be elaborated here); the servo electric cylinder is activated, controlling the second locking hole 411 on the moving part 400 to move to the corresponding first locking hole 121; thereby facilitating precise control of the first clamping part 200 and the second clamping part 300. It is worth noting that when a driving component is provided, a locking component 420 can be provided or not; this is not limited here, as long as the wafer can be accurately clamped. More specifically, the driving component and the driving component cooperate to achieve more precise wafer positioning.

[0095] The implementation principle of a wafer clamping device according to an embodiment of this application is as follows: wafers of different diameters are placed in corresponding placement slots 111; after the wafers are placed, the first clamping part 200 is first controlled to move toward the wafer to achieve wafer positioning; specifically, when the edge of the wafer is flat, the position of the second positioning member 212 is fixed, and the end of the second positioning member 212 will not extend outside the abutment surface 214. At this time, the abutment surface 214 of the first positioning member 211 can abut against the flat edge of the wafer, thereby achieving wafer positioning; when the edge of the wafer has a notch, the second positioning member 212 is controlled to move, so that the end of the second positioning member 212 extends to the abutment surface 214. Outside the interface 214, the end of the second positioning member 212 can engage with the notch on the edge of the wafer to achieve wafer positioning. After wafer positioning, the second clamping part 300 is controlled to move towards the wafer, and the position of the limiting member 313 in the limiting hole 312 is adjusted so that the edge of the limiting hole 312 abuts against the edge of the wafer, thereby forming at least three contact points to complete wafer clamping. This allows for clamping of wafers of different sizes and models, effectively preventing external forces from adversely affecting the wafer, adapting to the clamping requirements of wafers of different sizes and models, and simultaneously clamping multiple wafers during transport. The wafer clamping device is highly adaptable, and through the cooperation of the first clamping part 200, the second clamping part 300, and multiple positioning holes, the device can adapt to wafers of different sizes and models, improving the device's versatility. The wafer clamping device provides reliable clamping. The first positioning element 211 and the second positioning element 212 in the first clamping part 200 can initially position the wafer. Combined with the limiting element 313 in the second clamping part 300, this ensures stable clamping of the wafer and effectively avoids wafer deformation or damage caused by external forces. The wafer clamping device has a reasonable structure. Multiple placement slots 111 further enhance the clamping effect on wafers of different sizes. The weight-reducing holes 116 reduce the weight of the device and provide gripping positions, making the device more convenient to use.

[0096] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A wafer chucking device characterized by comprising: The utility model relates to a wafer carrier (100) including a placing part (110) and a sliding part (120), the placing part (110) is connected with the sliding part (120), a plurality of concentric placing grooves (111) are set up on the placing part (110), the diameter of a plurality of the placing grooves (111) increases gradually from inside to outside to bear different size wafers, a first clamping part (200) and a second clamping part (300) are oppositely arranged, the first clamping part (200) and the second clamping part (300) are movably arranged in the sliding part (120) to clamp the wafers of different diameters, the first clamping part (200) and the second clamping part (300) are close to each other, at least one contact point is formed between the first clamping part (200) and the wafer, at least two contact points are formed between the second clamping part (300) and the wafer to clamp the wafer, the first clamping part (200) and the second clamping part (300) are away from each other to release the wafer, the first clamping part (200) includes a first moving part (400) and a positioning part (210), the first moving part (400) is movably arranged in the sliding part (120), the positioning part (210) is arranged in the first moving part (400), the positioning part (210) is used for contacting the edge of the wafer to form the at least one contact point to position the wafer, the positioning part (210) includes a first positioning member (211) and a second positioning member (212), the first positioning member (211) is arranged in the first moving part (400), and a through channel (213) is formed in the first positioning member (211), the first positioning member (211) has an abutting surface (214) for contacting the flat part of the edge of the wafer, the second positioning member (212) is movably arranged in the first moving part (400) to contact the notch of the edge of the wafer after passing through the through channel (213), the second clamping part (300) includes a second moving part (400) and a limiting part (310), the second moving part (400) is movably arranged in the sliding part (120), the limiting part (310) is arranged in the second moving part (400), and the limiting part (310) forms the at least two contact points with the edge of the wafer to position the wafer, the limiting part (310) includes a limiting main body (311) and at least two limiting members (313), a plurality of limiting holes (312) are formed in the limiting main body (311), each limiting member (313) is detachably arranged in the corresponding limiting hole (312), and at least three contact points are formed with the first clamping part (200) to clamp the wafer, a plurality of first locking holes (121) are formed in the sliding part (120). ​ ​ ​ ​ ​ 2. The wafer chucking apparatus according to claim 1, wherein ​ 3. The wafer chucking apparatus according to claim 2, wherein ​ 4. The wafer chucking apparatus according to claim 2, wherein ​ The first moving part (400) and the second moving part (400) each comprise a moving body (410) and a locking piece (420); a plurality of second locking holes (411) are formed through the moving body (410); each first locking hole (121) corresponds to a placement slot (111); the locking piece (420) is arranged in the first locking hole (121) and the second locking hole (411) to lock the corresponding first moving part (400) or the second moving part (400), so that the first clamping part (200) and the second clamping part (300) correspondingly clamp the wafer in one of the placement slots (111).

5. The wafer chucking apparatus according to claim 1, wherein The placement part (110) is provided with a first sliding channel (112) and a second sliding channel (113); The first sliding channel (112) is arranged corresponding to the first clamping part (200), so that the first clamping part (200) is close to or away from the wafer along the radial direction of the wafer in the first sliding channel (112); The second sliding channel (113) is arranged corresponding to the second clamping part (300), so that the second clamping part (300) is close to or away from the wafer along the radial direction of the wafer in the second sliding channel (113).

6. The wafer chucking apparatus of claim 1, wherein The placement slot (111) has a first area (114) and a second area (115); the first area (114) is arranged around the second area (115) and is used for carrying the wafer.

7. The wafer chucking apparatus according to claim 6, wherein A plurality of lightening holes (116) are arranged on the first area (114) at intervals, and at least part of the lightening holes (116) penetrate the placement part (110) along the axial direction of the placement slot (111).

8. The wafer chucking apparatus according to claim 2, wherein The sliding part (120) is provided with a detection piece (122) for detecting the position of the wafer in the placement slot (111); the first moving part (400) or the second moving part (400) moves to a predetermined position according to the detection result of the detection piece (122) so that the positioning part (210) and the limiting part (310) cooperate to clamp the corresponding wafer.

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