Plasma radiator array and radiating method
By designing a plasma heat sink array, the array arrangement of vibrating electrode films and needle-like structures, along with the formation of an electric field and asynchronous vibrations, generates an ion wind for heat dissipation. This solves the problem of effectively cooling high-temperature targets in small areas and with low noise in existing technologies, achieving a highly efficient heat dissipation effect.
Patent Information
- Application Number
- CN202511096658.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-06
- Publication Date
- 2025-11-18
AI Technical Summary
Existing technologies struggle to effectively cool high-temperature targets in small areas with low noise. Fan radiators are bulky and noisy, while existing plasma jet cooling methods are ineffective.
A plasma heat sink array is employed, comprising a substrate, a needle-like structure group, a vibrating electrode film, and a circuit module. The array arrangement of the vibrating electrode film and the needle-like structure group, along with the formation of an electric field and the different rhythmic vibrations of the vibrating electrode film, generates an ion wind for heat dissipation.
It achieves efficient cooling with a small area and low noise, avoids gas discharge instability in the cooling unit, and improves heat dissipation.
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Figure CN120977970A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of heat dissipation, in particular to a plasma radiator array and a heat dissipation method. BACKGROUND
[0002] With the continuous improvement of the function of signal processing devices represented by integrated circuit chips, the power density is getting higher and higher, and the heat dissipation problem has become a key factor restricting the further development of integrated circuit chips. At the same time, with the increasing requirement of the existing technology for the integration of integrated circuit chips, the area of integrated circuit chips needs to be further reduced. A current heat dissipation method is to achieve heat dissipation by blowing the high-temperature target through a fan. However, the fan is large in size and difficult to achieve heat dissipation in a small area, and the fan is prone to generate noise. Another current heat dissipation method is to achieve cooling of the high-temperature target by blowing the high-temperature target with a plasma jet formed by gas discharge. However, the wind of the plasma jet generated by the existing plasma generating structure is small, and it is difficult to effectively cool the high-temperature target.
[0003] Therefore, how to effectively cool the high-temperature target in a small area and with low noise has become a technical problem to be solved by the existing technology. SUMMARY
[0004] The technical problem solved by the present application is to provide a plasma radiator array and a heat dissipation method. The plasma radiator array of the present application can achieve effective heat dissipation in a small area and with low noise.
[0005] According to a first aspect of the present application, the technical solution of the present application provides a plasma radiator array, comprising: a substrate; a plurality of cooling units, the cooling unit comprising a corresponding needle structure group and a vibrating electrode film, the vibrating electrode film being suspended relative to the needle structure group, the vibrating electrode film and the needle structure group having a space containing gas therebetween, the needle structure group comprising a plurality of needle structures arranged in an array, the needle structures being located on the substrate, and at least part of the needle structure group being located within the projection range of the vibrating electrode film on the surface of the substrate, the needle structure group and the substrate forming a discharge electrode, the vibrating electrode film comprising a driving layer, a piezoelectric layer and a substrate layer stacked in sequence, the spacing between the substrate layer and the substrate being smaller than the spacing between the driving layer and the substrate, and the substrate layer being grounded; a vibrating electrode support, the vibrating electrode support being located on both sides of the vibrating electrode film, and the edges of the vibrating electrode film being fixed between the vibrating electrode supports; The circuit module comprises a plurality of first output terminals and a second output terminal, each of the first output terminals is coupled to a driving layer of a cooling unit, and the second output terminal is coupled to the substrate, the circuit module is configured to output first and second alternating current voltage signals with different phases to the driving layers of any two adjacent vibrating electrode films in the cooling units respectively, so that the driven two adjacent vibrating electrode films vibrate in different steps in the direction perpendicular to the substrate, and the circuit module is further configured to output a first voltage signal to the substrate to form an electric field between the vibrating electrode film and the discharge electrode of each cooling unit.
[0006] Optionally, the circuit module is configured to output first and second alternating current voltage signals with opposite phases to the driving layers of any two adjacent vibrating electrode films in the cooling units respectively, so that the driven two adjacent vibrating electrode films vibrate in opposite phases in the direction perpendicular to the substrate.
[0007] Optionally, the voltage amplitude of the first alternating current voltage signal is 0V-2000V, the voltage amplitude of the second alternating current voltage signal is 0V-2000V, the frequency of the first alternating current voltage signal is greater than 20kHz, and the frequency of the second alternating current voltage signal is greater than 20kHz.
[0008] Optionally, the cooling unit further comprises a vertical nanowire fixed to the needle-shaped structure and spaced between the vibrating electrode film and the vertical nanowire.
[0009] Optionally, the material of the substrate layer is stainless steel or hastelloy; The material of the driving layer is a conductive metal; The material of the piezoelectric layer is a piezoelectric material.
[0010] Optionally, the piezoelectric material comprises organic piezoelectric composite material and / or inorganic ceramic; The organic composite piezoelectric material comprises poly(vinylidene fluoride-trifluoroethylene-chlorotrifluoroethylene) and polyvinylidene fluoride; The inorganic ceramic comprises lead zirconate titanate and / or aluminum nitride.
[0011] Optionally, the vibrating electrode support comprises a support main body and a support connecting portion, the support connecting portion extends from the support main body to the substrate, one end of the support connecting portion is connected to the support main body, and the vibrating electrode film is fixed to the other end of the support connecting portion.
[0012] According to a second aspect of the present application, the technical solution of the present application provides a heat dissipation method applied to the plasma radiator array, the method comprising: continuously applying a first voltage signal to the substrate and continuously applying a first alternating voltage signal and a second alternating voltage signal to the driving layer in two adjacent cooling units, the method comprising: making the voltage of the first voltage signal equal to a first air discharge threshold voltage, the first air threshold voltage being a minimum voltage required to be applied to the substrate to enable ionization of the gas in the corresponding cooling unit when the vibrating electrode thin film is in a static state without loading the alternating voltage signal.
[0013] According to a third aspect of the present application, the technical solution of the present application provides a heat dissipation method applied to the plasma radiator array, the method comprising: continuously applying a first voltage signal to the substrate and continuously applying a first alternating voltage signal and a second alternating voltage signal to the driving layer in two adjacent cooling units, the method comprising: making the voltage of the first voltage signal reach a maximum value only when the vibrating electrode thin film reaches the closest distance to the substrate, and the maximum value of the voltage of the first voltage signal being equal to a first air discharge threshold voltage, the voltage of the first voltage signal being a variable voltage, and the first air threshold voltage being a minimum voltage required to be applied to the substrate to enable ionization of the gas in the corresponding cooling unit when the vibrating electrode thin film is in a static state without loading the alternating voltage signal.
[0014] According to a fourth aspect of the present application, the technical solution of the present application provides a heat dissipation method applied to the plasma radiator array, the method comprising: continuously applying a first voltage signal to the substrate and continuously applying a first alternating voltage signal and a second alternating voltage signal to the driving layer in two adjacent cooling units, the method comprising: making the voltage of the first voltage signal equal to a second air discharge threshold voltage, the second air threshold voltage being a minimum voltage required to be applied to the substrate to enable ionization of the gas in the corresponding cooling unit when the vibrating electrode thin film reaches the closest distance to the substrate.
[0015] Compared with the prior art, the technical solution of the embodiment of the present application has the following beneficial effects: The plasma radiator array and the heat dissipation method of the present application have the following advantages. Firstly, each cooling unit includes a corresponding needle structure group, a vibrating electrode film, and a space containing gas between the vibrating electrode film and the needle structure group. The vibrating electrode film is suspended relative to the needle structure group. The needle structure group includes a plurality of needle structures arranged in an array. The needle structures are located on a substrate. At least part of the needle structure group is located within the projection range of the vibrating electrode film on the surface of the substrate. The needle structure group and the substrate form a discharge electrode. The vibrating electrode film includes a driving layer, a piezoelectric layer, and a substrate layer stacked in sequence. The distance between the substrate layer and the substrate is smaller than the distance between the driving layer and the substrate. The substrate layer is grounded. Vibrating electrode supports are located on both sides of the vibrating electrode film. The edges of the vibrating electrode film are fixed to the vibrating electrode supports. The circuit module includes a plurality of first output terminals. Each first output terminal is coupled to a corresponding driving layer. The circuit module is configured to output a first alternating voltage signal and a second alternating voltage signal to the driving layers of any two adjacent vibrating electrode films. Therefore, each vibrating electrode film vibrates in a direction perpendicular to the substrate. The vibration of the vibrating electrode film can blow against the substrate to cool the substrate. Secondly, the circuit module includes a second output terminal coupled to the substrate. The circuit module is configured to output a first voltage signal to the substrate. Therefore, an electric field can be formed between the vibrating electrode film and the discharge electrode. The gas between the vibrating electrode film and the discharge electrode can be ionized to form an ion wind. The ion wind blowing against the substrate can have a heat dissipation effect. The cooling effect of the present application on the substrate is enhanced due to the combination of the two heat dissipation methods, i.e., the airflow generated by the vibration of the vibrating electrode film blowing against the substrate and the ion wind generated by the ionization of the gas in each cooling unit blowing against the substrate. Furthermore, the vibration of the first alternating voltage signal and the second alternating voltage signal output by the circuit module to the driving layers of any two adjacent vibrating electrode films is inconsistent. The vibrating electrode films of two adjacent cooling units vibrate in a direction perpendicular to the substrate with different steps. Therefore, the present application can make the ionization time of the gas in adjacent cooling units inconsistent. The ionization products of the gas in the cooling unit can diffuse into the adjacent cooling unit, thereby avoiding the discharge instability of the gas in the cooling unit and facilitating the ionization of the gas in the adjacent cooling unit and the formation of an ion wind in the adjacent cooling unit to improve the cooling effect on the substrate. Thus, the plasma radiator array of the present application can effectively cool the substrate with a smaller area and lower noise. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.
[0017] Figure 1 Structure diagram of the plasma radiator array of the first embodiment of the present application; Figure 2 The present application Figure 1 The schematic diagram of the vibrating electrode film in the working state in the first embodiment of the present application; Figure 3 Structure diagram of the plasma generator array of the second embodiment of the present application. DETAILED DESCRIPTION
[0018] As described in the background, how to make the plasma radiator array be able to discharge stably has become a technical problem to be solved in the industry. The following will be described in detail.
[0019] Therefore, in the technical solution of the present application, each cooling unit in the plasma radiator array includes a corresponding needle structure group and a vibrating electrode film. The needle structure group includes a plurality of needle structures arranged in an array, and the needle structure is located on a substrate. The needle structure group and the substrate form a discharge electrode. The vibrating electrode film includes a driving layer, a piezoelectric layer and a substrate layer which are stacked in sequence, and the substrate layer is grounded. The edge of the vibrating electrode film is fixed between vibrating electrode supports. The circuit module includes a plurality of first output terminals and second output terminals. The circuit module is used to output first alternating voltage signals and second alternating voltage signals with different phases to the driving layers of any two adjacent vibrating electrode films, respectively. The circuit module is also used to output a first voltage signal to the substrate. Thus, the present application can achieve effective heat dissipation with smaller area and lower noise.
[0020] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0021] The terms "first", "second", "third", "fourth" and the like in the description and in the claims of the present application, and above-mentioned drawings, if any, are used to distinguish between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the use of the terms so-termed "first", "second", "third", "fourth" and the like, if any, in the description and in the claims of the present application is simply intended to differentiate between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used can be interchanged, where appropriate, so that the embodiments of the present application described herein can be carried out in other than the order described herein. Also, the terms "comprising", "having", "including" and any variations thereof in the description and in the claims are intended to cover the respective steps, units, processes, methods, objects, and the like either individually or collectively without necessarily excluding other steps, units, processes, methods, objects, and the like.
[0022] The technical solutions of the present application will be described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes can not be described in some embodiments.
[0023] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0024]
First embodiment
[0025] The cooling unit includes a corresponding needle structure group 200 and a vibrating electrode film 300, the vibrating electrode film 300 is suspended relative to the needle structure group 200, and the vibrating electrode film 300 and the needle structure group 200 have a space for accommodating gas, the needle structure group 200 includes a plurality of needle structures 210 arranged in an array, the needle structure 210 is located on the substrate 100, and at least part of the needle structure group 200 is located in the projection range of the vibrating electrode film 300 on the surface of the substrate 100, the needle structure group 200 and the substrate 100 form a discharge electrode, the vibrating electrode film 300 includes a driving layer 310, a piezoelectric layer 320 and a substrate layer 330 which are stacked in sequence, the distance between the substrate layer 330 and the substrate 100 is less than the distance between the driving layer 310 and the substrate 100, and the substrate layer 330 is grounded.
[0026] The vibrating electrode support 400 is located on both sides of the vibrating electrode film 300, and the edge of the vibrating electrode film 300 is fixed between the vibrating electrode supports 400.
[0027] The circuit module 500 includes a plurality of first output terminals and a second output terminal, each of the first output terminals is coupled to the driving layer 310 of one cooling unit, and the second output terminal is coupled to the substrate 100. The circuit module 500 is configured to output first and second alternating current voltage signals with different phases to the driving layers 310 of any two adjacent vibrating electrode films 300 in the plurality of cooling units, respectively, so that the driven two adjacent vibrating electrode films 300 vibrate in different steps along the direction perpendicular to the substrate 100. The circuit module 500 is also configured to output a first voltage signal to the substrate 100, so as to form an electric field between the vibrating electrode film 300 and the discharge electrode of each cooling unit.
[0028] For the plasma radiator array as described above, each vibrating electrode film 300 vibrates along the direction perpendicular to the substrate 100. The vibration of the vibrating electrode film 300 can blow to the substrate 100 to cool the substrate 100. An electric field can be formed between the vibrating electrode film 300 and the discharge electrode, and the gas between the vibrating electrode film 300 and the discharge electrode can be ionized to form an ion wind. The blowing of the ion wind to the substrate 100 can play a role in heat dissipation. The blowing of the airflow generated by the vibration of the vibrating electrode film 300 to the substrate 100, in combination with the blowing of the ion wind generated by the ionization of the gas in each cooling unit to the substrate 100, can enhance the cooling effect of the substrate 100 by the plasma radiator array. Since the two adjacent vibrating electrode films 300 vibrate in opposite directions along the direction perpendicular to the substrate 100, the plasma radiator array can make the ionization of the gas in the adjacent cooling units inconsistent in steps, and the ionization products of the gas in the cooling unit can diffuse to the adjacent cooling unit, thereby avoiding the discharge instability of the gas in the cooling unit, and facilitating the ionization of the gas in the adjacent cooling unit, promoting the formation of the ion wind in the adjacent cooling unit, and improving the cooling effect on the substrate. Therefore, the plasma radiator array can effectively cool the substrate with a smaller area and a smaller noise.
[0029] As a preferred embodiment, please refer to Figure 1 The circuit module 500 outputs first and second alternating current voltage signals with different phases to the driving layers 310 of any two adjacent vibrating electrode films 300 in the plurality of cooling units, respectively, so that the driven two adjacent vibrating electrode films 300 vibrate in opposite phases along the direction perpendicular to the substrate 100 (as shown in Figure 2
[0030] In this embodiment, when the gas in one cooling unit is ionized, the pressure difference between the cooling unit and the adjacent cooling unit is the largest, the ionized products can better diffuse into the adjacent cooling unit, further improve the stability of the discharge of the cooling unit, and further promote the ionization of the gas in the adjacent cooling unit, thereby further improving the cooling effect on the substrate. And the heat sink of the present application does not need to additionally increase the fan, the area is smaller, the noise is smaller. Therefore, the plasma heat sink array of the present application can effectively cool the substrate with smaller area and smaller noise.
[0031] The total thickness of the vibrating electrode film 300 is between 10um and 30um.
[0032] The thickness of the vibrating electrode film is set to be between 10um and 30um, so that the vibrating electrode film has appropriate conductivity and can vibrate more sensitively.
[0033] Specifically, the voltage amplitude of the first alternating voltage signal is 0V-2000V, the voltage amplitude of the second alternating voltage signal is 0V-2000V, the frequency of the first alternating voltage signal is greater than 20kHz, and the frequency of the second alternating voltage signal is greater than 20kHz.
[0034] In this embodiment, the material of the substrate layer 330 is stainless steel or hastelloy.
[0035] The material of the driving layer 310 is a conductive metal.
[0036] The material of the piezoelectric layer 320 is a piezoelectric material.
[0037] Specifically, the piezoelectric material includes organic piezoelectric composite material and / or inorganic ceramic.
[0038] The organic composite piezoelectric material includes poly(vinylidene fluoride-trifluoroethylene-chlorotrifluoroethylene) (P(VDF-TrFE-CTFE) and polyvinylidene fluoride (PVDF).
[0039] The inorganic ceramic includes lead zirconate titanate (PZT) and / or aluminum nitride (AlN).
[0040] In this embodiment, the vibrating electrode support 400 includes a support main body part 420 and a support connecting part 410, the support connecting part 410 extends from the support main body part 420 to the substrate 100, and one end of the support connecting part 410 is connected to the support main body part 420, and the vibrating electrode film 300 is fixed at the other end of the support connecting part 410.
[0041] By this setting, the edge of the vibrating electrode film 300 can be fixed without affecting the vibration of the vibrating electrode film 300 in the direction perpendicular to the substrate 100.
[0042] Accordingly, please continue to refer to Figure 1 The embodiment of the present application further provides a heat dissipation method, which can be applied to the plasma heat dissipator array, and specifically comprises: a method for continuously applying a first voltage signal to the substrate 100 and continuously applying a first alternating voltage signal and a second alternating voltage signal to the driving layer 310 in two adjacent cooling units, and the method comprises: making the voltage of the first voltage signal equal to a first air discharge threshold voltage, and the first air threshold voltage is the minimum voltage applied to the substrate to enable the gas in the corresponding cooling unit to be ionized when the vibrating electrode film is in a static state without the alternating voltage signal.
[0043] The first air threshold voltage can be understood as: the voltage applied to the substrate when the vibrating electrode film 300 in the cooling unit is in a static state without the alternating voltage signal and the gas in the cooling unit is in a critical state from non-ionization to ionization. Specifically, the first air threshold voltage can be determined by actual measurement, and the measurement error of the first air threshold voltage can be reduced by taking the average of multiple actual measurement results.
[0044] In the heat dissipation method, when the vibrating electrode film 300 in a cooling unit bends or is static towards the substrate 100, that is, the actual distance between the vibrating electrode film 300 in the cooling unit and the substrate 110 is less than or equal to the distance between the substrate 100 and the vibrating electrode film 300 in a static state without the alternating voltage signal, the gas in the cooling unit is ionized. When the vibrating electrode film 300 in a cooling unit bends away from the substrate 100, that is, the distance between the vibrating electrode film 300 in the cooling unit and the substrate 100 is greater than the distance between the substrate 110 and the vibrating electrode film in a static state, the gas in the cooling unit will not be ionized. It can be seen that the gas in each cooling unit is ionized intermittently, and the ionization products in each cooling unit will not accumulate excessively in the cooling unit, thereby further improving the stability of the gas discharge in each cooling unit.
[0045] Please continue to refer to Figure 1The embodiment of the present application also provides another heat dissipation method, which can be applied to the above-mentioned plasma heat dissipator array, and specifically comprises: a method for continuously applying a first voltage signal to the substrate 100 and continuously applying a first alternating voltage signal and a second alternating voltage signal to the driving layer 310 in two adjacent cooling units, wherein the voltage of the first voltage signal reaches a maximum value only when the vibrating electrode film 300 reaches the closest distance to the substrate, and the maximum value of the voltage of the first voltage signal is equal to the first air discharge threshold voltage, the voltage of the first voltage signal is a variable voltage, and the first air threshold voltage is the minimum voltage applied to the substrate 100 to enable the gas in the corresponding cooling unit to be ionized when the vibrating electrode film 300 is in a static state without being loaded with the first alternating voltage signal and the second alternating voltage signal.
[0046] The first air threshold voltage can be understood as follows: the voltage applied to the substrate 100 when the vibrating electrode film 300 in the cooling unit is in a static state without being loaded with the alternating voltage signal and the gas in the cooling unit is in a critical state from non-ionization to ionization. Specifically, the first air threshold voltage can be determined by actual measurement, and the measurement error of the first air threshold voltage can be reduced by taking the average of the results of multiple actual measurements.
[0047] The closest distance is the closest distance that can be reached between the vibrating electrode film 300 and the substrate 100.
[0048] In this embodiment, as an example, the first voltage signal can be a sine signal, a triangular wave signal, a square wave signal or a pulse signal.
[0049] In this embodiment, the electric field in the plasma generator is the strongest only when the vibrating electrode film 300 reaches the closest distance to the substrate 100, at which time the gas in the plasma generator can be ionized and the ionization degree is the strongest. When the distance between the vibrating electrode film 300 and the substrate 100 is greater than the closest distance between the vibrating electrode film 300 and the substrate 100 and is less than or equal to the distance between the substrate 100 and the vibrating electrode film 300 in a static state, the gas in the plasma generator can or can not be ionized. When the distance between the vibrating electrode film 300 and the substrate 100 is greater than the distance between the substrate 100 and the vibrating electrode film 300 in a static state, the gas in the cooling unit will not be ionized. Therefore, the gas in the cooling unit is intermittently ionized, the products generated by the ionization of the gas do not accumulate excessively in one cooling unit, and the stability of the gas discharge process in the cooling unit can be further improved.
[0050] Please continue to refer to Figure 1The embodiment of the present application also provides another heat dissipation method, which can be applied to the plasma heat radiator array, and specifically comprises: a method for continuously applying a first voltage signal to the substrate 100 and continuously applying a first alternating voltage signal and a second alternating voltage signal to the driving layer 310 in two adjacent cooling units, and the method comprises: making the voltage of the first voltage signal equal to a second air discharge threshold voltage, and the second air threshold voltage is the minimum voltage applied to the substrate 100 to make the gas in the corresponding cooling unit ionized when the vibrating electrode film 300 and the substrate 100 reach the closest distance.
[0051] The second air threshold voltage can be understood as: the voltage loaded on the substrate 100 when the vibrating electrode film 300 and the substrate 100 in the cooling unit reach the closest distance and the gas in the cooling unit is in a critical state from non-ionization to ionization. Specifically, the second air threshold voltage can be determined by actual measurement, and the measurement error of the second air threshold voltage can be reduced by taking the average of the results of multiple actual measurements.
[0052] In this embodiment, the gas in the corresponding cooling unit can be instantaneously ionized only when the vibrating electrode film 300 and the substrate 110 reach the closest distance, and the gas in the cooling unit can be intermittently discharged, and the products generated by the ionization of the gas cannot be excessively accumulated in the cooling unit, and the stability of the gas discharge in the cooling unit can be further improved.
[0053]
Second Embodiment
[0054] The material of the vertical nanowire 610 can be any one of a carbon nanotube or an oxide nanowire.
[0055] The vertical nanowire arranged on the needle-shaped structure can promote the ionization of the gas in the cooling unit.
[0056] In summary, on the one hand, since each cooling unit of the plurality of cooling units comprises a corresponding needle structure group 200, a vibrating electrode film 300 suspended relative to the needle structure group 200, a space containing gas between the vibrating electrode film 300 and the needle structure group 200, the needle structure group 200 comprising a plurality of needle structures 210 arranged in an array, the needle structures 210 being located on the substrate 100, and at least part of the needle structure group 200 being located within the projection range of the vibrating electrode film 300 on the surface of the substrate 100, the needle structure group 200 and the substrate 100 forming a discharge electrode, the vibrating electrode film 300 comprising a driving layer 310, a piezoelectric layer 320 and a substrate layer 330 stacked in sequence, the spacing between the substrate layer 330 and the substrate 100 being smaller than the spacing between the driving layer 310 and the substrate 100, the substrate layer 330 being grounded, the vibrating electrode support 400 being located on both sides of the vibrating electrode film 300, the vibrating electrode film 300 being fixed to the vibrating electrode support 400, and the circuit module 500 comprising a plurality of first output terminals, each first output terminal being coupled to a corresponding driving layer 310, the circuit module 500 being configured to output a first alternating voltage signal and a second alternating voltage signal to the driving layers 310 of any two adjacent vibrating electrode films 300, respectively, so that each vibrating electrode film 300 vibrates in a direction perpendicular to the substrate 100, and the vibration of the vibrating electrode film 300 can blow against the substrate 100 to cool the substrate 100; on the other hand, since the circuit module 500 comprises a second output terminal coupled to the substrate 100, the circuit module 500 is configured to output a first voltage signal to the substrate 100, so that an electric field can be formed between the vibrating electrode film 300 and the discharge electrode, and the gas between the vibrating electrode film 300 and the discharge electrode can be ionized to form an ion wind, and the ion wind blowing against the substrate 100 can play a role in heat dissipation. The combination of the blowing of the airflow generated by the vibration of the vibrating electrode film 300 against the substrate 100 and the blowing of the ion wind generated by the ionization of the gas in each cooling unit against the substrate 100 enhances the cooling effect of the substrate 100. On this basis, since the first alternating voltage signal and the second alternating voltage signal output by the circuit module 500 to the driving layers 310 of any two adjacent vibrating electrode films 300 are different in phase, the vibrating electrode films 300 of the two adjacent cooling units vibrate in different directions in the direction perpendicular to the substrate 100 (for example Figure 2Therefore, the ionization time of the gas in the two adjacent cooling units is inconsistent, the ionization product of the gas in the cooling unit can diffuse to the adjacent cooling unit, thereby avoiding the gas discharge instability in the cooling unit, and facilitating the ionization of the gas in the adjacent cooling unit and promoting the formation of ion wind in the adjacent cooling unit, so as to improve the cooling effect on the substrate. Therefore, the plasma heat dissipation array of the present application can effectively cool the substrate with smaller area and smaller noise.
[0057] It should be noted that, in order to help understand, Figure 2 The schematic diagram of the vibrating electrode thin film 300 in the working state is shown.
[0058] Although the present application is disclosed as above, the present application is not limited to this. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, and therefore the protection scope of the present application should be subject to the scope defined by the claims.
Claims
1. A plasma heat sink array, characterized in that, include: Base; The system includes several cooling units, each comprising a corresponding group of needle-like structures and a vibrating electrode film. The vibrating electrode film is suspended relative to the group of needle-like structures, and a space for accommodating gas exists between the vibrating electrode film and the group of needle-like structures. The group of needle-like structures comprises several needle-like structures arranged in an array, located on the substrate. At least a portion of the group of needle-like structures is located within the projection range of the vibrating electrode film on the surface of the substrate. The group of needle-like structures and the substrate constitute a discharge electrode. The vibrating electrode film comprises a driving layer, a piezoelectric layer, and a substrate layer stacked sequentially. The distance between the substrate layer and the substrate is smaller than the distance between the driving layer and the substrate. The substrate layer is grounded. A vibration electrode support is provided, which is located on both sides of the vibration electrode film, and the edge of the vibration electrode film is fixed between the vibration electrode supports. The circuit module includes several first output terminals and second output terminals. Each first output terminal is coupled to the driving layer of a cooling unit, and the second output terminal is coupled to the substrate. The circuit module is used to output a first AC voltage signal and a second AC voltage signal with different phases to the driving layers of any two adjacent vibrating electrode films in the several cooling units, so that the two adjacent vibrating electrode films driven by the circuit module vibrate at different paces in a direction perpendicular to the substrate. The circuit module is also used to output a first voltage signal to the substrate to form an electric field between the vibrating electrode film and the discharge electrode in each cooling unit.
2. The plasma heat sink array as described in claim 1, characterized in that, The circuit module is used to output a first AC voltage signal and a second AC voltage signal with opposite phases to the driving layer of any two adjacent vibrating electrode films in several cooling units, so that the two adjacent vibrating electrode films driven by the circuit will vibrate with opposite phases in a direction perpendicular to the substrate.
3. The plasma heat sink array as described in claim 1, characterized in that, The voltage amplitude of the first AC voltage signal is 0V~2000V, the voltage amplitude of the second AC voltage signal is 0V~2000V, the frequency of the first AC voltage signal is greater than 20kHz, and the frequency of the second AC voltage signal is greater than 20kHz.
4. The plasma heat sink array as described in claim 1, characterized in that, The cooling unit further includes: vertical nanowires fixed to the needle-like structure, and the vertical nanowires are spaced apart from the vibrating electrode film.
5. The plasma heat sink array as described in claim 1, characterized in that, The base layer is made of stainless steel or Hastelloy. The material of the driving layer is a conductive metal; The piezoelectric layer is made of a piezoelectric material.
6. The plasma heat sink array as described in claim 5, characterized in that, The piezoelectric material includes organic piezoelectric composite materials and / or inorganic ceramics; The organic composite piezoelectric material includes poly(vinylidene fluoride-trifluoroethylene-trifluorochloroethylene) and polyvinylidene fluoride; The inorganic ceramics include lead zirconate titanate and / or aluminum nitride.
7. The plasma heat sink array as described in claim 1, characterized in that, The vibration electrode support includes a support body and a support connection. The support connection extends from the support body to the substrate, and one end of the support connection is connected to the support body, while the vibration electrode film is fixed to the other end of the support connection.
8. A heat dissipation method, characterized in that, The method, applicable to any one of claims 1 to 7, comprises: continuously applying a first voltage signal to a substrate and continuously applying a first AC voltage signal and a second AC voltage signal to the driving layers in two adjacent cooling units. The method further comprises: making the voltage of the first voltage signal equal to a first air discharge threshold voltage, such that the first air threshold voltage is the minimum voltage required to be applied to the substrate when the vibrating electrode film is in a static state without the AC voltage signal applied, so that the gas in the corresponding cold zone unit can be ionized.
9. A heat dissipation method, characterized in that, The method, applicable to any one of claims 1 to 7, comprises: continuously applying a first voltage signal to a substrate and continuously applying a first AC voltage signal and a second AC voltage signal to the driving layers in two adjacent cooling units. The method further comprises: maximizing the voltage of the first voltage signal only when the vibrating electrode film reaches its closest distance to the substrate, wherein the maximum voltage of the first voltage signal is equal to a first air discharge threshold voltage, the voltage of the first voltage signal is a variable voltage, and the first air threshold voltage is the minimum voltage required to be applied to the substrate when the vibrating electrode film is in a static state without the AC voltage signal applied, so that the gas in the corresponding cold zone unit can ionize.
10. A heat dissipation method, characterized in that, The method, applicable to any one of claims 1 to 7, comprises: continuously applying a first voltage signal to a substrate and continuously applying a first AC voltage signal and a second AC voltage signal to the driving layers in two adjacent cooling units. The method further comprises: making the voltage of the first voltage signal equal to a second air discharge threshold voltage, wherein the second air threshold voltage is the minimum voltage required to be applied to the substrate when the vibrating electrode film and the substrate reach the closest distance, so that the gas in the corresponding cold zone unit can be ionized.